Chip assembly and ink box

Abstract

The invention provides a chip assembly and an ink box with the chip assembly, the chip assembly is used for forming electric contact with a contact pin to establish communication connection with imaging equipment, the chip assembly comprises a chip, an elastic piece, a conductive piece and a positioning plate for accommodating the chip, the chip comprises a substrate and a plurality of contact parts arranged on the substrate, and the elastic piece is arranged on the substrate. The substrate is provided with a first side and a second side which are oppositely arranged, and a third side located between the first side and the second side; the plurality of contact parts comprise a front contact part arranged on the first side and a back contact part not arranged on the first side; the first group of contact parts are arranged on the first side and are used for directly forming electric contact with the contact pins; the second group of contact parts are at least arranged on the second side or the third side, and the second group of contact parts are configured to be used for indirectly forming electric contact with the contact pin through the conductive piece under the action of the elastic piece; the density of the contacts of the chip substrate can be reduced, and the possibility of short circuit is reduced.

Description

[0001] The present patent application claims the priority of the Chinese prior application entitled “Imaging Material Box” and application number 202322242221.7 filed by the present applicant on August 18, 2023, the Chinese prior application entitled “Imaging Material Box” and application number 202322338135.6 filed on August 29, 2023, and the prior application entitled “Imaging Material Box” and application number 202322496455.4 filed on September 13, 2023, the entire contents of which are cross-referenced in the present application. Technical Field

[0002] The present invention relates to the field of imaging, and in particular to a chip assembly and an ink cartridge detachably installed in an imaging device. Background Art

[0003] Existing imaging devices include laser printers, copiers, inkjet printers, etc., and boxes containing imaging materials are installed in these imaging devices. The imaging materials are different depending on the type of imaging device. For example, when the imaging device is a laser printer, the imaging material is toner, and when the imaging device is an inkjet printer, the imaging material is ink.

[0004] Typically, in order to establish a communication connection between the box and the imaging device, a chip assembly including a chip and a substrate is installed on the box. When the box is installed to a predetermined position of the imaging device, the contact portion of the chip assembly contacts the contact pin of the imaging device. Multiple contact portions of existing chips are arranged on the same side of the same substrate. In the limited surface area of ​​the substrate, the arrangement density of these contact portions is relatively large, and the design of the contact portions will be greatly restricted. At the same time, these closely arranged contact portions are also prone to short circuits. Summary of the invention

[0005] The present invention provides a chip assembly and ink cartridge using the following technical solutions to solve or optimize at least one of the above technical problems. The specific technical solutions are:

[0006] A first aspect of the present invention provides a chip assembly, which is arranged on a cartridge that is detachably mounted on an imaging device having a contact pin, and is used to form electrical contact with the contact pin to establish a communication connection with the imaging device. The chip assembly includes a chip, an elastic member, a conductive member, and a positioning plate for accommodating the chip, and the chip includes a substrate and a plurality of contact portions arranged on the substrate, the substrate having a first side and a second side that are relatively arranged and a third side located between the first side and the second side; the plurality of contact portions include a front contact portion arranged on the first side and a back contact portion that is not arranged on the first side; a first group of contact portions are arranged on the first side for directly forming electrical contact with the contact pin; a second group of contact portions are arranged on at least the second side or the third side, and the second group of contact portions are configured to indirectly form electrical contact with the contact pin through the conductive member under the action of the elastic member.

[0007] Furthermore, the conductive member forms electrical contact with the second group of contact portions under the pressure of the elastic member.

[0008] Further, the second group of contact portions is at least partially arranged on the second side, and the elastic member presses the conductive member so that the reverse conductive member is in electrical contact with the second group of contact portions on the second side.

[0009] Furthermore, a chip accommodating cavity for accommodating a chip is provided on the positioning plate.

[0010] Furthermore, the positioning plate is provided with a card slot for card-connecting the chip, and the card slot is open toward at least one of the -y direction, the +y direction, the -z direction and the +z direction.

[0011] Furthermore, at least one of the conductive member and the elastic member is disposed in the chip accommodating cavity.

[0012] Further, the elastic member is conductive, and the conductive member forms electrical contact with the second group of contact portions through the elastic member.

[0013] Further, the second group of contact portions is at least partially arranged on the third side, and the reverse conductive member forms indirect electrical contact with the second group of contact portions through the elastic member.

[0014] Furthermore, the elastic member is configured as a cantilever integrally formed with the positioning plate or as a spring separately formed with the positioning plate.

[0015] On the other hand, the present invention also provides an ink cartridge that can be detachably installed in an imaging device having a contact pin. The ink cartridge includes a shell for containing ink, and the ink cartridge includes a chip component that is arranged on the shell. The chip component is used to form an electrical contact with the contact pin to establish a communication connection with the imaging device.

[0016] The present invention can reduce the density of chip substrate contacts and reduce the possibility of short circuit.

[0017] In order to more clearly illustrate the above-mentioned objectives, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of the ink cartridge involved in the present invention.

[0019] Figure 2A It is an exploded view of the chip assembly and the shell after being separated according to the first embodiment of the present invention.

[0020] Figure 2B It is a three-dimensional diagram of the chip after the second group of contact parts in the chip assembly involved in the first embodiment of the present invention are deformed.

[0021] Figure 3A It is a three-dimensional diagram of the second positioning plate in the chip assembly involved in the first embodiment of the present invention.

[0022] Figure 3B is along Figure 3A After cutting along the AA direction, the side view observed along the z direction.

[0023] Figure 4 This is an exploded view of the chip assembly according to the first embodiment of the present invention after the third positioning plate is separated from the chip.

[0024] Figure 5A It is a plan view of the first chip in the chip assembly involved in the second embodiment of the present invention observed along the x direction.

[0025] Figure 5B It is a plan view of the second chip in the chip assembly according to the second embodiment of the present invention observed along the x direction.

[0026] Figure 6 It is an exploded view of the chip assembly involved in the third embodiment of the present invention after being separated from the shell.

[0027] Figure 7 It is an exploded view of the chip assembly involved in the fourth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0028] Figure 8 This is an exploded view of the chip assembly involved in the fifth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0029] Fig. 9 It is an exploded view of the chip assembly involved in the sixth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0030] Fig.10 This is an exploded view of the chip assembly involved in the seventh embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0031] Fig.11A and Fig. 11B This is an exploded view of the chip assembly involved in the eighth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0032] Fig.12 It is an exploded view of the chip assembly involved in the ninth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0033] Fig.13 It is an exploded view of the chip assembly involved in the tenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0034] Fig.14 It is a simplified plan view of the chip assembly involved in the eleventh embodiment of the present invention observed along the -x direction.

[0035] Fig.15 It is a simplified plan view of the chip involved in the eleventh embodiment of the present invention observed along the +x direction.

[0036] Fig.16 It is an exploded view of the chip assembly involved in the twelfth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0037] Fig.17 This is the first exploded view of the chip assembly involved in the thirteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0038] Fig.18 This is a second exploded view of the chip assembly involved in the thirteenth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0039] Fig.19 It is an exploded view of the chip assembly involved in the fourteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0040] Fig. 20 This is an exploded view of the chip assembly involved in the fifteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0041] Fig.21A and Fig.21B This is an exploded view of the chip assembly involved in the sixteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0042] Fig. 21C It is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when observed along the y direction.

[0043] Fig.21D It is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when observed along the x direction.

[0044] FIG. 22A to FIG. 22C It is a schematic diagram of the internal structure of the ink cartridge involved in the sixteenth embodiment of the present invention.

[0045] Fig.22D It is a three-dimensional diagram of the ink cartridge involved in the sixteenth embodiment of the present invention when viewed from another angle. DETAILED DESCRIPTION

[0046] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. Figure 1 It is a three-dimensional diagram of the ink cartridge involved in the present invention.

[0047] As described in the background technology, the type of imaging material contained in the imaging material box 10 varies depending on the type of imaging device. The imaging material can be toner, in which case the imaging material box is a processing box or a powder cartridge. The imaging material can also be ink, in which case the imaging material box is an ink cartridge. However, regardless of the type of imaging material, the chip assembly 103 described below is applicable; the following description takes the ink cartridge as an example.

[0048] As shown in the figure, the ink cartridge 10 includes a shell 101 for containing ink, an ink outlet portion 102 (imaging material discharge portion) arranged on the shell 101, and a chip component 103. The ink outlet portion 102 is used to combine with an ink absorption component provided in an imaging device to supply ink to the imaging device. The chip component 103 is used to establish a communication connection with the imaging device so that the imaging device can obtain the ink cartridge information stored in the chip component 103. Specifically, the chip component 103 realizes the communication connection by forming electrical contact with a contact pin provided in the imaging device.

[0049] To make the following description clearer, the ink cartridge is defined as having the x-direction, y-direction and z-direction shown in the figure based on the posture when the ink cartridge is installed in the imaging device, and the x-direction, y-direction and z-direction intersect with each other. Preferably, the x-direction, y-direction and z-direction are perpendicular to each other, wherein the x-direction has opposite +x-direction (front) and -x-direction (back), the y-direction has opposite +y-direction (left) and -y-direction (right), the z-direction has opposite +z-direction (above) and -z-direction (below), and the -z direction is the direction of gravity. The ink cartridge 10 can be installed and removed along the x-direction as well as along the z-direction.

[0050] The shell 101 is used to contain ink and has a front side wall 101a facing the +x direction and a lower side wall 101d facing the -z direction, the front side wall 101a and the lower side wall 101d are adjacent to each other, in the following embodiment, the ink outlet 102 is arranged on the lower side wall 101d, the chip assembly 103 can be arranged on the lower side wall 101d, and can also be arranged on a side wall different from the lower side wall 101d, and the coupling 11 for locking the ink cartridge 10 in the imaging device is directly or indirectly arranged on the front side wall 101a, and along the x direction, at least a portion of the coupling 11 is located in front of the front side wall 101a.

[0051] Furthermore, the shell 101 is also provided with a chip component mounting portion 13, and the chip component 103 is mounted in the chip component mounting portion 13. In practice, the chip component 103 can be mounted in the chip component mounting portion 13 in a non-detachable manner or in a detachable manner. Obviously, when the chip component 103 is detachable relative to the chip component mounting portion 13 (shell 101), it is more conducive to the replacement, maintenance, upgrade, recycling, regeneration and other operations of the chip component 103, thereby reducing the use cost of the chip component 103.

[0052] [Example 1]

[0053] Figure 2A It is an exploded view of the chip assembly and the shell after being separated according to the first embodiment of the present invention.

[0054] In this embodiment, the chip component 103 is installed to the chip component mounting portion 13 in a detachable manner. For example, the chip component 103 is installed and removed along the z direction, or installed and removed along the y direction. The figure shows a structure in which the chip component mounting portion 13 is open to the -y direction. At this time, the chip component 103 is installed toward the chip component mounting portion 13 along the +y direction, and is removed from the chip component mounting portion 13 along the -y direction.

[0055] The chip assembly 103 includes a chip 104 and a positioning plate 105. The chip 104 is first mounted on the positioning plate 105, and then the positioning plate 105 is mounted on the chip assembly mounting portion 13; the chip 104 includes a substrate 1041, a memory 1044 (such as Figure 3B As shown) and multiple contact portions 1042, the substrate 1041 has a first side 1048 and a second side 1049 relative to each other, the memory 1044 stores information of the ink cartridge 10, the contact portion 1042 is used to make electrical contact with the contact pin, and the contact portion 1042 is also electrically connected to the memory 1044. Preferably, at least a portion of the contact portion 1042 and the memory 1044 are respectively arranged on different sides of the substrate 1041.

[0056] The plurality of contact portions 1042 may be divided into a first group of contact portions 1045 and a second group of contact portions 1046 according to their distribution on the substrate 1041, wherein the first group of contact portions 1045 are arranged on the first side 1048 and are referred to as front contact portions, and the second group of contact portions 1046 are not arranged on the first side 1048 and are referred to as back contact portions, the first group of contact portions 1045 may be arranged as one contact portion or as a plurality of contact portions, similarly, the second group of contact portions 1046 may be arranged as one contact portion or as a plurality of contact portions, and hereinafter, unless otherwise specified, the first group of contact portions 1045 may be arranged as a plurality of contact portions. The second group of contact parts 1046 is set as a contact part; specifically, the second group of contact parts 1046 can be set on the second side 1049, or can be set on the third side 104c located between the first side 1048 and the second side 1049. The first group of contact parts 1045 is used to directly form electrical contact with the contact pin, and the second group of contact parts 1046 is used to indirectly form electrical contact with the contact pin. It can be seen that the multiple contact parts 1042 are not arranged on the same side of the substrate 1041, so that the number of contact parts located on the same side is reduced, the design freedom of these contact parts and the design freedom of the substrate are improved, and the risk of short circuit between the contact parts is also reduced.

[0057] like Figure 2A As shown, the first side 1048 faces the +x direction, the second side 1049 faces the -x direction, and the third side 104c faces the y direction or the z direction intersecting the x direction. The figure shows that the third side 104c faces the +y direction. Accordingly, the positioning plate 105 will have a power transmission part 105f / 105i facing the -y / +y direction (such as Figure 3B As shown in the figure, the positioning plate 105 in this embodiment is provided with a conductor for making electrical contact with the contact pin, and the conductor can be either a component mounted on the positioning plate 105 or a part of the positioning plate 105 itself, and the conductor is also electrically connected to the power transmission part 105f / 105i. Preferably, the power transmission part 105f / 105i and the conductor are both part of the positioning plate 105 itself. In this case, at least a part of the positioning plate 105 is made of conductive material, and more preferably, the positioning plate 105 is made entirely of conductive material. When the ink cartridge 10 is installed in the imaging device, the positioning plate 105 is in direct electrical contact with the contact pin, and thus, the contact part 1042 (the second group of contact parts 1046) provided on the third side 104c is in indirect electrical contact with the contact pin through the positioning plate 105.

[0058] Continue as Figure 2AAs shown, the positioning plate 105 includes a supporting portion 105a and at least one blocking portion. The supporting portion 105a is used to support the substrate 1041 (the second side 1049). The blocking portion is extended from the supporting portion 105a. On the one hand, the blocking portion is used to position the chip 104, and on the other hand, the blocking portion is used to prevent the chip 104 from falling off. Along the thickness direction of the chip 104 / substrate 1041 (the arrangement direction of the first side 1048 and the second side 1049), a chip accommodating portion 1050 is formed opposite to the supporting portion 105a, as shown in FIG. Figure 2A As shown, along the +y direction, the chip 104 is installed toward the chip accommodating portion 1050. Preferably, the positioning plate 105 is configured as the first blocking portion 105b and two second blocking portions 105d as shown in the figure, wherein the two second blocking portions 105d are spaced apart in the z direction, and the chip accommodating portion 1050 is located between the two second blocking portions 105d.

[0059] In this embodiment, the third side 104c provided with the second group of contact portions 1046 is the surface of the substrate 1041 facing the +y direction, and accordingly, the surface 105f of the first blocking portion 105b located in the +y direction of the chip accommodating portion 1050 facing the chip accommodating portion 1050 is formed as the above-mentioned power transfer portion, that is, the power transfer portion faces the direction intersecting with the thickness direction, and when the chip 104 is mounted to the positioning plate 105, the power transfer portion 105f contacts the third side 104c along the direction intersecting with the thickness direction of the chip 104 / substrate 1041.

[0060] In some embodiments, the power transfer portion 105 f may also be a protrusion disposed on a surface of the first barrier portion 105 b facing the chip receiving portion 1050 , that is, the protrusion extends in a direction intersecting the thickness direction.

[0061] In some embodiments, when a conductor is disposed in the positioning plate 105 , the conductor may also extend to the surface of the first blocking portion 105 b facing the chip receiving portion 1050 , so that the conductor is in electrical contact with the second group of contact portions 1046 disposed on the third side 104 c .

[0062] In some embodiments, the positioning plate 105 also includes a card slot 105e arranged between the second blocking portion 105d and the supporting portion 105a, and the card slot 105e is used to accommodate the substrate 1041 of the chip 104 to ensure that the chip 104 can be stably mounted on the positioning plate 105; in practice, the card slot 105e can be arranged between both of the two second blocking portions 105d and the supporting portion 105a, or the card slot 105e can be arranged between only one of the second blocking portions 105d and the supporting portion 105a, or the card slot 105e can be not arranged between both of the second blocking portions 105d and the supporting portion 105a, but the surface of the second blocking portion 105d facing the chip accommodating portion 1050 abuts against the substrate 1041, which can also achieve that the chip 104 is stably mounted on the positioning plate 105.

[0063] In some embodiments, the support portion 105a is further provided with a first guide surface 105g on a side where no blocking portion is provided, so that the chip 104 can be installed smoothly.

[0064] In some embodiments, the support portion 105a is further provided with an avoidance portion 105c. When the memory 1044 is provided on the second side 1049, the avoidance portion 105c is used to allow the memory 1044 to enter. On the contrary, when the memory 1044 is not provided on the second side 1049, the avoidance portion 105c does not need to be provided.

[0065] Figure 2B It is a three-dimensional diagram of the chip after the second group of contact parts in the chip assembly involved in the first embodiment of the present invention are deformed.

[0066] In this variation, the second group of contact portions 1046 is still configured as one contact portion, but the contact portion is configured on both the second side 1049 and the third side 104c, that is, a portion of the contact portion is configured on the second side 1049 and another portion is configured on the third side 104c.

[0067] Based on this, when the second group of contact portions 1046 is set as multiple contact portions, the second contact portion 1046 can also be simultaneously set on the second side 1049 and the third side 104c. For example, the second group of contact portions 1046 is further decomposed into multiple groups of sub-contact portions, and one contact portion or multiple contact portions can be set in each group of sub-contact portions. Among the multiple groups of sub-contact portions, at least one group of sub-contact portions is set on the second side 1049, and at least another group of sub-contact portions is set on the third side 104c.

[0068] Based on the inventive concept of this embodiment, two deformation structures of the positioning plate are introduced below, and the same parts will be numbered the same.

[0069] Figure 3Ais a three-dimensional diagram of a second type of positioning plate in a chip assembly according to the first embodiment of the present invention; Figure 3B is along Figure 3A After cutting along the AA direction, the side view observed along the z direction.

[0070] For the sake of distinction, the positioning plate introduced above is called the first positioning plate 105A. On the basis of the first positioning plate 105A, the second positioning plate 105B is further provided with a third blocking portion 105h movable relative to the supporting portion 105a. The chip 104 is installed toward the chip accommodating portion 1050 from the side where the third blocking portion 105h is provided. When the third blocking portion 105h is elastically deformed, the chip 104 is allowed to be installed toward or removed from the chip accommodating portion 1050.

[0071] Along the y direction, the third blocking portion 105h and the first blocking portion 105b are arranged opposite to each other, and the third blocking portion 105h is connected to the supporting portion 105a or the second blocking portion 105d. Preferably, the third blocking portion 105h is arranged in the form of a cantilever, so that the third blocking portion 105h can be formed integrally with the supporting portion 105a or the second blocking portion 105d.

[0072] like Figure 3A As shown, the free end of the third blocking portion 105h is provided with an extension portion 105i. When the chip 104 is mounted to the chip receiving portion 1050, at least the extension portion 105i of the third blocking portion 105h abuts against the chip 104. Further, the extension portion 105i is provided with a second guide surface 105j. Figure 3B As shown, when viewed along the z direction, the extension line of the first guide surface 105g and the extension line of the second guide surface 105j intersect.

[0073] Along the y direction, at least a portion of the second guide surface 105j is located in the -y direction of the first guide surface 105g, so that the chip 104 will first contact the second guide surface 105j and force the third blocking portion 105h to undergo elastic deformation. Subsequently, the chip 104 is guided by the first guide surface 105g and smoothly enters the chip accommodating portion 1050; on the contrary, along the y direction, when the second guide surface 105j is entirely located in the +y direction of the first guide surface 105g, although the chip 104 can be first guided by the first guide surface 105g, the chip 104 is not restricted in its +z direction, so that the chip 104 may detach from the first guide surface 105g and cannot enter the chip accommodating portion 1050.

[0074] Based on the first positioning plate 105A, in this variation, the second group of contact portions 1046 may also be disposed on the surface of the substrate 1041 facing the second blocking portion 105d, or the second group of contact portions 1046 may also be disposed on the surface 105i of the substrate 1041 facing the third blocking portion 105h. Figure 3B As shown, a surface 105f of the first barrier 105b facing the chip receiving portion 1050 and a surface 105i of the third barrier 105h facing the chip receiving portion 1050 may both serve as power transfer portions for electrically connecting to the third side 104c of the substrate 1041 .

[0075] Combination Figure 2A It can be seen that along the y direction, the first group of contact portions 1045 are more concentratedly arranged on the -y side of the substrate 1041, that is, along the y direction, compared with the surface of the substrate 1041 facing the +y direction, the first group of contact portions 1045 are closer to the surface of the substrate 1041 facing the -y direction. Then, when the second group of contact portions 1046 are arranged on the surface of the substrate 1041 facing the +y direction, it is more conducive to reducing the risk of short circuit in the contact portion.

[0076] Figure 4 This is an exploded view of the chip assembly according to the first embodiment of the present invention after the third positioning plate is separated from the chip.

[0077] In the third positioning plate 105C, the third blocking portion 105h is not deformable relative to the supporting portion 105a, and the third positioning plate 105C also includes an anti-detachment portion 105k arranged on each blocking portion. Along the thickness direction of the substrate 1041, the anti-detachment portion 105k and the supporting portion 105a are relatively arranged, and the chip accommodating portion 1050 is located between the anti-detachment portion 105k and the supporting portion 105a. Therefore, the chip 104 accommodated by the chip accommodating portion 1050 is restricted in the x-direction, the y-direction and the z-direction and will not fall off easily.

[0078] [Example 2]

[0079] Figure 5A is a plan view of the first chip in the chip assembly according to the second embodiment of the present invention observed along the x direction; Figure 5B It is a plan view of the second chip in the chip assembly according to the second embodiment of the present invention observed along the x direction.

[0080] The multiple contact portions 1042 in the chip 104 include a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal, wherein the power terminal is used to receive power supplied by the imaging device through a contact pin, and the ground terminal is used to be connected to a grounding device of the imaging device through a contact pin to be grounded. For example, the second group of contact portions 1046 is set as a ground terminal, and one of the first group of contact portions 1045 is set as a power terminal 10424.

[0081] like Figure 5A As shown, the first chip provided in this embodiment is also provided with a power supply 108, and the ground terminal 1046 is electrically connected to the power supply 108. The power supply 108 is used to supply a voltage to the chip 104 that is lower than the voltage received by the power terminal 10424 from the imaging device. Thus, the ground terminal 1046 can be replaced by the power supply 108.

[0082] like Figure 5B As shown, the second chip provided in this embodiment is also provided with a power supply 108. Unlike the first chip, the power supply 108 in this embodiment is electrically connected to the power terminal 10424 for supplying the chip 104 with the voltage required for the chip to operate. That is to say, the power terminal 10424 in the second chip does not have to be electrically connected to the contact pin.

[0083] Similar to the first embodiment, the first group of contact portions 1045 and the second group of contact portions 1046 in this embodiment can also be arranged on different sides of the substrate 1041 to reduce the risk of short circuit of the contact portions.

[0084] [Example 3]

[0085] Figure 6 It is an exploded view of the chip assembly involved in the third embodiment of the present invention after being separated from the shell.

[0086] The chip 104 provided in this embodiment uses a short-range wireless communication method, such as RFID in the prior art, which is not limited here. Figure 6 As shown, the chip 104 (chip assembly) includes a radio frequency chip 104d and a chip body 104e which are separately and spaced apart from each other. There is no physical connection (no physical contact) between the two, but the connection is achieved through wireless communication.

[0087] Among them, the RF chip 104d includes a first substrate 104d1 and a plurality of contact portions 1042 and a RF tag 104d3 (first signal transceiver) arranged on the first substrate 104d1. The plurality of contact portions 1042 are used to electrically contact with the contact pins of the imaging device so that the chip 104 establishes a communication connection with the imaging device, and the RF tag 104d3 is used to establish a wireless connection with the chip body 104e.

[0088] The chip body 104e includes a second substrate 104e1 and a reader 104e2 (a second signal transceiver) and a memory 1044 disposed on the second substrate 104e1. The memory 1044 stores information of the ink cartridge, and the reader 104e2 is also electrically connected to the memory 1044.

[0089] Similar to the second embodiment, the plurality of contact portions 1042 in the chip assembly 104 of this embodiment include a data terminal, a clock terminal, a reset terminal, a power terminal and a ground terminal; Figure 6 , the multiple contact portions 1042 are asymmetrically distributed on the surface of the substrate; specifically, the multiple contact portions 1042 are arranged on the first substrate 104d1, and more specifically, the data terminal, reset terminal, power terminal and ground terminal are arranged on the -x side of the first substrate 104d1, and the ground terminal is arranged on the +x side of the first substrate 104d1.

[0090] After the contact portion 1042 is electrically connected to the contact pin, the RF chip 104d receives an electrical signal from the imaging device, and then the RF tag 104d3 can convert the electrical signal received from the contact pin into an electromagnetic wave signal and transmit it to the chip body 104e. The reader 104e2 converts the received electromagnetic wave signal into an electrical signal and exchanges information with the memory 1044. Subsequently, the reader 104e2 converts the electrical signal received from the memory 1044 into an electromagnetic wave and sends it back to the RF tag 104d3. The RF tag 104d3 converts the electromagnetic wave signal received from the reader 104e2 into an electrical signal and outputs it to the multiple contact portions 1042. Then, the contact pin can identify the signal output by the memory 1044 through the electrical signal output by the multiple contact portions 1042.

[0091] In the chip 104, the RF chip 104d and the chip body 104e are not in contact, so the risk of short circuit between the components inside the chip 104 can be effectively reduced; it is understandable that the positions of the RF chip 104d and the chip body 104e can also be interchanged, and the RF tag 104d3 can be any one of an active tag and a passive tag.

[0092] In some embodiments, the chip body 104 e is configured to be sealed relative to the RF chip 104 d . For example, the chip body 104 e is sealed with sealing glue, which can better protect the chip body 104 e having the memory 1044 .

[0093] The contact portion 1042 in this embodiment may also adopt the structural arrangement described in any of the above embodiments to further reduce the risk of short circuit at the contact portion. The technical solution of this embodiment may be applied to imaging material boxes in the prior art, such as ink cartridges / serender drums.

[0094] [Example 4]

[0095] Figure 7 It is an exploded view of the chip assembly involved in the fourth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0096] On the basis of the above embodiments, this embodiment further configures the shell 101, the coupling 11 and the positioning plate 105 to all be conductive. At this time, the coupling 11, the positioning plate 105 and the shell 101 can be formed as one piece, or in other words, the coupling 11 and the positioning plate 105 are regarded as part of the shell 101, and the conductor 107 does not need to be provided separately, but is formed by at least a part of the positioning plate 105.

[0097] In an embodiment of the present invention, when no conductor is installed on the positioning plate 105, at least the positioning plate 105 is made of a conductive material. On the contrary, when a conductor is installed on the positioning plate 105, the positioning plate 105 still has conductivity. It can be seen that the positioning plate 105 always needs to be configured to have conductivity. In a deformable embodiment, the positioning plate 105 and the coupling 11 can also be made of a conductive material together, and the combination of the positioning plate 105 and the coupling 11 can be detachably arranged relative to the shell 101. It can also be that as mentioned above, the positioning plate 105, the coupling 11 and the shell 101 are integrally formed of a conductive material. In the following embodiments, the materials of the coupling 11 and the shell 101 are not limited, and it should be understood that at least the positioning plate 105 is made of a conductive material.

[0098] The conductor 107 includes a front conductive member 1074 and a back conductive member 1075 electrically connected to each other, wherein the front conductive member 1074 is used to contact the contact pin, and the back conductive member 1075 is used to contact the back contact portion 1046, so that the back contact portion 1046 arranged on the second side 1049 can also form an electrical connection with the contact pin. In this embodiment, preferably, the back contact portion 1046 is a ground terminal 10425 (such as Fig.14 shown).

[0099] In some embodiments, the back contact portion 1046 may also be disposed on the third side 104 c , and the power transfer portion 105 f may be regarded as a back conductive member 1075 .

[0100] like Figure 7 As shown, at least one supporting portion 105a is disposed in the chip accommodating cavity 1050, and the second side 1049 of the substrate 1041 is supported by the supporting portion 105a. In this embodiment, the supporting portion 105a is also made of a conductive material, and thus, the supporting portion 105a can be regarded as a reverse conductive member 1075, and the chip 104 is fixedly supported by the supporting portion 105a.

[0101] Furthermore, the positioning plate 105 also includes a positioning portion 105n arranged on the supporting portion 105a, and the chip 104 also includes a positioned portion 10411 arranged on the substrate 1041. Preferably, the positioning portion 105n is arranged as a protrusion, and the positioned portion 10411 is arranged as a positioned hole / positioned groove allowing the positioning portion 105n to enter. Through the positioning portion 105n, the chip 104 is positioned on the positioning plate 105. Subsequently, the positioning portion 105n is heated to melt the positioning portion 105n. Finally, the chip 104 is riveted to the positioning plate 105 by the positioning portion 105n.

[0102] [Example 5]

[0103] Figure 8 This is an exploded view of the chip assembly involved in the fifth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0104] Compared with the fourth embodiment, the chip 104 in this embodiment is movably disposed in the chip receiving cavity 1050. Figure 8 As shown, the chip assembly 103 also includes an elastic member 106 arranged in the chip accommodating cavity 1050, one end of the elastic member 106 abuts against the second side 1049 of the substrate 1041, and the other end abuts against the positioning plate 105, so that the chip 104 is pushed by the elastic member 106 in the direction away from the shell 101 (+x direction).

[0105] Specifically, a protrusion for contacting with the elastic member 106 is provided in the chip accommodating cavity 1050, and the elastic member 106 is provided as a compression spring. Preferably, the protrusion and the elastic member 106 are both made of conductive material, and thus, the protrusion can be regarded as the reverse conductive member 1075; similarly, the chip 104 in this embodiment can also be riveted on the positioning plate 105, but when the chip 104 is subjected to a force in the -x direction, the chip 104 can overcome the elastic force of the elastic member 106 and move in the x direction, and at the same time, the chip 104 It is also restricted by the melted positioning portion 105n and will not fall off the shell 101; for example, when the chip 104 is squeezed by the contact pin, the elastic member 106 is elastically deformed, and the chip 104 moves toward the direction close to the shell 101 (-x direction). While ensuring that the chip 104 maintains good contact with the contact pin, the contact pin can be prevented from being elastically deformed and damaged. In addition, the elastic member 106 supported by the conductive material can also ensure that the reverse contact portion 1046 maintains good contact with the reverse conductive member 1075.

[0106] [Example 6]

[0107] Fig. 9 It is an exploded view of the chip assembly involved in the sixth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0108] The chip 104 in this embodiment is also movably disposed in the chip receiving cavity 1050. Different from the fifth embodiment, the elastic member 106 in this embodiment does not need to be installed separately, but is formed by a part of the positioning plate 105 itself. Fig. 9 As shown, the elastic member 106 in this embodiment is a cantilever formed in the chip receiving cavity 1050 , and the cantilever 106 is made of a conductive material. Therefore, the cantilever 106 can be regarded as the reverse conductive member 1075 in this embodiment.

[0109] [Example 7]

[0110] Fig.10 This is an exploded view of the chip assembly involved in the seventh embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0111] Different from the above-mentioned embodiment, the chip 104 in this embodiment is no longer positioned (fixed or movably arranged) in the chip receiving cavity 1050 by riveting. Fig.10 As shown, the chip 104 in this embodiment is positioned in the chip receiving cavity 1050 by screws, that is, the positioning portion 105n in this embodiment is a screw.

[0112] Preferably, the chip 104 is fixed to the positioning plate 105 by at least two screws 105n. More preferably, the screws are arranged relative to each other in a direction intersecting the x-direction to ensure that the chip 104 can be stably positioned. Further, according to the above embodiment, the chip 104 in this embodiment can be fixed in the chip accommodating cavity 1050 or can be movably arranged in the chip accommodating cavity 1050.

[0113] In this embodiment, the back contact portion 1046 can also be arranged on the third side 104c, so that the back contact portion 1046 can form an electrical connection with the conductive screw 105n, and thus, the back contact portion 1046 can form an electrical connection with the contact pin through the conductive screw 105n.

[0114] [Embodiment 8]

[0115] Fig.11A and Fig. 11B This is an exploded view of the chip assembly involved in the eighth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0116] Similar to the fourth embodiment, the chip 104 in this embodiment is also fixedly supported by the support portion 105 a , that is, the chip 104 in this embodiment is immovable relative to the housing 101 , and thus, the support portion 105 a in this embodiment can also be regarded as a reverse conductive member 1075 .

[0117] Different from the fourth to seventh embodiments, the chip 104 in this embodiment is no longer combined with the positioning plate 105 by riveting, but is combined with the positioning plate 105 by providing a slot 105e on the positioning plate 105, and the slot 105e is used to clamp the substrate 1041. Fig.11A and Fig. 11B As shown, at least one second blocking portion 105d is disposed at both ends of the chip receiving cavity 1050 in the z direction, and the card slot 105e is disposed between the second blocking portion 105d and the supporting portion 105a.

[0118] The chip accommodating cavity 1050 is open toward the -y direction, and the chip 104 can be installed toward the chip accommodating cavity 1050 along the +y direction; preferably, the reverse conductive member 1075 in this embodiment includes a third guide surface 10751 and a support surface 10752 arranged adjacent to each other, and the third guide surface 10751 is located in the -y direction of the support surface 10752, or in other words, along the installation direction of the chip 104, the third guide surface 10751 is located upstream of the support surface 10752, and the third guide surface 10751 is arranged as an inclined surface inclined relative to the y direction, specifically, along the +y direction, the distance from the third guide surface 10751 to the rear side wall 101b of the shell 101 or the center line of the ink outlet portion 102 gradually increases, and the rear side wall 101b and the front side wall 101a are arranged opposite to each other in the x direction, so that the third guide surface 10751 can play a guiding role in the installation of the chip 104.

[0119] Similarly, the chip accommodating cavity 1050 can also be set to be open toward the +y direction. In this case, the inclination direction of the third guide surface 10751 will be opposite to the above direction, and the chip 104 will be installed toward the chip accommodating cavity 1050 along the -y direction.

[0120] [Example 9]

[0121] Fig.12 It is an exploded view of the chip assembly involved in the ninth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0122] In combination with Example 5 and Example 8, the chip accommodating cavity 1050 in this embodiment is also configured to be open toward the -y direction, and the chip 104 can be installed toward the chip accommodating cavity 1050 along the +y direction. At the same time, the chip assembly 103 also includes an elastic member 106 abutting against the chip 104, and a protrusion for abutting against the elastic member 106 is also provided in the chip accommodating cavity 1050. The protrusion and the elastic member 106 are both made of conductive material, and the protrusion can be regarded as the reverse conductive member 1075.

[0123] [Example 10]

[0124] Fig.13It is an exploded view of the chip assembly involved in the tenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0125] In combination with the sixth embodiment and the eighth embodiment, the chip receiving cavity 1050 in this embodiment is also configured to be open toward the -y direction, and the chip 104 can be installed toward the chip receiving cavity 1050 along the +y direction. Similar to the sixth embodiment, the elastic member 106 in this embodiment is formed as a part of the positioning plate 105, such as Fig.13 As shown, the elastic member 106 is a cantilever formed in the chip receiving cavity 1050 , and the cantilever 106 is made of a conductive material. Therefore, the cantilever 106 can be regarded as a reverse conductive member 1075 .

[0126] Further, similar to the eighth embodiment, the cantilever 106 / 1075 in this embodiment is also configured to include a third guide surface 10751 and a support surface 10752, and the third guide surface 10751 is inclined relative to the y direction.

[0127] [Example 11]

[0128] Fig.14 It is a simplified plan view of the chip assembly involved in the eleventh embodiment of the present invention observed along the -x direction.

[0129] This embodiment further describes the position change of the back contact portion 1046. Similarly, the back contact portion 1046 in this embodiment is also set as the ground terminal 10425. The surface of the substrate 1041 of the chip 104 on which the contact portion 1042 is set extends along the y direction and the d direction. When observed along the x direction, the projection points C of the contact points formed by the two contact portions of the front contact portion 1045 located at the outermost side in the y direction and the contact pins are respectively N1 and N2 on the straight line D parallel to the y direction in the surface including the y direction and the d direction. The projection point C of the back contact portion 1046 on the surface including the y direction and the d direction is E on the straight line D parallel to the y direction. Along the y direction, the projection point E is located on the line segment N1N2 That is to say, along the y direction, the projection point C of the back contact portion 1046 within the surface including the y direction and the d direction is located within the range defined by the two outermost contact points of the front contact portion 1045 in the y direction, or, along the y direction, the back contact portion 1046 is located between the two front contact portions 1045. This arrangement not only reduces the contact portion arrangement density on the first side 1048, thereby reducing the short circuit risk of the chip 104, but also helps to make full use of the surface area of ​​the first side 1048 and the second side 1049 to reduce the volume of the chip 104.

[0130] In an embodiment of the present invention, the d direction can be parallel to the z direction or the x direction, or it can be neither parallel to the z direction nor to the x direction, but inclined relative to the x direction or the z direction. The midline of the line segment N1N2 is L2. Along the y direction, the midline L2 divides the substrate 1041 into adjacent first areas Q1 and second areas Q2. Overall, the number of contact portions in the first area Q1 is different from the number of contact portions in the second area Q2. When only the front contact portion 1045 is observed, the number of contact portions on both sides of the midline L2 is equal. In this way, the substrate 1041 is subjected to uniform force in the y direction, which is beneficial for the chip 104 (front contact portion 1045) to form a stable electrical contact with the contact pin. In particular, when the chip 104 is configured to be movable relative to the housing 101, this contact portion distribution method is more conducive to ensuring that the chip 104 remains stable.

[0131] like Fig.14 As shown, the conductor 107 is electrically connected to the back contact portion 1046, and the front conductive member 1074 of the conductor 107 forms a contact point C2 with the contact pin. Preferably, the resistance from the front conductive member 1074 to the back conductive member 1075 (including the front conductive member itself, the back conductive member itself, and the conductor between the front conductive member and the back conductive member) does not exceed 1KΩ, and more preferably, the resistance does not exceed 700Ω. In actual testing, when the resistance exceeds 1KΩ, the contact pin will not detect any signal.

[0132] Fig.15 It is a simplified plan view of the chip involved in the eleventh embodiment of the present invention observed along the +x direction.

[0133] On the basis of the above-mentioned embodiments, the reverse contact portion 1046 in this embodiment is arranged adjacent to the positioned portion 10411. Preferably, the reverse contact portion 1046 is arranged in an arc shape extending around the edge of the positioned portion 10411. As described above, the chip 104 can be combined with the positioning portion 105n through the positioned portion 10411, and the chip 104 can be positioned on the positioning plate 105 by riveting. Even if the chip 104 is subjected to vibration, the reverse contact portion 1046 arranged close to the positioned portion 10411 can form a stable electrical connection with the conductor 107.

[0134] Furthermore, the reverse contact portion 1046 can also be configured to extend to the positioned portion 10411. When the positioning portion 105n enters the positioned portion 10411, the reverse contact portion 1046 can directly contact the positioning portion 105n. In particular, when the positioning plate 105 itself is made of conductive material, a stable electrical connection will be formed between the reverse contact portion 1046 and the positioning portion 105n.

[0135] [Example 12]

[0136] Fig.16It is an exploded view of the chip assembly involved in the twelfth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0137] Based on the aforementioned embodiments, the chip 104 of this embodiment is substantially the same as that of the eleventh embodiment, with the difference being that in this embodiment, the positioning plate 105 is integrally formed with the shell 101, and the positioning plate 105 is not conductive, and the second group of contact portions 1046 / 1042 (rear contact portions) form electrical contact with the conductor 107 under the elastic pressure of the elastic member 106.

[0138] The positioning plate 105 is used to accommodate and install the chip 104. At least a portion of the elastic member 106 and at least a portion of the conductor 107 are located in the chip accommodating cavity 1050. In this embodiment, the back contact portion ( Fig.16 ) is disposed on the second side 1049 of the substrate 1041.

[0139] Further, the conductor 107 includes a front conductive member 1074 for electrically contacting the contact pin and a back conductive member 1075 for electrically contacting the second group of contact portions 1046. Specifically, the front conductive member 1074 is a part of the conductive member 107 for contacting the contact pin, and the back conductive member 1075 is a part of the conductor 107 for contacting the second group of contact portions 1046.

[0140] In this embodiment, similar to the fifth embodiment, a protrusion for abutting against the elastic member 106 is provided in the chip accommodating cavity 1050, and the elastic member 106 is configured as a compression spring. However, unlike the fifth embodiment, in this embodiment, the elastic member 106 is used to apply pressure to the conductor 107, pressing the reverse conductive member 1075 to form electrical contact with the reverse contact portion 1046 / 1042 of the chip 104 to form an electrical path: reverse contact portion-conductive member-contact pin; that is, the elastic member 106 in this embodiment does not play a conductive role in the electrical path; with the above configuration, the conductor 107 can form a stable electrical contact with the reverse contact portion 1046 / 1042 under the action of the elastic member 106, and poor contact is less likely to occur.

[0141] In some other embodiments, a method similar to that of Example 6 may also be adopted, and the elastic member 106 does not need to be installed separately, but is formed by a part of the positioning plate 105 itself, that is, the elastic member 106 is a cantilever formed on the positioning plate 105. In this embodiment, the elastic member 106 is used to apply pressure to the conductor 107, forcing the reverse conductive member 1075 to form electrical contact with the reverse contact portion 1046 / 1042 of the chip 104.

[0142] Regarding the fixing method of the chip 104 , this embodiment adopts a method substantially similar to that of the fourth embodiment, that is, by heating the positioning portion 105 n to melt the positioning portion 105 n , the chip 104 is riveted to the positioning plate 105 by the positioning portion 105 n .

[0143] Preferably, the reverse contact portion 1046 is a ground terminal.

[0144] [Example 13]

[0145] Fig.17 is a first exploded view of the chip assembly according to the thirteenth embodiment of the present invention after the chip and the ink cartridge housing are separated; Fig.18 This is a second exploded view of the chip assembly involved in the thirteenth embodiment of the present invention after the chip and the ink cartridge housing are separated.

[0146] On the basis of the above-mentioned embodiment, the difference between this embodiment and the twelfth embodiment is that the elastic member 106 is conductive, and the second group of contact portions 1046 / 1042 forms electrical contact with the conductor 107 under the conductive effect of the elastic member 106 .

[0147] In this embodiment, the back contact portion 1046 forms electrical contact with the conductor 107 through the elastic member 106, that is, an electrical path is formed: back contact portion-elastic member-conductive member-contact pin. Preferably, the elastic member 106 is a compression spring.

[0148] like Fig.17 and Fig.18 As shown, a plurality of protrusions are provided in the chip receiving cavity 1050. In addition to the protrusions for contacting with the elastic member 106, the chip receiving cavity 1050 is also provided with protrusions for positioning the conductor 107. The conductor 107 is provided with a corresponding groove structure. More specifically, one of the protrusions plays a role in positioning both the conductor 107 and the elastic member 106.

[0149] [Example 14]

[0150] Fig.19 It is an exploded view of the chip assembly involved in the fourteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0151] On the basis of the above-mentioned embodiments, the difference between this embodiment and the thirteenth embodiment is that the back contact portion 1046 / 1042 is arranged on the third side 104 c between the first side 1048 and the second side 1049 , that is, the side surface of the substrate 1041 .

[0152] The chip 104 and the conductor 107 are spaced apart from each other along the direction in which the elastic member 106 extends. Specifically, the direction in which the elastic member 106 extends refers to the direction in which the elastic member 106 extends toward the reverse contact portion / the second group of contact portions 1046. Fig.19As shown, in this embodiment, the elastic member 106 extends along the y direction toward the reverse contact portion / second group of contact portions 1046. In the y direction, the elastic member 106 is located between the chip 104 and the conductor 107, that is, the chip 104 is located in the -y direction of the elastic member 106, and the conductor 107 is located in the +y direction of the elastic member 106.

[0153] In this embodiment, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the third side 104c of the substrate 1041, and the elastic member 106 and the conductor 107 can be located in the +y or -y direction of the third side 104c of the substrate 1041. In other embodiments, after the chip is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the third side 104c of the substrate 1041, and the elastic member 106 and the conductor 107 can be located in the +z or -z direction of the third side 104c of the substrate 1041.

[0154] Furthermore, the chip accommodating cavity 1050 is provided with a slot and a protrusion at the position corresponding to the conductor 107, and the conductor 107 is provided with a protrusion corresponding to the slot and a positioning hole corresponding to the protrusion. The conductor 107 is installed on the positioning plate 105 through the slot-protrusion and protrusion-positioning hole matching.

[0155] Furthermore, regarding the fixing method of the chip 104 , this embodiment adopts a method substantially similar to that of the fourth embodiment, that is, by heating the positioning portion 105 n so that the positioning portion 105 n melts, the chip 104 is riveted to the positioning plate 105 by the positioning portion 105 n.

[0156] [Example 15]

[0157] Fig. 20 This is an exploded view of the chip assembly involved in the fifteenth embodiment of the present invention after the chip and the ink cartridge shell are separated.

[0158] On the basis of the above-mentioned embodiment, the difference between this embodiment and the fourteenth embodiment lies in that the elastic member 106 and the conductor 107 are integrally formed; and the chip receiving cavity 1050 opens toward the −y direction and the +y direction respectively.

[0159] The chip 104 and the conductor 107 are spaced apart from each other along the extension direction of the elastic member 106. Specifically, the extension direction of the elastic member 106 refers to the direction in which the elastic member 106 extends toward the reverse contact portion / the second group of contact portions 1046. Fig. 20As shown, the elastic member 106 and the conductor 107 are integrally formed, and the conductor 107 is electrically in contact with the back contact portion 1046 / 1042 through the elastic member 106. Further, the elastic member 106 is arranged in the -x direction of the conductor 107, and the elastic member 106 extends in the -y direction and is in electrical contact with the back contact portion 1046 / 1042 of the chip 104. The back contact portion 1046 / 1042 can be arranged on the second side 1049 or the third side 104c of the substrate 1041, or can be partially arranged on the second side 1049 and extend to the third side 104c. When the chip 104 and the conductor 107 are both installed in the accommodating cavity 1050, the back contact portion 1046 / 1042 is in electrical contact with the elastic member 106 and causes the elastic member 106 to undergo elastic deformation, thereby forming a stable electrical contact between the back contact portion 1046 / 1042 and the elastic member 106.

[0160] Furthermore, the elastic member 106 is bent to form a U-shaped or V-shaped structure, the opening of the bent portion of the bent elastic member 106 is arranged in a direction away from the chip 104, and the apex of the bend of the elastic member 106 is used to form an electrical contact with the reverse contact portion 1046 / 1042. After the chip 104 is installed, it can abut the apex of the bent portion of the elastic member 106 to cause the elastic member 106 to undergo elastic deformation, making the electrical contact between the elastic member 106 and the reverse contact portion 1046 / 1042 more stable. In some other embodiments, the reverse contact portion 1046 / 1042 of the chip 104 can also be in electrical contact with an end of the elastic member 106 away from the conductor 107.

[0161] In this embodiment, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 and / or the third side 104c of the substrate 1041, the elastic member 106 is located in the -x direction of the second side 1049 of the substrate 1041, and the conductor 107 is located in the +y direction or -y direction of the third side 104c of the substrate 1041. In other embodiments, after the chip 104 is mounted to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 and / or the third side 104c of the substrate 1041, the elastic member 106 is located in the -x direction of the second side 1049 of the substrate 1041, and the conductor 107 is located in the +z direction or -z direction of the third side 104c of the substrate 1041.

[0162] Regarding the opening direction of the chip accommodating cavity 1050, similar to the eighth embodiment, the chip 104 is combined with the positioning plate 105 by providing a card slot 105e on the positioning plate 105, and the card slot 105e is used to clamp the substrate 1041. At least one second blocking portion 105d is provided at both ends of the chip accommodating cavity 1050 in the z direction.

[0163] Further, the chip receiving cavity 1050 is open toward the -y direction and the +y direction respectively, the chip 104 can be installed toward the chip receiving cavity 1050 along the +y direction, and the conductor 107 is installed toward the chip receiving cavity 1050 along the -y direction. Further, the chip receiving cavity 1050 is provided with protrusions in the -y direction and the +y direction respectively, the protrusion of the chip receiving cavity 1050 in the -y direction is used to position the chip 104 to prevent the chip 104 from being separated from the chip receiving cavity 1050, and the protrusion of the chip receiving cavity 1050 in the +y direction is used to position the conductor 107 to prevent the conductor 107 from being separated from the chip receiving cavity 1050.

[0164] It should be noted that in the aforementioned embodiments, the connection relationship between the chip accommodating cavity 1050 and the chip, as well as the spatial position relationship between at least two of the back contact part, the elastic part and the conductive part can be freely combined as long as the back contact part can form electrical contact with the contact pin through the conductive part.

[0165] [Example 16]

[0166] Fig.21A and Fig.21B is an exploded view of the chip assembly according to the sixteenth embodiment of the present invention after the chip and the ink cartridge housing are separated; Fig. 21C is a schematic diagram of a chip assembly according to a sixteenth embodiment of the present invention when viewed along the y direction; Fig.21D It is a schematic diagram of the chip assembly involved in the sixteenth embodiment of the present invention when observed along the x direction.

[0167] Compared with the thirteenth embodiment, the elastic member is not provided in this embodiment. Fig.21A and Fig.21B As shown, the conductor 107 includes a first conductive member 107a and a second conductive member 107b. The first conductive member 107a is at least used for electrical contact with the contact pin, and the second conductive member 107b is at least used for electrical contact with the chip 104 / the back contact portion 1046 / the second group of contact portions 1046. Further, the second conductive member 107b is used to make the chip 104 form electrical contact with the first conductive member 107a. Further, the first conductive member 107a and the second conductive member 107b can be formed as one piece or separately. In the present embodiment, the first conductive member 107a and the second conductive member 107b are preferably formed separately, that is, the first conductive member 107a and the second conductive member 107b are separated from each other.

[0168] Since the elastic member 106 in the fourteenth and fifteenth embodiments is conductive, it can be considered as the second conductive member 107b in this embodiment. Specifically, in the fourteenth embodiment, the elastic member 106 and the chip 104 are arranged in the y direction, for example, at this time, the elastic member 106 can be electrically contacted with the reverse contact portion / second group of contact portions 1046 disposed on the third side 104c; in the fifteenth embodiment, the elastic member 106 and the chip 104 are arranged in the x direction, for example, at this time, the elastic member 106 is electrically contacted with the reverse contact portion / second group of contact portions 1046 disposed on the second side 1049 and / or the third side 104c; in other embodiments, the elastic member 106 and the chip 104 can also be arranged in the z direction.

[0169] Along the direction in which the second conductive member 107b extends, the chip 104 is spaced apart from the first conductive member 107a. Specifically, the direction in which the second conductive member 107b extends refers to the direction in which the second conductive member 107b extends toward the reverse contact portion / the second group of contact portions 1046. For example, in this embodiment, the second conductive member 107b extends toward the reverse contact portion / the second group of contact portions 1046 along the x direction. In the x direction, the second conductive member 107b is located in the +x direction of the first conductive member 107a, and the second conductive member 107b is located in the -x direction of the chip 104. That is, the second conductive member 107b is disposed between the chip 104 and the first conductive member 107a. Further, the second conductive member 107b is disposed between the chip 104 and the first conductive member 107a. One end of b is electrically in contact with the chip 104, and the other end is electrically in contact with the first conductive member 107a. Furthermore, along the x direction / the thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the chip 104 is provided with a first mounting hole 10491, the first conductive member 107a is provided with a second mounting hole 107a1, and one end of the second conductive member 107b is combined with the first mounting hole 10491. Specifically, the second conductive member 107b has a first portion 107b1, a second portion 107b2, and a third portion 107b3 located between the first portion 107b1 and the second portion 107b2. The first portion 107b1 is used to connect with the first mounting hole 10491. The second portion 107b2 is used to be combined with the second mounting hole 107a1. When the first conductive member 107a and the second conductive member 107b are integrally formed, the second mounting hole 107a1 can be cancelled. Along the x direction / the thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the third portion 107b3 is a step surface formed between the first portion 107b1 and the second portion 107b2; the reverse contact portion / the second group of contact portions 1046 is arranged on the second side 1049 of the chip 104. Preferably, the reverse contact portion / the second group of contact portions 1046 is arranged to extend around the edge of the first mounting hole 10491. The reverse contact portion / the second group of contact portions 1046 is arranged to extend around the edge of the first mounting hole 10491. 6 may be a complete ring extending around the edge of the first mounting hole 10491, for example, in the shape of a circular ring, or may be a strip-shaped structure extending around a portion of the edge of the first mounting hole 10491, for example, in the shape of an arc. While the first portion 107b1 of the second conductive member 107b is combined with the first mounting hole 10491, the third portion 107b3 is in electrical contact with the reverse contact portion / the second group of contact portions 1046, and the second portion 107b2 of the second conductive member 107b is combined with the second mounting hole 107a1, so that the electrical connection stability between the conductor 107 and the chip 104 is better, thereby forming an electrical connection path: chip 104-second conductive member 107b-first conductive member 107a-contact pin;In some embodiments, the back contact portion / second group of contact portions 1046 may also be configured as: a portion is configured on the second side 1049 of the chip, and the other portion is configured on the inner wall of the first mounting hole 10491; in some embodiments, the back contact portion / second group of contact portions 1046 may also be configured as being entirely configured on the inner wall of the first mounting hole 10491. Further, when the back contact portion / second group of contact portions 1046 is configured on the inner wall of the first mounting hole 10591, the second conductive member 107b may also be electrically connected to the back contact portion / second group of contact portions 1046 by welding / interference fit. In the x direction / thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the second conductive member 107b is arranged between the first conductive member 107a and the chip 104, that is, the chip 104 and the first conductive member 107a are arranged at intervals, that is, the first conductive member 107a does not support the chip 104, and the friction between the first conductive member 107a and the chip 104 can be avoided, so that the chip 104 can be prevented from being damaged by the first conductive member 107a. At the same time, the contact area between the second conductive member 107b and the chip 104 is small, and the friction between the second conductive member 107b and the chip 104 is small, thereby reducing the wear of the chip 104 and preventing the chip 104 from being damaged, thereby improving the reuse rate of the chip when the ink cartridge is recycled. ;

[0170] In some embodiments, along the y direction, the second conductive member 107 a is disposed between the first conductive member 107 a and the chip 104 , that is, the first conductive member 107 a and the chip 104 are spaced apart from each other.

[0171] Further, such as Fig. 21C As shown, in the x direction / thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the spacing distance between the first conductive member 107a and the chip 104 is D1, and along the +x direction (the direction of the first conductive member 107a toward the reverse contact portion / the second group of contact portions 1046), the size of the second conductive member 107b is D2, and preferably, D2 is greater than or equal to D1.

[0172] Further, such as Fig.21DAs shown, the contact area between the second conductive member 107b and the chip 104 is S1, and along the x direction / the thickness direction of the chip 104 (the arrangement direction of the first side 1048 and the second side 1049), the overlapping area between the first conductive member 107a and the substrate 1041 / the chip 104 is S2. Preferably, S1 is less than or equal to S2. Furthermore, the contact area S1 between the second conductive member 107b and the chip 104 includes a projection area S11 and a projection area S12 along the x direction. Furthermore, the projection area of ​​the region in contact with the second conductive member 107b and the reverse contact portion / second group of contact portions 1046 in the x direction is S12. The total projection area of ​​the second conductive member 107b on the second side 1049 along the x direction minus the projection area S12 is the projection area S11. In addition, when the second conductive member 107b is electrically connected to the reverse contact portion / second group of contact portions 1046 by soldering, the portion formed by the solder can be regarded as a part of the second conductive member 107b.

[0173] Since the size D2 of the second conductive member 107b is greater than or equal to the spacing distance D1 between the first conductive member 107a and the chip 104, and the contact area S1 between the second conductive member 107b and the chip 104 is less than or equal to the overlapping area S2 of the first conductive member 107a and the substrate 1041, even if the chip 104 is squeezed by external force and produces elastic deformation / displacement, it is difficult for the first conductive member 107a to rub against the non-contact part of the substrate 1041, and only the second conductive member 107b in the conductor 107 rubs against the reverse contact part / the second group of contact parts 1046. Therefore, the conductor 107 is not easy to damage the chip 104 (for example, the insulating layer).

[0174] Along the -x direction, the chip 104 is installed toward the chip accommodating portion 1050. Specifically, during installation, the second conductive member 107b can be first fixed on the substrate 1041 of the chip 104, and then the first conductive member 107a can be fixed on the ink cartridge 10. Preferably, the first conductive member 107a is fixed on the positioning plate 105, and finally the combination of the chip 104 / substrate 1041 and the second conductive member 107b is installed on the ink cartridge 10 / positioning plate 105, or finally the chip 104 / substrate 1041 is installed on the ink cartridge 10 / positioning plate 105; or first the second conductive member 107b is fixed on the first conductive member 107a, and then the subsequent installation steps are performed. Preferably, during installation, the second conductive member 107b is first welded to the substrate 1041 / chip 104, and then the combination of the substrate 1041 / chip 104 and the second conductive member 107b is installed on the ink cartridge 10; more preferably, the second conductive member 107b is fixed to the second mounting hole 107a1 on the first conductive member 107a by pressing (interference fit).

[0175] In this embodiment, in the y direction and / or the z direction, the first conductive member 107a overlaps with the chip 104. Further, the first conductive member 107a is combined with the housing 101. Preferably, the first conductive member 107a is snapped to the positioning plate 105. In this embodiment, the second blocking portion 105d of the positioning plate 105 is arranged on the side close to the +y direction. The second blocking portion 105d is used to cooperate with the first conductive member 107a. The card slot 105e of the positioning plate 105 is extended along the z direction. The card slot 105e is used to cooperate with the first conductive member 107a to guide the first conductive member 107a to be slidably installed on the positioning plate 105. That is, the card slot 105e is open toward the -z direction. Optionally, the card slot 105e can also be open toward the +z direction. Furthermore, the first conductive member 107a is open toward the +y direction. A groove portion 107a2 is provided at one end, and when the first conductive member 107a is slidably installed toward the positioning plate 105 along the +z direction, the groove portion 107a2 of the first conductive member 107a is used to cooperate with the second blocking portion 105d, so that the combination of the first conductive member 107a and the positioning plate 105 is more stable. At the same time, along the x direction, the groove portion 107a2 is located in the -x direction of the front conductive member 1074, which can make the front conductive member 1074 of the first conductive member 107a have a sufficiently large surface area to enable the contact pin to better electrically contact the front conductive member 1074.

[0176] Preferably, the reverse contact portion / the second group of contact portions 1046 is a ground terminal.

[0177] In some embodiments, the back contact portion / second group of contact portions 1046 can also be set on the third side 104c, and the back contact portion / second group of contact portions 1046 is electrically contacted with the first conductive member 107a. For example, the back contact portion / second group of contact portions 1046 is oriented in the +y direction or in the -z direction. At this time, the second conductive member 107b is set to be non-conductive and is only used to support the chip 104. In this way, the design freedom of the chip 104 and the conductor 107 can be improved.

[0178] In this embodiment, after the chip 104 is installed to the ink cartridge 10 / positioning plate 105, the back contact portion / second group of contact portions 1046 is located on the second side 1049 of the substrate 1041, the second conductive member 107b is located in the -x direction of the second side 1049 of the substrate 1041, a portion of the first conductive member 107a is located in the -x direction of the second side 1049 of the substrate 1041, and another portion of the first conductive member 107a is located in the +y direction and / or -z direction of the third side 104c of the substrate 1041.

[0179] FIG. 22A to FIG. 22C is a schematic diagram of the internal structure of an ink cartridge according to a sixteenth embodiment of the present invention; Fig.22D It is a three-dimensional diagram of the ink cartridge involved in the sixteenth embodiment of the present invention when viewed from another angle.

[0180] like Figure 22A-22D As shown, in this embodiment, the ink cartridge 10 includes a first ink chamber 201a, a second ink chamber 201b and a third ink chamber 201c for accommodating ink, wherein the first ink chamber 201a and the second ink chamber 201b are interconnected, and the second ink chamber 201b and the third ink chamber 201c are interconnected. Further, the first ink chamber 201a is connected to the ink outlet portion 102, and the ink in the first ink chamber 201a is supplied to the imaging device through the ink outlet portion 102. A sponge is provided in the third ink chamber 201c or the second air chamber 201e described later, and the sponge is used to absorb part of the ink and cover the third air guide port 202d described later to prevent ink from flowing back; the ink cartridge 10 also includes an air inlet chamber 201f, a first air chamber 201d and a second air chamber 201e, wherein the air inlet chamber 201f can be interconnected with the atmosphere, the first air chamber 201d and the second air chamber 201e are interconnected, and the second air chamber 201e and the third ink chamber 201c are interconnected.

[0181] Furthermore, the atmosphere is interconnected with the air inlet cavity 201f through the air inlet 202a. In the Z direction, the air inlet 202a and the ink outlet 1022 provided in the ink outlet portion 102 are both located on the side facing the -z direction, and the air inlet 202a and the ink outlet 1022 are arranged adjacent to each other. The air inlet cavity 201f and the first air cavity 201d are interconnected through the first air guide 202b. After the atmosphere enters the air inlet cavity 201f from the air inlet 202a, it enters the air inlet cavity 201f from the first air guide 202b. The air guide port 202b enters the first air cavity 201d; the first air cavity 201d and the second air cavity 201e are interconnected through the second air guide port 202c, the second air cavity 201e and the third ink cavity 201c are interconnected through the third air guide port 202d, the third ink cavity 201c and the second ink cavity 201b are connected through the first connecting port 202e, and the second ink cavity 201b and the first ink cavity 201a are connected through the second connecting port 202f.

[0182] Furthermore, before the ink cartridge 10 is used, the air inlet 202a and the ink outlet 1022 are sealed by the sealing member 1021 at the same time. Preferably, the sealing member 1021 is a sealing film. When the ink cartridge 10 is installed in place, the ink absorbing member provided in the imaging device pierces the sealing member 1021 and combines with the ink outlet portion 102. At this time, the air inlet 202a is connected to the atmosphere, and the atmosphere enters the interior of the ink cartridge 10 from the air inlet 202a to balance the air pressure inside and outside the ink cartridge 10, thereby allowing the ink to flow out.

[0183] Furthermore, the sponge provided in the third ink chamber 201c or the second air chamber 201e is used to retain ink to prevent the ink from flowing out from the third air port 202d. Moreover, even if the ink flows out from the third air port 202d, it will first be accommodated by the second air chamber 201e and will not immediately flow out of the ink cartridge 10, thereby avoiding contamination of the ink cartridge 10 and the imaging device.

[0184] Furthermore, the ink cartridge 10 also includes an ink level detection component 110, which is used to detect the amount of ink in the ink cartridge 10. Preferably, the ink level detection component 110 is arranged on the lower side wall 101d of the ink cartridge 10, and more preferably, the ink level detection component 110 is arranged as a prism.

Claims

1. A chip assembly, arranged on an ink cartridge detachably mounted on an imaging device having a stylus, the chip assembly being used to form an electrical contact with the stylus to establish a communication connection with the imaging device, wherein: The chip assembly includes a chip, an elastic member, a conductive member and a positioning plate for accommodating the chip, the chip includes a substrate and a plurality of contact portions arranged on the substrate, the substrate has a first side and a second side arranged opposite to each other and a third side located between the first side and the second side; the plurality of contact portions include a front contact portion arranged on the first side and a back contact portion not arranged on the first side; A first set of contacts is provided on the first side for making direct electrical contact with the contact pins; The second group of contact portions is at least arranged on the second side or the third side, and is configured to indirectly form electrical contact with the contact pins through the conductive member under the action of the elastic member.

2. The chip assembly according to claim 1, characterized in that: The conductive member forms electrical contact with the second group of contact parts under the pressure of the elastic member.

3. The chip assembly as claimed in claim 2, characterized in that: The second group of contact parts is at least partially arranged on the second side, and the elastic member presses the conductive member so that the reverse conductive member is in electrical contact with the second group of contact parts on the second side.

4. The chip assembly according to claim 1, characterized in that: The positioning plate is provided with a chip accommodating cavity for accommodating a chip.

5. The chip assembly as claimed in claim 4, characterized in that: The positioning plate is provided with a card slot for card-connecting a chip, and the card slot is open toward at least one of the -y direction, the +y direction, the -z direction and the +z direction.

6. The chip assembly as claimed in claim 4, characterized in that: At least one of the conductive member and the elastic member is disposed in the chip receiving cavity.

7. The chip assembly according to any one of claims 1 to 6, characterized in that: The elastic member is conductive, and the conductive member forms electrical contact with the second group of contact parts through the elastic member.

8. The chip assembly according to claim 7, characterized in that: The second group of contact portions is at least partially disposed on the third side, and the reverse conductive member forms indirect electrical contact with the second group of contact portions through the elastic member.

9. The chip assembly according to claim 7, characterized in that: The elastic member is configured as a cantilever integrally formed with the positioning plate or as a spring separately formed with the positioning plate.

10. An ink cartridge detachably mounted in an imaging device having a stylus, the ink cartridge comprising a housing for containing ink, wherein: The ink cartridge comprises a chip assembly as claimed in any one of claims 1 to 9, wherein the chip assembly is arranged on a housing, and the chip assembly is used to form an electrical contact with a contact pin to establish a communication connection with an imaging device.

Images