Deslagging mechanism and scribing machine for semiconductor device processing

Abstract

The invention discloses a deslagging mechanism and a scribing machine for semiconductor device processing in the technical field of semiconductor processing, and the deslagging mechanism comprises a deslagging seat and a mounting rack, the deslagging seat is fixedly mounted at the bottom of the mounting rack, an inclined seat is fixedly mounted in the deslagging seat, an upper threaded rod is rotatably mounted at the upper end of the mounting rack, and the upper threaded rod is in threaded connection with a sliding seat; movable frames are slidably connected to the two sides of the sliding seat, a bearing plate is fixedly mounted at the lower ends of the movable frames, a plurality of water seepage holes are formed in the bearing plate, an upper connecting hose is fixedly mounted on the sliding seat, an upper connecting pipe is fixedly mounted at the lower end of the upper connecting hose, and a plurality of lower connecting pipes are fixedly mounted on the lower surface of the upper connecting pipe; left spraying pieces are fixedly installed on the left sides of the lower surfaces of the lower connecting pipes, and right spraying pieces are fixedly installed on the right sides of the lower connecting pipes. Through cooperation of the sliding seat, the left spraying part and the right spraying part, the cutting position can be cooled in time, and cutting waste residues can be automatically collected.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a slag removal mechanism and a dicing machine for processing semiconductor devices. Background Art

[0002] The grinding wheel dicing machine is a precision CNC equipment that integrates water-gas-electric, air-static high-speed spindle, precision mechanical transmission, sensor and automatic control technologies. It is mainly used for dicing and cutting materials such as silicon integrated circuits, light-emitting diodes, lithium niobate, piezoelectric ceramics, gallium arsenide, sapphire, aluminum oxide, iron oxide, quartz, glass, ceramics, solar cells, etc. The grinding wheel dicing machine is also called precision grinding wheel cutting machine in China.

[0003] The laser scribing machine uses a high-energy laser beam to irradiate the surface of the workpiece, causing the irradiated area to melt and vaporize locally, thereby achieving the purpose of scribing. Because the laser is focused by a special optical system to become a very small light spot, the energy density is high. Because the processing is non-contact, there is no mechanical impact on the workpiece itself, and the workpiece is not easy to deform. The heat effect is extremely small and the scribing accuracy is high. It is widely used in the cutting and scribing of solar panels and thin metal sheets.

[0004] The grinding wheel dicing machine lacks cooling and cleaning devices to clean the silicon powder generated in the wafer dicing grooves and on the wafer surface. The silicon powder generated during wafer dicing will be scattered and accumulated on the wafer surface. When the grinding wheel dicing device changes the dicing track, it will rub against the scattered and accumulated silicon powder for a second dicing, causing the grinding wheel dicing to wear faster and reduce accuracy. The dicing cut of the wafer will also become rough and have small gaps, affecting the dicing quality. The laser energy of laser dicing is focused on the dicing surface, causing the dicing surface to heat up. Existing dicing equipment lacks equipment to quickly cool down the dicing blade. Summary of the invention

[0005] The technical problem of the present invention is to provide a slag discharge mechanism and a dicing machine for processing semiconductor devices, so as to provide a dicing machine that can cool down the cutting position in time and automatically collect the cutting waste.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a slag discharge mechanism and a dicing machine for semiconductor device processing, comprising a slag discharge seat and a mounting frame, wherein an inclined seat is fixedly installed in the slag discharge seat, a lower suction pipe is fixedly installed on one side of the slag discharge seat and at a position corresponding to the lower end of the inclined seat, lower threaded rods are rotatably installed on both sides of the slag discharge seat, scrapers are threadedly connected between the lower threaded rods, one end of the lower threaded rod extends to the outside of the slag discharge seat, and a collecting piece is fixedly installed on the lower surface of one end of the slag discharge seat close to the lower suction pipe.

[0007] As a further solution of the present invention, a moving gear is fixedly installed on one end of the lower threaded rod away from the lower suction pipe, a transmission chain is connected to the outer sleeve of the moving gear, a limiting gear is fixedly installed on one side of the moving gear, and a side gear is rotatably installed on one side of the slag discharge seat, and the side gear is meshed with the limiting gear.

[0008] As a further scheme of the present invention, the slag discharge seat is fixedly installed at the bottom of the mounting frame, the upper end of the mounting frame is rotatably installed with an upper threaded rod, the upper threaded rod is threadedly connected with a sliding seat, and both sides of the sliding seat are slidably connected with a movable frame, and the lower end of the movable frame is fixedly installed with a bearing plate, and a plurality of water seepage holes are opened on the bearing plate. The upper connecting hose is fixedly installed on the sliding seat, and an upper connecting pipe is fixedly installed on the lower end of the upper connecting hose, and a plurality of lower connecting pipes are fixedly installed on the lower surface of the upper connecting pipe, and a left spray piece is fixedly installed on the left side of the lower surface of the lower connecting pipe, and a right spray piece is fixedly installed on the right side of the lower connecting pipe, and a clamping device is arranged between the lower ends of the movable frames, and the clamping device can automatically detect the length of the semiconductor device, and a storage tank is fixedly installed on one side of the mounting frame, and the end of the lower suction pipe away from the slag discharge seat is fixedly connected to the lower end of the storage tank, and one end of the upper connecting hose is fixedly installed on the upper end of the storage tank.

[0009] As a further solution of the present invention, the clamping device includes a movable threaded member, which is rotatably installed on the lower end of the movable frame. The internal thread of the movable threaded member is connected to a clamping threaded rod, one end of the clamping threaded rod is fixedly installed with a clamping plate, and one end of the clamping plate and the side away from the clamping threaded rod is fixedly installed with a distance sensor.

[0010] As a further solution of the present invention, an upper gear is fixedly installed on the movable threaded member, a linkage rod is rotatably installed on the lower end of the supporting plate, lower gears are fixedly installed on both ends of the linkage rod, and the lower gears are meshed with the upper gears.

[0011] As a further solution of the present invention, a loading transmission member is arranged on the left side of the mounting frame, a unloading transmission member is arranged on the side of the mounting frame away from the loading transmission member, a side mounting plate is fixedly installed on the side of the mounting frame away from the unloading transmission member and corresponding to the position of the unloading transmission member, a side threaded member is rotatably installed on the side mounting plate, a pushing threaded rod is connected to the internal thread of the side threaded member, a pushing frame is fixedly installed on one end of the pushing threaded rod close to the unloading transmission member, a driven gear is fixedly installed on the side threaded member, a driving gear is fixedly installed on the side mounting plate, and the driving gear is meshed with the driven gear.

[0012] As a further solution of the present invention, a main transmission member is provided at one end of the upper threaded rod, a second gear is fixedly installed on one side of the upper threaded rod, a first gear is rotatably installed on the mounting frame, the first gear is meshed with the second gear, a rotating motor is provided on the mounting frame, the output end of the rotating motor is fixedly connected to the first gear, a speed sensor is provided on one side of the first gear, a positioning seat is fixedly installed on the mounting frame close to one side of the storage tank and corresponding to the position between the loading transmission member and the unloading transmission member, an internal threaded rod is rotatably installed in the positioning seat, the internal threaded rod is connected to a moving seat with its internal threads, and a laser cutting member is fixedly installed on the moving seat.

[0013] As a further solution of the present invention, a plurality of groups of movable threaded rods are fixedly installed on the upper surface of the sliding seat, and transmission gears are rotatably installed at positions on the movable frame corresponding to the movable threaded rods. The transmission gears are meshed with each other and threadedly connected with the movable threaded rods. A driving gear is rotatably installed on the movable frame, and the driving gear is meshed with the transmission gear on one side.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the semiconductor device is arranged on the upper surface of the carrier plate, and the upper threaded rod drives the sliding seat to move toward the position of the laser cutting equipment. As the sliding seat moves, the semiconductor device is driven to gradually pass through the laser cutting equipment, so that the laser cutting equipment slices the semiconductor device. During the cutting process, the upper connecting hose guides the water in the storage tank into the upper connecting tube, and then enters the lower connecting tube from the upper connecting tube, and then sprays out through the left spray piece and the right spray piece at the lower end of the lower connecting tube, and sprays on the cutting surface of the semiconductor device through the left spray piece and the right spray piece, so that the cutting debris of the semiconductor device falls into the inside of the slag discharge seat with the water through the carrier plate, and at the same time, the cutting surface of the semiconductor device is cooled by spraying water to avoid damage to the dicing due to untimely heat dissipation at the semiconductor cutting position.

[0015] 2. In the present invention, the cut pieces automatically fall into the slag discharge seat, and the pieces move along the inclined seat toward the suction pipe, and the lower threaded rod continuously rotates forward and reversely to drive the scraper to move back and forth on the surface of the inclined seat, thereby pushing the pieces into the collecting piece through the scraper, automatically collecting the cut pieces, and the cut pieces automatically fall into the collecting piece, and the cleaned water can be recycled under the action of the lower suction pipe, thereby improving the utilization rate of water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 for Figure 1 A partial schematic diagram of the structure at A in the middle; Figure 3 for Figure 1 A partial schematic diagram of the structure at B in the middle; Figure 4 This is a schematic diagram of the structure of the present invention from a rear side perspective; Figure 5 for Figure 4 A partial schematic diagram of the structure at C in the middle; Figure 6 It is a structural cross-sectional view of the present invention; Figure 7 for Figure 6 A partial schematic diagram of the structure at D in the middle; Figure 8 for Figure 6 Partial schematic diagram of the structure at E in the middle.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Mounting frame; 2. Slag discharge seat; 3. Lower threaded rod; 4. Side gear; 5. Tilt seat; 6. Limit gear; 7. Transmission chain; 8. Push threaded rod; 9. Driving gear; 10. Driven gear; 11. Side threaded member; 12. Upper threaded rod; 13. Loading transmission member; 14. Unloading transmission member; 15. Upper connecting hose; 16. Movable threaded rod; 17. Sliding seat; 18. Loading plate; 19. Water seepage hole; 20. Clamping plate; 21. Distance sensor; 22. Movable frame; 23. Lower connecting pipe; 24. Right spray part; 25, left spray part; 26, upper connecting pipe; 27, transmission gear; 28, driving gear; 29, side mounting plate; 30, lower gear; 31, upper gear; 32, movable threaded part; 33, clamping threaded rod; 34, first gear; 35, second gear; 36, main transmission part; 37, push rack; 38, storage tank; 39, lower suction pipe; 40, collecting part; 41, moving seat; 42, laser cutting part; 43, positioning seat; 44, internal threaded rod; 45, moving gear; 46, scraper. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-Figure 8 The present invention provides a technical solution: a slag discharge mechanism and a dicing machine for processing semiconductor devices, comprising a slag discharge seat 2 and a mounting frame 1, wherein an inclined seat 5 is fixedly installed inside the slag discharge seat 2, a lower suction pipe 39 is fixedly installed on one side of the slag discharge seat 2 and at a position corresponding to the lower end of the inclined seat 5, lower threaded rods 3 are rotatably installed on both sides of the slag discharge seat 2, scrapers 46 are threadedly connected between the lower threaded rods 3, one end of the lower threaded rods 3 extends to the outside of the slag discharge seat 2, and a collecting piece 40 is fixedly installed on the lower surface of one end of the slag discharge seat 2 close to the lower suction pipe 39.

[0021] During operation, the cut debris in the present invention automatically falls into the slag discharge seat 2, and the debris moves along the inclined seat 5 toward the suction pipe, and the lower threaded rod 3 continuously rotates forward and reverse to drive the scraper 46 to reciprocate on the surface of the inclined seat 5 (the bidirectional motor drives the side gear 4 to rotate, and the rotation of the side gear 4 drives the limit gear 6 meshing with it to rotate, and the rotation of the limit gear 6 drives one side of the threaded rod to rotate, and the movement gear 45 and the transmission chain 7 cooperate to drive the threaded rods on both sides to rotate, and the threaded rods rotate and interact with the scraper 46, thereby driving the scraper 46 to slide on the surface of the inclined seat 5), so that the scraper 46 pushes the debris into the collecting piece 40, automatically collects the cut debris, and automatically falls into the collecting piece 40, and the cleaned water can be recycled under the action of the lower suction pipe 39, thereby improving the utilization rate of water resources.

[0022] As a further solution of the present invention, a moving gear 45 is fixedly installed on one end of the lower threaded rod 3 away from the lower suction pipe 39, and a transmission chain 7 is connected to the outer sleeve of the moving gear 45. A limiting gear 6 is fixedly installed on one side of the moving gear 45, and a side gear 4 is rotatably installed on one side of the slag discharge seat 2, and the side gear 4 is meshed with the limiting gear 6.

[0023] During operation, the bidirectional motor drives the side gear 4 to rotate, and the rotation of the side gear 4 drives the limit gear 6 meshing with it to rotate. The rotation of the limit gear 6 drives the threaded rod on one side to rotate, and the moving gear 45 and the transmission chain 7 cooperate to drive the threaded rods on both sides to rotate. The rotation of the threaded rod interacts with the scraper 46, thereby driving the scraper 46 to slide on the surface of the tilting seat 5.

[0024] As a further solution of the present invention, the slag discharge seat 2 is fixedly installed at the bottom of the mounting frame 1, and the upper end of the mounting frame 1 is rotatably installed with an upper threaded rod 12, and a sliding seat 17 is threadedly connected to the upper threaded rod 12. Both sides of the sliding seat 17 are slidably connected with a movable frame 22, and a bearing plate 18 is fixedly installed at the lower end of the movable frame 22. A plurality of water seepage holes 19 are opened on the bearing plate 18, and an upper connecting hose 15 is fixedly installed on the sliding seat 17. An upper connecting pipe 26 is fixedly installed at the lower end of the upper connecting hose 15. A plurality of lower connecting tubes 23 are fixedly installed on the lower surface, a left spray component 25 is fixedly installed on the left side of the lower surface of the lower connecting tube 23, a right spray component 24 is fixedly installed on the right side of the lower connecting tube 23, a clamping device is arranged between the lower ends of the movable frames 22, the clamping device can automatically detect the length of the semiconductor device, a storage tank 38 is fixedly installed on one side of the mounting frame 1, one end of the lower suction pipe 39 away from the slag discharge seat 2 is fixedly connected to the lower end of the storage tank 38, and one end of the upper connecting hose 15 is fixedly installed on the upper end of the storage tank 38.

[0025] During operation, the semiconductor device of the present invention is arranged on the upper surface of the carrier plate 18 (the movable frame 22 can move up and down to adjust the spacing between the carrier plate 18 and the sliding seat 17, so that the carrier plate 18 can be positioned according to the height of the semiconductor device, and the driving gear 28 rotates to drive the transmission gear 27 engaged therewith to rotate, and the transmission gear 27 rotates to interact with the movable threaded rod 16, thereby driving the movable frame 22 to interact with the movable threaded rod 16, thereby adjusting the longitudinal position of the carrier plate 18). After the semiconductor device is fixed on the carrier plate 18, the upper threaded rod 12 is driven to move by rotating the sliding seat 17 (the motor drives the first gear 34 to rotate, the first gear 34 rotates to drive the second gear 35 engaged therewith to rotate, the second gear 35 rotates to drive the upper threaded rod 12 on one side to rotate, and the upper threaded rod 12 is driven to rotate at the same time by the main transmission member 36, and the upper threaded rod 12 is driven to rotate at the same time. The rod 12 interacts with the sliding seat 17 to drive the sliding seat 17 to move), driving the sliding seat 17 to move toward the position of the laser cutting equipment. As the sliding seat 17 moves, the semiconductor device is gradually driven through the laser cutting equipment, so that the laser cutting equipment slices the semiconductor device. During the cutting process, the upper connecting hose 15 guides the water in the storage tank 38 into the upper connecting pipe 26, and then enters the lower connecting pipe 23 from the upper connecting pipe 26, and then sprays out through the left spray piece 25 and the right spray piece 24 at the lower end of the lower connecting pipe 23, and is sprayed on the cutting surface of the semiconductor device through the left spray piece 25 and the right spray piece 24, so that the cutting debris of the semiconductor device falls into the slag discharge seat 2 with the water through the supporting plate 18, and at the same time, the cutting surface of the semiconductor device is cooled by spraying water to avoid damage to the dicing due to untimely heat dissipation at the semiconductor cutting position.

[0026] As a further solution of the present invention, the clamping device includes a movable threaded member 32, which is rotatably installed at the lower end of the movable frame 22. The movable threaded member 32 is internally threadedly connected to a clamping threaded rod 33, one end of the clamping threaded rod 33 is fixedly installed with a clamping plate 20, and one end of the clamping plate 20 and on a side away from the clamping threaded rod 33 is fixedly installed with a distance sensor 21.

[0027] During operation, the movable threaded member 32 rotates and interacts with the clamping threaded rod 33, thereby driving the clamping threaded rod 33 to approach each other, and the clamping plates 20 are driven to approach each other by the clamping threaded rod 33, so that the clamping plates 20 clamp the semiconductor device. The distance sensor 21 on the clamping plates 20 detects the distance between the clamping plates 20 on both sides, thereby obtaining the length of the semiconductor device to be cut, and transmitting the obtained data to the control main board. The control main board analyzes the length data to control the start of the laser cutting member 42.

[0028] As a further solution of the present invention, an upper gear 31 is fixedly mounted on the movable threaded member 32 , a linkage rod is rotatably mounted on the lower end of the carrier plate 18 , and lower gears 30 are fixedly mounted on both ends of the linkage rod, and the lower gear 30 meshes with the upper gear 31 .

[0029] During operation, the motor drives the lower gear 30 to rotate, and the rotation of the lower gear 30 drives the upper gear 31 meshing therewith to rotate, and the upper gear 31 rotates the movable screw member 32 to rotate.

[0030] As a further solution of the present invention, a loading transmission member 13 is provided on the left side of the mounting frame 1, and a unloading transmission member 14 is provided on the side of the mounting frame 1 away from the loading transmission member 13, and a side mounting plate 29 is fixedly installed on the side of the mounting frame 1 away from the unloading transmission member 14 and corresponding to the position of the unloading transmission member 14, a side threaded member 11 is rotatably installed on the side mounting plate 29, and a pushing threaded rod 8 is connected to the inner thread of the side threaded member 11, and a pushing frame 37 is fixedly installed on the end of the pushing threaded rod 8 close to the unloading transmission member 14, a driven gear 10 is fixedly installed on the side threaded member 11, and a driving gear 9 is fixedly installed on the side mounting plate 29, and the driving gear 9 is meshed with the driven gear 10.

[0031] During operation, the semiconductor device is transported to the carrier plate 18 through the loading transmission member 13, and then the sliding seat 17 moves the semiconductor device on the carrier plate 18 to the position of the laser cutting member 42. After the laser cutting member 42 is raised to cut it, the sliding seat 17 continues to move toward the unloading transmission member 14. When the carrier plate 18 moves to the position of the unloading transmission member 14, the driving gear 9 rotates to drive the driven gear 10 to rotate, and the driven gear 10 rotates to drive the side thread member 11 to rotate. The rotation of the side thread member 11 interacts with the pushing thread member to drive the pushing rack 37 to move toward the carrier plate 18, and then the cut slices are driven by the pushing rack 37 to move toward the unloading transmission member 14, thereby avoiding the trouble of manual loading and unloading, improving processing efficiency and reducing labor requirements.

[0032] As a further solution of the present invention, a main transmission member 36 is provided at one end of the upper threaded rod 12, a second gear 35 is fixedly installed on one side of the upper threaded rod 12, a first gear 34 is rotatably installed on the mounting frame 1, the first gear 34 is meshed with the second gear 35, a rotating motor is provided on the mounting frame 1, the output end of the rotating motor is fixedly connected to the first gear 34, a speed sensor is provided on one side of the first gear 34, a positioning seat 43 is fixedly installed on the side of the mounting frame 1 close to the storage tank 38 and corresponding to the position between the loading transmission member 13 and the unloading transmission member 14, an internal threaded rod 44 is rotatably installed in the positioning seat 43, the internal threaded rod 44 is internally threadedly connected to a moving seat 41, and a laser cutting member 42 is fixedly installed on the moving seat 41.

[0033] During operation, the internal threaded rod 44 rotates and interacts with the moving seat 41 , thereby driving the moving seat 41 to move on the internal threaded rod 44 , thereby driving the laser cutting member 42 to move up and down, so that the laser cutting member 42 cuts the semiconductor device.

[0034] As a further solution of the present invention, a plurality of sets of movable threaded rods 16 are fixedly installed on the upper surface of the sliding seat 17, and transmission gears 27 are rotatably installed at the positions corresponding to the movable threaded rods 16 on the movable frame 22. The transmission gears 27 are meshed with each other and threadedly connected with the movable threaded rods 16. A driving gear 28 is rotatably installed on the movable frame 22, and the driving gear 28 is meshed with a transmission gear 27 on one side.

[0035] During operation, the movable frame 22 can move up and down to adjust the distance between the supporting plate 18 and the sliding seat 17, so that the supporting plate 18 can be changed in position according to the height of the semiconductor device. The driving gear 28 rotates to drive the transmission gear 27 engaged therewith to rotate, and the transmission gear 27 rotates to interact with the movable threaded rod 16, thereby driving the movable frame 22 to interact with the movable threaded rod 16, thereby adjusting the longitudinal position of the supporting plate 18.

Claims

1. A slag removal mechanism and a dicing machine for semiconductor device processing, comprising a slag removal seat (2) and a mounting frame (1), characterized in that: An inclined seat (5) is fixedly installed inside the slag discharge seat (2); a lower suction pipe (39) is fixedly installed on one side of the slag discharge seat (2) and at a position corresponding to the lower end of the inclined seat (5); lower threaded rods (3) are rotatably installed on both sides of the slag discharge seat (2); a scraper (46) is threadedly connected between the lower threaded rods (3); one end of the lower threaded rod (3) extends to the outside of the slag discharge seat (2); and a collecting piece (40) is fixedly installed on the lower surface of one end of the slag discharge seat (2) close to the lower suction pipe (39).

2. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 1, characterized in that: A moving gear (45) is fixedly mounted on one end of the lower threaded rod (3) away from the lower suction pipe (39), a transmission chain (7) is connected to the outer shell of the moving gear (45), a limit gear (6) is fixedly mounted on one side of the moving gear (45), and a side gear (4) is rotatably mounted on one side of the slag discharge seat (2), and the side gear (4) is meshed with the limit gear (6).

3. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 2, characterized in that: The slag discharge seat (2) is fixedly mounted on the bottom of the mounting frame (1); an upper threaded rod (12) is rotatably mounted on the upper end of the mounting frame (1); a sliding seat (17) is threadedly connected to the upper threaded rod (12); both sides of the sliding seat (17) are slidably connected to movable frames (22); a bearing plate (18) is fixedly mounted on the lower end of the movable frame (22); a plurality of water seepage holes (19) are provided on the bearing plate (18); an upper connecting hose (15) is fixedly mounted on the sliding seat (17); an upper connecting pipe (26) is fixedly mounted on the lower end of the upper connecting hose (15); and a lower surface of the upper connecting pipe (26) is provided. A plurality of lower connecting tubes (23) are fixedly mounted on the surface, a left spraying member (25) is fixedly mounted on the left side of the lower surface of each of the lower connecting tubes (23), a right spraying member (24) is fixedly mounted on the right side of the lower connecting tube (23), a clamping device is arranged between the lower ends of the movable frame (22), and the clamping device can automatically detect the length of the semiconductor device, a storage tank (38) is fixedly mounted on one side of the mounting frame (1), one end of the lower suction pipe (39) away from the slag discharge seat (2) is fixedly connected to the lower end of the storage tank (38), and one end of the upper connecting hose (15) is fixedly mounted on the upper end of the storage tank (38).

4. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 3, characterized in that: The clamping device comprises a movable threaded member (32), each of the movable threaded members (32) being rotatably mounted on the lower end of the movable frame (22), the movable threaded member (32) being internally threadedly connected to a clamping threaded rod (33), one end of the clamping threaded rod (33) being fixedly mounted with a clamping plate (20), and one end of the clamping plate (20) being fixedly mounted with a distance sensor (21) on a side away from the clamping threaded rod (33).

5. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 4, characterized in that: An upper gear (31) is fixedly mounted on each of the movable threaded members (32), a linkage rod is rotatably mounted on the lower end of the carrier plate (18), and lower gears (30) are fixedly mounted on both ends of the linkage rod, and the lower gear (30) meshes with the upper gear (31).

6. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 5, characterized in that: A loading transmission member (13) is arranged on the left side of the mounting frame (1), and a discharging transmission member (14) is arranged on the side of the mounting frame (1) away from the loading transmission member (13). A side mounting plate (29) is fixedly mounted on the side of the mounting frame (1) away from the discharging transmission member (14) and corresponding to the position of the discharging transmission member (14). A side threaded member (11) is rotatably mounted on the side mounting plate (29), and a pusher threaded rod (8) is internally threadedly connected to the side threaded member (11). A pusher frame (37) is fixedly mounted on one end of the pusher threaded rod (8) close to the discharging transmission member (14), and a driven gear (10) is fixedly mounted on the side threaded member (11). A driving gear (9) is fixedly mounted on the side mounting plate (29), and the driving gear (9) meshes with the driven gear (10).

7. A slag removal mechanism and a dicing machine for semiconductor device processing according to claim 6, characterized in that: A main transmission member (36) is provided at one end of the upper threaded rod (12), a second gear (35) is fixedly mounted on one side of the upper threaded rod (12), a first gear (34) is rotatably mounted on the mounting frame (1), the first gear (34) meshing with the second gear (35), a rotating motor is provided on the mounting frame (1), an output end of the rotating motor is fixedly connected to the first gear (34), a rotation speed sensor is provided on one side of the first gear (34), a positioning seat (43) is fixedly mounted on one side of the mounting frame (1) close to the storage tank (38) and corresponding to a position between the loading transmission member (13) and the unloading transmission member (14), an internal threaded rod (44) is rotatably mounted in the positioning seat (43), the internal threaded rod (44) is internally threadedly connected to a moving seat (41), and a laser cutting member (42) is fixedly mounted on the moving seat (41).

8. The slag removal mechanism and the dicing machine for semiconductor device processing according to claim 7, characterized in that: A plurality of groups of movable threaded rods (16) are fixedly mounted on the upper surface of the sliding seat (17); transmission gears (27) are rotatably mounted at positions on the movable frame (22) corresponding to the movable threaded rods (16); the transmission gears (27) are meshed with each other and are threadedly connected to the movable threaded rods (16); a driving gear (28) is rotatably mounted on the movable frame (22); the driving gear (28) is meshed with the transmission gear (27) on one side.

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