Liquid cooling device of Ethernet switch

Abstract

The invention relates to the technical field of Ethernet switches, in particular to a liquid cooling device of an Ethernet switch, which comprises a bottom plate, a mounting column, a driving motor, a heat dissipation mechanism and a liquid cooling mechanism, the bottom plate is mounted underground, and the mounting column is mounted on the bottom plate; the driving motor is mounted in the middle of the mounting mechanism and drives the pressurizing assembly to rotate, so that liquid in the transition cavity passes through the pressurizing cavity and then is pressurized to flow; the heat dissipation mechanism is mounted on the mounting column, a large-space circulation cavity is formed in the heat dissipation mechanism and matched with heat dissipation fins arranged on the surface to dissipate heat of liquid, and pressurization circulation is conducted on the liquid through a pressurization assembly; the liquid cooling mechanism is installed in the heat dissipation mechanism, and a liquid cooling assembly is tightly attached to the surface of a chip of the exchanger body for liquid cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of Ethernet switches, and in particular to a liquid cooling device for an Ethernet switch. Background Art

[0002] An Ethernet switch is a network device used to connect multiple devices, such as computers, printers, and servers, within a local network. It forwards data between these devices using packet switching technology, ensuring efficient and reliable network communication. A switch determines which port to send a packet by reading the destination address in the packet, ensuring data is delivered only to the correct device and reducing network congestion. It supports simultaneous sending and receiving, thereby increasing network transmission speeds. Switches can isolate network traffic by configuring different virtual local area networks (VLANs), enhancing network security and manageability. Advanced switches support bandwidth management and priority control for each port to ensure that critical data is transmitted first. Switches can connect multiple devices and can be stacked or aggregated to increase network capacity. Compared to hubs, switches handle data traffic more intelligently, avoid network conflicts, and provide more efficient communication.

[0003] Ethernet switches generate heat during operation, making heat dissipation crucial, especially in high-performance or large-scale data center environments. Poor heat dissipation can lead to reduced switch performance, shortened lifespan, and even device failure. Therefore, choosing the right heat dissipation method is crucial. The main heat dissipation methods include free air cooling and air cooling, but each has its own drawbacks, particularly regarding dust accumulation and space requirements. Free air cooling utilizes the device's housing or heat sink to dissipate heat through natural convection between the device's surface and the air. Without moving parts like fans, it operates silently. Free air cooling is limited by air flow speed and cannot effectively dissipate heat in high-power or densely populated environments, especially in confined or enclosed spaces. Effective free air dissipation requires ample space for airflow, requiring additional physical space for device placement and installation. Air cooling uses built-in fans to actively draw cool air into the device and expel hot air, dissipating heat. Air cooling systems can quickly dissipate large amounts of heat and are suitable for high-density switches that require continuous high-traffic processing. They can handle varying temperature conditions and equipment environments, making them suitable for high-performance equipment operating in data centers. Fan operation generates noise, which can be noticeable when multiple devices are operating simultaneously. Air cooling systems require forced airflow, which causes large amounts of dust to be drawn into the equipment and accumulate on the air ducts, fans, and heat sinks. This accumulation of dust blocks airflow, reduces cooling efficiency, and increases maintenance difficulties.

[0004] Dust can cling to heat sinks or accumulate in air ducts, reducing airflow and lowering cooling efficiency. Dust accumulation requires more frequent cleaning and maintenance to prevent degradation of cooling performance and hardware overheating. Dust particles can also easily adhere to electronic components due to static electricity, increasing the risk of short circuits or circuit damage.

[0005] In view of the above situation, in order to overcome the above technical problems, the present invention designs a liquid cooling device for an Ethernet switch, which solves the above technical problems. Summary of the Invention

[0006] The technical objective of the present invention is to design a liquid cooling device for an Ethernet switch, abandoning the existing air cooling or natural heat dissipation methods and adopting liquid cooling to directly cool and dissipate the core components inside the switch. This ensures the temperature control requirements while reducing the size of the Ethernet switch and reducing the impact of dust on the operation of the switch.

[0007] In order to achieve the above technical objectives, the present invention provides the following technical solutions: The liquid cooling device of this Ethernet switch has a reasonable design, compact structure, and effective heat dissipation and cooling effect. It mainly includes the base plate, mounting column, drive motor, heat dissipation mechanism and liquid cooling mechanism.

[0008] The baseplate, the foundation of the device, is installed below the ground, providing a stable support structure. Mounting posts are located above the baseplate to support and secure other components, ensuring the stability and reliability of the entire device. These posts not only provide physical support but also connect and maintain the position of various components.

[0009] The drive motor, located in the center of the mounting mechanism, is the device's primary power source. By rotating the pressurizing assembly, the drive motor allows the liquid in the transition chamber to flow under pressure after passing through the pressurizing chamber. This design ensures effective control and regulation of the liquid flow, ensuring smooth and efficient circulation within the liquid cooling system.

[0010] The heat sink is located above the mounting post and features a large internal circulation chamber, providing ample space for liquid flow. Fins are also incorporated into the heat sink, increasing the surface area exposed to air and effectively improving heat dissipation efficiency. The pressurized components continuously circulate the liquid within the heat sink, rapidly dissipating heat.

[0011] The liquid cooling mechanism is a core component of the device, directly cooling the switch's chips. Installed within the heat sink, the liquid cooling assembly adheres closely to the switch's chip surface, ensuring direct and effective heat dissipation. Chips generate significant heat during operation. If not promptly cooled, this can affect device performance and even cause overheating and damage. The continuous action of the liquid cooling mechanism allows heat to be quickly transferred away from the chip surface, achieving effective liquid cooling and ensuring efficient and stable operation of the Ethernet switch.

[0012] This liquid cooling device combines the dual functions of pressurized circulation and liquid cooling, which can not only ensure the effective circulation of the liquid, but also improve the heat dissipation and cooling effects, making it very suitable for use in scenarios that require efficient heat dissipation, such as the application of high-performance Ethernet switches and other equipment.

[0013] The design of this heat dissipation mechanism includes multiple functional components to ensure that the liquid dissipates heat effectively during the circulation process. First, the heat dissipation mechanism consists of a housing assembly, heat dissipation fins, a water inlet, a water outlet, and a pressurizing assembly. Among them, the housing assembly is installed on the upper part of the mounting column to support and protect the internal structure. The heat dissipation fins are distributed on the top and both sides of the housing assembly, which improves the heat dissipation efficiency by increasing the contact area with the air. When the liquid in the circulation chamber flows through the heat dissipation fins, the heat is quickly dissipated, ensuring that the liquid temperature is reduced.

[0014] The water inlet, located at the bottom of the housing assembly, is responsible for introducing liquid from the liquid cooling mechanism into the heat dissipation mechanism, participating in the heat dissipation process. After the liquid dissipates heat through the fins, it flows out of the water outlet at the bottom. The water outlet and water inlet work together to connect the liquid cooling mechanism and the heat dissipation mechanism, thereby ensuring the circulation of liquid.

[0015] Furthermore, a pressurizing assembly is installed inside the housing assembly to pressurize the liquid, promoting efficient flow within the circulation chamber and ensuring even greater heat dissipation. This design not only improves cooling efficiency but also effectively extends the life of the device.

[0016] The housing assembly, comprised of a circulation chamber and guide plates, is cleverly designed to enhance heat dissipation and fluid control. First, the circulation chamber, located within the housing assembly, serves a dual purpose: effectively dissipating heat from the switch housing, while also rapidly cooling the fluid flowing through it through its large contact area and the cooling fins, ensuring more efficient heat dissipation.

[0017] Guide plates, installed inside the side of the circulation chamber, play a key role in regulating the speed and direction of water flow. Their length is set to two-thirds the width of the side transition chamber and they are arranged alternately on the left and right sides. This design ensures stable and even distribution of the liquid during circulation, preventing excessive or uneven flow, ensuring stable and efficient cooling and continuous liquid circulation.

[0018] The housing assembly also includes a transition chamber, a pressurizing chamber, and a limit chute, each with a unique design and clear functions. The transition chamber, located at the bottom of the housing assembly, guides the liquid to the pressurizing chamber, where it is pressurized before entering the circulation system. This pressurization allows the liquid to rise smoothly to the water inlet, thereby achieving continuous circulation. The transition chambers are triangular in shape, arranged on either side of the pressurizing chamber, creating a symmetrical structure that effectively improves the smoothness of liquid flow.

[0019] The pressurized chamber adopts a circular structure, ensuring uniform pressurization throughout the fluid flow. A limiting chute, located on the central axis of the chamber's inner annular surface, secures and guides the pressurized components, ensuring a stable and efficient pressurization process. This design enables the entire system to maintain stable pressure and fluid flow during operation, ensuring long-term and reliable heat dissipation.

[0020] The pressurizing assembly, consisting of a rotating shaft, rotating rods, and a stop ball, boasts an ingenious structural design and clear functions. The rotating shaft, installed within the pressurizing chamber, serves as the core component responsible for driving the entire pressurization process. The rotating rods are arranged in a circular array around the rotating shaft. This arrangement ensures balance and stability during liquid pressurization, improving pressurization efficiency.

[0021] The stop ball, located on the outer side of the rotating rod, rolls on the stop groove to ensure smooth rotation. This design not only reduces friction but also effectively prevents deviation of the pressurizing component during operation, ensuring a stable and efficient pressurization process for the entire system.

[0022] The distance between the top ends of adjacent rotating rods is set to be greater than the opening distance of the transition chamber, thereby ensuring that the liquid in the transition chamber enters the space formed by the adjacent rotating rods in the pressurizing assembly as much as possible at the same time, thereby generating a higher pressure.

[0023] This liquid cooling mechanism primarily consists of a switch body, a connection port, and a mounting cavity, boasting a precise and rational design. First, the switch body is a rectangular parallelepiped designed to fit snugly within the housing assembly, ensuring a secure fit within the device. To achieve this, the distance between the upper and lower inner surfaces of the housing assembly is set to an integer multiple of the switch body's height. This design not only ensures a tight fit between the switch body and the housing assembly but also effectively prevents dust from entering, thereby improving the device's protection and lifespan.

[0024] The connection socket is cleverly designed on the side of the switch body for connecting to an external liquid cooling system or other necessary equipment, ensuring that liquid can flow smoothly into and out of the switch body, thereby maintaining a stable cooling effect.

[0025] Furthermore, a cavity is created inside the switch to house the necessary electronic components. This cavity design ensures a rational layout of the components, making connections between them more compact and providing more efficient cooling space for liquid cooling, ensuring operational stability and heat dissipation efficiency in high-intensity operating environments.

[0026] The liquid cooling mechanism, which includes a liquid cooling assembly, a connecting block, and water inlet and outlet pipes, features a precise structural design and efficient functionality. The liquid cooling assembly is installed within the mounting cavity of the switch body, providing core cooling. The connecting blocks secure the assembly to its sides, ensuring stable operation. The connecting blocks also help tightly integrate the assembly with the rest of the cooling system, ensuring smooth liquid flow during the cooling process.

[0027] The inlet and outlet pipes are located on the sides of the exchange unit and are oriented in different directions—the inlet pipe is arranged upward or downward, while the outlet pipe faces the opposite direction. This design ensures unidirectional flow of the cooling liquid, avoiding backflow or turbulent flow. Furthermore, the inlet and outlet pipes of adjacent liquid cooling units are arranged in opposite directions, forming a continuous coolant circulation system.

[0028] This arrangement not only ensures the orderly flow of liquid between multiple liquid cooling mechanisms, but also greatly improves the cooling efficiency and realizes the recycling of coolant, thereby ensuring that the entire system can maintain long-term stable operation while dissipating heat efficiently.

[0029] Two inlet and outlet channels are provided inside the exchange body, one end of each of which is connected to the water inlet pipe and the water outlet pipe respectively. A liquid cooling channel is provided inside the liquid cooling component, and the liquid cooling channel is arranged in a linear array to ensure heat dissipation efficiency.

[0030] The beneficial effects of the present invention are as follows: 1. The present invention abandons natural heat dissipation and air-cooling heat dissipation solutions by arranging a liquid cooling device on the switch. The liquid cooling device achieves more efficient heat dissipation than air through the high thermal conductivity of the liquid. Compared with traditional natural heat dissipation and air cooling, the liquid cooling system can transfer heat out of the switch body more quickly, ensuring that the device can maintain a low temperature even when running under high load. This efficient heat dissipation mechanism significantly reduces the risk of performance degradation due to overheating, thereby improving the overall performance and stability of the switch. Traditional air-cooled heat dissipation systems rely on fans and air flow, which can cause dust and other particulate matter to be sucked into the interior of the device, affecting the normal operation and life of internal components. By adopting a liquid cooling device, the switch hardly needs to rely on air flow during the heat dissipation process, reducing the chance of dust entering the device, effectively extending the service life of the switch, and reducing maintenance costs.

[0031] 2. The liquid cooling mechanism's circulation channels deliver coolant directly to the core electronic components within the switch, precisely cooling these critical components. Since core components are crucial to device performance, maintaining them within the appropriate operating temperature range effectively prevents malfunctions and failures caused by overheating, thereby ensuring system reliability. A large circulation chamber not only cools the core components but also effectively dissipates heat from the switch surface. The cooling liquid flowing within the circulation chamber removes heat accumulated on the switch surface, enhancing overall heat dissipation. This feature is particularly important for high-density integrated switches, preventing localized overheating and improving the device's overall heat dissipation capacity. Using heat sink fins to dissipate liquid heat: The use of heat sink fins further enhances the liquid cooling system's heat dissipation. The fins increase the contact area with the ambient air, promoting heat dissipation. This design allows the liquid to efficiently release heat as it passes through the fins, ensuring the liquid remains cool throughout the circulation process, thereby enhancing the effectiveness of the entire liquid cooling system.

[0032] In summary, the liquid cooling device of the present invention improves the performance of the switch through an efficient heat dissipation mechanism, extends the service life of the equipment, reduces maintenance requirements, and provides users with a more reliable solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] The above and other aspects of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention from another perspective; Figure 3 It is a schematic structural diagram of the heat dissipation mechanism of the present invention; Figure 4 Schematic diagram of the internal structure of the housing assembly of the present invention; Figure 5 is a cross-sectional view of a housing assembly of the present invention; Figure 6 It is a schematic diagram of the internal structure of the lower part of the housing assembly of the present invention; Figure 7 This invention Figure 6 A local enlarged schematic diagram in FIG. Figure 8 It is a schematic structural diagram of the pressurizing assembly of the present invention; Figure 9 It is a schematic structural diagram of the liquid cooling mechanism of the present invention; Figure 10 It is a cross-sectional view of the liquid cooling mechanism of the present invention.

[0035] In the figure: 1. Base plate; 2. Mounting column; 3. Drive motor; 4. Heat dissipation mechanism; 41. Housing assembly; 411. Circulation chamber; 412. Guide plate; 413. Transition chamber; 414. Pressurization chamber; 415. Limiting slide; 42. Heat dissipation fin; 43. Water inlet; 44. Water outlet; 45. Pressurization assembly; 451. Rotating shaft; 452. Rotating rod; 453. Limiting ball; 5. Liquid cooling mechanism; 51. Exchange body; 511. Inlet and outlet channels; 52. Connecting socket; 53. Mounting cavity; 54. Liquid cooling assembly; 541. Liquid cooling channel; 55. Connecting block; 56. Water inlet pipe; 57. Water outlet pipe. DETAILED DESCRIPTION

[0036] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0037] like Figure 1-10 As shown in FIG, the liquid cooling device of the Ethernet switch has a reasonable design, a compact structure, and an effective heat dissipation and cooling effect. It mainly includes a base plate 1, a mounting column 2, a drive motor 3, a heat dissipation mechanism 4, and a liquid cooling mechanism 5.

[0038] Baseplate 1, the foundation of the device, is installed below the ground, providing a stable support structure. Mounting columns 2 are located above baseplate 1. These columns support and secure the other components, ensuring the stability and reliability of the entire device. Mounting columns 2 serve not only as a physical support structure but also as a way to connect and maintain the position of the various components of the device.

[0039] The drive motor 3, located in the center of the mounting structure, is the device's primary power source. By driving the pressurizing assembly 45, the drive motor 3 rotates, allowing the liquid in the transition chamber 413 to flow under pressure after passing through the pressurizing chamber 414. This design ensures that the flow of liquid can be effectively controlled and regulated, ensuring smooth and efficient circulation within the liquid cooling device.

[0040] The heat dissipation mechanism 4 is located above the mounting post 2. It features a large circulation chamber 411, providing ample space for liquid flow. Furthermore, heat dissipation fins 42 are also provided on the surface of the heat dissipation mechanism 4, effectively improving heat dissipation efficiency by increasing the surface area in contact with air. Under the action of the pressurizing assembly 45, the liquid continuously circulates within the heat dissipation mechanism 4, rapidly dissipating heat.

[0041] The liquid cooling mechanism 5 is a core component of the device, responsible for directly cooling the chips in the switch body 51. It is installed within the heat dissipation mechanism 4. The liquid cooling assembly 54 closely adheres to the surface of the chips in the switch body 51, ensuring more direct and effective heat dissipation. Chips generate significant heat during operation. If not promptly cooled, this can affect device performance and even cause overheating and damage. The continuous action of the liquid cooling mechanism 5 allows heat to be rapidly transferred away from the chip surface, achieving effective liquid cooling and ensuring efficient and stable operation of the Ethernet switch.

[0042] This liquid cooling device combines the dual functions of pressurized circulation and liquid cooling, which can not only ensure the effective circulation of the liquid, but also improve the heat dissipation and cooling effects, making it very suitable for use in scenarios that require efficient heat dissipation, such as the application of high-performance Ethernet switches and other equipment.

[0043] like Figure 3 As shown, the design of the heat dissipation mechanism 4 includes multiple functional components to ensure that the liquid effectively dissipates heat during the circulation process. First, the heat dissipation mechanism 4 is composed of a shell component 41, heat dissipation fins 42, a water inlet 43, a water outlet 44 and a pressurizing component 45. Among them, the shell component 41 is installed on the upper part of the mounting column 2 to support and protect the internal structure. The heat dissipation fins 42 are distributed on the top and both sides of the shell component 41, and the heat dissipation efficiency is improved by increasing the contact area with the air. When the liquid in the circulation chamber 411 flows through the heat dissipation fins 42, the heat is quickly dissipated to ensure that the liquid temperature is reduced.

[0044] Water inlet 43, located at the bottom of housing assembly 41, is responsible for introducing liquid from liquid cooling mechanism 5 into heat dissipation mechanism 4, participating in the heat dissipation process. After the liquid dissipates heat through the fins, it flows out through water outlet 44 at the bottom. Water outlet 44 cooperates with water inlet 43 to connect liquid cooling mechanism 5 with heat dissipation mechanism 4, thereby ensuring liquid circulation.

[0045] Furthermore, a pressurizing assembly 45 is mounted inside the housing assembly 41 to pressurize the liquid, promoting efficient flow of the liquid within the circulation chamber 411 and ensuring a more effective heat dissipation effect. This design not only improves cooling efficiency but also effectively extends the life of the device.

[0046] like Figure 4-7 As shown, the housing assembly 41 comprises a circulation chamber 411 and a guide plate 412, a clever design designed to enhance heat dissipation and fluid control. First, the circulation chamber 411, located within the housing assembly 41, serves a dual purpose: effectively dissipating heat from the switch housing, and secondly, its large contact area with the heat sink fins 42 allows the fluid flowing through it to cool rapidly, ensuring greater heat dissipation efficiency.

[0047] Guide plates 412 are installed inside the side of circulation chamber 411 and have the key function of regulating the speed and direction of water flow. The length of guide plates 412 is set to 2 / 3 the width of the side transition chamber 413, and they are arranged alternately on the left and right sides. This design ensures stable and even distribution of liquid during circulation, preventing excessive or uneven flow, ensuring stable and efficient heat dissipation, and ensuring continuous operation of the liquid circulation process.

[0048] The housing assembly 41 also includes a transition chamber 413, a pressurizing chamber 414, and a limiting chute 415, with a unique design and clear functions. The transition chamber 413 is located at the bottom of the housing assembly 41 and is used to guide the liquid to the pressurizing chamber 414 so that the liquid is pressurized before entering the circulation system. Through pressurization, the liquid can smoothly rise to the position of the water inlet 43, thereby achieving continuous circulation of the liquid. The transition chamber 413 is designed in a triangular shape and is distributed on both sides of the pressurizing chamber 414, forming a symmetrical structure, which effectively improves the smoothness of the liquid flow.

[0049] The pressurization chamber 414 adopts a circular structure, which can provide a uniform pressurization effect during the liquid flow. The limiting slide 415 is located on the central axis of the inner annular surface of the pressurization chamber 414, which serves to fix and guide the pressurization assembly 45, ensuring a stable and efficient pressurization process. This design enables the entire system to maintain stable pressure and fluid flow during operation, ensuring the durability and reliability of the heat dissipation effect.

[0050] like Figure 7-8As shown, the pressurizing assembly 45 comprises a rotating shaft 451, a rotating rod 452, and a stop ball 453, with an ingenious structural design and clear functions. The rotating shaft 451 is installed within the pressurizing chamber 414 and serves as the core component responsible for driving the entire pressurization process. The rotating rods 452 are distributed in a circular array around the rotating shaft 451. This arrangement ensures balance and stability during liquid pressurization, improving pressurization efficiency.

[0051] The stopper ball 453, located on the outer side of the rotating rod 452, ensures smooth rotation by rolling on the stopper groove 415. The design of the stopper ball 453 not only reduces friction but also effectively prevents deviation of the pressurizing assembly 45 during operation, ensuring a stable and efficient pressurization process for the entire system.

[0052] The distance between the top ends of adjacent rotating rods 452 is set to be greater than the opening distance of the transition chamber 413, so as to ensure that the liquid in the transition chamber 413 enters the space formed by the adjacent rotating rods 452 in the pressurizing component 45 as much as possible at the same time, thereby generating a greater pressure.

[0053] like Figure 9-10 As shown, the liquid cooling mechanism 5 primarily consists of a switch body 51, a connection port 52, and a mounting cavity 53, and features a precise and rational design. First, the switch body 51 is rectangular in shape, designed to fit snugly within the housing assembly 41 to ensure a secure fit within the device. To achieve this, the distance between the upper and lower inner surfaces of the housing assembly 41 is set to an integer multiple of the height of the switch body 51. This design not only ensures a tight fit between the switch body 51 and the housing assembly 41, but also effectively prevents dust from entering the interior, thereby improving the device's protective performance and service life.

[0054] The connection socket 52 is cleverly designed on the side of the switch body 51 for connecting to an external liquid cooling system or other necessary equipment to ensure that liquid can flow smoothly into and out of the switch body 51, thereby maintaining a stable cooling effect.

[0055] Furthermore, a mounting cavity 53 is defined within the switch housing 51 to house the necessary electronic components. This cavity design ensures a rational layout of the components, making connections between them more compact and providing more efficient cooling space for liquid cooling, ensuring operational stability and heat dissipation efficiency in high-intensity operating environments.

[0056] The liquid cooling mechanism 5 also includes a liquid cooling assembly 54, a connecting block 55, a water inlet pipe 56, and a water outlet pipe 57. Its structural design is precise and highly efficient. The liquid cooling assembly 54 is installed within the mounting cavity 53 of the switch body 51, providing core cooling. The liquid cooling assembly 54 is secured to its sides by connecting blocks 55, ensuring stable operation. These blocks also help to tightly integrate the liquid cooling assembly 54 with the rest of the cooling system, ensuring smooth liquid flow during the cooling process.

[0057] The inlet pipe 56 and outlet pipe 57 are located on the sides of the exchange body 51 and are arranged in different directions: the inlet pipe 56 is arranged upward or downward, while the outlet pipe 57 is arranged in the opposite direction. This design ensures unidirectional flow of the cooling liquid, avoiding backflow or turbulent flow. In addition, the inlet pipes 56 and outlet pipes 57 of adjacent liquid cooling mechanisms 5 are also arranged in opposite directions, forming a continuous coolant circulation system.

[0058] This arrangement not only ensures that the liquid flows in an orderly manner between the multiple liquid cooling mechanisms 5, but also greatly improves the cooling efficiency and realizes the recycling of the coolant, thereby ensuring that the entire system can maintain a long-term stable operating state while dissipating heat efficiently.

[0059] Two inlet and outlet channels 511 are provided inside the exchange body 51, and one end of the inlet and outlet channels 511 is connected to the water inlet pipe 56 and the water outlet pipe 57 respectively. A liquid cooling channel 541 is provided inside the liquid cooling component 54, and the liquid cooling channel 541 is arranged in a linear array to ensure heat dissipation efficiency.

[0060] During operation, the drive motor 3 rotates, driving the pressurizing assembly 45 to rotate in the pressurizing chamber 414. Liquid enters the pressurizing chamber 414 from the transition chamber 413 and flows to the other transition chamber 413 through the rotation of the rotating rod 452. During this process, the limiting ball 453 slides in the limiting groove 415 to ensure rotation stability. The pressurized liquid continues to move through the transition chamber 413, and part of the liquid enters the liquid cooling mechanism 5 through the water inlet 43, and the other part of the liquid moves upward in the circulation channel, and is assisted by an additional water pump arranged in the circulation channel to move the liquid upward. When the liquid moves to the circulation channel at the top, it flows through the circulation channel with the guide plate 412 arranged on the side, and then the guide plate 412 drains the liquid left and right, and the liquid enters the transition chamber 413 in an orderly manner to realize the outer large circulation. On the one hand, the outer large circulation is used to dissipate heat to the surface of the exchange body 51, and on the other hand, the larger circulation chamber 411 and the heat dissipation fins 42 are used to dissipate heat to the liquid.

[0061] The liquid that enters the liquid cooling mechanism 5 through the water inlet 43 flows into the liquid cooling channel 541 through the inlet and outlet channels 511 , thereby achieving efficient heat dissipation of the electronic components inside the mounting cavity 53 opened in the exchange body 51 .

[0062] Various modifications to the present disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the scope of the present disclosure. Therefore, the present disclosure is not limited to the examples and designs described herein, but should be given the widest scope consistent with the principles and novel features disclosed herein. Although one or more exemplary embodiments of the present disclosure have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined in the appended claims.

Claims

1. A liquid cooling device for an Ethernet switch, characterized in that: It comprises a base plate (1), a mounting column (2), a drive motor (3), a heat dissipation mechanism (4) and a liquid cooling mechanism (5); The base plate (1) is installed below the ground, and the mounting column (2) is installed above the base plate (1); The drive motor (3) is installed in the middle of the installation mechanism, and the drive motor (3) drives the pressurizing assembly (45) to rotate, so that the liquid in the transition chamber (413) passes through the pressurizing chamber (414) and flows under pressure; The heat dissipation mechanism (4) is installed on the mounting column (2); a large circulation chamber (411) is provided inside the heat dissipation mechanism (4) to dissipate heat from the liquid in cooperation with heat dissipation fins (42) arranged on the surface, and the liquid is pressurized and circulated through a pressurizing component (45); The liquid cooling mechanism (5) is installed inside the heat dissipation mechanism (4), and the liquid cooling component (54) is closely attached to the surface of the chip of the exchange body (51) to perform liquid cooling.

2. The liquid cooling device for an Ethernet switch according to claim 1, characterized in that: The heat dissipation mechanism (4) comprises a housing component (41), heat dissipation fins (42), a water inlet (43), a water outlet (44) and a pressurizing component (45); The housing component (41) is mounted on the top of the mounting column (2); the heat dissipation fins (42) are arranged on the top and two side surfaces of the housing component (41); the water inlet (43) is arranged at the bottom of the housing component (41); the water outlet (44) is arranged at the bottom of the housing component (41); and the pressurizing component (45) is mounted inside the housing component (41).

3. The liquid cooling device for an Ethernet switch according to claim 2, characterized in that: The housing assembly (41) comprises a circulation chamber (411) and a guide plate (412); The circulation chamber (411) is opened inside the housing assembly (41), and the guide plate (412) is installed inside the side circulation chamber (411). The length of the guide plate (412) is set to 2 / 3 of the width of the side transition chamber (413), and the guide plates (412) are alternately arranged on the left and right.

4. The liquid cooling device for an Ethernet switch according to claim 3, characterized in that: The housing assembly (41) further comprises a transition chamber (413), a pressurizing chamber (414) and a limiting sliding groove (415); The transition chamber (413) and the pressurizing chamber (414) are provided below the housing assembly (41); the pressurizing chamber (414) is provided in a circular shape, the transition chamber (413) is provided in a triangular shape, the transition chamber (413) is mirror-imaged on both sides of the pressurizing chamber (414), and the limiting slide groove (415) is provided on the central axis of the inner annular surface of the pressurizing chamber (414).

5. The liquid cooling device for an Ethernet switch according to claim 2, characterized in that: The pressurizing component (45) comprises a rotating shaft (451), a rotating rod (452) and a limiting ball (453); The rotating shaft (451) is installed inside the pressurizing chamber (414), the rotating rods (452) are arranged in a circular array around the rotating shaft (451), and the limiting balls (453) are arranged on the outer side surfaces of the rotating rods (452).

6. The liquid cooling device for an Ethernet switch according to claim 5, characterized in that: The distance between the top ends of adjacent rotating rods (452) is set to be greater than the opening distance of the transition cavity (413).

7. The liquid cooling device for an Ethernet switch according to claim 2, characterized in that: The liquid cooling mechanism (5) comprises an exchange body (51), a connection socket (52) and a mounting cavity (53); The switch body (51) is configured as a rectangular parallelepiped, the distance between the upper and lower inner side surfaces of the housing component (41) is configured as an integral multiple of the height of the switch body (51), the connection socket (52) is provided on the side surface of the switch body (51), and the installation cavity (53) is provided inside the switch body (51).

8. The liquid cooling device for an Ethernet switch according to claim 7, characterized in that: The liquid cooling mechanism (5) further comprises a liquid cooling component (54), a connecting block (55), a water inlet pipe (56) and a water outlet pipe (57); The liquid cooling component (54) is installed inside the installation cavity (53), the connection block (55) is installed on both sides of the liquid cooling component (54), the water inlet pipe (56) and the water outlet pipe (57) are arranged on the side of the exchange body (51), and the water inlet pipe (56) and the water outlet pipe (57) are respectively arranged upward or downward, and the two directions are opposite.

9. The liquid cooling device for an Ethernet switch according to claim 8, characterized in that: The water inlet pipe (56) and the water outlet pipe (57) installed on the adjacent liquid cooling mechanisms (5) are arranged in opposite directions.

10. The liquid cooling device for an Ethernet switch according to claim 9, characterized in that: Two inlet and outlet flow channels (511) are provided inside the exchange body (51), one end of the inlet and outlet flow channels (511) is respectively connected to the water inlet pipe (56) and the water outlet pipe (57), and a liquid cooling flow channel (541) is provided inside the liquid cooling component (54), and the liquid cooling flow channel (541) is arranged in a linear array.

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