Electronic component and manufacturing method thereof

Abstract

The invention provides an electronic component and a manufacturing method thereof. The electronic component comprises a substrate, a chip, a covering part, a capacitor component and a sealing structure. The chip is disposed on the substrate. The cover is disposed on the chip. The capacitor assembly is disposed on the substrate. The sealing structure surrounds the chip and seals a gap between the cover and the substrate. The sealing structure comprises an insulating colloid, and the insulating colloid wraps the capacitor assembly. According to the electronic component and the manufacturing method of the electronic component, overflow of liquid metal is effectively prevented through a simple sealing structure.

Description

Technical Field

[0001] The invention relates to an electronic component and a manufacturing method thereof. Background Art

[0002] The gap between the chip and the heat sink fin group can be filled with liquid metal, so that the heat of the chip can be effectively transferred to the heat sink fin group. In order to prevent the overflow of liquid metal from causing the capacitor component next to the chip to short-circuit and / or other components in the electronic system to short-circuit, insulating film, foam and plastic cover are generally used to seal around the chip. However, this sealing method has complicated procedures and is not easy to rework, and the prevention effect of liquid metal overflow is limited. Summary of the invention

[0003] The present invention provides an electronic component, which includes a substrate, a chip, a cover, a capacitor component and a sealing structure. The chip is arranged on the substrate. The cover is arranged on the chip. The capacitor component is arranged on the substrate. The sealing structure surrounds the chip and seals the gap between the cover and the substrate. The sealing structure includes an insulating colloid, and the insulating colloid covers the capacitor component.

[0004] The present invention further provides a method for manufacturing an electronic component, comprising the following steps: providing a substrate, on which a chip and a capacitor component are disposed; providing a sealing structure on the substrate to surround the chip; configuring a cover on the chip, and allowing the sealing structure to seal a gap between the cover and the substrate; the sealing structure includes an insulating colloid, and the step of providing the sealing structure includes the following steps: encapsulating the capacitor component with the insulating colloid; defining the shape of the insulating colloid with a jig and curing the insulating colloid.

[0005] Based on the above, the sealing structure of the present invention includes an insulating colloid for coating the capacitor component, which can effectively prevent the overflowing liquid metal from causing a short circuit of the capacitor component. In addition, the present invention uses an insulating colloid to coat the capacitor component, replacing the complex sealing structure of the insulating film and plastic cover used to protect the capacitor component in the traditional sealing structure, thereby simplifying the setting process of the sealing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a partial cross-sectional view of an electronic component according to an embodiment of the present invention;

[0007] Figure 2 yes Figure 1 A schematic top view of some components of an electronic assembly;

[0008] FIG. 3A to FIG. 3F is a flow chart of a method for manufacturing an electronic component according to an embodiment of the present invention. DETAILED DESCRIPTION

[0009] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0010] Figure 1 FIG. 4 is a partial cross-sectional view of an electronic component according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic top view of some components of an electronic assembly, Figure 1 The cross section corresponds to Figure 2 Part of II line. Please refer to Figure 1 and Figure 2 The electronic component 100 of this embodiment includes a substrate 110, a chip 120, a cover 130, a capacitor component 140, a sealing structure 150, a structural reinforcement 160 and a liquid metal layer 170. The chip 120 is, for example, a graphics processing unit (GPU) or other types of chips and is configured on the substrate 110. The cover 130 is, for example, a heat sink (such as a heat sink fin group) and is configured on the chip 120. In other embodiments, the cover 130 can be other types of components, and the present invention is not limited to this.

[0011] The structural reinforcement member 160 is, for example, a ring-shaped metal member, which surrounds the chip 120 and is supported between the substrate 110 and the cover 130. The liquid metal layer 170 is disposed between the chip 120 and the cover 130 to fill the gap between the chip 120 and the cover 130. The capacitor element 140 is, for example, a multi-layer ceramic capacitor (MLCC) or other types of capacitors and is disposed on the substrate 110. The sealing structure 150 surrounds the chip 120 and seals the gap between the cover 130 and the substrate 110.

[0012] The sealing structure 150 of the present embodiment includes an insulating colloid 152, which is located between the chip 120 and the structural reinforcement 160 and covers the capacitor component 140. Accordingly, the protection of the capacitor component 140 by the insulating colloid 152 can effectively prevent the overflowing liquid metal 170 from causing a short circuit of the capacitor component 140. In addition, the present embodiment uses the insulating colloid 152 to cover the capacitor component, replacing the complex sealing structure of the insulating film and the plastic cover used to protect the capacitor component in the traditional sealing structure, thereby simplifying the setting process of the sealing structure 150.

[0013] The insulating colloid 152 of the present embodiment is, for example, a removable colloid so that the sealing structure 150 can be easily reworked. In addition, the insulating colloid 152 of the present embodiment is, for example, a light-curing colloid. Specifically, the insulating colloid 152 of the present embodiment can be a removable light-curing resin (removable UV epoxy). However, the present invention is not limited thereto. In other embodiments, the insulating colloid 152 can be a heat-curing colloid or other types of colloid.

[0014] Please refer to Figure 1 In detail, the sealing structure 150 of the present embodiment further includes a foam layer 154 and an insulating film 156. The foam layer 154 is disposed between the insulating colloid 152 and the cover 130, and the insulating film 156 is, for example, a polyimide (PI) film or other types of insulating films and is disposed between the foam layer 154 and the cover 130. The foam layer 154 has good elastic deformation ability to absorb the manufacturing and assembly tolerances of the electronic component 100, so that the sealing structure 150 can reliably seal the gap between the cover 130 and the substrate 110. The insulating film 156 has good heat resistance and is isolated between the foam layer 154 and the cover 130 to prevent the heat of the chip 120 from being directly transferred to the foam layer 154 with relatively insufficient heat resistance through the cover 130.

[0015] In this embodiment, the insulating film 156 is glued to the cover 130 by, for example, a glue layer 180. In addition, the foam layer 154 and the insulating film 156 may also be bonded to each other by a glue layer. However, the present invention is not limited thereto, and there may be no glue layer between the foam layer 154 and the insulating film 156.

[0016] like Figure 1 As shown, a groove G1 is formed between the insulating colloid 152 and the chip 120, and another groove G2 is formed between the insulating colloid 152 and the structural reinforcement 160. Accordingly, the overflowing liquid metal layer 170 can be contained in the grooves G1 and G2, effectively reducing the possibility of it continuing to overflow and causing short circuits in other components in the electronic system.

[0017] The following will be Figure 1 The electronic component 100 is taken as an example to illustrate a method for manufacturing an electronic component according to an embodiment of the present invention.

[0018] FIG. 3A to FIG. 3F FIG. 1 is a flow chart of a method for manufacturing an electronic component according to an embodiment of the present invention. First, Figure 3A As shown, a substrate 110 is provided, on which a chip 120, a capacitor element 140 and a structural reinforcement 160 are disposed. The chip 120, the capacitor element 140 and the structural reinforcement 160 are bonded to the substrate 110 by, for example, surface mounting technology (SMT). FIG. 3B to FIG. 3E As shown, a sealing structure 150 is provided on the substrate 110 to surround the chip 120 .

[0019] In detail, the steps of providing the sealing structure 150 are as follows. First, Figure 3B As shown, the insulating colloid 152 is sprayed on the substrate 110 so that the insulating colloid 152 is located at the capacitor element 140 between the chip 120 and the structural reinforcement 160, so that the capacitor element 140 is covered by the insulating colloid 152. Figure 3C As shown, the shape of the insulating glue 152 is defined by the jig 50 and the insulating glue 152 is cured. The material of the jig 50 can be glass, and the method of curing the insulating glue 152 is, for example, light curing, heat curing or other curing methods. So far, a groove G1 has been formed between the insulating glue 152 and the chip 120, and a groove G2 has been formed between the insulating glue 152 and the structural reinforcement 160. Figure 3D Remove the jig 50 as shown. Figure 3E As shown, the foam layer 154 is disposed on the insulating colloid 152, and the insulating film 156 is disposed on the foam layer 154. Specifically, for example, the foam layer 154, the insulating film 156 and the adhesive layer 180 that are pre-combined are disposed on the insulating colloid 152 and the structural reinforcement 160 in the same process.

[0020] Then, if Figure 3F The liquid metal layer 170 is disposed on the chip 120. Next, the cover 130 (shown in FIG. Figure 1 ) on the chip 120, so that the structural reinforcement member 160 is supported between the substrate 110 and the cover member 130, and the sealing structure 150 seals the gap between the cover member 130 and the substrate 110, thereby completing Figure 1 The electronic assembly 100 is shown.

[0021] As described above, the jig 50 is used to shape the uncured insulating colloid 152 , so that the shape and size of the insulating colloid 152 can be accurately defined, so that the insulating colloid 152 can surely cover the capacitor element 140 , and the insulating colloid 152 can surely match the foam layer 154 and the insulating film 156 to seal the gap between the cover 130 and the substrate 110 .

[0022] In summary, the sealing structure of the present invention includes an insulating colloid for coating the capacitor component, which can effectively prevent the overflowing liquid metal from causing a short circuit in the capacitor component. In addition, the present invention uses an insulating colloid to coat the capacitor component, replacing the complex sealing structure of the insulating film and plastic cover used to protect the capacitor component in the traditional sealing structure, thereby simplifying the setting process of the sealing structure. In addition, the insulating colloid can be a removable colloid, making the sealing structure easy to rework.

[0023] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic component, characterized in that: include: substrate; A chip is configured on the substrate; A cover, disposed on the chip; A capacitor component is disposed on the substrate; as well as The sealing structure surrounds the chip and seals the gap between the cover and the substrate, wherein the sealing structure comprises an insulating colloid, and the insulating colloid covers the capacitor component.

2. The electronic component according to claim 1, characterized in that The sealing structure further comprises a foam layer, and the foam layer is arranged between the insulating colloid and the covering element.

3. The electronic component according to claim 2, characterized in that The sealing structure further includes an insulating film, and the insulating film is disposed between the foam layer and the covering member.

4. The electronic component according to claim 1, characterized in that A groove is formed between the insulating colloid and the chip.

5. The electronic component according to claim 1, characterized in that It also includes a structural reinforcement member, wherein the structural reinforcement member is supported between the substrate and the cover member, and the insulating colloid is located between the chip and the structural reinforcement member.

6. The electronic component according to claim 5, characterized in that A groove is formed between the insulating colloid and the structural reinforcement.

7. The electronic component according to claim 1, characterized in that: It also includes a liquid metal layer, wherein the liquid metal layer is configured between the chip and the cover.

8. The electronic component according to claim 1, characterized in that The insulating colloid is a light-curing colloid or a heat-curing colloid.

9. The electronic component according to claim 1, characterized in that: The cover is a heat sink.

10. The electronic component according to claim 1, characterized in that The insulating colloid is a removable colloid.

11. A method for manufacturing an electronic component, characterized in that: include: Providing a substrate, on which a chip and a capacitor component are arranged; providing a sealing structure on the substrate to surround the chip; as well as A cover is disposed on the chip, and the sealing structure seals the gap between the cover and the substrate. The sealing structure includes an insulating colloid, and the steps of providing the sealing structure include: Covering the capacitor component with the insulating colloid; as well as The shape of the insulating colloid is defined by a jig and the insulating colloid is solidified.

12. The method for manufacturing an electronic component according to claim 11, characterized in that: The sealing structure further includes a foam layer, and the step of providing the sealing structure further includes: The foam layer is arranged on the insulating colloid.

13. The method for manufacturing an electronic component according to claim 12, characterized in that: The sealing structure further includes an insulating film, and the step of providing the sealing structure further includes: The insulating film is disposed on the foam layer.

14. The method for manufacturing an electronic component according to claim 11, characterized in that: Also includes: A groove is formed between the insulating colloid and the chip.

15. The method for manufacturing an electronic component according to claim 11, characterized in that: The substrate is provided with a structural reinforcement member, and the manufacturing method further comprises: The structural reinforcement member is supported between the substrate and the cover member, and the insulating colloid is located between the chip and the structural reinforcement member.

16. The method for manufacturing an electronic component according to claim 15, characterized in that: Also includes: A groove is formed between the insulating colloid and the structural reinforcement member.

17. The method for manufacturing an electronic component according to claim 11, characterized in that: Also includes: Before disposing the cover on the chip, a liquid metal layer is disposed on the chip.

18. The method for manufacturing an electronic component according to claim 11, characterized in that: The step of curing the insulating colloid comprises: The insulating colloid is light cured or heat cured.

19. The method for manufacturing an electronic component according to claim 11, characterized in that: The cover is a heat sink.

20. The method for manufacturing an electronic component according to claim 11, characterized in that: The insulating colloid is a removable colloid.

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