Multi-channel optical fiber fluorescence temperature measurement device and method for electrostatic chuck in etcher

Abstract

The present application discloses a multi-channel optical fiber fluorescence temperature measurement device and method for an electrostatic chuck in an etching machine, and relates to the field of semiconductor etching technology. The device includes temperature sensors arranged in different areas of the electrostatic chuck, and each temperature sensor includes a fluorescence temperature measurement head, a ceramic sleeve, a switching optical fiber, a transmission optical fiber, an optical coupling module, a photoelectric detection module, and a working light source module; wherein the fluorescence temperature measurement head includes a stacked fluorescent layer and a thermal conductive layer, the fluorescent layer is prepared by a hot pressing sintering method, and the end face of the fluorescent layer is gold-plated, the thermal conductive layer includes a copper diamond composite material, the end face of the thermal conductive layer is gold-plated and connected to the end face of the fluorescent layer through a vacuum reflow void-free welding process, the ceramic sleeve covers the switching optical fiber, the end face of the ceramic sleeve is gold-plated, and the fluorescence temperature measurement head is connected through a vacuum reflow void-free welding process. The device of the present application can effectively improve the temperature measurement accuracy and broaden the temperature measurement range, and accurately measure the temperature distribution on the surface of the semiconductor wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor etching technology, and in particular to a multi-channel optical fiber fluorescence temperature measurement device and method for an electrostatic chuck in an etcher. Background Art

[0002] Etching technology is a basic manufacturing process for semiconductor devices and integrated circuits. It can selectively corrode and strip the surface of the semiconductor substrate or the surface covering film according to the requirements of the mask pattern design, and determine the accuracy and quality of the semiconductor circuit pattern, which directly affects the performance and yield of the final chip produced. As the main equipment for implementing etching technology, the etcher can remove the material on the surface of the semiconductor wafer according to the preset shape and through physical or chemical methods to form a circuit pattern.

[0003] In the etcher, the electrostatic chuck is a key component used to fix the position of the semiconductor wafer and control the temperature of the semiconductor wafer. It can ensure the accuracy and uniformity of the etching process, which is particularly important for the production quality control of semiconductor devices. Since the etching of semiconductor wafers is usually carried out under the condition of a very small temperature field variation range, otherwise it will directly affect the etching rate and quality, reduce the service life of the product, and even destroy the semiconductor material. Therefore, it is necessary to accurately measure the temperature distribution on the surface of the semiconductor wafer in order to adjust the electrostatic chuck heating or cooling devices to achieve precise control of the temperature of the adsorbed semiconductor wafer.

[0004] However, the electrostatic chuck temperature measurement device of the related technology can only achieve local temperature measurement, and naturally cannot effectively control the temperature of the entire area of ​​the semiconductor wafer to ensure consistency. In addition, the temperature measurement accuracy is ±1°C, and the temperature measurement range is below 200°C. It cannot adapt to the new requirements of the current electrostatic chuck temperature measurement, that is, the temperature measurement accuracy is ≤±0.1°C, and the temperature measurement range is >200°C, which has limitations. Summary of the invention

[0005] In view of the above-mentioned defects or deficiencies in the related art, it is desired to provide a multi-channel fiber optic fluorescence temperature measurement device and method for an electrostatic chuck in an etcher, which can improve the temperature measurement accuracy and widen the temperature measurement range, and accurately measure the temperature distribution on the surface of a semiconductor wafer.

[0006] In a first aspect, the present application provides a multi-channel optical fiber fluorescence temperature measuring device for an electrostatic chuck in an etcher, wherein the multi-channel optical fiber fluorescence temperature measuring device comprises temperature measuring sensors arranged in different areas of the electrostatic chuck, and each of the temperature measuring sensors comprises a fluorescent temperature measuring head, a ceramic sleeve, a switching optical fiber, a transmission optical fiber, an optical coupling module, a photoelectric detection module and a working light source module;

[0007] The fluorescent temperature measuring head comprises a fluorescent layer and a heat-conducting layer which are stacked, the fluorescent layer is prepared by hot pressing and sintering, and the end face of the fluorescent layer is plated with gold, the heat-conducting layer comprises a copper-diamond composite material, the end face of the heat-conducting layer is plated with gold, and the end face of the fluorescent layer is connected by a vacuum reflow and void-free welding process; the ceramic sleeve covers the switching optical fiber, the end face of the ceramic sleeve is plated with gold, and the end face of the ceramic sleeve is connected to the fluorescent temperature measuring head by a vacuum reflow and void-free welding process;

[0008] One end of the switching optical fiber is arranged opposite to the fluorescent layer, the other end of the switching optical fiber is connected to one end of the transmission optical fiber, the other end of the transmission optical fiber is connected to the first end of the optical coupling module, the second end of the optical coupling module is connected to the photoelectric detection module, and the third end of the optical coupling module is connected to the working light source module; the working light source module is configured to output incident light that can excite the fluorescent layer to produce fluorescence, and the photoelectric detection module is configured to detect the lifetime of the fluorescent signal reflected by the fluorescent layer, and determine the fluorescent material temperature corresponding to the fluorescent signal lifetime based on the mapping relationship between the fluorescence lifetime and the temperature of the fluorescent material.

[0009] Optionally, in some embodiments of the present application, the fluorescent layer includes rare earth tri-color fluorescent powder, gadolinium terbium oxysulfide and magnesium germanium fluoride.

[0010] Optionally, in some embodiments of the present application, the end surface gold plating thickness of the fluorescent layer is 1 m to 3 m.

[0011] Optionally, in some embodiments of the present application, there is a gap between the fluorescent layer and the switching optical fiber, and the gap value is 0.2 mm to 0.4 mm.

[0012] Optionally, in some embodiments of the present application, the heat conducting layer is an inverted concave structure, the first end surface of the inverted concave structure connected to the fluorescent layer is gold-plated, and the second end surface of the inverted concave structure connected to the ceramic sleeve is gold-plated.

[0013] Optionally, in some embodiments of the present application, the gold plating thickness of the first end surface and the gold plating thickness of the second end surface are both 1 m to 3 m.

[0014] Optionally, the ceramic sleeve in some embodiments of the present application includes zirconium oxide material or silicon nitride material.

[0015] Optionally, in some embodiments of the present application, the solder between the fluorescent layer and the thermal conductive layer is gold-tin solder, and the solder between the fluorescent temperature measuring head and the ceramic sleeve is lead solder.

[0016] Optionally, in some embodiments of the present application, the ceramic sleeve is provided with a compression spring and a top screw that can be fixedly connected to the electrostatic chuck at one end close to the transmission optical fiber.

[0017] In a second aspect, the present application provides a multi-channel optical fiber fluorescence temperature measurement method, which is used for the multi-channel optical fiber fluorescence temperature measurement device described in any one of the first aspects, and the multi-channel optical fiber fluorescence temperature measurement method includes:

[0018] Simultaneously outputting incident light that can excite the fluorescent layer to generate fluorescence to each fluorescent layer of the multi-channel optical fiber fluorescent temperature measuring device;

[0019] The lifetime of the fluorescent signal reflected by the fluorescent layer is detected, and the temperature of the fluorescent material corresponding to the lifetime of the fluorescent signal is determined according to a mapping relationship between the fluorescent lifetime and the temperature of the fluorescent material.

[0020] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0021] The embodiment of the present application provides a multi-channel fiber optic fluorescence temperature measuring device and method for an electrostatic chuck in an etcher. By arranging the same temperature measuring sensors in different areas of the electrostatic chuck, the temperature distribution on the surface of the semiconductor wafer adsorbed by the electrostatic chuck can be accurately measured simultaneously, with high consistency and interchangeability. The fluorescent layer in each temperature measuring sensor is prepared by hot pressing and sintering, and is connected to the thermal conductive layer by a vacuum reflow void-free welding process after gold plating on the end face. In other words, the entire fluorescent temperature measuring head is non-gelled, which can meet the temperature measurement requirements above 400°C, avoiding the temperature resistance limit of only 200°C caused by the use of epoxy resin glue, effectively broadening the temperature measurement range, and the thermal conductive layer includes a copper diamond composite material with a thermal conductivity of 1000 W / m•degree, that is, the heat conduction speed is faster, the measured temperature information is more accurate, and the temperature measurement frequency is also higher, so that the temperature measurement accuracy can be less than or equal to ±0.1°C. Furthermore, a switching optical fiber is provided at a relative position to the fluorescent layer, and the switching optical fiber is connected to the transmission optical fiber to transmit the fluorescent signal, and has strong anti-electromagnetic interference capability. The outside of the switching optical fiber is coated with a ceramic sleeve, and the end face of the ceramic sleeve is gold-plated and connected to the fluorescent temperature measuring head through a vacuum reflow void-free welding process, thereby achieving glue-free, and at the same time isolating the adverse effects of external heat on the switching optical fiber, so that the photoelectric detection module can detect the lifetime of the fluorescent signal reflected by the fluorescent layer, and according to the mapping relationship between the fluorescence lifetime and the temperature of the fluorescent material, quickly determine the fluorescent material temperature corresponding to the fluorescence signal lifetime, thereby obtaining the temperature of the surface of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the structure of a multi-channel optical fiber fluorescence temperature measurement device for an electrostatic chuck in an etcher provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the surface temperature field distribution of a semiconductor wafer provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the structure of a temperature sensor provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of a fluorescent temperature measuring head provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of the structure of a heat-conducting layer provided in an embodiment of the present application;

[0028] Figure 6 A schematic diagram of the structure of a ceramic sleeve provided in an embodiment of the present application;

[0029] Figure 7 A schematic diagram of the structure of another ceramic sleeve provided in an embodiment of the present application;

[0030] Figure 8 A schematic flow chart of a multi-channel optical fiber fluorescence temperature measurement method provided in an embodiment of the present application.

[0031] Reference numerals:

[0032] 1-multi-channel fiber optic fluorescence temperature measuring device, 11-temperature measuring sensor, 111-fluorescence temperature measuring head, 1111-fluorescent layer, 1112-thermal conductive layer, 112-ceramic sleeve, 1121-compression spring, 1122-top screw, 113-transfer optical fiber, 114-transmission optical fiber, 115-optical coupling module, 116-photoelectric detection module, 117-working light source module, 2-electrostatic chuck, 21-cooling layer of electrostatic chuck, 3-semiconductor wafer. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Figures 1 to 8 The multi-channel fiber optic fluorescence temperature measurement device and method for the electrostatic chuck in the etcher provided in the embodiments of the present application are described in detail.

[0036] Please refer to Figure 1 , which is a schematic diagram of the structure of a multi-channel optical fiber fluorescence temperature measuring device for an electrostatic chuck in an etching machine provided by an embodiment of the present application. The multi-channel optical fiber fluorescence temperature measuring device 1 includes temperature measuring sensors 11 arranged in different areas of an electrostatic chuck 2, such as Figure 2 The schematic diagram of the surface temperature field distribution of the semiconductor wafer 3 is shown, so that each temperature measuring sensor 11 can be located on the electrostatic chuck 2 corresponding to different temperature areas of the semiconductor wafer 3, and the number of temperature measuring channels is 4 to 16.

[0037] For example, Figure 3 As shown, each temperature sensor 11 includes a fluorescent temperature measuring head 111, a ceramic sleeve 112, a switching optical fiber 113, a transmission optical fiber 114, an optical coupling module 115, a photoelectric detection module 116 and a working light source module 117. ① For example Figure 4 As shown, the fluorescent temperature measuring head 111 may include a fluorescent layer 1111 and a heat conducting layer 1112 which are stacked, wherein the fluorescent layer 1111 is prepared by hot pressing and sintering, and the end surface of the fluorescent layer 1111 is gold plated, for example, the fluorescent layer 1111 includes but is not limited to a mixed material such as rare earth tri-color fluorescent powder, gadolinium terbium oxysulfide and magnesium germanium fluoride, and then the mixed material is sintered at a high temperature of more than 1000° C. into a fluorescent material block, and then cut into pieces with a thickness of 200 m to 300 m, a fluorescent layer 1111 with a square or round shape and a size of 1 mm to 2 mm, the processing process does not require manual operation, ensuring that the sensor has higher consistency and interchangeability, and the end surface gold plating thickness of the fluorescent layer 1111 is 1 m to 3 m, which is convenient for welding with the heat-conducting layer 1112. At the same time, gold is heat-resistant and has good thermal conductivity. The heat-conducting layer 1112 directly contacts the temperature measuring point and can quickly conduct heat to the fluorescent layer 1111. For example, the heat-conducting layer 1112 includes a copper-diamond composite material, which is resistant to high and low temperatures, and the temperature measuring range can be -120°C to 450°C, and the thermal conductivity is 1000 W / m•degree. The heat conduction speed is faster, the measured temperature information is more accurate, and the temperature measurement frequency is also higher, reaching 30Hz. At the same time, the end face of the heat-conducting layer 1112 is gold-plated and connected to the end face of the fluorescent layer 1111 through a vacuum reflow void-free welding process. The gold plating thickness of the end face of the heat-conducting layer 1112 is 1 m to 3 m.

[0038] Alternatively, if Figure 5 As shown, the heat conducting layer 1112 is an inverted concave structure, the first end surface of the inverted concave structure connected to the fluorescent layer 1111 is gold-plated, and the second end surface of the inverted concave structure connected to the ceramic sleeve 112 is gold-plated. For example, the gold-plated thickness of the first end surface and the gold-plated thickness of the second end surface are both 1 m to 3 m, the advantage of such a setting is that the contact area between the heat conducting layer 1112 and the fluorescent layer 1111 can be increased, the response speed is faster, and the final measured temperature is more accurate.

[0039] ② Another example Figure 6 As shown, the ceramic sleeve 112 covers the switching optical fiber 113, one end of the switching optical fiber 113 is arranged opposite to the fluorescent layer 1111, the end face of the ceramic sleeve 112 is gold-plated and connected to the fluorescent temperature measuring head 111 through a vacuum reflow non-void welding process. For example, the ceramic sleeve 112 includes but is not limited to low thermal conductivity materials such as zirconium oxide materials and silicon nitride materials. The thermal conductivity of zirconium oxide materials is 2.2 W / m·degree, and the thermal conductivity of silicon nitride materials is 3.4 W / m·degree, thereby effectively isolating external heat from being conducted to the switching optical fiber 113 to prevent interference with the temperature measurement process and protect the switching optical fiber 113. For another example, the thickness of the gold plating on the end face of the ceramic sleeve 112 is also 1 m to 3 m, realizing the glue-free connection between the fluorescent layer 1111 and the switching optical fiber 113. It should be noted that in the embodiment of the present application, the solder between the fluorescent layer 1111 and the heat-conducting layer 1112 can be a high-temperature soldering material such as gold-tin solder, and the welding temperature is relatively high, reaching above 300°C, while the solder between the fluorescent temperature measuring head 111 and the ceramic sleeve 112 can be a low-temperature soldering material such as lead solder, and the welding temperature is 200°C, that is, the first welding uses a high-temperature soldering material, and the second welding uses a low-temperature soldering material. The advantage of such a setting is to ensure that the second welding will not affect the effect of the first welding, realizing the glue-free of the entire structure, and the welding material is also an excellent thermal conductor, which will not destroy the fast and accurate thermal conductivity characteristics of the fluorescent temperature measuring head 111.

[0040] Furthermore, in the embodiment of the present application, there is a gap between the fluorescent layer 1111 and the switching optical fiber 113 (corresponding to Figure 4 The gap value is 0.2mm to 0.4mm, thereby avoiding the direct contact between the fluorescent layer 1111 and the ceramic sleeve 112 to generate a thermal bridge, thereby achieving a heat insulation effect. Figure 7 As shown, in some embodiments of the present application, a compression spring 1121 and a top screw 1122 that can be fixedly connected to the electrostatic suction cup 2 are provided at one end of the ceramic sleeve 112 close to the transmission optical fiber 114, wherein the reference numeral 21 represents the cooling layer of the electrostatic suction cup. The advantage of such a configuration is that the front and rear positions of the temperature sensor 11 can be adjusted by adjusting the top screw 1122, while the compression spring 1121 plays a tightening role, ultimately ensuring that the temperature sensor 11 and the temperature measuring point of the semiconductor wafer 3 are in a suitable position.

[0041] ③ For another example, one end of the transmission optical fiber 114 is connected to the other end of the switching optical fiber 113, the other end of the transmission optical fiber 114 is connected to the first end of the optical coupling module 115, the second end of the optical coupling module 115 is connected to the photoelectric detection module 116, and the third end of the optical coupling module 115 is connected to the working light source module 117. In actual use, the working light source module 117 can output incident light that can excite the fluorescent layer 1111 to produce fluorescence, and the photoelectric detection module 116 can detect the lifetime of the fluorescent signal reflected by the fluorescent layer 1111, and quickly determine the fluorescent material temperature corresponding to the fluorescent signal lifetime based on the mapping relationship between the fluorescent lifetime and the fluorescent material temperature, for example, the mapping relationship includes but is not limited to a function curve and a two-dimensional table, which can be obtained through experimental data.

[0042] As another aspect, an embodiment of the present application further provides an etcher, in which temperature sensors 11 of a multi-channel optical fiber fluorescence temperature measuring device 1 are provided in different areas of an electrostatic chuck 2 in the etcher.

[0043] Based on the above embodiments, the present invention provides a multi-channel optical fiber fluorescence temperature measurement method, which can be used for Figures 1 to 7 The multi-channel optical fiber fluorescence temperature measuring device 1 of the corresponding embodiment. Please refer to Figure 8 , which is a flow chart of a multi-channel optical fiber fluorescence temperature measurement method provided in an embodiment of the present application, the method specifically comprises the following steps:

[0044] S101, simultaneously outputting incident light that can excite the fluorescent layers to generate fluorescence to each fluorescent layer of the multi-channel optical fiber fluorescence temperature measurement device.

[0045] Exemplarily, the incident light output by the working light source module 117 in the multi-channel fiber optic fluorescence temperature measuring device 1 passes through the optical coupling module 115 to the transmission optical fiber 114, and then irradiates the fluorescent layer 1111 at the head of the switching optical fiber 113 to stimulate fluorescence, wherein the thermal conductive layer 1112 at the front end of the fluorescent layer 1111 contacts the electrostatic suction cup 2 and conducts heat to the fluorescent layer 1111 quickly and accurately.

[0046] S102, detecting the lifetime of the fluorescent signal reflected by the fluorescent layer, and determining the fluorescent material temperature corresponding to the fluorescent signal lifetime according to a mapping relationship between the fluorescent lifetime and the fluorescent material temperature.

[0047] Exemplarily, the fluorescent signal excited on the fluorescent layer 1111 returns to the optical coupling module 115 through the switching optical fiber 113 and the transmission optical fiber 114, and the photoelectric detection module 116 detects the lifetime of the fluorescent signal and determines the fluorescent material temperature corresponding to the lifetime of the fluorescent signal.

[0048] It should be noted that, for the description of the same steps and the same contents in this embodiment as those in other embodiments, reference can be made to the description in other embodiments and will not be repeated here.

[0049] The multi-channel fiber optic fluorescence temperature measuring device and method for the electrostatic chuck in the etcher provided in the embodiment of the present application can accurately measure the temperature distribution on the surface of the semiconductor wafer adsorbed by the electrostatic chuck at the same time by arranging the same temperature measuring sensors in different areas of the electrostatic chuck, with high consistency and interchangeability. The fluorescent layer in each temperature measuring sensor is prepared by hot pressing and sintering, and is connected to the thermal conductive layer by a vacuum reflow void-free welding process after gold plating on the end face. That is to say, the entire fluorescent temperature measuring head is non-gelled, which can meet the temperature measurement requirements above 400°C, avoiding the temperature resistance limit of only 200°C caused by the use of epoxy resin glue, effectively broadening the temperature measurement range, and the thermal conductive layer includes a copper diamond composite material with a thermal conductivity of 1000 W / m•degree, that is, the heat conduction speed is faster, the measured temperature information is more accurate, and the temperature measurement frequency is also higher, so that the temperature measurement accuracy can be less than or equal to ±0.1°C. Furthermore, a switching optical fiber is provided at a relative position to the fluorescent layer, and the switching optical fiber is connected to the transmission optical fiber to transmit the fluorescent signal, and has strong anti-electromagnetic interference capability. The outside of the switching optical fiber is coated with a ceramic sleeve, and the end face of the ceramic sleeve is gold-plated and connected to the fluorescent temperature measuring head through a vacuum reflow void-free welding process, thereby achieving glue-free, and at the same time isolating the adverse effects of external heat on the switching optical fiber, so that the photoelectric detection module can detect the lifetime of the fluorescent signal reflected by the fluorescent layer, and according to the mapping relationship between the fluorescence lifetime and the temperature of the fluorescent material, quickly determine the fluorescent material temperature corresponding to the fluorescence signal lifetime, thereby obtaining the temperature of the surface of the semiconductor wafer.

[0050] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A multi-channel optical fiber fluorescence temperature measuring device for an electrostatic chuck in an etching machine, characterized in that: The multi-channel optical fiber fluorescence temperature measurement device (1) comprises temperature measurement sensors (11) arranged in different areas of the electrostatic chuck (2), each of the temperature measurement sensors (11) comprising a fluorescence temperature measurement head (111), a ceramic sleeve (112), a switching optical fiber (113), a transmission optical fiber (114), an optical coupling module (115), a photoelectric detection module (116) and a working light source module (117); The fluorescent temperature measuring head (111) comprises a fluorescent layer (1111) and a heat conducting layer (1112) which are stacked, the fluorescent layer (1111) being prepared by a hot pressing sintering method and the end face of the fluorescent layer (1111) being plated with gold, the heat conducting layer (1112) comprising a copper diamond composite material, the end face of the heat conducting layer (1112) being plated with gold and connected to the end face of the fluorescent layer (1111) by a vacuum reflow void-free welding process; the ceramic sleeve (112) covering the switching optical fiber (113), the end face of the ceramic sleeve (112) being plated with gold and connected to the fluorescent temperature measuring head (111) by a vacuum reflow void-free welding process; One end of the switching optical fiber (113) is arranged opposite to the fluorescent layer (1111), the other end of the switching optical fiber (113) is connected to one end of the transmission optical fiber (114), the other end of the transmission optical fiber (114) is connected to the first end of the optical coupling module (115), the second end of the optical coupling module (115) is connected to the photoelectric detection module (116), and the third end of the optical coupling module (115) is connected to the working light source module (117); the working light source module (117) is configured to output incident light that can excite the fluorescent layer (1111) to generate fluorescence, and the photoelectric detection module (116) is configured to detect the lifetime of the fluorescent signal reflected by the fluorescent layer (1111), and determine the fluorescent material temperature corresponding to the fluorescent signal lifetime according to the mapping relationship between the fluorescent lifetime and the fluorescent material temperature.

2. The multi-channel optical fiber fluorescence temperature measurement device according to claim 1, characterized in that: The fluorescent layer (1111) comprises rare earth tri-color fluorescent powder, gadolinium terbium oxysulfide and magnesium germanium fluoride.

3. The multi-channel optical fiber fluorescence temperature measuring device according to claim 2, characterized in that: The gold plating thickness of the end surface of the fluorescent layer (1111) is 1 m to 3 m.

4. The multi-channel optical fiber fluorescence temperature measurement device according to claim 1, characterized in that: There is a gap between the fluorescent layer (1111) and the switching optical fiber (113), and the gap value is 0.2 mm to 0.4 mm.

5. The multi-channel optical fiber fluorescence temperature measurement device according to claim 1, characterized in that: The heat conducting layer (1112) is an inverted concave structure, a first end surface of the inverted concave structure connected to the fluorescent layer (1111) is gold-plated, and a second end surface of the inverted concave structure connected to the ceramic sleeve (112) is gold-plated.

6. The multi-channel optical fiber fluorescence temperature measurement device according to claim 5, characterized in that: The gold plating thickness of the first end surface and the gold plating thickness of the second end surface are both 1 m to 3 m.

7. The multi-channel optical fiber fluorescence temperature measuring device according to any one of claims 1 to 6, characterized in that: The ceramic sleeve (112) comprises zirconium oxide material or silicon nitride material.

8. The multi-channel optical fiber fluorescence temperature measurement device according to claim 7, characterized in that: The solder between the fluorescent layer (1111) and the heat-conducting layer (1112) is gold-tin solder, and the solder between the fluorescent temperature measuring head (111) and the ceramic sleeve (112) is lead solder.

9. The multi-channel optical fiber fluorescence temperature measurement device according to claim 7, characterized in that: One end of the ceramic sleeve (112) close to the transmission optical fiber (114) is provided with a compression spring (1121) and a top screw (1122) that can be fixedly connected to the electrostatic suction cup (2).

10. A multi-channel optical fiber fluorescence temperature measurement method, characterized in that: The multi-channel optical fiber fluorescence temperature measurement method is used for the multi-channel optical fiber fluorescence temperature measurement device according to any one of claims 1 to 9, and the multi-channel optical fiber fluorescence temperature measurement method comprises: Simultaneously outputting incident light that can excite the fluorescent layer to generate fluorescence to each fluorescent layer of the multi-channel optical fiber fluorescent temperature measuring device; The lifetime of the fluorescent signal reflected by the fluorescent layer is detected, and the temperature of the fluorescent material corresponding to the lifetime of the fluorescent signal is determined according to a mapping relationship between the fluorescent lifetime and the temperature of the fluorescent material.

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