Substrate, electronic device, electronic module, and module device

Abstract

The thermal conductivity is improved. This substrate is provided with: a base body comprising a first surface, a second surface on the opposite side of the first surface, at least one first recess having an opening in the first surface, and at least one second recess having an opening in the second surface; a first metal member located inside the first recess; and a second metal member located inside the second recess, the thermal conductivity of the first metal member and the thermal conductivity of the second metal member are higher than the thermal conductivity of the base body.

Description

Technical Field

[0001] The present invention relates to a substrate on which electronic components are mounted. Background Art

[0002] As disclosed in Patent Documents 1 and 2, there is known a substrate on which electronic components are mounted, that is, a substrate having improved thermal conductivity so that heat generated by the electronic components can be rapidly diffused.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2018-117232

[0006] Patent document 2: International Publication No. 2011-059070. Summary of the invention

[0007] A substrate of one embodiment of the present invention comprises: a base, including a first surface, a second surface located on the opposite side of the first surface, at least one first recess having an opening on the first surface, and at least one second recess having an opening on the second surface; a first metal component located inside the first recess; and a second metal component located inside the second recess; the thermal conductivity of the first metal component and the thermal conductivity of the second metal component are higher than the thermal conductivity of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a perspective view of a module device according to Embodiment 1 of the present invention.

[0009] Figure 2 is a top view of the above module device.

[0010] Figure 3 is along Figure 2 Cross-sectional view along line III-III.

[0011] Figure 4 It is a top view of the substrate according to the first embodiment of the present invention.

[0012] Figure 5 This is a diagram of the substrate and the electronic component according to the first embodiment of the present invention as viewed from the Y-axis direction.

[0013] Figure 6 It is a top view of a substrate according to a second embodiment of the present invention.

[0014] Figure 7 This is a diagram of a substrate and an electronic component according to Embodiment 2 of the present invention as viewed from the Y-axis direction.

[0015] Figure 8It is a top view of a substrate according to a third embodiment of the present invention.

[0016] Fig. 9 This is a diagram of a substrate and an electronic component according to a third embodiment of the present invention as viewed from the Y-axis direction.

[0017] Fig.10 It is a top view of a substrate according to a fourth embodiment of the present invention.

[0018] Fig.11 is along Fig.10 A cross-sectional view taken along line XI-XI.

[0019] Fig.12 is along Fig.10 Cross-sectional view along line XII-XII.

[0020] Fig.13 It is a top view of a substrate according to a fifth embodiment of the present invention.

[0021] Fig.14 This is a diagram of a substrate and an electronic component according to a fifth embodiment of the present invention as viewed from the Y-axis direction. DETAILED DESCRIPTION

[0022] In substrates on which components such as electronic elements are mounted, there is a need for substrates with further improved thermal conductivity.

[0023] According to one embodiment of the present invention, thermal conductivity can be improved.

[0024] [Implementation Method 1]

[0025] Hereinafter, one embodiment of the present invention will be described in detail. Figure 1 It is a perspective view of the module device 1 according to the present embodiment. Figure 2 is a top view of the module device 1. Figure 2 In the figure, for the convenience of explanation, the upper surface of the housing 11 described later is omitted. Figure 3 is along Figure 2 In the following description, Figure 1 The X-axis direction is used as the second direction (left-right direction) of the module device 1, the Y-axis direction is used as the third direction (front-back direction) of the module device 1, and the Z-axis direction is used as the first direction (up-down direction) of the module device 1. Figure 1 The +X axis direction is taken as the right direction, the -X axis direction is taken as the left direction, the +Y axis direction is taken as the rear direction, the -Y axis direction is taken as the front direction, the +Z axis direction is taken as the upper direction, and the -Z axis direction is taken as the lower direction.

[0026] like Figure 1 to Figure 3As shown, the module device 1 has an electronic module 10 and a frame 2 on which the electronic module 10 is mounted. The frame 2 may be composed of a cooling plate, for example. Thus, the electronic module 10 can be cooled. The number of electronic modules in the module device 1 may be one or more than two. The electronic module 10 may be mounted on a module substrate (not shown) instead of the frame 2.

[0027] like Figure 2 and Figure 3 As shown, the electronic module 10 includes a housing 11 , a fixing member 12 and an electronic device 20 .

[0028] The housing 11 has a storage space 11a at the center in the second direction (left-right direction), and the electronic device 20 is stored in the storage space 11a. The housing 11 is fixed to the frame 2 via a fixing member 12. The fixing member 12 may be a screw, for example. The housing 11 may be made of metal.

[0029] like Figure 3 As shown, the electronic device 20 includes an electronic component 21 , a substrate 30A, a metal plate 22 , and a heat sink 23 in order from top to bottom.

[0030] The electronic component 21 of the present embodiment is constituted by a laser diode or the like capable of emitting laser light, and the electronic device 20 irradiates the laser light emitted from the electronic component 21 to the outside.

[0031] In the electronic device 20, the heat generated when the electronic element 21 is operated is conducted to the radiator 23 via the substrate 30A and the metal plate 22, and is dissipated by the radiator 23. Therefore, the substrate 30A is required to have high heat dissipation. In addition, part of the heat conducted to the radiator 23 is conducted to the frame 2 composed of the cooling plate via the housing 11, and is dissipated in the frame 2.

[0032] The substrate 30A is an electronic component mounting substrate for mounting the electronic component 21. The substrate 30A may be used to mount heat-generating components other than the electronic components. Figure 4 is a top view of the substrate 30A. Figure 4 In FIG. 1 , for convenience of explanation, an electronic component mounting portion 41 a and a recess 50 described later are indicated by dotted lines, and the recess 50 formed on the second surface 42 is shaded in the figure. Figure 5 This is a diagram showing the substrate 30A and the electronic component 21 as viewed from the third direction (front-back direction). Figure 5 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0033] like Figure 4 and Figure 5 As shown, the substrate 30A includes a base 40A, a metal member 51 , a first conductor film layer 31 , and a second conductor film layer 32 .

[0034] The substrate 40A may be composed of a single layer or multiple layers. Figure 5 As shown, the substrate 40A in this embodiment is a single-layer insulating layer. The substrate 40A has a first surface 41 on which the electronic element 21 is mounted, a second surface 42 located on the opposite side of the first surface, and a recess 50. In the following description, the recess 50 having an opening on the first surface 41 is sometimes referred to as the first recess 50A, and the recess 50 having an opening on the second surface 42 is sometimes referred to as the second recess 50B. The first surface 41 and the second surface 42 are opposite to each other. Figure 4 As shown, the first surface 41 has an electronic component mounting portion 41 a for mounting the electronic component 21 in the center portion in the second direction.

[0035] The shape of the substrate 40A when viewed from above is not particularly limited, and may be, for example, rectangular, circular, etc. The substrate 40A of this embodiment is rectangular when viewed from above. In this specification, the descriptions "flat" or "plane" do not require strict flatness or plane.

[0036] The substrate 40A may have insulating properties. In this case, the material of the substrate 40A may be, for example, ceramics such as an aluminum nitride sintered body, an aluminum oxide sintered body (alumina ceramics), a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. When the material of the substrate 40A is an aluminum nitride sintered body, the substrate 40A contains aluminum nitride as a main component. In this case, when the mass of the substrate 40A is 100 mass %, the substrate 40A contains more than 80 mass % of aluminum nitride. The substrate 40A may contain more than 95 mass % of aluminum nitride. Thus, since it is easy to make the thermal conductivity of the substrate 40A reach more than 170 W / mK, the heat dissipation of the substrate 40A can be improved.

[0037] The base body 40A has at least one recessed portion 50 on each of the first surface 41 and the second surface 42. In the present embodiment, the base body 40A has a plurality of recessed portions 50 on each of the first surface 41 and the second surface 42.

[0038] The recess 50 may be a cavity structure. When the substrate 30A is viewed from the first direction, the opening of the recess 50 may be circular. The recess 50 has a bottom.

[0039] When the base 40A has a plurality of recesses 50 on each of the first surface 41 and the second surface 42, the arrangement method of the plurality of recesses 50 is not particularly limited. Figure 4As shown in FIG. 1 , the plurality of recesses 50 may be arranged so that four adjacent recesses 50 are located at the vertices of a rectangle on each of the first surface 41 and the second surface 42. In other words, the plurality of recesses 50 may be arranged in a grid pattern on each of the first surface 41 and the second surface 42. Thus, when the substrate 30A is viewed from above, since the plurality of recesses 50 are evenly arranged, the heat dissipation of the substrate 30A is less likely to vary.

[0040] like Figure 5 As shown, in a cross section cut by a plane parallel to a first direction (i.e., a vertical direction) orthogonal to the first surface 41 and the second surface 42, the first recess 50A provided on the first surface 41 may become thinner as the distance from the first surface 41 increases. In other words, in a cross section cut by a plane parallel to the first direction, the width of the first recess 50A in the second direction may become smaller as the distance from the first surface 41 provided with the first recess 50A increases. Figure 5 As shown, in the cross section cut along the first direction, the shape of the first recess 50A may be a curved shape that is convex from the first surface 41 toward the second surface 42. For example, the shape of the cross section of the first recess 50A cut along a plane parallel to the first direction may be an elliptical hemispherical shape.

[0041] like Figure 5 As shown, in a cross section cut by a plane parallel to the first direction, the second recess 50B provided on the second surface 42 may become thinner as the distance from the second surface 42 increases. In other words, in a cross section cut by a plane parallel to the first direction, the width of the second recess 50B in the second direction may become smaller as the distance from the second surface 42 provided with the second recess 50B increases. Figure 5 As shown, in the cross section cut along the first direction, the shape of the second recess 50B may be a curved line shape that is convex from the second surface 42 toward the first surface 41 .

[0042] The concave portion 50 can be formed by performing sandblasting on the first surface 41 or the second surface 42. By performing sandblasting to form the concave portion 50, the Figure 5 As shown, the inner surface of the recessed portion 50 is formed into a curved shape.

[0043] In the present embodiment, the opening areas of the plurality of recesses 50 when viewed from above the base 40A are the same, but the present invention is not limited thereto, and the opening areas of the plurality of recesses 50 may be different from each other. An example in which the opening areas of the plurality of recesses 50 are different will be described in the second embodiment. In the present embodiment, the depths of the plurality of recesses 50 are formed to be the same, but the present invention is not limited thereto, and the depths of the plurality of recesses 50 may be different from each other.

[0044] In the substrate 30A of the present invention, the shape of the recessed portion 50 is not limited to the above shape as long as the recessed portion 50 is formed on each of the first surface 41 and the second surface 42. The shape of the recessed portion 50 may be, for example, a cylindrical shape.

[0045] The inside of the recess 50 is filled with a metal member 51 having a higher thermal conductivity than the thermal conductivity of the substrate 40A. The metal member 51 is not particularly limited as long as it has a higher thermal conductivity than the substrate 40A. For example, if the material of the substrate 40A is an aluminum nitride sintered body, it can be copper, copper-tungsten, copper-molybdenum, aluminum, etc. By filling the inside of the recess 50 with the metal member 51, the thermal conductivity of the substrate 30A can be improved. The filling of the metal member 51 into the recess 50 can utilize a plating method such as an electroplating method or a metallization method. In the following description, the metal member 51 located inside the first recess 50A is sometimes described as a first metal member 51A, and the metal member 51 located inside the second recess 50B is described as a second metal member 51B to be distinguished.

[0046] When viewed from above, the first recessed portions 50A formed on the first surface 41 and the second recessed portions 50B formed on the second surface 42 of the base 40A may be alternately arranged in at least one direction perpendicular to the first direction. Figure 4 On the straight line L shown, the center of the opening of the first recess 50A and the center of the opening of the second recess 50B are arranged alternately. By forming the above structure, since a plurality of recesses 50 are evenly arranged on the first surface 41 and the second surface 42, the overall heat dissipation of the base 40A is not easily deviated. In addition, by adopting the above structure, when the substrate 30A is viewed from above, the first recess 50A provided on the first surface 41 can be provided in an area that does not overlap with the second recess 50B provided on the second surface 42. As a result, the first conductor film layer 31 and the second conductor film layer 32 can be electrically connected. In this specification, the description of "vertical" does not require verticality in a strict sense.

[0047] When viewed from a perspective view perpendicular to the first direction, the base 40A may have at least one set of recesses 50, in which a portion of a first recess 50A overlaps with a second recess 50B. Figure 5 As shown, this structure can be realized by forming the first concave portion 50A formed on the first surface 41 deeper than the center of the base 40A in the first direction, and forming the second concave portion 50B formed on the second surface 42 deeper than the center of the base 40A in the first direction. According to this structure, since the volume of the concave portion 50 formed in the base 40A can be increased, the thermal conductivity of the substrate 30A can be improved.

[0048] In the substrate 30A of one embodiment of the present invention, a thin film layer not shown may be provided on the surface of the recess 50, the surface of the first surface 41, and the surface of the second surface 42. The thin film layer may be composed of, for example, tantalum nitride, nickel-chromium, nickel-chromium-silicon, tungsten-silicon, molybdenum-silicon, tungsten, molybdenum, titanium, chromium, etc. The thin film layer can be formed by a forming technique such as evaporation, ion plating, sputtering, etc. By forming the thin film layer on the surface of the recess 50, the surface of the first surface 41, and the surface of the second surface 42, the bonding between the inner surface of the recess 50 and the metal member 51, the bonding between the first surface 41 and the first conductor film layer 31, the bonding between the metal member 51 and the first conductor film layer 31, the bonding between the second surface 42 and the second conductor film layer 32, and the bonding between the metal member 51 and the second conductor film layer 32 can be improved.

[0049] like Figure 5 As shown, the first conductor film layer 31 is located on the first surface 41 of the substrate 40A. The first conductor film layer 31 is connected to the first metal member 51A filled in the first recess 50A. Figure 5 As shown, the first conductor film layer 31 is connected to the first metal member 51A respectively filled with the plurality of first recesses 50A provided on the first surface 41. The first conductor film layer 31 is made of a material with excellent conductivity such as copper. The first conductor film layer 31 is divided into two regions and formed on the first surface 41. The first conductor film layer 31 on one side carries the electronic component 21. The first conductor film layer 31 on the other side is used as a connecting part of a connecting member 33 such as a bonding wire to electrically connect the electronic component 21 to a wiring conductor of a wiring substrate not shown in the figure. As described later, since the first conductor film layer 31 is made of a thin film, in this specification, the so-called "the electronic component 21 is mounted on the first conductor film layer 31" and "the electronic component 21 is mounted on the electronic component mounting portion 41a of the first surface 41" have the same meaning.

[0050] The first conductor film layer 31 is formed on the first surface 41 and has a higher thermal conductivity than the substrate 40A. The first conductor film layer 31 is not particularly limited as long as it has a higher thermal conductivity than the substrate 40A. For example, when the material of the substrate 40A is an aluminum nitride sintered body, it can be copper, copper-tungsten, copper-molybdenum, aluminum, etc. By forming the first conductor film layer 31 on the first surface 41, the thermal conductivity of the substrate 30A can be improved. The first conductor film layer 31 can be formed on the first surface 41 by a plating method such as an electroplating method or a metallization method. As described above, the surface of the first surface 41 can have a thin film layer not shown. If the first conductor film layer 31 and the metal member 51 are formed of the same material, for example, the first conductor film layer 31 and the metal member 51 are formed of copper, then heat can be well transferred from the first conductor film layer 31 to the metal member 51. The electronic element 21 is fixed to one first conductive film layer 31 via a bonding material such as In or Au—Sn, and then the electrode of the electronic element 21 is electrically connected to the other first conductive film layer 31 via a connection member 33 such as a bonding wire, and is mounted on the substrate 30A.

[0051] A plating layer may be formed on the upper surface of the first conductor film layer 31. The plating layer may be made of a metal such as nickel, copper, gold, or silver that has excellent corrosion resistance and connectivity with the connection member 33. For example, the plating layer may be formed by sequentially covering a nickel plating layer having a thickness of 0.5 to 5 μm and a gold plating layer having a thickness of 0.1 to 3 μm. Thus, the possibility of corrosion of the first conductor film layer 31 can be reduced, and the first conductor film layer 31 and the electronic element 21 can be fixed firmly, and the first conductor film layer 31 and the connection member 33 can be bonded.

[0052] The second conductor film layer 32 is located on the second surface 42 of the substrate 40A. The second conductor film layer 32 may have the same material and structure as the first conductor film layer 31. The second conductor film layer 32 is used to be bonded to the metal plate 22. If the second conductor film layer 32 and the metal member 51 are formed of the same material, for example, the second conductor film layer 32 and the metal member 51 are formed of copper, heat can be well transferred from the metal member 51 to the second conductor film layer 32.

[0053] If the sum of the volume of the first metal member 51A filled in the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 is significantly different from the sum of the volume of the second metal member 51B filled in the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32, the base body 40A warps due to the difference in thermal expansion coefficient between the base body 40A and the thermal expansion coefficient of the metal member 51. Therefore, in the substrate 30A, the sum of the volume of the first metal member 51A filled in the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 may be set to be greater than 90 volume % and less than 110 volume % of the sum of the volume of the second metal member 51B filled in the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32. Thus, the warping amount of the base body 40A can be reduced. If the substrate 30A has neither the first conductor film layer 31 nor the second conductor film layer 32, the sum of the volumes of the first metal components 51A filling the plurality of first recesses 50A set on the first surface 41 can be set to be greater than 90 volume % and less than 110 volume % of the sum of the volumes of the second metal components 51B filling the plurality of second recesses 50B set on the second surface 42.

[0054] As described above, in the substrate 30A of the present embodiment, the base 40A has a plurality of recesses 50 filled with metal members 51 on the first surface 41 and the second surface 42. Thus, compared with a base in which the recesses 50 are formed only on one of the first surface 41 and the second surface 42, the volume of the metal members 51 contained in the base 40A can be increased. As a result, the thermal conductivity of the substrate 30A can be improved. In addition, the recess 50 whose width in the front-back direction decreases as the distance from the first surface 41 increases in the cross section cut by a plane parallel to the up-down direction can be formed on the first surface 41 on which the electronic element 21 is mounted.

[0055] The substrate 30A of the present embodiment is provided with a recess 50 on the first surface 41 and the second surface 42 on which the electronic element 21 is mounted. In a cross section cut by a plane parallel to the first direction, the width of the recess 50 in the second direction decreases as the distance from the first surface 41 or the second surface 42 increases. In other words, in a cross section cut by a plane parallel to the first direction, the diameter of the recess 50 decreases as the distance from the first surface 41 or the second surface 42 increases. Thus, for example, the surface area of ​​the recess 50 can be increased compared to a case where the recess 50 is in a rectangular parallelepiped shape. As a result, the transfer of heat from the metal component 51 on the first surface 41 side to the base 40A and the transfer of heat from the base 40A to the metal component 51 on the second surface 42 side become easy. Thus, the thermal conductivity of the substrate 30A can be improved.

[0056] like Figure 5 As shown in the figure, in the cross section cut along the first direction, the shape of the recess 50 is a curved shape that is convex from the surface where the recess 50 is formed toward the surface on the opposite side. Therefore, when a load in the first direction is applied to the substrate 30A, the stress applied to the surface where the recess 50 is formed can be dispersed. As a result, the possibility of damage to the substrate 30A can be reduced.

[0057] In the substrate 30A, as Figure 5 As shown, the first metal member 51A filling the first recess 50A formed on the first surface 41 side contacts the first conductor film layer 31. As a result, the heat conducted from the electronic element 21 to the first conductor film layer 31 is easily conducted to the first metal member 51A. Figure 5 As shown, the second metal member 51B filling the second recess 50B formed on the second surface 42 side contacts the second conductor film layer 32. As a result, the heat conducted to the base 40A is easily conducted to the second conductor film layer 32 via the second metal member 51B. Therefore, the thermal conductivity of the substrate 30A can be improved.

[0058] The substrate 30A of this embodiment carries a laser diode as the electronic element 21, but the electronic element carried on the substrate 30A is not limited to the laser diode. For example, the electronic element carried on the substrate 30A may be a semiconductor element such as an IC chip or an LSI chip, or a piezoelectric element such as a crystal oscillator or a piezoelectric vibrator.

[0059] [Implementation Method 2]

[0060] For the sake of convenience, components having the same functions as those described in the above embodiment are denoted by the same reference numerals and will not be described repeatedly.

[0061] Figure 6 FIG. 3 is a top view of the substrate 30B of this embodiment. Figure 6 In FIG. 1 , for convenience of explanation, the electronic component mounting portion 41 a and the recess 50 are indicated by dotted lines, and the recess 50 formed on the second surface 42 is shaded in the figure. Figure 7 This is a diagram of the substrate 30B and the electronic component 21 as viewed from the third direction (front-rear direction). Figure 7 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0062] like Figure 6 and Figure 7 As shown, the substrate 30B has a base 40B instead of the base 40A in the first embodiment.

[0063] The base 40B is formed with a plurality of recesses 50 filled with metal members 51 on the first surface 41 and the second surface 42, respectively. In the base 40B, the opening diameter of the recess 50 decreases as the formation position of the recess 50 in the second direction moves from the central portion to the outside. Thus, in the substrate 30B, when viewed from above, the opening area of ​​the recess 50 increases as it moves from the outside of the second direction toward the electronic component mounting portion 41a. In other words, when viewed from above, the opening area of ​​the recess 50 provided in the electronic component mounting portion 41a or in an area close to the electronic component mounting portion 41a is larger than the opening area of ​​the recess 50 provided in an area away from the electronic component mounting portion 41a.

[0064] By having the above structure, in the base 40B, in the electronic component mounting portion 41a or the area near the electronic component mounting portion 41a where the recess 50 with a large opening area is formed, it is easy to transfer heat from the first surface 41 to the inside of the base 40B, and it is easy to transfer heat from the inside of the base 40B to the second surface 42. In other words, in the substrate 30B, the thermal conductivity near the electronic component mounting portion 41a is higher than that of the outside. As a result, it is easy to effectively transfer the heat conducted from the electronic component 21 to the metal plate 22, so that the temperature of the electronic component 21 is easy to reduce. In the case where the electronic component 21 is mounted only on the central part of the third direction of the first surface 41 of the substrate 30B according to the size or shape of the electronic component 21, in this case, the opening diameter of the recess 50 of the base 40B can be reduced as it moves from the central part of the third direction of the first surface 41 toward the outside.

[0065] [Implementation Method 3]

[0066] Next, another embodiment of the present invention will be described. Figure 8 FIG. 30 is a top view of a substrate 30C according to the present embodiment. Figure 8 In FIG. 4 , for convenience of explanation, the recessed portion 50 formed on the second surface 42 is shown with hatching. Fig. 9 This is a diagram showing the substrate 30C and the electronic component 21 as viewed from a third direction. Fig. 9 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0067] like Figure 8 and Fig. 9 As shown, the substrate 30C has a base 40C instead of the base 40A in the first embodiment.

[0068] The base 40C has a plurality of recesses 50 filled with metal members 51 on the first surface 41 and the second surface 42. In the base 40C of the present embodiment, Fig. 9As shown, the depth of the second recess 50B provided on the second surface 42 is deeper than the depth of the first recess 50A provided on the first surface, and the second surface 42 is located at a position farther from the electronic component 21 as a heat source than the first surface 41. Thus, since the distance between the first recess 50A provided on the first surface 41 and the second recess 50B provided on the second surface 42 can be reduced, the transfer of heat from the first metal member 51A filled in the first recess 50A to the second metal member 51B filled in the second recess 50B becomes easy. As a result, the heat dissipation of the substrate 30C can be improved. The so-called depth of the first recess 50A represents the distance from the first surface 41 to the bottom of the first recess 50A, and the so-called depth of the second recess 50B represents the distance from the second surface 42 to the bottom of the second recess 50B in the Z-axis direction.

[0069] As described in the first embodiment, if the sum of the volume of the first metal member 51A filling the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 is significantly different from the sum of the volume of the second metal member 51B filling the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32, the base 40C may be warped. Fig. 9 As shown, the base 40C of this embodiment can be configured so that the opening area of ​​the second recessed portion 50B formed on the second surface 42 is smaller than the opening area of ​​the first recessed portion 50A formed on the first surface 41. Thus, the volume of the first recessed portion 50A formed on the first surface 41 and the volume of the second recessed portion 50B formed on the second surface 42 can be made not significantly different. Thus, the warping amount of the base 40C can be reduced.

[0070] [Implementation method 4]

[0071] Next, another embodiment of the present invention will be described. Fig.10 It is a top view of the substrate 30D of this embodiment. Fig.11 is along Fig.10 A cross-sectional view taken along line XI-XI. Fig.12 is along Fig.10 Cross-sectional view along line XII-XII.

[0072] like Figure 10 to Figure 12 As shown, the substrate 30D has a base 40D instead of the base 40A in the first embodiment.

[0073] The base body 40D has a plurality of recesses 60 filled with the metal member 51 formed on each of the first surface 41 and the second surface 42. Fig.10 and Fig.11 As shown in FIG. 1 , the recess 60 is a slit extending in a direction perpendicular to the first direction, that is, in a second direction. Fig.10As shown, when the base body 40D is viewed from above, the recess 60 may be provided in a region overlapping with the first conductor film layer 31. The recess 60 of the present embodiment is formed so that the length in the second direction thereof is the same as the length in the second direction of the first conductor film layer 31, but may be shorter than the length in the second direction of the first conductor film layer 31. In the following description, the recess 60 having an opening on the first surface 41 is sometimes described as a first recess 60A, and the recess 60 having an opening on the second surface 42 is sometimes described as a second recess 60B.

[0074] like Fig.12 As shown, the shape of the cross section of the first recessed portion 60A provided on the first surface 41 cut by a plane perpendicular to the second direction may also be such that the length in the third direction becomes smaller as the distance from the first surface 41 increases. Thus, for example, compared with the case where the shape of the cross section cut by a plane perpendicular to the second direction is a rectangle, the surface area of ​​the first recessed portion 60A can be increased. As a result, the heat transfer from the first metal member 51A to the base 40D becomes easier. Thus, the thermal conductivity of the substrate 30D can be improved.

[0075] The cross-sectional shape of the second recess 60B provided on the second surface 42 cut along a plane perpendicular to the second direction may also decrease in length in the third direction as the distance from the second surface 42 increases. As in the above embodiment, the slits can be formed by sandblasting the first surface 41 and the second surface 42 of the base 40D.

[0076] In the substrate 40D, as Fig.10 As shown, in a plan perspective view, the first recess 60A provided on the first surface 41 may be provided in a region that does not overlap with the second recess 60B provided on the second surface 42. Thus, the first conductive film layer 31 and the second conductive film layer 32 may not be electrically connected.

[0077] The recess 60 of this embodiment is a slit extending in the second direction (left-right direction), but is not limited thereto. As long as the recess 60 is perpendicular to the up-down direction, it may be a slit extending in any direction, for example, it may be a slit extending in the third direction (front-back direction).

[0078] In the substrate 30D of the present invention, the shape of the recess 60 is not limited to the above shape as long as the recess 60 is formed on each of the first surface 41 and the second surface 42. The shape of the recess 60, for example, its cross section perpendicular to the longitudinal direction may be rectangular or triangular.

[0079] In the substrate 30D of the present embodiment, the recessed portions formed on the first surface 41 and the second surface 42 are slits, but are not limited thereto. In the substrate of one embodiment of the present invention, a recessed portion 50 with a cavity structure may be formed on one of the first surface 41 and the second surface 42, and a recessed portion 60 with a slit structure may be formed on the other surface.

[0080] [Implementation method five]

[0081] Next, another embodiment of the present invention will be described. Fig.13 FIG. 3 is a top view of a substrate 30E according to the present embodiment. Fig.13 In FIG. 1 , for convenience of explanation, the electronic component mounting portion 41 a and the recess 50 are indicated by dotted lines, and the recess 50 formed on the second surface 42 is shaded in the figure. Fig.14 This is a diagram of the substrate 30E and the electronic component 21 as viewed from the third direction (front-rear direction). Fig.14 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0082] like Figure 10 to Figure 12 As shown, the substrate 30E has a base 40E instead of the base 40A in the first embodiment.

[0083] In the base body 40E, a plurality of recesses 50 filled with metal members 51 are formed on each of the first surface 41 and the second surface 42. Fig.13 and Fig.14 As shown in FIG. 1 , the recess 50 has a rectangular parallelepiped shape extending in the first direction. The interior of the recess 50 is filled with a metal member 51 having a higher thermal conductivity than the base 40E.

[0084] With the above structure, in the substrate 30E of the present embodiment, the base 40E has a plurality of recesses 50 filled with metal members 51 on the first surface 41 and the second surface 42. Thus, the volume of the metal members 51 included in the base 40E can be increased compared to a base having the recesses 50 formed on only one of the first surface 41 and the second surface 42. As a result, the thermal conductivity of the substrate 30E can be improved.

[0085] In the present embodiment, the opening areas of the plurality of recesses 50 when viewed from above the base 40E are the same, but the present invention is not limited thereto, and the opening areas of the plurality of recesses 50 may be different from each other. In the present embodiment, the depths of the plurality of recesses 50 are the same, but the present invention is not limited thereto, and the depths of the plurality of recesses 50 may be different from each other.

[0086] A substrate of embodiment 1 of the present invention comprises: a base, including a first surface, a second surface located on the opposite side of the first surface, at least one first recess having an opening on the first surface, and at least one second recess having an opening on the second surface; a first metal component located inside the first recess; and a second metal component located inside the second recess; the thermal conductivity of the first metal component and the thermal conductivity of the second metal component are higher than the thermal conductivity of the base.

[0087] A substrate according to a second aspect of the present invention is the substrate in the first aspect, wherein the base may have a plurality of the first recessed portions and a plurality of the second recessed portions.

[0088] A substrate according to a third aspect of the present invention is the substrate in the first or second aspect, wherein the shape of the opening of at least one of the first recess and the second recess may be circular when viewed from above.

[0089] The substrate of mode 4 of the present invention is in any one of modes 1 to 3 above, wherein the base has a plurality of the first recesses and a plurality of the second recesses, the first recesses are arranged in a grid pattern on the first surface, and the second recesses are arranged in a grid pattern on the second surface.

[0090] The substrate of the fifth aspect of the present invention may be configured such that, in the fourth aspect, when the substrate is viewed from above, the first recesses and the second recesses are alternately arranged in at least one direction perpendicular to a first direction orthogonal to the first surface and the second surface.

[0091] The substrate of aspect 6 of the present invention may be configured such that, in any one of aspects 1 to 5, when the substrate is viewed in a plan perspective, the first recessed portion does not overlap with the second recessed portion.

[0092] The substrate of aspect 7 of the present invention may be configured such that, in any of aspects 1 to 6, a portion of the first recess overlaps with the second recess when viewed from a direction perpendicular to a first direction orthogonal to the first surface and the second surface.

[0093] The substrate of mode eight of the present invention can be constructed as follows: in any one of modes one to seven, the sum of the volumes of the first metal components filled inside the first recess is greater than 90 volume % and less than 110 volume % of the sum of the volumes of the second metal components filled inside the second recess.

[0094] The substrate of mode nine of the present invention can be constructed as, in any of the above modes one to seven, further comprising a first conductor film layer located on the first surface and a second conductor film layer located on the second surface, wherein the sum of the volume of the first metal component filled in the first recess and the volume of the first conductor film layer is greater than 90 volume % and less than 110 volume % of the sum of the volume of the second metal component filled in the second recess and the volume of the second conductor film layer.

[0095] The substrate of mode 10 of the present invention can be constructed as follows: in any one of modes 1 to 9 above, in at least one cross-section cut along a first direction orthogonal to the first surface and the second surface, the width of the first recess in a direction parallel to the first surface decreases as the distance from the first surface increases, and the width of the second recess in a direction parallel to the first surface decreases as the distance from the second surface increases.

[0096] The substrate of mode eleven of the present invention is in the above-mentioned mode ten, and in at least one cross-section cut along the first direction, the shape of the first recess and the second recess can be a curved shape from the surface on which the first recess or the second recess is provided in the first surface and the second surface toward the surface on the opposite side.

[0097] A substrate according to a twelfth aspect of the present invention may be configured such that, in any one of the first to eleventh aspects, the base has an electronic component mounting portion on the first surface, and an opening area of ​​the second recess is smaller than an opening area of ​​the first recess.

[0098] A substrate according to a thirteenth aspect of the present invention may be configured such that, in any one of the first to twelfth aspects, the base has an electronic component mounting portion on the first surface, and the second recess has a depth greater than that of the first recess.

[0099] In the substrate of aspect 14 of the present invention, in any of aspects 1 and aspects 6 to 13, at least one of the first recess and the second recess may be a slit extending in a second direction perpendicular to a first direction in which the first surface and the second surface are opposite to each other.

[0100] The substrate of the fifteenth aspect of the present invention may be configured such that, in the fourteenth aspect, when the substrate is viewed in a plan perspective, the first recessed portion does not overlap with the second recessed portion.

[0101] An electronic device according to a sixteenth aspect of the present invention comprises an electronic element mounted on the substrate described in any one of the first to fifteenth aspects.

[0102] In an electronic module according to a seventeenth aspect of the present invention, the electronic device described in the sixteenth aspect is accommodated in a casing.

[0103] In a module device according to an eighteenth aspect of the present invention, the electronic module described in the seventeenth aspect is mounted on a module substrate or a housing.

[0104] The invention of the present disclosure is described above based on the various drawings and embodiments. However, the invention of the present disclosure is not limited to the above-mentioned embodiments. That is, the invention of the present disclosure can be variously modified within the scope shown in the present disclosure, and the embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention of the present disclosure. In other words, it should be noted that it is easy for those skilled in the art to make various deformations or modifications based on the present disclosure. It should also be noted that these deformations or modifications are included in the scope of the present invention.

[0105] Description of Reference Numerals

[0106] 1 module device

[0107] 2 Frame

[0108] 10 electronic modules

[0109] 11 Shell

[0110] 20 Electronic devices

[0111] 21 Electronic components

[0112] 30A, 30B, 30C, 30D, 30E substrate

[0113] 31 first conductor film layer

[0114] 32 second conductor film layer

[0115] 40A, 40B, 40C, 40D, 40E substrate

[0116] 41a Electronic component mounting area

[0117] 50, 60 concave parts

[0118] 50A, 60A first recess

[0119] 50B, 60B second recess

[0120] 51Metal components

[0121] 51A first metal component

[0122] 51B Second metal component

Claims

1. A substrate, wherein: have: A substrate including a first surface, a second surface located on the opposite side of the first surface, at least one first recess having an opening on the first surface, and at least one second recess having an opening on the second surface; a first metal component, located inside the first recess; as well as a second metal component, located inside the second recess; The thermal conductivity of the first metal member and the thermal conductivity of the second metal member are higher than the thermal conductivity of the base.

2. The substrate according to claim 1, wherein The base body has a plurality of the first recesses and a plurality of the second recesses.

3. The substrate according to claim 1 or 2, wherein When viewed from above, the shape of the opening of at least one of the first recess and the second recess is circular.

4. The substrate according to any one of claims 1 to 3, wherein The base body has a plurality of the first recesses and a plurality of the second recesses, The first recesses are arranged in a grid pattern on the first surface. The second recessed portions are provided so as to be arranged in a grid pattern on the second surface.

5. The substrate according to claim 4, wherein When the substrate is viewed in a plan perspective view, the first recessed portions and the second recessed portions are alternately arranged in at least one direction perpendicular to a first direction orthogonal to the first surface and the second surface.

6. The substrate according to any one of claims 1 to 5, wherein When the substrate is viewed in a plan perspective view, the first recess does not overlap with the second recess.

7. The substrate according to any one of claims 1 to 6, wherein When the base is viewed from a direction perpendicular to a first direction orthogonal to the first surface and the second surface, a portion of the first recess overlaps with the second recess.

8. The substrate according to any one of claims 1 to 7, wherein The total volume of the first metal member filled in the first recess is greater than or equal to 90 volume % and less than or equal to 110 volume % of the total volume of the second metal member filled in the second recess.

9. The substrate according to any one of claims 1 to 7, wherein It also has a first conductor film layer located on the first surface and a second conductor film layer located on the second surface, The sum of the volumes of the first metal component and the first conductor film layer filled in the first recess is greater than 90 volume % and less than 110 volume % of the sum of the volumes of the second metal component and the second conductor film layer filled in the second recess.

10. The substrate according to any one of claims 1 to 9, wherein In at least one cross-section cut along a first direction orthogonal to the first surface and the second surface, the width of the first recess in a direction parallel to the first surface decreases as the distance from the first surface increases, and the width of the second recess in a direction parallel to the first surface decreases as the distance from the second surface increases.

11. The substrate according to claim 10, wherein In at least one cross section cut along the first direction, the first recess and the second recess have a curved shape that is convex from a surface of the first surface or the second surface on which the first recess or the second recess is provided toward an opposite surface.

12. The substrate according to any one of claims 1 to 11, wherein The base has an electronic component mounting portion on the first surface. An opening area of ​​the second recess is smaller than an opening area of ​​the first recess.

13. The substrate according to claim 1, wherein The base has an electronic component mounting portion on the first surface. The second recess has a depth greater than that of the first recess.

14. The substrate according to any one of claims 1 to 12, wherein At least one of the first recess and the second recess is a slit extending in a second direction perpendicular to a first direction in which the first surface and the second surface are opposed to each other.

15. The substrate according to claim 14, wherein When the substrate is viewed in a plan perspective view, the first recess does not overlap with the second recess.

16. An electronic device, wherein: An electronic component is mounted on the substrate according to any one of claims 1 to 15.

17. An electronic module, wherein: The electronic device described in claim 16 is accommodated in a housing.

18. A module device, wherein: The electronic module according to claim 17 is mounted on a module substrate or a frame.

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