Glue pouring forming method and glue pouring jig

Abstract

The invention relates to the technical field of injection molding, and particularly discloses a glue pouring forming method and a glue pouring jig.The glue pouring forming method comprises the steps that a flexible bonding base material is cut, and a target bonding piece with set contour features is obtained; the workpiece is assembled in an assembling cavity of the glue pouring jig; attaching the target bonding piece to a set position on the workpiece; the pressing piece is pressed above the target bonding piece, and the pressing piece, the target bonding piece, the workpiece and the glue pouring jig define a set glue pouring space; and injecting glue into the set glue filling space, and curing the glue to form a set glue structure on the workpiece. According to the glue pouring forming method, a complex flexible mold core structure is omitted, the structure for assembling the glue pouring space is simpler and convenient to operate, a target bonding piece does not need to be subjected to injection molding through a mold, the flexible bonding base material only needs to be cut into set contour features according to the set glue structure shape, the production period is short, and the cost is low.

Description

Technical Field

[0001] The present application relates to the technical field of injection molding, and in particular to a glue pouring molding method and a glue pouring jig. Background Art

[0002] Low-pressure injection molding technology is used in mobile phone manufacturing to form a flexible mold core on the workpiece to be injected, usually made of LSR (Liquid Silicone Rubber), so as to improve the relevant performance of the workpiece. In the existing flexible mold core processing, a dedicated injection mold is required for molding. Once the flexible mold core structure needs to be changed, the relevant structure of the injection mold must be changed, which is time-consuming and costly.

[0003] Therefore, how to improve the processing efficiency of flexible mold core structure design changes is a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of this, the present application provides a glue pouring molding method and a glue pouring jig to improve the processing efficiency of the flexible mold core design change.

[0005] An embodiment of the present application provides a glue potting molding method, which includes: cutting a flexible adhesive substrate to obtain a target adhesive part with set contour features; assembling a workpiece into an assembly cavity of a glue potting jig; attaching the target adhesive part to a set position on the workpiece; pressing a clamping part on top of the target adhesive part, and the clamping part, the target adhesive part, the workpiece and the glue potting jig are enclosed to form a set glue potting space; injecting glue into the set glue potting space, and curing the glue to form a set colloid structure on the workpiece.

[0006] In the above-mentioned glue injection molding method, a set glue injection space is formed by enclosing a clamping member, a target adhesive member, a workpiece and a glue injection jig, and glue is injected into the set glue injection space for curing to form a set colloid structure on the workpiece. On the one hand, the complex production of flexible molds is omitted, and the structure of the glue injection space is simpler and easy to operate; on the other hand, the target adhesive member does not need to be molded for injection molding, and only needs to cut the flexible adhesive substrate into the set contour features according to the set colloid structure shape. The production cycle is short, the flexibility is high, and the production cost is low, thereby improving the processing efficiency of the flexible mold design change.

[0007] In some embodiments of the present application, a flexible adhesive substrate is cut to obtain a target adhesive part having set contour features, including: attaching a base film to the bottom adhesive side of the flexible adhesive substrate; and laser cutting the flexible adhesive substrate according to a projection shape of a set colloid structure on the flexible adhesive substrate to obtain the target adhesive part.

[0008] In the above embodiment, by attaching a base film to the bottom adhesive side of the flexible adhesive substrate before cutting the flexible adhesive substrate, the risk of the bottom adhesive side of the flexible adhesive substrate being contaminated with pollutants such as dust and debris, resulting in a decrease in the viscosity of the flexible adhesive base adhesive side and being unable to be stably attached to the workpiece, can be reduced.

[0009] In some embodiments of the present application, the step of laser cutting a flexible adhesive substrate to obtain a target adhesive component includes: setting the working power of a carbon dioxide laser cutting machine to a set power, cutting the flexible adhesive substrate, and obtaining a target adhesive component; wherein the set power has a value range of 50W to 70W; the flexible adhesive substrate includes a stacked top adhesive layer, a substrate layer, and a bottom adhesive layer; the material of the substrate layer is a thermoplastic polyester material, a foam material, or a non-woven fabric material; the material of the top adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material, or an acrylic pressure-sensitive adhesive material; the material of the bottom adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material, or an acrylic pressure-sensitive adhesive material.

[0010] In the above embodiment, by setting the working power of the carbon dioxide laser cutting machine to the set power, it helps to ensure that the carbon dioxide laser cutting machine accurately cuts the flexible adhesive substrate, and reduces the risk of the flexible adhesive substrate being burned due to excessive working power of the carbon dioxide laser cutting machine, or the risk of the flexible adhesive substrate being unable to be cut due to too low working power of the carbon dioxide laser cutting machine.

[0011] In some embodiments of the present application, after the flexible adhesive substrate is laser cut to obtain the target adhesive component, the glue potting molding method further includes: detecting whether the current contour of the target adhesive component is consistent with the set contour feature.

[0012] In the above embodiment, if it is detected that the current contour of the target adhesive is inconsistent with the set contour, it means that the target adhesive does not meet the requirements and needs to be recut or replaced. Therefore, by detecting whether the current contour of the target adhesive is consistent with the set contour feature, the technician can check in advance whether the target adhesive has defects that meet the requirements, so as to ensure that the set colloid structure formed by the subsequent glue curing meets the setting, and then ensure the sealing of the set glue filling space, reducing the risk of glue leakage during the subsequent glue injection.

[0013] In some embodiments of the present application, after laser cutting the flexible adhesive substrate to obtain the target adhesive component, the glue potting molding method further includes: attaching a protective film to the top adhesive side of the target adhesive component; wherein the protective film completely covers the target adhesive component.

[0014] In the above embodiment, by attaching a protective film to the top glue side of the target adhesive, the target adhesive can be protected, thereby reducing the risk of scratching the target adhesive due to repeated handling of the target adhesive, thereby ensuring the sealing of the set glue filling space and preventing glue leakage when injecting glue into the set glue filling space.

[0015] In some embodiments of the present application, after the protective film is attached to the top glue side of the target adhesive component, the glue potting molding method also includes: opening a positioning hole on the protective film according to the position of the positioning part in the glue potting jig to position the target adhesive component at a set position on the workpiece.

[0016] In the above embodiment, when attaching the target adhesive to the set position on the workpiece, the user only needs to insert the positioning piece in the glue injection jig into the corresponding positioning hole to achieve the positioning of the target adhesive. The setting of the positioning hole can not only ensure the accurate alignment of the target adhesive and the workpiece, but also improve the assembly efficiency of the target adhesive. In some embodiments of the present application, after the target adhesive component is attached to a set position on the workpiece, the glue potting molding method further includes: tearing off a protective film from the target adhesive component.

[0017] In the above embodiment, after the target adhesive is attached to the set position on the workpiece, the technician needs to tear off the protective film from the target adhesive. In this way, it can not only prevent the protective film from blocking the injection of glue into the set glue injection space, but also reduce the risk of impurities in the set colloid structure after solidification due to melting or breaking of the protective film when in contact with the glue, thereby improving the quality of the set colloid structure formed on the workpiece.

[0018] In some embodiments of the present application, before assembling the workpiece onto the glue potting jig, the glue potting molding method further includes: spraying silicone oil onto the workpiece placement area of ​​the glue potting jig.

[0019] In the above embodiment, before assembling the workpiece onto the glue potting jig, by spraying silicone oil on the workpiece placement area of ​​the glue potting jig, the risk of adhesion between the workpiece and the glue potting jig can be reduced, which is conducive to removing the workpiece with a set colloid structure from the glue potting jig.

[0020] In some embodiments of the present application, a pressing member is pressed onto a target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space, comprising: pressing the pressing member onto the target adhesive member, and abutting the pressing member against the upper surface of the side wall of the assembly cavity, so that the lower surface of the pressing member serves as the upper side wall of the set glue pouring space, the side surface of the target adhesive member and the side surface of the workpiece serve as the first side wall of the set glue pouring space, the side wall of the assembly cavity serves as the second side wall of the set glue pouring space, and the bottom surface of the assembly cavity serves as the bottom side wall of the set glue pouring space.

[0021] In the above embodiment, the lower surface of the clamping member is used as the upper side wall of the glue pouring space, the side surface of the target adhesive member and the side surface of the workpiece are used as the first side wall of the glue pouring space, the side wall of the assembly cavity is used as the second side wall of the glue pouring space, and the bottom surface of the assembly cavity is used as the bottom side wall of the glue pouring space, thereby omitting the production of a complex flexible mold core structure, and the structure of the assembled glue pouring space is simpler and easy to operate.

[0022] In some embodiments of the present application, attaching the target adhesive to a set position on the workpiece includes: attaching the target adhesive to the workpiece; wherein the upper surface of the target adhesive is higher than the upper surface of the glue potting fixture.

[0023] In the above embodiment, since the upper surface of the target adhesive is higher than the upper surface of the glue pouring jig, when the pressing member is pressed on the target adhesive, the pressing member will squeeze the target adhesive, and the target adhesive will undergo elastic deformation and fill in the space between the pressing member and the upper surface of the glue pouring jig, so as to reduce the risk of glue overflow due to a gap between the pressing member and the upper surface of the glue pouring jig.

[0024] In some embodiments of the present application, a pressing member is pressed onto a target adhesive member to form a set glue filling space, including: performing glue dispensing and sealing operations at cracks in the target adhesive member itself, at the gap between the target adhesive member and the workpiece, and / or at the gap between the target adhesive member and a glue filling jig.

[0025] In the above embodiment, by performing glue dispensing and sealing operations on the cracks of the target adhesive, the gaps between the target adhesive and the workpiece, and / or the gaps between the target adhesive and the glue pouring jig, the gaps in the target adhesive, the workpiece and the glue pouring jig can be filled, thereby ensuring the airtightness of the glue pouring hole space and reducing the risk of glue leakage when the glue is injected into the glue pouring space.

[0026] In some embodiments of the present application, the clamping piece is made of a light-transmitting material, and a glue filling port is provided on the clamping piece. The steps of injecting glue into a set glue filling space and curing the glue include: injecting glue into the set glue filling space through the glue filling port on the clamping piece; wherein the glue filling port is connected to the set glue filling space; and irradiating curing light into the set glue filling space through the clamping piece to cure the glue.

[0027] In the above embodiment, by setting the clamping piece made of light-transmitting material and the glue filling port, the user only needs to inject glue into the set glue filling space through the glue filling port on the clamping piece, and irradiate the set glue filling space with curing light through the clamping piece to achieve the injection and curing of glue, which reduces the difficulty of glue injection and glue curing and improves the user experience.

[0028] An embodiment of the present application provides a glue pouring jig, which is suitable for the above-mentioned glue pouring molding method. The glue pouring jig includes a base plate, a workpiece fixing groove, a clamping member and a positioning member. The workpiece fixing groove is arranged on the base plate to accommodate the workpiece; the clamping member is detachably covered on the workpiece fixing groove; wherein the clamping member is provided with a glue pouring hole and a glue outlet hole; the positioning member is arranged on the base plate to position the target adhesive member at a set position on the workpiece.

[0029] In the above-mentioned glue pouring jig, the user fixes the workpiece in the workpiece fixing groove, and the target adhesive part is accurately pasted to the set position of the workpiece through the positioning part. The clamping part cover is set on the workpiece fixing groove and presses the target adhesive part. The clamping part, the target adhesive part, the workpiece and the bottom plate are connected and sealed to form a set glue pouring space. Glue is injected into the set glue pouring space and the glue is cured to form a set colloid structure on the workpiece, omitting the complex flexible mold core structure. The structure of the assembled glue pouring space is simpler and easy to operate, which improves the processing efficiency of the design change of the flexible mold core structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0031] Figure 1 A schematic diagram of the structure of a glue-filling fixture provided in one embodiment of the present application; Figure 2 for Figure 1 Schematic diagram of the decomposition structure of the glue filling fixture; Figure 3 for Figure 1 Schematic diagram of the structure of the glue filling fixture after omitting the clamping parts; Figure 4 for Figure 3 A partial enlarged view of the middle part; Figure 5 for Figure 3 A partial enlarged view of point B in the middle; Figure 6 A schematic diagram of a structure in which a pressing member, a target adhesive member, a workpiece and a glue pouring fixture are enclosed to form a set glue pouring space provided in an embodiment of the present application; Figure 7 A schematic diagram of a process of a glue potting molding method provided in an embodiment of the present application; Figure 8 A schematic diagram of a process of a glue potting molding method provided in yet another embodiment of the present application; Fig. 9 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.10A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.11 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.12 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.13 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.14 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.15 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application; Fig.16 A schematic flow chart of a glue potting molding method provided in yet another embodiment of the present application.

[0032] Explanation of the main component symbols: 100, glue filling fixture; 10, bottom plate; 11, workpiece fixing groove; 12, adsorption hole; 20, pressing part; 21, glue filling hole; 22, glue outlet hole; 30, positioning part; 200, workpiece; 300, target bonding part; 400, colloid structure.

[0033] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0036] An embodiment of the present application provides a glue potting molding method, which includes: cutting a flexible adhesive substrate to obtain a target adhesive part with set contour features; assembling a workpiece into an assembly cavity of a glue potting jig; attaching the target adhesive part to a set position on the workpiece; pressing a clamping part on top of the target adhesive part, and the clamping part, the target adhesive part, the workpiece and the glue potting jig are enclosed to form a set glue potting space; injecting glue into the set glue potting space, and curing the glue to form a set colloid structure on the workpiece.

[0037] In the above-mentioned glue injection molding method, a set glue injection space is formed by enclosing a clamping member, a target adhesive member, a workpiece and a glue injection jig, and glue is injected into the set glue injection space for curing to form a set colloid structure on the workpiece. On the one hand, the complex flexible mold structure is omitted, and the structure of the glue injection space is simpler and easy to operate; on the other hand, the target adhesive member does not need to be molded for injection molding, and only needs to cut the flexible adhesive substrate into the set contour features according to the set colloid structure shape, which has a short production cycle, high flexibility and low production cost.

[0038] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0039] It should be noted that in the description of the present application, the orientation or position relationship indicated by "above" is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0040] An embodiment of the present application provides a glue-filling jig 100, which is used to perform LIPO (low pressure injection molding) glue filling processing on a mobile phone display screen to form a circle of colloid structure 400 at the edge of the mobile phone display screen, and the colloid structure 400 can be used to assemble the mobile phone display screen with a mobile phone frame, etc. The formed colloid structure 400 can also be used to detect performance and parameters, so as to determine the optimal glue specifications and process parameters.

[0041] In other embodiments, the glue potting jig 100 may also be used for other workpieces that require the generation of a colloid structure 400 , which is not limited in the present application.

[0042] Please refer to Figure 1 and Figure 2 The glue-filling fixture 100 includes a base plate 10, a workpiece fixing groove 11, a clamping member 20, and a positioning member 30. The workpiece fixing groove 11 is provided on the base plate 10, and the workpiece fixing groove 11 is used to accommodate a workpiece 200, such as a mobile phone display screen, a liquid crystal display screen of a smart watch, etc. The clamping member 20 is detachably covered on the workpiece fixing groove 11.

[0043] In this embodiment, the clamping member 20 is detachably mounted on the base plate 10 by means of fasteners (specifically, screws, bolts, and other threaded members), and covers the workpiece fixing groove 11. When the clamping member 20 needs to be removed, the user only needs to release the threaded connection between the fastener and the base plate 10.

[0044] In other embodiments, the clamping member 20 may also adopt other detachable structures such as a snap structure, a magnetic structure, etc., as long as it can ensure that the clamping member 20 can be detachably covered on the workpiece fixing groove 11. This application does not limit this, and technical personnel in this field can choose according to actual conditions.

[0045] Please refer to Figure 1 , Figure 3 and Figure 5 The positioning member 30 is disposed on the bottom plate 10, and the positioning member 30 is used to position the target adhesive member 300 at a set position on the workpiece 200. It is worth noting that the set position specifically refers to a position where the target adhesive member 300, the workpiece 200, the pressing member 20 and the bottom plate 10 are connected and sealed to form a set glue injection space (not shown).

[0046] Please refer to Figure 1 , Figure 4 and Figure 6 The pressing member 20 is provided with a glue injection hole 21 and a glue outlet hole 22. Glue is injected into the set glue injection space through the glue injection hole 21 and discharged through the glue outlet hole 22 to ensure that the glue can fill the entire glue injection space.

[0047] Exemplarily, when the glue injection jig 100 is in use, the user fixes the workpiece 200 in the workpiece fixing groove 11, and the target adhesive 300 is accurately pasted to the set position of the workpiece 200 through the positioning member 30. The pressing member 20 is covered on the workpiece fixing groove 11, and presses the target adhesive 300. The pressing member 20, the target adhesive 300, the workpiece 200 and the bottom plate 10 are connected and sealed to form a set glue injection space. Glue is injected into the set glue injection space through the glue injection hole 21 and discharged through the glue outlet hole 22. The glue is then cured to form a set colloid structure 400 on the workpiece 200.

[0048] Compared with the prior art, the glue pouring jig 100 omits the complicated flexible mold structure, and forms a set glue pouring space by utilizing the closed connection between the clamping member 20, the workpiece 200 and the base plate 10. The structure of the glue pouring space is simpler and easy to operate.

[0049] See also Figure 7 The glue pouring molding method provided in one embodiment of the present application is applicable to the above-mentioned glue pouring fixture 100. The glue pouring molding method is used to perform LIPO (Low Injection Pressure Over-molding) glue pouring treatment on the mobile phone display screen to form a circle of colloid structure at the edge of the mobile phone display screen. It includes the following steps S101~S105: Step S101 , cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature.

[0050] The set contour feature may be a contour feature of the desired set colloid structure projected on a plane, or may be a contour feature drawn in advance by a technician.

[0051] In this embodiment, before cutting the flexible adhesive substrate, the technician pre-sets a colloid structure with a specific shape according to the needs of the glue performance test. After obtaining the set colloid structure, the technician obtains the contour features of the set colloid structure projected on the plane by projection, and cuts the flexible adhesive substrate according to the contour features to obtain the target adhesive part.

[0052] In other embodiments, technicians can directly draw the contour features of the colloid structure before cutting the flexible adhesive substrate according to the needs of the glue performance test, and cut the flexible adhesive substrate according to the preset contour features to obtain the target adhesive part.

[0053] For example, if the orthographic projection contour of the desired colloid structure is rectangular, the technician needs to cut the flexible adhesive substrate along the rectangular contour to obtain a target adhesive member having a rectangular contour.

[0054] If the orthographic projection contour of the desired colloid structure is circular, the technician needs to cut the flexible adhesive substrate along the circular contour to obtain a target adhesive member with a circular contour. In this embodiment, the flexible adhesive substrate is a double-sided pressure-sensitive adhesive, and a PU-based foam adhesive is selected, which has compressibility. Specifically, the flexible adhesive substrate includes a stacked top adhesive layer, a substrate layer, and a bottom adhesive layer. The material of the substrate layer is a thermoplastic polyester material, a foam material, or a non-woven fabric material. The material of the top adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material, or an acrylic pressure-sensitive adhesive material. The material of the bottom adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material, or an acrylic pressure-sensitive adhesive material.

[0055] In other embodiments, the flexible adhesive substrate may also be other suitable structures, which is not limited in the present application.

[0056] Step S102, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0057] The workpiece can be placed directly on the glue potting jig and fixed at the set position on the glue potting jig under the constraint of the positioning mechanism. Of course, it can also be fixed on the glue potting jig by vacuum adsorption, or assembled on the glue potting jig by magnetic adsorption structure to reduce the risk of shaking or offset of the workpiece.

[0058] Please refer to Figure 2 and Figure 3In this embodiment, the assembly cavity of the glue potting jig 100 is specifically the above-mentioned workpiece fixing groove 11. The glue potting jig 100 is provided with an adsorption hole 12 in the workpiece fixing groove 11. When the workpiece 200 needs to be assembled on the glue potting jig 100, the technician only needs to place the workpiece 200 in the workpiece fixing groove 11 and adsorb the workpiece 200 through the adsorption hole 12 to achieve the assembly and fixation of the workpiece 200.

[0059] Step S103, attaching the target adhesive member to a set position on the workpiece. In this embodiment, the target adhesive member is bonded to the set position of the workpiece through its adhesive side. In other embodiments, the target adhesive member can also be applied with adhesive to affix the target adhesive member to the set position of the workpiece through the adhesive.

[0060] Step S104, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue injection fixture are enclosed to form a set glue injection space.

[0061] Please refer to Figure 1 , Figure 2 and Figure 6 In this embodiment, the pressing member 20 is installed on the glue-filling fixture 100 through a fastener (specifically a screw, bolt or other threaded member) and is pressed on the top of the target adhesive member 300. The pressing member 20 abuts against the upper surface of the side wall of the assembly cavity.

[0062] Among them, the lower surface of the clamping part 20 serves as the upper side wall of the glue pouring space, the side surface of the target adhesive part 300 and the side surface of the workpiece serve as the first side wall of the glue pouring space, the side wall of the assembly cavity serves as the second side wall of the glue pouring space, and the bottom surface of the assembly cavity serves as the bottom side wall of the glue pouring space.

[0063] By utilizing the lower surface of the clamping member 20 as the upper side wall of the glue pouring space, the side surface of the target adhesive member 200 and the side surface of the workpiece as the first side wall of the glue pouring space, the side wall of the assembly cavity as the second side wall of the glue pouring space, and the bottom surface of the assembly cavity as the bottom side wall of the glue pouring space, the complicated manufacturing of the flexible mold core structure is omitted, and the structure of the assembled glue pouring space is simpler and easy to operate.

[0064] It should be noted that the shape of the glue pouring space formed by the pressing member 20 , the target adhesive member 300 , the workpiece 200 and the glue pouring fixture 100 is the same as the shape of the pre-set glue structure 400 .

[0065] In other embodiments, the clamping member 20 may also be installed on the glue filling fixture 100 using other structures such as a snap structure and pressed on the target adhesive member 300. This application does not limit this, and technicians in this field may choose according to actual conditions.

[0066] Step S105, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0067] Please refer to Figure 1 , Figure 3 and Figure 4 In this embodiment, the pressing member 20 is made of a light-transmitting material, for example, the pressing member 20 may be a transparent glass plate, a transparent acrylic plate, etc. The pressing member 20 is provided with a glue injection hole 21 and a glue outlet hole 22, and the glue injection hole 21 and the glue outlet hole 22 are both connected to the glue injection space.

[0068] The glue is injected into the set glue injection space through the glue injection hole 21 and discharged through the glue outlet hole 22. After the glue completely fills the set glue injection space, a curing light is irradiated into the set glue injection space through the clamping member 20 to cure the glue, so as to form a set colloid structure 400 on the workpiece 200.

[0069] In other embodiments, a glue injection hole 21 and a glue outlet hole 22 may also be provided on the glue injection jig 100, and both the glue injection hole 21 and the glue outlet hole 22 are connected to the glue injection space. Glue is injected into the set glue injection space through the glue injection hole 21 and discharged through the glue outlet hole 22. After the glue completely fills the set glue injection space, the glue is cured to form a set colloid structure 400 on the workpiece 200.

[0070] It should be noted that the injection parameters of the glue, such as injection pressure, injection speed, etc., can refer to the injection process of the prior art. For example, the injection speed under normal pressure can be set to 0.5-1.5 ml / min according to actual needs, the vacuum environment can be set to -90 kPa, and the injection speed can be selected to 3-5 ml / min. The specific selection is related to the material and viscosity of the glue, and technicians in this field can choose according to actual conditions.

[0071] The glue pouring molding method in the present application utilizes a clamping member 20, a target adhesive member 300, a workpiece 200, and a glue pouring fixture 100 to enclose a set glue pouring space, and injects glue into the set glue pouring space for curing to form a set colloid structure 400 on the workpiece. On the one hand, the complex manufacturing of the flexible mold core structure is omitted, and the structure of the assembled glue pouring space is simpler and easy to operate. On the other hand, the target adhesive member 300 does not need to be molded for injection molding, and only needs to cut the flexible adhesive substrate into the set contour features according to the set shape of the colloid structure 400, which has a short production cycle, high flexibility, and low production cost.

[0072] It should be noted that, in other embodiments, the order of step S402 and step S403 can be swapped, that is, the technician can first attach the target adhesive to the workpiece, and then assemble the workpiece with the target adhesive attached to the glue-filling fixture. This application does not limit this, and technicians in this field can choose according to actual conditions.

[0073] See also Figure 8 Another embodiment of the present application provides a method for potting and molding. When performing the step of cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature, the present application proposes the following steps: Figure 8 The embodiment shown includes the following steps S201 to S206: Step S201 , attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0074] Understandably, when the flexible adhesive substrate falls to the ground, the bottom film can isolate the bottom adhesive side of the flexible adhesive substrate from dust or debris on the ground, thereby preventing pollutants from contaminating the adhesive layer of the flexible adhesive substrate and ensuring the stickiness of the adhesive side of the flexible adhesive substrate.

[0075] Optionally, the base film may be tissue paper, PET, PVC film, foam, acrylic foam, etc., which is not limited in the present application.

[0076] Step S202 , laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0077] In this embodiment, a high-speed carbon dioxide laser machine is used to laser cut the flexible adhesive substrate. Specifically, the working power of the carbon dioxide laser cutting machine is set to a set power, and the flexible adhesive substrate is cut to obtain a target adhesive. The set power ranges from 50W to 70W.

[0078] It should be noted that by setting the working power of the CO2 laser cutting machine to the set power, it helps to ensure that the CO2 laser cutting machine accurately cuts the flexible adhesive substrate and reduces the risk of the flexible adhesive substrate being burned due to excessive working power of the CO2 laser cutting machine, or the risk of the flexible adhesive substrate being unable to be cut due to too low working power of the CO2 laser cutting machine.

[0079] In other embodiments, other suitable laser cutting machines may also be used, which is not limited in the present application, and those skilled in the art may choose according to actual conditions.

[0080] For example, before cutting the flexible adhesive substrate, the technician pre-sets a colloid structure with a specific shape according to the needs of the glue performance test. After obtaining the set colloid structure, the technician obtains the contour features of the set colloid structure projected on the plane by projection, and depicts the contour features on the flexible adhesive substrate. Subsequently, the working power of the carbon dioxide laser cutting machine is set to 60W, and the flexible adhesive substrate is cut along the contour features by the carbon dioxide high-speed laser machine to obtain the target adhesive.

[0081] Step S203, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0082] Step S204, attaching the target adhesive member to a set position on the workpiece.

[0083] Step S205 , pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0084] Step S206, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0085] In this embodiment, the specific description of steps S203 to S206 can be referred to as follows. Figure 3 Steps S102 to S105 in the provided embodiment.

[0086] Before cutting the flexible adhesive substrate, by attaching the base film to the bottom adhesive side of the flexible adhesive substrate, the risk of the adhesive side of the flexible adhesive substrate being contaminated by pollutants such as dust and debris, resulting in the adhesiveness of the flexible adhesive substrate being reduced and unable to be stably attached to the workpiece, can be reduced, thereby improving efficiency.

[0087] See also Fig. 9 Another embodiment of the present application provides a method for glue potting molding. When performing the steps of laser cutting the flexible adhesive substrate to obtain the target adhesive component, the present application proposes the following steps: Fig. 9 The embodiment shown includes the following steps S301 to S307: Step S301, attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0088] Step S302 , laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0089] Step S303: Detect whether the current contour of the target adhesive component is consistent with the set contour feature.

[0090] In some embodiments, there are multiple implementations for detecting whether the current profile of the target adhesive component is consistent with the set profile feature. One of them is: The current contour of the target adhesive after cutting is obtained by a visual camera component (such as a CCD camera). The current contour is overlapped with the set contour feature, and it is determined whether the contour lines of the two are completely consistent.

[0091] If the two contour lines do not completely match, it indicates that the current contour of the target adhesive is inconsistent with the set contour feature. At this time, it is necessary to cut the target adhesive again, or replace a new flexible adhesive substrate and cut it again according to the set contour feature.

[0092] If the two contour lines are completely consistent, it means that the current contour of the target adhesive part is consistent with the set contour feature, and the next step can be performed if it meets the requirements.

[0093] In other embodiments, the current contour of the target adhesive may be selected for comparison with specific points on the set contour feature, or other comparison methods may be used to detect whether the current contour of the target adhesive is consistent with the set contour feature, which is not limited in the present application.

[0094] Step S304, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0095] Step S305 , attaching the target adhesive member to a set position on the workpiece.

[0096] Step S306, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue injection fixture are enclosed to form a set glue injection space.

[0097] Step S307, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0098] In this embodiment, for the specific description of step S301 and step S302, and step S304 to step S307, reference may be made to the description of the relevant contents in the above embodiment, and will not be repeated here.

[0099] By detecting whether the current contour of the target adhesive is consistent with the set contour characteristics, technicians can check in advance whether the target adhesive has defects that meet the requirements, so as to ensure that the set colloid structure formed by the subsequent glue curing meets the settings, thereby ensuring the sealing of the set glue filling space and reducing the risk of glue leakage during subsequent glue injection.

[0100] See also Fig.10 Another embodiment of the present application provides a method for glue potting molding. When performing the steps after obtaining the target adhesive component, the present application proposes the following steps: Fig.10 The embodiment shown includes the following steps S401 to S407: Step S401, attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0101] Step S402 , laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0102] Step S403 , attaching a protective film to the top adhesive side of the target adhesive component, wherein the protective film completely covers the target adhesive component 300 .

[0103] In this embodiment, the protective film is made of PET and is sticky. The protective film is attached to the top adhesive side of the target adhesive part through the sticky side. The thickness of the protective film is 0.05mm~0.10mm, which can not only avoid the protection of the target adhesive part due to the protective film being too thin, but also avoid the increase of production cost due to the protective film being too thick.

[0104] Exemplarily, the thickness of the protective film is 0.08 mm. In other embodiments, the thickness of the protective film may also be 0.06 mm, 0.07 mm, etc. For the selection of the thickness of the protective film, those skilled in the art may select it according to the actual situation, and this application does not limit it.

[0105] Step S404, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0106] Step S405 , attaching the target adhesive member to a set position on the workpiece.

[0107] Step S406, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0108] Step S407, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0109] In this embodiment, the specific description of step S401 and step S402, and step S404 to step S407 can refer to the description of the relevant content in the above embodiment, and will not be repeated here.

[0110] By attaching the protective film to the top glue side of the target adhesive part, the target adhesive part can be protected, and the risk of scratching the target adhesive part due to repeated handling of the target adhesive part can be reduced, thereby ensuring the sealing of the set glue filling space and preventing glue leakage when injecting glue into the set glue filling space.

[0111] See also Fig.11 Another embodiment of the present application provides a method for molding by glue pouring. When performing the steps after cutting the protective film, the present application proposes the following steps: Fig.11 The embodiment shown includes the following steps S501 to S508: Step S501 , attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0112] Step S502 : laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0113] Step S503, attaching a protective film to the top adhesive side of the target adhesive component, wherein the protective film completely covers the target adhesive component.

[0114] Step S504, according to the position of the positioning piece in the glue potting fixture, a positioning hole is opened on the protective film to position the target adhesive piece at a set position on the workpiece.

[0115] Combined with reference Figure 1 , Figure 3 and Figure 5 In this embodiment, a positioning member 30 is provided in the glue-filling jig 100, and a positioning hole (not shown) corresponding to the positioning member 30 is provided on the protective film (not shown). When the target adhesive member 300 is attached to the set position on the workpiece 200, the positioning member 30 is inserted into the corresponding positioning hole, thereby realizing the positioning of the target adhesive member 300.

[0116] In other embodiments, the protective film and the glue-filling jig 100 may also be positioned in other ways, for example, the glue-filling jig 100 is provided with a positioning clamping portion (not shown), and the protective film is provided with an extension portion (not shown) that cooperates with the positioning clamping portion. When the positioning clamping portion clamps the extension portion, the target adhesive 300 is positioned relative to the set position on the workpiece 200, that is, the target adhesive 300 is positioned. This application does not limit this, and those skilled in the art may select according to actual conditions.

[0117] Step S505, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0118] Step S506, attaching the target adhesive member to a set position on the workpiece.

[0119] Step S507, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0120] Step S508, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0121] In this embodiment, for the specific description of steps S501 to S503 and steps S505 to S508, reference may be made to the description of the relevant contents in the above embodiments, and will not be repeated here.

[0122] By opening positioning holes corresponding to the positioning parts in the glue potting fixture on the cut protective film, not only can the target adhesive part and the workpiece be accurately aligned, but also the assembly efficiency of the target adhesive part can be improved. See also Fig.12 Another embodiment of the present application provides a method for glue pouring molding. When executing the step of assembling a glue pouring fixture on a workpiece, the present application proposes the following steps: Fig.12 The embodiment shown includes the following steps S601 to S606: Step S601 , cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature.

[0123] Step S602, spraying silicone oil onto the workpiece placement area of ​​the glue potting fixture.

[0124] Combined with reference Figure 2 and Figure 3 In this embodiment, before assembling the workpiece 200 onto the glue-filling fixture 100, the technician needs to spray silicone oil in the workpiece fixing groove 11 to form an isolation layer on the surface of the groove wall of the workpiece fixing groove 11. The silicone oil has certain thermal stability and chemical inertness and does not corrode the groove wall surface of the workpiece fixing groove 11.

[0125] In other embodiments, other release agents with an isolation effect may also be sprayed, and this application does not limit this.

[0126] Step S603, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0127] Step S604, attaching the target adhesive member to a set position on the workpiece.

[0128] Step S605, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0129] Step S606, injecting glue into the set glue injection space and curing the glue to form a set colloid structure on the workpiece.

[0130] By spraying silicone oil on the workpiece placement area of ​​the glue potting jig, the risk of the workpiece adhering to the glue potting jig can be reduced, thereby facilitating the removal of the workpiece with the set colloid structure from the glue potting jig. Specifically, when the glue is injected into the set glue potting space, the silicone oil can isolate the glue from the glue potting jig 100. Even if the glue solidifies, the workpiece will not adhere to the glue potting jig.

[0131] In this embodiment, for the specific description of step S601 and step S603 to step S606, reference may be made to the description of the relevant contents in the above embodiment, which will not be repeated here.

[0132] See also Fig.13 Another embodiment of the present application provides a method for glue potting. When executing the step of attaching the target adhesive member to the set position on the workpiece, the present application proposes the following steps: Fig.13 The embodiment shown includes the following steps S701 to S705: Step S701 , cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature.

[0133] Step S702, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0134] Step S703, attaching the target adhesive component to the workpiece; wherein the upper surface of the target adhesive component is higher than the upper surface of the glue-filling fixture.

[0135] In some embodiments, in order to achieve that the upper surface of the target adhesive is higher than the upper surface of the glue filling fixture when the target adhesive is attached to the workpiece, there are multiple implementation methods, such as using a target adhesive with a larger thickness, or raising the target adhesive by adding a filling piece.

[0136] Combined with reference Figure 1 , Figure 2 and Figure 6 In this embodiment, a target adhesive 300 with a larger thickness is selected. When the target adhesive 300 is attached to the workpiece, the sum of the thickness of the target adhesive 300 and the thickness of the workpiece is greater than the groove depth of the workpiece fixing groove 11, so that the upper surface of the target adhesive 300 is higher than the upper surface of the glue injection fixture 100.

[0137] Exemplarily, the depth of the workpiece fixing groove 11 is 10 mm, the thickness of the workpiece is 8 mm, and the thickness of the target adhesive 300 is 3 mm. When the workpiece is installed in the workpiece fixing groove 11 and the target adhesive 300 is attached to the workpiece, the sum of the thickness of the workpiece and the thickness of the target adhesive 300 is 11 mm, which is greater than the depth of the workpiece fixing groove 11, which is 10 mm. At this time, the upper surface of the target adhesive 300 is higher than the upper surface of the glue injection fixture 100.

[0138] In other embodiments, a filling piece (not shown) may be added to lift the target adhesive 300 so that the upper surface of the target adhesive 300 is higher than the upper surface of the glue potting fixture 100 .

[0139] Exemplarily, a gasket is provided between the target adhesive 300 and the workpiece, and the thickness of the gasket is 1 mm. The depth of the workpiece fixing groove 11 is 10 mm, the thickness of the workpiece is 8 mm, and the thickness of the target adhesive 300 is 2 mm. When the workpiece is installed in the workpiece fixing groove 11 and the target adhesive 300 is attached to the workpiece, the sum of the thickness of the workpiece, the thickness of the gasket and the thickness of the target adhesive 300 is 11 mm, and is greater than the depth of the workpiece fixing groove 11 of 10 mm. At this time, the upper surface of the target adhesive 300 is higher than the upper surface of the glue filling fixture 100.

[0140] Step S704, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0141] Step S705 , injecting glue into the set glue injection space and curing the glue to form a set colloid structure on the workpiece.

[0142] In this embodiment, for the specific description of step S701, step S702, step S704 and step S705, reference may be made to the description of the relevant contents in the above embodiment, which will not be repeated here.

[0143] Since the upper surface of the target adhesive component is higher than the upper surface of the glue pouring jig, when the pressing member is pressed on the target adhesive component, the pressing member will squeeze the target adhesive component, and the target adhesive component will undergo elastic deformation to fill the space between the pressing member and the upper surface of the glue pouring jig, thereby reducing the risk of glue overflow due to a gap between the pressing member and the upper surface of the glue pouring jig.

[0144] See also Fig.14 Another embodiment of the present application provides a method for glue potting. The present application proposes the following steps when executing the step of attaching the target adhesive member to the set position on the workpiece: Fig.14 The embodiment shown includes the following steps S801 to S806: Step S801, attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0145] Step S802 , laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0146] Step S803 , attaching a protective film to the top adhesive side of the target adhesive component, wherein the protective film completely covers the target adhesive component 300 .

[0147] Step S804, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0148] Step S805 , attaching the target adhesive member to a set position on the workpiece.

[0149] Step S806, removing the protective film from the target adhesive component.

[0150] It should be noted that the technician may tear off the protective film from the target adhesive part manually, or may use a mechanism such as a mechanical clamp to tear off the protective film from the target adhesive part.

[0151] Step S807, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0152] Step S808, injecting glue into the set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0153] In this embodiment, for the specific description of steps S801 to S805, step 807, and step 808, reference may be made to the description of the relevant contents in the above embodiment, and will not be repeated here.

[0154] By tearing off the protective film from the target adhesive part, not only can the protective film be prevented from hindering the injection of glue into the set glue pouring space, but also the risk of impurities in the set colloid structure after solidification due to melting or breaking of the protective film when in contact with the glue can be reduced, thereby improving the quality of the set colloid structure formed on the workpiece.

[0155] See also Fig.15 Another embodiment of the present application provides a method for glue injection molding. When executing the step of pressing the pressing member on the target adhesive member to form a setting glue injection space, the present application proposes the following steps: Fig.15 The embodiment shown includes the following steps S901 to S906: Step S901 , cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature.

[0156] Step S902, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0157] Step S903, attaching the target adhesive member to a set position on the workpiece.

[0158] Step S904, performing glue dispensing and sealing operations at cracks of the target adhesive component itself, at a gap between the target adhesive component and the workpiece, and / or at a gap between the target adhesive component and a glue potting jig.

[0159] In order to save the production cost of the target adhesive and avoid waste, the technician will usually cut the middle part of the sheet-like target adhesive to form a ring-shaped target adhesive. However, when cutting the sheet-like target adhesive, a cutting crack will be left on the target adhesive.

[0160] In this embodiment, the technician uses a glue dispensing mechanism to dispense glue to the cracks of the target adhesive component to fill the gaps and ensure the airtightness of the glue injection hole space, thereby reducing the risk of glue leakage when the glue is injected into the glue injection space.

[0161] In other embodiments, due to assembly errors, there may be a gap between the target adhesive and the workpiece, or between the target adhesive and the glue-filling jig. The technician may also use a glue-dispensing mechanism to dispense glue to the gap between the target adhesive and the workpiece, and / or the gap between the target adhesive and the glue-filling jig to fill the gap. This application does not limit this, and those skilled in the art may choose according to actual conditions.

[0162] Step S905, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0163] Step S906, injecting glue into the set glue injection space and curing the glue to form a set colloid structure on the workpiece.

[0164] In this embodiment, for the specific description of steps S901 to S903, step S905, and step S906, reference may be made to the description of the relevant contents in the above embodiments, and will not be repeated here.

[0165] By performing glue dispensing and sealing operations on cracks in the target adhesive component itself, gaps between the target adhesive component and the workpiece, and / or gaps between the target adhesive component and the glue injection jig, the gaps can be filled to ensure the airtightness of the glue injection hole space, thereby reducing the risk of glue leakage when glue is injected into the glue injection space.

[0166] See also Fig.16 , exemplary, the operation steps of the glue pouring molding method in this application are as follows: Step S100 , attaching the base film to the bottom adhesive side of the flexible adhesive substrate.

[0167] Step S200 , laser cutting the flexible adhesive substrate according to the projection shape of the set colloid structure on the flexible adhesive substrate to obtain a target adhesive member.

[0168] Step S300, detecting whether the current contour of the target adhesive component is consistent with the set contour feature.

[0169] Step S400 , attaching a protective film to the top adhesive side of the target adhesive component, wherein the protective film completely covers the target adhesive component 300 .

[0170] Step S500, according to the position of the positioning piece in the glue potting fixture, a positioning hole is opened on the protective film to position the target adhesive piece at a set position on the workpiece.

[0171] Step S600, spraying silicone oil onto the workpiece placement area of ​​the glue pouring fixture.

[0172] Step S700, assembling the workpiece into the assembly cavity of the glue-filling fixture.

[0173] Step S800, attaching the target adhesive component to a set position on the workpiece, wherein the upper surface of the target adhesive component is higher than the upper surface of the glue-filling fixture.

[0174] Step S900, removing the protective film from the target adhesive component.

[0175] Step S1000, performing glue dispensing and sealing operations at cracks of the target adhesive component itself, at a gap between the target adhesive component and a workpiece, and / or at a gap between the target adhesive component and a glue potting jig.

[0176] Step S1100, pressing the pressing member onto the target adhesive member, and the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space.

[0177] Step S1200, injecting glue into a set glue injection space, and curing the glue to form a set colloid structure on the workpiece.

[0178] In this embodiment, for the specific description of step S100 to step S1200, reference may be made to the description of the relevant contents in the above embodiment, which will not be repeated here.

[0179] The glue injection molding method in the present application uses a clamping member, a target adhesive member, a workpiece and a glue injection jig to form a set glue injection space, and injects glue into the set glue injection space for curing to form a set colloid structure on the workpiece. On the one hand, the complex flexible mold structure is omitted, and the structure of the glue injection space is simpler and easy to operate; on the other hand, the target adhesive member does not need to be molded for injection molding, and only needs to cut the flexible adhesive substrate into the set contour features according to the set colloid structure shape, which has a short production cycle, high flexibility and low production cost.

[0180] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A glue pouring molding method, characterized in that: The method comprises: Cutting the flexible adhesive substrate to obtain a target adhesive member having set contour features; Assemble the workpiece into the assembly cavity of the glue-filling fixture; affixing the target adhesive member to a set position on the workpiece; Pressing a pressing member onto the target adhesive member, wherein the pressing member, the target adhesive member, the workpiece and the glue pouring fixture are enclosed to form a set glue pouring space; Glue is injected into the set glue injection space, and the glue is cured to form a set colloid structure on the workpiece.

2. The glue pouring molding method according to claim 1, characterized in that: The step of cutting the flexible adhesive substrate to obtain a target adhesive member having a set contour feature comprises: attaching the base film to the bottom adhesive side of the flexible adhesive substrate; According to the projection shape of the set colloid structure on the flexible adhesive substrate, the flexible adhesive substrate is cut by laser to obtain the target adhesive member.

3. The glue pouring molding method according to claim 2, characterized in that: The step of laser cutting the flexible adhesive substrate to obtain the target adhesive member comprises: The working power of the carbon dioxide laser cutting machine is set to a set power, and the flexible adhesive substrate is cut to obtain the target adhesive member; Among them, the set power value range is 50W to 70W; the flexible adhesive substrate includes a stacked top adhesive layer, a substrate layer and a bottom adhesive layer; the material of the substrate layer is a thermoplastic polyester material, a foam material or a non-woven fabric material; the material of the top adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material or an acrylic pressure-sensitive adhesive material; the material of the bottom adhesive layer is an elastomeric pressure-sensitive adhesive material, a resin-type pressure-sensitive adhesive material or an acrylic pressure-sensitive adhesive material.

4. The glue pouring molding method according to claim 3, characterized in that: After the laser cutting of the flexible adhesive substrate to obtain the target adhesive component, the method further includes: A protective film is attached to the top adhesive side of the target adhesive component; wherein the protective film completely covers the target adhesive component.

5. The glue pouring molding method according to claim 4, characterized in that: After attaching the protective film to the top adhesive side of the target adhesive component, the method further includes: According to the position of the positioning member in the glue-filling jig, a positioning hole is opened on the protective film to position the target adhesive member at the set position on the workpiece; and / or, After attaching the target adhesive to the set position on the workpiece, the method further includes: The protective film is removed from the target adhesive member.

6. The glue pouring molding method according to claim 1, characterized in that: The step of pressing the pressing member onto the target adhesive member, and enclosing the pressing member, the target adhesive member, the workpiece and the glue pouring fixture to form a set glue pouring space includes: The pressing member is pressed onto the target adhesive member, and the pressing member is abutted against the upper surface of the side wall of the assembly cavity, so that the lower surface of the pressing member serves as the upper side wall of the set glue pouring space, the side surface of the target adhesive member and the side surface of the workpiece serve as the first side wall of the set glue pouring space, the side wall of the assembly cavity serves as the second side wall of the set glue pouring space, and the bottom surface of the assembly cavity serves as the bottom side wall of the set glue pouring space.

7. The glue pouring molding method according to claim 1, characterized in that: The step of attaching the target adhesive member to a set position on the workpiece includes: The target adhesive component is attached to the workpiece; wherein the upper surface of the target adhesive component is higher than the upper surface of the glue-filling fixture.

8. The glue pouring molding method according to claim 1, characterized in that: The pressing member is pressed onto the target adhesive member to form a set glue pouring space, including: The glue dispensing and sealing operation is performed at the cracks of the target adhesive component itself, at the gap between the target adhesive component and the workpiece, and / or at the gap between the target adhesive component and the glue pouring fixture.

9. The glue pouring molding method according to claim 1, characterized in that: The pressing piece is made of a light-transmitting material, and the pressing piece is provided with a glue injection port. The step of injecting glue into the set glue injection space and curing the glue comprises: Injecting glue into the set glue pouring space through the glue pouring port on the pressing member; wherein the glue pouring port is in communication with the set glue pouring space; The glue is cured by irradiating curing light into the set glue pouring space through the pressing member.

10. A glue pouring jig, suitable for the glue pouring molding method according to any one of claims 1 to 9, characterized in that: The glue pouring fixture comprises: Base plate; A workpiece fixing groove, provided on the bottom plate, for accommodating the workpiece; A pressing piece is detachably covered on the workpiece fixing groove; wherein the pressing piece is provided with a glue injection hole and a glue outlet hole; The positioning member is arranged on the bottom plate and is used to position the target adhesive member at a set position on the workpiece.

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