Preparation method of electrochemical in-situ synthesis Cu / DNBT film
By electrochemically synthesizing Cu/DNBT thin films in situ and coating them with nano-aluminum films, the problems of miniaturization and integration of ignition devices for explosives were solved, the ignition performance and safety were improved, and an efficient ignition reaction was achieved.
Patent Information
- Application Number
- CN202411636283.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2044-11-15
AI Technical Summary
The ignition devices of existing pyrotechnics are difficult to miniaturize, integrate and intelligentize, and the traditional preparation methods have problems such as complex operation and poor safety.
The Cu/DNBT thin film was synthesized in situ by electrochemical means. The surface of the Cu substrate was modified to cover it with a nanoscale Cu(OH)2 film, and a coordination reaction was carried out on it to synthesize the Cu/DNBT thin film. Subsequently, a nanoscale aluminum film was coated on the Cu/DNBT film to form a Cu/DNBT@nano-Al energetic thin film.
It achieves miniaturization, high integration and excellent ignition performance, improves the energy density, heat generation and detonation speed of the film, enhances the gas generation capacity of the ignition reaction, and improves safety and ignition performance.
Smart Images
Figure CN119491281B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of micro-charging of pyrotechnics, and particularly relates to a preparation method of electrochemical in-situ synthesis of Cu / DNBT film. BACKGROUND
[0002] Pyrotechnics is a functional starting device providing ignition, explosion or power supply. Ignition device is one of the core categories of pyrotechnics, and its development limits and affects the development of civil explosive systems and the like. With the increasing demand of modern technology for intelligent airbags and other civil equipment, small-sized, light-weight, integrated and intelligent ignition devices are becoming the research direction of pyrotechnics technology. Micro-electro-mechanical system (MEMS) is becoming an important means to realize small-sized, integrated and intelligent devices due to its high integration, ultra-miniaturization and combination with digital logic circuit. Therefore, the application of MEMS technology in the field of pyrotechnics provides a technical approach for developing MEMS pyrotechnic chips with excellent performances such as low-energy ignition, high-energy output, small size, high integration and the like. SUMMARY
[0003] The present application belongs to the technical field of micro-charging of pyrotechnics, and particularly relates to a preparation method of electrochemical in-situ synthesis of Cu / DNBT film.
[0004] The present application is realized by the following technical scheme:
[0005] A preparation method of electrochemical in-situ synthesis of Cu / DNBT film, comprising the following steps:
[0006] 1) Synthesis of DABT
[0007] Hydrochloric acid is added to a mixture of oxalic acid and aminocarbonic guanidine bicarbonate, and stirred at 70°C for 1 hour. Finally, the precipitate is collected by filtration to obtain a colorless solid.
[0008] The colorless solid is dissolved in water, and alkalized to pH 14 with sodium hydroxide. Then, heated to reflux for 1 hour. Subsequently, acidified to pH 4 with acetic acid. Finally, the precipitate is collected by filtration and washed with water to obtain the DABT (i.e. 5,5'-diamino-3,3'-bis(1,2,4-triazole)).
[0009] 2) Synthesis of DNBT
[0010] A 20% sulfuric acid solution of DABT is added dropwise to a 40°C aqueous sodium nitrite solution, and stirred at 50°C for 1 hour. After cooling to room temperature, the obtained mixture is acidified with sulfuric acid until no nitrogen dioxide is observed. The precipitate is collected by filtration, and then dissolved in boiling water. The hot solution is filtered and cooled to room temperature to obtain the DNBT (i.e. 5,5'-dinitro-3,3'-bis(1,2,4-triazole)).
[0011] 3) Modification of Cu substrate surface
[0012] The copper foil was ultrasonically cleaned with dilute sulfuric acid and anhydrous ethanol to remove oil stains and oxide layer on the surface; then it was washed with deionized water to remove residual ethanol on the surface.
[0013] The cleaned Cu foil was vertically immersed in a mixed alkaline solution containing sodium hydroxide and (NH4)2S2O8, then rinsed with deionized water, and finally dried at a constant temperature of 25°C to obtain a Cu foil with a blue nanoscale Cu(OH)2 film coated on the surface.
[0014] 4) Electrochemical in situ synthesis of Cu / DNBT thin films
[0015] The Cu foil coated with a blue nano-scale Cu(OH)2 film was immersed in a DNBT aqueous solution, and the Cu foil coated with the blue nano-scale Cu(OH)2 film was used as the anode, and the platinum foil was used as the auxiliary electrode. After the coordination reaction, a light green film was obtained on the surface of the Cu foil, which was the Cu / DNBT film.
[0016] Finally, the copper foil containing the Cu / DNBT film is taken out from the reaction solution, rinsed with deionized water, dried at 25° C., and then stored.
[0017] As a preferred technical solution, in step 1) of the above method, the amount of hydrochloric acid used is 60 mL, the amount of oxalic acid used is 20.0 g, and the amount of aminoguanidine bicarbonate used is 45.4 g.
[0018] As a preferred technical solution, in step 2) of the above method, in the sulfuric acid solution of DABT, the amount of DABT used is 11.9 g, and the amount of 20% sulfuric acid used is 140 mL; in the sodium nitrite aqueous solution, the amount of sodium nitrite used is 98.8 g, and the amount of water used is 40 mL; the concentration of sulfuric acid used for acidification is 20%.
[0019] As a preferred technical solution, in step 3) of the above method, the concentration of dilute sulfuric acid used for ultrasonic cleaning is 20%, and the ultrasonic cleaning time is 5 min; the concentration of sodium hydroxide in the mixed alkaline solution is 1.17 mol·L −1 , the concentration of (NH4)2S2O8 is 0.087 mol·L −1 , the immersion time of Cu foil in the mixed alkaline solution is 10 min.
[0020] As a preferred technical solution, in step 4) of the above method, the concentration of the DNBT aqueous solution is 0.01 mol·L −1The dosage is 40 mL; a constant voltage of 1.5 V is used during the coordination reaction, and the reaction time is 20 min.
[0021] Furthermore, in order to improve the energy of the Cu / DNBT film prepared by the above method, the present invention also provides a method for preparing a Cu / DNBT@nano-Al energetic film based on the above Cu / DNBT film, comprising the following steps:
[0022] 1) Dissolve nitrocellulose (NC) in acetone solution, then add Al powder and disperse under the action of ultrasound to obtain high-energy aluminum-containing ink.
[0023] 2) Using a spin coating device (spin coater), the high-energy aluminum-containing ink is evenly coated on the surface of the Cu / DNBT film prepared by the method of claim 1; after the acetone evaporates, a dark green film is obtained on the surface of the Cu foil, which is the Cu / DNBT@nano-Al energetic film.
[0024] As a preferred technical solution, in step 1) of the above method, the amount of nitrocellulose used is 0.075 g, the amount of acetone used is 45 mL, the particle size of Al powder is 200 nm, the amount added is 0.425 g, and the ultrasonic dispersion time is 40 min.
[0025] The present invention provides a method for preparing a Cu / DNBT thin film by electrochemical in-situ synthesis. The preparation method of the present invention is scientifically and rationally designed, simple and convenient to operate, has a short preparation time, and is highly safe. In the method for electrochemical in-situ synthesis of the Cu / DNBT thin film, in order to increase the contact area between the Cu substrate (Cu foil) and the ligand in the electrolyte, the surface of the Cu substrate is modified to be covered with a layer of nanoscale Cu(OH)2 thin film. The nanoscale Cu(OH)2 thin film provides metal ions as an electrochemical anode. Through the coordination reaction between DNBT and the Cu(OH)2 film, a Cu / DNBT thin film is ultimately synthesized on the copper foil. Although the copper substrate is not the most commonly used copper substrate for MEMS, the copper film is easily deposited on a wafer and has good adhesion properties. Therefore, the present invention directly uses Cu foil as a substrate to preliminarily verify the compatibility with MEMS. The density velocity, heat of formation, and detonation velocity of the DNBT prepared by the method of the present invention are 1.90 g·cm, respectively. −3 、285kJ·mol −1 and 8413ms −1 , high nitrogen content, can produce a large amount of gas after ignition reaction, and produce a large amount of residual gas after combustion, which improves the ignition performance of the film.
[0026] The application also provides a preparation method of the Cu / DNBT@nano-Al energetic film, which is based on the Cu / DNBT film and aims to further increase the heat release after ignition. The preparation method is to coat a nano-aluminum film on the Cu / DNBT film by using a drop coating method through a spin coating device (a uniform coating machine), so that the Cu / DNBT@nano-Al film has more excellent ignition and detonation performance. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. The drawings here are used to provide further explanation of the present application, and form a part of the present application. The schematic embodiments of the present application and the explanation thereof are used to explain the present application, and do not constitute an improper limitation on the present application.
[0028] Figure 1 SEM, macroscopic morphology and EDS spectrum of the Cu / DNBT film prepared in the embodiments of the present application.
[0029] Figure 2 PXRD spectrum of each related product in the preparation method of the embodiments of the present application.
[0030] Figure 3 FT-IR spectrum of each related product in the preparation method of the embodiments of the present application.
[0031] Figure 4 DTA curve of each related product in the preparation method of the embodiments of the present application.
[0032] Figure 5 Laser ignition schematic diagram of the Cu / DNBT film and the Cu / DNBT@nana-Al energetic film prepared in the embodiments. DETAILED DESCRIPTION
[0033] The embodiments of the technical solutions of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application. It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present application should be understood as the usual meanings understood by the skilled in the art to which the present application belongs. Embodiment 1
[0034] The embodiment provides a preparation method of an electrochemical in-situ synthesized Cu / DNBT film, which specifically comprises the following steps:
[0035] 1) Synthesis of DABT
[0036] Add hydrochloric acid (60 mL) to a mixture of oxalic acid (20.0 g, 159 mmol) and aminoguanidine bicarbonate (45.4 g, 332 mmol), stir and react at 70 °C for 1 hour, and finally collect the precipitate by filtration to obtain a colorless solid;
[0037] The colorless solid was dissolved in water (240 mL), basified with sodium hydroxide to pH 14, then heated to reflux for 1 hour, then acidified with acetic acid to pH 4, and finally the precipitate was collected by filtration and washed with water to obtain the DABT;
[0038] 2) Synthesis of DNBT
[0039] A solution of DABT (11.9 g, 72 mmol) in 20% sulfuric acid (140 mL) was added dropwise to a 40°C aqueous solution of sodium nitrite (98.8 g) (140 mL), and the mixture was stirred at 50°C for 1 hour; after cooling to room temperature, the resulting mixture was acidified with sulfuric acid (20%) until no nitrogen dioxide was observed to be generated; the precipitate was collected by filtration, and then the precipitate was dissolved in boiling water, the hot solution was filtered and cooled to room temperature to obtain the DNBT;
[0040] 3) Modification of Cu substrate surface
[0041] Copper foil (20 mm × 15 mm × 0.1 mm, 99.9% purity) was ultrasonically cleaned for 5 min using dilute sulfuric acid (20%) and anhydrous ethanol to remove surface oil stains and oxide layers. It was then rinsed with deionized water to remove residual ethanol.
[0042] The cleaned Cu foil was vertically immersed in a solution containing 1.17 mol·L −1 Sodium hydroxide and 0.087 mol·L −1 The copper foil was placed in a mixed alkaline solution (20 mL) of (NH4)2S2O8 for 10 min, then rinsed with deionized water, and finally dried at a constant temperature of 25 °C to obtain a Cu foil coated with a blue nanoscale Cu(OH)2 film on the surface;
[0043] 4) Electrochemical in situ synthesis of Cu / DNBT thin films
[0044] A Cu foil (20 mm × 15 mm) coated with a blue nanoscale Cu(OH)2 film was immersed in 0.01 mol·L −1In a DNBT aqueous solution (40 mL), a Cu foil coated with a blue nanoscale Cu(OH)2 film was used as the anode, and a platinum foil (15 mm × 15 mm) was used as the auxiliary electrode. After 20 minutes of coordination reaction (constant potential of 1.5 V), a light green film was obtained on the Cu foil surface, which is the Cu / DNBT film.
[0045] Finally, the copper foil containing the Cu / DNBT film is taken out from the reaction solution, rinsed with deionized water, dried at 25° C., and then stored. Example 2
[0046] This embodiment provides a method for preparing a Cu / DNBT@nano-Al energetic film, which specifically includes the following steps:
[0047] 1) Dissolve 0.075 g of nitrocellulose (NC) in 45 mL of acetone solution. Add 0.425 g of aluminum powder (particle size 200 nm) to the nitrocellulose and acetone mixture. Disperse the mixture under ultrasonication for 40 min to obtain a high-energy aluminum-containing ink.
[0048] 2) Using a spin coating apparatus (spin coater), the high-energy aluminum-containing ink was evenly coated on the surface of the Cu / DNBT film prepared by the method of Example 1. After evaporation of the acetone, a dark green film was obtained on the surface of the Cu foil, namely, the Cu / DNBT@nano-Al energetic film.
[0049] The following is a further analysis of the relevant products involved in the preparation method of the embodiment of the present invention, and the specific results are as follows:
[0050] 1) Cu / DNBT film morphology analysis
[0051] Figure 1 (a)-(c) are SEM images of Cu / DNBT films at low, medium and high magnifications. From the microscopic morphology in the figure, it can be clearly seen that the surface of the prepared Cu / DNBT film has an interlaced lamellae structure with an average flake size of 700nm-1400nm. Figure 1 (d) in the figure shows the macroscopic morphology of the prepared Cu / DNBT film. Figure 1 (e) in the figure is the EDS spectrum of the prepared Cu / DNBT film. EDS shows that the prepared Cu / DNBT film is mainly composed of Cu, C, N, and O, with atomic mass ratios of 28.01%, 19.10%, 30.97%, and 21.91%, respectively.
[0052] 2) Composition analysis of Cu / DNBT films
[0053] The Cu / DNBT thin film prepared in Example 1 was analyzed by PXRD to determine its elemental composition. Figure 2 The following are PXRD spectra of the relevant products in the preparation process of the embodiment, wherein (a) is the PXRD spectrum of Cu / DNBT powder, (b) is the PXRD spectrum of Cu / DNBT@nano-Al energetic film, (c) is the PXRD spectrum of Cu(OH)2 film, and (d) is the PXRD spectrum of Cu / DNBT film. Figure 2 As shown in (b)-(d) in the figure, the diffraction peaks at 43.3, 50.3 and 74.4 in the Cu / DNBT film correspond to the diffraction peaks of the Cu substrate, and the diffraction peaks at 16.7 and 23.8 are standard Cu(OH)2. Figure 2 As shown in (a) and (b), the diffraction peaks of the Cu / DNBT film at 14.3 and 28.6 correspond to the Cu / DNBT powder, confirming that Cu / DNBT was successfully synthesized on the film surface.
[0054] In order to further determine the composition of each related product, Fourier transform infrared (FT-IR) spectroscopy was used to analyze each related product. Figure 3 The following are FTIR spectra of the relevant products in the preparation process of the embodiment, among which (a) is the FT-IR spectrum of Cu(OH)2 film, (b) is the FT-IR spectrum of Cu / DNBT film, (c) is the FT-IR spectrum of Cu / DNBT powder, and (d) is the FT-IR spectrum of Cu / DNBT@nano-Al energetic film. Figure 3 As shown in (d), there is no infrared absorption peak in the FT-IR spectrum because there is no functional group in the nano-aluminum structure. The FT-IR spectrum of the Cu(OH)2 array is at 3564 cm −1 and 3296cm −1 The peak at is related to the OH bond. Figure 3 As shown in (b), the peak is at 1537cm −1 、1439cm −1 、1365cm −1 、1174cm −1 , and 1099cm −1 Belongs to the triazole ring and NO2 bond. Figure 3 (b) and (d) show the FT-IR spectra of Cu / DNBT film and the FT-IR spectra of Cu / DNBT powder. Figure 1 The results show that the Cu / DNBT thin films were successfully prepared on the Cu substrate.
[0055] 3) Cu / DNBT film performance analysis
[0056] The exothermic characteristics of Cu / DNBT thin films were analyzed by DTA method. Figure 4 The DTA curves of the relevant products during the preparation process of the embodiment are shown in Figure 1, where (a) is the DTA curve of Cu / DNBT powder, (b) is the DTA curve of Cu / DNBT film, (c) is the DTA curve of Cu / DNBT@nano-Al energetic film coated with aluminum three times, (d) is the DTA curve of Cu / DNBT@nano-Al film coated with aluminum four times, and (e) is the DTA curve of Cu / DNBT@nano-Al film coated with aluminum five times. Figure 4 As shown in (a) and (b) in Figure 1, the DTA curve of the Cu / DNBT film is consistent with that of the Cu / DNBT powder, with a significant exothermic peak observed at 357.5°C, corresponding to the decomposition of the DNBT ligand. Compared with the initial reaction temperatures of many typical high-energy materials, such as HMX (287°C) and RDX (230°C), the thermal stability of Cu / DNBT is significantly better, indicating improved safety. Figure 4 As shown in (c), in addition to the obvious exothermic peak at around 358.3℃, there is also an obvious exothermic peak at 587.9℃. This is because the copper oxide produced by the Cu / DNBT film reacts with the aluminum-containing ink to release a large amount of heat. In addition, the addition of nano-aluminum also improves the heat release of the energetic film, as shown in Figure 2. Figure 4 As shown in (c)-(e), with the increase of the number of aluminum plating times, the heat release of Cu / DNBT@nana-Al energetic film also increases (1592.4 J·g −1 、1691.8J·g −1 and 1823.1 J·g −1 ).
[0057] 4) Laser ignition test
[0058] Figure 5 High-speed photography images of the laser ignition of Cu / DNBT film and Cu / DNBT@nana-Al energetic film, where (a) is the laser ignition of the Cu / DNBT film prepared by reaction at 20 min and 1.5 V, and (b)-(d) are the laser ignition of the Cu / DNBT@nano-Al film coated with aluminum 3, 4, and 5 times. Figure 5A bright flash can be observed in the image, confirming the successful ignition of the as-prepared Cu / DNBT and Cu / DNBT@nano-Al energetic films. The ignition height and duration were 12.5 mm and 200 μs, respectively. Furthermore, the ignition time and flame height of the Cu / DNBT@nano-Al energetic film increased with the number of aluminum coatings. As the number of aluminum coatings increased from 3 to 5, the ignition time of the Cu / DNBT@nano-Al energetic film increased from 250 μs to 400 μs, and the flame height increased from 11.2 mm to 13.5 mm. These results indicate that increasing the amount of aluminum coating on the Cu / DNBT@nano-Al energetic film can improve the ignition time, flame height, and flame brightness of the film. During the ignition process, the Cu / DNBT@nano-Al energetic film produces solid residue, which releases a large amount of heat and generates a large amount of high-temperature, high-pressure gas. The hot solid particles, propelled by the high-temperature, high-pressure gas, impact the ignited particles, improving the ignition performance of the MEMS device.
[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that it is still possible to modify the technical solutions described in the aforementioned embodiments, or to replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.
Claims
1. A method for preparing a Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic film, characterized in that: The steps include: (1) Dissolve nitrocellulose in acetone solution, then add Al powder and disperse under the action of ultrasound to obtain high-energy aluminum-containing ink; (2) A high-energy aluminum-containing ink was uniformly coated on the surface of the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole) film using a spin coating device; after acetone evaporated, a dark green film was obtained on the surface of the Cu foil, namely the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic film; The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole) film comprises the following steps: 1) Synthesis of 5,5′-diamino-3,3′-bis(1,2,4-triazole) Add hydrochloric acid to the mixture of oxalic acid and aminoguanidine bicarbonate, stir and react at 70°C for 1 hour, and finally collect the precipitate by filtration to obtain a colorless solid; The colorless solid was dissolved in water, basified with sodium hydroxide to a pH of 14, then heated to reflux for 1 hour, then acidified with acetic acid to a pH of 4, and finally the precipitate was collected by filtration and washed with water to obtain the 5,5′-diamino-3,3′-bis(1,2,4-triazole); 2) Synthesis of 5,5′-dinitro-3,3′-bis(1,2,4-triazole) A 20% sulfuric acid solution of 5,5′-diamino-3,3′-bis(1,2,4-triazole) was added dropwise to a 40°C aqueous sodium nitrite solution and stirred at 50°C for 1 hour; after cooling to room temperature, the resulting mixture was acidified with sulfuric acid until no nitrogen dioxide was observed to be generated; the precipitate was collected by filtration, and then the precipitate was dissolved in boiling water, the hot solution was filtered and cooled to room temperature to obtain the 5,5′-dinitro-3,3′-bis(1,2,4-triazole); 3) Modification of Cu substrate surface The copper foil was ultrasonically cleaned with dilute sulfuric acid and anhydrous ethanol to remove oil stains and oxide layers on the surface; then it was washed with deionized water to remove residual ethanol on the surface. The cleaned Cu foil was vertically immersed in a mixed alkaline solution containing sodium hydroxide and (NH4)2S2O8, then rinsed with deionized water, and finally dried at a constant temperature of 25°C to obtain a Cu foil with a blue nanoscale Cu(OH)2 film on its surface; 4) Electrochemical in situ synthesis of Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole) thin films A Cu foil coated with a blue nanoscale Cu(OH)2 film is immersed in an aqueous solution of 5,5′-dinitro-3,3′-bis(1,2,4-triazole), the Cu foil coated with the blue nanoscale Cu(OH)2 film is used as an anode, and a platinum foil is used as an auxiliary electrode. After a coordination reaction, a light green film is obtained on the surface of the Cu foil, which is the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole) film. Finally, the copper foil containing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole) film is taken out from the reaction solution, rinsed with deionized water, dried at 25° C., and then stored.
2. The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic thin film according to claim 1, characterized in that: In step 1), the amount of hydrochloric acid used is 60 mL, the amount of oxalic acid used is 20.0 g, and the amount of aminoguanidine bicarbonate used is 45.4 g.
3. The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic thin film according to claim 1, characterized in that: In step 2), in the sulfuric acid solution of 5,5′-diamino-3,3′-bis(1,2,4-triazole), the amount of 5,5′-diamino-3,3′-bis(1,2,4-triazole) is 11.9 g, and the amount of 20% sulfuric acid is 140 mL; in the sodium nitrite aqueous solution, the amount of sodium nitrite is 98.8 g, and the amount of water is 40 mL; the concentration of sulfuric acid used for acidification is 20%.
4. The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic film according to claim 1, wherein: In step 3), the concentration of dilute sulfuric acid used for ultrasonic cleaning is 20%, and the ultrasonic cleaning time is 5 min; the concentration of sodium hydroxide in the mixed alkaline solution is 1.17 mol·L −1 , the concentration of (NH4)2S2O8 is 0.087 mol·L −1 , the immersion time of Cu foil in the mixed alkaline solution is 10 min.
5. The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic thin film according to claim 1, wherein: In step 4), the concentration of the 5,5′-dinitro-3,3′-bis(1,2,4-triazole) aqueous solution is 0.01 mol·L −1 The dosage is 40 mL; a constant voltage of 1.5 V is used during the coordination reaction, and the reaction time is 20 min.
6. The method for preparing the Cu / 5,5′-dinitro-3,3′-bis(1,2,4-triazole)@nano-Al energetic thin film according to claim 1, characterized in that: In step (1), the amount of nitrocellulose used is 0.075 g, the amount of acetone used is 45 mL, the particle size of Al powder is 200 nm, the amount added is 0.425 g, and the ultrasonic dispersion time is 40 min.