V-CUT processing method of circuit board
By realizing automatic cutter discharge and residual thickness correction methods in V-CUT equipment, the problem of manual cutter discharge in the prior art is solved, the work efficiency and cutting quality are improved, product quality is guaranteed and production costs are reduced.
Patent Information
- Application Number
- CN202411479839.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-02-18
AI Technical Summary
Existing V-CUT devices require manual cutters when cutting circuit boards of different specifications, which are prone to errors and troublesome operations, which affects work efficiency.
By obtaining the information of the circuit board, determining the corresponding stored production parameters in the target information platform, controlling the automatic tooling of the V-CUT machine, and measuring and correcting the residual thickness of the circuit board to achieve automated batch cutting.
It effectively reduces the risk of errors in obtaining and using production parameters, improves work efficiency and cutting quality, ensures product quality, avoids waste of circuit boards, and reduces production costs.
Smart Images
Figure CN119485926A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit board production, and in particular to a V-CUT processing method for a circuit board. Background Art
[0002] Nowadays, in the production of circuit boards, it is usually necessary to manually input a series of production parameters required for production into the processing equipment. For example, in the V-cut process of the circuit board, it is necessary to manually input any reasonable production parameters such as cutting angle, residual thickness, board thickness, tolerance, etc. into the corresponding processing equipment in sequence, so that the processing equipment can process the circuit board according to the input production parameters.
[0003] However, the existing V-CUT equipment needs to manually arrange the cutter when cutting circuit boards of different specifications, which is prone to errors, cumbersome to operate, labor-intensive, and affects work efficiency. Summary of the invention
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a V-CUT processing method for a circuit board, which does not require manual cutter arrangement or manual size conversion input, effectively reduces the risk of errors in obtaining and using production parameters, improves work efficiency, improves cutting quality, and ensures product quality.
[0005] The V-CUT processing method of the circuit board according to the embodiment of the present application includes: Obtain the data information of the circuit board and determine the corresponding production parameters stored in the target information platform; According to the production parameters, control the V-CUT machine to automatically arrange the cutter to perform V-CUT processing on the circuit board; Measure the residual thickness of the circuit board and control the V-CUT machine to make corrections based on the measurement results; Control the V-CUT machine to cut circuit boards in batches.
[0006] The V-CUT processing method of the circuit board according to the embodiment of the present application has at least the following beneficial effects: the V-CUT processing method of the circuit board according to the embodiment of the present application can determine the corresponding production parameters stored in the target information platform by acquiring the data information of the circuit board, so as to control the V-CUT machine to automatically arrange the cutters according to the production parameters, without the need for manual cutter arrangement or manual size conversion input, thereby effectively reducing the risk of errors in obtaining and using production parameters and improving work efficiency; by measuring the residual thickness of the circuit board, the V-CUT machine can be controlled to make corrections according to the measurement results, thereby improving the cutting quality and ensuring the product quality; by performing batch cutting according to the measurement results and after correction, it is possible to avoid waste of circuit boards, reduce scrap rates, improve cutting quality, and reduce production costs.
[0007] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the data information includes the board width, board thickness, required residual thickness and pcs quantity of the circuit board.
[0008] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, in acquiring the data information of the circuit board and determining the corresponding production parameters stored in the target information platform, it also includes: Get the information of the circuit board and control the V-CUT machine to place the circuit board.
[0009] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, in obtaining the thickness of the circuit board and controlling the V-CUT machine to place the board, the method includes: Obtain the data information of the circuit board and control the V-CUT machine to adjust the height of the feeding channel so that the V-CUT machine can only place one circuit board.
[0010] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the cutter arrangement of the V-CUT machine adopts a dislocation-balanced interval setting.
[0011] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the residual thickness of the circuit board is measured, and the V-CUT machine is controlled to make corrections according to the measurement results, including: The remaining thickness of the circuit board is measured, and the V-CUT machine is controlled to make center correction based on the measurement results.
[0012] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the residual thickness of the circuit board is measured, and the V-CUT machine is controlled to perform center correction according to the measurement result, including: Measure the residual thickness of the circuit board. When the residual thickness in the measurement results shows that the upper and lower cutters are of different depths, control the V-CUT machine to make center correction.
[0013] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the residual thickness of the circuit board is measured, and the V-CUT machine is controlled to make corrections according to the measurement results, including: The residual thickness of the circuit board is measured, and the V-CUT machine is controlled to make residual thickness correction based on the measurement results.
[0014] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, the residual thickness of the circuit board is measured, and the V-CUT machine is controlled to perform residual thickness correction according to the measurement result, including: Measure the residual thickness of the circuit board. When the residual thickness in the measurement result is too shallow or too deep, control the V-CUT machine to make residual thickness correction.
[0015] According to the V-CUT processing method of the circuit board described in the embodiment of the present application, after controlling the V-CUT machine to cut the circuit boards in batches, the method further includes: Control the V-CUT machine to collect the circuit boards.
[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 A flowchart of a V-CUT processing method for a circuit board according to some embodiments of the present application; Figure 2 A flowchart of a V-CUT processing method for a circuit board according to some embodiments of the present application; Figure 3 A flowchart of a V-CUT processing method for a circuit board according to some embodiments of the present application; Figure 4 This is a flow chart of a V-CUT processing method for a circuit board according to some embodiments of the present application. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0020] Reference Figure 1 , an embodiment of the present application provides a V-CUT processing method for a circuit board, including but not limited to step S110, step S120, step S130 and step S140.
[0021] Step S110: Acquire data information of the circuit board and determine the corresponding production parameters stored in the target information platform.
[0022] The data information includes the board width, board thickness, required residual thickness and number of pcs of the circuit board. Specifically, the target information platform is pre-entered with the data information of the circuit board and its corresponding production parameters, and a mapping relationship or program link between the data information and the production parameters is established. When processing the circuit board, the circuit board to be processed is determined and its data information is obtained. At this time, the V-CUT machine accesses the target information platform, so that it can determine the currently required production parameters based on the current data information and the corresponding mapping relationship or program link, and retrieve the production parameters, so that the circuit board can be V-CUT processed through the production parameters later.
[0023] By acquiring the data information of the circuit board, the corresponding production parameters stored in the target information platform can be determined, so that the V-CUT machine can be controlled to automatically arrange the cutters according to the production parameters. There is no need for manual cutter arrangement or manual size conversion input, which effectively reduces the risk of errors in obtaining and using production parameters and improves work efficiency.
[0024] It should be noted that the target information platform can be understood as a data storage space, and specifically can be the local database of the V-CUT machine, or a network cloud data platform, such as a local storage hard disk, or a manufacturer's backend computer, or a network cloud data center on a third-party server.
[0025] From this, we can see that the data information of the circuit board and its corresponding production parameters can be obtained through front-end design, that is, the manufacturing factory obtains them by analyzing customer information and specific processing requirements, and then can enter them into the target information platform for direct retrieval and use in subsequent production.
[0026] Among them, the relevant V-CUT data and information of the front-end design, that is, the production parameters specifically include the design V-CUT angle, residual thickness (also known as "remaining thickness"), board thickness, tolerance, and the corresponding V-CUT required photolithography data, so that the circuit board can be V-CUT processed later through the production parameters.
[0027] Optionally, the target information platform can specifically be an IMES (Manufacturing Execution System) platform, that is, an information platform that integrates all circuit board production-related data and information, and can play the role of information transmission between the front-end design department and the manufacturing department. The specific approach is to obtain the front-end design information and data, and send it to the various automated production equipment of the manufacturing department in real time for use, so as to ensure that the equipment can still produce quickly without a network connection and ensure the security of enterprise information.
[0028] For production factories that do not require high information security, they do not need to use the IMES platform. Instead, they can directly communicate with the automated production equipment through a network path to enable the automated production equipment to directly and automatically obtain the relevant production information and data of the front-end design.
[0029] Reference Figure 2 In some embodiments, step S110 may also include but is not limited to the following steps: Step S210: Acquire the data information of the circuit board, determine the corresponding production parameters stored in the target information platform, and control the V-CUT machine to place the circuit board.
[0030] Specifically, in the processing flow of circuit boards, the circuit board to be processed is determined and its data information is obtained. At this time, the V-CUT machine accesses the target information platform, so that it can determine the currently required production parameters based on the current data information and the corresponding mapping relationship or program link, and call out the production parameters; at the same time, it can also control the V-CUT machine to place the board according to the board thickness in the data information, so as to transport the circuit board to be processed to the processing position, so as to facilitate the subsequent V-CUT processing of the circuit board according to the production parameters.
[0031] By using the V-CUT machine to place the circuit board, no manual operation is required, automatic processing is achieved, labor intensity is reduced, and work efficiency is improved.
[0032] Furthermore, in the processing flow of the circuit board, the circuit board to be processed is determined and its data information is obtained. At this time, the V-CUT machine accesses the target information platform, so that it can determine the currently required production parameters based on the current data information and the corresponding mapping relationship or program link, and call out the production parameters; at the same time, it can control the V-CUT machine to adjust its material guide belt according to the board thickness in the data information, so as to adjust the height of the left material guide belt of the V-CUT machine to be the same as the board thickness of the circuit board or 0.1-0.2mm greater than the board thickness, and the height of the right material guide belt of the V-CUT machine is adjusted to increase by one third the height of the left material guide belt, thereby realizing the adjustment of the height of the feed channel. At this time, the height of the feed channel can only be used to place the board at the height of one circuit board, thereby avoiding two circuit boards from entering the middle board at the same time, improving the quality of subsequent V-CUT processing, and reducing the scrap rate.
[0033] Step S120: According to the production parameters, the V-CUT machine is controlled to automatically arrange the cutters to perform V-CUT processing on the circuit board.
[0034] Specifically, when processing a circuit board, the production parameters are determined and retrieved through the target information platform, and the V-CUT machine automatically arranges the cutters according to the production parameters to perform V-CUT processing on the circuit board.
[0035] Among them, the knife arrangement method of the V-CUT machine adopts a staggered arrangement with balanced intervals. Specifically, according to the cutting position of the circuit board, the V-CUT lines are arranged in order from left to right, with one to ten lines in total, and the corresponding V-CUT machine is arranged in order from left to right and from front to back, with one to ten knives in total. When the circuit board needs to cut four knives, one knife cuts one line, two knives cut three lines, three knives cut two lines, and four knives cut four lines. At the same time, the fifth knife and the sixth knife, and the seventh to the tenth knife are moved to the positions corresponding to the third knife and the fourth knife respectively; when the circuit board needs to cut five knives, one knife cuts one line, two knives cut three lines, three knives cut two lines, four knives cut four lines, and six knives cut five lines. At the same time, the fifth knife and the seventh to the tenth knife are moved to the positions corresponding to the first knife and the fifth knife respectively; when the circuit board needs to cut six knives, one knife cuts one line, two knives cut three lines, three knives cut two lines, four knives cut four lines, and six knives cut five lines. At the same time, the fifth knife and the seventh to the tenth knife are moved to the positions corresponding to the first knife and the fifth knife respectively. When cutting a circuit board, one knife cuts one line, two knives cut four lines, three knives cut two lines, four knives cut five lines, five knives cut three lines, and six knives cut six lines. At the same time, move knives seven to ten to the positions corresponding to knives five and six. When the circuit board needs to be cut ten times, one knife and two knives cut one line and six lines respectively, three knives and four knives cut two lines and seven lines respectively, five knives and six knives cut three lines and eight lines respectively, seven knives and eight knives cut four lines and nine lines respectively, and nine knives and ten knives cut five lines and ten lines respectively. By adopting the knife arrangement method with staggered arrangement and balanced interval setting, and moving the unused knives to the positions corresponding to other working knives, it is possible to prevent the wrong knives from being opened, thereby improving the cutting quality of the circuit board and ensuring the product quality.
[0036] Step S130: measuring the remaining thickness of the circuit board, and controlling the V-CUT machine to make corrections based on the measurement results.
[0037] Specifically, after the cutting of the circuit board is completed, the remaining thickness of the circuit board is measured to determine the cutting condition of the circuit board, and the V-CUT machine is controlled to make corrections based on the results to obtain a circuit board that meets production requirements, thereby ensuring the cutting quality of the circuit board and improving product quality.
[0038] Reference Figure 3 Step S130 may include but is not limited to: Step S310: Measure the remaining thickness of the circuit board, and control the V-CUT machine to perform center correction according to the measurement result.
[0039] Specifically, after the circuit board is cut, the residual thickness of the circuit board is measured. When the residual thickness in the measurement results shows that the upper and lower cutters are different in depth, the V-CUT machine is controlled to perform center correction. Specifically, when the upper cutter is shallow and the lower cutter is deep, the position of the center line needs to be corrected to move the center line down; when the upper cutter is deep and the lower cutter is shallow, the position of the center line needs to be corrected to move the center line up. By performing center correction, the upper and lower cutter depths of the circuit board can be made consistent, thereby improving the cutting quality of the circuit board and improving product quality.
[0040] Reference Figure 4 Step S130 may also include but is not limited to: Step S410: measuring the residual thickness of the circuit board, and controlling the V-CUT machine to perform residual thickness correction according to the measurement result.
[0041] Specifically, after the circuit board is cut, the residual thickness of the circuit board is measured. When the residual thickness in the measurement result is too shallow or too deep, the V-CUT machine is controlled to correct the residual thickness. Specifically, when the residual thickness is too shallow, the residual thickness needs to be corrected to make it deeper and move downward; when the residual thickness is too deep, the residual thickness needs to be corrected to make it shallower. By correcting the residual thickness, the circuit board can better meet the production requirements and improve product quality.
[0042] It should be noted that, in step S130, when the V-CUT machine performs center correction, the residual thickness remains unchanged; when the V-CUT machine performs residual thickness correction, the center remains unchanged.
[0043] Step S140: Control the V-CUT machine to cut the circuit boards in batches.
[0044] Specifically, after completing the correction of the V-CUT machine, the V-CUT machine is controlled to cut the circuit boards in batches according to the correction results, so that the circuit boards can be accurately processed before batch cutting, thereby avoiding waste of circuit boards, reducing scrap rates, improving cutting quality, ensuring the cutting quality of the batch of circuit boards, improving product quality, and reducing production costs.
[0045] In some embodiments, after step S140, the method further includes: controlling the V-CUT machine to collect the circuit board.
[0046] Specifically, by adopting a V-CUT machine to collect the circuit boards, no manual operation is required, automatic processing is achieved, labor intensity is reduced, and work efficiency is improved.
[0047] The V-CUT processing method of the circuit board described in the embodiment of the present application can determine the corresponding production parameters stored in the target information platform by acquiring the data information of the circuit board, so as to control the V-CUT machine to automatically arrange the cutters according to the production parameters, without the need for manual cutter arrangement or manual size conversion input, thereby effectively reducing the risk of errors in obtaining and using production parameters and improving work efficiency; by measuring the residual thickness of the circuit board, the V-CUT machine can be controlled to make corrections according to the measurement results, thereby improving the cutting quality and ensuring the product quality; by performing batch cutting according to the measurement results and after correction, it is possible to avoid waste of circuit boards, reduce scrap rates, improve cutting quality, and reduce production costs.
[0048] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.
Claims
1. A V-CUT processing method for a circuit board, characterized in that: include: Obtain the data information of the circuit board and determine the corresponding production parameters stored in the target information platform; According to the production parameters, control the V-CUT machine to automatically arrange the cutter to perform V-CUT processing on the circuit board; Measure the residual thickness of the circuit board and control the V-CUT machine to make corrections based on the measurement results; Control the V-CUT machine to cut circuit boards in batches.
2. The V-CUT processing method of a circuit board according to claim 1, characterized in that: The data information includes the board width, thickness, required residual thickness and number of pcs of the circuit board.
3. The V-CUT processing method of a circuit board according to claim 2, characterized in that: In obtaining the data information of the circuit board and determining the corresponding production parameters stored in the target information platform, it also includes: Obtain the data information of the circuit board, determine the corresponding production parameters stored in the target information platform, and control the V-CUT machine to place the circuit board.
4. The V-CUT processing method of a circuit board according to claim 3, characterized in that: After obtaining the information of the circuit board, determining the corresponding production parameters stored in the target information platform, and controlling the V-CUT machine to place the board, including: Obtain the data information of the circuit board, determine the corresponding production parameters stored in the target information platform, and control the V-CUT machine to adjust the height of the feed channel so that the V-CUT machine can only place one circuit board.
5. The V-CUT processing method of a circuit board according to claim 1, characterized in that: The V-CUT machine's knife arrangement adopts a staggered and balanced interval setting.
6. The V-CUT processing method of a circuit board according to claim 1, characterized in that: Measure the residual thickness of the circuit board and control the V-CUT machine to make corrections based on the measurement results, including: The remaining thickness of the circuit board is measured, and the V-CUT machine is controlled to make center correction based on the measurement results.
7. The V-CUT processing method of a circuit board according to claim 6, characterized in that: Measure the residual thickness of the circuit board and control the V-CUT machine to make center correction based on the measurement results, including: Measure the residual thickness of the circuit board. When the residual thickness in the measurement results shows that the upper and lower cutters are of different depths, control the V-CUT machine to make center correction.
8. The V-CUT processing method of a circuit board according to claim 1, characterized in that: Measure the residual thickness of the circuit board and control the V-CUT machine to make corrections based on the measurement results, including: The residual thickness of the circuit board is measured, and the V-CUT machine is controlled to make residual thickness correction based on the measurement results.
9. The V-CUT processing method of a circuit board according to claim 8, characterized in that: Measure the residual thickness of the circuit board and control the V-CUT machine to make residual thickness correction based on the measurement results, including: Measure the residual thickness of the circuit board. When the residual thickness in the measurement result is too shallow or too deep, control the V-CUT machine to make residual thickness correction.
10. The V-CUT processing method of a circuit board according to claim 1, characterized in that: After controlling the V-CUT machine to cut the circuit boards in batches, it also includes: Control the V-CUT machine to collect the circuit boards.