Laptop mainboard testing device
By designing a laptop motherboard test device including multiple adjustable components, the problems of cumbersome operation and unstable fixation in the prior art are solved, the motherboard is stable and well-connected, and the accuracy and reliability of the test are improved. .
Patent Information
- Application Number
- CN202411502843.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-02-21
AI Technical Summary
The existing laptop motherboard testing devices have problems such as cumbersome operation and unstable fixing, making it difficult to adapt to motherboards of different sizes and thicknesses, affecting the accuracy and reliability of the test.
Designed is a kind of design including bottom box, hinge, flip board, placement board, fixing block, adjusting rod, adjusting pressure plate, fixing frame, extrusion frame, adjustable pressure block frame, adjustable pressure plate and extrusion wrench Testing mechanism, by adjusting these components to ensure stable fixation and good contact of the motherboard.
It realizes stable fixation and good contact of the notebook motherboard, improves the accuracy and reliability of testing, adapts to motherboards of different sizes and thicknesses, simplifies the operation process, and reduces operational complexity and working intensity.
Smart Images

Figure CN119492978A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of motherboard testing, and in particular to a notebook motherboard testing device. Background Art
[0002] The laptop motherboard is the core component of the laptop, integrating key components such as the processor, memory, and storage device interface. With the widespread use of laptops in daily life and work, it is particularly important to ensure the quality and performance of its motherboard. In order to ensure the stability and reliability of the factory products, the laptop motherboard needs to be strictly inspected and tested during the production process. These tests usually include functional tests, electrical performance tests, thermal performance tests, etc. to ensure that the motherboard can work properly under different usage environments.
[0003] However, existing notebook motherboard testing methods usually have problems such as cumbersome operation and loose fixation. When fixing the motherboard, traditional testing devices often cause the motherboard to move or have poor contact during the test due to unstable support structure or uneven pressure, thus affecting the accuracy and reliability of the test. Especially under diverse testing requirements, existing devices are difficult to adapt to motherboards of different sizes and thicknesses. Operators spend a lot of time during installation and adjustment, which increases the complexity of operation and work intensity. Therefore, we provide a notebook motherboard testing device. Summary of the invention
[0004] The purpose of the present invention is to solve the shortcomings existing in the prior art.
[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: comprising: a testing mechanism, the testing mechanism comprises a bottom box, a hinge is provided on one side of the bottom box, a flap is provided on one end of the hinge, a placing plate is provided on the side of the bottom box away from the hinge and the flap, a fixing block is provided on the bottom box, an adjusting rod is provided on the fixing block, an adjusting pressure plate is provided at one end of the adjusting rod, a fixing frame is provided on one side of the fixing frame, an extrusion frame is provided at the end of the extrusion frame away from the fixing frame, an adjustable pressure block frame is provided on one side of the adjusting frame, an adjustable pressure plate is provided on the side of the adjustable pressure block frame away from the adjusting frame, an extrusion wrench is provided on the end of the adjustable pressure plate away from the adjustable pressure block frame, a docking frame is provided between the bottom box and the adjusting pressure plate, a detection main board is provided on one side of the docking frame, and a snap frame is provided at the end of the detection main board away from the docking frame.
[0006] As a preferred embodiment, a pressure-resistant mechanism is provided on the outer surface of the adjusting pressure plate on the bottom box, and the pressure-resistant mechanism includes a mounting block, an adjusting frame is provided at one end of the mounting block, a limiting frame is provided on the side of the adjusting frame away from the mounting block, and an adjusting flip frame is provided on the side of the limiting frame away from the adjusting frame and the mounting block.
[0007] As a preferred embodiment, the bottom end of the mounting block is fixedly connected to the bottom box, the bottom side of the adjusting frame is fixedly connected to the side of the mounting block away from the bottom box, the bottom side of the limiting frame is installed on the adjusting frame, one end of the adjusting flip frame is installed on the side of the limiting frame away from the adjusting frame and the mounting block, and one end of the adjusting flip frame away from the limiting frame is snap-mounted on the bottom box.
[0008] As a preferred embodiment, a pressure rod mechanism is provided on the adjusting pressure plate, and the pressure rod mechanism includes a fixed plate, a top plate is provided at one end of the fixed plate, a pressure applicator is provided on the top plate, and a pressure handle is provided on the pressure applicator.
[0009] As a preferred embodiment, one end of the fixed plate is fixedly connected to the adjusting pressure plate, the bottom side of the top plate is fixedly connected to the end of the fixed plate away from the adjusting pressure plate, the pressure applicator is upper-limited on the top plate for rotating pressure, the pressure applicator passes through the top plate and docks between the adjustable pressure block frame and the adjustable pressure plate, and one end of the pressure handle docks on the pressure applicator.
[0010] As a preferred embodiment, one end of the hinge is butted against the bottom box, the end of the hinge away from the bottom box is butted against the flap, and the outer surface of the placement plate is nested on the side of the bottom box away from the flap.
[0011] As a preferred embodiment, the bottom end of the fixed block is fixedly connected to the bottom box, one end of the adjusting rod is docked on the fixed block, the end of the adjusting rod away from the fixed block is docked on the adjusting pressure plate, one end of the fixed frame is fixedly connected to the adjusting pressure plate, and one side of the extrusion frame is fixedly connected to one side of the fixed frame.
[0012] As a preferred implementation, one side of the adjustment frame is butted against a side of the extrusion frame away from the fixed frame, and one side of the adjustable pressure block frame is butted against a side of the adjustment frame away from the extrusion frame.
[0013] As a preferred embodiment, one end of the adjustable pressure plate is docked on one side of the adjustable pressure block frame, one end of the extrusion wrench is docked on one end of the adjustable pressure plate, the bottom side of the extrusion wrench is docked on the adjustable pressure plate, and the bottom side of the docking frame is fixedly connected to the bottom box.
[0014] As a preferred implementation, one end of the detection mainboard contacts the docking frame, the bottom side of the buckle frame is fixedly connected to the bottom box, and one end of the detection mainboard away from the docking frame contacts one end of the buckle frame.
[0015] Compared with the prior art, the advantages and positive effects of the present invention are:
[0016] 1. In the present invention, the notebook motherboard to be tested is placed on the placement plate on the bottom box, and the detection motherboard is aligned so that one end of it contacts the docking frame and the other end contacts the snap frame to ensure a stable installation. Then, the adjustment rod is adjusted to gradually press the adjustment pressure plate toward the motherboard to ensure that it is firmly fixed. The adjustment pressure plate is connected to a fixing frame and an extrusion frame. The operator can adjust the extrusion frame to adapt to motherboards of different thicknesses and sizes to ensure the stability of the motherboard during the test. Then, the frame and the adjustable pressure block frame are further adjusted to better fix and press the motherboard. The extrusion wrench is used to apply appropriate pressure to ensure good contact between the motherboard and the detection motherboard. After completing these steps, the test device is started, and the detection motherboard will detect the notebook motherboard in real time, and the results are read and analyzed through a display screen or other methods. The whole process ensures that the motherboard is stably fixed during the test, avoids errors caused by movement or poor contact, and improves the detection accuracy and reliability.
[0017] 2. In the present invention, a limit frame is provided on the outer surface of the device to improve practicality. The staff nests the limit frame on the outer surface and docks one side of the limit frame with the adjustment frame on the mounting block, and the other side is installed on the bottom box by adjusting the flip frame. When it is necessary to install the detection mainboard, the operator can easily remove the limit frame from the outer surface of the adjustment pressure plate to install the mainboard. After the installation is completed, the adjustment pressure plate is reinforced again to ensure that the mainboard is firmly fixed. This design makes the device more convenient and efficient in actual use. The user can quickly complete the installation and fixation of the mainboard, which improves work efficiency and convenience of operation. At the same time, it also ensures the stability of the mainboard during the detection process and reduces errors during operation.
[0018] 3. In the present invention, a pressure test is performed by setting a pressure rod mechanism between the adjustable pressure plate and the adjustable pressure block frame. The staff fixes the bottom end of the fixed plate to the adjustable pressure plate, and fixes the bottom side of the top plate to the fixed plate. Then, by controlling the pressure handle, the pressure applicator applies pressure between the adjustable pressure plate and the adjustable pressure block frame, thereby testing the mainboard. This design further enhances the practicality of the device, enabling it to adapt to diverse testing needs. The pressure applied by the pressure rod mechanism can simulate different usage environments and pressure conditions to more comprehensively evaluate the performance of the mainboard, which not only improves the accuracy and reliability of the test, but also enables the device to have a wider range of applications in different testing scenarios, further improving the efficiency and effectiveness of the entire testing process. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A three-dimensional diagram of a notebook motherboard testing device is provided for the present invention;
[0020] Figure 2 The present invention provides a structural exploded perspective view of a notebook motherboard testing device;
[0021] Figure 3 A three-dimensional diagram of a testing mechanism of a notebook motherboard testing device proposed by the present invention;
[0022] Figure 4 The present invention provides a test mechanism exploded perspective view of a notebook motherboard test device;
[0023] Figure 5 A partial three-dimensional diagram of a bottom box of a notebook motherboard testing device provided by the present invention;
[0024] Figure 6 A partial stereoscopic diagram of a fixing frame of a notebook motherboard testing device proposed by the present invention;
[0025] Figure 7 The present invention provides a three-dimensional diagram of a compression mechanism and a pressure rod mechanism of a notebook motherboard testing device.
[0026] Legend:
[0027] 1. Test mechanism; 11. Bottom box; 12. Hinge; 13. Flip plate; 14. Placement plate; 15. Fixed block; 16. Adjustment rod; 17. Adjustment pressure plate; 18. Fixed frame; 19. Extrusion frame; 110. Adjustment frame; 111. Adjustable pressure block frame; 112. Adjustable pressure plate; 113. Extrusion wrench; 114. Docking frame; 115. Detection main board; 116. Buckle frame;
[0028] 2. Compression-resistant mechanism; 21. Mounting block; 22. Adjustment frame; 23. Limiting frame; 24. Adjustment flip frame;
[0029] 3. Pressure rod mechanism; 31. Fixed plate; 32. Top plate; 33. Pressure applicator; 34. Pressure handle. DETAILED DESCRIPTION
[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.
[0031] It should be further explained that the drawings and implementation modes of the present invention mainly describe the concept of the present invention. On the basis of this concept, the specific forms and settings of some connection relationships, positional relationships, power mechanisms, power supply systems, hydraulic systems and control systems may not be fully described. However, on the premise that those skilled in the art understand the concept of the present invention, those skilled in the art can implement the above-mentioned specific forms and settings in a well-known manner.
[0032] When an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.
[0033] The directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself. The directions or positional relationships indicated by the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.
[0034] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, and the spatially relative descriptions used here are interpreted accordingly.
[0035] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, and "several" means one or more, unless otherwise clearly and specifically defined.
[0036] A notebook motherboard testing device provided by the present invention is now described.
[0037] Example 1
[0038] like Figure 1-6 As shown, the present invention provides a technical solution: a notebook motherboard testing device, comprising: a testing mechanism 1, the testing mechanism 1 comprises a bottom box 11, a hinge 12 is arranged on one side of the bottom box 11, a flap 13 is arranged on one end of the hinge 12, a placing plate 14 is arranged on the side of the bottom box 11 away from the hinge 12 and the flap 13, a fixing block 15 is arranged on the bottom box 11, an adjusting rod 16 is arranged on the fixing block 15, an adjusting pressure plate 17 is arranged at one end of the adjusting rod 16, a fixing frame 18 is arranged on the adjusting pressure plate 17, and an extrusion plate 18 is arranged on one side of the fixing frame 18 The bottom box 11 and the adjusting plate 17 are provided with a docking frame 114, a detection main board 115 is provided on one side of the docking frame 114, and a buckle frame 116 is provided on the end of the detection main board 115 away from the docking frame 114;
[0039] One end of the hinge 12 is butted against the bottom box 11, and the end of the hinge 12 away from the bottom box 11 is butted against the flap 13. The outer surface of the placement plate 14 is nested on the side of the bottom box 11 away from the flap 13. The bottom end of the fixing block 15 is fixedly connected to the bottom box 11. One end of the adjusting rod 16 is butted against the fixing block 15. The end of the adjusting rod 16 away from the fixing block 15 is butted against the adjusting pressure plate 17. One end of the fixing frame 18 is fixedly connected to the adjusting pressure plate 17. One side of the extrusion frame 19 is fixedly connected to one side of the fixing frame 18. One side of the adjusting frame 110 is butted against the extrusion frame 19 away from the fixing frame 18. One side of the adjustable pressure block frame 111 is docked with the side of the adjustment frame 110 away from the extrusion frame 19, one end of the adjustable pressure plate 112 is docked with one side of the adjustable pressure block frame 111, one end of the extrusion wrench 113 is docked with one end of the adjustable pressure plate 112, the bottom side of the extrusion wrench 113 is docked with the adjustment pressure plate 17, the bottom side of the docking frame 114 is fixedly connected to the bottom box 11, one end of the detection mainboard 115 is in contact with the docking frame 114, the bottom side of the snap frame 116 is fixedly connected to the bottom box 11, and the end of the detection mainboard 115 away from the docking frame 114 is in contact with one end of the snap frame 116.
[0040] In this embodiment, when the staff uses the test device to test the notebook motherboard, they place the notebook motherboard to be tested on the placement plate 14 on the bottom box 11, align the interface of the motherboard with the test motherboard 115, and make one end of it contact with the docking frame 114, and the other end contact with the buckle frame 116 to ensure a stable installation. Then, by adjusting the adjustment rod 16, the adjustment pressure plate 17 is gradually pressed toward the motherboard to ensure that the motherboard is tightly fixed on the device. The adjustment pressure plate 17 is fixedly connected with a fixing frame 18 and an extrusion frame 19. The extrusion frame 19 is adjusted to adapt to motherboards of different thicknesses and sizes to ensure that the test During the test, the mainboard remains stable. Next, the adjustment frame 110 and the adjustable pressure block frame 111 can be further adjusted to better fix and press the mainboard. The squeezing wrench 113 is used to apply appropriate pressure to ensure good contact between the mainboard and the detection mainboard 115, thereby ensuring the accuracy of the test. After completing these steps, the test device is started, and the detection mainboard 115 will perform real-time detection on the notebook mainboard. The test results can be read and analyzed through the device's display screen or other output methods. The whole process ensures that the mainboard is stably fixed during the test and avoids test errors caused by movement or poor contact.
[0041] Example 2
[0042] like Figure 1-7 As shown, a pressure-resistant mechanism 2 is provided on the outer surface of the adjusting pressure plate 17 on the bottom box 11, and the pressure-resistant mechanism 2 includes a mounting block 21, an adjusting frame 22 is provided at one end of the mounting block 21, a limiting frame 23 is provided on the side of the adjusting frame 22 away from the mounting block 21, and an adjusting flip frame 24 is provided on the side of the limiting frame 23 away from the adjusting frame 22 and the mounting block 21, the bottom end of the mounting block 21 is fixedly connected to the bottom box 11, the bottom side of the adjusting frame 22 is fixedly connected to the side of the mounting block 21 away from the bottom box 11, the bottom side of the limiting frame 23 is installed on the adjusting frame 22, one end of the adjusting flip frame 24 is installed on the side of the limiting frame 23 away from the adjusting frame 22 and the mounting block 21, and the end of the adjusting flip frame 24 away from the limiting frame 23 is snap-mounted on the bottom box 11.
[0043] In this embodiment, in order to further improve its practicality during actual use, a pressure-resistant mechanism 2 is provided on the outer surfaces of the fixing frame 18, the extrusion frame 19, the adjusting frame 110, the adjustable pressure block frame 111, the adjustable pressure plate 112 and the extrusion wrench 113. The staff can nest the limit frame 23 on the outer surface and dock one side of the limit frame 23 on the adjustment frame 22 on the mounting block 21, and install the side of the limit frame 23 away from the mounting block 21 and the adjustment frame 22 on the bottom box 11 through the adjusting flip frame 24. In this way, when the staff needs to install and fix the detection main board 115, they can remove the limit frame 23 from the outer surface of the adjustment pressure plate 17 to install the main board, and then re-reinforce the adjustment pressure plate 17.
[0044] Example 3
[0045] like Figure 1-7 As shown, a pressure rod mechanism 3 is arranged on the adjusting pressure plate 17, and the pressure rod mechanism 3 includes a fixed plate 31, a top plate 32 is arranged at one end of the fixed plate 31, a pressure applicator 33 is arranged on the top plate 32, and a pressure handle 34 is arranged on the pressure applicator 33, one end of the fixed plate 31 is fixedly connected to the adjusting pressure plate 17, the bottom side of the top plate 32 is fixedly connected to the end of the fixed plate 31 away from the adjusting pressure plate 17, the pressure applicator 33 is upper-limited on the top plate 32 for rotating pressure, the pressure applicator 33 passes through the top plate 32 and is docked between the adjustable pressure block frame 111 and the adjustable pressure plate 112, and one end of the pressure handle 34 is docked on the pressure applicator 33.
[0046] In this embodiment, in order to further improve the test diversity during actual use, a pressure test is performed between the adjustable pressure plate 112 and the adjustable pressure block frame 111 by using a pressure rod mechanism 3. The staff can fix the bottom end of the fixed plate 31 to the adjusting pressure plate 17 and fix the bottom side of the top plate 32 to the fixed plate 31. Then the staff can control the pressure handle 34 to make the pressure applicator 33 perform corresponding operations to apply pressure between the adjustable pressure plate 112 and the adjustable pressure block frame 111 to test the main board, thereby further improving its practicality during actual use.
[0047] Working principle:
[0048] like Figure 1-7 As shown, when the staff uses this test device to test the notebook motherboard, first place the notebook motherboard to be tested on the placement plate 14 on the bottom box 11, ensure that the interface of the motherboard is aligned with the test motherboard 115, make one end of the motherboard contact with the docking frame 114, and the other end contact with the snap frame 116 to ensure that it is firmly installed. Then, by adjusting the adjustment rod 16, the adjustment pressure plate 17 is gradually pressed toward the motherboard to ensure that the motherboard can be tightly fixed on the device. The adjustment pressure plate 17 is fixedly connected with a fixing frame 18 and an extrusion frame 19. The staff can adjust the extrusion frame 19 to adapt to motherboards of different thicknesses and sizes to ensure that they are stable and immobile during the test.
[0049] Subsequently, the staff further adjusts the adjustment frame 110 and the adjustable pressure block frame 111 to better fix and compress the mainboard. Use the squeeze wrench 113 to apply appropriate pressure to ensure good contact between the mainboard and the detection mainboard 115, thereby ensuring the accuracy of the test. After completing these steps, the test device is started, and the detection mainboard 115 will perform real-time detection on the notebook mainboard. The test results can be read and analyzed through the display screen or other output methods of the device. The whole process ensures that the mainboard is stably fixed during the test, avoiding test errors caused by movement or poor contact.
[0050] In order to further improve the practicality of the device during actual use, the outer surfaces of the fixing frame 18, the extrusion frame 19, the adjustment frame 110, the adjustable pressure block frame 111, the adjustable pressure plate 112 and the extrusion wrench 113 are provided with a compression mechanism 2. The staff can nest the limit frame 23 on the outer surface, and dock one side of the limit frame 23 on the adjustment frame 22 on the mounting block 21, and then install the side of the limit frame 23 away from the mounting block 21 and the adjustment frame 22 on the bottom box 11 by adjusting the flip frame 24. When it is necessary to install the detection main board 115, the staff can install the main board by removing the limit frame 23 from the outer surface of the adjustment pressure plate 17, and then re-reinforce the adjustment pressure plate 17.
[0051] In addition, in order to improve the test diversity of the device during actual use, a pressure rod mechanism 3 is set between the adjustable pressure plate 112 and the adjustable pressure block frame 111 for pressure testing. The staff can fix the bottom end of the fixed plate 31 to the adjustable pressure plate 17 and fix the bottom side of the top plate 32 to the fixed plate 31. Then, by controlling the pressure handle 34, the pressure applicator 33 applies pressure between the adjustable pressure plate 112 and the adjustable pressure block frame 111, thereby performing a pressure test on the main board. This design further improves the practicality of the device during actual use and the diversity of tests.
[0052] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
[0053] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0054] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values of the parts and steps described in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.
Claims
1. A notebook motherboard testing device, characterized in that: include: A testing mechanism (1), the testing mechanism (1) comprising a bottom box (11), a hinge (12) being provided on one side of the bottom box (11), a flap (13) being provided on one end of the hinge (12), a placement plate (14) being provided on a side of the bottom box (11) away from the hinge (12) and the flap (13), a fixing block (15) being provided on the bottom box (11), an adjustment rod (16) being provided on the fixing block (15), an adjustment pressure plate (17) being provided at one end of the adjustment rod (16), a fixing frame (18) being provided on the adjustment pressure plate (17), an extrusion frame (19) being provided on one side of the fixing frame (18), and the extrusion frame (19) being provided on one side of the fixing frame (18). 9) An adjustment frame (110) is provided at one end away from the fixing frame (18), an adjustable pressure block frame (111) is provided at one side of the adjustment frame (110), an adjustable pressure plate (112) is provided at one side of the adjustable pressure block frame (111) away from the adjustment frame (110), an extrusion wrench (113) is provided at one end of the adjustable pressure plate (112) away from the adjustable pressure block frame (111), a docking frame (114) is provided between the bottom box (11) and the adjustment pressure plate (17), a detection main board (115) is provided at one side of the docking frame (114), and a buckle frame (116) is provided at one end of the detection main board (115) away from the docking frame (114).
2. A notebook motherboard testing device according to claim 1, characterized in that: A pressure-resistant mechanism (2) is provided on the outer surface of the bottom box (11) located at the adjusting pressure plate (17), and the pressure-resistant mechanism (2) comprises a mounting block (21), an adjusting frame (22) is provided at one end of the mounting block (21), a limiting frame (23) is provided on a side of the adjusting frame (22) away from the mounting block (21), and an adjusting flip frame (24) is provided on a side of the limiting frame (23) away from the adjusting frame (22) and the mounting block (21).
3. A notebook motherboard testing device according to claim 2, characterized in that: The bottom end of the mounting block (21) is fixedly connected to the bottom box (11); the bottom side of the adjusting frame (22) is fixedly connected to a side of the mounting block (21) away from the bottom box (11); the bottom side of the limiting frame (23) is mounted on the adjusting frame (22); one end of the adjusting flip frame (24) is mounted on a side of the limiting frame (23) away from the adjusting frame (22) and the mounting block (21); and one end of the adjusting flip frame (24) away from the limiting frame (23) is snap-fitted to the bottom box (11).
4. A notebook motherboard testing device according to claim 1, characterized in that: The adjusting pressure plate (17) is provided with a pressure rod mechanism (3), the pressure rod mechanism (3) comprises a fixed plate (31), one end of the fixed plate (31) is provided with a top plate (32), the top plate (32) is provided with a pressure applicator (33), and the pressure applicator (33) is provided with a pressure handle (34).
5. A notebook motherboard testing device according to claim 4, characterized in that: One end of the fixed plate (31) is fixedly connected to the adjusting pressure plate (17), the bottom side of the top plate (32) is fixedly connected to the end of the fixed plate (31) away from the adjusting pressure plate (17), the pressure applicator (33) is upper-limited on the top plate (32) for rotational pressure application, the pressure applicator (33) passes through the top plate (32) and is docked between the adjustable pressure block frame (111) and the adjustable pressure plate (112), and one end of the pressure handle (34) is docked on the pressure applicator (33).
6. A notebook motherboard testing device according to claim 1, characterized in that: One end of the hinge (12) is butted against the bottom box (11), and the end of the hinge (12) away from the bottom box (11) is butted against the flap (13); the outer surface of the placement plate (14) is nested on the side of the bottom box (11) away from the flap (13).
7. A notebook motherboard testing device according to claim 1, characterized in that: The bottom end of the fixed block (15) is fixedly connected to the bottom box (11), one end of the adjusting rod (16) is butted against the fixed block (15), one end of the adjusting rod (16) away from the fixed block (15) is butted against the adjusting pressure plate (17), one end of the fixing frame (18) is fixedly connected to the adjusting pressure plate (17), and one side of the extrusion frame (19) is fixedly connected to one side of the fixing frame (18).
8. A notebook motherboard testing device according to claim 1, characterized in that: One side of the adjustment frame (110) is butted against a side of the extrusion frame (19) away from the fixed frame (18), and one side of the adjustable pressure block frame (111) is butted against a side of the adjustment frame (110) away from the extrusion frame (19).
9. A notebook motherboard testing device according to claim 1, characterized in that: One end of the adjustable pressure plate (112) is butt-jointed with one side of the adjustable pressure block frame (111), one end of the extrusion wrench (113) is butt-jointed with one end of the adjustable pressure plate (112), the bottom side of the extrusion wrench (113) is butt-jointed with the adjustment pressure plate (17), and the bottom side of the butt-jointing frame (114) is fixedly connected with the bottom box (11).
10. A notebook motherboard testing device according to claim 1, characterized in that: One end of the detection mainboard (115) contacts the docking frame (114), the bottom side of the buckle frame (116) is fixedly connected to the bottom box (11), and one end of the detection mainboard (115) away from the docking frame (114) contacts one end of the buckle frame (116).