Substrate, electronic device, electronic module, and module device

Abstract

The heat conductivity of the substrate is improved. The substrate has a base body including a first surface and a second surface on an opposite side of the first surface. The base body is provided with at least one concave part, the at least one concave part is arranged on the first surface, the concave part is internally filled with a metal component, and the thermal conductivity of the metal component is higher than that of the base body. In a cross-section cut in a first direction orthogonal to the first surface and the second surface, a width of the recess in a direction parallel to the first surface decreases as a distance from a surface of the first surface and the second surface on which the recess is provided increases.

Description

Technical Field

[0001] The present invention relates to a substrate or the like on which parts such as electronic elements are mounted. Background Art

[0002] As disclosed in Patent Documents 1 and 2, there is known a substrate on which electronic components are mounted and on which thermal conductivity is improved so that heat generated from the electronic components can be rapidly diffused.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent document 1: International Publication No. 2018-117232.

[0006] Patent document 2: International Publication No. 2011-059070. Summary of the invention

[0007] A substrate according to one aspect of the present invention has a base, which includes a first surface and a second surface located on the opposite side of the first surface, the base having at least one recess, at least one of the recess being arranged on at least one of the first surface and the second surface, the interior of the recess being filled with a metal component, the metal component having a thermal conductivity higher than that of the base, and in at least one cross-section cut along a first direction orthogonal to the first surface and the second surface, the width of the recess in a direction parallel to the first surface decreases as the distance from the surface of the first surface and the second surface on which the recess is arranged increases. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a perspective view of the module device according to the first embodiment of the present invention.

[0009] Figure 2 is a top view of the above module device.

[0010] Figure 3 is along Figure 2 Cross-sectional view along line III-III.

[0011] Figure 4 It is a top view of the substrate according to Embodiment 1 of the present invention.

[0012] Figure 5 is along Figure 4 Sectional view along line VV.

[0013] Figure 6 It is a top view of a substrate according to Embodiment 2 of the present invention.

[0014] Figure 7 is along Figure 6Cross-sectional view taken along line VII-VII.

[0015] Figure 8 It is a top view of a substrate according to Embodiment 3 of the present invention.

[0016] Fig. 9 is along Figure 8 A cross-sectional view taken along line IX-IX.

[0017] Fig.10 is along Figure 8 Sectional view along line XX.

[0018] Fig.11 It is a top view of a substrate according to Embodiment 4 of the present invention.

[0019] Fig.12 This is a diagram of a substrate and an electronic component according to Embodiment 4 of the present invention as viewed from the Y-axis direction.

[0020] Fig.13 It is a top view of a substrate according to Embodiment 5 of the present invention.

[0021] Fig.14 This is a diagram of a substrate and an electronic component according to Embodiment 5 of the present invention as viewed from the Y-axis direction. DETAILED DESCRIPTION

[0022] In substrates on which components such as electronic elements are mounted, substrates having further improved thermal conductivity are desired.

[0023] According to one aspect of the present invention, thermal conductivity can be improved.

[0024] [Implementation method 1]

[0025] Hereinafter, one embodiment of the present invention will be described in detail. Figure 1 It is a perspective view of the module device 1 in this embodiment. Figure 2 is a top view of the module device 1. Figure 2 In the figure, for the convenience of explanation, the upper surface of the housing 11 described later is omitted. Figure 3 is along Figure 2 In the following description, Figure 1 The X-axis direction in the module device 1 is described as the second direction (left-right direction), the Y-axis direction is described as the third direction (front-back direction), and the Z-axis direction is described as the first direction (up-down direction) of the module device 1. Figure 1 The +X axis direction is described as the right direction, the -X axis direction is described as the left direction, the +Y axis direction is described as the backward direction, the -Y axis direction is described as the forward direction, the +Z axis direction is described as the upward direction, and the -Z axis direction is described as the downward direction.

[0026] like Figure 1 to Figure 3 As shown, the module device 1 has an electronic module 10 and a frame 2 on which the electronic module 10 is mounted. The frame 2 may be composed of a cooling plate, for example. Thus, the electronic module 10 can be cooled. The number of electronic modules in the module device 1 may be one or more than two. The electronic module 10 may also be mounted on a module substrate not shown in the figure instead of being mounted on the frame 2.

[0027] like Figure 2 and Figure 3 As shown, the electronic module 10 comprises a housing 11 , a fixing component 12 and an electronic device 20 .

[0028] The housing 11 has a storage space 11a in the center in the second direction (left-right direction), and the electronic device 20 is stored in the storage space 11a. The housing 11 is fixed to the frame 2 by a fixing member 12. The fixing member 12 may be a screw, for example. The housing 11 may also be made of metal.

[0029] like Figure 3 As shown, the electronic device 20 includes an electronic component 21 , a substrate 30A, a metal plate 22 , and a heat sink 23 in order from top to bottom.

[0030] The electronic element 21 in the present embodiment is constituted by a laser diode or the like capable of emitting laser light, and the electronic device 20 irradiates the outside with the laser light emitted from the electronic element 21 .

[0031] In the electronic device 20, the heat generated when the electronic element 21 is operated is conducted to the radiator 23 via the substrate 30A and the metal plate 22, and the heat is dissipated by the radiator 23. Therefore, the substrate 30A is required to have high heat dissipation. In addition, part of the heat conducted to the radiator 23 is conducted to the frame 2 composed of the cooling plate via the housing 11, and the heat is dissipated in the frame 2.

[0032] The substrate 30A may be an electronic component mounting substrate for mounting the electronic component 21. The substrate 30A may be used for mounting heat generating components other than the electronic component. Figure 4 is a top view of the substrate 30A. Figure 4 In FIG. 1 , for convenience of explanation, an electronic component mounting portion 41 a and a recess 50 to be described later are indicated by dotted lines. Figure 5 is along Figure 4 The cross-sectional view along the VV line. Figure 5 In FIG. 2 , an electronic component 21 is also shown. Figure 5 In FIG. 5 , the recess 50 is indicated by a dotted line. Figure 4 and Figure 5 As shown, the substrate 30A has a base 40A, a first conductor film layer 31 , a second conductor film layer 32 and a metal component 51 .

[0033] The substrate 40A may be composed of a single layer or a plurality of layers. Figure 5 As shown in FIG. 1 , the substrate 40A in this embodiment is a single-layer insulating layer. The substrate 40A has a first surface 41 on which the electronic element 21 is mounted, and a second surface 42 located on the opposite side of the first surface. The first surface 41 and the second surface 42 are opposite to each other. Figure 4 As shown, the first surface 41 has an electronic component mounting portion 41 a on which the electronic component 21 is mounted at the center portion in the second direction (left-right direction).

[0034] The shape of the base body 40A when viewed from above is not particularly limited, and may be, for example, rectangular, circular, etc. The base body 40A in the present embodiment has a rectangular shape when viewed from above.

[0035] The substrate 40A may also have insulating properties. In this case, the material of the substrate 40A may be, for example, ceramics such as an aluminum nitride sintered body, an aluminum oxide sintered body (alumina ceramics), a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. When the material of the substrate 40A is an aluminum nitride sintered body, the substrate 40A contains aluminum nitride as a main component. In this case, when the mass of the substrate 40A is set to 100 mass %, the substrate 40A contains more than 80 mass % of aluminum nitride. The substrate 40A may also contain more than 95 mass % of aluminum nitride. Thus, it is easy to make the thermal conductivity of the substrate 40A more than 170 W / mK, and therefore, the heat dissipation of the substrate 40A can be improved.

[0036] The base 40A has at least one recess 50 on the first surface 41. In the present embodiment, the base 40A has a plurality of recesses 50 on the first surface 41. The recess 50 may be a cavity structure. When the substrate 30A is viewed from the Z-axis direction, the shape of the opening of the recess 50 may be circular. The recess 50 has a bottom. When the base 40A has a plurality of recesses 50, the arrangement method of the plurality of recesses 50 is not particularly limited, for example, Figure 4 As shown, the four adjacent recesses 50 may be arranged at the vertices of the rectangle. In other words, the plurality of recesses 50 may be arranged in a grid-like manner. Thus, when the substrate 30A is viewed from above, the plurality of recesses 50 are evenly arranged, so that the heat dissipation of the substrate 30A is unlikely to vary.

[0037] like Figure 5 As shown in FIG. 1 , in a cross section cut by a plane parallel to a first direction (i.e., a vertical direction) orthogonal to the first surface 41 and the second surface 42, the concave portion 50 becomes thinner as the distance from the first surface 41 increases. In other words, in a cross section cut by a plane parallel to the first direction, as the distance from the first surface 41 where the concave portion 50 is provided increases, the width of the concave portion 50 in the second direction becomes smaller. As for the shape of the concave portion 50, as shown in FIG. Figure 5As shown, in the cross section cut along the first direction, the first surface 41 toward the second surface 42 may be a convex curved shape. For example, the cross section of the recess 50 cut along a plane parallel to the first direction may be an elliptical hemispherical shape. In this specification, the description of "flat" or "plane" does not require a strict flatness or a strict plane.

[0038] The concave portion 50 can be formed by performing sandblasting on the first surface 41. The concave portion 50 is formed by performing sandblasting. Figure 5 As shown, the inner surface of the recessed portion 50 can be formed into a curved shape.

[0039] In the present embodiment, the opening areas of the plurality of recesses 50 when the base 40A is viewed from above are the same, but the present invention is not limited thereto, and the opening areas of the plurality of recesses 50 may be different from each other. An example in which the opening areas of the plurality of recesses 50 are different will be described in Embodiment 2. In the present embodiment, the depths of the plurality of recesses 50 are the same, but the present invention is not limited thereto, and the depths of the plurality of recesses 50 may be different from each other.

[0040] The inside of the recess 50 is filled with a metal component 51, which has a higher thermal conductivity than the thermal conductivity of the base 40A. As long as the metal component 51 has a higher thermal conductivity than the base 40A, it is not particularly limited. For example, when the material of the base 40A is an aluminum nitride sintered body, it can be copper, copper-tungsten, copper-molybdenum, aluminum, etc. By filling the inside of the recess 50 with the metal component 51, the thermal conductivity of the substrate 30A can be improved. The metal component 51 can be filled in the recess 50 using a plating method such as an electroplating method or a metallization method.

[0041] In the substrate 30A of one embodiment of the present invention, a thin film layer (not shown) may be provided on the surface of the recess 50 and the surface of the first surface 41. The thin film layer may be composed of, for example, tantalum nitride, nickel-chromium, nickel-chromium-silicon, tungsten-silicon, molybdenum-silicon, tungsten, molybdenum, titanium, chromium, etc. The thin film layer can be formed by a forming technique such as evaporation, ion plating, sputtering, etc. By forming the thin film layer on the surface of the recess 50, the metal component 51 can be well filled into the recess 50 and the first conductor film layer 31 can be formed on the first surface 41, and the inner surface of the recess 50 and the metal component 51 can be well bonded, the first surface 41 and the first conductor film layer 31 can be well bonded, and the metal component 51 and the first conductor film layer 31 can be well bonded.

[0042] Here, if the ratio of the volume of the metal member 51 filled in the plurality of recesses 50 is large relative to the volume of the base 40A including the recesses 50, the base 40A warps due to the difference in the thermal expansion coefficient of the base 40A and the thermal expansion coefficient of the metal member 51. If the base 40A warps, the contact area between the metal plate 22 and the base 40A becomes smaller. As a result, it is difficult to cause heat transfer from the base 40A to the metal plate 22, and the heat dissipation of the electronic device 20 decreases. Therefore, in the substrate 30A of one embodiment of the present invention, the sum of the volumes of the metal member 51 filled in the plurality of recesses 50 can be set to be 10% or less relative to the volume of the base 40A including the recess 50. As a result, the warping amount of the base 40A can be reduced, and therefore, it is difficult to reduce the heat dissipation of the electronic device 20. When there is only one recess 50, the sum of the volumes of the metal member 51 represents the volume of the metal member 51 filled in the recess 50.

[0043] like Figure 5 As shown, the first conductor film layer 31 is located on the first surface 41 of the substrate 40A. The first conductor film layer 31 is connected to the metal component 51 filled in the recess 50. Figure 5 As shown, the first conductor film layer 31 is connected to the metal parts 51 filled in the plurality of recesses 50 formed in the base 40A. The first conductor film layer 31 is made of a material with excellent conductivity such as copper. The first conductor film layer 31 is formed on the first surface 41 in two regions. One of the first conductor film layers 31 carries the electronic component 21. The other first conductor film layer 31 is used as a connection part of a connection part 33 such as a bonding wire to electrically connect the electronic component 21 to the wiring conductor of the wiring substrate not shown. As described later, since the first conductor film layer 31 is made of a thin film, in this specification, "the electronic component 21 is mounted on the first conductor film layer 31" and "the electronic component 21 is mounted on the electronic component mounting part 41a of the first surface 41" are explained in the same meaning.

[0044] The first conductor film layer 31 is formed on the first surface 41 and has a higher thermal conductivity than the thermal conductivity of the substrate 40A. As long as the first conductor film layer 31 has a higher thermal conductivity than the substrate 40A, it is not particularly limited. For example, when the material of the substrate 40A is an aluminum nitride sintered body, it can be copper, copper-tungsten, copper-molybdenum, aluminum, etc. By forming the first conductor film layer 31 on the first surface 41, the thermal conductivity of the substrate 30A can be improved. The first conductor film layer 31 can be formed on the first surface 41 using a plating method such as an electroplating method or a metallization method. As described above, a thin film layer not shown in the figure can also be provided on the surface of the first surface 41. If the first conductor film layer 31 and the metal component 51 are formed of the same material, for example, the first conductor film layer 31 and the metal component 51 are formed of copper, then heat can be well transferred from the first conductor film layer 31 to the metal component 51. After the electronic element 21 is fixed to one first conductive film layer 31 by a bonding material such as In or Au—Sn, the electrodes of the electronic element 21 are electrically connected to the other first conductive film layer 31 via a connection member 33 such as a bonding wire and mounted on the substrate 30A.

[0045] A plating layer may also be formed on the upper surface of the first conductor film layer 31. The plating layer may be made of a metal such as nickel, copper, gold, or silver that has excellent corrosion resistance and connectivity with the connection component 33. The plating layer may be formed, for example, by sequentially bonding a nickel plating layer having a thickness of 0.5 to 5 μm and a gold plating layer having a thickness of 0.1 to 3 μm. This can reduce the possibility of corrosion of the first conductor film layer 31, and can make the first conductor film layer 31 and the electronic element 21 fixed and the first conductor film layer 31 and the connection component 33 firmly bonded.

[0046] The second conductor film layer 32 is located on the second surface 42 of the substrate 40A. The second conductor film layer 32 may also have the same material and structure as the first conductor film layer 31. The second conductor film layer 32 is used to be bonded to the metal plate 22. If the second conductor film layer 32 and the metal component 51 are formed of the same material, for example, the second conductor film layer 32 and the metal component 51 are formed of copper, heat can be well transferred from the metal component 51 to the second conductor film layer 32.

[0047] As described above, for the substrate 30A in the present embodiment, a recess 50 is formed on the first surface on which the electronic component 21 is mounted, and the width of the recess 50 in the second direction decreases as the distance from the first surface 41 increases in the cross section cut by a plane parallel to the first direction. Thus, for example, compared with the case where the recess 50 is a rectangular parallelepiped, the surface area of ​​the recess 50 can be increased. As a result, it is easy to move heat from the metal component 51 to the base 40A. Thus, the thermal conductivity of the substrate 30A can be improved. In addition, a recess 50 can be formed on the first surface 41 on which the electronic component 21 is mounted, and the width of the recess 50 in the front-to-back direction decreases as the distance from the first surface 41 increases in the cross section cut by a plane parallel to the first direction.

[0048] Here, when the recess 50 is formed in a rectangular parallelepiped shape along the first direction, if a load parallel to the first direction is applied to the substrate 30A, stress is concentrated on the corners of the rectangular parallelepiped shape, and thus the substrate is easily damaged. Figure 5 As shown, the shape of the recessed portion 50 is a curved shape that is convex from the first surface 41 toward the second surface 42 in a cross section cut along the first direction. Thus, when a load in the first direction is applied to the substrate 30A, the stress applied to the surface where the recessed portion 50 is formed can be dispersed. As a result, the possibility of damage to the substrate 30A can be reduced.

[0049] In the substrate 30A, as Figure 5 As shown, the metal member 51 filled in the recess 50 is in contact with the first conductor film layer 31. Thus, the heat conducted from the electronic element 21 to the first conductor film layer 31 is easily conducted to the metal member 51. Therefore, the thermal conductivity of the substrate 30A can be improved.

[0050] The substrate 30A in this embodiment is equipped with a laser diode as the electronic element 21. The electronic element mounted on the substrate 30A is not limited to the laser diode. For example, the electronic element mounted on the substrate 30A can be a semiconductor element such as an IC chip or an LSI chip, or a piezoelectric element such as a crystal oscillator or a piezoelectric oscillator.

[0051] [Implementation method 2]

[0052] For the sake of convenience, components having the same functions as those described in the above embodiments are given the same reference numerals and will not be described again.

[0053] Figure 6 It is a top view of the substrate 30B in this embodiment. Figure 7 is along Figure 6 The sectional view along the line VII-VII. Figure 7 In FIG. 2 , an electronic component 21 is also shown.

[0054] like Figure 6 and Figure 7 As shown, the substrate 30B includes a base 40B instead of the base 40A in the first embodiment.

[0055] In the base 40B, a plurality of recesses 50 filled with metal parts 51 are formed on the first surface 41. In the base 40B, the opening diameter of the recess 50 decreases as it moves from the central portion in the second direction of the first surface 41 on which the electronic component 21 is mounted toward the outside. Thus, in the substrate 30B, when viewed from above, the opening area of ​​the recess 50 increases as it moves from the outside in the second direction toward the electronic component mounting portion 41a. In addition, in the base 40B, the opening diameter of the recess 50 decreases as it moves from the central portion in the third direction of the first surface 41 on which the electronic component 21 is mounted toward the outside. Thus, in the substrate 30B, when viewed from above, the opening area of ​​the recess 50 increases as it moves from the outside in the third direction toward the electronic component mounting portion 41a. With the above configuration, when the base 40B is viewed from above, the opening area of ​​the recess 50 provided in the electronic component mounting portion 41a or a region close to the electronic component mounting portion 41a is larger than the opening area of ​​the recess 50 provided in a region away from the electronic component mounting portion 41a.

[0056] By having the above structure, in the base 40B, in the electronic component mounting portion 41a or the area near the electronic component mounting portion 41a where the recessed portion 50 with a large opening area is formed, it is easy to transfer heat to the inside of the base 40B. In other words, when the substrate 30B is viewed from above, the thermal conductivity near the electronic component mounting portion 41a is higher than that of the outer edge. As a result, it is easy to efficiently transfer the heat conducted from the electronic component 21 to the metal plate 22, and it is easy to reduce the temperature of the electronic component 21.

[0057] [Implementation method 3]

[0058] Other embodiments of the present invention will be described below. Figure 8 It is a top view of the substrate 30C in this embodiment. Fig. 9 is along Figure 8 A cross-sectional view taken along line IX-IX. Fig.10 is along Figure 8 Sectional view along line XX.

[0059] like Figure 8 to Figure 10 As shown, the substrate 30C includes a base 40C instead of the base 40A in the first embodiment.

[0060] In the base body 40C, a plurality of recesses 60 filled with metal components 51 are formed on the first surface 41. Figure 8 and Fig. 9 As shown in FIG. 1 , the recess 60 is a slit extending in a second direction (left-right direction) which is perpendicular to the first direction (up-down direction). Figure 8As shown, when the substrate 40C is viewed from above, the recess 60 may be provided in a region overlapping with the first conductive film layer 31. The recess 60 in this embodiment is formed so that the length in the second direction is the same as the length in the second direction of the first conductive film layer 31, but may be shorter than the length in the second direction of the first conductive film layer 31. In this specification, the term "vertical" does not require strict verticality.

[0061] like Fig.10 As shown, in the cross section cut along the plane perpendicular to the second direction, as the distance from the first surface 41 increases, the length of the recess 60 in the third direction (front-rear direction) decreases. Thus, for example, compared with the case where the shape of the cross section cut along the plane perpendicular to the second direction is a rectangular shape, the surface area of ​​the recess 60 can be increased. As a result, heat can be easily transferred from the metal member 51 to the base 40C. Thus, the thermal conductivity of the substrate 30C can be improved.

[0062] The recessed portion 60 in this embodiment is a slit extending in the second direction, but is not limited thereto. The recessed portion 60 may be a slit extending in any direction perpendicular to the first direction, for example, a slit extending in the third direction. The slit may be formed by sandblasting the first surface 41 of the substrate 40C, as in the above embodiment.

[0063] [Implementation method 4]

[0064] Other embodiments of the present invention will be described below. Fig.11 FIG. 3 is a top view of the substrate 30D in this embodiment. Fig.11 In FIG. 1 , for convenience of explanation, the recessed portion 50 formed on the second surface 42 is shown with hatching. Fig.12 This is a diagram of the substrate 30D and the electronic component 21 as viewed from the third direction (front-rear direction). Fig.12 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0065] like Fig.11 and Fig.12 As shown, the substrate 30D includes a base 40D instead of the base 40A in the first embodiment.

[0066] The base 40D has a plurality of recesses 50 filled with metal components 51 on the first surface 41 and the second surface 42. In the following description, the recesses 50 provided on the first surface 41 are sometimes described separately from the first recesses 50A, and the recesses 50 provided on the second surface 42 are sometimes described separately from the second recesses 50B. Fig.11As shown, the base 40D can be configured so that four adjacent recesses 50 on the first surface 41 and the second surface 42 are located at the vertices of a rectangle. In other words, the plurality of recesses 50 can be arranged in a grid-like manner. Thus, when the substrate 30D is viewed from above, the plurality of recesses 50 are evenly arranged on the first surface 41 and the second surface 42, so that the heat dissipation of the substrate 30D is unlikely to deviate. Fig.11 and Fig.12 In the illustrated example, in the substrate 30D, the metal member 51 filled in the second recess 50B formed on the second surface 42 is connected to the second conductor film layer 32 .

[0067] When the base 40D is viewed from above, the first recessed portions 50A formed on the first surface 41 and the second recessed portions 50B formed on the second surface 42 may be arranged alternately in at least one direction perpendicular to the first direction. Fig.11 On the straight line L shown, the centers of the openings of the first recessed portions 50A formed on the first surface 41 and the centers of the openings of the second recessed portions 50B formed on the second surface 42 are alternately arranged. With the above structure, the first recessed portions 50A and the second recessed portions 50B can be discontinuous. Thus, the first conductive film layer 31 and the second conductive film layer 32 can be electrically disconnected.

[0068] When viewed from a perspective in a direction perpendicular to the first direction, the base 40D may have at least one set of recesses 50, wherein a portion of a first recess 50A disposed on the first surface overlaps with a second recess 50B disposed on the second surface. Fig.12 As shown, this structure can be realized by forming the first recess 50A formed on the first surface 41 to be deeper than the center of the first direction of the base 40D and forming the second recess 50B formed on the second surface 42 to be deeper than the center of the first direction of the base 40D. According to this structure, since the volume of the recess 50 formed in the base 40D can be increased, the thermal conductivity of the substrate 30D can be improved.

[0069] Here, when the sum of the volume of the metal member 51 filled in the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 is greatly different from the sum of the volume of the metal member 51 filled in the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32, the base body 40D warps due to the difference in thermal expansion coefficient between the base body 40D and the thermal expansion coefficient of the metal member 51. Therefore, in the substrate 30D, the sum of the volume of the metal member 51 filled in the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 may be set to be 90 volume % or more and 110 volume % or less of the sum of the volume of the metal member 51 filled in the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32. Thus, the warpage amount of the base body 40D can be reduced. In the case where the substrate 30D does not have both the first conductor film layer 31 and the second conductor film layer 32, the sum of the volumes of the metal components 51 filled in the plurality of first recesses 50A provided on the first surface 41 may be set to be greater than 90 volume % and less than 110 volume % of the sum of the volumes of the metal components 51 filled in the plurality of second recesses 50B provided on the second surface 42.

[0070] As described above, in the substrate 30D of the present embodiment, the base 40D has a plurality of recesses 50 filled with metal members 51 on the first surface 41 and the second surface 42. Thus, the volume of the metal members 51 included in the base 40D can be increased compared to the base 40A of the first embodiment, and thus the thermal conductivity of the substrate 30D can be improved.

[0071] In the substrate 30D of the present embodiment, the recessed portion 50 formed on the first surface 41 and the second surface 42 is a cavity structure, but is not limited thereto. In the substrate 30D of one embodiment of the present invention, a plurality of recessed portions 50 may be formed on one of the first surface 41 and the second surface 42, and a recessed portion 60 of the slit structure described in Embodiment 3 may be formed on the other surface. In addition, in the substrate 30D of one embodiment of the present invention, a recessed portion 60 of the slit structure may be formed on the first surface 41 and the second surface 42.

[0072] [Implementation method 5]

[0073] Other embodiments of the present invention will be described below. Fig.13 FIG. 3 is a top view of the substrate 30E in this embodiment. Fig.13 In FIG. 1 , for convenience of explanation, the recessed portion 50 formed on the second surface 42 is shown with hatching. Fig.14 This is a diagram of the substrate 30E and the electronic component 21 as viewed from the third direction (front-rear direction). Fig.14 In FIG. 5 , the recess 50 is indicated by a dotted line.

[0074] like Fig.13 and Fig.14 As shown, the substrate 30E includes a base 40E instead of the base 40A in the first embodiment.

[0075] The base 40E has a plurality of recesses 50 filled with metal components 51 on the first surface 41 and the second surface 42. In the base 40E of the present embodiment, Fig.14 As shown, the depth of the second recess 50B provided on the second surface 42 is deeper than the depth of the first recess 50A provided on the first surface 41, and the second surface 42 is located at a position farther from the electronic component 21 as a heat source than the first surface 41. As a result, the distance between the first recess 50A provided on the first surface 41 and the second recess 50B provided on the second surface 42 can be reduced, so that heat can be easily transferred from the metal component 51 filled in the first recess 50A provided on the first surface 41 to the metal component 51 filled in the second recess 50B provided on the second surface 42. As a result, the heat dissipation of the substrate 30E can be improved. The depth of the recess 50 represents the distance in the Z-axis direction from the first surface 41 or the second surface 42 where the recess 50 is provided to the bottom of the recess 50.

[0076] As described in Embodiment 4, when the sum of the volume of the metal member 51 filled in the plurality of first recesses 50A provided on the first surface 41 and the volume of the first conductor film layer 31 is greatly different from the sum of the volume of the metal member 51 filled in the plurality of second recesses 50B provided on the second surface 42 and the volume of the second conductor film layer 32, the base body 40E may warp. Fig.14 As shown, the base 40E in this embodiment can be configured so that the opening area of ​​the second recess 50B formed on the second surface 42 is smaller than the opening area of ​​the first recess 50A formed on the first surface 41. Thus, the volume of the first recess 50A formed on the first surface 41 and the volume of the second recess 50B formed on the second surface 42 are not greatly different. Thus, the warping amount of the base 40E can be reduced.

[0077] The invention of the present invention has been described above based on the drawings and embodiments. However, the invention of the present invention is not limited to the above-mentioned embodiments. That is, the invention of the present invention can be variously modified within the scope shown in the present invention, and the embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. That is, it should be noted that those skilled in the art can easily make various deformations or modifications according to the present invention. In addition, it should also be noted that these deformations or modifications are included in the scope of the present invention.

[0078] The substrate of scheme 1 of the present invention has a base, which includes a first surface and a second surface located on the opposite side of the first surface, the base has at least one recessed portion, and at least one recessed portion is provided on at least one of the first surface and the second surface. A metal component is filled inside the recessed portion, and the metal component has a thermal conductivity higher than that of the base. In at least one cross-section cut along a first direction orthogonal to the first surface and the second surface, the width of the recessed portion in a direction parallel to the first surface decreases as the distance from the surface of the first surface and the second surface on which the recessed portion is provided increases.

[0079] The substrate of scheme 2 of the present invention, based on the above-mentioned scheme 1, can be formed into a curved shape for the shape of the recessed portion, in at least one cross-section cut along the first direction, from the surface on which the recessed portion is provided in the first surface and the second surface toward the opposite side.

[0080] In the substrate according to claim 3 of the present invention, in addition to the above-mentioned claim 1 or 2, the base body may have the recessed portion only on one of the first surface and the second surface.

[0081] According to a fourth aspect of the present invention, in the substrate of the third aspect, the sum of the volumes of the metal member filled in the interior of the recess may be 10 volume % or less relative to the volume of the base including the recess.

[0082] The substrate of scheme 5 of the present invention, based on the above-mentioned scheme 3 or 4, the base may have the recessed portion only on any one of the first surface and the second surface, the surface of the first surface and the second surface on which the recessed portion is provided may have a conductor film layer, and the metal part filled in the recessed portion may be in contact with the conductor film layer.

[0083] In the substrate according to claim 6 of the present invention, based on the above-mentioned claim 1 or 2, the recessed portion may include a first recessed portion provided on the first surface and a second recessed portion provided on the second surface.

[0084] The substrate of scheme 7 of the present invention, based on the above-mentioned scheme 6, may include at least one first recess arranged on the first surface and at least one second recess arranged on the second surface, and the sum of the volumes of the metal parts filled in the interior of the first recess may be greater than 90 volume % and less than 110 volume % of the sum of the volumes of the metal parts filled in the interior of the second recess.

[0085] The substrate of Scheme 8 of the present invention, based on Scheme 6 above, may also have a first conductor film layer located on the first surface and a second conductor film layer located on the second surface, the recess may include at least one first recess arranged on the first surface and at least one second recess arranged on the second surface, and the sum of the volume of the metal component filled in the interior of the first recess and the volume of the first conductor film layer may be greater than 90 volume % and less than 110 volume % of the sum of the volume of the metal component filled in the interior of the second recess and the volume of the second conductor film layer.

[0086] The substrate according to claim 9 of the present invention may be configured such that, in any one of claims 6 to 8, the first recessed portion and the second recessed portion are discontinuous.

[0087] The substrate of claim 10 of the present invention, based on any one of claims 6 to 9, may be configured such that the base has an electronic component mounting portion on the first surface, and an opening area of ​​the second recess is smaller than an opening area of ​​the first recess.

[0088] The substrate of claim 11 of the present invention, based on any one of claims 6 to 9, may be configured such that the base has an electronic component mounting portion on the first surface, and the second recess has a depth greater than that of the first recess.

[0089] The substrate according to claim 12 of the present invention, in any one of claims 1 to 11, may be configured such that the opening of the recessed portion has a circular shape in a plan view.

[0090] According to claim 13 of the present invention, in the substrate according to claim 12, a plurality of the recesses may be arranged in a grid pattern on the first surface or the second surface.

[0091] The substrate according to claim 14 of the present invention, in addition to any one of claims 1 to 11, may be configured such that the recessed portion is a slit extending in a second direction perpendicular to the first direction.

[0092] The electronic device according to claim 15 of the present invention includes an electronic component mounted on the substrate according to any one of claims 1 to 14 above.

[0093] In the electronic module of solution 16 of the present invention, the electronic device described in solution 15 is accommodated in a housing.

[0094] In the module device according to claim 17 of the present invention, the electronic module according to claim 16 is mounted on a module substrate or a housing.

[0095] Description of Reference Numerals

[0096] 1 module device;

[0097] 2 frame;

[0098] 10 Electronic modules;

[0099] 11 housing;

[0100] 20 Electronic devices;

[0101] 21 Electronic components;

[0102] 30A, 30B, 30C, 30D, 30E substrate;

[0103] 31 a first conductor film layer;

[0104] 32 second conductor film layer;

[0105] 40A, 40B, 40C, 40D, 40E substrate;

[0106] 41a electronic component mounting portion;

[0107] 50, 60 concave parts;

[0108] 50A first recess;

[0109] 50B second recess;

[0110] 51 Metal parts.

Claims

1. A substrate, wherein: The substrate has a base body, the base body including a first surface and a second surface located on the opposite side of the first surface, The base has at least one recessed portion, and the at least one recessed portion is provided on at least one of the first surface and the second surface. The interior of the recess is filled with a metal component having a thermal conductivity higher than that of the base body, In at least one cross section taken along a first direction orthogonal to the first surface and the second surface, a width of the recess in a direction parallel to the first surface decreases as the distance from a surface of the first surface and the second surface where the recess is provided increases.

2. The substrate according to claim 1, wherein The shape of the recessed portion is formed into a curved shape from a surface of the first surface and the second surface where the recessed portion is provided toward an opposite surface in at least one cross section cut along the first direction.

3. The substrate according to claim 1 or 2, wherein The base body has the recessed portion only on one of the first surface and the second surface.

4. The substrate according to claim 3, wherein The sum of the volumes of the metal member filled in the interior of the recess is 10 volume % or less relative to the volume of the base including the recess.

5. The substrate according to claim 3 or 4, wherein The base has the recessed portion only on one of the first surface and the second surface. The surface of the first surface and the second surface where the recess is provided has a conductor film layer, The metal member filled in the recess is in contact with the conductor film layer.

6. The substrate according to claim 1 or 2, wherein The recessed portion includes a first recessed portion provided on the first surface and a second recessed portion provided on the second surface.

7. The substrate according to claim 6, wherein The recessed portion includes at least one first recessed portion disposed on the first surface and at least one second recessed portion disposed on the second surface, The sum of the volumes of the metal members filled in the first recess is 90 volume % or more and 110 volume % or less of the sum of the volumes of the metal members filled in the second recess.

8. The substrate according to claim 6, wherein The substrate also has a first conductor film layer located on the first surface and a second conductor film layer located on the second surface. The recessed portion includes at least one first recessed portion disposed on the first surface and at least one second recessed portion disposed on the second surface, The sum of the volume of the metal component filled in the first recess and the volume of the first conductor film layer is greater than or equal to 90 volume % and less than or equal to 110 volume % of the sum of the volume of the metal component filled in the second recess and the volume of the second conductor film layer.

9. The substrate according to any one of claims 6 to 8, wherein The first recessed portion and the second recessed portion are discontinuous.

10. The substrate according to any one of claims 6 to 9, wherein The base has an electronic component mounting portion on the first surface. An opening area of ​​the second recess is smaller than an opening area of ​​the first recess.

11. The substrate according to any one of claims 6 to 9, wherein The base has an electronic component mounting portion on the first surface. The second recess has a depth greater than that of the first recess.

12. The substrate according to any one of claims 1 to 11, wherein The opening of the recessed portion has a circular shape in a plan view.

13. The substrate according to claim 12, wherein The plurality of recesses are arranged in a grid pattern on the first surface or the second surface.

14. The substrate according to any one of claims 1 to 11, wherein The recess is a slit extending along a second direction perpendicular to the first direction.

15. An electronic device, wherein: An electronic component is mounted on the substrate according to any one of claims 1 to 14.

16. An electronic module, wherein: The electronic device described in claim 15 is accommodated in a housing.

17. A module device, wherein: The electronic module according to claim 16 is mounted on a module substrate or a frame.

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