Heat dissipation system, heat dissipation control method and device, storage medium and program product
By introducing cooling circuits, bypass pipelines and sensing equipment into the heat dissipation system, and adjusting the working mode according to the outdoor wet bulb temperature and indoor temperature, the problems of insufficient heat dissipation limit and difficulty in automation control in the traditional refrigeration system are solved, and efficient and automated The thermal dissipation management reduces the energy use efficiency of smart computing centers.
Patent Information
- Application Number
- CN202411667735.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-02-21
AI Technical Summary
In the prior art, the upper limit of the cooling system is not enough to meet the needs of intelligent computing centers with high heat dissipation density, and the traditional water-cooling and air-cooling systems have complex structures and low efficiency, making it difficult to achieve automated control and multi-mode autonomous switching.
It provides a cooling system, through cooling circuit, bypass pipeline and sensing equipment, the working mode is adjusted in real time according to the outdoor wet bulb temperature and indoor temperature, extending the utilization time of natural cold sources and reducing PUE.
The working mode of automatically adjusting the heat dissipation system according to outdoor meteorological conditions and indoor load is realized, which improves the heat dissipation efficiency, extends the utilization time of natural cold sources, and reduces the energy use efficiency of the intelligent computing center.
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Figure CN119497351A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation system, a heat dissipation control method and device, a storage medium, and a program product. Background Art
[0002] At present, the intelligent computing center mainly uses water cooling system or air cooling system for cooling. In the water cooling system, a water pump is used to drive the cooling water circulation, and the cooling water carries the heat in the computer room, and releases the heat in the cooling water into the environment through the cooling tower. In the air cooling system, a water pump is used to drive the chilled water circulation, and the chilled water carries the heat in the computer room. The refrigerant absorbs the heat of the chilled water in the chiller, and the refrigerant in the condenser is cooled by the fan to release the heat carried by the refrigerant into the environment. Summary of the invention
[0003] The inventors noticed that the upper limit of the heat dissipation of the refrigeration system in the prior art is 25KW-30KW, which is difficult to adapt to the intelligent computing center with high heat dissipation density. The structure of the traditional water cooling system is complex, and the efficiency of multiple heat exchange levels affects the overall efficiency of the system. The refrigeration capacity of the traditional air cooling system is greatly affected by the local climate, and it is difficult to maximize natural cooling. At the same time, the operation of the traditional refrigeration system is greatly affected by the degree of automation of the BA (Building Automation) system. Due to the complexity of the traditional refrigeration system pipelines and the huge number of operating points that need to be monitored, when facing changes in refrigeration conditions, most BA systems are difficult to fully realize automation, and it is difficult to achieve autonomous switching of multiple modes.
[0004] Accordingly, the present disclosure provides a heat dissipation system which can automatically adjust the working mode of the heat dissipation system according to outdoor meteorological conditions and indoor load changes while meeting the heat dissipation needs, while extending the utilization time of natural cold sources and reducing the PUE (Power Usage Effectiveness) of the intelligent computing center.
[0005] In a first aspect of the present disclosure, a heat dissipation system is provided, comprising: a cooling circuit, comprising an outdoor heat exchange device, an air pump and an indoor heat exchange device connected in sequence by pipelines, wherein the pipelines include a plurality of sub-pipelines, each of which is provided with an air pump inlet valve and an air pump outlet valve; a plurality of bypass pipelines corresponding one to one to the plurality of sub-pipelines, wherein each bypass pipeline is connected to a corresponding sub-pipeline and is used to bypass the air pump inlet valve and the air pump outlet valve on the corresponding sub-pipeline, and each bypass pipeline is provided with a bypass valve; a first sensing device, configured to collect an outdoor wet-bulb temperature; a second sensing device, configured to collect an indoor temperature; a heat dissipation control device, configured to control the working mode of the heat dissipation system according to the outdoor wet-bulb temperature using the air pump inlet valve, the air pump outlet valve and the bypass valve, and to control the number of conducting sub-pipelines in the plurality of sub-pipelines according to the indoor temperature.
[0006] In some embodiments, the heat dissipation system also includes: a balancing pipeline, including a balancing branch and a plurality of connecting branches, the plurality of connecting branches correspond one-to-one to the plurality of sub-pipelines, the balancing branch is connected to the plurality of sub-pipelines through the plurality of connecting branches, each connecting branch is provided with a connecting valve, and the balancing pipeline is provided with a balancing valve corresponding to each of the sub-pipelines.
[0007] In some embodiments, the heat dissipation control device is configured to: when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold, close the air pump inlet valve and the air pump outlet valve on each sub-pipeline, and open the bypass valve on each bypass pipeline, so that the heat dissipation system enters the first operating mode.
[0008] In some embodiments, the heat dissipation control device is configured to close the connecting valve and the balancing valve on the balancing pipeline when the outdoor wet-bulb temperature is less than a wet-bulb temperature threshold.
[0009] In some embodiments, the heat dissipation control device is configured to: in the first working mode, control the rotation speed of the first fan in the indoor heat exchange device according to the indoor temperature.
[0010] In some embodiments, the heat dissipation control device is configured to: when the rotation speed of the first fan reaches a minimum value, select a sub-pipeline from the sub-pipelines currently in an on state as the first target pipeline, and close the bypass valve on the bypass pipeline corresponding to the first target pipeline so that the first target pipeline is in a closed state.
[0011] In some embodiments, the heat dissipation control device is configured to: when the speed of the first fan reaches a maximum value, select a sub-pipeline from the sub-pipelines that are currently in a closed state as the second target pipeline, and open the bypass valve on the bypass pipeline corresponding to the second target pipeline so that the second target pipeline is in a conducting state.
[0012] In some embodiments, the heat dissipation control device is configured to: when the rotation speed of the first fan reaches a maximum value and the number of sub-pipelines currently in a conductive state is a maximum value, open the air pump inlet valve and the air pump outlet valve of each sub-pipeline, and close the bypass valve on each bypass line, so that the heat dissipation system enters a second operating mode.
[0013] In some embodiments, the heat dissipation control device is configured to open the connecting valve and the balancing valve on the balancing pipeline when the rotation speed of the first fan reaches a maximum value and the number of sub-pipelines currently in a conducting state is a maximum value.
[0014] In some embodiments, the heat dissipation control device is configured to: when the outdoor wet-bulb temperature is greater than or equal to a wet-bulb temperature threshold, open the air pump inlet valve and the air pump outlet valve on each sub-pipeline, and close the bypass valve on each bypass pipeline, so that the heat dissipation system enters the second operating mode.
[0015] In some embodiments, the heat dissipation control device is configured to open the connecting valve and the balancing valve on the balancing pipeline when the outdoor wet-bulb temperature is greater than or equal to a wet-bulb temperature threshold.
[0016] In some embodiments, the heat dissipation control device is configured to: in the second working mode, control the rotation speed of the first fan in the indoor heat exchange device according to the indoor temperature.
[0017] In some embodiments, the heat dissipation control device is configured to: when the rotation speed of the first fan reaches a minimum value, select a sub-pipeline from the sub-pipelines currently in an on state as a third target pipeline, and close the air pump inlet valve and the air pump outlet valve on the third target pipeline so that the third target pipeline is in a closed state.
[0018] In some embodiments, the heat dissipation control device is configured to: close the connecting valve and the balancing valve corresponding to the third target pipeline.
[0019] In some embodiments, the heat dissipation control device is configured to: when the rotation speed of the first fan reaches a maximum value, select a sub-pipeline from the sub-pipelines that are currently in a closed state as a fourth target pipeline, and open the air pump inlet valve and the air pump outlet valve on the fourth target pipeline so that the fourth target pipeline is in a conducting state.
[0020] In some embodiments, the heat dissipation control device is configured to: open the connecting valve and the balancing valve corresponding to the fourth target pipeline.
[0021] In some embodiments, the heat dissipation control device is configured to: when the rotation speed of the first fan reaches a minimum value and the number of sub-pipelines currently in a conductive state is a minimum value, close the air pump inlet valve and the air pump outlet valve of each sub-pipeline, and open the bypass valve on each bypass pipeline, so that the heat dissipation system enters the first working mode.
[0022] In some embodiments, the heat dissipation control device is configured to close the connecting valve and the balancing valve on the balancing pipeline when the rotation speed of the first fan reaches a minimum value and the number of sub-pipelines currently in a conducting state is a minimum value.
[0023] In some embodiments, the indoor temperature includes at least one of an indoor supply air temperature and an indoor outlet air temperature.
[0024] In some embodiments, the heat dissipation system further includes: a third sensing device configured to collect outdoor condensation parameters, wherein the heat dissipation control device is configured to: control the rotation speed of the second fan in the outdoor heat exchange device according to the outdoor condensation parameters.
[0025] In some embodiments, the heat dissipation control device is configured to turn on a spray system in the outdoor heat exchange device when the rotation speed of the second fan reaches a maximum value.
[0026] In a second aspect of the present disclosure, a heat dissipation control method is provided, which is applied to a heat dissipation control device in a heat dissipation system described in any of the above embodiments, comprising: receiving an outdoor wet-bulb temperature collected by a first sensor device; receiving an indoor temperature collected by a second sensor device; according to the outdoor wet-bulb temperature, using an air pump inlet valve, an air pump outlet valve and a bypass valve in the heat dissipation system to control a working mode of the heat dissipation system; and according to the indoor temperature, controlling the number of conducting sub-pipelines among a plurality of sub-pipelines in the heat dissipation system.
[0027] In a third aspect of the present disclosure, a heat dissipation control device is provided, comprising: a memory; a processor, coupled to the memory, the processor being configured to execute the heat dissipation control method as described in any of the above embodiments based on instructions stored in the memory.
[0028] In a fourth aspect of the present disclosure, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and when the instructions are executed by a processor, the method described in any of the above embodiments is implemented.
[0029] In a fifth aspect of the present disclosure, a computer program product is provided, comprising computer instructions, wherein when the computer instructions are executed by a processor, the method described in any of the above embodiments is implemented.
[0030] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0032] Figure 1 A schematic diagram of the structure of a heat dissipation system according to an embodiment of the present disclosure;
[0033] Figure 2 It is a structural schematic diagram of a heat dissipation system according to another embodiment of the present disclosure;
[0034] Figure 3 A schematic flow chart of a heat dissipation control method according to an embodiment of the present disclosure;
[0035] Figure 4 The figure is a schematic diagram of the structure of a heat dissipation control device according to an embodiment of the present disclosure. DETAILED DESCRIPTION
[0036] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present disclosure and its application or use. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0037] Unless specifically stated otherwise, the relative arrangement of components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure.
[0038] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.
[0039] Technologies, methods, and apparatus known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, such technologies, methods, and apparatus should be considered part of the authorization specification.
[0040] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.
[0041] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0042] Figure 1 The figure is a schematic diagram of the structure of a heat dissipation system according to an embodiment of the present disclosure.
[0043] like Figure 1 As shown, the heat dissipation system includes a cooling circuit, which includes an outdoor heat exchange device 2, an air pump 3 and an indoor heat exchange device 4 connected in sequence through a pipeline 1. The pipeline 1 includes a plurality of sub-pipelines, and an air pump inlet valve 5 and an air pump outlet valve 6 are provided on each sub-pipeline.
[0044] In some embodiments, the air pump 3 comprises a magnetically levitated air pump.
[0045] In addition, the heat dissipation system also includes a bypass branch 7, which includes a plurality of bypass pipes corresponding one to one to the plurality of sub-pipelines, wherein each bypass pipe is connected to the corresponding sub-pipeline and is used to bypass the air pump inlet valve 5 and the air pump outlet valve 6 on the corresponding sub-pipeline, and a bypass valve 8 is provided on each bypass pipe.
[0046] In addition, the heat dissipation system further includes a first sensor device 9, a second sensor device 10 and a heat dissipation control device 11. The first sensor device 9 is configured to collect outdoor wet-bulb temperature, and the second sensor device 10 is configured to collect indoor temperature. For example, the first sensor device 9 is arranged at the outdoor heat exchange device 2, and the second sensor device 10 is arranged in the machine room.
[0047] It should be noted here that the wet-bulb temperature is the lowest temperature that the current environment can reach simply by evaporating water.
[0048] In some embodiments, the indoor temperature includes at least one of an indoor supply air temperature and an indoor outlet air temperature.
[0049] In some embodiments, the second sensing device 10 includes a cold channel temperature sensor 10a and a hot channel temperature sensor 10b. The cold channel temperature sensor 10a is used to detect the indoor supply air temperature, and the hot channel temperature sensor 10b is used to detect the indoor outlet air temperature.
[0050] The heat dissipation control device 11 is configured to control the working mode of the heat dissipation system according to the outdoor wet-bulb temperature using the air pump inlet valve 5, the air pump outlet valve 6 and the bypass valve 8, and to control the number of conducting sub-pipelines in the multiple sub-pipelines according to the indoor temperature.
[0051] It should be noted here that Figure 1 As shown, the outdoor heat exchange device 2, the air pump 3, the air pump inlet valve 5, the air pump outlet valve 6, the bypass branch 7 and the bypass valve are located in the outdoor evaporative cooling unit 100, and the indoor heat exchange device 4, the cold channel temperature sensor 10a and the hot channel temperature sensor 10b are located in the computer room 200 of the intelligent computing center.
[0052] Figure 2 It is a schematic structural diagram of a heat dissipation system according to another embodiment of the present disclosure.
[0053] like Figure 2 As shown, the evaporation section of the pipeline 1 is located in the indoor heat exchange device 4. For example, the evaporation section of each sub-pipeline in the pipeline 1 is U-shaped. A balancing pipeline 12 is arranged on one side of the evaporation section of the pipeline 1. The balancing pipeline 12 includes a balancing branch 13 and a plurality of connecting branches 14, wherein the plurality of connecting branches 15 correspond to the plurality of sub-pipelines one by one, and the balancing branch 13 is connected to the plurality of sub-pipelines through the plurality of connecting branches 14, and each connecting branch 14 is provided with a connecting valve 15, and the balancing pipeline 13 is provided with a balancing valve 16 corresponding to each sub-pipeline.
[0054] In some embodiments, the heat dissipation control device 11 is configured to: when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold, close the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline, and open the bypass valve 8 on each bypass pipeline, so that the heat dissipation system enters the first working mode.
[0055] In some embodiments, the heat dissipation control device 11 is configured to close the connecting valve 15 and the balancing valve 16 on the balancing pipeline when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold.
[0056] That is to say, in the first working mode, since the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline are closed, and the bypass valve 8 on each bypass line 7 is opened, the refrigerant in the sub-pipeline only passes through the bypass line 7 and does not pass through the air pump 3.
[0057] For example, in the first working mode, the switch states of the air pump 3 and each valve are as shown in Table 1.
[0058]
[0059]
[0060] Table 1
[0061] In some embodiments, Figure 1 As shown, the heat dissipation system further includes a third sensor device 17. The third sensor device 17 is configured to collect outdoor condensation parameters.
[0062] For example, the outdoor condensing parameter includes at least one of an outdoor condensing temperature and an outdoor condensing pressure.
[0063] In some embodiments, the third sensing device 17 is disposed at the outdoor heat exchange device 2 .
[0064] In some embodiments, the heat dissipation control device 11 is configured to: in the first working mode, control the rotation speed of the fan 21 in the outdoor heat exchange device 2 according to the outdoor condensation parameters.
[0065] That is to say, without using the air pump 3, the heat dissipation of the machine room is achieved by only using the natural environment.
[0066] In some embodiments, the heat dissipation control device 11 is configured to: in the first working mode, when the rotation speed of the fan 21 reaches the maximum value, turn on the spray system 23 in the outdoor heat exchange device.
[0067] For example, when the rotation speed of the fan 21 reaches the maximum value, the spray pump 22 is started to open the spray system 23 in the outdoor heat exchange device, thereby accelerating the heat exchange.
[0068] In some embodiments, the heat dissipation control device 11 is configured to: in the first working mode, control the rotation speed of the fan 41 in the indoor heat exchange device 4 according to the indoor temperature.
[0069] For example, the indoor temperature includes at least one of an indoor supply air temperature and an indoor outlet air temperature.
[0070] It should be noted here that the temperature in the machine room is kept stable by controlling the rotation speed of the fan 41 in the indoor heat exchange device 4 according to the indoor temperature.
[0071] In some embodiments, the heat dissipation control device 11 is configured as follows: in a first working mode, when the rotation speed of the fan 41 reaches a minimum value, a sub-pipeline is selected from the sub-pipelines currently in an on state as a first target pipeline, and the bypass valve on the bypass pipeline corresponding to the first target pipeline is closed so that the first target pipeline is in a closed state.
[0072] It should be noted that if the speed of the fan 41 reaches the minimum value, it indicates that the current outdoor ambient temperature is low, and the heat dissipation of the machine room can still be achieved when one sub-pipeline is reduced. In this case, one sub-pipeline is closed so that the refrigerant in the sub-pipeline stops circulating.
[0073] In some embodiments, the heat dissipation control device 11 is configured as follows: in the first working mode, when the rotation speed of the fan 41 reaches the maximum value, a sub-pipeline is selected from the sub-pipelines that are currently in a closed state as the second target pipeline, and the bypass valve on the bypass pipeline corresponding to the second target pipeline is opened so that the second target pipeline is in a conducting state.
[0074] It should be noted that if the speed of the fan 41 reaches the maximum value, it indicates that the current indoor load is large and a sub-pipeline needs to be added to ensure the heat dissipation of the machine room. In this case, a sub-pipeline is opened so that the refrigerant in the sub-pipeline circulates.
[0075] In some embodiments, the heat dissipation control device 11 is configured as follows: in the first working mode, when the rotation speed of the fan 41 reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, the air pump inlet valve 5 and the air pump outlet valve 6 of each sub-pipeline are opened, and the bypass valve 8 on each bypass pipeline is closed, so that the heat dissipation system enters the second working mode.
[0076] It should be noted here that if the speed of the fan 41 reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, it indicates that the current indoor load is large and the indoor heat dissipation cannot be effectively achieved by relying solely on the external environment. In this case, the air pump 3 needs to be started to achieve indoor heat dissipation.
[0077] In some embodiments, the heat dissipation control device 11 is configured to: in the first working mode, when the speed of the fan 41 reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, open the connecting valve 15 and the balancing valve 16 on the balancing pipeline.
[0078] That is to say, in the second working mode, the communication valve 15 and the balancing valve 16 on the balancing pipeline are also in an open state.
[0079] For example, in the second working mode, the switch status of the air pump 3 and each valve is as shown in Table 2.
[0080]
[0081]
[0082] Table 2
[0083] In some embodiments, the heat dissipation control device 11 is configured to: when the outdoor wet-bulb temperature is greater than or equal to the wet-bulb temperature threshold, open the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline, and close the bypass valve 8 on each bypass pipeline, so that the heat dissipation system enters the second working mode.
[0084] In some embodiments, the heat dissipation control device 11 is configured to open the connecting valve 15 and the balancing valve 16 on the balancing pipeline when the outdoor wet-bulb temperature is greater than or equal to a wet-bulb temperature threshold.
[0085] That is to say, when the indoor heat dissipation cannot be achieved by relying solely on the external environment, it is necessary to close the bypass branch and start the air pump 3 to achieve indoor heat dissipation.
[0086] In some embodiments, the heat dissipation control device 11 is configured to: in the second working mode, control the rotation speed of the fan 21 in the outdoor heat exchange device 2 according to the outdoor condensation parameters.
[0087] In some embodiments, the heat dissipation control device 11 is configured to turn on the spray system 23 in the outdoor heat exchange device when the rotation speed of the fan 21 reaches a maximum value.
[0088] For example, when the rotation speed of the fan 21 reaches the maximum value, the spray pump 22 is started to open the spray system 23 in the outdoor heat exchange device, thereby accelerating the heat exchange.
[0089] In some embodiments, the heat dissipation control device 11 is configured to: in the second working mode, control the rotation speed of the fan 41 in the indoor heat exchange device 4 according to the indoor temperature, so as to ensure the temperature stability in the machine room.
[0090] In some embodiments, the heat dissipation control device 11 is configured as follows: in the second working mode, when the rotation speed of the fan 41 reaches the minimum value, a sub-pipeline is selected from the sub-pipelines currently in the on state as the third target pipeline, and the air pump inlet valve and the air pump outlet valve on the third target pipeline are closed so that the third target pipeline is in a closed state.
[0091] It should be noted that if the speed of the fan 41 reaches the minimum value, it indicates that the cooling capacity provided by the current cooling system is sufficient, and the cooling of the machine room can still be achieved when one sub-pipeline is reduced. In this case, one sub-pipeline is closed so that the refrigerant in the sub-pipeline stops circulating.
[0092] In some embodiments, the heat dissipation control device 11 is configured to: close the connecting valve and the balancing valve corresponding to the third target pipeline.
[0093] That is, if the third target pipeline is closed, the communication valve and the balancing valve corresponding to the third target pipeline are closed to prevent the third target pipeline from affecting the refrigerant balance of other sub-pipelines operating normally.
[0094] In some embodiments, the heat dissipation control device 11 is configured as follows: in the second working mode, when the rotation speed of the fan 41 reaches the maximum value, a sub-pipeline is selected from the sub-pipelines that are currently in a closed state as the fourth target pipeline, and the air pump inlet valve and the air pump outlet valve on the fourth target pipeline are opened so that the fourth target pipeline is in a conducting state.
[0095] It should be noted that if the speed of the fan 41 reaches the maximum value, it indicates that the current indoor load is large and a sub-pipeline needs to be added to ensure the heat dissipation of the machine room. In this case, a sub-pipeline is opened so that the refrigerant in the sub-pipeline circulates.
[0096] In some embodiments, the heat dissipation control device 11 is configured to open the communication valve and the balancing valve corresponding to the fourth target pipeline.
[0097] That is, if the fourth target pipeline is opened, the connecting valve and the balancing valve corresponding to the fourth target pipeline are opened, so that the fourth target pipeline balances the refrigerant with other sub-pipelines operating normally, so as to obtain a better heat dissipation effect.
[0098] In some embodiments, the heat dissipation control device 11 is configured to: in the second working mode, when the rotation speed of the fan 41 reaches the minimum value and the number of sub-pipelines currently in the on state is the minimum value, close the air pump inlet valve and the air pump outlet valve of each sub-pipeline, and open the bypass valve on each bypass pipeline, so that the heat dissipation system enters the first working mode.
[0099] It should be noted here that if the rotation speed of the fan 41 reaches the minimum value and the number of sub-pipelines currently in the on state is the minimum value, it indicates that the current outdoor ambient temperature is low and indoor heat dissipation can be achieved without the air pump 3 working. In this case, turn off the air pump 3 so that the cooling system returns to the first working mode.
[0100] In some embodiments, the heat dissipation control device 11 is configured to: in the second working mode, when the speed of the first fan reaches the minimum value and the number of sub-pipelines currently in the on state is the minimum value, close the connecting valve and the balancing valve on the balancing pipeline.
[0101] That is to say, in order to return the heat dissipation system to the first working mode, the balancing branch needs to be closed.
[0102] By implementing the heat dissipation system provided by the above-mentioned embodiment of the present disclosure, the outdoor wet-bulb temperature collected by the first sensor device is received, and the indoor temperature collected by the second sensor device is received. According to the outdoor wet-bulb temperature, the air pump inlet valve, the air pump outlet valve and the bypass valve in the heat dissipation system are used to control the working mode of the heat dissipation system, and according to the indoor temperature, the number of conducting sub-pipelines in the multiple sub-pipelines in the heat dissipation system is controlled. In this way, the working mode of the heat dissipation system can be flexibly adjusted according to the outdoor environment, and the working state of the sub-pipeline can be flexibly adjusted according to the indoor load, so as to effectively utilize the external environment for heat dissipation and effectively reduce the PUE of the intelligent computing center.
[0103] Figure 3 FIG. 1 is a flow chart of a heat dissipation control method according to an embodiment of the present disclosure. In some embodiments, the following heat dissipation control method is applied to Figure 1 and Figure 2 The heat dissipation control device in the heat dissipation system of any embodiment includes steps 31-34.
[0104] In step 31 , the outdoor wet-bulb temperature collected by the first sensing device 9 is received.
[0105] In step 32 , the indoor temperature collected by the second sensing device 10 is received.
[0106] For example, the indoor temperature includes at least one of an indoor supply air temperature and an indoor outlet air temperature.
[0107] In step 33, according to the outdoor wet-bulb temperature, the air pump inlet valve 5, the air pump outlet valve 6 and the bypass valve 8 in the heat dissipation system are used to control the working mode of the heat dissipation system.
[0108] In some embodiments, when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold, the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline are closed, and the bypass valve 8 on each bypass pipeline is opened so that the cooling system enters the first working mode.
[0109] In some embodiments, when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold, the connecting valve 15 and the balancing valve 16 on the balancing pipeline are closed.
[0110] That is to say, in the first working mode, since the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline are closed, and the bypass valve 8 on each bypass line 7 is opened, the refrigerant in the sub-pipeline only passes through the bypass line 7 and does not pass through the air pump 3.
[0111] For example, in the first working mode, the switch states of the air pump 3 and each valve are as shown in Table 1.
[0112] In some embodiments, when the outdoor wet-bulb temperature is greater than or equal to the wet-bulb temperature threshold, the air pump inlet valve 5 and the air pump outlet valve 6 on each sub-pipeline are opened, and the bypass valve 8 on each bypass pipeline is closed, so that the cooling system enters the second working mode.
[0113] In some embodiments, the heat dissipation control device 11 is configured to open the connecting valve 15 and the balancing valve 16 on the balancing pipeline when the outdoor wet-bulb temperature is greater than or equal to a wet-bulb temperature threshold.
[0114] That is to say, when the indoor heat dissipation cannot be achieved by relying solely on the external environment, it is necessary to close the bypass branch and start the air pump 3 to achieve indoor heat dissipation.
[0115] For example, in the second working mode, the switch status of the air pump 3 and each valve is as shown in Table 2.
[0116] In step 34, the number of the conducting sub-pipelines among the plurality of sub-pipelines in the heat dissipation system is controlled according to the indoor temperature.
[0117] In some embodiments, in the first working mode, the rotation speed of the fan 21 in the outdoor heat exchange device 2 is controlled according to the outdoor condensation parameters.
[0118] That is to say, without using the air pump 3, the heat dissipation of the machine room is achieved by only using the natural environment.
[0119] In some embodiments, when the rotation speed of the fan 21 reaches a maximum value, the spray system 23 in the outdoor heat exchange device is turned on.
[0120] For example, when the rotation speed of the fan 21 reaches the maximum value, the spray pump 22 is started to open the spray system 23 in the outdoor heat exchange device, thereby accelerating the heat exchange.
[0121] In some embodiments, in the first working mode, the rotation speed of the fan 41 in the indoor heat exchange device 4 is controlled according to the indoor temperature.
[0122] It should be noted here that the temperature in the machine room is kept stable by controlling the rotation speed of the fan 41 in the indoor heat exchange device 4 according to the indoor temperature.
[0123] In some embodiments, in the first operating mode, when the rotation speed of the fan 41 reaches the minimum value, a sub-pipeline is selected from the sub-pipelines currently in the on state as the first target pipeline, and the bypass valve on the bypass pipeline corresponding to the first target pipeline is closed so that the first target pipeline is in a closed state.
[0124] It should be noted that if the speed of the fan 41 reaches the minimum value, it indicates that the current outdoor ambient temperature is low, and the heat dissipation of the machine room can still be achieved when one sub-pipeline is reduced. In this case, one sub-pipeline is closed so that the refrigerant in the sub-pipeline stops circulating.
[0125] In some embodiments, in the first operating mode, when the rotation speed of the fan 41 reaches the maximum value, a sub-pipeline is selected from the sub-pipelines that are currently in a closed state as the second target pipeline, and the bypass valve on the bypass pipeline corresponding to the second target pipeline is opened so that the second target pipeline is in a conducting state.
[0126] It should be noted that if the speed of the fan 41 reaches the maximum value, it indicates that the current indoor load is large and a sub-pipeline needs to be added to ensure the heat dissipation of the machine room. In this case, a sub-pipeline is opened so that the refrigerant in the sub-pipeline circulates.
[0127] In some embodiments, in the first operating mode, when the speed of the fan 41 reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, the air pump inlet valve 5 and the air pump outlet valve 6 of each sub-pipeline are opened, and the bypass valve 8 on each bypass pipeline is closed, so that the cooling system enters the second operating mode.
[0128] It should be noted here that if the speed of the fan 41 reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, it indicates that the current indoor load is large and the indoor heat dissipation cannot be effectively achieved by relying solely on the external environment. In this case, the air pump 3 needs to be started to achieve indoor heat dissipation.
[0129] In some embodiments, when the rotation speed of the fan 41 reaches a maximum value and the number of sub-pipelines currently in a conducting state is a maximum value, the connecting valve 15 and the balancing valve 16 on the balancing pipeline are opened.
[0130] That is to say, in the second working mode, the communication valve 15 and the balancing valve 16 on the balancing pipeline are also in an open state.
[0131] In some embodiments, in the second working mode, the rotation speed of the fan 21 in the outdoor heat exchange device 2 is controlled according to the outdoor condensation parameters.
[0132] In some embodiments, when the rotation speed of the fan 21 reaches a maximum value, the spray system 23 in the outdoor heat exchange device is turned on.
[0133] For example, when the rotation speed of the fan 21 reaches the maximum value, the spray pump 22 is started to open the spray system 23 in the outdoor heat exchange device, thereby accelerating the heat exchange.
[0134] In some embodiments, in the second working mode, the rotation speed of the fan 41 in the indoor heat exchange device 4 is controlled according to the indoor temperature, so as to ensure the temperature stability in the machine room.
[0135] In some embodiments, in the second operating mode, when the rotation speed of the fan 41 reaches the minimum value, a sub-pipeline is selected from the sub-pipelines currently in the on state as the third target pipeline, and the air pump inlet valve and the air pump outlet valve on the third target pipeline are closed so that the third target pipeline is in a closed state.
[0136] It should be noted that if the speed of the fan 41 reaches the minimum value, it indicates that the cooling capacity provided by the current cooling system is sufficient, and the cooling of the machine room can still be achieved when one sub-pipeline is reduced. In this case, one sub-pipeline is closed so that the refrigerant in the sub-pipeline stops circulating.
[0137] In some embodiments, the communication valve and the balancing valve corresponding to the third target line are closed.
[0138] That is, if the third target pipeline is closed, the communication valve and the balancing valve corresponding to the third target pipeline are closed to prevent the third target pipeline from affecting the refrigerant balance of other sub-pipelines operating normally.
[0139] In some embodiments, in the second operating mode, when the rotation speed of the fan 41 reaches the maximum value, a sub-pipeline is selected from the sub-pipelines that are currently in a closed state as the fourth target pipeline, and the air pump inlet valve and the air pump outlet valve on the fourth target pipeline are opened so that the fourth target pipeline is in a conducting state.
[0140] It should be noted that if the speed of the fan 41 reaches the maximum value, it indicates that the current indoor load is large and a sub-pipeline needs to be added to ensure the heat dissipation of the machine room. In this case, a sub-pipeline is opened so that the refrigerant in the sub-pipeline circulates.
[0141] In some embodiments, the communication valve and the balancing valve corresponding to the fourth target line are opened.
[0142] That is, if the fourth target pipeline is opened, the connecting valve and the balancing valve corresponding to the fourth target pipeline are opened, so that the fourth target pipeline balances the refrigerant with other sub-pipelines operating normally, so as to obtain a better heat dissipation effect.
[0143] In some embodiments, in the second operating mode, when the rotation speed of the fan 41 reaches the minimum value and the number of sub-pipelines currently in the on state is the minimum value, the air pump inlet valve and the air pump outlet valve of each sub-pipeline are closed, and the bypass valve on each bypass pipeline is opened, so that the cooling system enters the first operating mode.
[0144] It should be noted here that in the second working mode, if the rotation speed of the fan 41 reaches the minimum value and the number of sub-pipelines currently in the on state is the minimum value, it indicates that the current outdoor ambient temperature is low and indoor heat dissipation can be achieved without the air pump 3 working. In this case, turn off the air pump 3 so that the cooling system returns to the first working mode.
[0145] In some embodiments, in the second working mode, when the rotation speed of the first fan reaches a minimum value and the number of sub-pipelines currently in a conducting state is a minimum value, the connecting valve and the balancing valve on the balancing pipeline are closed.
[0146] That is to say, in order to return the heat dissipation system to the first working mode, the balancing branch needs to be closed.
[0147] Figure 4 The figure is a schematic diagram of the structure of a heat dissipation control device according to an embodiment of the present disclosure.
[0148] like Figure 4 As shown, the heat dissipation control device 40 can be embodied in the form of a general-purpose computing device. The heat dissipation control device 40 includes a memory 41, a processor 42, and a bus 33 connecting different system components.
[0149] The memory 41 may include, for example, a system memory, a non-volatile storage medium, etc. The system memory may store, for example, an operating system, an application program, a boot loader, and other programs. The system memory may include a volatile storage medium, such as a random access memory (RAM) and / or a cache memory. The non-volatile storage medium may store, for example, instructions of a corresponding embodiment of at least one billing processing method being executed. The non-volatile storage medium includes, but is not limited to, a disk memory, an optical memory, a flash memory, etc.
[0150] The processor 42 may be implemented by a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistors, etc., as discrete hardware components. Accordingly, each module such as an acquisition module, a calculation module, and an adjustment module may be implemented by a central processing unit (CPU) running instructions in a memory that execute corresponding steps, or may be implemented by a dedicated circuit that executes corresponding steps.
[0151] For example, the processor 42 is configured to execute instructions stored in the memory to implement the following Figure 3 The method of any one of the embodiments.
[0152] The bus 43 may use any of a variety of bus structures, including, but not limited to, an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MCA) bus, and a Peripheral Component Interconnect (PCI) bus.
[0153] The interfaces 44, 45, 46 of the heat dissipation control device 40, the memory 41 and the processor 42 can be connected via a bus 43. The input / output interface 44 can provide a connection interface for input / output devices such as a display, a mouse, and a keyboard. The network interface 45 provides a connection interface for various networked devices. The storage interface 46 provides a connection interface for external storage devices such as a floppy disk, a USB flash drive, and an SD card.
[0154] Here, various aspects of the present disclosure are described with reference to flowcharts and / or block diagrams of methods, devices, and computer program products according to embodiments of the present disclosure. It should be understood that each frame of the flowchart and / or block diagram and the combination of frames can be implemented by computer-readable program instructions.
[0155] These computer-readable program instructions may be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable device to produce a machine, so that the processor executes the instructions to produce means for implementing the functions specified in one or more blocks in the flowchart and / or block diagram.
[0156] These computer-readable program instructions may also be stored in a computer-readable memory, which cause the computer to work in a specific manner to produce an article of manufacture, including instructions for implementing the functions specified in one or more blocks in the flowchart and / or block diagram.
[0157] The present disclosure can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects.
[0158] The present disclosure also provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and when the instructions are executed by a processor, the following is implemented: Figure 3 The method of any one of the embodiments.
[0159] The present disclosure also provides a computer program product, including computer instructions, wherein when the computer instructions are executed by a processor, the following is achieved: Figure 3 The method of any one of the embodiments.
[0160] By implementing the above-mentioned embodiments of the present disclosure, the following beneficial effects can be obtained.
[0161] 1) The present invention automatically adjusts the working mode of the heat dissipation system according to outdoor meteorological conditions, thereby making full use of the external environment to achieve heat dissipation, and thus heat dissipation can be achieved without turning on the air pump.
[0162] 2) The present invention automatically adjusts the number of sub-pipelines involved in the work according to the indoor load, thereby achieving high-precision heat dissipation management and low PUE operation of the heat dissipation system.
[0163] 3) The present invention adopts a magnetic levitation air pump, which enables the heat dissipation to operate stably even at high temperature and low load. It should be noted here that the magnetic levitation air pump uses magnetic levitation technology to compress the fluid, and can operate efficiently and stably under a small pressure ratio (condensing pressure / evaporation pressure) working condition. Ordinary centrifugal compressors cannot adapt to this working condition.
[0164] 4) The present disclosure uses multiple valves to control the operation of the heat dissipation system, thereby achieving stable operation of the heat dissipation system and reducing additional consumption of the system.
[0165] In some embodiments, the functional unit described above can be implemented as a general-purpose processor, a programmable logic controller (PLC), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware component or any appropriate combination thereof for performing the functions described in the present disclosure.
[0166] A person skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware or by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a disk or an optical disk, etc.
[0167] The description of the present disclosure is given for the purpose of illustration and description, and is not intended to be exhaustive or to limit the present disclosure to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present disclosure, and to enable those of ordinary skill in the art to understand the present disclosure and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. A heat dissipation system, comprising: A cooling circuit, comprising an outdoor heat exchange device, an air pump and an indoor heat exchange device connected in sequence through a pipeline, wherein the pipeline comprises a plurality of sub-pipelines, each of which is provided with an air pump inlet valve and an air pump outlet valve; a plurality of bypass pipelines corresponding one to one with the plurality of sub-pipelines, wherein each bypass pipeline is communicated with a corresponding sub-pipeline and is used to bypass an air pump inlet valve and an air pump outlet valve on the corresponding sub-pipeline, and each bypass pipeline is provided with a bypass valve; A first sensing device is configured to collect an outdoor wet-bulb temperature; A second sensor device is configured to collect indoor temperature; The heat dissipation control device is configured to control the working mode of the heat dissipation system according to the outdoor wet-bulb temperature using the air pump inlet valve, the air pump outlet valve and the bypass valve, and control the number of conducting sub-pipelines in the multiple sub-pipelines according to the indoor temperature.
2. The heat dissipation system according to claim 1, further comprising: A balancing pipeline comprises a balancing branch and a plurality of connecting branches, wherein the plurality of connecting branches correspond one-to-one to the plurality of sub-pipelines, the balancing branch is connected to the plurality of sub-pipelines through the plurality of connecting branches, each connecting branch is provided with a connecting valve, and the balancing pipeline is provided with a balancing valve corresponding to each of the sub-pipelines.
3. The heat dissipation system according to claim 2, wherein: The heat dissipation control device is configured to: when the outdoor wet-bulb temperature is less than the wet-bulb temperature threshold, close the air pump inlet valve and the air pump outlet valve on each sub-pipeline, and open the bypass valve on each bypass pipeline, so that the heat dissipation system enters the first working mode.
4. The heat dissipation system according to claim 3, wherein: The heat dissipation control device is configured to close the connecting valve and the balancing valve on the balancing pipeline when the outdoor wet-bulb temperature is less than a wet-bulb temperature threshold.
5. The heat dissipation system according to claim 4, wherein: The heat dissipation control device is configured to: in the first working mode, control the rotation speed of the first fan in the indoor heat exchange device according to the indoor temperature.
6. The heat dissipation system according to claim 5, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches a minimum value, select a sub-pipeline from the sub-pipelines currently in an on state as a first target pipeline, and close a bypass valve on the bypass pipeline corresponding to the first target pipeline so that the first target pipeline is in a closed state.
7. The heat dissipation system according to claim 5, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches a maximum value, select a sub-pipeline from the sub-pipelines currently in a closed state as a second target pipeline, and open a bypass valve on the bypass pipeline corresponding to the second target pipeline so that the second target pipeline is in a conducting state.
8. The heat dissipation system according to claim 5, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches the maximum value and the number of sub-pipelines currently in the on state is the maximum value, open the air pump inlet valve and the air pump outlet valve of each sub-pipeline, and close the bypass valve on each bypass pipeline, so that the heat dissipation system enters the second working mode.
9. The heat dissipation system according to claim 8, wherein: The heat dissipation control device is configured to open the connecting valve and the balancing valve on the balancing pipeline when the rotation speed of the first fan reaches a maximum value and the number of sub-pipelines currently in a conducting state is a maximum value.
10. The heat dissipation system according to claim 2, wherein: The heat dissipation control device is configured to: when the outdoor wet-bulb temperature is greater than or equal to the wet-bulb temperature threshold, open the air pump inlet valve and the air pump outlet valve on each sub-pipeline, and close the bypass valve on each bypass pipeline, so that the heat dissipation system enters the second working mode.
11. The heat dissipation system according to claim 10, wherein: The heat dissipation control device is configured to open the connecting valve and the balancing valve on the balancing pipeline when the outdoor wet-bulb temperature is greater than or equal to a wet-bulb temperature threshold.
12. The heat dissipation system according to claim 11, wherein: The heat dissipation control device is configured to: in the second working mode, control the rotation speed of the first fan in the indoor heat exchange device according to the indoor temperature.
13. The heat dissipation system according to claim 12, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches the minimum value, select a sub-pipeline from the sub-pipelines currently in the on state as the third target pipeline, and close the air pump inlet valve and the air pump outlet valve on the third target pipeline so that the third target pipeline is in a closed state.
14. The heat dissipation system according to claim 13, wherein: The heat dissipation control device is configured to close the communication valve and the balance valve corresponding to the third target pipeline.
15. The heat dissipation system according to claim 12, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches the maximum value, select a sub-pipeline from the sub-pipelines that are currently in a closed state as the fourth target pipeline, and open the air pump inlet valve and the air pump outlet valve on the fourth target pipeline so that the fourth target pipeline is in a conducting state.
16. The heat dissipation system according to claim 15, wherein: The heat dissipation control device is configured to open the communication valve and the balance valve corresponding to the fourth target pipeline.
17. The heat dissipation system according to claim 12, wherein: The heat dissipation control device is configured to: when the rotation speed of the first fan reaches a minimum value and the number of sub-pipelines currently in a conducting state is a minimum value, close the air pump inlet valve and the air pump outlet valve of each sub-pipeline, and open the bypass valve on each bypass pipeline, so that the heat dissipation system enters the first working mode.
18. The heat dissipation system according to claim 17, wherein: The heat dissipation control device is configured to close the connecting valve and the balancing valve on the balancing pipeline when the rotation speed of the first fan reaches a minimum value and the number of sub-pipelines currently in a conducting state is a minimum value.
19. The heat dissipation system according to any one of claims 1 to 18, wherein: The indoor temperature includes at least one of an indoor supply air temperature and an indoor outlet air temperature.
20. The heat dissipation system according to any one of claims 1 to 18, further comprising: The third sensor device is configured to collect outdoor condensation parameters. Wherein, the heat dissipation control device is configured to control the rotation speed of the second fan in the outdoor heat exchange device according to the outdoor condensation parameter.
21. The heat dissipation system according to claim 20, wherein: The heat dissipation control device is configured to turn on the spray system in the outdoor heat exchange device when the rotation speed of the second fan reaches a maximum value.
22. A heat dissipation control method, applied to a heat dissipation control device in a heat dissipation system according to any one of claims 1 to 21, comprising: receiving the outdoor wet-bulb temperature collected by the first sensing device; Receiving the indoor temperature collected by the second sensing device; According to the outdoor wet-bulb temperature, the working mode of the heat dissipation system is controlled by using the air pump inlet valve, the air pump outlet valve and the bypass valve in the heat dissipation system; According to the indoor temperature, the number of the conducting sub-pipelines in the plurality of sub-pipelines in the heat dissipation system is controlled.
23. A heat dissipation control device, comprising: Memory; A processor is coupled to the memory, and the processor is configured to execute the heat dissipation control method as claimed in claim 22 based on instructions stored in the memory.
24. A computer-readable storage medium, wherein: The computer-readable storage medium stores computer instructions, and when the instructions are executed by the processor, the heat dissipation control method as claimed in claim 22 is implemented.
25. A computer program product, comprising computer instructions, wherein when the computer instructions are executed by a processor, the heat dissipation control method according to claim 22 is implemented.