Cabinet door type liquid cooling distribution unit and computing equipment
By integrating the liquid-cooled distribution unit and the liquid-cooled manifold on the cabinet door, the existing liquid-cooled distribution unit has solved the problem of large space and complex on-site deployment, and the effect of high-density deployment and simplifying the deployment process is achieved.
Patent Information
- Application Number
- CN202311030173.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-15
- Publication Date
- 2025-02-21
AI Technical Summary
The existing liquid-cooled distribution units occupy a large space in the data center and are complex on-site deployment, which affects deployment density and efficiency.
A cabinet door-type liquid-cooled distribution unit is designed. By integrating the liquid-cooled distribution unit and the liquid-cooled manifold on the cabinet door, a cabinet door-type liquid-cooled distribution unit is formed, which simplifies on-site deployment and reduces the use of cabinet space.
It realizes the simplification of on-site deployment of liquid cooling systems on the basis of maintaining the deployment density of cabinets, reducing assembly time and cost, and improving operational convenience.
Smart Images

Figure CN119497335A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of servers, and in particular to a cabinet door type liquid cooling distribution unit and computing equipment. Background Art
[0002] In order to improve the energy efficiency of data centers, liquid cooling technology is widely used. A typical liquid cooling system mainly includes liquid cooling servers, liquid cooling manifold systems, liquid cooling secondary side pipelines and CDU (Coolant Distribution Unit). Among them, the main function of CDU is to provide liquid circulation power and heat exchange, exchanging heat between the hot working fluid in the liquid cooling system and the relatively low temperature water outside.
[0003] There are two typical forms of CDU. One is a centralized CDU that is an independent cabinet in the computer room. Usually, one centralized CDU can connect multiple cabinets. The server nodes and Manifold are both set up in the cabinet. The secondary side pipelines set up for the Manifold include two branches: the supply and return. In this configuration, the centralized CDU needs to occupy the computer room space, and the secondary side pipelines that need to be deployed in the computer room are relatively complex. The other is a distributed CDU arranged in each cabinet, which occupies the height space inside the cabinet, resulting in a decrease in the number of server nodes deployed in the cabinet. Summary of the invention
[0004] The embodiments of the present application provide a cabinet door type liquid cooling distribution unit and computing equipment, which can effectively simplify the on-site deployment of the liquid cooling system while maintaining the deployment density of the cabinet.
[0005] The first aspect of the embodiment of the present application provides a computing device, including a cabinet, multiple computing nodes and a cabinet door, wherein the multiple computing nodes are arranged in the cabinet, and the computing node includes a liquid cooling medium inlet and a liquid cooling medium outlet, wherein the liquid cooling medium inlet is used to input the liquid cooling medium, and the liquid cooling medium outlet is used to output the liquid cooling medium that has completed the heat exchange, so as to take away the heat generated by the operation in the node; the cabinet door is arranged on the cabinet, and the cabinet door includes a door body, a liquid cooling distribution unit and a liquid cooling manifold, wherein the door body has an installation cavity, the liquid cooling distribution unit is arranged in the installation cavity of the door body, the liquid cooling manifold is arranged on the door body, and the liquid cooling manifold is located on the opposite side of the door body to the multiple computing nodes; the liquid cooling manifold includes a shunt manifold and a converging manifold, and the liquid cooling distribution unit is respectively connected to the liquid cooling medium inlet of each computing node through the shunt manifold, and the liquid cooling distribution unit is respectively connected to the liquid cooling medium outlet of each computing node through the converging manifold. In this way, based on the integrated arrangement of the liquid cooling distribution unit and the liquid cooling manifold on the door body, a cabinet door type liquid cooling distribution unit is formed. The layout of the liquid cooling distribution unit does not occupy the effective layout space in the cabinet, can support the configuration of the maximum number of computing nodes, and can ensure the cabinet deployment density under a certain height size; in addition, the cabinet door-type liquid cooling distribution unit based on the integrated setting can effectively simplify the on-site deployment of the liquid cooling system, and there is no need to assemble the secondary side pipeline between the liquid cooling manifold and the liquid cooling distribution unit on-site, which can save on-site assembly time and has good operability.
[0006] In addition, compared with the implementation method of independently setting up a liquid cooling manifold, the integrated connection between the liquid cooling distribution unit and the liquid cooling manifold has lower implementation costs.
[0007] Exemplarily, the computing device may be a server cabinet. In addition, the cabinet door may be a rear door located at the back of the cabinet.
[0008] In practical applications, the heat generating devices in the computing node can exchange heat with the cold plate of the liquid cooling system, that is, dissipate heat by indirect contact liquid cooling.
[0009] In other practical applications, the heat generating devices in the computing node may also be immersed in the liquid cooling medium, that is, direct immersion liquid cooling is used for heat dissipation.
[0010] Based on the first aspect, the embodiment of the present application further provides a first implementation of the first aspect: a fixed connector is provided on the cabinet body, and the cabinet door is provided on the cabinet door through the fixed connector. Alternatively, the cabinet body and the cabinet door can be fixedly connected as one. With such an arrangement, after each computing node is inserted into place, the corresponding connector can be connected and connected.
[0011] In practical applications, the door body can be connected to the cabinet body through a hinge, and the fixed connection piece is constructed based on the hinge. In this way, the cabinet door opening and closing operation can be convenient, which is conducive to maintenance and repair operations.
[0012] In other practical applications, the door body and the cabinet body can be detachably connected. For example, the door body and the cabinet body can be detachably connected by a threaded fastener, and the fixed connection piece of the cabinet body can be arranged based on the threaded fastener; or, the door body and the cabinet body can be detachably connected by an adaptable buckle locking structure, and the fixed connection piece of the cabinet body can be arranged based on the buckle locking structure.
[0013] Based on the first implementation of the first aspect, the embodiment of the present application also provides a second implementation of the first aspect: a first connector is respectively provided on the liquid cooling medium inlet and the liquid cooling medium outlet of each computing node, and a plurality of second connectors adapted to the corresponding first connectors are respectively provided on the shunt manifold and the converging manifold, wherein the first connector and the second connector are adapted to each other as quick-plug connectors; that is, one is a male connector and the other is a female connector. In this way, when the computing node is inserted into place along the cabinet slide, the first connector on the computing node automatically docks with the corresponding second connector on the cabinet door, which has good operational convenience.
[0014] Based on the first implementation of the first aspect, the embodiment of the present application also provides a third implementation of the first aspect: a first joint is respectively provided on the liquid cooling medium inlet and the liquid cooling medium outlet of each computing node, the first joint is connected to the computing node through a flexible connecting pipe, and a plurality of second joints adapted to the corresponding first joints are respectively provided on the shunt manifold and the converging manifold. With such a configuration, during assembly or operation and maintenance operations, the first joint and the second joint can be manually connected.
[0015] Based on the first aspect, the embodiment of the present application also provides a fourth implementation of the first aspect: a first joint is respectively provided on the liquid cooling medium inlet and the liquid cooling medium outlet of each computing node, a plurality of second joints adapted to the corresponding first joints are respectively provided on the shunt manifold and the converging manifold, and the second joints are respectively connected to the shunt manifold and the converging manifold through flexible connecting pipes. Similarly, based on the setting of the flexible connecting pipe, the first joint and the second joint can be manually connected during assembly or operation and maintenance.
[0016] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, the embodiment of the present application further provides a fifth embodiment of the first aspect: the diverter manifold and the converging manifold are embedded and fixed on the door body, and the front ends of the diverter manifold and the converging manifold do not protrude from the front side surface of the door body; in this way, the diverter manifold and the converging manifold do not protrude from the outer contour of the door body. It is convenient for transfer transportation and on-site management.
[0017] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, the embodiment of the present application also provides a sixth embodiment of the first aspect: the liquid cooling distribution unit includes a heat exchanger, a liquid storage tank and a pump, the confluence manifold is connected to the high-temperature liquid cooling working medium interface of the heat exchanger through a working medium return pipeline, the low-temperature liquid cooling working medium interface of the heat exchanger is connected to the liquid storage tank, and the pump is arranged on the working medium delivery pipeline connected between the liquid storage tank and the branch manifold; the heat generating device in the computing node is in contact with the cold plate for heat exchange, and the cold plate is respectively connected to the liquid cooling working medium inlet and the liquid cooling working medium outlet of the computing node; or, the heat generating device in the computing node can be immersed in the liquid cooling working medium in the chassis, and the chassis is provided with a liquid cooling working medium inlet and a liquid cooling working medium outlet. In this way, the high-temperature liquid cooling medium exchanges heat with the external cold source in the heat exchanger. After the heat exchange is completed, the low-temperature liquid cooling medium enters the liquid storage tank and can be sent to the branch manifold through the medium delivery pipeline under the action of the pump. The low-temperature liquid cooling medium is transported to each server node through the branch manifold and enters the next working cycle. It can be used to realize single-phase liquid cooling scenarios.
[0018] In practical applications, the heat exchanger may be a liquid-to-liquid heat exchanger, or an air-to-liquid heat exchanger.
[0019] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, the embodiment of the present application also provides a seventh embodiment of the first aspect: the liquid cooling distribution unit includes a condenser, a liquid storage tank and a pump, the confluence manifold is connected to the inlet of the condenser through a working fluid reflux pipeline, the outlet of the condenser is connected to the liquid storage tank, and the pump is arranged on the working fluid delivery pipeline connected between the liquid storage tank and the branch manifold; the heat generating device in the computing node is in contact with the cold plate for heat exchange, and the cold plate is respectively connected to the liquid cooling working fluid inlet and the liquid cooling working fluid outlet of the computing node; or, the heat generating device in the computing node can be immersed in the liquid cooling working fluid in the chassis, and the chassis is provided with a liquid cooling working fluid inlet and a liquid cooling working fluid outlet. In this way, after the two-phase working medium is heated and vaporized on the node side, the vapor working medium is transported to the sealed inner cavity of the door body through the converging manifold, and is cooled and liquefied on the surface of the condensing coil of the condenser. The liquid working medium can be stored in the liquid storage tank and circulated into the diverting manifold under the action of the pump. The low-temperature liquid cooling working medium is transported to each server node through the diverting manifold and enters the next working cycle. It can be used to realize two-phase liquid cooling scenarios.
[0020] The second aspect of the embodiment of the present application provides a cabinet door type liquid cooling distribution unit, which is used to be connected to the rear side of the cabinet of the computing device. The cabinet door type liquid cooling distribution unit includes a door body, a liquid cooling distribution unit and a liquid cooling manifold. The liquid cooling distribution unit is arranged on the door body, and the liquid cooling manifold is arranged on the door body, and the liquid cooling manifold is located on the front side of the door body; the liquid cooling manifold includes a shunt manifold and a confluence manifold. The liquid cooling distribution unit can be connected to the liquid cooling medium inlet of each computing node of the computing device through the shunt manifold, and the liquid cooling distribution unit can be connected to the liquid cooling medium outlet of each computing node of the cloud computing device through the confluence manifold. In this way, the cabinet door type liquid cooling distribution unit can be arranged on the rear side of the cabinet, and the arrangement position of the liquid cooling distribution unit does not occupy the effective layout space in the cabinet, and can simplify the on-site deployment of the liquid cooling system.
[0021] Based on the second aspect, the embodiment of the present application also provides a first implementation of the second aspect: the diverter manifold and the converging manifold are embedded and fixed on the door body, and the front ends of the diverter manifold and the converging manifold do not protrude from the front surface of the door body. In this way, the diverter manifold and the converging manifold do not protrude from the outer contour of the door. It is convenient for transfer transportation and on-site management.
[0022] Based on the second aspect, or the first implementation of the second aspect, the embodiment of the present application also provides a second implementation of the second aspect: the liquid cooling distribution unit includes a heat exchanger, a liquid storage tank and a pump, the confluence manifold is connected to the high-temperature liquid cooling working medium interface of the heat exchanger through a working medium return pipeline, the low-temperature liquid cooling working medium interface of the heat exchanger is connected to the liquid storage tank, and the pump is arranged on the working medium delivery pipeline connected between the liquid storage tank and the diversion manifold. In this way, it can be used to realize a single-phase liquid cooling scenario.
[0023] Based on the second aspect, or the first embodiment of the second aspect, the embodiment of the present application also provides a third embodiment of the second aspect: the liquid cooling distribution unit includes a condenser, a liquid storage tank and a pump, the converging manifold is connected to the inlet of the condenser through a working fluid return pipeline, the outlet of the condenser is connected to the liquid storage tank, and the pump is arranged on the working fluid delivery pipeline connected between the liquid storage tank and the diverting manifold. In this way, it can be used to realize a two-phase liquid cooling scenario. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 A schematic diagram of the overall structure of a server cabinet provided in an embodiment of the present application;
[0025] Figure 2 for Figure 1 A schematic diagram of an open state of the cabinet door shown in ;
[0026] Figure 3 A schematic diagram of the principle of a liquid cooling system based on a cabinet door type liquid cooling distribution unit provided in an embodiment of the present application;
[0027] Figure 4 for Figure 3 A top view of the connector adaptation relationship between the server node and the liquid cooling manifold is shown in FIG.
[0028] Figure 5 A schematic diagram of another connection method of the first connector on the server node side provided in an embodiment of the present application;
[0029] Figure 6 A schematic diagram of another connection method of the second joint on the liquid cooling manifold side provided in an embodiment of the present application;
[0030] Figure 7 A schematic diagram of another liquid cooling system principle based on a cabinet door type liquid cooling distribution unit provided in an embodiment of the present application;
[0031] Figure 8 A schematic diagram of the principle of another liquid cooling system based on a cabinet door type liquid cooling distribution unit provided in an embodiment of the present application. DETAILED DESCRIPTION
[0032] The embodiment of the present application provides a cabinet door type liquid cooling distribution unit, which can simplify the on-site deployment of the liquid cooling system without occupying the effective layout space in the cabinet, and provides technical guarantee for supporting the computing node deployment density of the cabinet.
[0033] As computing devices develop towards high power, high integration, and ultra-large scale, the heat flux density of high-performance chips and integrated circuit components is increasing. Traditional air-cooled heat dissipation systems can no longer meet the heat dissipation needs of high-power computing chips. Liquid cooling technology is widely used in high-power density heat dissipation scenarios based on low energy consumption and good heat dissipation capabilities. Taking the server cabinet as an example, in a typical liquid cooling system, the Coolant Distribution Unit (CDU) is responsible for delivering liquid cooling media to the server side to absorb and take away the heat generated by the server operation.
[0034] Among them, the centralized CDU occupies the space of the computer room and is set up independently, and is usually connected to multiple cabinets. More complex secondary side pipelines need to be deployed in the computer room. The distributed CDU occupies the height space inside the cabinet, resulting in a decrease in the number of server nodes deployed in the cabinet, that is, it is impossible to support the configuration of the maximum number of server nodes based on the cabinet size, occupying the effective layout space of the computing equipment and affecting the server configuration density. Here, "effective layout space" refers to the space within the layout plane of the computing equipment used for high-density layout. The typical CDU layout method is to set it above or below the node in the cabinet, which affects the server configuration density.
[0035] Based on this, an embodiment of the present application provides a computing device, including a cabinet, a plurality of computing nodes arranged in the cabinet, and a cabinet door arranged on the cabinet. Each computing node includes a liquid-cooling medium inlet and a liquid-cooling medium outlet, the liquid-cooling medium inlet is used to input the liquid-cooling medium, and the liquid-cooling medium outlet is used to output the liquid-cooling medium that has completed the heat exchange, so as to take away the heat generated by the operation in the node. The cabinet door located on the cabinet includes a door body, a liquid-cooling distribution unit and a liquid-cooling manifold, the door body has an installation cavity, the liquid-cooling distribution unit and the liquid-cooling manifold are arranged in the installation cavity of the door body, and the liquid-cooling manifold is located on the opposite side of the door body and the plurality of computing nodes. The liquid-cooling distribution unit is respectively connected to the liquid-cooling medium inlet and the liquid-cooling medium outlet of each computing node on the cabinet side through the liquid-cooling manifold, and thereby establishes a liquid-cooling circulation path to achieve effective cooling of the computing nodes.
[0036] In this way, the liquid cooling distribution unit and the liquid cooling manifold are integrated on the door body to form a cabinet-type liquid cooling distribution unit. On the one hand, the layout of the liquid cooling distribution unit does not occupy the effective layout space in the cabinet, can support the configuration of the maximum number of computing nodes, and can ensure the cabinet deployment density under a certain height size; on the other hand, based on the integrated cabinet-type liquid cooling distribution unit, it can effectively simplify the on-site deployment of the liquid cooling system, and there is no need to assemble the secondary side pipeline between the liquid cooling manifold and the liquid cooling distribution unit on-site, which can save on-site assembly time and has good operability.
[0037] In addition, compared with the implementation method of independently setting up a liquid cooling manifold, the integrated connection between the liquid cooling distribution unit and the liquid cooling manifold has lower implementation costs.
[0038] In order to better understand the technical solution and technical effect of the present application, without loss of generality, the following will be combined with the accompanying drawings and take the server as the heat dissipation treatment object to describe the specific embodiment in detail. Figure 1 and Figure 2 ,in, Figure 1 The overall structural diagram of a server cabinet 100 provided in an embodiment of the present application is as follows: Figure 2 for Figure 1 The arrow X in the figure indicates the front and rear direction of the server, that is, the insertion direction of each server node 10 on the cabinet 20, and the direction indicated by the mark F is the front side of the server node 10, and the direction indicated by the mark B is the back side of the server node 10.
[0039] The cabinet door 30 of the server cabinet 100 is arranged on the cabinet body 20, and the CDU and the liquid cooling manifold 32 are integrated with the door body 31 to form a cabinet door type liquid cooling distribution unit. As shown in the figure, relative to the server nodes 10 inserted from front to back, the cabinet door 30 is located at the rear side of the cabinet body 20, that is, at the back of each server node 10; the liquid cooling manifold 32 is located at the front side of the door body 31, that is, at the side of the door body 31 facing the server node 10. A fixed connection portion can be set on the rear side of the cabinet body 20 to assemble and fix the cabinet door 30.
[0040] Here, the cabinet door type liquid cooling distribution unit occupies the depth space of the cabinet, that is, the dimension space in the cabinet insertion direction X, and can keep the total depth of the cabinet within the set value; for example, the set value can be 1500mm as specified in the standard. In this way, along the height direction of the cabinet, on the basis of supporting the configuration of the maximum number of server nodes, it does not constitute a substantial impact on the overall layout of the server cabinet in the computer room.
[0041] In a possible implementation, the cabinet door 30 and the cabinet body 20 may be connected by a hinge (not shown in the figure), and the fixed connection portion of the cabinet body 20 is arranged based on the hinge. After assembly, the door body 31 rotates around the hinge connection side to open and close, and the liquid cooling manifold 32 and the liquid cooling distribution unit integrated on the door body 31 will open and close synchronously.
[0042] In other possible implementations, a detachable connection may be used between the cabinet door 30 and the cabinet body 20. For example, but not limited to, the door body 31 and the cabinet body 20 are assembled and fixed by threaded fasteners (not shown in the figure), and the fixed connection part of the cabinet body 20 is set based on the threaded fasteners. When operation and maintenance operations are required, the cabinet door 30 can be detached from the cabinet body 20 by loosening the threaded fasteners. Of course, a detachable connection may be used between the cabinet door 30 and the cabinet body 20 by using an adapter buckle locking structure, and the fixed connection part of the cabinet body 20 is set based on the buckle locking structure. As long as the functional requirements of the door body opening and closing operation relative to the cabinet body are met, the embodiments of the present application are not limited.
[0043] In addition, in other possible implementations, the cabinet door 30 and the cabinet body 20 can also be integrated into one body; for example, but not limited to, the door body 31 and the cabinet body 20 are separately processed and then assembled and fixed into one body, or the door body 31 and the cabinet body 20 are integrally processed and formed.
[0044] like Figure 2 As shown, the liquid cooling manifold 32 includes a shunt manifold 321 for liquid supply and a confluence manifold 322 for liquid return. The CDU 34 provides liquid cooling medium to each server node 10 through the shunt manifold 321, recovers the liquid cooling medium that has absorbed heat through the confluence manifold 322, and then sends the liquid cooling medium after releasing heat back to the server node 10 to achieve continuous cooling of the server node.
[0045] In a possible implementation, the flow-dividing manifold 321 and the flow-collecting manifold 322 may be respectively embedded and fixed on the door body 31 .
[0046] Please also see Figure 3 and Figure 4 ,in Figure 3 A schematic diagram of the principle of a liquid cooling system based on a cabinet door type liquid cooling distribution unit provided in an embodiment of the present application is shown in FIG. Figure 4 for Figure 3 In order to clearly illustrate the opening and closing assembly relationship between the cabinet door 30 integrated with the CDU and the liquid cooling manifold 32 and the cabinet body 20, Figure 3 The cabinet door 30 shown in the figure is in an open state separated from the cabinet body 20. In addition, based on the view projection relationship, Figure 3 The liquid cooling manifold 32 shown in the figure includes a branch manifold 321 and a converging manifold 322 to form liquid cooling passages isolated from each other.
[0047] like Figure 3 and Figure 4 As shown, the liquid cooling manifold 32 and the CDU 34 are arranged in the installation cavity 36 of the door body 31, which has a high degree of integration. In other possible implementations, the liquid cooling manifold 32 can also be arranged in another installation cavity of the door body 31 (not shown in the figure) relative to the CDU 34. Optionally, the liquid cooling manifold 32 can be completely built into the installation cavity 36 as shown in the figure, or it can be partially embedded in the corresponding installation cavity.
[0048] The liquid cooling medium inlet 11 and the liquid cooling medium outlet 12 on the server node 10 side are respectively connected to the branch manifold 321 and the converging manifold 322 on the cabinet door type liquid cooling distribution unit 30 side. In a specific implementation, the liquid cooling medium inlet 11 and the liquid cooling medium outlet 12 are not limited to being set to one each as shown in the figure, and can also be set to two or more in number according to the overall design requirements of the product; for example, the server node 10 includes one liquid cooling medium inlet 11 and two liquid cooling medium outlets 12, and for another example, the server node 10 includes two liquid cooling medium inlets 11 and one liquid cooling medium outlet 12, so as to obtain different liquid cooling heat dissipation capabilities.
[0049] The liquid cooling medium inlet 11 and the liquid cooling medium outlet 12 of the server node 10 are provided with a first joint 13, and the diversion manifold 321 and the converging manifold 322 are provided with a second joint 33 accordingly. The first joint 13 and the second joint 33 can be compatible quick-connect joints, one is a male joint and the other is a female joint. Specifically, the server node 10 can be inserted along the cabinet slide (not shown in the figure). When inserted into place, the first joint 13 on the server node 10 automatically docks with the corresponding second joint 33 on the cabinet door type liquid cooling distribution unit 30. The first joint 13 and the second joint 33 can be implemented by using existing technologies, which will not be repeated here.
[0050] Optionally, in order to make the outer contour of the cabinet door type liquid cooling distribution unit 30 have no protruding structure, Figure 3 As shown, the flow-dividing manifold 321 and the flow-converging manifold 322 are embedded and fixed on the door body 31, and the front ends of the flow-dividing manifold 321 and the flow-converging manifold 322 are substantially flush with the front surface of the door body 31; in other specific implementations, the front ends of the flow-dividing manifold 321 and the flow-converging manifold 322 may also be located on the inner side of the front surface of the door body 31, that is, they do not protrude from the outer contour of the door body 31. In this way, transfer transportation and on-site management can be facilitated.
[0051] In this implementation, the server node 10 exchanges heat with the heat generating device 15 in the server node 10 through the cold plate 14, that is, the server node 10 is an indirect heat exchange liquid cooling node. The "heat generating device" here refers to a device that generates heat during operation and needs to be heat-dissipated to maintain its functional requirements, such as but not limited to, CPU (central processing unit), GPU (graphics processing unit) or memory stick and other devices; the cold plate 14 is connected to the liquid cooling medium inlet 11 and the liquid cooling medium outlet 12 on the side of the server node 10, respectively, so that the liquid cooling medium circulates in the cold plate 14, takes away the heat generated by the operation of the heat generating device, and flows back to the cabinet door 30 through the confluence manifold 322, and specifically exchanges heat through the CDU 34 located in the installation cavity 36 of the door body 31.
[0052] It is understandable that the figure uses one cold plate as an example. In other specific implementations, the server node 10 may include multiple cold plates (not shown in the figure), for example but not limited to, a cold plate that fits the CPU radiator and a cold plate that fits the memory module; in addition, multiple cold plates may be arranged in series or in parallel between the liquid cooling medium inlet 11 and the liquid cooling medium outlet 12 of the server node 10, which is not limited in the embodiment of the present application.
[0053] The CDU 34 integrated in the installation cavity 35 of the door body 31 includes a heat exchanger 341, a liquid storage tank 342 and a pump 343. The confluence manifold 322 is connected to the high-temperature liquid cooling medium interface of the heat exchanger 341 through the medium return pipeline, and the low-temperature liquid cooling medium interface of the heat exchanger 341 is connected to the liquid storage tank 342; in this way, the high-temperature liquid cooling medium exchanges heat with the external cold source in the heat exchanger 341, and the low-temperature liquid cooling medium enters the liquid storage tank 342, and can be sent to the branch manifold 321 through the medium delivery pipeline under the action of the pump 343, and the low-temperature liquid cooling medium is delivered to each server node 10 through the branch manifold 321 to enter the next working cycle.
[0054] The heat exchanger 341 in this embodiment is a liquid-liquid heat exchanger, and the high-temperature liquid cooling medium exchanges heat with an external cold source in the heat exchanger 341, for example, but not limited to, taking away the heat generated by the operation of the equipment through cooling water to reduce the temperature of the liquid cooling medium. In other specific implementations, for a single-phase liquid cooling system, the heat exchanger can also use an air-liquid heat exchanger, rather than being limited to the liquid-liquid heat exchanger shown in the figure. The specific function of the air-liquid heat exchanger can be realized by using existing technologies, which will not be repeated here.
[0055] Optionally, for the first connector 13 on the server node 10 side and the second connector 33 on the liquid cooling manifold 32 side, such an implementation method can also be adopted, one of the two can be fixedly arranged, and the other can be connected by a flexible connecting pipe.
[0056] See also Figure 5 , which is a schematic diagram of another connection method of the first connector 13 on the server node 10 side provided by an embodiment of the present application. As shown in the figure, the first connector 13 is connected to the server node 10 through a flexible connecting pipe 16, and the first connector 13 and the second connector 33 can be manually connected during assembly or operation and maintenance operations.
[0057] It is understandable that, based on the view projection relationship, the figure uses a set of matching first joints 13 and flexible connecting tubes 16 as an example. Specifically, for each server node 10, the matching first joints 13 and flexible connecting tubes 16 are set to at least two groups, wherein the first joints 13 of one group are connected to the liquid cooling medium inlet (not shown in the figure) of the server node 10 through the flexible connecting tube 16, and the first joints 13 of the other group are connected to the liquid cooling medium outlet (not shown in the figure) of the server node 10 through the flexible connecting tube 16.
[0058] See also Figure 6, which is a schematic diagram of another connection method of the second joint 33 on the side of the liquid cooling manifold 32 provided in an embodiment of the present application. As shown in the figure, the second joint 33 is connected to the liquid cooling manifold 32 through a flexible connecting pipe 35. During assembly or operation and maintenance, the second joint 33 can be manually connected to the first joint 13.
[0059] Similarly, based on the view projection relationship, the figure uses a set of matching second connectors 33 and flexible connecting tubes 35 as an example. Specifically, for each server node 10, the matching second connectors 33 and flexible connecting tubes 35 are set to at least two groups, wherein the second connectors 33 of one group are connected to the flow distribution manifold 321 (not shown in the figure) through the flexible connecting tube 35, and the second connectors 33 of the other group are connected to the flow converging manifold 322 (not shown in the figure) through the flexible connecting tube 35.
[0060] In the above implementation, the liquid cooling system uses a single-phase liquid cooling medium. In other specific implementations, the liquid cooling system can also use a two-phase liquid cooling medium, that is, the liquid cooling medium is in a gaseous state when it takes away heat. Figure 7 , which is a schematic diagram of another liquid cooling system based on a cabinet-type liquid cooling distribution unit provided in an embodiment of the present application. Figure 3 The differences and connections between the described embodiments, and the components and structures with the same functions are indicated in the figures with the same symbols.
[0061] like Figure 7 As shown, the liquid cooling system in this embodiment can also use a two-phase liquid cooling medium. Accordingly, the CDU 34a includes a condenser 341a, a liquid storage tank 342 and a pump 343. The confluence manifold is connected to the inlet of the condenser 341a through a working medium return pipeline, and the outlet of the condenser 341a is connected to the liquid storage tank 342. The pump 343 is arranged on the working medium delivery pipeline connected between the liquid storage tank 342 and the diversion manifold. The condenser 341a, the liquid storage tank 342 and the pump 343 are located in the installation cavity 36. After the two-phase working medium in the inner cavity of the cold plate 14 is heated and vaporized, the vapor liquid cooling medium is transported to the side of the door body 31 through the confluence manifold 322, and is cooled and liquefied on the surface of the condensing coil of the condenser 341a. The liquid liquid cooling medium accumulates in the liquid storage tank 342 and is circulated into the diversion manifold 321 under the action of the pump 343.
[0062] Of course, it should be noted that the condenser 341a and the external cold source can be implemented using existing technologies, which will not be described in detail here.
[0063] The foregoing Figure 3 and Figure 7The server node 10 described above is in contact with the heat generating device 15 in the node through the cold plate 14, that is, indirect contact liquid cooling. In other specific implementations, the server node 10 can also adopt direct immersion liquid cooling, see Figure 8 , which is a schematic diagram of the principle of another liquid cooling system based on a cabinet door type liquid cooling distribution unit provided in the embodiment of the present application. Figure 3 The differences and connections between the described embodiments, and the components and structures with the same functions are indicated in the figures with the same symbols.
[0064] like Figure 8 As shown, in this embodiment, the server node 10b is a direct immersion liquid cooling node, and the heat generating device 15 can be immersed in the liquid cooling medium in the chassis 17, or the heat generating device 15 can also be partially immersed in the liquid cooling medium in the chassis 17. In a specific implementation, the chassis 17 of the server node 10b needs to have good sealing properties to accommodate the liquid cooling medium; at the same time, the selection of the liquid cooling medium needs to avoid the long-term compatibility risk of the device.
[0065] In addition, for Figure 8 The liquid cooling system of the described server node 10b may also use a two-phase liquid cooling medium. Accordingly, the CDU needs to be equipped with a condenser, and the door body 31 needs to have good sealing performance.
[0066] The cabinet-type liquid cooling distribution unit described in the above embodiments can be widely used in high-density application scenarios, such as but not limited to supercomputers, HPC (High Performance Computing), intensive computing servers and other different computing device scenarios.
[0067] It should be understood that other functional components of the computing device are not the core invention of the present application, and those skilled in the art can implement them based on the existing technology, so they will not be described in detail herein.
[0068] It should be noted that the ordinal numerals "first" and "second" used in this article are only used to describe the composition or structure with the same function in the technical solution, and the use of the above-mentioned ordinal numerals does not constitute an understanding limitation on the technical solution requested for protection in this application.
[0069] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A computing device, characterized in that It comprises a cabinet, a plurality of computing nodes arranged in the cabinet, and a cabinet door arranged on the cabinet; the computing node comprises a liquid cooling medium inlet and a liquid cooling medium outlet; The cabinet door includes a door body, a liquid cooling distribution unit and a liquid cooling manifold, the door body includes an installation cavity, the liquid cooling distribution unit is arranged in the installation cavity of the door body, the liquid cooling manifold is arranged in the door body, and the liquid cooling manifold is located on the opposite side of the door body to the multiple computing nodes; the liquid cooling manifold includes a shunt manifold and a confluence manifold, the liquid cooling distribution unit is respectively connected to the liquid cooling medium inlet of each of the computing nodes through the shunt manifold, and the liquid cooling distribution unit is respectively connected to the liquid cooling medium outlet of each of the computing nodes through the confluence manifold.
2. The computing device according to claim 1, wherein: The cabinet body is provided with a fixed connection piece, and the cabinet door is arranged on the cabinet door through the fixed connection piece; or the cabinet body and the cabinet door are fixedly connected as a whole.
3. The computing device according to claim 1 or 2, characterized in that The liquid cooling medium inlet and outlet of the computing node are respectively provided with a first joint, and the branch manifold and the converging manifold are respectively provided with a plurality of second joints adapted to the corresponding first joints, and the first joint and the second joint are adapted quick-plug joints.
4. The computing device according to claim 1 or 2, characterized in that: A first joint is respectively provided on the liquid cooling medium inlet and the liquid cooling medium outlet of the computing node, and the first joint is connected to the computing node through a flexible connecting pipe. The branch manifold and the converging manifold are respectively provided with a plurality of second joints adapted to the corresponding first joints.
5. The computing device according to claim 1 or 2, characterized in that: A first joint is respectively provided on the liquid cooling medium inlet and the liquid cooling medium outlet of the computing node, and a plurality of second joints adapted to the corresponding first joints are respectively provided on the diversion manifold and the confluence manifold, and the second joints are respectively connected to the diversion manifold and the confluence manifold through flexible connecting pipes.
6. The computing device according to any one of claims 1 to 5, characterized in that: The flow-dividing manifold and the flow-collecting manifold are embedded and fixed on the door body, and the flow-dividing manifold and the flow-collecting manifold do not protrude from the surface of the door body opposite to the plurality of computing nodes.
7. The computing device according to any one of claims 1 to 6, characterized in that: The liquid cooling distribution unit includes a heat exchanger, a liquid storage tank and a pump. The confluence manifold is in communication with a high-temperature liquid cooling medium interface of the heat exchanger, and the low-temperature liquid cooling medium interface of the heat exchanger is in communication with the liquid storage tank. The heat exchanger is used to cool the high-temperature liquid cooling medium inputted from the confluence manifold into a low-temperature liquid cooling medium. The pump is disposed between the liquid storage tank and the diversion manifold, and is used to input the low-temperature liquid cooling medium into the diversion manifold. A heat generating device and a cold plate are arranged in the chassis of the computing node, the heat generating device in the computing node is in contact with the cold plate for heat exchange, and the cold plate is connected to a liquid cooling medium inlet and a liquid cooling medium outlet of the computing node respectively; or, A heat generating device is arranged in the chassis of the computing node, and the heat generating device in the computing node is immersed in the liquid cooling medium in the chassis. The chassis of the computing node is provided with the liquid cooling medium inlet and the liquid cooling medium outlet.
8. The computing device according to any one of claims 1 to 6, characterized in that: The liquid cooling distribution unit includes a condenser, a liquid storage tank and a pump. The converging manifold is connected to the inlet of the condenser, and the outlet of the condenser is connected to the liquid storage tank. The condenser is used to cool the vapor-state liquid cooling medium input from the converging manifold into a liquid-state liquid cooling medium. The pump is arranged between the liquid storage tank and the diverting manifold, and the pump is used to input the liquid-state liquid cooling medium into the diverting manifold. A heat generating device and a cold plate are arranged in the chassis of the computing node, the heat generating device in the computing node is in contact with the cold plate for heat exchange, and the cold plate is connected to a liquid cooling medium inlet and a liquid cooling medium outlet of the computing node respectively; or, A heat generating device is arranged in the chassis of the computing node, and the heat generating device in the computing node is at least partially immersed in the liquid cooling medium in the chassis, and the chassis is provided with the liquid cooling medium inlet and the liquid cooling medium outlet.
9. A cabinet door type liquid cooling distribution unit, used to be connected to a cabinet of a computing device, characterized in that: The cabinet door type liquid cooling distribution unit includes a door body, a liquid cooling distribution unit and a liquid cooling manifold, the door body includes an installation cavity, the liquid cooling distribution unit is arranged in the installation cavity of the door body, the liquid cooling manifold is arranged in the door body, and the liquid cooling manifold is located on the opposite side of the door body to the multiple computing nodes; the liquid cooling manifold includes a shunt manifold and a confluence manifold, the liquid cooling distribution unit can be connected with the liquid cooling medium inlet of each computing node of the computing device through the shunt manifold, and the liquid cooling distribution unit can be connected with the liquid cooling medium outlet of each computing node of the computing device through the confluence manifold.
10. The cabinet door type liquid cooling distribution unit according to claim 9, characterized in that: The flow-dividing manifold and the flow-collecting manifold are embedded and fixed on the door body, and the flow-dividing manifold and the flow-collecting manifold do not protrude from a surface of the door body opposite to the plurality of computing nodes.
11. The cabinet door type liquid cooling distribution unit according to claim 9 or 10, characterized in that: The liquid-cooling distribution unit includes a heat exchanger, a liquid storage tank and a pump. The confluence manifold is connected to the high-temperature liquid-cooling medium interface of the heat exchanger, and the low-temperature liquid-cooling medium interface of the heat exchanger is connected to the liquid storage tank. The heat exchanger is used to cool the high-temperature liquid-cooling medium input into the confluence manifold into a low-temperature liquid-cooling medium. The pump is arranged between the liquid storage tank and the diversion manifold, and the pump is used to input the low-temperature liquid-cooling medium into the diversion manifold.
12. The cabinet door type liquid cooling distribution unit according to claim 9 or 10, characterized in that: The liquid-cooling distribution unit includes a condenser, a liquid storage tank and a pump. The confluence manifold is connected to the inlet of the condenser, and the outlet of the condenser is connected to the liquid storage tank. The condenser is used to cool the vapor liquid-cooling medium input by the confluence manifold into a liquid liquid-cooling medium. The pump is arranged between the liquid storage tank and the diversion manifold, and the pump is used to input the liquid liquid-cooling medium into the diversion manifold.