Transport apparatus, transport method, and semiconductor device manufacturing method

Abstract

A transport apparatus (600) according to an embodiment is designed to transport a substrate (100) so as to irradiate the substrate (100) with a linear laser light (15), and includes: a main suspension unit (10) that includes an irradiation region disposed directly below an irradiation position of the laser light, and is designed to suspend the substrate above an upper surface of the main suspension unit; a holding mechanism (11) arranged outside the main suspension unit (10) and designed to hold the substrate (100) above the main suspension unit; a first moving mechanism designed to move the holding mechanism (11) in a first direction to change an irradiation position of the laser light on the substrate (100); and a second moving mechanism designed to move the holding mechanism and the first moving mechanism in a second direction inclined to the first direction.

Description

Technical Field

[0001] The present invention relates to a conveying device, a conveying method, and a method for manufacturing a semiconductor device. Background Art

[0002] Patent Document 1 discloses a laser annealing device for forming a polycrystalline silicon thin film. In Patent Document 1, a projection lens focuses laser light on a substrate so that the laser light forms a linear irradiation area. As a result, the amorphous silicon film crystallizes and becomes a polycrystalline silicon film.

[0003] In Patent Document 1, the conveying unit conveys the substrate, and the suspending unit suspends the substrate. Furthermore, in the suspending unit, the substrate is loaded and unloaded at the same position. The conveying unit conveys the substrate along each side of the suspending unit. Furthermore, the substrate is conveyed twice in a circumferential manner above the suspending unit, so that substantially the entire surface of the substrate is irradiated with laser light.

[0004] Reference List

[0005] Patent Literature

[0006] Patent document 1: Japanese Unexamined Patent Application Publication JP 2018-64048. Summary of the invention

[0007] In such a conveying device for a laser irradiation device, it is desirable to appropriately convey the substrate so that the laser irradiation process is performed in a high-speed and stable manner.

[0008] Other problems to be solved and novel features will become apparent from the description and accompanying drawings in this specification.

[0009] According to an embodiment, the conveying device is designed to convey a substrate so as to irradiate the substrate with a linear laser, and includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism, which is designed to move the holding mechanism in a first direction to change the irradiation position of the laser on the substrate; and a second moving mechanism, which is designed to move the holding mechanism and the first moving mechanism in a second direction inclined to the first direction to change the irradiation position of the laser on the substrate.

[0010] According to an embodiment, the conveying device is designed to convey a substrate so as to irradiate the substrate with a linear laser, and includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening set along a first direction, and is designed to spray gas onto the lower surface of the substrate; a holding mechanism, which is arranged in the opening and is designed to hold the substrate; and a first moving mechanism, which is designed to move the holding mechanism and the suspension unit along the first direction.

[0011] According to an embodiment, a conveying method is a conveying method for conveying a substrate by using a conveying device so as to irradiate the substrate with a linear laser, the conveying device comprising: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; and a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit, the conveying method comprising the following steps: (A1) moving the holding mechanism in a first direction by a first moving mechanism to change the irradiation position of the laser on the substrate; and (A2) moving the holding mechanism and the first moving mechanism in a second direction inclined to the first direction by a second moving mechanism to change the irradiation position of the laser on the substrate.

[0012] According to an embodiment, in a conveying method using a conveying device, the conveying device is designed to convey a substrate so that the substrate is irradiated with a linear laser, and the conveying device includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a movable suspension unit, which is arranged outside the main suspension unit, includes an opening set in a first direction, and is designed to spray gas onto the lower surface of the substrate; and a holding mechanism, which is arranged in the opening and is designed to hold the substrate, and the conveying method includes step (B1): moving the holding mechanism and the movable suspension unit in the first direction by a first moving mechanism.

[0013] According to an embodiment, a method for manufacturing a semiconductor device includes the following steps: (sa1) forming an amorphous film on a substrate; (sa2) loading the substrate with the amorphous film formed thereon onto a conveying device; and (sa3) irradiating the substrate with a linear laser while conveying the substrate using the conveying device, thereby annealing the amorphous film so that the amorphous film is crystallized to form a crystalline film, the conveying device including: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism, which is designed to move the holding mechanism along a first direction to change the irradiation position of the laser on the substrate; and a second moving mechanism, which is designed to move the holding mechanism; and a first moving mechanism, which is designed to move the holding mechanism and the suspension unit along the first direction.

[0014] According to an embodiment, a method for manufacturing a semiconductor device includes the following steps: (sb1) forming an amorphous film on a substrate; (sb2) loading the substrate with the amorphous film formed thereon onto a conveying device; and (sb3) irradiating the substrate with a linear laser while conveying the substrate using the conveying device, thereby annealing the amorphous film so that the amorphous film is crystallized to form a crystalline film, wherein the conveying device includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening set along a first direction, and is designed to spray gas onto the lower surface of the substrate; and a holding mechanism, which is arranged in the opening and is designed to hold the substrate, and the method includes the step of moving the holding mechanism and the suspension unit along the first direction by a first moving mechanism.

[0015] According to the above-described embodiment, substrate transportation suitable for the laser irradiation process can be performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view schematically showing the structure of a conveying device used in a laser irradiation device;

[0017] Figure 2 is a side cross-sectional view schematically showing a laser irradiation device;

[0018] Figure 3 is a side cross-sectional view schematically showing a laser irradiation device;

[0019] Figure 4 is a top view for explaining the structure before the substrate is irradiated with laser light;

[0020] Figure 5It is a top view for explaining the structure during laser irradiation.

[0021] Figure 6 is a top view for explaining the conveying direction and the inclination of the substrate;

[0022] Figure 7 It is a top view for explaining the conveying process in the conveying device;

[0023] Figure 8 It is a top view for explaining the conveying process in the conveying device;

[0024] Fig. 9 It is a top view for explaining the conveying process in the conveying device;

[0025] Fig.10 It is a top view for explaining the conveying process in the conveying device;

[0026] Fig.11 It is a top view for explaining the conveying process in the conveying device;

[0027] Fig.12 It is a top view for explaining the conveying process in the conveying device;

[0028] Fig.13 It is a top view for explaining the conveying process in the conveying device;

[0029] Fig.14 It is a top view for explaining the conveying process in the conveying device;

[0030] Fig.15 It is a top view for explaining the conveying process in the conveying device;

[0031] Fig.16 is a cross-sectional view showing a simplified configuration of an organic EL display device;

[0032] Fig.17 are cross-sectional views showing processes in a method for manufacturing a semiconductor device according to an embodiment; and

[0033] Fig.18 2 is a cross-sectional view showing steps in a method for manufacturing a semiconductor device according to an embodiment. DETAILED DESCRIPTION

[0034] The conveying device according to the embodiment is used in a laser irradiation device, such as a laser annealing device. The laser annealing device is, for example, an excimer laser annealing (ELA: Excimer laser Anneal) device for forming a low temperature polycrystalline silicon (LTPS: Low Temperature Poly-Silicon) film. The conveying device, laser irradiation device, method, and manufacturing method according to the present embodiment will be described below with reference to the accompanying drawings.

[0035] First embodiment

[0036] Will refer to Figures 1 to 3 The basic structures of the conveying device and the laser irradiation device according to the present embodiment will be described. Figure 1 It is a plan view schematically showing the basic structure of the conveying device 600. Figure 2 It is a side cross-sectional view schematically showing the structure of the conveying device. Figure 3 It is a side cross-sectional view schematically showing the structure of the conveying device.

[0037] Note that in the drawings described below, in order to simplify the description, an xyz three-dimensional orthogonal coordinate system is appropriately shown. The z direction is the vertical direction, and the y direction is the line direction along the linear irradiation area 15a. The x direction is a direction perpendicular to the z direction and the y direction. That is, the y direction is the longitudinal direction (i.e., the long side direction) of the linear irradiation area 15a, and the x direction is a transverse direction (i.e., the short side direction) perpendicular to the longitudinal direction.

[0038] Notice, Figures 1 to 3 is a conceptual diagram showing only the basic structure of the conveying device and the laser irradiation device, and omitting some components of the structure. Figure 1 In FIG. 6 , a conveying device 600 is shown in a simplified manner. Figure 1 , the laser irradiation unit 14, the fine suspension unit 111, and the rough suspension unit 113 are omitted.

[0039] like Figures 1 to 3 As shown, the laser irradiation device 1 includes a main suspension unit 10, a conveying unit 11, and a laser irradiation unit 14. The main suspension unit 10 and the conveying unit 11 constitute a conveying device 600. In addition, the conveying device 600 may include an end suspension unit 18.

[0040] like Figure 2As shown, the main suspension unit 10 is designed so that gas is ejected from the surface of the main suspension unit 10. The substrate 100 is suspended above the upper surface of the main suspension unit by the main suspension unit 10. When the gas ejected from the surface of the main suspension unit 10 blows onto the lower surface of the substrate 100, the substrate 100 is suspended. The substrate 100 is, for example, a glass substrate. When conveying the substrate 100, the main suspension unit 10 adjusts the suspension height of the substrate 100 so that the substrate does not collide with any other mechanism (not shown) arranged above the substrate 100.

[0041] The main suspension unit 10 is mainly divided into a fine suspension area 31 and a rough suspension area 33. The fine suspension area 31 is an area including the irradiation area 15a of the laser 15. That is, in the xy plane view, the fine suspension area 31 is an area overlapping with the focus (irradiation area 15a) of the laser. The fine suspension area 31 is an area larger than the irradiation area 15a.

[0042] The rough floating area 33 is an area adjacent to the fine floating area 31. The rough floating area 33, that is, two rough floating areas 33 are arranged on both sides of the fine floating area 31 in the x direction. In the xy plane view, the rough floating area 33 is an area that does not overlap with the focus (irradiation area 15a) of the laser.

[0043] Each of the precision suspension unit 111 and the rough suspension unit 113 ejects gas, such as air, upward. In addition, the gas ejected from the precision suspension unit 111 and the rough suspension unit 113 may be an inert gas, such as nitrogen. When the gas is blown onto the lower surface of the substrate 100, the substrate 100 is suspended. As a result, the main suspension unit 10 and the substrate 100 are no longer in contact with each other. In addition, the precision suspension unit 111 sucks the gas existing between the substrate 100 and the main suspension unit 10. The rough suspension unit 113 may be designed to suck the gas in a similar manner to the precision suspension unit 111, or may not be designed to suck the gas.

[0044] For example, one or more gas supply sources (not shown) for supplying gas are connected to the precise suspension unit 111 and the rough suspension unit 113. In addition, one or more vacuum generating sources (not shown) for sucking gas are connected to the precise suspension unit 111 and the rough suspension unit 113. The gas supply source is a compressor, a cylinder, etc., and supplies compressed gas. The vacuum generating source is a vacuum pump, a vacuum generator, etc.

[0045] The precision of the levitation height of the precise levitation unit 111 is higher than the precision of the levitation height of the rough levitation unit 113. In addition, the substrate 100 is irradiated with laser light in the precise levitation region 31 having the highest levitation height precision. Note that a semi-precision levitation unit may be arranged between the precise levitation unit 111 and the rough levitation unit 113. The precision of the levitation height of the semi-precision levitation unit is lower than the precision of the levitation height of the precise levitation unit 111, and higher than the precision of the levitation height of the rough levitation unit 113.

[0046] For example, in the irradiation area 15a and the surrounding precision floating area 31, high precision is required for the floating height of the substrate 100. Therefore, a precision floating unit 111 capable of controlling the floating height with high precision is used. The precision floating unit 111 is a precision floating unit formed of a porous body such as ceramics.

[0047] Then, the precision suspension unit 111 ejects gas upward. In addition, a suction hole for sucking gas may be provided in the precision suspension unit 111. In the porous body, suction holes extending to its upper surface are formed at predetermined intervals, for example, by machining. The suction holes are micropores, and form a negative pressure between the substrate 100 and the precision suspension unit. In addition, the gas is ejected from almost the entire surface of the porous body except for the suction holes. The ejection surface forming the positive pressure is formed on almost the entire surface except for the suction holes.

[0048] The rough suspension unit 113 is formed of a metal material. For example, the rough suspension unit 113 is formed of a metal block having a hollow portion. In addition, a plurality of injection holes extending from the hollow portion of the metal block to the upper surface thereof are formed. In addition, a suction hole for sucking gas may be provided in the metal block. Note that the semi-precision suspension unit may be formed of a metal material, similar to the rough suspension unit 113.

[0049] The coarse suspension unit 113 and the fine suspension unit 111 are also collectively referred to as a suspension unit body 131. In the coarse suspension region 33, a plurality of coarse suspension units 113 are provided as the suspension unit body 131. In the fine suspension region 31, a plurality of fine suspension units 111 are provided as the suspension unit body 131. A semi-fine suspension region may be provided between the fine suspension region 31 and the coarse suspension region 33.

[0050] The base 120 is, for example, a metal plate. The precision suspension unit 111 and the rough suspension unit 113 are fixed to the base 120 by, for example, bolts. The heights of the upper surfaces of the precision suspension unit 111 and the rough suspension unit 113 are substantially equal to each other. That is, the upper surface (suspension surface) of the main suspension unit 10 is substantially flat. The surface of the base 120 may be polished to have a predetermined flatness. In addition, an internal space (not shown) used as a flow path for injecting or sucking gas may be provided in the base 120. The suspension unit body 131 may suck or inject gas through the internal space of the base 120.

[0051] The end suspension unit 18 is provided at the +y side of the main suspension unit 10. The end suspension unit 18 is arranged just below the end of the substrate 100. Similar to the main suspension unit 10, the end suspension unit 18 sprays gas onto the lower surface of the substrate 100. The end of the substrate 100 is suspended by the gas sprayed from the upper surface of the end suspension unit 18. The end suspension unit 18 has a configuration similar to that of the rough suspension unit. The end suspension unit 18 is formed of a metal material having a spray hole, etc.

[0052] The conveying unit 11 conveys the suspended substrate 100 in the conveying direction. The conveying unit 11 is disposed at the end of the main suspension unit 10 in the +y direction. Specifically, the conveying unit 11 is disposed between the main suspension unit 10 and the end suspension unit 18 in the y direction. Figure 3 As shown, the transport unit 11 includes a holding mechanism 12 , a movable suspension unit 17 , an x-axis moving mechanism 220 , a y-axis moving mechanism 230 , and a lifting mechanism 240 .

[0053] The holding mechanism 12 holds the substrate 100. For example, the holding mechanism 12, that is, each holding mechanism 12, can be formed by using a vacuum suction mechanism. The vacuum suction mechanism is formed of a metal material, a resin material, a porous material, etc. Suction grooves, suction holes, etc. are formed on the upper surface of the holding mechanism 12. The holding mechanism 12 can be formed of a porous material.

[0054] The holding mechanism 12 (vacuum suction mechanism) is connected to an exhaust port (not shown), and the exhaust port is connected to a vacuum generator, a vacuum pump, etc. Therefore, since a negative pressure for sucking gas acts, i.e., is formed in the holding mechanism 12, the substrate 100 can be held by using the holding mechanism 12.

[0055] The holding mechanism 12 holds the substrate 100 by adsorbing the surface (lower surface) of the substrate 100 opposite to the surface (upper surface) irradiated with the laser 15, that is, the surface of the substrate 100 facing the main suspension unit 10. Figure 1 In the embodiment, the holding mechanism 12 holds the end portion of the substrate 100 in the +y direction.

[0056] like Figure 3 As shown, the holding mechanism 12 is supported by a lifting mechanism 240 to perform an adsorption operation. The lifting mechanism 240 lifts and lowers the holding mechanism 12. Each lifting mechanism 240 includes, for example, an actuator such as a cylinder or a motor. Each lifting mechanism 240 also includes a linear guide mechanism along the Z direction. Therefore, the lifting mechanism 240 can move the holding mechanism 12 up and down. For example, the holding mechanism 12 adsorbs the substrate 100 in a state where it is raised to the adsorption position. In addition, in a state where the adsorption is released, that is, stopped, the holding mechanism 12 is lowered to a standby position.

[0057] The movable levitation unit 17 is arranged around each holding mechanism 12. The movable levitation unit 17 sprays gas onto the substrate 100. The movable levitation unit 17 sprays gas onto the lower surface of the substrate 100 in a manner similar to the main levitation unit 10. The end of the substrate 100 is suspended by the gas sprayed from the upper surface of the movable levitation unit 17. For example, the movable levitation unit 17 has a configuration similar to that of the rough levitation unit 113. The movable levitation unit 17 is made of a metal material having a spray hole and the like.

[0058] The movable suspension unit 17, that is, each movable suspension unit 17, comprises an opening 171 in which the holding mechanism 12 is located. The holding mechanism 12 is arranged in the opening 171 provided in the movable suspension unit 17. Figure 1 As shown, each opening 171 is arranged along the y direction, that is, extends. Specifically, in the xy plane view, each opening 171 is formed in a rectangular shape, wherein the y direction is the longitudinal direction and the x direction is the lateral direction.

[0059] In addition, a plurality of openings 171 are provided in the movable levitation unit 17. The plurality of openings 171 are arranged along the x direction. Figure 1 Eight openings 171 are arranged in the x direction in FIG. 1 , but only one opening 171 may be provided or a plurality of openings 171 may be provided. A holding mechanism 12 is arranged in each of the openings 171. Each holding mechanism 12 adsorbs and holds the substrate 100.

[0060] The y-direction moving mechanism 230 moves the holding mechanism 12 in the y-direction. For example, the holding mechanism 12 and the lifting mechanism 240 are arranged on the y-direction moving mechanism 230. That is, the y-direction moving mechanism 230 movably supports the holding mechanism 12 and the lifting mechanism 240. The y-direction moving mechanism 230 includes an actuator such as a motor (not shown). The y-direction moving mechanism 230 moves the holding mechanism 12 and the lifting mechanism 240 in the y-direction. As a result, the holding mechanism 12 moves in the y-direction through the opening 171.

[0061] The x-direction moving mechanism 220 moves the holding mechanism 12, the movable suspension unit 17, the lifting mechanism 240, and the y-direction moving mechanism 230 in the x-direction. For example, the x-direction moving mechanism 220 includes a guide portion 221 and a movable portion 222. The guide portion 221 is used as a stage portion for movably supporting the movable portion 222. The guide portion 221 is provided in the x-direction. The x-direction moving mechanism 220 includes an actuator, such as a motor (not shown). By the drive of the actuator, the movable portion 222 moves on the guide member 221 in the x-direction.

[0062] In addition, the y-direction moving mechanism 230 is provided on the movable part 222. That is, the movable part 222 supports the y-direction moving mechanism 230 so as to be movable in the y direction. In the movable part 222, a guide mechanism such as one or more guide grooves or one or more guide rails may be formed along the y direction.

[0063] The movable part 222 slides on the guide part 221 along the x direction. In addition, the y-direction moving mechanism 230 slides on the movable part 222 along the y direction. In this way, the holding mechanism 12 moves in the x direction and the y direction. Therefore, the conveying unit 11 can convey the substrate 100 in the x direction and the y direction. By adjusting the moving speed of the substrate 100 in the x direction and the y direction, the conveying direction of the substrate 100 can be changed. That is, by increasing the ratio of the moving speed in the y direction to the moving speed in the x direction, the angle formed by the x direction and the conveying direction can be increased. By setting the moving speed in the y direction to zero, the conveying direction becomes parallel to the x direction.

[0064] Furthermore, the movable portion 222 supports the movable levitation unit 17. Therefore, the movable portion 222 moves the movable levitation unit 17 in the x direction together with the y-direction moving mechanism 230. Therefore, the movable levitation unit 17, the y-direction moving mechanism 230, the lifting mechanism 240, and the holding mechanism 12 move together with the movable portion 222. The movable portion 222 functions as a stage portion for movably supporting the y-direction moving mechanism 230, the movable levitation unit 17, and the like.

[0065] like Figure 1 As shown, for example, the conveying unit 11 is designed so that the end of the main suspension unit 10 in the +y direction slides along the conveying direction. In addition, the x-direction moving mechanism 220 and the y-direction moving mechanism 230 are controlled independently of each other. The conveying speed and conveying direction of the substrate 100 can be controlled by adjusting the moving speeds of the x-direction moving mechanism 220 and the y-direction moving mechanism 230.

[0066] Each of the x-movement mechanism 220 and the y-movement mechanism 230 may include, for example, an actuator (such as a motor), a linear guide mechanism, an air bearing, etc. (not shown). The x-movement mechanism 220 and the y-movement mechanism 230 are synchronized with each other and move the holding mechanism 12 in the x-direction and the y-direction.

[0067] like Figure 4 and Figure 5 As shown in FIG. 1 , when the holding mechanism 12 moves along the conveying direction, the substrate 100 is conveyed along the conveying direction. The conveying direction is inclined with respect to the x direction. Figure 4 and Figure 5, a straight line parallel to the x-direction is represented by a dot-dash line. For example, when the angle between the x-direction and the conveying direction is represented by θ, the angle θ is greater than 0°. At this time, by changing the moving speed in at least one of the x-direction and the y-direction, the angle θ of the conveying direction relative to the x-direction can be changed. In this way, the substrate 100 can be conveyed at an angle suitable for the process. In addition, when the y-direction moving mechanism 230 stops, the angle θ can be set to 0° (θ=0°).

[0068] The angle θ of the conveying direction can be adjusted by independently changing the moving speed in the x direction or the y direction. In this way, conveying suitable for the process can be performed. Figure 6 As shown in FIG. 1 , the moving direction of the y-axis moving mechanism 230 can be made parallel to the positive direction of the y-axis. In this case, the sign of the angle θ in the conveying direction can be changed, that is, positive / negative. Specifically, when Figure 4 In the configuration shown, the angle θ is defined as a positive value. Figure 6 The angle θ in the structure shown becomes a negative value. Figure 6 In the embodiment, the angle θ becomes less than 0°. The conveying direction may be inclined so that the angle θ of the conveying direction relative to the x direction may be positive or negative. For example, the angle θ may vary within a range of -5° to +5°.

[0069] In addition, if Figure 1 As shown, the main suspension unit 10 has a rectangular shape in the xy plane view. Specifically, in the xy plane view, the main suspension unit 10 has a rectangular shape having two sides parallel to the x direction and two sides parallel to the y direction. In addition, the conveying direction is inclined relative to the edge of the main suspension unit 10. In other words, when the holding mechanism 12 moves in the +x direction, they approach the main suspension unit 10. In addition, the substrate 100 has a rectangular shape. In addition, the substrate 100 is arranged so that its edges are inclined relative to the x direction and the y direction. For example, the substrate 100 is arranged so that its edges are parallel to the conveying direction. Alternatively, the substrate 100 may be arranged so that its edges are parallel to the direction inclined to the conveying direction.

[0070] like Figure 4 As shown in FIG. 1 , the conveying direction is parallel to the edge of the substrate 100. In this case, as Figure 4 and Figure 5 As shown, the angle formed by the edge of the substrate 100 and the x-direction is also the angle θ. In addition, the angle of the edge of the substrate 100 relative to the conveying direction can be adjusted by rotating the substrate 100 around the z-axis, for example, the substrate 100 can be rotated within a range of -5° to 5°. In this way, even when the angle θ formed by the x-direction and the conveying direction changes, the conveying direction and the edge direction of the substrate 100 can be made parallel to each other. Needless to say, the conveying direction and the edge direction of the substrate 100 may be different from each other.

[0071] like Figure 2 As shown, the substrate 100 is irradiated with the laser 15. Note that the irradiation area 15a of the laser 15 on the substrate 100 has a linear shape, and its longitudinal direction is parallel to the y direction. That is, in the irradiation area 15a, the y direction is the longitudinal direction (linear direction) and the x direction is the lateral direction.

[0072] For example, the laser irradiation unit 14 includes an excimer laser source that generates laser light, etc. In addition, the laser irradiation unit 14 includes an optical system for guiding the laser light to the substrate 100. The laser irradiation unit 14 includes one or more lenses for concentrating the laser light 15 on the substrate 100. For example, the laser irradiation unit 14 includes a cylindrical lens for forming a linear irradiation area 15a. The substrate 100 is irradiated with a linear laser, particularly, the laser light 15 (line beam) whose focus extends in the y direction, i.e., stretches. The focus of the laser light 15 is formed on the substrate 100. Therefore, in order to reduce the in-plane variation, a precise levitation height is required in the precision levitation area 31.

[0073] The substrate 100 is, for example, a glass substrate on which an amorphous film (amorphous silicon film 101a) is formed. The amorphous film can be crystallized by irradiating the amorphous film with laser light 15 and thereby performing an annealing process. For example, the amorphous silicon film 101a can be transformed into a polycrystalline silicon film (polycrystalline silicon film 101b).

[0074] The laser irradiation device 1 transports the substrate 100 in the transport direction by holding the lower surface of the substrate 100 using the transport unit 11 and suspending the substrate 100 using the suspension unit 10. Note that when the substrate 100 is transported, the transport unit 11 included in the laser irradiation device 1 transports the substrate 100 while holding a portion of the substrate 100 that does not overlap with the irradiation area 15a in a top view (i.e., when viewed in the z direction). That is, as shown in FIG. Figure 1 As shown, when the substrate 100 is conveyed in the conveying direction, the portion of the substrate 100 where the main conveying unit 11 holds the substrate 100 (which corresponds to the position of the holding mechanism 12 ) does not overlap with the irradiation area 15 a .

[0075] For example, the planar shape of the substrate 100 is a quadrilateral (rectangle) having four sides, and the main conveying unit 11 (holding mechanism 12) holds only one of the four sides of the substrate 100. In addition, during the conveyance of the substrate 100, the conveying unit 11 (holding mechanism 12) holds a portion of the substrate 100 that is not irradiated with the laser.

[0076] By the above configuration, the portion of the substrate 100 (which corresponds to the position of the holding mechanism 12) where the conveying unit 11 holds the substrate 100 and the irradiation region 15a can be separated from each other. The irradiation region 15a is located at approximately half of the substrate 100 in the -y direction, and the conveying unit 11 holds the end of the substrate 100 in the +y direction. The distance between the position near the holding mechanism 12 where the deflection of the substrate 100 becomes large and the irradiation region 15a can be increased. Therefore, when laser light is applied to the substrate 100, the influence of the deflection of the substrate 100 caused by the holding mechanism 12 can be reduced.

[0077] like Figure 4 As shown, the length of the irradiated area 15a in the y direction is approximately half the length of the substrate 100. Figure 5 As shown, when the substrate 100 is conveyed, laser light is applied to a region corresponding to the length of the irradiation region 15a. Then, in the region that has been irradiated with laser light, a polysilicon film 101b is formed.

[0078] When the substrate 100 passes through the laser irradiation position 15a once, the amorphous silicon film 101a is crystallized in about a half region of the substrate 100. Then, after the substrate 100 is rotated 180 degrees around the z-axis by a rotating mechanism (not shown), the conveying unit 11 conveys the substrate 100 in the -x direction. Alternatively, after conveying the rotated substrate 100 in the -x direction, the conveying unit 11 may convey the substrate 100 in the +x direction again. Then, when the substrate 100 is conveyed in the -x direction, or when the substrate 100 is conveyed in the +x direction again after being rotated 180 degrees, laser light is applied to the substrate 100. In this way, the substrate 100 passes through the laser irradiation position 15a, and the amorphous silicon film 101a in the remaining half of the substrate 100 is crystallized. By causing the substrate 100 to perform the reciprocating motion as described above, the amorphous silicon film 101a is converted into the polycrystalline silicon film 101b over substantially the entire region of the substrate 100.

[0079] In addition, the conveying direction is inclined with respect to the x direction perpendicular to the linear irradiation area 15a. That is, the substrate 100 is conveyed in the conveying direction inclined with respect to the edge of the rectangular substrate 100. By making the conveying direction inclined with respect to the x direction in the top view, the conveying of the substrate suitable for the laser irradiation process can be performed. Therefore, the crystallization process for the silicon film can be appropriately performed, thereby improving the display quality. By the above configuration, for example, the occurrence of moire fringes can be prevented.

[0080] For example, it is assumed that the substrate 100 is a glass substrate for an organic EL (electroluminescent) display device. When the display area of ​​the organic EL display device is rectangular, the edge of the display area is parallel to the edge of the substrate 100. That is, the organic EL display device has a rectangular display area whose short sides are parallel to the x-direction and the y-direction. When the conveying direction is parallel to the x-direction, the laser is applied to the substrate 100 in a state where the arrangement direction of the pixels is parallel to the irradiation area 15a.

[0081] As shown in this embodiment, the laser irradiation process can be appropriately performed by tilting the conveying direction with respect to the x direction. The moving mechanism moves the holding mechanism 12 along the conveying direction tilted with respect to the x direction perpendicular to the longitudinal direction of the linear irradiation area 15a in a top view to change the irradiation position of the laser on the substrate 100. In this way, the crystallization process of the silicon film can be appropriately performed. For example, the occurrence of moire fringes can be prevented, thereby improving the display quality.

[0082] In addition, the conveying unit 11 is capable of performing a two-axis operation. That is, the holding mechanism 12 moves not only in the x-direction but also in the y-direction. In this case, it is necessary to widen the gap, i.e., the clearance, between the main suspension unit 10 and the end suspension unit 18. That is, it is necessary to arrange the end suspension unit 18 away from the main suspension unit 10 in the Y-direction. Even in this case, the bending of the substrate 100 can be reduced by providing the movable suspension unit 17. The gas is sprayed onto the lower surface of the substrate 100 in the gap between the end suspension unit 18 and the main suspension unit 10. In this way, the substrate 100 can be prevented from bending, thereby preventing the substrate 100 from colliding with the main suspension unit 10 or any structure around it.

[0083] In addition, an opening 171 is provided in the movable levitation unit 17. In addition, the holding mechanism 12 moves in the y direction within the opening 171. Therefore, the conveying direction of the substrate 100 can be adjusted with a simple configuration. In addition, a plurality of openings 171 are provided in the movable levitation unit 17. Therefore, since a plurality of holding mechanisms 12 can hold the substrate 100, the substrate 100 can be reliably adsorbed and held.

[0084] According to this embodiment, the conveying device is designed to convey the substrate so that the substrate is irradiated with a linear laser. The conveying device includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism, which is designed to move the holding mechanism in a first direction to change the irradiation position of the laser on the substrate; and a second moving mechanism, which is designed to move the holding mechanism and the first moving mechanism in a second direction inclined to the first direction to change the irradiation position of the laser on the substrate.

[0085] According to another embodiment, the conveying device is designed to convey the substrate so as to irradiate the substrate with a linear laser. The conveying device includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening arranged in a first direction, and is designed to spray gas onto the lower surface of the substrate; a holding mechanism, which is arranged in the opening and is designed to hold the substrate; and a first moving mechanism, which is designed to move the holding mechanism and the suspension unit in the first direction.

[0086] According to the present embodiment, the conveying method is a conveying method for conveying a substrate by using a conveying device so as to irradiate the substrate with a linear laser, the conveying device comprising: a main suspension unit, which comprises an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; and a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit, the conveying method comprising the following steps: (A1) moving the holding mechanism in a first direction by a first moving mechanism to change the irradiation position of the laser on the substrate; and (A2) moving the holding mechanism and the first moving mechanism in a second direction inclined to the first direction by a second moving mechanism to change the irradiation position of the laser on the substrate.

[0087] According to another embodiment, in a conveying method, a conveying device is designed to convey a substrate so as to irradiate the substrate with a linear laser, and includes: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser, and is designed to suspend the substrate above the upper surface of the main suspension unit; a movable suspension unit, which is arranged outside the main suspension unit, includes an opening set along a first direction, and is designed to spray gas onto the lower surface of the substrate; and a holding mechanism, which is arranged in the opening and is designed to hold the substrate, and the conveying method includes step (B1): moving the holding mechanism and the movable suspension unit along the first direction by a first moving mechanism.

[0088] According to the present embodiment, a method for manufacturing a semiconductor device includes the following steps: (sa1) forming an amorphous film on a substrate; (sa2) loading the substrate with the amorphous film formed thereon onto a conveying device; and (sa3) irradiating the substrate with a linear laser while conveying the substrate using the conveying device, thereby annealing the amorphous film so that the amorphous film is crystallized to form a crystalline film, the conveying device including: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism, which is designed to move the holding mechanism along a first direction to change the irradiation position of the laser on the substrate; and a second moving mechanism, which is designed to move the holding mechanism and the first moving mechanism along a second direction inclined to the first direction to change the irradiation position of the laser on the substrate.

[0089] According to another embodiment, a method for manufacturing a semiconductor device includes the following steps: (sb1) forming an amorphous film on a substrate; (sb2) loading the substrate with the amorphous film formed thereon onto a conveying device; and (sb3) irradiating the substrate with a linear laser while conveying the substrate using the conveying device, thereby annealing the amorphous film so that the amorphous film is crystallized to form a crystalline film, the conveying device including: a main suspension unit, which includes an irradiation area arranged directly below the irradiation position of the laser and is designed to suspend the substrate above the upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening set along a first direction, and is designed to spray gas onto the lower surface of the substrate; and a holding mechanism, which is arranged in the opening and is designed to hold the substrate; and a first moving mechanism, which is designed to move the holding mechanism and the suspension unit along the first direction.

[0090] (Surround conveyor)

[0091] Next, we will refer to Figure 7 An example of the configuration of the transport device 600 will be described. Figure 7 600. Figures 1 to 6 Description of the composition, function, etc. similar to the description of the composition, function, etc.

[0092] The conveying device 600 includes a main suspension unit 10 and end suspension units 671 to 676. The main suspension unit 10 allows the substrate ( Figure 7 The main suspension unit 10 has a rectangular shape in a top view. The main suspension unit 10 includes two sides parallel to the y direction and two sides parallel to the x direction. Each of the end suspension units 671 to 676 suspends the end of the substrate protruding from the main suspension unit 10.

[0093] Here, for illustration, the main suspension unit 10 is divided into six regions 60a to 60f in a top view. Specifically, the main suspension unit 10 includes the first region 60a to the fourth region 60d, the processing region 60e, and the passing region 60f. The first region 60a is a corner including the -x side and the +y side (i.e., Figure 4 The second area 60b is a rectangular area including the corners on the +x side and the +y side (ie, Figure 4 The third region 60c is a rectangular region including the corners on the +x side and the -y side (ie, Figure 4 The fourth region 60d is a rectangular region including the corners on the -x side and the -y side (ie, Figure 4 The rectangular area (the lower left corner of ).

[0094] The processing region 60e is a rectangular region arranged between the first region 60a and the second region 60b. The processing region 60e is a region including the irradiation region 15a to which laser light is applied. The passing region 60f is a rectangular region located between the third region 60c and the fourth region 60d.

[0095] The half area of ​​the main suspension unit 10 on the +y side (i.e., Figure 4 The upper area in the middle) is from the -x side (i.e., Figure 4 The order starting from the left side of the main suspension unit 10 includes the first area 60a, the processing area 60e and the second area 60b. Figure 4 The lower half region in FIG. 60A ) includes a third region 60c, a passing region 60f, and a fourth region 60d in order from the +x side.

[0096] In addition, the fourth region 60d is used as the substrate 100 ( Figure 8 ) is loaded and the unloading area where the substrate 100 is unloaded. For example, a loader such as a loading robot (not shown) is set at the -x side of the fourth area 60d. At this time, the loader loads the substrate 100 to the fourth area 60d. Similarly, the loader unloads the substrate arranged in the fourth area 60d.

[0097] The main suspension unit 10 includes a rotating mechanism 68 and alignment mechanisms 69a and 69b. The rotating mechanism 68 rotates the substrate. Each of the alignment mechanisms 69a and 69b aligns the substrate. The alignment mechanisms 69a and 69b are arranged in the first area 60a and the second area 60b, respectively. The rotating mechanism 68 is set in the fourth area 60d. The operation of the rotating mechanism 68, the alignment mechanisms 69a and 69b, etc. will be described later.

[0098] The end suspension units 671 to 676 are arranged outside the main suspension unit 10. The end suspension units 671 to 676 are arranged along the outer periphery of the rectangular main suspension unit 10. The end suspension units 671 to 676 are arranged along the edge of the main suspension unit 10. In a top view, the end suspension units 671 to 676 are arranged to surround the outer periphery of the main suspension unit 10.

[0099] The end suspension units 671 and 672 are arranged on the -x side of the main suspension unit 10. The end suspension unit 673 is arranged on the +y side of the main suspension unit 10. The end suspension unit 674 is arranged on the +x side of the main suspension unit 10. The end suspension units 675 and 676 are arranged on the -y side of the main suspension unit 10.

[0100] The end suspension units 671 and 672 are arranged along the edge of the main suspension unit 10 on the -x side. That is, each of the end suspension units 671 and 672 is arranged along the y direction. In addition, the width of the end suspension unit 671 in the x direction is wider than the width of the end suspension unit 672 in the x direction. The end suspension unit 671 is arranged on the -y side of the end suspension unit 672.

[0101] The end suspension unit 673 is arranged along the edge of the main suspension unit 10 on the +y side. That is, the end suspension unit 673 is arranged along the x direction. The end suspension unit 674 is arranged along the edge of the main suspension unit 10 on the +x side. That is, the end suspension unit 674 is arranged along the y direction.

[0102] The end suspension units 675 and 676 are arranged along the edge of the main suspension unit 10 on the -y side. That is, each of the end suspension units 675 and 676 is arranged along the x direction. In addition, the width of the end suspension unit 676 in the y direction is wider than the width of the end suspension unit 675 in the y direction. The end suspension unit 676 is arranged on the -x side of the end suspension unit 675.

[0103] The conveying unit 11a is disposed between the main suspension unit 10 and the end suspension unit 671. A portion of the conveying unit 11a is also disposed between the main suspension unit 10 and the end suspension unit 672. The conveying unit 11a is formed along the y direction. The conveying unit 11a conveys the substrate in the +y direction. That is, the conveying unit 11a conveys the substrate 100 from the fourth area 60d to the first area 60a.

[0104] The conveying unit 11b is provided between the main suspension unit 10 and the end suspension unit 673. The conveying unit 11b is formed along the x direction. The conveying unit 11b conveys the substrate in a conveying direction inclined to the x direction. That is, the conveying unit 11b conveys the substrate 100 from the first area 60a to the second area 60b.

[0105] The conveying unit 11c is provided between the main suspension unit 10 and the end suspension unit 674. The conveying unit 11c is formed along the y direction. The conveying unit 11c conveys the substrate 100 in the -y direction. That is, the conveying unit 11c conveys the substrate 100 from the second area 60b to the third area 60c.

[0106] The conveying unit 11d is provided between the main suspension unit 10 and the end suspension unit 675. The conveying unit 11d moves between the main suspension unit 10 and the end suspension unit 676. The conveying unit 11d is formed along the x direction. The conveying unit 11a conveys the substrate along the -x direction. That is, the conveying unit 11d conveys the substrate 100 from the third area 60c to the fourth area 60d.

[0107] Note that the conveying unit 11b has Figure 1 and Figure 3 The conveying unit 11 shown is similarly constructed. Figure 7 and Figure 8 The structure of the conveying unit 11b is shown in a simplified manner, but it has the same Figure 1 and Figure 3 Therefore, the conveying unit 11b includes Figure 3 The holding mechanism 12, the x-direction moving mechanism 220, the y-direction moving mechanism 230, etc. are shown in the figure. The conveying unit 11b can perform a biaxial operation and move the substrate 100 in the x-direction and the y-direction. Therefore, the conveying direction of the substrate 100 is inclined with respect to the x-direction.

[0108] Each of the conveying units 11a, 11c and 11d is connected to Figure 1 The conveying unit 11 shown is different and is capable of only single-axis operation. Specifically, each of the conveying units 11a and 11c holds the substrate 100 and conveys it only in the y direction. The conveying unit 11d holds the substrate 100 and conveys it only in the x direction. Each of the conveying units 11a, 11c, and 11d has a holding mechanism for vacuum-adsorbing the substrate 100 and a moving mechanism for moving the holding mechanism.

[0109] See also Figure 8 , the conveying unit 11a includes a holding mechanism 12a and a moving mechanism 13a. Similarly, the conveying unit 11c includes a holding mechanism 12c and a moving mechanism 13c, and the conveying unit 11d includes a holding mechanism 12d and a moving mechanism 13d. Each of the holding mechanisms 12a, 12c, and 12d adsorbs and holds the substrate 100. The moving directions of the moving mechanisms 13a and 13c are parallel to the y direction. The moving direction of the moving mechanism 13d is parallel to the x direction. In addition, each of the conveying units 11a, 11c, and 11d includes a lifting mechanism (not shown) for moving the substrate 100 up and down.

[0110] like Figure 7 As shown, in the irradiation area 15a of the laser, the y direction is the longitudinal direction. That is, a linear irradiation area 15a is formed in which the longitudinal direction is parallel to the y direction. The substrate 100 is irradiated with laser light while the substrate 100 is transported in the transport direction. The laser irradiation process is performed while the substrate moves from the first area 60a to the second area 60b. In this embodiment, the amorphous silicon film is converted into a polycrystalline silicon film by irradiating the substrate with laser light from the laser light source as well.

[0111] Note that in the main suspension unit 10, the precision suspension unit 111 is arranged in and around the irradiation area 15a. The precision of the suspension height of the precision suspension unit 111 is higher than the precision of the suspension height of the rough suspension unit 113. Therefore, in the processing area 60e including the irradiation area 15a, the laser is applied to the substrate suspended with higher suspension height precision than the other areas 60a, 60b, 60c, 60d and 60f. In this way, the laser can be applied to the substrate 100 in a stable manner. In addition, the area other than the irradiation area 15a, such as the through area 60f, the third area 60c and the fourth area 60d, is manufactured without using the expensive precision suspension unit 111. Therefore, the cost of the device can be reduced.

[0112] The conveying unit 11b includes the movable suspension unit 17. Each of the conveying units 11a, 11c, and 11d does not include the movable suspension unit 17. Therefore, the width of the conveying unit 11b is wider than the widths of the conveying units 11a, 11c, and 11d. For example, the width of the conveying unit 11b in the y direction is greater than the width of the conveying unit 11d in the y direction. Similarly, the width of the conveying unit 11b in the y direction is greater than the width of the conveying units 11a and 11c in the x direction.

[0113] As described above, the width of the conveying unit 11b is greater than the widths of the conveying units 11a, 11c, and 11d. Therefore, the gap, i.e., the clearance between the end suspension unit 673 and the main suspension unit 10 is wider than the gap between the main suspension unit 10 and any other end suspension unit. For example, the gap between the end suspension unit 673 and the main suspension unit 10 in the y direction is wider than the gap between the end suspension unit 675 and the main suspension unit 10 in the y direction.

[0114] Next, we will refer to Figures 8 to 15The process according to the conveying method using the main suspension unit 10 is described. In this example, the fourth area 60d is used as a place where the substrate 100 is loaded and unloaded. In addition, the substrate 100 loaded into the fourth area 60d is conveyed from one area to another in the order of the first area 60a, the processing area 60e, the second area 60b, the third area 60c, the passing area 60f, and the fourth area 60d. That is, the substrate 100 moves along the edge of the main suspension unit 10 in a circumferential manner. In this example, the substrate 100 is moved twice in a circumferential manner so that the entire area of ​​the substrate 100 is irradiated with laser. That is, the substrate 100 is conveyed so that it moves twice above the main suspension unit 10 in a circumferential manner. By doing so, substantially the entire surface of the substrate 100 is irradiated with laser.

[0115] The above process according to the conveying method will be described in detail below. Figure 8 As shown, the substrate 100 is loaded into the fourth area 60d. The substrate 100 loaded into the fourth area 60d is suspended by the main suspension unit 10 and the end suspension units 671, 672, and 676. That is, the end of the substrate 100 on the -x side is suspended by the end suspension units 671 and 672, and the center portion of the substrate is suspended by the main suspension unit 10. The end of the substrate 100 on the -y side is suspended by the end suspension unit 676. In addition, the holding mechanism 12a of the conveying unit 11a holds the substrate 100.

[0116] Then, if Fig. 9 As shown in FIG. 1 , the substrate 100a in the fourth area 60d is transported to the first area 60a. The substrate that has been moved to the first area 60a is Fig. 9 The substrate 100b is shown in FIG. 1. The holding mechanism 12a of the conveying unit 11a holds the substrate 100a. Then, the moving mechanism 13a moves the holding mechanism 12a in the +y direction so that the substrate 100a moves from the fourth region 60d to the first region 60a (by Fig. 9 denoted by the outline arrows in the figure).

[0117] In this process, in the xy plane view, the holding mechanism 12a passes through the gap between the main suspension unit 10 and the end suspension unit 671 and moves in the +y direction. In addition, in the xy plane view, the holding mechanism 12a passes through the gap between the main suspension unit 10 and the end suspension unit 672 and moves in the +y direction. Therefore, the substrate 100b is suspended by the main suspension unit 10 and the end suspension units 672 and 673. That is, the end of the substrate 100b on the -x side is suspended by the end suspension unit 672, and the central part of the substrate is suspended by the main suspension unit 10. The end of the substrate 100b on the +y side is suspended by the end suspension unit 673.

[0118] Note that the transport unit 11b includes Figures 1 to 3The movable suspension unit 17 shown. When the substrate 100 moves from the fourth area 60d to the first area 60a, the end of the substrate 100 on the +y side passes through the gap between the main suspension unit 10 and the end suspension unit 673. In this process, the movable suspension unit 17 sprays gas onto the substrate 100. In this way, the substrate 100 can be prevented from bending and colliding with the edge of the main suspension unit 10 or the end suspension unit 673 or the structure around it. As described above, the gap between the end suspension unit 673 and the main suspension unit 10 is wider than the gap between any other end suspension unit and the main suspension unit 10. Even in this case, the substrate 100 can be prevented from bending by providing the movable suspension unit 17 in the conveying unit 11b.

[0119] Then, if Fig.10 As shown, the alignment mechanism 69a aligns the position and angle of the substrate 100b that has been transported to the first area 60a. For example, due to the loading operation, transport operation and / or rotation operation of the substrate 100, the position and rotation angle of the substrate 100 may have a slight deviation. The alignment mechanism 69a corrects the deviation of the position and / or rotation angle of the substrate. In this way, the irradiation position of the laser in the substrate 100 can be accurately controlled.

[0120] For example, the alignment mechanism 69a is movable in the y direction and rotatable around the z axis. In addition, the alignment mechanism 69a is movable in the z direction. For example, the alignment mechanism 69a includes an actuator such as a motor. The deviation amounts of the position and angle of the substrate 100b are obtained from a substrate image taken by a camera or the like. The alignment mechanism 69a performs alignment based on these deviation amounts.

[0121] The alignment mechanism 69a is arranged just below the center portion of the substrate 100b. The alignment mechanism 69a holds the substrate 100b. The alignment mechanism 69a can adsorb and hold the substrate 100b in a manner similar to the holding mechanism 12. The holding mechanism 12a releases (i.e., stops) the holding of the substrate 100b. In this way, the substrate 100b is transferred from the holding mechanism 12a to the alignment mechanism 69a.

[0122] Then, the alignment mechanism 69a rotates the substrate 100b about the z-axis (by Fig.10 ). The alignment mechanism 69a rotates the substrate 100b so that the edge of the substrate 100b becomes parallel to the conveying direction. The rotated substrate is shown as substrate 100c. For example, the alignment mechanism 69a rotates the substrate 100 around the z-axis by a predetermined angle. The edge of the substrate 100c is parallel to the conveying direction of the main suspension unit 10. Then, after the alignment is completed, the holding mechanism 12 ( Figure 1 and Figure 3) holds the substrate 100b, and the alignment mechanism 69a releases its holding. As a result, the substrate 100c is transferred from the alignment mechanism 69a to the holding mechanism 12 of the conveying unit 11b.

[0123] Then, if Fig.11 As shown, the conveying unit 11b moves the substrate 100d. As a result, the substrate 100d passes through the processing area 60e. In this process, in the xy plane view, the holding mechanism 12 passes through the gap between the main suspension unit 10 and the end suspension unit 673 and moves in a direction inclined to the x direction. In this way, approximately half of the area of ​​the substrate 100d passes through the irradiation area 15a. The laser is applied to the substrate 100d moving in a direction inclined to the x direction perpendicular to the irradiation area 15a.

[0124] In the xy plane view, the holding mechanism 12 passes through the gap between the main suspension unit 10 and the end suspension unit 673 and moves. Therefore, the substrate 100d is suspended by the main suspension unit 10 and the end suspension unit 673. That is, the end of the substrate 100d on the +y side is suspended by the end suspension unit 673, and the center portion thereof is suspended by the main suspension unit 10. When the substrate moves from the first area 60a to the second area 60b, the laser irradiation process is performed.

[0125] Then, if Fig.12 As shown, when the substrate 100e has moved to the second area 60b, the alignment mechanism 69b aligns the substrate 100e. In this process, the alignment mechanism 69b rotates the substrate 100e (by Fig.12 The rotated substrate is Fig.12 The substrate 100f is shown in FIG.

[0126] The alignment mechanism 69b is arranged just below the center portion of the substrate 100e. The alignment mechanism 69b holds the substrate 100e. The alignment mechanism 69b can adsorb and hold the substrate 100e in a manner similar to the holding mechanism 12. In addition, the holding mechanism 12 releases the holding of the substrate 100e. The substrate 100e is transferred from the holding mechanism 12 of the conveying unit 11b to the alignment mechanism 69b.

[0127] The alignment mechanism 69b causes the substrate 100e to rotate about the z-axis (by Fig.12 ). The alignment mechanism 69a rotates the substrate 100e so that the edge of the substrate 100e becomes parallel to the y direction of the main suspension unit 10. After the rotation, the edge of the substrate 100f is parallel to the x or y direction. Then, after the alignment is completed, the holding mechanism 12c of the conveying unit 11c holds the substrate 100f, and the alignment mechanism 69b releases the holding of the substrate. As a result, the substrate 100f is transferred from the alignment mechanism 69b to the holding mechanism 12c of the conveying unit 11c.

[0128] The substrate 100e is suspended by the main suspension unit 10 and the end suspension units 673, 674. That is, the end of the substrate 100e on the +y side is suspended by the end suspension unit 673. The end of the substrate 100e on the +x side is suspended by the end suspension unit 674, and the center portion of the substrate is suspended by the main suspension unit 10.

[0129] Then, if Fig.13 As shown, the substrate 100f located in the second area 60b is transported to the third area 60c. The substrate that has moved to the third area 60c is shown as substrate 100g. Fig.13 In the embodiment, the holding mechanism 12c of the conveying unit 11c holds the substrate 100f. Then, the moving mechanism 13c moves the holding mechanism 12c in the -y direction so that the substrate 100f moves from the second area 60b to the third area 60c (by Fig.13 denoted by the outline arrows in the figure).

[0130] In this process, in the xy plane view, the holding mechanism 12c passes through the gap between the main suspension unit 10 and the end suspension unit 674 and moves in the -y direction. Therefore, the substrate 100e is suspended by the main suspension unit 10 and the end suspension units 674, 675. The end of the substrate 100e on the +x side is suspended by the end suspension unit 674, and the central part of the substrate is suspended by the main suspension unit 10. The end of the substrate 100e on the -y side is suspended by the end suspension unit 675.

[0131] Then, the holding mechanism 12d of the conveying unit 11d holds the substrate 100g, and the holding mechanism 12c releases the holding of the substrate. As a result, the substrate 100g is transferred from the holding mechanism 12c of the conveying unit 11c to the holding mechanism 12d of the conveying unit 11d.

[0132] Then, if Fig.14 As shown, the substrate 100g located in the third area 60c is transported to the fourth area 60d. The substrate that has moved to the fourth area 60d is shown as substrate 100h. Fig.14 In the embodiment, the holding mechanism 12d of the conveying unit 11d holds the substrate 100g. Then, the moving mechanism 13d moves the holding mechanism 12d in the -x direction so that the substrate 100f moves from the third area 60c to the fourth area 60d (by Fig.14 denoted by the outline arrows in the figure).

[0133] In this process, in the xy plane view, the holding mechanism 12d passes through the gap between the main suspension unit 10 and the end suspension unit 675 and moves in the -x direction. In the xy plane view, the holding mechanism 12d passes through the gap between the main suspension unit 10 and the end suspension unit 676 and moves in the -x direction. Therefore, the substrate 100h is suspended by the main suspension unit 10 and the end suspension unit 676. The end of the substrate 100h on the -y side is suspended by the end suspension unit 676, and the central part of the substrate is suspended by the main suspension unit 10. The end of the substrate 100h on the -x side is suspended by the end suspension unit 671.

[0134] In this way, the substrate 100 initially arranged in the fourth area 60d moves from one area to another in the order of the first area 60a, the processing area 60e, the second area 60b, the third area 60c, the passing area 60f and the fourth area 60d. That is, the substrate 100 moves in a circumferential manner along the edge of the main suspension unit 10.

[0135] Then, if Fig.15 As shown, the rotating mechanism 68 rotates the substrate 100h around the z-axis by 180°. That is, the substrate 100h is transferred from the holding mechanism 12d to the rotating mechanism 68. After the rotating mechanism 68 rotates the substrate 100h, the substrate 100h is transferred from the rotating mechanism 68 to the holding mechanism 12d.

[0136] Similar to the above process, the conveying units 11a to 11d move the substrate 100h from one area to another again in the order of the first area 60a, the processing area 60e, the second area 60b, the third area 60c, the passing area 60f and the fourth area 60d. Figures 7 to 15 As shown, the substrate 100 moves in a circumferential manner along the edge of the main suspension unit 10 .

[0137] In this example, the rotating mechanism 68 rotates the substrate 100h by 180°. When the substrate 100e passes through the processing area 60e for the second time, the laser is applied to the remaining half of the substrate area that was not irradiated with the laser during the first pass. As described above, the substrate 100 moves twice in a circular manner along the edge of the main suspension unit 10. Since the substrate 100 rotates 180° between the first laser irradiation and the second laser irradiation, substantially the entire surface of the substrate 100 is irradiated with the laser. Note that the position where the substrate 100 is rotated is not limited to the first area 60a. For example, the rotation may be performed in the second area 60b, the third area 60c, the fourth area 60d, etc.

[0138] The conveying unit 11b conveys the substrate 100 in a conveying direction inclined to the x direction perpendicular to the irradiation area 15a. In this way, the crystallization process for the silicon film can be appropriately performed. For example, the occurrence of moire fringes can be prevented, thereby improving the display quality. Needless to say, the conveying direction of the substrate 100 may be parallel to the x direction. It is sufficient that the conveying direction of the substrate 100 is a direction inclined to the y direction in a top view. That is, the conveying direction of the substrate may be parallel to the x direction or a direction inclined to the x direction.

[0139] Note that the above description is given based on the following assumption: the conveying units 11a, 11c, and 11d convey the substrate 100 in a state where the edge of the substrate 100 is parallel to the x-direction and the y-direction. However, the substrate 100 may be conveyed in a state where the edge of the substrate 100 is inclined to the x-direction and the y-direction. That is, the conveying units 11a, 11c, and 11d may convey the substrate 100 in a state where the substrate 100 is parallel to the conveying direction. In this case, it is not necessary to Fig.10 and 12 The rotation angle is adjusted by the alignment mechanisms 69a and 69b in the embodiment. Therefore, the alignment mechanisms 69a and 69b may not be provided.

[0140] In addition, when the conveying unit 11b conveys the substrate 100, the holding mechanism Fig.11 In the embodiment, the short side of the substrate 100 is maintained, but it can maintain the long side of the substrate 100. In this case, Figure 8 In the embodiment, after the rotating mechanism 68 rotates the substrate 100 by 90°, the conveying unit 11a may convey the substrate 100. Alternatively, the loader may convey the substrate 100 to the fourth area 60d in a state where the long side of the substrate 100 is parallel to the x direction or the conveying direction.

[0141] (Organic EL display device)

[0142] The semiconductor device having the polysilicon film is suitable for a thin film transistor (TFT) array substrate of an organic electroluminescence (EL) display, that is, the polysilicon film is used as a semiconductor layer including a source region, a channel region and a drain region of the TFT.

[0143] Next, a configuration in which the semiconductor device according to the present embodiment is applied to an organic EL display will be described. Fig.16 It is a simplified cross-sectional view of a pixel circuit of an organic EL display device. Fig.16 The illustrated organic EL display 300 is an active matrix type display device in which one or more TFTs are arranged in each pixel PX.

[0144] The organic EL display device 300 includes a substrate 310 , a TFT layer 311 , an organic layer 312 , a color filter layer 313 , and a sealing substrate 314 . Fig.16 A top emission type organic EL display device is shown, in which one side of the sealing substrate 314 is located on the observation side. Note that the following description is given to show an example of the configuration of the organic EL display device, and the present embodiment is not limited to the configuration described below. For example, the semiconductor device according to the present embodiment can be used for a bottom emission type organic EL display device.

[0145] The substrate 310 is a glass substrate or a metal substrate. The TFT layer 311 is provided on the substrate 310. The TFT layer 311 includes TFTs 311a arranged in each pixel PX. In addition, the TFT layer 311 includes wiring (not shown) connected to the TFTs 311a, etc. The TFTs 311a, wiring, etc. constitute a pixel circuit.

[0146] The organic layer 312 is provided over the TFT layer 311. The organic layer 312 includes an organic EL light emitting portion 312a arranged in each pixel PX. Furthermore, in the organic layer 312, a partition wall 312b for partitioning the organic EL light emitting portion 312a is provided between the pixels PX.

[0147] The color filter layer 313 is provided over the organic layer 312. The color filter layer 313 includes a color filter 313a for performing color display. That is, in each pixel PX, a resin layer colored with R (red), G (green), or B (blue) is provided as the color filter 313a.

[0148] The sealing substrate 314 is provided over the color filter layer 313. The sealing substrate 314 is a transparent substrate such as a glass substrate, and is provided to prevent degradation of the organic EL light emitting portion of the organic layer 312.

[0149] The current flowing through the organic EL light emitting portion 312a of the organic layer 312 is changed by the display signal supplied to the pixel circuit. Therefore, the amount of light emitted in each pixel PX can be controlled by supplying a display signal corresponding to the display image to each pixel PX. As a result, a desired image can be displayed.

[0150] In an active matrix display device such as an organic EL display, at least one TFT (e.g., a switching TFT or a driving TFT) is provided in one pixel PX. In addition, a semiconductor layer including a source region, a channel region, and a drain region is provided in the TFT in each pixel PX. The polycrystalline silicon film according to the present embodiment is suitable for the semiconductor layer of the TFT. That is, by using the polycrystalline silicon film manufactured by the above-mentioned method for manufacturing the semiconductor layer of the TFT array substrate, the in-plane variation of the TFT characteristics can be prevented or reduced. Therefore, a display device with excellent display characteristics can be manufactured with high productivity.

[0151] (Method for manufacturing semiconductor device)

[0152] The method for manufacturing a semiconductor device using the laser irradiation device according to this embodiment is suitable for manufacturing a TFT array substrate. Fig.17 and Fig.18 A method for manufacturing a semiconductor device including a TFT is described. Fig.17 and Fig.18 Each of them is a cross-sectional view showing a process in a method for manufacturing a semiconductor device. In the following description, a method for manufacturing a semiconductor device including an inverted staggered TFT will be described. Fig.17 and Fig.18 One of the processes for forming a polysilicon film in a method for manufacturing a semiconductor is shown separately. Note that other manufacturing steps can be performed by using known techniques, and therefore their descriptions are appropriately omitted.

[0153] like Fig.17 As shown, a gate electrode 402 is formed on a glass substrate 401. A gate insulating film 403 is formed on the gate electrode 402. An amorphous silicon film 404 is formed on the gate insulating film 403. The amorphous silicon film 404 is arranged to be placed on the gate electrode 402 with the gate insulating film 403 interposed therebetween. For example, the gate insulating film 403 and the amorphous silicon film 404 are sequentially formed by a chemical vapor deposition (CVD: Chemical Vapor Deposition) method.

[0154] Then, the glass substrate 401 on which the amorphous silicon film 404 has been formed is transported to the above-mentioned transport device 600. Then, by irradiating the amorphous silicon film 404 with the laser light L1, a polycrystalline silicon film 405 is formed. Fig.18 That is, through Figure 1 The laser irradiation device 1 shown in the figure crystallizes the amorphous silicon film 404. As a result, a polysilicon film 405 formed when silicon is crystallized is formed on the gate insulating film 403. The polysilicon film 405 corresponds to the above-mentioned polysilicon film. When the conveying device 600 conveys the glass substrate 401, the glass substrate 401 is irradiated with the laser light L1. As a result, the amorphous silicon film 404 is annealed and converted into the polysilicon film 405.

[0155] In addition, the above description is given based on the following setting: the laser annealing device according to the present embodiment is a device in which a polycrystalline silicon film is formed by applying laser to an amorphous silicon film. However, the present disclosure can be applied to other cases in which a microcrystalline film is formed by applying laser to an amorphous silicon film. In addition, the laser used for annealing is not limited to Nd:YAG laser. In addition, the method according to the present embodiment can also be applied to a laser annealing device for crystallizing a thin film other than a silicon film. That is, the method according to the present embodiment can be applied to any laser annealing device in which a crystalline film is formed by applying laser to an amorphous film. According to the laser annealing device of the present embodiment, a substrate including a crystalline film can be appropriately modified (or altered).

[0156] Note that the present invention is not limited to the above-described embodiments, and they can be modified appropriately without departing from the scope and spirit of the present invention.

[0157] Reference numerals list

[0158] 1 Laser irradiation device

[0159] 10 Main suspension unit

[0160] 11 Conveying unit

[0161] 12. Holding mechanism

[0162] 14 Laser irradiation unit

[0163] 15 Laser Beam

[0164] 15a Irradiation area

[0165] 17 Movable suspension unit

[0166] 18 End suspension unit

[0167] 31 Precision Floating Area

[0168] 33 Coarse suspension area

[0169] 60a First Area

[0170] 60b Second Area

[0171] 60c Third Area

[0172] 60d Fourth Area

[0173] 60e Processing Area

[0174] 60f Passing area

[0175] 671~676 end suspension unit

[0176] 68 Rotating Mechanism

[0177] 69a, 69b Alignment mechanism

[0178] 100 substrates

[0179] 111 Precision Suspension Unit

[0180] 113 Coarse suspension unit

[0181] 131 Suspended Unit

[0182] 220 x-direction moving mechanism

[0183] 230 Y-axis moving mechanism

[0184] 240 Lifting Mechanism

[0185] 300 organic EL display

[0186] 310 base plate

[0187] 311 TFT layer

[0188] 311a TFT

[0189] 312 organic layer

[0190] 312a Organic EL light emitting unit

[0191] 312b Dividing wall

[0192] 313 Color filter layer

[0193] 313a Color Filter (CF)

[0194] 314 sealed substrate

[0195] 401 Glass Substrate

[0196] 402 gate electrode

[0197] 403 Gate insulation film

[0198] 404 Amorphous Silicon Film

[0199] 405 Polysilicon Film

[0200] 671~676 end suspension unit

[0201] PX pixels.

Claims

1. A conveying device, which is designed to convey a substrate so as to irradiate the substrate with a linear laser, the conveying device comprising: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism, which is designed to move the holding mechanism along a first direction to change an irradiation position of the laser on the substrate; as well as A second moving mechanism is designed to move the holding mechanism and the first moving mechanism in a second direction inclined with respect to the first direction, so as to change an irradiation position of the laser on the substrate.

2. The conveying device according to claim 1, wherein: The conveying device further comprises a movable suspension unit having an opening formed along a first direction and configured to spray gas onto a lower surface of the substrate, wherein: The second moving mechanism moves the movable suspension unit along a second direction, and The first moving mechanism moves the holding mechanism so that the holding mechanism moves in the opening along the first direction.

3. A conveying device, which is designed to convey a substrate so as to irradiate the substrate with a linear laser, the conveying device comprising: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening arranged along a first direction, and is designed to spray gas onto a lower surface of the substrate; a holding mechanism disposed in the opening and configured to hold the substrate; as well as The first moving mechanism is configured to move the holding mechanism and the suspension unit along the first direction.

4. The conveying device according to claim 3, wherein: The conveying device further comprises a second moving mechanism, wherein the second moving mechanism is designed to move the holding mechanism and the suspension unit along a second direction inclined to the first direction in a top view, wherein: When the second moving mechanism moves the holding mechanism and the suspension unit in the second direction, the first moving mechanism moves the holding mechanism in the first direction, thereby changing an irradiation position of the laser on the substrate.

5. The conveying device according to claim 1 or 3, wherein: The conveying device further comprises a lifting mechanism, wherein the lifting mechanism is configured to lift and lower the holding mechanism, wherein the first moving mechanism moves the lifting mechanism along the first direction.

6. The conveying device according to claim 1 or 3, wherein: The conveying device further includes an end suspension unit designed to spray gas onto a lower surface of an end of the substrate, wherein the holding mechanism moves between the end suspension unit and the main suspension unit.

7. A conveying method for conveying a substrate by using a conveying device so as to irradiate the substrate with a linear laser, The conveying device comprises: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; as well as a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit, The delivery method comprises the following steps: (A1) moving the holding mechanism along a first direction by a first moving mechanism to change an irradiation position of the laser on the substrate; as well as (A2) The holding mechanism and the first moving mechanism are moved in a second direction inclined with respect to the first direction by a second moving mechanism to change an irradiation position of the laser on the substrate.

8. The conveying method according to claim 7, wherein: The conveying device further includes a movable suspension unit having an opening formed along the first direction and configured to spray gas onto a lower surface of the substrate. The second moving mechanism moves the movable suspension unit along a second direction, and The first moving mechanism moves the holding mechanism so that the holding mechanism moves in the opening along the first direction.

9. A conveying device, which is designed to convey a substrate so as to irradiate the substrate with a linear laser, the conveying device comprising: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; a movable suspension unit, which is arranged outside the main suspension unit, includes an opening arranged along a first direction, and is designed to spray gas onto a lower surface of the substrate; as well as a holding mechanism arranged in the opening and designed to hold the substrate, and The conveying method comprises the step (B1): moving the holding mechanism and the movable suspension unit along the first direction by a first moving mechanism.

10. The conveying method according to claim 9, wherein: The conveying device further comprises a second moving mechanism, wherein the second moving mechanism is configured to move the holding mechanism and the movable suspension unit along a second direction inclined to the first direction in a top view, and When the second moving mechanism moves the holding mechanism and the movable floating unit in the second direction, the first moving mechanism moves the holding mechanism in the first direction, thereby changing an irradiation position of the laser on the substrate.

11. The method for conveying according to claim 7 or 9, wherein: The conveying device further comprises a lifting mechanism, wherein the lifting mechanism is configured to lift and lower the holding mechanism, and The first moving mechanism moves the lifting mechanism along the first direction.

12. The method for conveying according to claim 7 or 9, wherein: The conveying device further includes an end suspension unit, the end suspension unit being designed to spray gas onto a lower surface of an end of the substrate, and The holding mechanism moves between the end suspension unit and the main suspension unit.

13. A method for manufacturing a semiconductor device, comprising the following steps: (sa1) forming an amorphous film on a substrate; (sa2) loading the substrate on which the amorphous film is formed onto a conveying device; and (sa3) while the substrate is transported by the transport device, the substrate is irradiated with a linear laser to anneal the amorphous film so that the amorphous film is crystallized to form a crystalline film, The conveying device comprises: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; a holding mechanism, which is arranged outside the main suspension unit and is designed to hold the substrate above the main suspension unit; a first moving mechanism configured to move the holding mechanism along a first direction to change an irradiation position of the laser on the substrate; and A second moving mechanism is designed to move the holding mechanism and the first moving mechanism in a second direction inclined with respect to the first direction, so as to change an irradiation position of the laser on the substrate.

14. The method for manufacturing a semiconductor device according to claim 13, wherein: The conveying device further includes a movable suspension unit having an opening formed along the first direction and designed to spray gas onto the lower surface of the substrate. The second moving mechanism moves the movable suspension unit along a second direction, and The first moving mechanism moves the holding mechanism so that the holding mechanism moves in the opening along the first direction.

15. A method for manufacturing a semiconductor device, comprising the following steps: (sb1) forming an amorphous film on a substrate; (sb2) loading the substrate on which the amorphous film is formed onto a conveying device; and (sb3) while the substrate is transported by the transport device, the substrate is irradiated with a linear laser to anneal the amorphous film so that the amorphous film is crystallized to form a crystalline film, wherein The conveying device comprises: a main suspension unit including an irradiation area arranged directly below the irradiation position of the laser and designed to suspend the substrate above an upper surface of the main suspension unit; a suspension unit, which is arranged outside the main suspension unit, includes an opening arranged along a first direction, and is designed to spray gas onto a lower surface of the substrate; a holding mechanism disposed in the opening and configured to hold the substrate; and The first moving mechanism is configured to move the holding mechanism and the suspension unit along the first direction.

16. The method for manufacturing a semiconductor device according to claim 15, wherein: The conveying device further comprises a second moving mechanism, wherein the second moving mechanism is configured to move the holding mechanism and the suspension unit along a second direction inclined to the first direction in a top view, and When the second moving mechanism moves the holding mechanism and the suspension unit in the second direction, the first moving mechanism moves the holding mechanism in the first direction, thereby changing an irradiation position of the laser on the substrate.

17. The method for manufacturing a semiconductor device according to claim 13 or 15, wherein: The conveying device further comprises a lifting mechanism, wherein the lifting mechanism is configured to lift and lower the holding mechanism, and The first moving mechanism moves the lifting mechanism along the first direction.

18. The method for manufacturing a semiconductor device according to claim 13 or 15, wherein: The conveying device further includes an end suspension unit, the end suspension unit being designed to spray gas onto a lower surface of an end of the substrate, and The holding mechanism moves between the end suspension unit and the main suspension unit.

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