Display device

Abstract

A display device includes: a display panel including a first non-bending portion, a bending portion, and a second non-bending portion; the flexible circuit board comprises a first flexible circuit board arranged on the upper surface of the second non-bending part and a second flexible circuit board arranged on the lower surface of the second non-bending part; the lower supporting piece is arranged below the first non-bending part; and an adhesive tape disposed on a lower surface of the lower support and a lower surface of the second flexible circuit board, in which the adhesive tape disposed on the lower surface of the second flexible circuit board is disposed at an edge of the second flexible circuit board.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims the priority benefit of Korean Patent Application No. 10-2023-0105119 filed in the Korean Intellectual Property Office on August 10, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device having a bent display panel. Background Art

[0004] Various display devices are widely used in multimedia devices such as televisions, mobile phones, tablet computers, and portable video game console devices. Display devices include various optical elements to provide users with images with excellent quality. Various optical elements are being studied to improve image display quality and image display efficiency in various display devices. Summary of the invention

[0005] A display device includes: a display panel, including a first non-bending portion, a bending portion, and a second non-bending portion; a flexible circuit board, including a first flexible circuit board arranged on the upper surface of the second non-bending portion and a second flexible circuit board arranged on the lower surface of the second non-bending portion; a lower support member, arranged below the first non-bending portion; and an adhesive tape, arranged between the lower surface of the lower support member and the lower surface of the second flexible circuit board, wherein the adhesive tape arranged on the lower surface of the second flexible circuit board is arranged at an edge of the second flexible circuit board.

[0006] A display device includes: a display panel including a first non-bending portion, a bending portion, and a second non-bending portion; and a lower support member disposed below the display panel, the lower support member including: a lower adhesive layer including a plurality of protruding patterns disposed on a surface of the lower adhesive layer facing the display panel; a cushion layer disposed below the lower adhesive layer; and a heat dissipation layer disposed below the cushion layer and including stainless steel. The cushion layer is non-porous. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and other aspects of the present disclosure will become apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0008] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure;

[0009] Figure 2 yes Figure 1 An exploded perspective view of the display device shown in ;

[0010] Figure 3 yes Figure 2 A cross-sectional view of a display module shown in ;

[0011] Figure 4 is a cross-sectional view of a display module according to an embodiment of the present disclosure;

[0012] Figure 5 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0013] Figure 6 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0014] Figure 7 is a cross-sectional view of a display device according to a comparative example;

[0015] Fig. 8A It is shown Figure 2 A cross-sectional view of the lower support member shown in ;

[0016] Figure 8B is a cross-sectional view showing a lower support member according to an embodiment of the present disclosure;

[0017] Fig. 9 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0018] Fig.10 is a cross-sectional view of a lower support member according to a comparative example;

[0019] Fig.11A and Fig. 11B It is shown Figure 2 A cross-sectional view of the display module and the lower support member shown in ;

[0020] Fig.12 is a perspective view of a display device according to an embodiment of the present disclosure;

[0021] Fig.13A and Fig. 13B is a cross-sectional view showing a display device according to an embodiment of the present disclosure; and

[0022] Fig.14A and Fig. 14B are images showing display devices according to a comparative example and an embodiment example of the present disclosure. DETAILED DESCRIPTION

[0023] By referring to the detailed description and accompanying drawings of the following embodiments, the features of the inventive concept and the methods for realizing the inventive concept can be more easily understood. However, the inventive concept can be implemented in many different forms and need not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the disclosure will be thorough and complete, and the inventive concept will be fully communicated to those skilled in the art. Throughout the specification and the accompanying drawings, the same reference numerals may refer to the same elements.

[0024] In the present disclosure, it will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, connected to, or coupled to the other element or layer, or intervening elements or layers may be present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] For ease of description, spatially relative terms such as "under", "beneath", "lower", "over", and "upper" may be used herein to describe the relationship of one element or feature to another (or other) element or feature (or features) shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the drawings.

[0026] It will be understood that, although the terms first, second, etc. can be used to describe various elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts are not necessarily limited by these terms. These terms are used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the present disclosure, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0027] Although each of the accompanying drawings may represent one or more specific embodiments of the present disclosure, drawn to scale so that relative lengths, relative thicknesses, and relative angles can be inferred therefrom, it is to be understood that the present invention is not necessarily limited to the relative lengths, relative thicknesses, and relative angles shown. These values ​​may be changed within the spirit and scope of the present disclosure (e.g., to allow for manufacturing limitations, etc.).

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0029] Figure 1 is a perspective view of a display device DD according to an embodiment of the present disclosure. Figure 2 yes Figure 1 An exploded perspective view of a display device DD is shown in FIG.

[0030] Reference Figure 1 As a representative example, a mobile phone terminal is shown as the display device DD. According to the present disclosure, the display device DD can be applied to large electronic products such as televisions and computer monitors, and small and medium-sized electronic products such as tablet computers, car navigation units, portable game units, and smart watches.

[0031] The display device DD may have a rectangular shape defined by a pair of long sides extending in a first direction DR1 and a pair of short sides extending in a second direction DR2 crossing the first direction DR1 in a plan view. However, the shape of the display device DD is not necessarily limited to the rectangular shape, and the display device DD may have various shapes such as a circular shape and other polygonal shapes.

[0032] Hereinafter, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 may be referred to as a third direction DR3. In the present disclosure, the expression "when viewed in a plane" or "in a plan view" may mean a state viewed in the third direction DR3.

[0033] The display device DD of the present disclosure may be rigid or flexible. The term "flexible" as used herein refers to the property of being able to bend from a fully bent structure to a structure of a few nanometers in size. For example, the flexible display device DD may be a curved electronic device, a rollable electronic device, or a foldable electronic device.

[0034] The display device DD may display an image IM through a display surface DD-IS. An icon image is shown as a representative example of the image IM. The display surface DD-IS may be substantially parallel to a plane defined by the first direction DR1 and the second direction DR2.

[0035] The display surface DD-IS may include a display area DD-DA through which an image IM is displayed and a non-display area DD-NDA defined to be adjacent to the display area DD-DA and at least partially surrounding the display area DD-DA. The image IM is not displayed through the non-display area DD-NDA. According to an embodiment, the non-display area DD-NDA may be omitted or may be defined to be adjacent to only one side of the display area DD-DA.

[0036] Reference Figure 2 , the display device DD may include a window WM, an upper adhesive layer OCA, a display module DM, a lower support CPL, and a receiving member BC such as a bottom case.

[0037] The window WM may be disposed on the display module DM and may transmit an image provided from the display module DM to the outside of the display module DM. The window WM may include a transmission area TA and a non-transmission area NTA. The transmission area TA may be Figure 1 The display area DD-DA shown in FIG. 4 overlaps and may have a shape corresponding to the shape of the display area DD-DA. The window WM may include a base layer and a functional layer disposed on the base layer. The functional layer may include a protective layer, an anti-fingerprint layer, and the like.

[0038] The base layer of the window WM may include glass, sapphire or plastic. The base layer of the window WM may include an optically transparent insulating material. As an example, the base layer of the window WM may include glass or a plastic film, or may include a glass substrate and a plastic film coupled to the glass substrate by an adhesive.

[0039] The non-transmitting area NTA can be Figure 1 , and may have a shape corresponding to the shape of the non-display area DD-NDA. The non-transmission area NTA may have a relatively low transmittance compared to the transmittance of the transmission area TA. The frame pattern may be provided in an area of ​​the base layer of the window WM, wherein the area in which the frame pattern is provided may be defined as the non-transmission area NTA, and the area in which the frame pattern is not provided may be defined as the transmission area TA. However, the present disclosure is not necessarily limited to this or thereby, and the non-transmission area NTA may be omitted.

[0040] The display module DM may be disposed under the window WM. The display module DM may include a display panel DP and an input sensor ISU.

[0041] The display panel DP may be one of a liquid crystal display panel, an electrophoretic display panel, a microelectromechanical system (MEMS) display panel, an electrowetting display panel, an organic light emitting display panel, an inorganic light emitting display panel, and a quantum dot light emitting display panel, and should not be particularly limited thereto. Hereinafter, the organic light emitting display panel will be described as the display panel DP.

[0042] The input sensor ISU may include one of a capacitive sensor, an optical sensor, an ultrasonic sensor, and an electromagnetic induction sensor. The input sensor ISU may be formed on the display panel DP through a continuous process, or may be attached to the upper portion of the display panel DP using an adhesive layer after being separately manufactured.

[0043] The display module DM may include a circuit board CB. The circuit board CB may include a driving chip DC and a flexible circuit board FPCB. Figure 2A structure is shown in which the driving chip DC is mounted on the display panel DP, however, the present disclosure is not necessarily limited thereto or thereby. The driving chip DC may generate a driving signal required to operate the display panel DP in response to a control signal provided from the flexible circuit board FPCB.

[0044] The display panel DP may include a bending portion BA, a first non-bending portion NBA1, and a second non-bending portion NBA2. The first non-bending portion NBA1 and the second non-bending portion NBA2 may be spaced apart from each other in the first direction DR1 with the bending portion BA interposed therebetween.

[0045] The bending portion BA may be a portion of the display panel DP that is bent relative to an imaginary bending axis extending in the second direction DR2. The first non-bending portion NBA1 may overlap the transmissive area TA, and the second non-bending portion NBA2 may be defined as an area to which the flexible circuit board FPCB is connected. When the bending portion BA is bent relative to the bending axis, the flexible circuit board FPCB and the driving chip DC may be bent toward the rear surface of the display panel DP, and the flexible circuit board FPCB and the driving chip DC may be disposed below the display panel DP. Fig.11A and Fig. 11B The bending of the bent portion BA is described in detail. An additional component may be provided to the display device DD to compensate for the step difference caused by the bent portion BA between the circuit board CB and the rear surface of the display panel DP.

[0046] According to an embodiment, the width of the first non-bending portion NBA1 in the second direction DR2 may be greater than the width of the bending portion BA and the second non-bending portion NBA2 in the second direction DR2, however, the present disclosure is not necessarily limited thereto or thereby. According to an embodiment, the width of the bending portion BA in the second direction DR2 may gradually decrease from the first non-bending portion NBA1 to the second non-bending portion NBA2, however, it is not necessarily limited thereto or thereby.

[0047] The flexible circuit board FPCB may be disposed at one end of the display panel DP. The flexible circuit board FPCB may be disposed on the upper surface of the second non-bending portion NBA2. A portion of the flexible circuit board FPCB may be disposed on the upper surface of the second non-bending portion NBA2, and another portion of the flexible circuit board FPCB may be bent to be disposed under the second non-bending portion NBA2. This will refer to Fig.11A and Fig. 11B Describe in detail.

[0048] The flexible circuit board FPCB may be connected to the display panel DP. The flexible circuit board FPCB may be electrically connected to the reference Figure 3 Describe the circuit component layer DP-CL.

[0049] The display module DM may further include an anti-reflection layer (eg, Figure 5 The anti-reflection layer ARL can reduce the reflectivity of external light incident from the outside of the display device DD to the anti-reflection layer. Figure 5 and Figure 6 The anti-reflection layer ARL is described in detail.

[0050] The upper adhesive layer OCA may be disposed between the window WM and the display module DM. The upper adhesive layer OCA may be disposed on the first non-bending portion NBA1 (or the anti-reflection layer ARL). The upper adhesive layer OCA may have a rectangular shape defined by a pair of long sides extending in the first direction DR1 and a pair of short sides extending in the second direction DR2 in a plan view. The window WM and the display module DM may be attached to each other by the upper adhesive layer OCA.

[0051] The receiving member BC may be disposed under the display module DM. The receiving member BC may receive the display module DM, the upper adhesive layer OCA, and the lower supporter CPL described below, and may be coupled with the window WM.

[0052] The lower support CPL may be disposed between the display module DM and the receiving member BC. The lower support CPL may be disposed under the first non-bending portion NBA1. The lower support CPL may have a rectangular shape defined by a pair of long sides extending in the first direction DR1 and a pair of short sides extending in the second direction DR2 in a plan view.

[0053] The lower support member CPL may include a cushion layer (e.g., Fig. 8A and Figure 8B pad FOM), heat sink (e.g. Fig. 8A and Figure 8B Heat dissipation layer HEL) etc. Fig. 8A and Figure 8B The lower support member CPL is described in detail.

[0054] Figure 3 yes Figure 2 . A cross-sectional view of the display module DM shown in FIG.

[0055] Reference Figure 3 , the display module DM may include an input sensor ISU, a display panel DP, and a panel protection layer PPL. The display panel DP may include a base layer BL, a circuit element layer DP-CL sequentially stacked on the base layer BL, a display element layer DP-OLED, and an upper insulating layer TFL. The input sensor ISU may be disposed on the upper insulating layer TFL.

[0056] The display panel DP may include a display area DP-DA and a non-display area DP-NDA. The display area DP-DA of the display panel DP may be Figure 1 The display area DD-DA or Figure 2 The transmission area TA shown in FIG. 1 corresponds to the transmission area TA, and the non-display area DP-NDA may correspond to the transmission area TA shown in FIG. Figure 1 The non-display area DD-NDA shown in Figure 2 corresponds to the non-transmitting area NTA shown in .

[0057] The base layer BL may include at least one plastic film. The base layer BL may be a flexible substrate, and may be a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate.

[0058] The circuit element layer DP-CL may include at least one intermediate insulating layer and a circuit element. The intermediate insulating layer may include at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit element may include a signal line and a pixel driving circuit.

[0059] The display element layer DP-OLED may include a plurality of organic light emitting diodes. The display element layer DP-OLED may further include an organic layer such as a pixel defining layer.

[0060] The upper insulating layer TFL may encapsulate the display element layer DP-OLED. The upper insulating layer TFL may be disposed on the display element layer DP-OLED. The upper insulating layer TFL may overlap the display area DP-DA. In other embodiments, the upper insulating layer TFL may overlap the display area DP-DA and the non-display area DP-NDA. The upper insulating layer TFL may overlap at least a portion of the non-display area DP-NDA. As an example, the upper insulating layer TFL may include a thin film encapsulation layer. The thin film encapsulation layer may have a stacked structure of an inorganic layer / organic layer / inorganic layer. The upper insulating layer TFL may protect the display element layer DP-OLED from moisture, oxygen, and foreign substances such as dust particles, however, it is not necessarily limited thereto or thereby. According to an embodiment, in addition to the thin film encapsulation layer, the upper insulating layer TFL may also include an additional insulating layer. Hereinafter, the upper insulating layer TFL will be described as the thin film encapsulation layer TFL.

[0061] According to an embodiment, a sealing substrate may be provided instead of the upper insulating layer TFL. In this case, the sealing substrate may face the base layer BL, and the circuit element layer DP-CL and the display element layer DP-OLED may be disposed between the sealing substrate and the base layer BL.

[0062] The input sensor ISU may be directly disposed on the display panel DP. In the present disclosure, the expression “component A is directly disposed on component B” means that there is no intervening element between component A and component B. In the present embodiment, the input sensor ISU may be formed with the display panel DP through a continuous process, however, the present disclosure is not necessarily limited to or thereby. According to an embodiment, the input sensor ISU may be provided as a separate panel and may then be coupled to the display panel DP through an adhesive layer. According to an embodiment, the input sensor ISU may be omitted.

[0063] The panel protection layer PPL may be disposed under the display panel DP. The panel protection layer PPL may protect the lower portion of the display panel DP. The panel protection layer PPL may include a flexible plastic material. As an example, the panel protection layer PPL may include polyethylene terephthalate (PET).

[0064] Figure 4 is a cross-sectional view of a display module DM according to an embodiment of the present disclosure.

[0065] Figure 4 A cross section corresponding to one light emitting area LA and a non-light emitting area NLA at least partially surrounding the one light emitting area LA is shown. Figure 4 Only one light emitting area LA is shown, however, the light emitting area LA may be provided in plural.

[0066] Figure 4 The light emitting element ED and one transistor TFT connected to the light emitting element ED are shown as an example. However, the light emitting element ED may be connected to a plurality of transistors and at least one capacitor.

[0067] As an example, Figure 4 The transistor TFT may be described as a silicon transistor, however, according to an embodiment, the transistor TFT may be a metal oxide transistor.

[0068] Reference Figure 4 The display module DM may include an input sensor ISU, a display panel DP and a panel protection layer PPL. The display panel DP may include a base layer BL, a circuit element layer DP-CL, a display element layer DP-OLED and a thin film encapsulation layer TFL.

[0069] The base layer BL may provide a base surface on which the circuit element layers DP-CL are arranged. The base layer BL may be a rigid base or a bendable, foldable or rollable flexible base. The base layer BL may be a plastic base, a glass base, a metal base or an organic / inorganic composite material base.

[0070] The base layer BL may have a multi-layer structure. For example, the base layer BL may include a first synthetic resin layer, an inorganic layer having a single layer or a multi-layer structure, and a second synthetic resin layer disposed on the inorganic layer having a single layer or a multi-layer structure. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin, however, it is not particularly limited thereto.

[0071] The circuit element layer DP-CL may be disposed on the base layer BL. The circuit element layer DP-CL may include an insulating layer, a semiconductor pattern, and a conductive pattern. The semiconductor pattern and the conductive pattern are used to form a signal line and a pixel driving circuit. The circuit element layer DP-CL may include a buffer layer BFL, a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, a fourth insulating layer 40, a fifth insulating layer 50, and a sixth insulating layer 60, a signal transmission region SCL, and a plurality of connection electrodes CNE1 and CNE2.

[0072] The buffer layer BFL may be disposed on the base layer BL. The buffer layer BFL may prevent metal atoms or impurities from diffusing from the base layer BL to the semiconductor pattern disposed on the base layer BL. A rear surface metal layer may also be disposed between the base layer BL and the buffer layer BFL. The rear surface metal layer may be disposed under the transistor TFT described later, and may prevent external light from reaching the transistor TFT.

[0073] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include a silicon semiconductor. For example, the silicon semiconductor may include amorphous silicon or polycrystalline silicon. For example, the semiconductor pattern may include low temperature polycrystalline silicon.

[0074] The semiconductor pattern may include a first region having a relatively high conductivity and a second region having a relatively low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region or a region doped at a concentration lower than that of the first region.

[0075] The first region may have a conductivity greater than that of the second region and may be substantially used as an electrode or a signal line. The second region may substantially correspond to an active region AC1 (or a channel) of the transistor TFT. For example, a portion of the semiconductor pattern may be an active region AC1 of the transistor TFT, another portion of the semiconductor pattern may be a source region SE1 (or source electrode SE1) or a drain region DE1 (or drain electrode DE1) of the transistor TFT, and another portion of the semiconductor pattern may be a connection electrode or a connection signal line.

[0076] The transistor TFT may include a source region SE1 (or source electrode SE1), an active region AC1 (or channel), a drain region DE1 (or drain electrode DE1), and a gate GT1. The source region SE1, the active region AC1, and the drain region DE1 of the transistor TFT may be formed of a semiconductor pattern. In a cross section, the source region SE1 and the drain region DE1 may extend from the active region AC1 in directions opposite to each other. Figure 4 A portion of a signal transmission region SCL formed of a semiconductor pattern is shown. In a plan view, the signal transmission region SCL may be connected to a drain electrode DE1 of the transistor TFT.

[0077] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may cover the source electrode SE1, the active region AC1, and the drain electrode DE1 of the transistor TFT disposed on the buffer layer BFL, and the signal transmission region SCL.

[0078] The first insulating layer 10 may include an inorganic layer and / or an organic layer, and may have a single layer or a multilayer structure. The inorganic layer may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide and / or hafnium oxide. In the present embodiment, the first insulating layer 10 may have a single layer structure of a silicon oxide layer. Not only the first insulating layer 10, but also the insulating layer of the circuit element layer DP-CL described later may be an inorganic layer and / or an organic layer, and may have a single layer or a multilayer structure. The inorganic layer may include at least one of the multiple materials mentioned above, however, it is not necessarily limited to this or thereby.

[0079] The gate electrode GT1 of the transistor TFT may be disposed on the first insulating layer 10. The gate electrode GT1 may be a part of a metal pattern. The gate electrode GT1 may overlap with the active region AC1. The gate electrode GT1 may be used as a mask in a process of doping a semiconductor pattern. The gate electrode GT1 may include titanium (Ti), silver (Ag), an alloy including silver (Ag), molybdenum (Mo), an alloy including molybdenum (Mo), aluminum (Al), an alloy including aluminum (Al), aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), indium tin oxide (ITO) or indium zinc oxide (IZO), etc., however, it is not necessarily limited thereto.

[0080] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate GT1 . The third insulating layer 30 may be disposed on the second insulating layer 20 .

[0081] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the signal transmission region SCL via a contact hole CNT-1 defined through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30. The fourth insulating layer 40 may be disposed on the third insulating layer 30 and may cover the first connection electrode CNE1. The fourth insulating layer 40 may be an organic layer.

[0082] The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT-2 defined through the fourth insulating layer 40 and the fifth insulating layer 50. The fifth insulating layer 50 may be an organic layer.

[0083] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer. The stacked structure of the first insulating layer 10 to the sixth insulating layer 60 is only an example, and in addition to the first insulating layer 10 to the sixth insulating layer 60, additional conductive layers and insulating layers may be further disposed.

[0084] The display element layer DP-OLED may be disposed on the circuit element layer DP-CL. The display element layer DP-OLED may include a light emitting element ED and a pixel defining layer PDL.

[0085] The light emitting element ED may be an organic light emitting element, an inorganic light emitting element, an organic-inorganic light emitting element, a quantum dot light emitting element, a micro light emitting diode (LED), or a nano-LED. However, the light emitting element ED is not necessarily limited thereto or thereby, and may include various embodiments as long as the light emitting element ED can emit light in response to an electrical signal or can control the amount of light.

[0086] The light emitting element ED may include a first electrode AE ​​(or anode), a light emitting pattern EP, and a second electrode CE (or cathode CE). The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. The first electrode AE ​​may include a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium oxide (In 2 O 3) and / or aluminum-doped zinc oxide (AZO). For example, the first electrode AE ​​may have a stack structure of ITO / Ag / ITO. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a contact hole CNT-3 defined through the sixth insulating layer 60.

[0087] The pixel defining layer PDL may be disposed on the sixth insulating layer 60. The pixel defining layer PDL may have a light absorbing property. For example, the pixel defining layer PDL may have a black color. The pixel defining layer PDL may include a black colorant. The black colorant may include a black dye or a black pigment. The black colorant may include carbon black, a metal (such as chromium) or an oxide thereof. The pixel defining layer PDL may correspond to a light blocking pattern having a light blocking property.

[0088] The pixel defining layer PDL may cover a portion of the first electrode AE. As an example, an opening PDL-OP may be defined through the pixel defining layer PDL to expose a portion of the first electrode AE. The opening PDL-OP of the pixel defining layer PDL may define the light emitting area LA.

[0089] A hole control layer may be provided between the first electrode AE ​​and the light emitting pattern EP. The hole control layer may also include a hole transport layer and / or a hole injection layer. An electron control layer may also be provided between the light emitting pattern EP and the second electrode CE. The electron control layer may also include an electron transport layer and / or an electron injection layer.

[0090] The display element layer DP-OLED may further include a coating layer. The coating layer may be disposed on the light emitting element ED and may cover the second electrode CE of the light emitting element ED. The coating layer may include an organic material. The coating layer may have a single layer or a multilayer structure. The coating layer may fully protect the cathode CE disposed thereunder and the organic light emitting layer (as the light emitting pattern EP) disposed thereunder from moisture or pollutants from the outside, and therefore, the life of the light emitting element ED may be increased.

[0091] The thin film encapsulation layer TFL may be disposed on the display element layer DP-OLED. The thin film encapsulation layer TFL may protect the display element layer DP-OLED from moisture, oxygen, and foreign substances such as dust particles. The thin film encapsulation layer TFL may include a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 sequentially stacked, however, the layers forming the thin film encapsulation layer TFL are not necessarily limited thereto or thereby.

[0092] The first inorganic layer 141 and the second inorganic layer 143 may protect the display element layer DP-OLED from moisture and oxygen, and the organic layer 142 may protect the display element layer DP-OLED from foreign substances such as dust particles. Each of the first inorganic layer 141 and the second inorganic layer 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer 142 may include an acrylic organic layer, however, it is not necessarily particularly limited thereto.

[0093] The input sensor ISU may be disposed on the display panel DP. The input sensor ISU may be referred to as a sensor layer, an input sensing layer, or an input sensing panel. The input sensor ISU may include a base insulating layer IL1, a first conductive layer CL1, a sensing insulating layer IL2, a second conductive layer CL2, and a cover layer IL3.

[0094] The base insulating layer IL1 may be directly disposed on the display panel DP. The base insulating layer IL1 may be an inorganic layer including silicon nitride, silicon oxynitride, and / or silicon oxide. According to an embodiment, the base insulating layer IL1 may be an organic layer including an epoxy resin, an acrylic resin, or an imide resin. The base insulating layer IL1 may have a single-layer structure or a multi-layer structure stacked in the third direction DR3.

[0095] Each of the first and second conductive layers CL1 and CL2 may have a single layer structure or a multi-layer structure stacked in the third direction DR3. When viewed in a plane, each of the first and second conductive layers CL1 and CL2 may include a sensing pattern or a bridge pattern having a mesh structure.

[0096] The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO) or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire or graphene.

[0097] The conductive layer having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0098] The sensing insulating layer IL2 may be disposed between the first conductive layer CL1 and the second conductive layer CL2. The cover layer IL3 may be disposed on the sensing insulating layer IL2 and may cover the second conductive layer CL2. The cover layer IL3 may reduce or eliminate the possibility of damaging the second conductive layer CL2 in subsequent processes. According to an embodiment, the input sensor ISU may not include the cover layer IL3.

[0099] The sensing insulating layer IL2 and the capping layer IL3 may include an inorganic layer, which may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and / or hafnium oxide.

[0100] According to an embodiment, the sensing insulating layer IL2 and the cover layer IL3 may include an organic layer, which may include epoxy-based resin, polyurethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and / or perylene-based resin.

[0101] The panel protection layer PPL may be disposed under the display panel DP. The panel protection layer PPL may be disposed on the lower surface of the base layer BL. The panel protection layer PPL may include a flexible plastic material. As an example, the panel protection layer PPL may include polyethylene terephthalate (PET). The panel protection layer PPL may protect the lower portion of the display panel DP.

[0102] Figure 5 is a cross-sectional view of a display device DD according to an embodiment of the present disclosure. Figure 6 is a cross-sectional view of a display device DD according to an embodiment of the present disclosure. Figure 7 is a cross-sectional view of a display device according to a comparative example.

[0103] For convenience of explanation, each of the base layer BL, the circuit element layers DP-DL, and the thin film encapsulation layer TFL is Figure 5 , Figure 6 and Figure 7 Schematically shown as a single layer.

[0104] For ease of explanation, Figure 5 , Figure 6 and Figure 7 Omitted Figure 2 The lower support member CPL and the receiving member BC shown in FIG.

[0105] because Figure 5 , Figure 6 and Figure 7 The panel protection layer PPL, the base layer BL, the circuit element layer DP-CL, the display element layer DP-OLED and the input sensor ISU shown in FIG. Figure 4The panel protection layer PPL, base layer BL, circuit element layer DP-CL, display element layer DP-OLED and input sensor ISU shown in the figure are basically the same, so in the absence of a detailed description of an element in the figure, it can be understood that the element is at least similar to the corresponding element already described elsewhere in the present disclosure.

[0106] about Figure 5 and Figure 6 The description of the first light emitting element ED1, the second light emitting element ED2, and the third light emitting element ED3 shown in FIG. 1 can be compared with the description of Figure 4 The description of the light emitting element ED shown in is basically the same.

[0107] because Figure 7 The display module DM and the anti-reflection layer ARL are Figure 5 The display module DM and the anti-reflection layer ARL are substantially the same, and thus the following description will focus on different features of the display module DM and the anti-reflection layer ARL.

[0108] Reference Figure 4 , Figure 5 and Figure 6 , the display panel DP may include a first light emitting element ED1, a second light emitting element ED2, and a third light emitting element ED3. The first light emitting element ED1 may include a first anode AE1, a first light emitting pattern EP1, and a portion of a cathode CE. The second light emitting element ED2 may include a second anode AE2, a second light emitting pattern EP2, and a portion of a cathode CE. The third light emitting element ED3 may include a third anode AE3, a third light emitting pattern EP3, and a portion of a cathode CE.

[0109] The first anode AE1, the second anode AE2, and the third anode AE3 may be provided in a plurality of patterns. The first light emitting opening OP1-E, the second light emitting opening OP2-E, and the third light emitting opening OP3-E may be defined through the pixel defining layer PDL. At least a portion of the first anode AE1 may be exposed through the first light emitting opening OP1-E. At least a portion of the second anode AE2 may be exposed through the second light emitting opening OP2-E. At least a portion of the third anode AE3 may be exposed through the third light emitting opening OP3-E.

[0110] The first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 may be respectively disposed on the first anode AE1, the second anode AE2, and the third anode AE3, and the first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 may be disposed on the pixel defining layer PDL. The first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 may be respectively disposed in the first light emitting opening OP1-E, the second light emitting opening OP2-E, and the third light emitting opening OP3-E. The first light emitting pattern EP1 may be disposed in the first light emitting opening OP1-E, the second light emitting pattern EP2 may be disposed in the second light emitting opening OP2-E, and the third light emitting pattern EP3 may be disposed in the third light emitting opening OP3-E. The cathode CE may be disposed on the first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 and the pixel defining layer PDL.

[0111] Figures 4 to 6 A structure in which the first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 are respectively disposed on the first anode AE1, the second anode AE2, and the third anode AE3 and may be disposed on the pixel defining layer PDL is shown as a representative example, however, the present disclosure is not necessarily limited thereto or thereby. As an example, the first light emitting pattern EP1, the second light emitting pattern EP2, and the third light emitting pattern EP3 may be respectively disposed only on the first anode AE1, the second anode AE2, and the third anode AE3.

[0112] The first, second and third emission patterns EP1, EP2 and EP3 may emit light having different colors from each other. As an example, the first emission pattern EP1 may provide (or emit) red light, the second emission pattern EP2 may provide green light, and the third emission pattern EP3 may provide blue light.

[0113] Reference Figure 5 , the display module DM may further include an anti-reflection layer ARL. The anti-reflection layer ARL may reduce the reflectivity of external light. The anti-reflection layer ARL may include a light shielding pattern BM, a color filter CF, and an overcoat layer OC. The anti-reflection layer ARL may be disposed on the display panel DP, for example, on the input sensor ISU.

[0114] The light shielding pattern BM may be provided on the input sensor ISU. The light shielding pattern BM may have a black color and may include a black colorant. The black colorant may include a black pigment or a black dye. The black colorant may include carbon black, a metal (such as chromium) or an oxide thereof. However, this is merely an example, and the material used for the light shielding pattern BM is not necessarily limited thereto as long as the material absorbs light.

[0115] The light shielding pattern BM can prevent external light from being Figure 4 The first conductive layer CL1 and the second conductive layer CL2 shown in the figure are reflected. The light-shielding pattern BM may overlap with the pixel defining layer PDL. The first opening BM-OP1, the second opening BM-OP2, and the third opening BM-OP3 may be defined through the light-shielding pattern BM. The first opening BM-OP1, the second opening BM-OP2, and the third opening BM-OP3 of the light-shielding pattern BM may overlap with the first light-emitting opening OP1-E, the second light-emitting opening OP2-E, and the third light-emitting opening OP3-E of the pixel defining layer PDL, respectively. The first opening BM-OP1 may overlap with the first light-emitting opening OP1-E, the second opening BM-OP2 may overlap with the second light-emitting opening OP2-E, and the third opening BM-OP3 may overlap with the third light-emitting opening OP3-E.

[0116] The first opening BM-OP1, the second opening BM-OP2, and the third opening BM-OP3 of the light shielding pattern BM may define the first pixel area PXA-R, the second pixel area PXA-G, and the third pixel area PXA-B, respectively. The first pixel area PXA-R, the second pixel area PXA-G, and the third pixel area PXA-B may be defined as areas where light generated by the first light emitting element ED1, the second light emitting element ED2, and the third light emitting element ED3 is emitted to the outside from the first pixel area PXA-R, the second pixel area PXA-G, and the third pixel area PXA-B, respectively.

[0117] The color filter CF may be disposed on the input sensor ISU. The color filter CF may be disposed in the first opening BM-OP1, the second opening BM-OP2, and the third opening BM-OP3 defined by the light blocking pattern BM. A portion of the color filter CF may be disposed on the light blocking pattern BM.

[0118] The color filter CF may include a first color filter CF1, a second color filter CF2, and a third color filter CF3. Each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may overlap with a corresponding pixel area among the first pixel area PXA-R, the second pixel area PXA-G, and the third pixel area PXA-B. A portion of each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may overlap with the non-pixel area NPXA. The first color filter CF1, the second color filter CF2, and the third color filter CF3 may be disposed on the light shielding pattern BM.

[0119] Each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may overlap with a corresponding light emitting element among the first light emitting element ED1, the second light emitting element ED2, and the third light emitting element ED3. The color filter CF may correspond to the first light emitting element ED1, the second light emitting element ED2, and the third light emitting element ED3, and may transmit light generated by the first light emitting element ED1, the second light emitting element ED2, and the third light emitting element ED3.

[0120] For example, the first color filter CF1 may transmit the first light provided from the first light emitting element ED1, the second color filter CF2 may transmit the second light provided from the second light emitting element ED2, and the third color filter CF3 may transmit the third light provided from the third light emitting element ED3. As an example, the first light may be red light, the second light may be green light, and the third light may be blue light.

[0121] The color filter CF may block external light having some wavelengths. For example, the first, second, and third color filters CF1, CF2, and CF3 may reduce reflection of external light caused by the first, second, and third anodes AE1, AE2, and AE3 or the cathode CE.

[0122] Each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may include a polymer photosensitive resin and a pigment or dye. The first color filter CF1 may include a red pigment or a red dye, the second color filter CF2 may include a green pigment or a green dye, and the third color filter CF3 may include a blue pigment or a blue dye, however, the present disclosure is not necessarily limited thereto or thereby. According to an embodiment, the third color filter CF3 may not include a pigment and a dye. As an example, the third color filter CF3 may be formed of a transparent photosensitive resin, and the third color filter CF3 may be transparent. In the case where the third color filter CF3 is formed of a transparent photosensitive resin, the light passing through the third color filter CF3 is not necessarily limited to the third light.

[0123] The overcoat layer OC may cover the light blocking pattern BM, the first color filter CF1, the second color filter CF2, and the third color filter CF3. The overcoat layer OC may include an organic material, and may provide a flat upper surface thereon.

[0124] Reference Figure 6 The anti-reflection layer ARLa may not include the color filter CF (refer to Figure 5 For example, the anti-reflection layer ARLa may include a light shielding pattern BM and a light control layer RCL. The light control layer RCL may be filled between the light shielding patterns BM spaced apart from each other.

[0125] The dye and pigment included in the light control layer RCL may be a material that transmits light in a specific wavelength range among the light emitted from the light emitting elements ED1, ED2, and ED3. According to an embodiment, each of the dye and the pigment may absorb light in a wavelength range equal to or greater than about 490 nm and equal to or less than about 505 nm and light in a wavelength range equal to or greater than about 585 nm and equal to or less than about 600 nm, and the dye and the pigment may transmit light in the remaining wavelength ranges. Since the dye and the pigment included in the light control layer RCL absorb light having a specific wavelength and transmit light having other wavelength ranges, external light may be prevented from being reflected, and therefore, the color of light emitted from the display panel DP may be controlled.

[0126] Each of the dyes and pigments included in the light control layer RCL may include anthraquinone compounds, phthalocyanine compounds, azo compounds, perylene compounds, xanthene compounds, diimonium compounds, dipyrromethane compounds, porphyrin compounds, squarylium compounds, oxazine compounds, triarylmethane compounds and / or cyanine compounds. As an example, the light control layer RCL may include one or a combination of porphyrin compounds, cyanine compounds, squarylium compounds and oxazine compounds. Relative to the total content of the light control layer RCL, the light control layer RCL may include 0.01wt% or more and 5.00wt% or less of dyes and pigments. In the case where the light control layer RCL includes less than about 0.01wt% of dyes and pigments, light within a specific wavelength range may not be fully absorbed, and therefore, color reproducibility may not be improved. In the case where the light management layer RCL includes more than about 5.00 wt % of the dye and the pigment, agglomeration may occur in the dye and the pigment.

[0127] Reference Figure 5 and Figure 6 , the window WM may be disposed on the anti-reflection layers ARL and ARLa. The window WM may have an optically transparent property. The window WM may include glass, however, the present disclosure is not necessarily limited thereto or thereby. The window WM may include a synthetic resin film.

[0128] The window WM may have a single-layer or multi-layer structure. As an example, the window WM may include a plurality of synthetic resin films coupled to each other by an adhesive, or may include a glass substrate and a synthetic resin film coupled to the glass substrate by an adhesive. According to an embodiment, when the window WM includes a synthetic resin film, the upper adhesive layer OCA may be omitted.

[0129] An upper adhesive layer OCA may be disposed between the display module DM and the window WM. The display module DM and the window WM may be coupled to each other through the upper adhesive layer OCA.

[0130] The upper adhesive layer OCA may include an optically clear adhesive. The upper adhesive layer OCA may be optically clear.

[0131] The upper adhesive layer OCA may have a thickness t1 ranging from about 75 micrometers to about 100 micrometers. The thickness t1 of the upper adhesive layer OCA may be referred to as a first thickness t1. The upper adhesive layer OCA may have an elastic modulus ranging from about 0.36 MPa to about 0.44 MPa.

[0132] Reference Figure 5 , Figure 6 and Figure 7 , Figure 7 The first upper adhesive layer OCA' shown in may have a thickness t2 ranging from about 140 micrometers to about 160 micrometers. The thickness t2 of the first upper adhesive layer OCA' may be referred to as a second thickness t2. Figure 7 The first upper adhesive layer OCA' shown in FIG. 5 may have an elastic modulus of about 0.23 MPa.

[0133] Because the elastic modulus of the upper adhesive layer OCA is greater than that of the first upper adhesive layer OCA', the repulsive force of the upper adhesive layer OCA can be increased against the external force applied from above the display device DD. Therefore, the upper adhesive layer OCA is less likely to be deformed by the external force, and thus, the possibility of the upper adhesive layer OCA being visible to the user can be reduced.

[0134] In addition, since the first thickness t1 of the upper adhesive layer OCA is less than the second thickness t2 of the first upper adhesive layer OCA', even if an external force is applied to the display device DD, the deformation amount can be small. For example, when an external force with the same strength is applied to the upper adhesive layer OCA and the first upper adhesive layer OCA', the strain rate of the upper adhesive layer OCA having a relatively large elastic modulus can be less than the strain rate of the first upper adhesive layer OCA'. The strain rate can be defined as the ratio between the thickness deformation and the original thickness. For example, the deformation amount can be proportional to the strain rate and the original thickness. Since the strain rate of the upper adhesive layer OCA is less than the strain rate of the first upper adhesive layer OCA', and the first thickness t1 of the upper adhesive layer OCA is less than the second thickness t2 of the first upper adhesive layer OCA', the deformation amount of the upper adhesive layer OCA can be less than the deformation amount of the first upper adhesive layer OCA'. Therefore, the possibility that the deformation of the upper adhesive layer OCA is visible to the user can be reduced.

[0135] Fig. 8A It is shown Figure 2 A cross-sectional view of the lower support member CPL shown in FIG. Figure 8B is a cross-sectional view showing a lower support member CPLa according to an embodiment of the present disclosure.

[0136] As an example, Fig. 8A and Figure 8B A cross-sectional view of the lower supports CPL and CPLa is shown.

[0137] Figure 8B The lower adhesive layer EB, the pad layer FOM and the heat dissipation layer HEL are Fig. 8A The lower adhesive layer EB, the pad layer FOM and the heat dissipation layer HEL are substantially identical, and therefore, in the event that an element is not described in detail with respect to this figure, it can be understood that the element is at least similar to the corresponding element described elsewhere within the present disclosure.

[0138] Reference Fig. 8A The lower support CPL may include a lower adhesive layer EB, a reinforcement film SFL, a cushion layer FOM, and a heat dissipation layer HEL. The lower adhesive layer EB may be disposed at an upper portion of the lower support CPL, and the lower support CPL may be attached to the display panel DP (refer to Figure 6 ). As an example, various polymer resins may be used as materials for the lower adhesive layer EB. The material for the lower adhesive layer EB is not necessarily limited thereto, and adhesive materials well known to those skilled in the art may be used for the lower adhesive layer EB. The lower adhesive layer EB may include, for example, a pressure-sensitive adhesive (PSA).

[0139] The lower adhesive layer EB may include an adhesive base ADB and a protruding pattern PP. The adhesive base ADB may include an upper surface and a lower surface opposite to the upper surface, and the protruding pattern PP may be defined on the upper surface of the adhesive base ADB. The upper surface of the adhesive base ADB may be in contact with the display panel DP (refer to Figure 6 ) is adjacent to the heat dissipation layer HEL, and a lower surface of the adhesive base ADB may face the heat dissipation layer HEL.

[0140] The protrusion pattern PP may be disposed on the upper surface of the adhesive base ADB, and may be defined as an embossed pattern protruding upward from the adhesive base ADB. The protrusion pattern PP may be integrally formed with the adhesive base ADB.

[0141] The protrusion pattern PP may have an upwardly convex shape. The protrusion pattern PP may have a semicircular shape in a cross-sectional view, however, the shape of the protrusion pattern PP is not necessarily limited thereto or thereby. According to an embodiment, the protrusion pattern PP may have a semi-elliptical shape or a polygonal shape such as a quadrilateral shape.

[0142] As an example, the lower adhesive layer EB may have a thickness t3 in a range from about 60 μm to about 80 μm. The thickness t3 of the lower adhesive layer EB may be defined as a third thickness t3. The thickness t4 of the lower support member CPL may be defined as a fourth thickness t4. Fig. 9The third thickness t3 and the fourth thickness t4 are described in detail.

[0143] The reinforcement film SFL may be disposed under the lower adhesive layer EB (or between the lower adhesive layer EB and the backing layer FOM). The reinforcement film SFL may include carbon fiber reinforced plastic (CFRP) or stainless steel (eg, SUS). The reinforcement film SFL may support the display panel DP (refer to Figure 6 ) resists the application to the display device DD (refer to Figure 1 ) external force. The reinforcing film SFL can be omitted.

[0144] The pad layer FOM may be disposed below the enhancement film SFL. The pad layer FOM may absorb the Figure 1 ) is applied to the display device DD (refer to Figure 1 ) to protect the display panel DP (refer to Figure 6 ).

[0145] The pad layer FOM may include an impact absorbing material such as foam or sponge. The pad layer FOM may include an acrylic polymer resin or a urethane polymer resin. As an example, the pad layer FOM may have a thickness in a range from about 105 microns to about 155 microns.

[0146] The heat dissipation layer HEL may be disposed below the pad layer FOM. The heat dissipation layer HEL disposed below the pad layer FOM may perform a heat dissipation function. The heat dissipation layer HEL may include a thermally conductive material. The heat dissipation layer HEL may include stainless steel (SUS 304). Figure 6 ) can be dissipated through the heat dissipation layer HEL, and thus, the heat can be prevented from being transferred to the display panel DP (refer to Figure 6 ).

[0147] The heat dissipation layer HEL may include an electromagnetic shielding material. Therefore, it is possible to prevent the electric field and the magnetic field generated from the electronic components placed under the heat dissipation layer HEL from being transmitted to the display panel DP placed on the lower support member CPL (refer to Figure 6 ).

[0148] Reference Figure 8B The reinforcement film SFL can be omitted from the lower support member CPLa (refer to Fig. 8A ). In this case, the lower adhesive layer EB may be disposed on the upper surface of the cushion layer FOM.

[0149] The lower support member CPLa may further include a digitizer DGT. The digitizer DGT may be disposed between the pad layer FOM and the heat dissipation layer HEL.

[0150] The digitizer DGT may receive information about a position indicated by a user in a display screen. The digitizer DGT may be implemented by an electromagnetic method or an electromagnetic resonance method. As an example, the digitizer DGT may include a digitizer sensor substrate including a plurality of coils, however, the present disclosure is not necessarily limited thereto or thereby. According to an embodiment, the digitizer DGT may be implemented by an active electrostatic method.

[0151] When the user displays the display device DD (refer to Figure 1 ) When the electromagnetic pen is moved on the surface, the electromagnetic pen can be driven by an AC signal to generate an oscillating magnetic field, and the oscillating magnetic field can induce a signal in the coil. The position of the electromagnetic pen can be detected based on the signal induced in the coil. The digitizer DGT can determine the position of the electromagnetic pen by detecting the electromagnetic changes that occur when the electromagnetic pen approaches.

[0152] Fig. 9 is a cross-sectional view of a display device DD according to an embodiment of the present disclosure. Fig.10 is a cross-sectional view of a lower support member CPL' according to a comparative example.

[0153] As an example, the receiving member BC of the display device DD is omitted (see Figure 2 ).

[0154] As an example, each of the display panel DP, the anti-reflection layer ARL, and the lower adhesive layer EB is schematically illustrated as a single layer.

[0155] Fig.10 The lower support CPL′ according to the comparative example shown in FIG. 1 may be referred to as a first lower support CPL′. Fig.10 The lower adhesive layer EB′ according to the comparative example shown in FIG. 1 may be referred to as a first lower adhesive layer EB′. Fig.10 The pad layer FOM′ according to the comparative example shown in FIG. 1 may be referred to as a first pad layer FOM′. Fig.10 The heat dissipation layer HEL′ according to the comparative example shown in FIG. 2 may be referred to as a first heat dissipation layer HEL′.

[0156] because Fig. 9 The window WM, the upper adhesive layer OCA, the display module DM and the lower support CPL are Figure 2 Window WM, Figure 6 The upper adhesive layer OCA and the display module DM as well as Fig. 8A The lower support member CPL is substantially identical, so that where an element is not described in detail with respect to this figure, it is understood that the element is at least similar to a corresponding element already described elsewhere within the present disclosure.

[0157] Reference Fig. 9, the upper adhesive layer OCA may be disposed on the display module DM. The window WM may be disposed on the upper adhesive layer OCA. The display module DM may be coupled to the window WM through the upper adhesive layer OCA. The lower support CPL may be disposed under the display module DM. The lower support CPL disposed under the display module DM may support the display module DM.

[0158] Reference Fig.10 , the first lower support member CPL' may include a first lower adhesive layer EB', a first cushion layer FOM', and a first heat dissipation layer HEL'. The first heat dissipation layer HEL', the first cushion layer FOM', and the first lower adhesive layer EB' may be sequentially stacked.

[0159] The first lower adhesive layer EB' may have a thickness t5 of about 30 micrometers. The first backing layer FOM' may be provided with an aperture AVA defined therein. The first heat dissipation layer HEL' may include copper (Cu).

[0160] Reference Fig. 9 and Fig.10 , the fourth thickness t4 of the lower support CPL may be greater than the thickness t6 of the first lower support CPL'. For example, the third thickness t3 of the lower adhesive layer EB may be greater than the thickness t5 of the first lower adhesive layer EB'. In addition, because the lower support CPL includes the reinforcement film SFL, the fourth thickness t4 of the lower support CPL may be greater than the thickness t6 of the first lower support CPL'.

[0161] Since the thickness of the lower support CPL (i.e., the fourth thickness t4) increases, even if an external force is applied to the display device DD, the resistance of the lower support CPL against the external force can be increased. Therefore, the deformation of the lower support CPL can be reduced, and therefore, the possibility of the deformation of the lower support CPL being visible to the user can be reduced.

[0162] In addition, in the case where the hole AVA is defined in the first pad layer FOM', when external force is applied to the display device DD, the first pad layer FOM' defining the hole AVA may be squeezed, and the shapes of the hole AVA and the first pad layer FOM' may be deformed. Therefore, the user may observe the deformation of the first pad layer FOM'.

[0163] However, the aperture AVA may not be defined in the pad layer FOM. Therefore, the deformation of the pad layer FOM may be reduced. Therefore, the possibility that the deformation of the pad layer FOM is visible to the user may be reduced.

[0164] In addition, since the lower support CPL includes the reinforcement film SFL, when an external impact is applied to the display device DD, the reinforcement film SFL may absorb the external impact together with the cushion layer FOM. Therefore, deformation of the lower support CPL may be reduced.

[0165] The heat dissipation layer HEL may include stainless steel. The first heat dissipation layer HEL' may include copper. Stainless steel may have an elastic modulus greater than that of copper. Because the lower support CPL includes the heat dissipation layer HEL including stainless steel, the resistance of the lower support CPL against external impact may be increased. Therefore, the deformation of the lower support CPL may be reduced, and the possibility that the deformation of the lower support CPL is visible to the user may be reduced.

[0166] Fig.11A and Fig. 11B It is shown Figure 2 2 is a cross-sectional view of the display module DM and the lower support member CPL shown in FIG.

[0167] Fig.11A is along Figure 2 A cross-sectional view taken along line II'.

[0168] For ease of explanation, the upper adhesive layer OCA and the window WM are omitted.

[0169] For convenience of explanation, each of the display panel DP, the input sensor ISU, the anti-reflection layer ARL, and the lower supporter CPL is schematically illustrated as a single layer.

[0170] Fig.11A The state where the bent portion BA is not bent is shown. Fig. 11B The bent portion BA is shown in a bent state.

[0171] because Fig.11A and Fig. 11B The driving chip DC, input sensor ISU, anti-reflection layer ARL, display panel DP and lower support CPL are Figure 2 The driver chip DC and Fig. 9 The input sensor ISU, anti-reflection layer ARL, display panel DP and lower support CPL are substantially identical and therefore, without describing an element in detail with respect to the figure, it can be understood that the element is at least similar to the corresponding element described elsewhere within the present disclosure.

[0172] Reference Figure 2 and Fig.11A , the display panel DP may include a first non-bending portion NBA1, a second non-bending portion NBA2, and a bending portion BA disposed between the first non-bending portion NBA1 and the second non-bending portion NBA2.

[0173] The display device DD (specifically, the circuit board CB) may include a flexible circuit board FPCB and a driving chip DC. The flexible circuit board FPCB and the driving chip DC may be coupled to the second non-bending portion NBA2. The flexible circuit board FPCB and the driving chip DC may be disposed on the upper surface of the second non-bending portion NBA2. The flexible circuit board FPCB may be bent and connected to the second non-bending portion NBA2. The portion of the flexible circuit board FPCB disposed on the upper surface of the second non-bending portion NBA2 may be defined as a first flexible circuit board FPCB1. The portion of the flexible circuit board FPCB disposed on the lower surface of the second non-bending portion NBA2 may be defined as a second flexible circuit board FPCB2. The first flexible circuit board FCPB1 may be connected to the second flexible circuit board FPCB2, and the portion of the flexible circuit board FPCB disposed at one side of the display panel DP may be defined as a third flexible circuit board FPCB3.

[0174] The driving chip DC may include a bump electrode and an integrated circuit disposed on a surface facing the display panel DP. The display panel DP may include a pad electrode disposed on a surface facing the driving chip DC. The bump electrode may be connected to the pad electrode, and thus, the driving chip DC may be electrically connected to the display panel DP. The integrated circuit may be connected to the bump electrode.

[0175] The flexible circuit board FPCB may include a timing controller. The timing controller may control the operation of the driving chip DC. The timing controller may generate a scan control signal and a data control signal in response to a control signal applied to the timing controller from the outside.

[0176] The display device DD may further include an adhesive tape ATP. The adhesive tape ATP may be disposed on the flexible circuit board FPCB. The adhesive tape ATP may be disposed on a lower surface of a second flexible circuit board FPCB2 of the flexible circuit board FPCB. The lower surface of the second flexible circuit board FPCB2 may be defined as a surface opposite to an upper surface of the second flexible circuit board FPCB2 that contacts the second non-bending portion NBA2.

[0177] The adhesive tape ATP may be provided at an edge of the second flexible circuit board FPCB2. Fig.11A Two adhesive tapes ATP are shown as a representative example, however, the two adhesive tapes ATP may be provided integrally with each other. The adhesive tape ATP has a length in the first direction DR1 ranging from about 3 mm to about 5 mm.

[0178] Reference Fig.11A and Fig. 11BThe bending portion BA may be bent relative to an axis extending in the second direction DR2. When the bending portion BA is bent, the second non-bending portion NBA2 may be disposed below the first non-bending portion NBA1. The driving chip DC and the flexible circuit board FPCB may be disposed below the first non-bending portion NBA1.

[0179] The flexible circuit board FPCB may be disposed under the lower support CPL. The lower surface of the second flexible circuit board FPCB2 may face the lower surface of the lower support CPL. An adhesive tape ATP may be disposed between the lower surface of the second flexible circuit board FPCB2 and the lower surface of the lower support CPL. The flexible circuit board FPCB may be coupled to the lower support CPL by the adhesive tape ATP, and the bent portion BA may be maintained in a bent state.

[0180] According to an embodiment, the adhesive tape ATP may be provided to completely cover the lower surface of the second flexible circuit board FPCB2 to fix the flexible circuit board FPCB to the lower surface of the lower support CPL. In this case, the adhesive tape ATP may be deformed corresponding to the flexible circuit board FPCB, and the shape of the flexible circuit board FPCB may be visible to the user.

[0181] In addition, in the case where the adhesive tape ATP completely covers the lower surface of the flexible circuit board FPCB, components such as a timing controller disposed on the lower surface of the flexible circuit board FPCB may be covered by the adhesive tape ATP. The adhesive tape ATP may be deformed corresponding to the shape of the flexible circuit board FPCB and may be visible to the user.

[0182] However, according to the present disclosure, the adhesive tape ATP may be provided only at the edge of the second flexible circuit board FPCB2. Since the adhesive tape ATP is provided at the edge of the second flexible circuit board FPCB2, the size of the flexible circuit board FPCB visible to the user may be reduced. Furthermore, since the adhesive tape ATP does not completely cover the flexible circuit board FPCB, the shape of the flexible circuit board FPCB may not be observed.

[0183] Fig.12 is a perspective view of a display device DDa according to an embodiment of the present disclosure.

[0184] because Fig.12 The display device DDa shown in FIG. Figure 1 The display device DD shown in FIG. 1 is substantially the same, so with respect to Fig.12 The description of the display device DDa will focus on Figure 1 The display device DD has different features, and without describing an element in detail with respect to this figure, it can be understood that the element is at least similar to a corresponding element that has been described elsewhere within the present disclosure.

[0185] Reference Fig.12 , the display surface DD-ISa may include a display area DD-DAa and a non-display area DD-NDAa. The sensor area FSA may be defined in the display surface (or front surface) DD-ISa. The sensor area FSA may overlap with the display area DD-DAa and may be used to sense a fingerprint.

[0186] Fig.13A and Fig. 13B 2 is a cross-sectional view showing display devices DDa and DDb according to an embodiment of the present disclosure.

[0187] Fig.13A and Fig. 13B is along Fig.12 A cross-sectional view taken along line II-II' shown in FIG.

[0188] exist Fig.13A and Fig. 13B The anti-reflection layer ARL is omitted (refer to Figure 5 )、Window WM (refer to Figure 2 )、Input sensor ISU (refer to Figure 2 )、Top adhesive layer OCA (refer to Figure 2 ) and the containing member BC (refer to Figure 2 ).

[0189] because Fig.13A and Fig. 13B The display panel DP and the panel protection layer PPL shown in FIG. Figure 6 The display panel DP and the panel protection layer PPL shown in FIG. 1 are substantially the same, and thus details of the display panel DP and the panel protection layer PPL will be omitted.

[0190] In addition, regarding Fig. 13B The description of the display device DDb shown in FIG. 1 will focus on the Fig.13A The display device DDa shown in FIG. 1 has different features, and where an element is not described in detail with respect to this figure, it is understood that the element is at least similar to a corresponding element that has been described elsewhere within the present disclosure.

[0191] Reference Fig.13A The panel protection layer PPL may be disposed under the display panel DP. The lower support member CPLb and the sensor unit FSU may be disposed under the panel protection layer PPL.

[0192] The lower support CPLb may include a lower adhesive layer EBa, a light blocking layer SBFa, a cushion layer FOMa, and a heat dissipation layer HELa.

[0193] The lower adhesive layer EBa may be disposed on the lower surface of the panel protection layer PPL. The lower adhesive layer EBa may include a protruding pattern PP (refer to Fig. 8A ). As an example, the lower adhesive layer EBa may have a thickness in a range from about 20 micrometers to about 40 micrometers.

[0194] The light blocking layer SBFa may be disposed under the lower adhesive layer EBa. The light blocking layer SBFa may reduce reflectivity of external light. As an example, the light blocking layer SBFa may be a polarizing film including a retarder and / or a polarizer.

[0195] However, this is merely an example, and the light blocking layer SBFa may include a black colorant. In this case, the black colorant may include a black pigment or a black dye. The black colorant may include carbon black, a metal such as chromium, or an oxide thereof.

[0196] The pad layer FOMa may be disposed below the light blocking layer SBFa. The pad layer FOMa may be disposed on the lower surface of the light blocking layer SBFa. Fig.13A In the embodiment, the cushion layer FOMa may be provided in plural, however, the cushion layers FOMa may be provided integrally with each other.

[0197] The cushion layer FOMa may not overlap with the sensor area FSA. The cushion layer FOMa may not be disposed in the sensor area FSA. The first sensor opening SOP1 may be defined by the cushion layer FOMa.

[0198] The heat dissipation layer HELa may be disposed below the pad layer FOMa. The heat dissipation layer HELa may be disposed on the lower surface of the pad layer FOMa. Fig.13A In the embodiment, the heat dissipation layer HELa is provided in plural, however, the heat dissipation layers HELa may be provided integrally with each other. The heat dissipation layer HELa may include stainless steel (eg, SUS).

[0199] The heat dissipation layer HELa may not overlap with the sensor area FSA. The heat dissipation layer HELa may not be disposed in the sensor area FSA. The second sensor opening SOP2 may be defined by the heat dissipation layer HELa. The first sensor opening SOP1 may be integrally defined with the second sensor opening SOP2.

[0200] The sensor adhesive layer PSS may be disposed in the first sensor opening SOP1. The sensor adhesive layer PSS may be disposed on the lower surface of the light blocking layer SBFa. As an example, the length of the sensor adhesive layer PSS in the first direction DR1 may be less than the length of the first sensor opening SOP1 in the first direction DR1. The sensor adhesive layer PSS may include a pressure sensitive adhesive (PSA).

[0201] The sensor unit FSU may be disposed in the first sensor opening SOP1 and the second sensor opening SOP2. The sensor unit FSU may be disposed below the sensor adhesive layer PSS. The sensor unit FSU may be disposed on the lower surface of the sensor adhesive layer PSS. The sensor unit FSU may be attached to the light blocking layer SBFa through the sensor adhesive layer PSS. The light blocking layer SBFa may be exposed through the first sensor opening SOP1 and the second sensor opening SOP2 without being covered by the pad layer FOMa.

[0202] The sensor unit FSU may be provided as a fingerprint recognition sensor and may operate in an optical, ultrasonic or capacitive method. The fingerprint recognition sensor is described as the sensor unit FSU as a representative example; however, the present disclosure is not necessarily limited thereto or thereby. Various sensors such as a proximity sensor, a pressure sensor, a brightness sensor, and a temperature sensor may be provided as the sensor unit FSU.

[0203] When the sensor unit FSU is attached to the sensor adhesive layer PSS, pressure may be applied to the sensor unit FSU. Therefore, the sensor adhesive layer PSS may be deformed. When external light is reflected, the deformation of the sensor adhesive layer PSS may be visible to the user.

[0204] However, according to the display device DDa of the present disclosure, the light blocking layer SBFa may be disposed on the sensor adhesive layer PSS. Therefore, the light blocking layer SBFa may prevent external light from being reflected. Therefore, the possibility that the deformation of the sensor adhesive layer PSS is visible to the user may be reduced.

[0205] Reference Fig. 13B , the display device DDb may include a display panel DP, a panel protection layer PPL, a light blocking layer SBFb, and a lower support CPLd. The light blocking layer SBFb may be disposed on a lower surface of the panel protection layer PPL. The light blocking layer SBFb may be disposed between the display panel DP and the lower support CPLd. Specifically, the light blocking layer SBFb may be disposed between the panel protection layer PPL and the lower adhesive layer EBa.

[0206] The light blocking layer SBFb may reduce reflectivity of external light. As an example, the light blocking layer SBFb may be a polarizing film including a retarder and / or a polarizer.

[0207] However, this is merely an example, and the light blocking layer SBFb may include a black colorant. In this case, the black colorant may include a black pigment or a black dye. The black colorant may include carbon black, a metal such as chromium, or an oxide thereof.

[0208] The lower support member CPLd may be disposed below the light blocking layer SBFb. The lower support member CPLd may be disposed on the lower surface of the light blocking layer SBFb. The lower support member CPLd may include a lower adhesive layer EBa, a reinforcement layer SLL, a cushion layer FOMa, and a heat dissipation layer HELa. For example, different from Fig.13A The lower support member CPLb shown in FIG. Fig. 13B The lower supporter CPLd shown in FIG. 4 may not include the light blocking layer SBFb.

[0209] The lower adhesive layer EBa may be disposed on the lower surface of the light blocking layer SBFb. The reinforcement layer SLL may be disposed below the lower adhesive layer EBa (or between the lower adhesive layer EBa and the pad layer FOMa). As an example, the reinforcement layer SLL may include polyethylene naphthalate (PEN) or polyimide (PI).

[0210] The cushion layer FOMa may be disposed on the lower surface of the reinforcement layer SLL. The cushion layer FOMa may not overlap the sensor area FSA. The cushion layer FOMa may not be disposed in the sensor area FSA. The first sensor opening SOP1 may be defined by the cushion layer FOMa.

[0211] The heat dissipation layer HELa may be disposed on the lower surface of the pad layer FOMa. The heat dissipation layer HELa may include stainless steel (eg, SUS). The heat dissipation layer HELa may not overlap with the sensor area FSA. The heat dissipation layer HELa may not be disposed in the sensor area FSA. The second sensor opening SOP2 may be defined by the heat dissipation layer HELa.

[0212] The sensor adhesive layer PSS may be disposed in the first sensor opening SOP1, and the sensor unit FSU may be disposed in the first and second sensor openings SOP1 and SOP2. The sensor unit FSU may be attached to the lower surface of the reinforcement layer SLL through the sensor adhesive layer PSS.

[0213] The light blocking layer SBFb disposed on the lower surface of the panel protection layer PPL may prevent reflection of external light. Therefore, the light blocking layer SBFb may prevent the sensor unit FSU and the sensor adhesive layer PSS from being observed due to external light.

[0214] In addition, since the lower support member CPLd includes the reinforcement layer SLL, the lower adhesive layer EBa disposed on the upper surface of the reinforcement layer SLL may not be recessed. Therefore, the recess of the lower adhesive layer EBa may be prevented from being visible to the user.

[0215] Fig.14A and Fig. 14B are images showing display devices according to a comparative example and an embodiment example of the present disclosure.

[0216] Fig.14A A display device DD' according to a comparative example is shown, and Fig. 14B A display device DD according to an example of an embodiment of the present disclosure is shown.

[0217] Fig.14A and Fig. 14B They are plan views of a display device DD′ and a display device DD, respectively.

[0218] Reference Figure 7 , Fig.10 and Fig.14A The upper adhesive layer OCA' of the display device DD' according to the comparative example has a thickness ranging from about 140 μm to about 160 μm, and an elastic modulus of the upper adhesive layer OCA' is about 0.23 MPa. In addition, an aperture AVA is defined in the first cushion layer FOM' of the lower support CPL'.

[0219] Reference Fig. 9 , Fig. 11B , Fig.13A and Fig. 14B According to the present disclosure, the display devices DD and DDa may include an upper adhesive layer OCA and lower supports CPL and CPLb. The upper adhesive layer OCA may have a thickness in a range from about 75 micrometers to about 100 micrometers, and an elastic modulus of the upper adhesive layer OCA may be in a range from about 0.36 MPa to about 0.44 MPa. Aperture AVA (refer to Fig.10 ) may not be defined in the pad layers FOM and FOMa of the lower supports CPL and CPLb (i.e., the pad layers FOM and FOMa may be non-porous). In addition, the adhesive tape ATP may be provided only at the edge of the flexible circuit board FPCB. In the case where the display device DDa includes the sensor unit FSU, the sensor unit FSU may overlap with the light blocking layer SBFa.

[0220] Reference Fig.14A , a flexible circuit board FPCB (refer to Figure 2 ) and sensor unit FSU (refer to Fig.13A ) may be visible to the user. However, refer to Fig. 14B , as the display device DD, the display device DDa (refer to Fig.13A ) of the flexible printed circuit board FPCB (refer to Figure 2 ) and sensor unit FSU (refer to Fig.13A ) may not be visible to the user.

[0221] Table 1

[0222]

[0223] Table 1 shows the result of whether the defective surface of each of the test display devices DD' and DD, the shape of the flexible circuit board FPCB and the shape of the sensor unit FSU are visible from the outside. The test can be carried out by visual inspection and phase measurement deflectometry (PMD) measurement. PMD measurement is a method of checking the deformation of the surface of display devices DD' and DD by using an external sensor to analyze the shift pattern of the light incident in the camera when light is reflected on the surface of display devices DD' and DD and enters the camera. As the value (that is, PMD value) measured by PMD decreases, it is unlikely to observe defects such as defective surfaces.

[0224] Referring to Table 1, in the case of the display device DD' according to the comparative example, the defective surface, the flexible circuit board FPCB (refer to Figure 2 ) and the sensor unit FSU (refer to Fig.13A However, in the case of the display device DD, the defective surface, the flexible circuit board FPCB (refer to Figure 2 ) and the sensor unit FSU (refer to Fig.13A ) is invisible.

[0225] In addition, according to the results obtained through PMD measurement, within the same test item, the PMD value of the display device DD according to the present disclosure is lower than the PMD value of the display device DD′ according to the comparative example.

[0226] Although the embodiments of the present disclosure have been described, it is to be understood that the present disclosure is not necessarily limited to these embodiments, but various changes and modifications can be made by those skilled in the art within the spirit and scope of the present disclosure. Therefore, the disclosed subject matter is not necessarily limited to any single embodiment described herein.

Claims

1. A display device, wherein: The display device comprises: The display panel comprises a first non-bending portion, a bending portion, and a second non-bending portion; A flexible circuit board, comprising a first flexible circuit board disposed on an upper surface of the second non-bending portion and a second flexible circuit board disposed on a lower surface of the second non-bending portion; a lower support member, disposed below the first non-bending portion; and An adhesive tape is disposed between a lower surface of the lower support and a lower surface of the second flexible circuit board, wherein the adhesive tape disposed on the lower surface of the second flexible circuit board is disposed at an edge of the second flexible circuit board.

2. The display device according to claim 1, wherein: The lower support member comprises: a lower adhesive layer; a cushion layer disposed below the lower adhesive layer; and The heat dissipation layer is arranged below the cushion layer.

3. The display device according to claim 2, wherein: The lower adhesive layer has a thickness in a range from 60 micrometers to 80 micrometers.

4. The display device according to claim 2, wherein: The cushion layer is non-porous.

5. The display device according to claim 4, wherein: The underlayer has a thickness in a range from 105 microns to 155 microns.

6. The display device according to claim 2, wherein: The heat dissipation layer includes stainless steel.

7. The display device according to claim 2, wherein: The lower support member further includes a reinforcement film disposed between the lower adhesive layer and the cushion layer, and the reinforcement film includes stainless steel or carbon fiber reinforced plastic.

8. The display device according to claim 2, wherein: The lower support member further includes a digitizer disposed between the cushion layer and the heat dissipation layer.

9. The display device according to claim 2, wherein: The display panel includes a sensor area defined in a front surface of the display panel, a first sensor opening defined in an area overlapping the sensor area through the pad layer, and a second sensor opening defined in an area overlapping the sensor area through the heat dissipation layer.

10. The display device according to claim 9, wherein: The lower support member further includes a light blocking layer disposed between the cushion layer and the lower adhesive layer.

11. The display device according to claim 10, wherein: The display device also includes a sensor unit disposed in the first sensor opening and the second sensor opening, and the sensor unit is attached to a lower surface of the light blocking layer, and the light blocking layer is exposed through the first sensor opening and the second sensor opening without being covered by the cushion layer.

12. The display device according to claim 9, wherein: The display device further includes a light blocking layer disposed between the display panel and the lower support, wherein the lower support further includes a reinforcement layer disposed between the lower adhesive layer and the cushion layer.

13. The display device according to claim 1, wherein: The display device further includes: an anti-reflection layer disposed on the display panel and comprising a color filter or a light control layer; and The upper adhesive layer is disposed on the anti-reflection layer, and the upper adhesive layer is optically transparent.

14. The display device according to claim 13, wherein: The upper adhesive layer has a thickness in a range from 75 micrometers to 100 micrometers.

15. The display device according to claim 14, wherein: The upper adhesive layer has an elastic modulus in a range from 0.36 MPa to 0.44 MPa.

16. A display device, wherein: The display device comprises: The display panel comprises a first non-bending portion, a bending portion, and a second non-bending portion; and A lower support member is disposed below the display panel, and the lower support member includes: a lower adhesive layer including a plurality of protruding patterns disposed on a surface of the lower adhesive layer facing the display panel; a cushion layer disposed below the lower adhesive layer; and The heat dissipation layer is disposed below the pad layer and comprises stainless steel, wherein the pad layer is non-porous.

17. The display device according to claim 16, wherein: The lower support member further includes a reinforcement film disposed between the lower adhesive layer and the cushion layer, and the reinforcement film includes stainless steel or carbon fiber reinforced plastic.

18. The display device according to claim 16, wherein: The lower adhesive layer has a thickness in a range from 60 micrometers to 80 micrometers, and the cushion layer has a thickness in a range from 105 micrometers to 155 micrometers.

19. The display device according to claim 16, wherein: The display device further includes: an anti-reflection layer disposed on the display panel and comprising a color filter or a light control layer; and An upper adhesive layer is disposed on the anti-reflection layer and is optically transparent, wherein the upper adhesive layer has a thickness in a range from 75 micrometers to 100 micrometers.

20. The display device according to claim 16, wherein: The display device further includes: a flexible circuit board, comprising a first flexible circuit board disposed on an upper surface of the second non-bending portion and a second flexible circuit board disposed on a lower surface of the second non-bending portion; and an adhesive tape attached to the lower surface of the second flexible circuit board, wherein the adhesive tape is disposed between the lower surface of the lower support and the lower surface of the second flexible circuit board, and the flexible circuit board is disposed below the lower support, and the adhesive tape is disposed only at an edge of the second flexible circuit board.

Images