Microchip applied to micro electro mechanical system (MEMS) and laser equipment

Abstract

The invention provides a microchip applied to a micro electro mechanical system (MEMS) and laser equipment. The microchip and the laser equipment can be applied to multiple fields such as laser head-up displays, MEMS laser radars and intelligent laser headlamps. The chip provided by the invention comprises a movable plane, a first movable comb, a first supporting beam and a first relative fixing structure. Wherein the first relative fixing structure and the movable plane are connected through a first supporting beam, and the first relative fixing structure comprises a protruding first fixing tooth comb. Specifically, a first movable tooth comb is formed on the surface of the movable plane, the first movable tooth comb comprises a plurality of comb teeth partially protruding out of the movable plane, and meanwhile the comb teeth of the first movable tooth comb and the comb teeth of the first fixed tooth comb are arranged in a crossed mode. The first supporting beam can drive the movable plane to move horizontally or rotate around the first supporting beam according to the first driving force. The chip provided by the invention has relatively high heat dissipation capability, and can improve the performance of a system when being applied to the system.

Description

Technical Field

[0001] The present application relates to the technical field of micro-electromechanical systems, and more specifically, to a microchip and a laser device applied to micro-electromechanical systems (MEMS). Background Art

[0002] Micro-electro-mechanical system (MEMS) is a miniature intelligent system that uses integrated circuit manufacturing and three-dimensional silicon micromachining technology to manufacture micron or even nanoscale structures, sensors, control processing circuits and even interfaces, communications and power supplies on one or more chips. It can provide intelligent devices with the ability to perceive and even process the external environment. It can be used in many fields such as smart glasses, laser head-up displays, MEMS lidar, smart laser headlights, medical detection image scanning, interpersonal interaction sensing, holographic projection, three-dimensional depth cameras, etc.

[0003] In laser beam scanning display technology, by applying an electrical signal to drive the MEMS micromirror to rotate, the incident light can be emitted in different reflection directions, and the different colors and brightness of the light source can be modulated to achieve image projection display. In order to improve the brightness of the projection, a high-power laser is usually used to generate the incident light. Depending on the different usage scenarios, the average power of the incident light incident on the micromirror may range from 0.1W to 50W. However, when tens of watts of incident light are irradiated on the MEMS micromirror, even if the reflectivity of the MEMS micromirror surface is high, some of the light will still be absorbed by the MEMS micromirror. Due to the small size of MEMS devices, the absorbed energy will cause a high temperature rise, which will cause the failure or performance drift of the MEMS micromirror.

[0004] Currently, common heat dissipation methods include heat sink fins, thermoelectric cooling and temperature control, etc. However, these solutions have limited effects on MEMS microchips (such as the micromirrors mentioned above). This is because the area where the temperature rise occurs is generally inside the microchip, rather than on the surface of the device. In addition, there is also a way to increase the reflectivity of the microchip to light by coating the surface of the microchip with a high-reflective film, but it is very difficult to further increase the reflectivity of the high-reflective film. Therefore, how to reduce the temperature of the microchip, that is, to enhance the heat dissipation capacity of the microchip, is a problem that needs to be solved. Summary of the invention

[0005] The present application provides a microchip and a laser device applied to a micro-electromechanical system (MEMS), which can enhance the heat dissipation capability of the microchip in the MEMS.

[0006] In the first aspect, a microchip applied to a micro-electromechanical system (MEMS) is provided. The microchip comprises: an active plane, a first active tooth comb, a first support beam and a first relatively fixed structure, wherein the first relatively fixed structure and the active plane are connected via the first support beam, and the first relatively fixed structure comprises a protruding first fixed tooth comb. The active plane is used as a base of the first active tooth comb, and the first active tooth comb is formed on the surface of the active plane; the first active tooth comb comprises a plurality of comb teeth partially protruding from the active plane, and the plurality of comb teeth of the first active tooth comb are cross-arranged with the plurality of comb teeth of the first fixed tooth comb; the first support beam is used to drive the active plane to translate according to a first driving force or to drive the active plane to rotate around the first support beam.

[0007] It should be noted that, in the present application, the first movable tooth comb or the first fixed tooth comb includes at least one part. Exemplarily, when the first movable tooth comb includes one part, the first fixed tooth comb also includes one part accordingly. When the first movable tooth comb includes two parts, the first fixed tooth comb also includes two parts accordingly. Of course, the first movable tooth comb or the first fixed tooth comb may also include three or four parts. Generally speaking, when the first movable tooth comb includes two parts, the two parts of the first movable tooth comb are arranged opposite to each other along the two sides of the movable plane and protrude from the movable plane.

[0008] Based on the microchip provided by the present application, by forming a first movable tooth comb on the surface of the movable plane, and forming a first fixed tooth comb on the first relatively fixed structure, and arranging multiple comb teeth of the first movable tooth comb and multiple comb teeth of the first fixed tooth comb crosswise, the heat generated by the microchip during use is transferred to the first fixed tooth comb through the first movable tooth comb, and the heat is extracted from the microchip through the first fixed number of teeth, thereby achieving the purpose of enhancing the heat dissipation capacity of the microchip, and then achieving the effect of improving the performance of the microchip. In addition, by arranging the first movable tooth comb on the surface of the movable plane, the thickness of the movable plane and the first movable tooth comb will not restrict each other, but can be designed differently according to different application scenarios, thereby achieving the effect of improving design flexibility.

[0009] In combination with the first aspect, in some implementations of the first aspect, the microchip further includes a first isolation structure, the first isolation structure is formed between the movable plane and the first movable tooth comb, and the first isolation structure is used to connect the first movable tooth comb and the movable plane.

[0010] In some embodiments, the thickness of the first isolation structure along the vertical direction is less than the thickness of the active plane along the vertical direction. By making the first isolation structure thinner, the overall thickness of the microchip can be reduced, thereby achieving the effect of reducing the volume of the microchip.

[0011] In other embodiments, the first isolation structure may be formed on the entire surface of the active plane, or may be formed only on the surface of the active plane where the first active tooth comb exists.

[0012] In the present application, the material of the first isolation structure may be a non-metallic material, such as silicon, silicon dioxide, silicon carbide or silicon nitride, or may be a metal material, such as gold, aluminum, copper, etc., which is not limited in the present application.

[0013] By forming a first isolation structure between the surface of the movable plane and the first movable tooth comb, the adhesion between the first movable tooth comb and the movable plane can be increased. At the same time, compared with the process of directly forming the first movable tooth comb on the movable plane, the process of forming the first movable tooth comb on the first isolation structure is more mature and more reliable. Therefore, this solution can also reduce the complexity of the process. In addition, when the isolation structure is an insulating material, this solution can also increase the degree of freedom of electrical design and achieve electrical isolation between the movable plane and the first movable tooth comb.

[0014] In combination with the first aspect, in some implementations of the first aspect, the first movable tooth comb is located on a surface of the movable plane close to the first support beam.

[0015] In combination with the first aspect, in some implementations of the first aspect, the first movable tooth comb is located on a surface of the movable plane away from the first support beam.

[0016] It should be noted that in the present application, the positions of the first movable tooth comb and the first fixed tooth comb can be flexibly set, that is, they can be close to the first support beam or far away from the first support beam, so the microchip of the present application can be designed into a variety of spatial structures to meet different application requirements. Generally speaking, when the first movable tooth comb is close to the first support beam, the rotational inertia of the microchip can be made smaller.

[0017] In addition, in the present application, no matter the first movable tooth comb is located on the surface of the movable plane close to the first support beam, or the first movable tooth comb is located on the surface of the movable plane away from the first support beam, the protruding direction of the first movable tooth comb can be parallel to the length direction of the first support beam, can be perpendicular to the length direction of the first support beam, or can have a certain angle with the length direction of the first support beam, that is, the protruding direction of the first movable tooth comb is inclined to the length direction of the first support beam.

[0018] In combination with the first aspect, in some implementations of the first aspect, the microchip further includes a first driving structure, the first driving structure is located on the surface of the active plane, and the first driving structure is used to provide the first driving force.

[0019] It should be noted that, in the present application, the first driving structure includes but is not limited to an electromagnetic coil, a permanent magnet or a piezoelectric film.

[0020] In addition, the first driving structure may surround the optical structure or be distributed around the optical structure. For example, the first driving structure may be a multi-turn electromagnetic coil surrounding the optical structure, or may be a piezoelectric film surrounding the optical structure, or may be one or more permanent magnets distributed outside the optical structure.

[0021] In some embodiments, if the first driving structure is an electromagnetic coil, the number of turns of the electromagnetic coil is greater than or equal to 1, the diameter of each turn of the electromagnetic coil is 5um-100um, and the thickness of the electromagnetic coil along the vertical direction is 0.1um-100um.

[0022] In some other embodiments, if the first driving structure is a piezoelectric film, the thickness of the piezoelectric film along the vertical direction is 0.1 um-100 um.

[0023] In some other embodiments, when the first driving structure is an electromagnetic coil or a permanent magnet, the periphery of the microchip includes a magnet for providing a magnetic field.

[0024] Based on the above scheme, the scheme of the present application sets the first driving structure on the microchip, making the structure of the microchip more compact. At the same time, the microchip provided by the present application can be designed as different driving modes according to different application scenarios, which increases the flexibility of the design.

[0025] In combination with the first aspect, in certain implementations of the first aspect, the microchip further includes an optical structure, and the active plane is also used as a substrate for the optical structure; the optical structure is formed on a surface of the active plane, and the optical structure is used to process incident light.

[0026] In combination with the first aspect, in some implementations of the first aspect, the optical structure is a plane reflector, a transmission element, a grating, or a micro-nano structure layer.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the optical structure is a single layer or a multilayer, and materials of two adjacent layers in the multilayer are different.

[0028] Based on the above scheme, the microchip provided by the present application can realize different functions according to different optical structures. In addition, the optical structure can be designed as a multilayer structure, for example, it can be designed as a combination structure of a reflector and a transmission element to realize the reflection of light of different wavelengths. Or the optical structure can be designed as a grating or a micro-nano structure layer to realize the modulation of the phase and / or amplitude of the incident light.

[0029] It should be understood that the above-mentioned plane mirrors, transmission elements, gratings or micro-nano structures are only common applications in MEMS, and other possible optical structures in some MEMS, such as optical films, should also be included in the protection scope of this application.

[0030] It should be noted that when the optical structure is multi-layer, the multi-layer structures can be the same. Exemplarily, if the optical structure is a double-layer grating, the present application only limits the materials of the double-layer plane reflector to be different.

[0031] In some embodiments, the thickness of a single layer of the optical structure along the vertical direction is 0.01um-10um. If the optical structure is a grating, the thickness of the grating along the vertical direction is 0.02um-10um.

[0032] In other embodiments, when the optical structure is a grating, the grating may be a periodic grating or a non-periodic grating, which is not limited in the present application. If the grating is a periodic grating, the grating period is 10um-3000um.

[0033] It should be noted that the size of the optical structure is less than or equal to the size of the active plane. Exemplarily, when the cross section of the active plane along the horizontal plane is rectangular, if the optical structure is a plane reflector, the length and / or width of the plane reflector is less than the side length of the corresponding active plane. If the optical structure is a grating, the surface of the active plane is a plurality of rectangular parallelepipeds arranged regularly or irregularly, then the length of the rectangular parallelepiped grating is less than or equal to the side length of the corresponding active plane, and the total width of the grating is less than or equal to the side length of the corresponding active plane.

[0034] In combination with the first aspect, in some implementations of the first aspect, the microchip further includes a reinforcement structure, wherein the reinforcement structure is formed on a surface of the active plane, and the reinforcement structure is used to increase the strength of the active plane.

[0035] It should be noted that the reinforcement structure and the optical structure are formed on different surfaces of the microchip.

[0036] By arranging a reinforcement structure on the surface of the active plane, the rigidity of the microchip can be improved and the deformation of the microchip caused by residual stress can be reduced.

[0037] In combination with the first aspect, in some implementations of the first aspect, the reinforcement structure is directly connected to part or all of the first movable tooth comb.

[0038] In combination with the first aspect, in certain implementations of the first aspect, a thickness of the reinforcement structure along the vertical direction is different from a thickness of the activity plane along the vertical direction.

[0039] In combination with the first aspect, in certain implementations of the first aspect, a thickness of the reinforcement structure along the vertical direction is greater than a thickness of the activity plane along the vertical direction.

[0040] It should be noted that there may be an isolation structure between the reinforcement structure and the surface of the movable plane for fixing the reinforcement structure. Exemplarily, when the first isolation structure is formed on the entire surface of the movable plane, the isolation structure between the reinforcement structure and the surface of the movable plane may be the first isolation structure. Alternatively, a third isolation structure is formed on the surface of the movable plane, which is not limited in this application.

[0041] In some embodiments, the width of the reinforcement structure along the horizontal plane is 10 um-1000 um.

[0042] In other embodiments, the shape of the reinforcement structure may include at least one part, such as a rectangular frame, or two rectangular frames, or a rectangular frame with two cross beams connecting the diagonals of the rectangular frames.

[0043] Based on the above solution, the design of the reinforcement structure of the present application can be flexibly designed according to different application scenarios, and the present application does not limit the shape of the reinforcement structure. When the reinforcement structure is connected to part of the first movable tooth comb, the rigidity of the first movable tooth comb can be increased and the deformation of the first movable tooth comb can be reduced.

[0044] In combination with the first aspect, in some implementations of the first aspect, the microchip further includes a second support beam and a second relatively fixed structure, and the second relatively fixed structure and the first relatively fixed structure are connected via the second support beam. The second support beam is used to drive the first relatively fixed structure to translate according to the second driving force or to drive the first relatively fixed structure to rotate around the second support beam.

[0045] Based on the above solution, the second support beam and the second relatively fixed structure enable the microchip to move in two dimensions in space. If the optical structure is a reflector, spatial scanning can be achieved.

[0046] In combination with the first aspect, in some implementations of the first aspect, the microchip further includes a second movable tooth comb, the second movable tooth comb is formed on the surface of the first relatively fixed structure, and the second relatively fixed structure includes a protruding second fixed tooth comb. The second movable tooth comb includes a plurality of comb teeth partially protruding from the first relatively fixed structure, and the plurality of comb teeth of the second movable tooth comb are arranged crosswise with the plurality of comb teeth of the second fixed tooth comb.

[0047] Based on the above solution, the heat of the optical structure is transferred to the second fixed tooth comb through the second movable tooth comb, and then guided out of the microchip through the second relatively fixed structure, so that the heat dissipation performance of the microchip can be further improved.

[0048] In combination with the first aspect, in certain implementations of the first aspect, the microchip also includes a second isolation structure, which is formed between the first relatively fixed structure and the second movable tooth comb, and the second isolation structure is used to connect the second movable tooth comb and the first relatively fixed structure.

[0049] By forming the second isolation structure between the surface of the first relatively fixed structure and the second movable tooth comb, the adhesion between the second movable tooth comb and the first relatively fixed structure can be increased, and the process complexity of directly forming the second movable tooth comb on the first relatively fixed structure can be reduced. In addition, electrical isolation between the first relatively fixed structure and the second movable tooth comb can also be achieved.

[0050] In some embodiments, the thickness of the second isolation structure along the vertical direction is less than the thickness of the first relatively fixed structure along the vertical direction. By making the second isolation structure thinner, materials can be saved and the thickness of the microchip can be controlled.

[0051] In other embodiments, the second isolation structure may be formed on the entire surface of the first relatively fixed structure, or may be formed only on the surface of the first relatively fixed structure where the second movable tooth comb exists.

[0052] In the present application, the material of the second isolation structure can be the same as that of the first isolation structure, which is conducive to simplifying the process flow. In combination with the first aspect, in some implementations of the first aspect, the microchip also includes a second driving structure, the second driving structure is located on the surface of the first relatively fixed structure, and the second driving structure is used to provide the second driving force.

[0053] It should be noted that in the present application, the second driving structure includes but is not limited to an electromagnetic coil, a permanent magnet or a piezoelectric film. At the same time, the second driving structure can be the same as or different from the first driving structure, and the present application does not limit it.

[0054] In some embodiments, if the second driving structure is an electromagnetic coil, the number of turns of the electromagnetic coil is greater than or equal to 1, the diameter of each turn of the electromagnetic coil is 5um-100um, and the thickness of the electromagnetic coil along the vertical direction is 0.1um-100um.

[0055] In some other embodiments, if the second driving structure is a piezoelectric film, the thickness of the piezoelectric film along the vertical direction is 0.1 um-100 um.

[0056] In some other embodiments, when the second driving structure is an electromagnetic coil or a permanent magnet, the periphery of the microchip includes a magnet for providing a magnetic field.

[0057] In combination with the first aspect, in some implementations of the first aspect, the side surface of the movable plane includes a protruding third movable tooth comb, and each comb tooth of the third movable tooth comb partially or completely overlaps with each comb tooth of the first movable tooth comb.

[0058] In combination with the first aspect, in some implementations of the first aspect, the first relatively fixed structure also includes a protruding third fixed tooth comb, and each comb tooth of the third fixed tooth comb partially or completely overlaps with each comb tooth of the first fixed tooth comb.

[0059] In combination with the first aspect, in certain implementations of the first aspect, the first relatively fixed structure further includes a protruding fourth movable tooth comb, and each tooth of the fourth movable tooth comb partially or completely overlaps with each tooth of the second movable tooth comb.

[0060] In combination with the first aspect, in some implementations of the first aspect, the second relatively fixed structure further includes a protruding fourth fixed tooth comb, each tooth of the fourth fixed tooth comb partially or completely overlaps with each tooth of the second fixed tooth comb. In combination with the first aspect, in some implementations of the first aspect, a thickness of the movable plane along the vertical direction is different from a thickness of the first movable tooth comb along the vertical direction.

[0061] In combination with the first aspect, in some implementations of the first aspect, a thickness of the movable plane along the vertical direction is smaller than a thickness of the first movable tooth comb along the vertical direction.

[0062] In combination with the first aspect, in certain implementations of the first aspect, a thickness of the first relatively fixed structure along the vertical direction is different from a thickness of the second movable tooth comb along the vertical direction.

[0063] In combination with the first aspect, in certain implementations of the first aspect, a thickness of the first relatively fixed structure along the vertical direction is smaller than a thickness of the second movable tooth comb along the vertical direction.

[0064] By increasing the thickness of the first movable tooth comb along the vertical direction and / or the thickness of the second movable tooth comb along the vertical direction, the heat dissipation surface area of ​​the movable tooth comb can be increased, thereby further improving the heat dissipation performance of the microchip.

[0065] In combination with the first aspect, in some implementations of the first aspect, a thickness of the active plane along the vertical direction is different from a thickness of the first isolation structure along the vertical direction.

[0066] In combination with the first aspect, in some implementations of the first aspect, a thickness of the active plane along the vertical direction is greater than a thickness of the first isolation structure along the vertical direction.

[0067] In combination with the first aspect, in some implementations of the first aspect, the number of comb teeth included in the first movable tooth comb is greater than or equal to 3.

[0068] In combination with the first aspect, in certain implementations of the first aspect, the length of each tooth of the first movable tooth comb protruding from the active plane is 20um-1000um, the thickness of each tooth of the first movable tooth comb along the vertical direction is 10um-1000um, and the width of each tooth of the first movable tooth comb along the cross section of the horizontal plane is 3um-300um.

[0069] In combination with the first aspect, in certain implementations of the first aspect, the length of each tooth of the first fixed tooth comb protruding from the first relatively fixed structure is 20um-1000um, the thickness of each tooth of the first fixed tooth comb along the vertical direction is 10um-1000um, and the width of each tooth of the first fixed tooth comb along the cross section of the horizontal plane is 3um-300um.

[0070] In some embodiments, the cross-section of the first movable tooth comb and the first fixed tooth comb along the horizontal plane is in a rectangular, trapezoidal, triangular or other shapes.

[0071] Exemplarily, if the shape of the cross-section of the comb teeth along the horizontal plane is a rectangle, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the width of the rectangle; if the shape of the cross-section of the comb teeth along the horizontal plane is a triangle, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the length of the base of the triangle; if the shape of the cross-section of the comb teeth along the horizontal plane is a trapezoid, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the length of the upper or lower side of the trapezoid.

[0072] In combination with the first aspect, in some implementations of the first aspect, the thickness of the movable plane along the vertical direction is 10um-500um, and the size of the cross section of the movable plane along the horizontal plane is 0.5mm-30um.

[0073] It should be noted that in the embodiment of the present application, the size of the cross section of the movable plane along the horizontal plane needs to be specifically described according to the shape of the cross section of the movable plane along the horizontal plane. Exemplarily, when the shape of the cross section of the movable plane along the horizontal plane is a rectangle, the size of the cross section of the movable plane along the horizontal plane is the side length (length and width) of the rectangle. That is, the length and width of the rectangle both satisfy the length range of 0.5mm-30mm. Alternatively, when the shape of the cross section of the movable plane along the horizontal plane is a circle, the size of the cross section of the movable plane along the horizontal plane is the diameter of the circle. When the shape of the cross section of the movable plane along the horizontal plane is a polygon, the size of the cross section of the movable plane along the horizontal plane is the range of each side length of the polygon.

[0074] In combination with the first aspect, in certain implementations of the first aspect, a spacing between each comb tooth of the first movable comb and a comb tooth of an adjacent first fixed comb is 1 um-100 um.

[0075] It should be noted that the interval between each comb tooth of the first movable comb and the adjacent comb teeth of the first fixed comb may be the distance between the center lines of the two adjacent combs.

[0076] In combination with the first aspect, in certain implementations of the first aspect, the number of comb teeth included in the second movable tooth comb is greater than or equal to 3.

[0077] In combination with the first aspect, in certain implementations of the first aspect, the length of each tooth of the second movable tooth comb protruding from the first relatively fixed structure is 20um-1000um, the thickness of each tooth of the second movable tooth comb along the vertical direction is 10um-1000um, and the width of each tooth of the second movable tooth comb along the cross section of the horizontal plane is 3um-300um.

[0078] In combination with the first aspect, in certain implementations of the first aspect, the length of each tooth of the second fixed tooth comb protruding from the second relatively fixed structure is 20um-1000um, the thickness of each tooth of the second fixed tooth comb along the vertical direction is 10um-1000um, and the width of each tooth of the second fixed tooth comb along the cross section of the horizontal plane is 3um-300um.

[0079] In some embodiments, the cross-section of the second movable tooth comb and the second fixed tooth comb along the horizontal plane is in a rectangular, trapezoidal, triangular or other shapes.

[0080] Exemplarily, if the shape of the cross-section of the comb teeth along the horizontal plane is a rectangle, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the width of the rectangle; if the shape of the cross-section of the comb teeth along the horizontal plane is a triangle, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the length of the base of the triangle; if the shape of the cross-section of the comb teeth along the horizontal plane is a trapezoid, the width of the cross-section of each comb tooth along the horizontal plane is expressed as the length of the upper or lower side of the trapezoid.

[0081] In combination with the first aspect, in certain implementations of the first aspect, an interval between each comb tooth of the second movable comb and an adjacent comb tooth of the second fixed comb is 1 um-100 um.

[0082] It should be noted that the interval between each comb tooth of the second movable comb and the comb teeth of the adjacent second fixed comb may be the distance between the center lines of the two adjacent combs.

[0083] In a second aspect, an embodiment of the present application provides a laser device. The device includes a laser and the microchip described in the first aspect and any possible implementation of the first aspect. The laser is used to generate the incident light.

[0084] In a third aspect, an embodiment of the present application provides a vehicle, wherein the vehicle comprises a laser device and a vehicle body as described in the implementation of the second aspect, wherein the laser device is disposed on the vehicle body.

[0085] The beneficial effects brought about by the above-mentioned second and third aspects can be specifically referred to the description of the beneficial effects in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] Figure 1 Schematic diagram of the structure of a laser scanning device 100 suitable for an embodiment of the present application.

[0087] Figure 2 A schematic structural diagram of a microchip 200 applied to a micro-electromechanical system MEMS provided in an embodiment of the present application.

[0088] Figure 3 A cross-sectional view of the activity plane provided in an embodiment of the present application.

[0089] Figure 4 A schematic diagram of the size of each comb tooth and the size of the movable plane of the first movable tooth comb provided in an embodiment of the present application.

[0090] Figure 5 The size of each comb tooth of the first fixed number of teeth provided in the embodiment of the present application.

[0091] Figure 6Four possible comb tooth shapes are provided for the embodiments of the present application.

[0092] Figure 7 A schematic structural diagram of a first position of a first movable tooth comb provided in an embodiment of the present application.

[0093] Figure 8 A schematic structural diagram of the second position of the first movable tooth comb provided in an embodiment of the present application.

[0094] Fig. 9 A schematic structural diagram of an optical structure of two optical layers provided in an embodiment of the present application.

[0095] Fig.10 This is an enlarged front schematic diagram of a first implementation method of the first isolation structure provided in an embodiment of the present application.

[0096] Fig.11 This is an enlarged schematic diagram of the back side of a first implementation method of the first isolation structure provided in an embodiment of the present application.

[0097] Fig.12 This is a schematic diagram of the back structure of the microchip 200 provided in an embodiment of the present application.

[0098] Fig.13 A cross-sectional schematic diagram of a second implementation of the first isolation structure provided in an embodiment of the present application.

[0099] Fig.14 A schematic diagram of the position of the first driving structure provided in an embodiment of the present application.

[0100] Fig.15 A schematic diagram of the position of the second first driving structure provided in an embodiment of the present application.

[0101] Fig.16 Schematic structural diagrams of four common reinforcement structures 290 provided in the embodiments of the present application.

[0102] Fig.17 A schematic diagram of the back structure of a microchip including a second isolation structure provided in an embodiment of the present application.

[0103] Fig.18 A schematic structural diagram of a microchip 1800 applied to a micro-electromechanical system MEMS provided in an embodiment of the present application.

[0104] Fig.19 A schematic diagram of the position of the third first driving structure provided in an embodiment of the present application.

[0105] Fig. 20 A schematic diagram of the positions of the first drive structure and the second drive structure provided in an embodiment of the present application.

[0106] Fig.21 A schematic structural diagram of a microchip 2100 applied to a micro-electromechanical system (MEMS) provided in an embodiment of the present application.

[0107] Fig. 22 This is a schematic diagram of a partially enlarged structure of a microchip 2100 provided in an embodiment of the present application and having a third isolation structure formed thereon.

[0108] Fig.23 A schematic structural diagram of a microchip 2300 including a third movable tooth comb and a third fixed tooth comb provided in an embodiment of the present application.

[0109] Fig.24 This is a first overlapping relationship between the third movable tooth comb and the first movable tooth comb provided in the embodiment of the present application.

[0110] Fig.25 This is a second overlapping relationship between the third movable tooth comb and the first movable tooth comb provided in the embodiment of the present application.

[0111] Fig.26 This is a third overlapping relationship between the third movable tooth comb and the first movable tooth comb provided in the embodiment of the present application.

[0112] Fig. 27 A schematic diagram of a usage scenario of a vehicle 2700 is also provided for the embodiment of the present application. DETAILED DESCRIPTION

[0113] In order to facilitate understanding of the embodiments of the present application, the following explanation is made.

[0114] First, the terms "first", "second", etc. and various numbers in the text descriptions or drawings of the embodiments of the present application shown below are only used for the convenience of description, and are not necessarily used to describe a specific order or sequence, and are not used to limit the scope of the embodiments of the present application. For example, to distinguish different frames, different support beams, different tooth combs or different optical structure layers, etc.

[0115] Second, the term "comprising" and any variations thereof in the embodiments of the present application shown below are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0116] Third, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions, and the embodiments or designs described as "exemplary" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way for easy understanding.

[0117] Fourth, in the description of the embodiments of the present application, "plurality" refers to two or more than two, "at least one" and "one or more" refer to one, two or more than two. The singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0118] Fifth, the references to "one embodiment" or "some embodiments" etc. described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0119] Sixth, in the description of the embodiments of the present application, the terms "upper", "lower", "vertical", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the devices or components referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientations of the components placed in the drawings, and therefore cannot be understood as limitations on the present application. For example, in the description of the embodiments of the present application, "thickness in the vertical direction" means that when the chip is placed horizontally for use, the length of each component of the chip in the vertical direction represents the thickness of each component.

[0120] Seventh, the same reference numerals are used in the embodiments of the present application to represent the same components or parts. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0121] Eighth, unless otherwise defined, all terms (including technical terms and scientific terms) used in this application have the same meaning as commonly understood by a person of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0122] Ninth, in the present application, "micro-nano structure layer" refers to a periodically arranged micro-nano structure, and the period of the micro-nano structure layer is less than the incident wavelength. It is a functional film layer device based on a subwavelength structure, which can modulate at least one of the phase, amplitude and polarization of the incident light incident to the micro-nano structure. Among them, the "period of the micro-nano structure layer" refers to the distance between the centers of any two adjacent micro-nano structures. In some usage scenarios, the micro-nano structure layer can also be called a metasurface, a metasurface structure layer, a metasurface, a metasurface structure or a two-dimensional metamaterial.

[0123] Tenth, in the present application scheme, it involves "forming" an isolation structure (including the first isolation structure, the second isolation structure, etc.), an active tooth comb, etc. on an active plane. "Forming" on the active plane can be by deposition, including but not limited to the following methods: molecular beam epitaxy (MBE), single crystal thin film bonding, physical vapor deposition (PVD), for example, magnetron sputtering, thermal evaporation, electron beam evaporation, pulsed laser deposition, electroplating, etc., chemical vapor deposition (CVD), organic spin coating, etc.

[0124] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0125] The MEMS device and MEMS system provided in the embodiments of the present application can be applied to laser equipment and are commonly used in intelligent systems such as self-driving cars, intelligent robots, augmented reality (AR), virtual reality (VR) and mixed reality (MR).

[0126] Figure 1 FIG. 1 is a schematic diagram of a structure of a laser scanning device 100 applicable to an embodiment of the present application. Figure 1As shown, the laser scanning device 100 includes a micromirror chip 101, a laser 102, a collimator 103, a converging lens 105, and a receiver 106. Specifically, the laser beam emitted by the laser 102 is collimated and shaped by the collimator 103, and then irradiated on the micromirror chip 101. The micromirror chip 101 rotates rapidly to emit the laser beam to the surrounding target 104 to detect the surrounding environment. Subsequently, the laser beam is reflected by the target 104 and converged by the converging lens 105, and then received by the receiver 106. Since the laser beam reflected by the target 104 carries the depth information of the target, when the receiver 106 receives the laser beam reflected by the target 104, it can scan the target according to the received beam.

[0127] However, in order to improve the display brightness of laser scanning, a higher power incident light is required. Depending on the usage scenario, the average power of the incident light may range from 0.1W to 50W. When high-power incident light shines on the micromirror chip, even if the surface of the micromirror chip may have a high reflectivity, some light will still be absorbed by the micromirror chip. Due to the small size of the micromirror chip, the absorbed energy will cause a high temperature rise, which will cause the micromirror chip to fail or performance drift.

[0128] The area where the temperature rise occurs is generally inside the micromirror chip, rather than on the outer surface of the device. Therefore, conventional heat dissipation methods, such as heat sink fins, thermoelectric cooler (TEC) temperature control, etc., are very limited in effect. The current solution with better results is to coat the surface of the micromirror chip with a high-reflection film to increase the reflectivity of the micromirror chip to light, thereby equivalently reducing its absorption rate of incident light. However, it is very difficult to further improve the reflectivity of the high-reflection film, which poses a huge challenge to the manufacturing process and precision of the high-reflection film.

[0129] In view of this, the present application proposes a microchip and a laser device applied to a micro-electromechanical system (MEMS). By modifying and designing the structure of the microchip, the temperature of the microchip can be assisted in reducing, thereby achieving the effect of enhancing the heat dissipation capacity of the microchip.

[0130] Figure 2 The schematic structure diagram of a microchip 200 applied to a micro-electromechanical system MEMS provided in an embodiment of the present application. Figure 2As shown, the microchip 200 includes an active plane 220, a first active tooth comb 230 (including a first portion 231 and a second portion 232), a first support beam 240 (including a first portion 241 and a second portion 242), and a first relatively fixed structure 250 (including a first portion 251, a second portion 252, a third portion 253, and a fourth portion 254). The first relatively fixed structure 250 includes a protruding first fixed tooth comb 260 (including a first portion 261 and a second portion 262), and the first relatively fixed structure 250 and the active plane 220 are connected through the first support beam 240. The active plane 220 is used as a base of the first active tooth comb 230, and the first active tooth comb 230 is formed on its lower surface. The first active tooth comb 230 includes a plurality of comb teeth partially protruding from the active plane 220, and at the same time, the plurality of comb teeth of the first active tooth comb 230 are arranged crosswise with the plurality of comb teeth of the first fixed tooth comb 260. The first support beam 240 is used to drive the movable plane 220 to translate or drive the movable plane 220 to rotate around the first support beam 240 according to the first driving force.

[0131] In the embodiment of the present application, the active plane 220 also serves as a substrate for the optical structure 210, on which the optical structure 210 is formed, and the optical structure 210 is used to process the incident light. Figure 3 In the cross-sectional view of the active plane shown, the active plane 220 includes an upper surface 221 and a lower surface 222, wherein an optical structure 210 is formed on the upper surface 221, and a first active tooth comb 230 is formed on the lower surface 222, that is, the optical structure 210, the active plane 220 and the first active tooth comb 230 are located at different horizontal planes along the vertical direction.

[0132] It should be noted that the present application does not limit the optical structure 210 and the first movable tooth comb 230 to be formed on different surfaces of the movable plane 220. In some embodiments, the optical structure 210 and the first movable tooth comb 230 can also be formed on the same surface of the movable plane 220, for example, both are formed on the upper surface of the movable plane 220.

[0133] Exemplarily, when the microchip 200 is used in a laser scanning process, the incident light is incident on the surface of the optical structure 210, and the system drives and controls the first support beam 240 to drive the movable plane 220 to rotate or translate relative to the first relatively fixed structure 250, so that the optical structure 210 on the movable plane 220 simultaneously translates and / or rotates, thereby processing the incident light (including but not limited to reflecting the incident light, dispersing the incident light, or modulating the amplitude and / or phase of the incident light, etc.). It can be understood that when the system works for a long time or the incident light power increases, the optical structure 210 will absorb part of the energy of the incident light and generate heat energy. At this time, the generated heat is transferred to the first fixed tooth comb 260 through the first movable tooth comb 230, and is conducted out of the microchip 200 through the first relatively fixed structure 250 (for example, conducted to the heat sink of the MEMS, etc.), thereby realizing the heat dissipation function of the microchip 200.

[0134] Next, various parts of the microchip 200 provided in the embodiment of the present application and various possible expansion implementations are described in detail.

[0135] Figure 4 The diagram shows the size of each comb tooth of the first movable comb 230 and the size of the movable plane 220. Specifically, the first movable comb 230 is convex, and each comb tooth of the first movable comb 230 protrudes along the edge of the movable plane 220. The width of each comb tooth of the first movable comb 230 is 3um-300um, the thickness is 10um-1000um, and the length protruding from the edge of the movable plane 220 is 20um-1000um.

[0136] In an embodiment of the present application, the thickness of the movable plane 220 is 10um-500um. When the microchip 200 is placed horizontally, the shape of the cross section of the movable plane 220 along the horizontal plane can be a rectangle, a circle or other polygons, etc., which is not limited in the present application, wherein the size range of the cross section of the movable plane 220 along the horizontal plane is 0.5mm-30mm. Exemplarily, when the shape of the cross section of the movable plane 220 along the horizontal plane is a rectangle or other polygon, the size range refers to the range of the length of each side of the rectangle or polygon. When the shape of the cross section of the movable plane 220 along the horizontal plane is a circle, the size range refers to the diameter of the circle. Optionally, the movable plane 220 can be silicon or other semiconductor materials, such as ceramics, glass, etc.

[0137] It should be understood that in order to ensure good heat dissipation function of the microchip without significantly increasing the volume of the microchip 200, generally speaking, the thickness of the active plane can be designed to be smaller than the thickness of the first active tooth comb 230, that is, the heat dissipation area of ​​the first active tooth comb 230 is increased, and at the same time, the number of comb teeth included in the first active tooth comb 230 is designed to be greater than or equal to 3.

[0138] Figure 5 The dimensions of each comb tooth of the first fixed number of teeth 260 are shown. The protruding portion of each comb tooth of the first fixed number of teeth 260 has a length of 20um-1000um, a width of 3um-300um, and a thickness of 10um-1000um, and the number of comb teeth included in the first fixed number of teeth 260 is greater than or equal to 3.

[0139] The multiple teeth of the first movable tooth comb 230 are arranged crosswise with the multiple teeth of the first fixed tooth comb 260, and the spacing between any one tooth of the first movable tooth comb 230 and one tooth of the adjacent first fixed tooth comb 260 is 1um-100um. The spacing between an adjacent pair of teeth can be understood as the distance between the center lines of a pair of adjacent teeth, or can be understood as the distance between any same positions of a pair of teeth (for example, the distance between the same side lines). It is understood that the thickness of the first movable tooth comb 230 can be the same as or different from the thickness of the first fixed tooth comb 260, and this application does not limit it.

[0140] The present application does not limit the shapes of the first movable tooth comb 230 and the first fixed tooth comb 260. For example, Figure 6 4. The four possible comb tooth shapes provided in the embodiment of the present application are shown. Specifically, the comb tooth shapes of the first movable tooth comb 230 and the first fixed tooth comb 260 are rectangular, trapezoidal, triangular or other shapes ( Figure 6 It can be understood that when the shape of the tooth comb is described in the embodiment of the present application, it is described by describing the shape of the cross section of the tooth comb.

[0141] Optionally, in the embodiment of the present application, when the first movable tooth comb 230 is formed on the lower surface of the movable plane 220, the first movable tooth comb 230 can be formed at different positions on the lower surface of the movable plane 220. Exemplarily, Figure 7 and Figure 8 Schematic structural diagrams of the microchip 200 are shown respectively when the first movable tooth comb 230 is located at different positions. Figure 7 In the embodiment, the first movable tooth comb 230 is located on the lower surface of the movable plane 220 close to the first support beam 240. At this time, the protruding direction of the first movable tooth comb 230 is parallel to the length direction of the first support beam 240, that is, the first movable tooth comb 230 protrudes along the extension direction of the first support beam 240. Exemplarily, when the first support beam 240 is extended along the x direction, the protruding direction of the first movable tooth comb 230 is along the x direction. Figure 8In the embodiment, the first movable tooth comb 230 is located on the lower surface of the movable plane 220 away from the first support beam 240. At this time, the protruding direction of the first movable tooth comb 230 is perpendicular to the length direction of the first support beam 240, that is, the first movable tooth comb 230 protrudes along the width direction of the first support beam 240. Exemplarily, when the first support beam 240 is extended along the x direction, the protruding direction of the first movable tooth comb 230 is along the y direction.

[0142] It should be noted that when the position of the first movable tooth comb 230 changes, the position of the first fixed tooth comb 260 on the first relatively fixed structure should also change at the same time. In addition, the position of the first movable tooth comb 230 can be selected according to the use scenario of the microchip and the required performance of the microchip. For example, when the moment of inertia of the microchip 200 is required to be small, the first movable tooth comb 230 can be arranged at a position close to the first support beam.

[0143] In addition, it should be noted that the above Figure 7 and Figure 8 , two scenarios are shown in which the protruding direction of the first movable tooth comb 230 is parallel to the length direction of the first support beam 240 and perpendicular to the length direction of the first support beam 240, that is, two special scenarios in which the angle between the protruding direction of the first movable tooth comb 230 and the length direction of the first support beam 240 is 0° or 90°. More generally, in other embodiments, the protruding direction of the first movable tooth comb 230 can also form other angles with the length direction of the first support beam 240. That is, the protruding direction of the first movable tooth comb 230 is inclined to the length direction of the first support beam 240.

[0144] In an embodiment of the present application, the optical structure 210 may be a plane reflector, a transmission element, a grating, a super surface structure layer, or an optical film, etc., according to the use scenario of the microchip 200, to achieve different processing of the incident light. Exemplarily, when the microchip 200 is used to achieve reflection or refraction of the incident light, the optical structure 210 may be a plane reflector or a film. When the microchip 200 is used to select a specific wavelength in the incident light, the optical structure 210 may be a grating. When the microchip 220 is used to modulate the phase and / or amplitude of the incident light, the optical structure 210 may be a super surface structure layer. Among them, when the optical structure 210 is a plane reflector, its material may be a metal material such as gold, silver, aluminum, or may be a non-metallic material such as quartz. It may also be a mixture of metal and non-metallic materials, which is not limited in the present application. When the optical structure 210 is a grating or a micro-nano structure layer, its material may include but is not limited to common materials such as silicon, titanium dioxide, silicon nitride, gallium nitride, etc., which can ensure the maturity of the manufacturing process and achieve the purpose of cost saving.

[0145] In some embodiments, the optical structure 210 may be a single-layer structure, in which case the optical structure 210 includes a single optical layer, which may include but is not limited to the above-mentioned plane reflectors, transmission elements (such as microlenses), gratings, metasurface structure layers, or optical films, etc. In other embodiments, the optical structure 210 may be a multi-layer structure, in which case the optical structure 210 includes multiple optical layers, which may include but are not limited to the above-mentioned plane reflectors, transmission elements, gratings, metasurface structure layers, or optical films, etc. It should be noted that when the optical structure 210 is a structure of two or more layers, the two adjacent layers in the multi-layer optical layer may be two layers with the same function, such as both gratings or both metasurface structure layers, etc. Alternatively, the two adjacent layers in the multi-layer optical layer may be two layers with different functions, such as any combination of plane reflectors, transmission elements, gratings, or metasurface structure layers, etc., and the two adjacent optical layers realize different functions. In addition, when the optical structure 210 is a multi-layer structure, the materials of two adjacent layers are different, so that even if the two adjacent layers are optical layers with the same function, they can process the incident light differently. In other words, when the optical structure 210 is a structure of two or more layers, the optical structure 210 contains at least two different materials, which process the incident light differently. For example, Fig. 9 FIG. 2 shows a schematic structural diagram of an optical structure 210 with two optical layers provided in an embodiment of the present application. Fig. 9 In the embodiment, the optical structure 210 includes a first optical layer 211 and a second optical layer 212, and the first optical layer 211 and the second optical layer 212 are made of different materials. For example, when the first optical layer 211 and the second optical layer 212 are both gratings, the grating periods of the first optical layer 211 and the second optical layer 212 are different, and are respectively used to select light of different wavelengths in the incident light. When the first optical layer 211 and the second optical layer 212 are both metasurface structure layers, the periods of the first optical layer 211 and the second optical layer 212 are different, and are respectively used to modulate light of different wavelengths in the incident light. Alternatively, the first optical layer 211 and the second optical layer 212 can be a thin film for reflecting or absorbing light of different wavelengths. When the first optical layer 211 and the second optical layer 212 are different functional layers with different structures, for example, the first optical layer 211 is a metasurface structure layer, and the second optical layer 212 is a plane reflector, the incident light is first modulated by the metasurface structure layer and then reflected by the plane reflector. Of course, the first optical layer 211 and the second optical layer 212 may also be a combination of other optical layers with different functions, which will not be described in detail here.

[0146] It should also be noted that the size of the optical structure layer 210 is not greater than the size of the active plane 220. In addition, the thickness of a single layer of the optical structure 210 is 0.01um-10um. Exemplarily, when a single layer of the optical structure 210 is a grating, its thickness is 0.02um-10um, and the period of the grating is 10um-3000um.

[0147] It is understandable that the above Figure 2 The shape of the microchip 200 shown is only an example and not a limitation. Figure 2 The external shape of the microchip 200 shown is only for illustrating the structural composition of the microchip 200 and the relative position relationship of each part, and is not the only implementation method of the present application. Figure 2 The first relatively fixed structure 250 shown includes four parts, but in some illustrations, the first relatively fixed structure can also be divided into other numbers of related parts. For example, in the following FIG. 18, the first relatively fixed structure 250 can be a whole, that is, the first part 251, the second part 252, the third part 253 and the fourth part 254 are not separated separately. Figure 2 In the microchip 200 shown in the figure, the first movable tooth comb 230 and the first fixed tooth comb 260 respectively include two parts. In some embodiments, the first movable tooth comb 230 and the first fixed tooth comb 260 may only be Figure 2 For example, it only includes the first movable tooth comb 231 and the first fixed tooth comb 262, or only includes the first movable tooth comb 232 and the first fixed tooth comb 261, which is not limited in this application.

[0148] Generally speaking, the process of forming the first movable tooth comb 230 directly on the active plane 220 is relatively difficult. In order to ensure the close connection between the first movable tooth comb 230 and the active plane 220, and at the same time to ensure the stability of the microchip performance and the reliability of production, optionally, in some embodiments, the microchip 200 may also include a first isolation structure 270. Among them, the first isolation structure 270 is located between the first movable tooth comb 230 and the active plane 220, that is, the first isolation structure 270 is first formed on the second surface 222 of the active plane 220, and then the first movable tooth comb 230 is formed. Exemplarily, in a first feasible method, the first isolation structure 270 can be formed only at the position on the second surface 222 where the first movable tooth comb 230 needs to be formed. Alternatively, in a second feasible method, the first isolation structure 270 is formed on the entire surface of the second surface 222. Specifically, Fig.10 FIG. 2 shows an enlarged front view of a first implementation of the first isolation structure 270. Correspondingly, Fig.11 FIG. 2 shows an enlarged schematic diagram of the back side of the first isolation structure 270 in a first implementation manner. Fig.10 and Fig.11 It can be seen that the first isolation structure 270 exists between the movable comb teeth of the first movable comb 230 and the second surface 222 of the movable plane 220. When the first isolation structure 270 adopts the first implementation mode, Fig.12 2 shows a schematic diagram of the back structure of the microchip 200. Among them, the first isolation structure 270 is not formed at other positions of the second surface 222 of the movable plane 220, and the first isolation structure 270 only exists between the positions where each movable comb tooth coincides with the second surface 222 (the description of the first relatively fixed structure 250, the first fixed tooth comb 260 and the first movable tooth comb 230 can refer to the above Figure 2 The relevant instructions in the description will not be repeated here). Fig.13 FIG. 2 is a cross-sectional schematic diagram of a second implementation of the first isolation structure 270. Fig.13 , the first isolation structure 270 is formed on the entire surface of the second surface 222. In this case, the size of the first isolation structure 270 is the same as that of the second surface 222. Both of these methods have their own advantages. For example, compared to Fig.10 The first isolation structure 270 shown, Fig.13 The implementation method does not require patterning of the first isolation structure 270, which can further simplify the production process. Fig.13 The first isolation structure 270 shown, Fig.10 The implementation method can save materials and save production costs.

[0149] In some embodiments, the thickness of the first isolation structure 270 is less than the thickness of the active plane 220. Optionally, the material of the first isolation structure 270 is a non-metallic material, such as silicon, silicon dioxide, silicon carbide, silicon nitride, etc. Alternatively, the material of the first isolation structure 270 is a metal material, such as gold, aluminum, copper, etc., which is not limited in this application.

[0150] It can be understood that when the first movable comb 230 is formed on the upper surface 221 of the movable plane 220 , the first isolation structure 270 is formed between the upper surface 221 of the movable plane 220 and the first movable comb 230 .

[0151] In order to realize different driving modes of the microchip 200, optionally, the microchip 200 further includes a first driving structure 280. The first driving structure 280 is located on the upper surface 221 of the active plane 220, and the first driving structure 280 is used to provide a first driving force for the first support beam 240. Optionally, the first driving structure 280 can also be arranged on the lower surface 222 of the active plane 220, which is not limited in this application.

[0152] It should be noted that in Figure 2In the microchip 200 shown in the figure, the first driving structure 280 is shown in the form of an electromagnetic coil. For example, the first driving structure 280 can also be a permanent magnet (such as Fig.14 As shown), piezoelectric film (such as Fig.15 As shown) or other commonly used driving structures in MEMS.

[0153] Specifically, when the first driving structure 280 is an electromagnetic coil, the number of turns of the electromagnetic coil is greater than or equal to 1, and multiple turns of the electromagnetic coil surround the optical structure 210. At the same time, the diameter of each turn of the coil is 5um-100um, and the thickness of the electromagnetic coil is 0.1um-100um. Alternatively, when the first driving structure 280 is a piezoelectric film, the thickness of the piezoelectric film is 0.1um-100um. It can be understood that when the first driving structure is an electromagnetic coil or a permanent magnet, the microchip 200 includes a magnet for providing a magnetic field.

[0154] In some embodiments, in order to improve the rigidity of the microchip 200 and reduce the deformation of the active plane 220 in the microchip 200, the microchip 200 optionally further includes a reinforcing structure 290. The reinforcing structure 290 is formed on the lower surface 222 of the active plane 220 and is used to increase the strength of the active plane 220.

[0155] For example, Fig.16 Schematic diagrams of four common reinforcing structures 290 are shown. Fig.16 In (a), the reinforcing structure 290 is a single ring; Fig.16 In (b), the reinforcing structure 290 is a plurality of rings; Fig.16 In (c), the reinforcing structure 290 is strip-shaped. The width of the reinforcing structure is 10um-1000um, and the thickness is greater than the active plane 220, wherein the width of the reinforcing structure 290 is understood as the width of the reinforcing structure 290 in the xy plane, and the thickness is understood as the height along the z axis. It can be understood that Fig.16 This is only for illustrative purposes and does not limit the reinforcing structure 290 of the present application. In other embodiments, the reinforcing structure 290 may also be other closed or non-closed shapes, which is not limited in the present application.

[0156] It should be noted that, in some embodiments, Fig.17As shown, there is a second isolation structure 300 between the reinforcement structure 290 and the lower surface 222 of the movable plane 220, which is used to connect the movable plane 220 and the reinforcement structure 290. It can be understood that if the first isolation structure 270 is an isolation structure formed on the entire surface of the lower surface 222 of the movable plane 220, the reinforcement structure 290 can be directly formed on the first isolation structure 270 without forming a second isolation structure. It can also be understood that the reinforcement structure 290 can also be directly connected to part or all of the first movable comb teeth 230. For example, the reinforcement structure 290 can be directly connected to the first movable comb teeth 231 or the first movable tooth comb 232, or the reinforcement structure 290 can be directly connected to both the first movable comb teeth 231 and the first movable tooth comb 232. When the reinforcement structure 290 is directly connected to part or all of the first movable comb teeth 230, the rigidity of the first movable comb teeth 230 can be improved.

[0157] It is understandable that, in the present application, when the microchip 200 is further formed with a reinforcement structure 290 , the reinforcement structure 290 and the optical structure 210 are located on different surfaces of the microchip 200 .

[0158] In order to realize the two-dimensional movement of the microchip, the embodiment of the present application also provides a dual-axis microchip 1800 applied to a micro-electromechanical system MEMS, such as Fig.18 Specifically, Fig.18 In the structural schematic diagram of the microchip 1800 shown, the microchip 1800 includes an optical structure 210, an active plane 220, a first active tooth comb 230, a first support beam 240, a first relatively fixed structure 250, and the first relatively fixed structure 250 includes a protruding first fixed tooth comb 260. It also includes a second support beam 1810 and a second relatively fixed structure 1820 (including a first part 1821 and a second part 1822), the second relatively fixed structure 1820 and the first relatively fixed structure 250 are connected through the second support beam 1810, and the second support beam 1810 is used to drive the first relatively fixed structure 250 to translate according to the second driving force or drive the first relatively fixed structure 250 to rotate around the second support beam. Among them, the relevant descriptions of the optical structure 210, the active plane 220, the first active tooth comb 230, the first support beam 240, the first relative structure 250 and the first fixed tooth comb 260 can refer to the above descriptions, and will not be repeated here.

[0159] Optionally, the microchip 1800 may further include a first drive structure 280. The function of the first drive structure 280 may refer to the description of the above-mentioned related parts and will not be described again here. Fig.18 As shown, it is located on the active plane 220. Alternatively, in other embodiments, the first driving structure 280 can be as follows Fig.19As shown, it is located on the first relatively fixed structure 250. Alternatively, in order to provide a more reliable driving force and ensure the reliability of the two-dimensional movement of the microchip 1800, in some other embodiments, the microchip 1800 may include both the first driving structure 280 and the second driving structure 1830, such as Fig. 20 As shown. The first driving structure 280 is located on the active plane 220, and the second driving structure 1830 is located on the first relatively fixed structure 250. It can be understood that the second driving structure 1830 can be the same as the first driving structure 280, for example, Fig. 20 The electromagnetic coil shown may alternatively be a piezoelectric film, a permanent magnet, etc., which is not limited in this application.

[0160] In order to enhance the heat dissipation function of the dual-axis microchip, the embodiment of the present application also provides another dual-axis microchip 2100 applied to a micro-electromechanical system MEMS, such as Fig.21 Specifically, Fig.21 In the structural diagram of the microchip 2100 shown, the microchip 2100 includes an optical structure 210, an active plane 220, a first active tooth comb 230, a first support beam 240, a first relatively fixed structure 250, and the first relatively fixed structure 250 includes a protruding first fixed tooth comb 260. It also includes a second support beam 1810, a second relatively fixed structure 1820 (including a first part 1821, a second part 1822, a third part 1823 and a fourth part 1824), and a second active tooth comb 2110 (including a first part 2111 and a second part 2112). The second relatively fixed structure 1820 further includes a protruding second fixed tooth comb 2120 (including a first portion 2121 and a second portion 2122), a second movable tooth comb 2110 is formed on the lower surface of the first relatively fixed structure 250, and the second movable tooth comb 2110 includes a plurality of comb teeth partially protruding from the first relatively fixed structure 250, and the plurality of comb teeth of the second movable tooth comb 2110 are arranged crosswise with the plurality of comb teeth of the second fixed tooth comb 2120. For the sake of simplicity of description, Fig.21 Zhongyu Figure 2 or Fig.18 The same structure will not be repeated here.

[0161] Specifically, when the microchip 2100 is used in the laser scanning process, the heat energy generated by the optical structure 210 is transferred to the first fixed tooth comb 260 through the first movable tooth comb 230, and is transferred to the second movable tooth comb 2110 through the first relatively fixed structure 250, and then is transferred to the second relatively fixed structure 1820 through the second fixed tooth comb 2120, and is conducted out of the microchip 200 (for example, it is conducted to the heat sink of the MEMS, etc.), thereby realizing the heat dissipation function of the microchip 2100.

[0162] Among them, the size and number of the second movable tooth comb 2110 and the second fixed tooth comb 2120 can refer to the size of the above-mentioned first movable tooth comb 230 and the second fixed tooth comb 260 respectively. At the same time, the interval between each comb tooth of the second movable tooth comb 2110 and the comb tooth of the adjacent second fixed tooth comb 2120 is 1um-1000um.

[0163] Optionally, a third isolation structure may be formed between the second movable tooth comb 2110 and the first relatively fixed structure 250 , and the third isolation structure is used to connect the second movable tooth comb 2110 and the first relatively fixed structure 250 . Fig. 22 FIG. 2 shows a schematic diagram of a partially enlarged structure of a microchip 2100 having a third isolation structure. Fig. 22 In the embodiment, the third isolation structure 2130 is formed between the lower surface of the first relatively fixed structure 250 and the second movable tooth comb 2110. The material and size of the third isolation structure 2130 can refer to the above-mentioned related description of the first isolation structure 270, and will not be repeated here. In addition, the specific description of the movable plane 220, the first relatively fixed structure 250, the second relatively fixed structure 1820, the second movable tooth comb 2110 and the second fixed tooth comb 2120 can refer to the above-mentioned related parts, and will not be repeated here.

[0164] Understandably, Fig.21 The second movable tooth comb 2110 is formed on the lower surface of the first relatively fixed structure 250 as an example for description. In other embodiments, the second movable tooth comb 2110 can also be formed on the upper surface of the first relatively fixed structure 250. In addition, when the third isolation structure is formed on the first relatively fixed structure 250, the third isolation structure is formed between the upper surface of the first relatively fixed structure 250 and the second movable tooth comb 2110.

[0165] In order to further enhance the heat dissipation performance of the microchip, in some embodiments, the side surface of the movable plane 220 may further include a protruding third movable tooth comb 2140, each comb tooth of the third movable tooth comb 2140 partially or completely overlaps with each comb tooth of the first movable tooth comb 230. Alternatively, in other embodiments, the first relatively fixed structure 250 further includes a protruding third fixed tooth comb 2150, each comb tooth of the third fixed tooth comb 2150 partially or completely overlaps with each comb tooth of the first fixed tooth comb 260. In still other embodiments, the first relatively fixed structure 250 further includes a protruding fourth movable tooth comb 2160, each comb tooth of the fourth movable tooth comb 2160 partially or completely overlaps with each comb tooth of the second movable tooth comb 2110. In still other embodiments, the second relatively fixed structure 1820 further includes a protruding fourth fixed tooth comb 2170, each comb tooth of the fourth fixed tooth comb 2170 partially or completely overlaps with each comb tooth of the second fixed tooth comb 2120.

[0166] For example, Fig.23 FIG. 2 shows a schematic diagram of the structure of a microchip 2300 including a third movable tooth comb and a third fixed tooth comb. Fig.23 In the microchip 2300 shown, the side surface of the movable plane 220 includes a protruding third movable tooth comb 2140, and the first relatively fixed structure 250 includes a protruding third fixed tooth comb 2150. The specific descriptions of the optical structure 210, the movable plane 220, the first relatively fixed structure 250, the first movable tooth comb 230 and the first fixed tooth comb 260 can refer to the above-mentioned relevant parts and will not be repeated here. Optionally, each tooth of the third movable tooth comb 2140 partially overlaps with each tooth of the first movable tooth comb 230, and at the same time, each tooth of the third fixed tooth comb 2150 partially overlaps with each tooth of the first fixed tooth comb 260. In one achievable manner, as Fig.24 As shown in FIG. 1 , the width of the cross section of each comb tooth of the third movable comb 2140 along the horizontal plane is smaller than the width of the cross section of each comb tooth of the first movable comb 230 along the horizontal plane. In other words, when the microchip 2300 is placed horizontally, the third movable comb 2140 and the first movable comb 230 can be observed at the same time in the top view. Alternatively, in another achievable manner, as shown in FIG. Fig.25 As shown, the width of the cross section of each tooth of the third movable tooth comb 2140 along the horizontal plane is greater than the width of the cross section of each tooth of the first movable tooth comb 230 along the horizontal plane. When the microchip 2300 is placed horizontally, in the top view, only the third movable tooth comb 2140 can be observed, and the first movable tooth comb 230 is blocked. Optionally, each tooth of the third movable tooth comb 2140 completely overlaps with each tooth of the first movable tooth comb 230, and at the same time, each tooth of the third fixed tooth comb 2150 completely overlaps with each tooth of the first fixed tooth comb 260. In this case, as shown in FIG. Fig.26 As shown, the width of the cross section of each comb tooth of the third movable tooth comb 2140 along the horizontal plane is equal to the width of the cross section of each comb tooth of the first movable tooth comb 230 along the horizontal plane.

[0167] Optionally, in some embodiments, a fourth isolation structure exists between each comb tooth of the third movable comb 2140 and each comb tooth of the first movable comb 230, such as Fig.24 As shown, the fourth isolation structure 2160 is used to connect each comb tooth of the third movable comb 2140 and each comb tooth of the first movable comb 230, so that the microchip 2300 is more rigid. In other embodiments, there is a fifth isolation structure between each comb tooth of the third fixed comb 2150 and each comb tooth of the first fixed comb 260, such as Fig.24As shown, the fifth isolation structure 2170 is used to connect each comb tooth of the third fixed-tooth comb 2150 and each comb tooth of the first fixed-tooth comb 260 , so that the microchip 2300 has stronger rigidity.

[0168] It should be noted that the third movable tooth comb and the third fixed tooth comb on the above-mentioned microchip 2300 can be understood as the case where the tooth comb is additionally extended on the single-axis microchip. Therefore, for a dual-axis microchip, such as the above-mentioned microchip 1800, the first relatively fixed structure 250 can also include a fourth movable tooth comb, which can extend to the area of ​​the second movable tooth comb, and each tooth of the fourth movable tooth comb partially or completely overlaps with each tooth of the second movable tooth comb. In addition, the second relatively fixed structure 1820 can also include a protruding fourth fixed tooth comb, which can extend to the area of ​​the second fixed tooth comb, and each tooth of the fourth fixed tooth comb partially or completely overlaps with each tooth of the second fixed tooth comb. It can be understood that for the scenario of extending the tooth comb of a dual-axis microchip, reference can be made to the above-mentioned. Fig.23 For example, there may be an isolation structure between the fourth movable tooth comb and the second movable tooth comb, or there may be an isolation structure between the fourth fixed tooth comb and the second fixed tooth comb, etc. This application does not limit this.

[0169] With respect to the above embodiments, it should be noted that the various

[0170] The embodiments may be implemented independently or in combination with each other. For example, Figure 4 The embodiments shown can be implemented individually or in combination with each other. For example, Fig.18 The embodiments shown and Figure 6 The illustrated embodiments may be combined with each other and the like.

[0171] The present application also provides a laser device, such as Figure 1 As shown, the laser device 100 at least includes a laser 102 and a microchip 101 provided in the above-mentioned embodiment of the present application, wherein the microchip 101 is used to process the laser light emitted by the laser 102 .

[0172] The present application also provides a means of transport, such as Fig. 27 The car 2700 shown, as Fig. 27 As shown, the automobile 2700 includes a vehicle body 2710 and the laser device 100 as described above, and the laser device 100 is arranged on the vehicle body 2710 .

[0173] Unless otherwise defined, technical or scientific terms used herein shall have the common meanings understood by one of ordinary skill in the art to which the present disclosure belongs.

[0174] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A microchip used in a micro-electromechanical system (MEMS), characterized in that: include: A movable plane, a first movable tooth comb, a first support beam and a first relatively fixed structure, wherein the first relatively fixed structure and the movable plane are connected through the first support beam, and the first relatively fixed structure includes a protruding first fixed tooth comb, The movable plane is used as a base of the first movable tooth comb, and the first movable tooth comb is formed on the surface of the movable plane; The first movable tooth comb comprises a plurality of comb teeth partially protruding from the movable plane, and the plurality of comb teeth of the first movable tooth comb are arranged crosswise with the plurality of comb teeth of the first fixed tooth comb; The first support beam is used to drive the movable plane to translate according to the first driving force or to drive the movable plane to rotate around the first support beam.

2. The microchip according to claim 1, characterized in that The microchip further includes a first isolation structure formed between the movable plane and the first movable tooth comb, and the first isolation structure is used to connect the first movable tooth comb and the movable plane.

3. The microchip according to claim 1 or 2, characterized in that: The first movable tooth comb is located on a surface of the movable plane close to the first supporting beam.

4. The microchip according to claim 1 or 2, characterized in that: The first movable tooth comb is located on a surface of the movable plane away from the first supporting beam.

5. The microchip according to any one of claims 1 to 4, characterized in that: The microchip further comprises a first driving structure, which is located on the surface of the active plane and is used to provide the first driving force.

6. The microchip according to any one of claims 1 to 5, characterized in that The microchip further comprises an optical structure, The active plane is also used as a base for the optical structure; The optical structure is formed on the surface of the active plane, and is used for processing incident light.

7. The microchip according to claim 6, characterized in that The optical structure is a single layer or a multilayer, and the materials of two adjacent layers in the multilayer are different.

8. The microchip according to any one of claims 1 to 7, characterized in that The microchip further comprises a reinforcement structure formed on a surface of the active plane, and the reinforcement structure is used to increase the strength of the active plane.

9. The microchip according to claim 8, characterized in that The reinforcement structure is directly connected to part or all of the first movable tooth comb.

10. The microchip according to any one of claims 1 to 9, characterized in that: The microchip further comprises a second supporting beam and a second relatively fixed structure, wherein the second relatively fixed structure and the first relatively fixed structure are connected via the second supporting beam. The second support beam is used to drive the first relatively fixed structure to translate according to the second driving force, or to drive the first relatively fixed structure to rotate around the second support beam.

11. The microchip according to claim 10, characterized in that The microchip further comprises a second movable tooth comb, wherein the second movable tooth comb is formed on the surface of the first relatively fixed structure, and the second relatively fixed structure comprises a protruding second fixed tooth comb, The second movable tooth comb includes a plurality of comb teeth partially protruding from the first relatively fixed structure, and the plurality of comb teeth of the second movable tooth comb are arranged crosswise with the plurality of comb teeth of the second fixed tooth comb.

12. The microchip according to claim 11, characterized in that The microchip further includes a second isolation structure, which is formed between the first relatively fixed structure and the second movable tooth comb, and is used to connect the second movable tooth comb and the first relatively fixed structure.

13. The microchip according to any one of claims 10 to 12, characterized in that: The microchip further includes a second driving structure, which is located on a surface of the first relatively fixed structure, and is used to provide the second driving force.

14. The microchip according to any one of claims 1 to 13, characterized in that The side surface of the movable plane comprises a convex third movable tooth comb, and each comb tooth of the third movable tooth comb partially or completely overlaps with each comb tooth of the first movable tooth comb.

15. The microchip according to any one of claims 1 to 14, characterized in that The first relatively fixed structure further includes a protruding third fixed tooth comb, and each comb tooth of the third fixed tooth comb partially or completely overlaps with each comb tooth of the first fixed tooth comb.

16. The microchip according to any one of claims 11 to 15, characterized in that The first relatively fixed structure further includes a protruding fourth movable tooth comb, and each comb tooth of the fourth movable tooth comb partially or completely overlaps with each comb tooth of the second movable tooth comb.

17. The microchip according to any one of claims 11 to 16, characterized in that The second relatively fixed structure further includes a protruding fourth fixed tooth comb, and each comb tooth of the fourth fixed tooth comb partially or completely overlaps with each comb tooth of the second fixed tooth comb.

18. The microchip according to any one of claims 1 to 17, characterized in that The thickness of the movable plane along the vertical direction is different from the thickness of the first movable tooth comb along the vertical direction.

19. The microchip according to claim 18, characterized in that The thickness of the movable plane along the vertical direction is smaller than the thickness of the first movable tooth comb along the vertical direction.

20. The microchip according to any one of claims 1 to 19, characterized in that A thickness of the active plane along the vertical direction is different from a thickness of the first isolation structure along the vertical direction.

21. The microchip according to claim 20, characterized in that The thickness of the active plane along the vertical direction is greater than the thickness of the first isolation structure along the vertical direction.

22. The microchip according to any one of claims 1 to 21, characterized in that The first movable tooth comb includes comb teeth greater than or equal to 3.

23. The microchip according to any one of claims 1 to 22, characterized in that The length of each tooth of the first movable tooth comb protruding from the movable plane is 20um-1000um, the thickness of each tooth of the first movable tooth comb along the vertical direction is 10um-1000um, and the width of the cross section of each tooth of the first movable tooth comb along the horizontal plane is 3um-300um.

24. The microchip according to any one of claims 1 to 23, characterized in that Each tooth of the first fixed tooth comb protrudes from the first relatively fixed structure by 20um-1000um, each tooth of the first fixed tooth comb has a thickness of 10um-1000um in the vertical direction, and each tooth of the first fixed tooth comb has a width of 3um-300um in the cross section along the horizontal plane.

25. The microchip according to any one of claims 1 to 24, characterized in that The thickness of the movable plane along the vertical direction is 10um-500um, and the size of the cross section of the movable plane along the horizontal plane is 0.5um-30um.

26. The microchip according to any one of claims 1 to 25, characterized in that The interval between each comb tooth of the first movable comb and the adjacent comb teeth of the first fixed comb is 1um-100um.

27. A laser device, characterized in that: The microchip comprises a laser and any one of claims 1 to 26, wherein the laser is used to generate the incident light.

28. A means of transport, characterized in that: The vehicle comprises a vehicle body and the laser device as claimed in claim 27, wherein the laser device is arranged on the vehicle body.

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