Display panel, manufacturing method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, and the light-emitting devices and the isolation columns are located on the same side of the substrate. The orthographic projections of the isolation columns on the substrate are located between the orthographic projections of the adjacent light-emitting devices on the substrate; the display panel is provided with a first section which is perpendicular to the plane where the substrate is located. Each isolation column in the first section comprises a bottom edge, a bevel edge and an arc-shaped edge, the bottom edge is the edge, close to one side of the substrate, of the isolation column, the arc-shaped edge is connected with the bottom edge and the bevel edge, an angle formed between the bevel edge and the plane where the substrate is located and facing the exterior of the isolation column is an acute angle, and the arc-shaped edge sinks towards the interior of the isolation column. Packaging holes and cracks can be prevented from being formed at the bottom corners of the isolation columns, and the packaging reliability of the display panel can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic self-luminous display panels have self-luminous properties and do not require a backlight source. They are thinner and lighter than liquid crystal display panels. In addition, organic self-luminous display panels have the advantages of high brightness, low power consumption, fast response, high clarity, good flexibility, and high luminous efficiency, which can meet consumers' new demands for display technology. The organic functional layer of each light-emitting device in the organic light-emitting display panel is made on the entire surface using an evaporation process. In order to reduce leakage between light-emitting devices, isolation columns are usually set to partially isolate the organic functional layer. When an inorganic encapsulation layer is made on top of the isolation column, there is a problem of local rupture of the inorganic encapsulation layer, causing encapsulation failure. Summary of the invention

[0003] The embodiments of the present invention provide a display panel and a manufacturing method thereof and a display device to solve the technical problem of improving the packaging reliability of the display panel.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, comprising: a substrate, a light emitting device, and an isolation column located on the same side of the substrate; an orthographic projection of the isolation column on the substrate is located between orthographic projections of adjacent light emitting devices on the substrate; The display panel has a first cross section, and the first cross section is perpendicular to the plane where the substrate is located; In the first cross section, the isolation column includes a bottom edge, a hypotenuse and an arcuate edge. The bottom edge is the edge of the isolation column close to the substrate. The arcuate edge connects the bottom edge and the hypotenuse. The angle formed between the hypotenuse and the plane where the substrate is located toward the outside of the isolation column is an acute angle, and the arcuate edge is recessed into the inside of the isolation column.

[0005] In a second aspect, based on the same inventive concept, an embodiment of the present invention provides a display device, including the display panel provided by any embodiment of the present invention.

[0006] In a third aspect, based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing a display panel, the manufacturing method comprising: manufacturing a light-emitting device and an isolation column on one side of a substrate, wherein the orthographic projection of the isolation column on the substrate is located between the orthographic projections of adjacent light-emitting devices on the substrate; the manufacturing method of the isolation column comprises: Applying photoresist material, and forming a prototype of isolation column through exposure and development steps; The prototype of the isolation column is subjected to IUV light treatment to obtain the initial shape of the isolation column; The isolation column is subjected to a curing treatment to obtain an isolation column having an arc-shaped edge; wherein the display panel has a first cross section, and the first cross section is perpendicular to the plane where the substrate is located; in the first cross section, the isolation column includes a bottom edge, a hypotenuse and an arc-shaped edge, the bottom edge is the edge of the isolation column close to the substrate, the arc-shaped edge connects the bottom edge and the hypotenuse, the angle formed between the hypotenuse and the plane where the substrate is located toward the outside of the isolation column is an acute angle, and the arc-shaped edge is recessed toward the inside of the isolation column.

[0007] The display panel and its manufacturing method and display device provided by the embodiment of the present invention have the following beneficial effects: In the display panel provided by the embodiment of the present invention, an inverted trapezoidal isolation column is arranged between adjacent light-emitting devices, and the isolation column can be used to isolate the organic functional layer in the light-emitting device, which can reduce the leakage between adjacent light-emitting devices. The isolation column is provided with an arc-shaped edge, and the arc-shaped edge connects the bottom edge and the hypotenuse, so that the bottom angle of the isolation column close to the substrate side is an arc-shaped bottom angle. When manufacturing the inorganic encapsulation layer, the inorganic material can be well deposited and smoothly transitioned at the arc-shaped bottom angle position of the isolation column, avoiding the problem of encapsulation voids and cracks formed at the bottom angle position of the isolation column, and can improve the encapsulation reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0009] Figure 1 It is a cross-sectional schematic diagram of a display panel in the related art; Figure 2 A schematic diagram of a display panel provided by an embodiment of the present invention; Figure 3 for Figure 2 A schematic diagram of a cross section at the mid-tangent line AA′; Figure 4 A schematic diagram of a light emitting device stack provided by an embodiment of the present invention; Figure 5 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Figure 6 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Figure 7 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Figure 8 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Fig. 9A partial schematic diagram of another display panel provided by an embodiment of the present invention; Fig.10 for Fig. 9 A simplified schematic diagram of a cross section at the mid-tangent line BB′; Fig.11 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Fig.12 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Fig.13 A partial schematic diagram of another display panel provided by an embodiment of the present invention; Fig.14 A partial schematic diagram of another display panel provided by an embodiment of the present invention; Fig.15 A partial schematic diagram of another display panel provided by an embodiment of the present invention; Fig.16 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention; Fig.17 A flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention; Fig.18 A schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0011] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0012] Figure 1 is a cross-sectional schematic diagram of a display panel in the related art, such as Figure 1 As shown, the display panel includes a spacer 001, an organic functional layer 002 separated by the spacer 001, and an inorganic encapsulation layer 003 covering the organic functional layer 002. The spacer 001 is in the shape of an inverted trapezoid. Since the bottom angle of the inverted trapezoid is relatively sharp, the inorganic encapsulation layer 003 cannot be well sunk at the bottom angle, and it is easy to form cavities and gaps, such as Figure 1 The position is enclosed by the dotted line in the middle. The inorganic encapsulation layer 003 at this gap position is prone to fracture along the gap direction and extend to the cavity position, resulting in poor encapsulation of the inorganic encapsulation layer 003 and affecting the encapsulation reliability of the display panel.

[0013] In order to solve the problems existing in the related art, an embodiment of the present invention provides a display panel, in which the morphology at the bottom corner position of the isolation column is improved to improve the morphology of the inorganic encapsulation layer deposited at the bottom corner position, thereby reducing the risk of cracks in the inorganic encapsulation layer. Furthermore, in some embodiments, the morphology at the top corner position of the isolation column is improved so that a relatively thick inorganic encapsulation layer can be deposited on the side wall of the isolation column, further improving the encapsulation reliability of the inorganic encapsulation layer.

[0014] Figure 2 A schematic diagram of a display panel provided by an embodiment of the present invention, Figure 3 for Figure 2 A schematic cross-sectional view at the midline AA′. Figure 2 The arrangement of the light emitting devices at the local position of the display panel is shown in FIG. Figure 2 As shown, the light emitting device 10 includes a first light emitting device 11, a second light emitting device 12 and a third light emitting device 13 having different colors from each other. Figure 2 The arrangement of the light emitting devices 10 is only for schematic representation and is not intended to limit the present invention. Figure 2 It can be seen that the isolation columns 20 are arranged between adjacent light emitting devices 10 , that is, the orthographic projections of the isolation columns 20 on the substrate 00 are located between the orthographic projections of the adjacent light emitting devices 10 on the substrate 00 .

[0015] Figure 3 The first cross section M1 of the display panel is shown, and the first cross section M1 is perpendicular to the plane where the substrate 00 is located. Figure 3 From the perspective of FIG. 1 , the light emitting device 10 and the isolation column 20 are located on the same side of the substrate 00; in the first section M1, the isolation column 20 includes a bottom side 21, a hypotenuse 22, and an arcuate side 23, the bottom side 21 being the side of the isolation column 20 close to the substrate 00, and the arcuate side 23 connecting the bottom side 21 and the hypotenuse 22. It can be seen that the angle formed between the hypotenuse 22 and the plane where the substrate 00 is located and facing the outside of the isolation column 20 is an acute angle, and the arcuate side 23 is concave toward the inside of the isolation column 20. In the first section M1, the isolation column 20 is approximately inverted trapezoidal shape. The arcuate side 23 can be a partial arc in an approximate circle or an approximate ellipse.

[0016] Figure 3Schematically shows a driving layer 01, in which a pixel circuit is arranged, and the pixel circuit is used to drive the light-emitting device 10 to emit light. A pixel definition layer 02 is arranged on the driving layer 01, and the pixel definition layer 02 includes a plurality of openings 021, and the light-emitting device 10 is located in the opening 021. The first electrode 101, the second electrode 102 and the organic functional layer 103 in the light-emitting device 10. The organic functional layer 103 is deposited in the opening 021 and extends to the outside of the opening 021. The display panel also includes an organic functional part 104, and the organic functional part 104 covers the isolation column 20 on the side of the isolation column 20 away from the substrate 00. Among them, the organic functional part 104 and the organic functional layer 103 are made of the same material, and the organic functional part 104 and the organic functional layer 103 are separated from each other at the position of the isolation column 20. When the display panel is manufactured, an organic material layer is manufactured by an evaporation process. The organic material layer is separated by the isolation column 20. The organic material deposited in the opening 021 forms an organic functional layer 103, and the organic material covering the isolation column 20 forms an organic functional portion 104. By using the isolation column 20 to separate the organic material layer, leakage between adjacent light-emitting devices 10 can be reduced. An inorganic encapsulation layer 03 is provided on the side of the light-emitting device 10 and the isolation column 20 away from the substrate 00. The inorganic encapsulation layer 03 covers the light-emitting device 10 and the isolation column 20 to form a whole layer.

[0017] In the display panel provided by the embodiment of the present invention, an inverted trapezoidal isolation column 20 is provided between adjacent light-emitting devices 10. The isolation column 20 can be used to isolate the organic functional layer 103 in the light-emitting device 10, and the leakage between adjacent light-emitting devices 10 can be reduced. The isolation column 20 is provided with an arc-shaped edge 23, and the arc-shaped edge 23 connects the bottom edge 21 and the hypotenuse 22, so that the bottom angle of the isolation column 20 close to the substrate 00 is an arc-shaped bottom angle. When manufacturing the inorganic encapsulation layer 03, the inorganic material can be well deposited and smoothly transitioned at the arc-shaped bottom angle position of the isolation column 20, avoiding the problem of encapsulation voids and cracks formed at the bottom angle position of the isolation column 20, and can improve the encapsulation reliability of the display panel.

[0018] Figure 3 In the figure, only the light emitting device 10 is simplified and illustrated. In some embodiments, the light emitting device 10 includes a light emitting layer, and the light emitting layer is located between the first electrode 101 and the second electrode 102. The organic functional layer 103 includes at least one of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. Optionally, the first electrode 101 is an anode and the second electrode 102 is a cathode.

[0019] In some embodiments, the light emitting device 10 is a stacked device. Figure 4 A schematic diagram of a light emitting device stacking according to an embodiment of the present invention. Figure 4As shown, the light emitting device 10 includes a first electrode 101 and a second electrode 102, and at least two light emitting layers 105 located between the first electrode 101 and the second electrode 102, and a charge generation layer 106 is provided between adjacent light emitting layers 105. The charge generation layer 106 includes an n-type charge generation layer N-CGL and a p-type charge generation layer P-CGL. The light emitting device 10 also includes film layers such as a hole blocking layer HBL, an electron transport layer ETL, a hole transport layer HTL, and an electron injection layer EIL. Figure 4 The light emitting device 10 includes two light emitting layers 105. The embodiment of the present invention can be applied to a display panel having a stacked device, and can improve the efficiency of the light emitting device 10, reduce power consumption, and extend the life. The isolation column 20 structure provided by the embodiment of the present invention can also improve the packaging reliability and further extend the service life.

[0020] like Figure 3 As shown, the display panel includes a pixel definition layer 02 located on one side of a substrate 00, and an isolation column 20 is located on the side of the pixel definition layer 02 away from the substrate 00. The arc edge 23 is in contact with the surface of the pixel definition layer 02 on the side away from the substrate 00. In this embodiment, the surface of the pixel definition layer 02 is the base surface of the isolation column 20, and the bottom edge 21 of the isolation column 20 is in contact with the surface of the pixel definition layer 02. In the embodiment of the present invention, the morphology of the isolation column 20 itself is designed to form an arc bottom angle at its bottom corner position, so as to improve the deposition morphology of the inorganic encapsulation layer at the bottom corner position of the isolation column 20, and improve the packaging reliability of the display panel.

[0021] In some embodiments, Figure 5 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention, Figure 5 Only the position of the isolation column 20 in the first cross section M1 is shown. Figure 5 As shown, in the first cross section M1, along the first direction a, the arcuate edge 23 does not exceed the end edge B of the isolation column 20 away from the substrate 00, and the first direction a is parallel to the plane where the substrate 00 is located. In this embodiment, the length of the arcuate edge 23 in the first direction a is not too long. On the one hand, the width occupied by the isolation column 20 as a whole in the first direction a is not too large, ensuring that a complete isolation column 20 can be set between adjacent light-emitting devices 10; on the other hand, the partition effect of the isolation column 20 can also be ensured, and the inorganic encapsulation layer can be well deposited at the position of the arcuate edge 23.

[0022] like Figure 5As shown, along the first direction a, the distance between the arcuate edge 23 and the end edge B of the isolation column 20 away from the substrate 00 is △W; wherein, △W≥h / (3*tanθ); h is the height of the isolation column 20 along the direction e perpendicular to the plane where the substrate 00 is located, and θ is the first angle formed by the hypotenuse 22 and the plane where the substrate 00 is located toward the outside of the isolation column 20. It can be understood that the height h of the isolation column 20 is its own height, that is, the distance between the upper and lower ends of the isolation column 20 along the direction e. In the embodiment of the present invention, △W is set to be related to h and θ, so that the length of △W is not too small, and the arcuate edge 23 also has an appropriate length in the first direction a. In this way, the partition effect of the isolation column 20 can be guaranteed, and the inorganic encapsulation layer can be well deposited at the position of the arcuate edge 23, thereby improving the encapsulation reliability.

[0023] In some embodiments, Figure 5 As shown, the angle formed by the hypotenuse 22 and the plane where the substrate 00 is located toward the outside of the isolation column 20 is a first angle θ, wherein 45°≤θ≤75°. Such a setting can ensure the inclination of the hypotenuse 22 relative to the plane where the substrate 00 is located, ensure that the isolation column 20 has a good isolation effect on the vapor deposition material, and improve the lateral leakage between the light-emitting devices 10.

[0024] In some embodiments, Figure 6 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention, Figure 6 Only the position of the isolation column 20 in the first cross section M1 is shown. Figure 6 As shown, along the direction e perpendicular to the plane where the substrate 00 is located, the height of the arc side 23 is H1. The height H1 of the arc side 23 is understood as its own height, that is, the length of the arc side 23 along the direction e. Along the first direction a, the width of the arc side 23 is W1, and the first direction a is parallel to the plane where the substrate 00 is located; wherein 0.4≤H1 / W1≤2.5. In the embodiment of the present invention, a certain proportional relationship is satisfied between the height H1 and the width W1 of the arc side 23. In some embodiments, H1 and W1 may also be equal. When H1 is greater than W1, or when H1 is less than W1, the numerical values ​​between H1 and W1 will not differ too much, so that the arc side 23 and the hypotenuse 22, as well as the arc side 23 and its substrate surface can be smoothly transitioned, then the inorganic encapsulation layer can be well deposited at the position of the arc side 23, avoiding the problem of encapsulation voids and cracks formed at the bottom corner of the isolation column 20, and can improve the encapsulation reliability of the display panel.

[0025] In some embodiments, 0.2μm≤H1≤0.5μm, 0.2μm≤W1≤0.5μm. In the display panel, the limitations of process capabilities and display panel thickness requirements have a certain impact on the height of the isolation column 20. In the embodiment of the present invention, H1 and W1 are set to meet a certain size range, which can ensure a smooth transition between the arc edge 23 and the hypotenuse 22, and between the arc edge 23 and its substrate surface, so that the inorganic encapsulation layer can be well deposited at the position of the arc edge 23. Moreover, the height of the arc edge 23 will not account for too large a proportion of the overall height of the isolation column 20, which can ensure the isolation column 20 The effect of the vapor deposition material is blocked.

[0026] In some embodiments, Figure 7 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention, Figure 7 Only the position of the isolation column 20 in the first cross section M1 is shown. Figure 7 As shown, in the first section M1, the corner of the isolation column 20 away from the substrate 00 is an arc corner 24, and the arc corner 24 can be a partial arc in an approximate circle or ellipse. In the embodiment of the present invention, not only the bottom angle of the isolation column 20 close to the substrate 00 is set as an arc bottom angle, but also the corner away from the substrate 00 is set as an arc corner 24. The use of the arc bottom angle can make the inorganic encapsulation layer well deposited at the bottom position of the isolation column 20, avoiding the problem of encapsulation voids and cracks formed at the bottom corner position of the isolation column 20. The use of the arc corner 24 can facilitate the film formation and extension of the inorganic encapsulation layer on the hypotenuse 22. The coordination of the arc bottom angle and the arc corner 24 on the isolation column 20 can make the inorganic encapsulation layer form a complete layer, thereby improving the encapsulation reliability.

[0027] like Figure 7 As shown, in the first section M1: along the direction e perpendicular to the plane where the substrate 00 is located, the height of the arc corner 24 is H2; the height H2 of the arc corner 24 is its own height, that is, the length of the arc corner 24 along the direction e; along the first direction a, the width of the arc corner 24 is W2, and the first direction a is parallel to the plane where the substrate 00 is located; wherein 0.5≤H2 / W2≤2. In the embodiment of the present invention, a certain proportional relationship is satisfied between the height H2 and the width W2 of the arc corner 24. In some embodiments, H2 and W2 may also be equal. When H2 is greater than W2, or when H2 is less than W2, the numerical values ​​between H2 and W2 will not differ too much, then the arc corner 24 and the hypotenuse 22, as well as the arc corner 24 and the upper surface of the isolation column 20 can be smoothly transitioned, which can be conducive to the film formation and extension of the inorganic encapsulation layer on the hypotenuse 22, and can improve the encapsulation reliability of the display panel.

[0028] In some embodiments, 0.5 μm ≤ H2 ≤ 0.9 μm, 0.5 μm ≤ W2 ≤ 0.9 μm. H2 and W2 are set to meet a certain size range, and there can be a smooth transition between the arc corner 24 and the hypotenuse 22, and between the arc corner 24 and the upper surface of the isolation column 20, so that the inorganic encapsulation layer can be formed and extended on the hypotenuse 22. In addition, the height of the arc corner 24 does not account for too large a proportion of the overall height of the isolation column 20, which can ensure the isolation column 20 The effect of separating the vapor deposition material.

[0029] In some embodiments, Figure 7 As shown, in the first cross section M1: along the direction e perpendicular to the plane of the substrate 00, the height of the arc edge 23 is H1, the height of the arc corner 24 is H2, and H2>H1. In the embodiment of the present invention, the height of the arc corner 24 is set to be greater than the height of the arc edge 23, which can reduce the process difficulty and make the process simpler and easier to implement.

[0030] In some embodiments, Figure 7 As shown, in the first cross section M1: along the first direction a, the width of the arcuate edge 23 is W1, the width of the arcuate corner 24 is W2, W2>W1, and the first direction a is parallel to the plane where the substrate 00 is located. In the embodiment of the present invention, the width of the arcuate corner 24 in the first direction a is greater than the width of the arcuate edge 23, which can reduce the process difficulty and is simpler and easier to implement.

[0031] In some embodiments, along the direction e perpendicular to the plane of the substrate 00, the height of the arc-shaped edge 23 is H1, the height of the arc-shaped corner 24 is H2, and the height of the isolation column 20 is h; wherein, h-H1-H2≥h / 3. That is, the sum of the height H1 of the arc-shaped edge 23 and the height H2 of the arc-shaped corner 24 does not exceed two-thirds of the height of the isolation column 20. Such a setting can ensure that the hypotenuse 22 has a certain length, and combined with the design of the first angle θ, it can ensure that the isolation column 20 has a good isolation effect on the vapor deposition material, and effectively improve the lateral leakage between the light-emitting devices 10.

[0032] In some embodiments, Figure 8 Another cross-sectional schematic diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 8 As shown, the display panel includes a pixel definition layer 02 located on one side of a substrate 00, and the pixel definition layer 02 includes a plurality of openings 021. Figure 3From the perspective of FIG. 1 , the light emitting device 10 is located in the opening 021. The isolation column 20 is located on the side of the pixel definition layer 02 away from the substrate 00; the pixel definition layer 02 includes a base portion 022 and a protrusion 023, the protrusion 023 protrudes from the base portion 022 to the side away from the substrate 00; the base portion 022 and the opening 021 share a side wall. In the first section M1, the edge of the base portion 022 exceeds the protrusion 023 along the first direction a, and the first direction a is parallel to the plane where the substrate 00 is located, that is, the width of the base portion 022 in the first direction a is greater than the width of the protrusion 023 in the first direction a. Along the direction e perpendicular to the plane where the substrate 00 is located, the isolation column 20 at least partially overlaps with the protrusion 023; the protrusion 023 includes a first top surface m1 and a first side surface m2 connected to each other; in the first section M1, it can be seen that the angle formed by the first top surface m1 and the first side surface m2 toward the inside of the protrusion 023 is an obtuse angle. Among them, the isolation column 20 includes a first isolation column 20-1, and the first isolation column 20-1 is in contact with the first top surface m1. That is, the bottom edge 21 of the first isolation column 20-1 is in contact with the first top surface m1. In the embodiment of the present invention, a first isolation column 20-1 is provided, and the first isolation column 20-1 is arranged on the protrusion 023 of the pixel definition layer 02, which is equivalent to placing the first isolation column 20-1 in a climbing position of the pixel definition layer 02, so that a large angle is formed between the hypotenuse 22 of the isolation column 20 and the first side surface m2 of the protrusion 023, which can be more conducive to the film formation of the inorganic encapsulation layer at the bottom of the isolation column 20, and further improve the encapsulation reliability. In addition, the first isolation column 20-1 is arranged on the protrusion 023, which is equivalent to raising the first isolation column 20-1, and can also improve its isolation effect on the evaporation material.

[0033] In some embodiments, the base portion 022 and the protrusion 023 have the same material and are integrally formed. When manufacturing the display panel, the pixel definition layer 02 can be manufactured using a half-grayscale mask process to form the base portion 022 and the protrusion 023 .

[0034] In other embodiments, the base 022 includes a light-shielding material, and the protrusion 023 includes a transparent material. In this embodiment, the base 022 and the protrusion 023 are made separately. The base 022 is made of a light-shielding material to prevent light crosstalk between adjacent light-emitting devices, and the protrusion 023 is made of a transparent material to prevent blocking of large-angle light emitted by the light-emitting device and ensure the light output angle of the light-emitting device.

[0035] like Figure 8As shown, the angle formed by the first side surface m2 and the plane where the substrate 00 is located toward the inside of the protrusion 023 is the second angle α, 10°≤α≤40°. Such a setting can ensure that a large angle can be formed between the first side surface m2 of the protrusion 023 and the first isolation column 20-1, which is more conducive to the film formation of the inorganic encapsulation layer at the bottom of the first isolation column 20-1, and further improves the encapsulation reliability. Moreover, the size of α in this embodiment is easy to achieve in terms of process, and the manufacturing difficulty is low.

[0036] like Figure 8 As shown, along the direction e perpendicular to the plane of the substrate 00, the height of the first side m2 is h1, 0.3μm≤h1≤0.6μm. The height h1 of the first side m2 is understood to be its length in the direction e. In this embodiment, the height h1 of the first side m2 will not be too large, which can avoid the height of the two being too high after the first isolation column 20-1 is stacked on the protrusion 023, affecting the overall thickness of the display panel. In addition, the height h1 of the first side m2 will not be too small, and the protrusion 023 of appropriate size can be produced within the process capability, so as to cooperate with the shape of the isolation column 20 so that the inorganic encapsulation layer can be better formed at the bottom of the isolation column 20.

[0037] In other embodiments, Fig. 9 A partial schematic diagram of another display panel provided by an embodiment of the present invention, Fig.10 for Fig. 9 A simplified schematic diagram of a cross section at the midline BB′. Fig. 9 and Fig.10 From the perspective of the display panel, the display panel includes a support column 30, which is located on the side of the pixel definition layer 02 away from the substrate 00. The support column 30 is used to support the mask during the evaporation process to ensure uniform evaporation. The vertical distance between the surface of the support column 30 away from the substrate 00 and the substrate 00 is d1, and the vertical distance between the surface of the isolation column 20 away from the substrate 00 and the substrate 00 is d2, d1>d2. The embodiment of the present invention does not limit the arrangement of the support column 30 on the display panel. Fig. 9 When the plane of the substrate 00 is taken as the reference plane, the height of the isolation column 20 on the substrate 00 is less than the height of the support column 30, which can ensure that the support column 30 is used to support the mask during the evaporation process and prevent the height of the isolation column 20 from being too high to affect the evaporation yield.

[0038] Combination Figure 8 According to the embodiment, when the first isolation column 20 - 1 is located on the protrusion 023 , taking the plane where the substrate 00 is located as the reference plane, the height of the first isolation column 20 - 1 on the substrate 00 is also smaller than the height of the support column 30 .

[0039] In some embodiments, 0.3 μm ≤ d1-d2 ≤ 0.6 μm. In this embodiment, the difference between d1 and d2 is not too large, which can ensure that the height of the isolation column 20 itself is large enough to ensure the isolation effect of the isolation column 20 on the evaporation material. The difference between d1 and d2 is also not too small, which ensures that the support column 30 is used to support the mask during the evaporation process to prevent the evaporation yield from being affected.

[0040] In some embodiments, Fig.11 Another cross-sectional schematic diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Fig.11 As shown, the display panel includes a pixel definition layer 02 located on one side of a substrate 00, and the pixel definition layer 02 includes a plurality of openings 021. Figure 3 From the perspective of the light emitting device 10, the light emitting device 10 is located in the opening 021. The isolation column 20 is located on the side of the pixel definition layer 02 away from the substrate 00. The pixel definition layer 02 includes a base portion 024 and a recessed portion 025, and the base portion 024 and the recessed portion 025 are integrally formed; the base portion 024 and the opening 021 share a side wall; the recessed portion 025 includes a first bottom surface m3 and a second side surface m4 connected to each other, and the base portion 024 includes a second top surface m5 away from the side of the substrate 00. Along the direction e perpendicular to the plane where the substrate 00 is located, the vertical distance between the first bottom surface m3 and the substrate 00 is less than the vertical distance between the second top surface m5 and the substrate 00; the second side surface m4 connects the first bottom surface m3 and the second top surface m5. Among them, the isolation column 20 includes a second isolation column 20-2, and the second isolation column 20-2 is in contact with the first bottom surface m3. In this embodiment, the second isolation column 20-2 is set at a low-lying position of the pixel definition layer 02, so that the second isolation column 20-2 and the second side surface m4 of the recessed portion 025 can form a small angle, which can improve the deposition morphology of the inorganic packaging layer at the bottom position of the second isolation column 20-2, reduce the generation of cracks in the inorganic packaging layer at the bottom position, and improve the packaging reliability.

[0041] like Fig.11 As shown, along the direction e perpendicular to the plane where the substrate 00 is located, the height of the second side m4 is h2, the maximum thickness of the base portion 024 is h0, and 0.3μm≤h2≤h0. The height h2 of the second side m4 is equivalent to the depth of the depression 025. When h2 is less than h0, the pixel definition layer 02 can be manufactured using a grayscale mask process during the manufacture of the display panel to form the base portion 024 and the depression 025. In the embodiment of the present invention, the minimum h2 is set to 0.3μm, which is easy to implement in terms of process and reduces the process difficulty.

[0042] like Fig.11As shown, the angle formed by the second side m4 and the plane where the substrate 00 is located toward the inside of the recessed portion 025 is a third angle β, 10°≤β≤40°. Such a setting can ensure that a small angle can be formed between the second side m4 of the recessed portion 025 and the second isolation column 20-2, which can improve the deposition morphology of the inorganic encapsulation layer at the bottom of the second isolation column 20-2 and reduce the generation of cracks in the inorganic encapsulation layer at the bottom. Moreover, the size of β in this embodiment is easy to achieve in terms of process, and the manufacturing difficulty is low.

[0043] In the embodiment of the present invention, Figure 4 As shown, the light emitting device 10 includes a stacked first electrode 101, a light emitting layer 105, and a second electrode 102. The first electrode 101 is located on a side of the second electrode 102 close to the substrate 00. In some embodiments, Fig.12 A schematic cross-sectional view of another display panel provided by an embodiment of the present invention, Fig.12 The figure is only simplified and only illustrates the first electrode 101 in the light emitting device 10. Fig.12 As shown, the display panel includes a first metal structure, and the first metal structure 40 and the first electrode 102 are located in the same layer; along the direction e perpendicular to the plane where the substrate 00 is located, the second isolation column 20-2 at least partially overlaps with the first metal structure 40. Wherein, along the direction e perpendicular to the plane where the substrate 00 is located, the distance between the first bottom surface m3 and the first metal structure 40 is d3, and d3 ≥ 0.3 μm. When a metal structure is provided below the recessed portion 025, a certain distance is provided between the bottom of the recessed portion 025 and the metal structure, so that the metal structure is not exposed in the recessed portion 025, and the second isolation column 20-2 can be in contact with the recessed portion 025 of similar material, so as to ensure better adhesion between the two and a more reliable contact connection.

[0044] Figure 2 The top view of the display panel is shown. It can be understood that the top view direction of the display panel is the same as the projection direction onto the plane where the substrate is located. Therefore, the orthographic projection of the isolation column 20 on the substrate and the isolation column 20 in the top view coincide with each other. Figure 2 It can be seen that the orthographic projection of the isolation column 20 on the substrate surrounds the orthographic projection of the light emitting device 10 on the substrate. That is, the isolation column 20 surrounding the light emitting device 10 does not form a closed figure. Such a setting can ensure that the isolation column 20 does not completely isolate the second electrode 102, so that multiple second electrodes 102 of multiple light emitting devices 10 on the entire surface of the display panel are electrically connected.

[0045] In one embodiment, Fig.13 A partial schematic diagram of another display panel provided by an embodiment of the present invention, such as Fig.13As shown, the light-emitting device 10 includes a first light-emitting device 11, a second light-emitting device 12, and a third light-emitting device 13 of different colors. Along the direction surrounding the light-emitting device 10, the isolation column 20 is formed with at least one break K; at the position of two adjacent light-emitting devices 10, the break K is opposite to the isolation column 20 that at least partially surrounds the other light-emitting device 10. At the position of the break K, the organic functional layer will not be cut off, and the cathode layer formed by the second electrode will not be cut off. Setting the break K opposite to the isolation column 20 that at least partially surrounds the other light-emitting device 10 not only ensures that the second electrodes in the entire display area are connected to each other, but also increases the current transmission path in the organic functional layer, thereby improving the lateral leakage between the light-emitting devices 10.

[0046] In another embodiment, Fig.14 A partial schematic diagram of another display panel provided by an embodiment of the present invention, such as Fig.14 As shown, the light emitting device 10 includes a first light emitting device 11, a second light emitting device 12 and a third light emitting device 13 of different colors. Along the direction surrounding the light emitting device 10, the isolation column 20 is formed with at least one break K; at the position of two adjacent light emitting devices 10, the break K is opposite to the isolation column 20 that at least partially surrounds the other light emitting device 10.

[0047] In another embodiment, Fig.15 A partial schematic diagram of another display panel provided by an embodiment of the present invention, such as Fig.15 As shown, the light emitting device 10 includes a first light emitting device 11, a second light emitting device 12 and a third light emitting device 13 of different colors. Along the direction surrounding the light emitting device 10, the isolation column 20 is formed with at least one break K; at the position of two adjacent light emitting devices 10, the break K is opposite to the isolation column 20 that at least partially surrounds the other light emitting device 10.

[0048] In some embodiments, Fig.16 Another cross-sectional schematic diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Fig.16As shown, the display panel includes an inorganic encapsulation layer 03, and the inorganic encapsulation layer 03 covers the light emitting device 10 and the isolation column 20 on the side away from the substrate 00 to form a whole layer. The inorganic encapsulation layer 03 includes a first sub-portion 031, a second sub-portion 032, a third sub-portion 033 and a fourth sub-portion 034 connected in sequence, the first sub-portion 031 covers the top surface of the isolation column 20 on the side away from the substrate 00, the second sub-portion 032 covers the oblique edge 22, the third sub-portion covers the arc edge 23, and the fourth sub-portion 034 covers the pixel definition layer 02. Among them, the thickness of the first sub-portion 031 is d11, the thickness of the second sub-portion 032 is d12, the thickness of the third sub-portion 033 is d13, and the thickness of the fourth sub-portion 034 is d14. The thickness d11 of the first sub-portion 031 is equal to the thickness d14 of the fourth sub-portion 034, the thickness d12 of the second sub-portion 032 is less than the thickness d11 of the first sub-portion 031, and the thickness d13 of the third sub-portion 033 is greater than the thickness d11 of the first sub-portion 031. In the embodiment of the present invention, the inorganic encapsulation layer 03 is manufactured after the light-emitting device 10 is manufactured. The top surface of the isolation column 20 away from the substrate 00 is substantially parallel to the plane where the substrate 00 is located, and the plane where the pixel definition layer 02 is located is substantially parallel to the plane where the substrate 00 is located. The first sub-portion 031 covers the top surface of the isolation column 20 away from the substrate 00, and the fourth sub-portion 034 covers the pixel definition layer 02, so the thickness d11 of the first sub-portion 031 is equal to the thickness d14 of the fourth sub-portion 034. Since the hypotenuse 22 of the isolation column 20 is inclined relative to the plane where the substrate 00 is located, the thickness of the second sub-portion 032 covering the hypotenuse 22 is relatively small. The position of the arc-shaped edge 23 is equivalent to the superposition of the inorganic materials deposited horizontally and vertically, so the thickness d13 of the third sub-portion 033 at this position is the largest.

[0049] In the embodiment of the present invention, the material for making the spacer column 20 includes a negative photoresist material. The exposed part of the negative photoresist material is insoluble in the developer due to cross-linking and curing, while the unexposed part is soluble in the developer. The negative photoresist material can be used to make the spacer column 20 with a shape similar to an inverted trapezoid.

[0050] In the related art, the isolation columns are generally made of heat-sensitive photoresist materials, and there is a baking and heating step between the exposure and development processes. Because the light in the exposure process alone cannot make the photoresist material completely react and cure, a baking and heating process needs to be set up to allow the isolation columns to cure and form.

[0051] In the embodiment of the present invention, the negative photoresist material includes a photosensitive negative photoresist material. The photosensitive negative photoresist material is more sensitive to light. When the photosensitive negative photoresist material is used to make the isolation column 20, there is no need to set a baking process between the exposure and development processes. Then, adding an IUV process after the development process can repair the morphology of the isolation column 20 required in the embodiment of the present invention, and finally the morphology is fixed by high-temperature curing.

[0052] Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display panel, the manufacturing method comprising: manufacturing a light-emitting device and an isolation column on one side of a substrate, wherein the orthographic projection of the isolation column on the substrate is located between the orthographic projections of adjacent light-emitting devices on the substrate. Fig.17 A flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention, such as Fig.17 As shown, the method for making the isolation column includes: Step S101: coating a photoresist material 004, and forming a spacer column prototype 0-20 through exposure and development steps. Optionally, the coated photoresist material 004 is a photosensitive negative photoresist material. The spacer column prototype 0-20 is approximately inverted trapezoidal in shape.

[0053] Step S102: IUV light treatment is performed on the isolation column prototype 0-20 to obtain the isolation column prototype 1-20; IUV light refers to 365nm ultraviolet light. The photosensitive negative photoresist material is sensitive to IUV light, and IUV light causes the carboxyl group and the aldehyde group in the photosensitive negative photoresist to further react. During the reaction, the molecules are reorganized and gathered to form an arc edge at the bottom corner of the isolation column prototype 0-20. This step modifies the morphology of the isolation column prototype 0-20.

[0054] Step S103: The isolation column initial shape 1-20 is subjected to a curing treatment to obtain the isolation column 20. Optionally, the curing treatment temperature is 200°C to 300°C. After the curing treatment, the isolation column 20 has an arc-shaped edge 23; wherein the display panel has a first section M1, and the first section M1 is perpendicular to the plane where the substrate 00 is located; in the first section M1, the isolation column 20 includes a bottom edge 21, a hypotenuse 22 and an arc-shaped edge 23, the bottom edge 21 is the edge of the isolation column 20 close to the substrate 00, the arc-shaped edge 23 connects the bottom edge 21 and the hypotenuse 22, the angle formed between the hypotenuse 22 and the plane where the substrate 00 is located and facing the outside of the isolation column 20 is an acute angle, and the arc-shaped edge 23 is concave toward the inside of the isolation column 20.

[0055] According to the manufacturing method provided by the embodiment of the present invention, firstly, the isolation column prototype 0-20 is formed by an exposure and development process, and then the isolation column prototype 0-20 is subjected to IUV light treatment to obtain the isolation column prototype 1-20. The IUV light treatment can cause the photoresist material to further react. During the reaction, the molecules are reorganized and gathered to form an arc edge at the bottom corner of the isolation column prototype 0-20 to obtain the isolation column prototype 1-20. Finally, the isolation column 20 having an arc edge 23 at the bottom corner position is obtained by curing treatment. When manufacturing the inorganic encapsulation layer, the inorganic material can be well deposited and smoothly transitioned at the arc edge 23 of the isolation column 20, avoiding the problem of encapsulation voids and cracks at the bottom corner position of the isolation column 20, and can improve the reliability of display panel encapsulation.

[0056] In some embodiments, the IUV light treatment in step S102 not only modifies the morphology at the bottom corner of the isolation column prototype 0-20, but also modifies the morphology at the corner of the isolation column prototype 0-20 away from the substrate 00, so that an arc corner is formed at the corner. Fig.17 As shown, step S103 solidifies the isolation column initial form 1-20 to obtain the isolation column 20, and also includes: the isolation column 20 has an arc corner 24, and the corner of the isolation column 20 away from the substrate 00 in the first section M1 is an arc corner 24. The isolation column 20 obtained by the manufacturing method provided by the embodiment of the present invention has an arc edge 23 at the bottom corner position, and the corner away from the substrate 00 is an arc corner 24. The arc edge 23 can make the inorganic encapsulation layer well deposited at the bottom position of the isolation column 20, avoiding the problem of encapsulation voids and cracks at the bottom corner position of the isolation column 20. The arc corner 24 can facilitate the film formation and extension of the inorganic encapsulation layer on the hypotenuse 22. The coordination of the arc bottom angle and the arc corner 24 on the isolation column 20 can make the inorganic encapsulation layer form a complete layer, thereby improving the encapsulation reliability.

[0057] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Fig.18 A schematic diagram of a display device provided by an embodiment of the present invention is shown in FIG. Fig.18 As shown, the display device includes a display panel 100 provided by any embodiment of the present invention. The structure of the display panel has been described in the above embodiment and will not be repeated here. The display device provided by the embodiment of the present invention can be, for example, a mobile phone, a tablet, a computer, a television, a smart wearable product, and other electronic devices with display functions.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that: include: The substrate, the light emitting device and the isolation column are located on the same side of the substrate; The orthographic projection of the isolation column on the substrate is located between the orthographic projections of the adjacent light emitting devices on the substrate; The display panel has a first cross section, and the first cross section is perpendicular to the plane where the substrate is located; In the first cross section, the isolation column includes a bottom edge, a hypotenuse and an arc-shaped edge, the bottom edge is the edge of the isolation column close to the substrate, the arc-shaped edge connects the bottom edge and the hypotenuse, the angle formed between the hypotenuse and the plane where the substrate is located toward the outside of the isolation column is an acute angle, and the arc-shaped edge is recessed into the inside of the isolation column.

2. The display panel according to claim 1, characterized in that: The height of the arcuate edge along a direction perpendicular to the plane where the substrate is located is H1; the width of the arcuate edge along a first direction is W1, and the first direction is parallel to the plane where the substrate is located; Among them, 0.4≤H1 / W1≤2.

5.

3. The display panel according to claim 2, characterized in that: 0.2μm≤H1≤0.5μm, 0.2μm≤W1≤0.5μm.

4. The display panel according to claim 1, characterized in that: In the first cross section, along a first direction, the arcuate side does not exceed an end edge of the isolation column away from the substrate, and the first direction is parallel to a plane where the substrate is located.

5. The display panel according to claim 4, characterized in that: Along the first direction, the distance between the arc edge and the end edge of the isolation column away from the substrate is ΔW; Among them, △W≥h / (3 tanθ); h is the height of the isolation column along a direction perpendicular to the plane where the substrate is located, and θ is a first angle formed by the hypotenuse and the plane where the substrate is located toward the outside of the isolation column.

6. The display panel according to claim 1, characterized in that: The display panel comprises a pixel definition layer located at one side of the substrate, the pixel definition layer comprises a plurality of openings, and the light emitting device is located in the openings; the isolation column is located at a side of the pixel definition layer away from the substrate; The arc-shaped edge contacts a surface of the pixel definition layer that is away from the substrate.

7. The display panel according to claim 1, characterized in that: In the first cross section, a corner of the isolation column away from one end of the substrate is an arc-shaped corner.

8. The display panel according to claim 7, characterized in that: The height of the arc corner along a direction perpendicular to the plane where the substrate is located is H2; the width of the arc corner along a first direction is W2, and the first direction is parallel to the plane where the substrate is located; Among them, 0.5≤H2 / W2≤2.

9. The display panel according to claim 8, characterized in that: 0.5μm≤H2≤0.9μm, 0.5μm≤W2≤0.9μm.

10. The display panel according to claim 7, characterized in that: Along a direction perpendicular to the plane where the substrate is located, the height of the arc-shaped edge is H1, the height of the arc-shaped corner is H2, and H2>H1; And / or, along a first direction, the width of the arc-shaped edge is W1, the width of the arc-shaped corner is W2, W2>W1, and the first direction is parallel to the plane where the substrate is located.

11. The display panel according to claim 7, characterized in that: Along a direction perpendicular to the plane where the substrate is located, the height of the arc-shaped edge is H1, the height of the arc-shaped corner is H2, and the height of the isolation column is h; wherein h-H1-H2≥h / 3.

12. The display panel according to claim 1, characterized in that: An angle formed by the hypotenuse and the plane where the substrate is located and facing the outside of the isolation column is a first angle θ, wherein 45°≤θ≤75°.

13. The display panel according to claim 1, characterized in that: The display panel comprises a pixel definition layer located at one side of the substrate, the pixel definition layer comprises a plurality of openings, and the light emitting device is located in the openings; the isolation column is located at a side of the pixel definition layer away from the substrate; The pixel definition layer includes a base portion and a protruding portion, wherein the protruding portion protrudes from the base portion toward a side away from the substrate; the base portion and the opening share a side wall; in the first cross section, the edge of the base portion exceeds the protruding portion along a first direction, and the first direction is parallel to the plane where the substrate is located; along a direction perpendicular to the plane where the substrate is located, the isolation column and the protruding portion at least partially overlap; the protruding portion includes a first top surface and a first side surface connected to each other; in the first cross section, the angle formed by the first top surface and the first side surface toward the inside of the protruding portion is an obtuse angle; wherein, The isolation column includes a first isolation column, and the first isolation column is in contact with the first top surface.

14. The display panel according to claim 13, characterized in that: The base portion and the protruding portion are integrally formed.

15. The display panel according to claim 13, characterized in that: The base portion includes a light shielding material, and the protruding portion includes a transparent material.

16. The display panel according to claim 13, characterized in that: An angle formed by the first side surface and the plane where the substrate is located and directed toward the inside of the protrusion is a second angle α, and 10°≤α≤40°.

17. The display panel according to claim 13, characterized in that: Along a direction perpendicular to the plane where the substrate is located, a height of the first side surface is h1, and 0.3 μm≤h1≤0.6 μm.

18. The display panel according to claim 1, characterized in that: The display panel further comprises a support column and a pixel definition layer located on one side of the substrate, wherein the support column is located on a side of the pixel definition layer away from the substrate; The vertical distance between the surface of the support column away from the substrate and the substrate is d1, the vertical distance between the surface of the isolation column away from the substrate and the substrate is d2, and d1>d2.

19. The display panel according to claim 18, characterized in that: 0.3μm≤d1-d2≤0.6μm.

20. The display panel according to claim 1, characterized in that: The display panel comprises a pixel definition layer located at one side of the substrate, the pixel definition layer comprises a plurality of openings, and the light emitting device is located in the openings; the isolation column is located at a side of the pixel definition layer away from the substrate; The pixel definition layer includes a base portion and a recessed portion, the base portion and the recessed portion are integrally formed; the base portion and the opening share a side wall; the recessed portion includes a first bottom surface and a second side surface connected to each other, and the base portion includes a second top surface away from the substrate; along a direction perpendicular to the plane where the substrate is located, the vertical distance between the first bottom surface and the substrate is smaller than the vertical distance between the second top surface and the substrate; the second side surface connects the first bottom surface and the second top surface; wherein, The isolation column includes a second isolation column, and the second isolation column is in contact with the first bottom surface.

21. The display panel according to claim 20, characterized in that: Along a direction perpendicular to the plane where the substrate is located, the height of the second side surface is h2, the maximum thickness of the base portion is h0, and 0.3 μm≤h2≤h0.

22. The display panel according to claim 20, characterized in that: An angle formed by the second side surface and the plane where the substrate is located and facing the inside of the recessed portion is a third angle β, and 10°≤β≤40°.

23. The display panel according to claim 20, characterized in that: The light emitting device comprises a stacked first electrode, a light emitting layer and a second electrode, wherein the first electrode is located on a side of the second electrode close to the substrate; The display panel comprises a first metal structure, wherein the first metal structure and the first electrode are located in the same layer; along a direction perpendicular to the plane where the substrate is located, the second isolation column at least partially overlaps with the first metal structure; Wherein, along a direction perpendicular to the plane where the substrate is located, a distance between the first bottom surface and the first metal structure is d3, and d3≥0.3 μm.

24. The display panel according to claim 1, characterized in that: The material used to make the isolation column includes a negative photoresist material.

25. The display panel according to claim 24, characterized in that: The negative photoresist material includes a photosensitive negative photoresist material.

26. The display panel according to claim 1, characterized in that: The isolation column surrounds the orthographic projection of the light emitting device on the substrate on the orthographic projection portion of the substrate.

27. The display panel according to claim 26, characterized in that: The isolation column is formed with at least one break along a direction surrounding the light emitting device; At the positions of two adjacent light emitting devices, the break is opposite to the isolation column at least partially surrounding the other light emitting device.

28. The display panel according to claim 1, characterized in that: The display panel comprises a pixel definition layer located at one side of the substrate, the pixel definition layer comprises a plurality of openings, and the light emitting device is located in the openings; the isolation column is located at a side of the pixel definition layer away from the substrate; The light emitting device includes an organic functional layer, which is deposited in the opening and extends outside the opening; the display panel also includes an organic functional part, which covers the isolation column on a side of the isolation column away from the substrate; wherein, The organic functional portion and the organic functional layer are made of the same material, and are isolated from each other at the position of the isolation column.

29. The display panel according to claim 28, characterized in that: The display panel further comprises an inorganic encapsulation layer, wherein the inorganic encapsulation layer covers the light emitting device and the isolation column on a side of the light emitting device and the isolation column away from the substrate to form a whole layer; The inorganic encapsulation layer comprises a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion connected in sequence, wherein the first sub-portion covers the top surface of the isolation column away from the substrate, the second sub-portion covers the hypotenuse, the third sub-portion covers the arc-shaped edge, and the fourth sub-portion covers the pixel definition layer; The thickness of the first sub-section is equal to the thickness of the fourth sub-section, the thickness of the second sub-section is smaller than the thickness of the first sub-section, and the thickness of the third sub-section is larger than the thickness of the first sub-section.

30. The display panel according to claim 1, characterized in that: The light emitting device includes a first electrode and a second electrode, and at least two light emitting layers located between the first electrode and the second electrode, and a charge generation layer is disposed between adjacent light emitting layers.

31. A display device, characterized in that: A display panel comprising any one of claims 1 to 30.

32. A method for manufacturing a display panel, characterized in that: The manufacturing method comprises: manufacturing a light emitting device and an isolation column on one side of a substrate, wherein the orthographic projection of the isolation column on the substrate is located between the orthographic projections of adjacent light emitting devices on the substrate; the manufacturing method of the isolation column comprises: Applying photoresist material, and forming the isolation column prototype through exposure and development steps; Performing IUV light treatment on the isolation column prototype to obtain an isolation column prototype; The isolation column is cured to obtain the isolation column, wherein the isolation column has an arc-shaped edge; wherein the display panel has a first cross-section, and the first cross-section is perpendicular to the plane where the substrate is located; in the first cross-section, the isolation column includes a bottom edge, a hypotenuse and the arc-shaped edge, the bottom edge is the edge of the isolation column close to the substrate, the arc-shaped edge connects the bottom edge and the hypotenuse, the angle formed between the hypotenuse and the plane where the substrate is located toward the outside of the isolation column is an acute angle, and the arc-shaped edge is recessed toward the inside of the isolation column.

33. The method according to claim 32, characterized in that: The isolation column is obtained by curing the initial shape of the isolation column, and further includes: the isolation column has an arc-shaped corner, and the corner of the isolation column away from the end of the substrate in the first cross section is the arc-shaped corner.

34. The method according to claim 32, characterized in that: The method comprises coating a photoresist material and forming a prototype of an isolation column through exposure and development steps, including coating a photosensitive negative photoresist material.

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