End face coupler and preparation method thereof

Through the multi-layer silicon nitride integration solution, the efficient coupling of optical fiber and silicon optical chip is achieved in silicon optical integration technology, and the problem of low input and output efficiency in the existing technology is solved, and an efficient and reliable optical coupling structure is realized. Promote the industrialization of silicon optical devices.

CN119493215APending Publication Date: 2025-02-21UNITED MICROELECTRONICS CENT CO LTD
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Patent Information

Application Number
CN202411906998.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-02-21

AI Technical Summary

Technical Problem

The prior art is difficult to achieve high efficiency, large bandwidth, high reliability and easy integration optical coupling structures in silicon optical integration technology, especially in terms of optical signal input and output.

Method used

Using a multi-layer silicon nitride integration solution, through reasonable structural design, the large-mode field in the optical fiber is thermally transformed to the bound optical mode field in the silicon waveguide, achieving efficient coupling between the optical fiber and the silicon optical chip.

Benefits of technology

It realizes the characteristics of low coupling loss, low polarization loss, large coupling tolerance, high reliability, easy packaging and large-scale production, greatly reducing packaging costs and promoting the industrial application of silicon optical devices.

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Abstract

The invention relates to an end face coupler and a preparation method thereof. An end face coupler includes: a semiconductor substrate; the buried oxide layer, the first waveguide, the first spacing layer, the second waveguide, the second spacing layer, the third waveguide and the upper cladding are sequentially arranged above the semiconductor substrate along a first direction which is vertical to the semiconductor substrate and is from bottom to top; and an interconnection structure lower than the third waveguide in the first direction; an optical signal from an optical fiber coupled with the end face coupler is coupled into the third waveguide, coupled into the second waveguide from the third waveguide in an evanescent field coupling mode, and then coupled into the first waveguide from the second waveguide in an evanescent field coupling mode. The third waveguide is arranged on the semiconductor substrate so as to gradually transition from a mode field of the optical fiber to a waveguide mode bound by the first waveguide, and the distance between the third waveguide and the semiconductor substrate in the first direction is not smaller than the radius of the mode field of the optical fiber.
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