Supply System and Supply Method of Chemical Vapor Deposition Equipment

Abstract

This patent relates to the field of chemical vapor deposition, and particularly to a supply system and a supply method for a chemical vapor deposition device. The supply system of the chemical vapor deposition device includes: a reaction vessel, at least one connection component, a guiding rail, and a translation device. The reaction vessel is used to provide a reaction space for chemical vapor deposition reactions. At least one connection component is arranged on the outer surface of the reaction vessel part. The guiding rail is arranged along a straight line, and the reaction vessel is arranged on the guiding rail. The translation device is detachably connected to the connection component and is used to drive the reaction vessel to move along the guiding rail. By driving the reaction vessel to move along the guiding rail through the translation device, the reaction vessel can be moved between various workstations along a fixed direction. The reaction vessel can be accurately positioned at different workstations for the gas delivery pipe to dock with the reaction vessel after the reaction vessel reaches the workstation, so as to ensure the smooth progress of chemical vapor deposition work.

Description

Technical Field

[0001] This patent relates to the field of silicon carbide reactions, and particularly to a supply system and a supply method for a chemical vapor deposition device. Background Art

[0002] Silicon carbide is a representative ceramic material and has been widely used in the entire industrial field due to its excellent physical, chemical, and electrical properties.

[0003] In recent years, with the active progress in the development of semiconductor processing components using silicon carbide materials, the importance of silicon carbide materials has been increasing. In particular, silicon carbide materials are widely used as components for etching processes in semiconductor process components due to their high plasma tolerance.

[0004] The traditional method for manufacturing silicon carbide for semiconductor etching process parts is the conventional method of manufacturing silicon carbide. Since the quality and performance cannot be met by this method, chemical vapor deposition is used.

[0005] Chemical vapor deposition of silicon carbide uses a mixture of Si-containing gases such as SiH4, SiCl2, SiCl4 and C-containing gases such as C2H2, CH4, C3H8, etc. as source gases, or CH3SiCl3, CH3SiH3, (CH3)3SiH, etc. There are some deposition methods using single-piece raw materials. Manufacturing silicon carbide materials by chemical vapor deposition has the disadvantage of low productivity because the process is carried out in a batch chemical vapor deposition furnace. However, if the batch chemical vapor deposition furnace is to be improved to a continuous chemical vapor deposition furnace, the transportation problem of the reaction vessel needs to be overcome. Summary of the Invention

[0006] To solve or at least partially solve the above technical problems, this patent provides a supply system and a supply method for a chemical vapor deposition device.

[0007] A supply system for a chemical vapor deposition device provided by this patent, the supply system of the chemical vapor deposition device includes: a reaction vessel, at least one connection component, a guide rail, and a translation device. The reaction vessel is used to provide a reaction space for chemical vapor deposition reactions. At least one connection component is provided on the outer surface of the reaction vessel part, the guide rail is arranged in a straight line, and the reaction vessel is arranged on the guide rail. The translation device is detachably connected to the connection component and is used to drive the reaction vessel to move along the guide rail.

[0008] Preferably, the translation device includes: a power source and a transmission rod provided on the power source. The transmission rod has: a connection portion and a straight rod portion, and the connection portion is used for detachably connecting with the connection. The connection assembly further includes: a rotary locking member, on which a connection groove is provided, and the shape of the connection groove matches that of the connection portion; the connection portion is embedded in the connection groove and drives the rotary locking member to rotate to detachably connect the connection portion with the connection assembly.

[0009] Preferably, the guide rail is a roller track; the roller track includes: two guide rails and a plurality of rollers. The two guide rails are symmetrically distributed. The plurality of rollers are evenly spaced between the two guide rails, and the reaction vessel is arranged on the rollers and slides along the rolling direction of the rollers.

[0010] Preferably, the supply system of the chemical vapor deposition equipment further includes: a calibration device and a control module. The calibration device includes: two pushing and positioning mechanisms, symmetrically arranged on both sides of the guide rail. The two pushing and positioning mechanisms respectively act on the outer surface of the reaction vessel in a direction perpendicular to the guide rail for calibrating the orientation of the reaction vessel. The control module is communicatively connected with the pushing and positioning mechanisms to control the movement of the pushing and positioning mechanisms according to instructions.

[0011] Preferably, the pushing and positioning mechanism includes: a fitting assembly and a telescopic assembly. The fitting assembly is used for fitting with the outer surface of the reaction vessel to drive the reaction vessel for calibration. The telescopic assembly is connected with the fitting assembly and communicatively connected with the control module; the telescopic assembly drives the fitting assembly to move in a direction perpendicular to the guide rail according to the instructions of the control module, so that the fitting assembly fits with the outer surface of the reaction vessel and applies an external force for calibration to the reaction vessel.

[0012] Preferably, the fitting assembly includes: a fitting plate and a friction wheel. The fitting plate is connected with the telescopic assembly, and the fitting plate is used for fitting with the outer surface of the reaction vessel to drive the reaction vessel for calibration. The friction wheel is arranged on the side of the fitting plate facing the reaction vessel, and the friction wheel fits with the outer surface of the reaction vessel to reduce the contact friction force between the fitting plate and the reaction vessel.

[0013] Preferably, the fitting assembly includes: a fitting member. The fitting member includes a plurality of fitting plates rotatably connected to each other, and a torsion spring is provided at the connection of adjacent fitting plates, so that the plurality of fitting plates of the fitting assembly tend to form a C-shaped configuration. When the fitting plates are abutted against the outer surface of the reaction vessel under the action of an external force, they overcome the elastic force of the torsion spring and fit with the outer surface of the reaction vessel. At least two telescopic connecting rods are respectively connected to both sides of the telescopic assembly and connected with the fitting member. By changing the telescopic amount of the telescopic connecting rods, the orientation of the reaction vessel is adjusted.

[0014] Preferably, the calibration device further includes: a position sensor assembly. The position sensor assembly is communicatively connected to the control module. After detecting that the reaction vessel is in place, the position sensor assembly sends an in-place signal to the control module.

[0015] Preferably, the position sensing assembly includes: a first sensor and a second sensor. The first sensor is communicatively connected to the control module and is used to send a preliminary in-place signal to the control module after detecting that the reaction vessel is in place, so that the control module controls the pushing and positioning mechanism to calibrate the reaction vessel. The second sensor is communicatively connected to the control module and is used to assist in the calibration of the positioning mechanism. After detecting that the calibrated reaction vessel reaches the docking position, the second sensor sends a fully in-place signal to the control module, so that the control module controls the gas supply module to dock with the reaction vessel.

[0016] The present invention also provides a supply method for a supply system of a chemical vapor deposition device. The supply method includes:

[0017] Manipulate the translation device to be connected to the connection component to push the reaction vessel to slide along the guide rail.

[0018] In response to the preliminary in-place signal of the reaction vessel, stop pushing the reaction vessel.

[0019] Control the pushing and positioning mechanisms on both sides of the reaction vessel to fit the outer surface of the reaction vessel and calibrate the orientation of the reaction vessel.

[0020] In response to the calibration completion signal of the orientation of the reaction vessel, control the translation device to continue to push the reaction vessel to move along the guide rail to finely adjust the reaction vessel to the docking position.

[0021] In response to the fully in-place signal of the reaction vessel, stop pushing the reaction vessel and control the gas supply module to dock with the reaction vessel.

[0022] Preferably, in the step of controlling the gas supply module to dock with the reaction vessel, it specifically includes:

[0023] Control the pushing and positioning mechanism to separate from the reaction vessel;

[0024] After the pushing and positioning mechanism is reset, control the movement of the gas supply module so that the gas pipe of the gas supply module is connected to the reaction vessel.

[0025] Compared with the prior art, this patent realizes the movement of the reaction vessel along the guide rail by means of the combination of the translation device and the connection component, so as to realize the movement of the reaction vessel between various workstations and complete different operations at different workstations. And by means of the calibration device for calibrating the reaction vessel, the attitude of the reaction vessel can be adjusted, avoiding the deviation of the attitude of the reaction vessel due to uneven external forces applied during the transportation process. Ensure that the pipeline for transporting gas can be smoothly docked with the reaction vessel, thereby enabling chemical vapor deposition to proceed smoothly. At the same time, since the chemical vapor deposition furnace is changed to a continuous type, the utilization rate of the reaction chamber can be improved and the production efficiency of chemical vapor deposition can be increased. Brief Description of the Drawings

[0026] In order to more clearly illustrate the embodiments of this patent, the relevant drawings will be briefly introduced below. It can be understood that the drawings in the following description are only used to illustrate some embodiments of this patent, and those of ordinary skill in the art can also obtain many other technical features and connection relationships not mentioned in this article based on these drawings.

[0027] Figure 1 is a three-dimensional schematic diagram of a supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0028] Figure 2 is a three-dimensional schematic diagram of a supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0029] Figure 3 is a three-dimensional schematic diagram of a supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0030] Figure 4 is a three-dimensional schematic diagram of a supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0031] Figure 5 is a schematic diagram of a pushing and positioning mechanism according to an embodiment of this patent;

[0032] Figure 6 is a control module diagram of a supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0033] Figure 7 is a flowchart of a supply method of another supply system of a chemical vapor deposition device according to an embodiment of this patent;

[0034] Figure 8 is a schematic diagram of a pushing and positioning mechanism according to an embodiment of this patent.

[0035] Explanation of Reference Numerals:

[0036] a, reaction vessel; 1, connection component; 200, rotation locking piece; 201, locking port; 211, guiding rail; 300, roller; 301, guide rail; 302, translation device; 400, connection part; 401, straight rod part; 402, pushing and positioning mechanism; 500, telescopic component; 501, fitting part, 502, fitting plate; 503, telescopic connecting rod; 504, fitting component; 505, friction wheel; 506, gas supply module; 700. Detailed implementation mode

[0037] The following combines the attached drawings to elaborate on this patent in detail.

[0038] In order to improve the technical problem of the low productivity of the batch chemical vapor deposition furnace, the applicant of this patent hopes to propose a continuous chemical vapor deposition furnace. In this type of chemical vapor deposition furnace, the reaction vessel sequentially passes through the preparation chamber, the reaction chamber and the heat treatment chamber, and respectively completes the preparation of atmosphere and temperature in the preparation chamber; completes chemical vapor deposition in the reaction chamber, and completes the post-treatment heat treatment and cooling operations in the heat treatment chamber.

[0039] That is to say, during the continuous chemical vapor deposition process, it is necessary to transport the reaction vessel sequentially through the preparation chamber, the reaction chamber and the heat treatment chamber. This is because when using three different chambers to achieve a segmented continuous process, since the chambers are relatively independent of each other, when the reaction vessel completes its work in one chamber and moves to the next chamber, at this time, the previous chamber can access a new reaction vessel to achieve continuous operation. That is to say, when there is a supply system for chemical vapor deposition equipment, the preparation chamber, the reaction chamber and the heat treatment chamber of the continuous chemical vapor deposition furnace can operate on different reaction vessels simultaneously.

[0040] The applicant found that in the prior art, in order to ensure good airtightness and heat preservation performance, the reaction vessel usually has a large weight.

[0041] In view of this, the inventors of the present disclosure provided a supply system adapted to chemical vapor deposition equipment and a corresponding supply method to solve the above technical problems.

[0042] Embodiment 1

[0043] Reference Figure 3An embodiment of the present invention provides a supply system for a chemical vapor deposition apparatus. The supply system of the chemical vapor deposition apparatus includes: a reaction vessel 1, at least one connection assembly 200, a guide rail 300, and a translation device 400. The reaction vessel 1 is used to provide a reaction space for chemical vapor deposition reaction. At least one connection assembly 200 is disposed on the outer surface of the reaction vessel 1. The guide rail 300 is arranged along a straight line, and the reaction vessel 1 is disposed on the guide rail 300. The translation device 400 is detachably connected to the connection assembly 200 and is used to drive the reaction vessel 1 to move along the guide rail 300.

[0044] When it is necessary to move the reaction vessel 1, the translation device 400 can be detachably connected to the connection assembly 200 on the surface of the reaction vessel 1. In this way, the translation device 400 can apply an external force to the reaction vessel 1 to drive it to move. Since the translation device 400 and the reaction vessel 1 are connected through the connection assembly 200, there will be no relative sliding between the two during the movement process, thereby avoiding the yaw of the reaction vessel 1 relative to the end of the translation device 400 during the movement process.

[0045] Since an object has inertia, that is, after the external force is cancelled, the object will maintain its original motion state. Usually, when the reaction vessel 1 reaches the target position, once the external force is stopped, the reaction vessel 1 will continue to slide a short distance due to its own inertia, resulting in an inaccurate stopping position. However, under the action of the connection assembly 200, when the translation device 400 stops driving, the two will not separate, avoiding the stopping error caused by the inertia of the reaction vessel 1 itself, thereby ensuring the moving direction and accuracy of the reaction vessel 1.

[0046] The guide rail 300 guides the moving direction of the reaction vessel 1, ensuring that the reaction vessel 1 can accurately pass through three workstations in sequence, avoiding unnecessary offsets during the movement process, and ensuring that the reaction vessel 1 successfully completes the reaction. In addition, the guide rail 300 also reduces the friction force of the translation device 400 during the process of pushing the reaction vessel 1 to move, protects the bottom of the reaction vessel 1 from wear, and at the same time reduces the power output of the translation device 400, saving energy.

[0047] And, as Figure 1 、 Figure 2 shown, the translation device 400 includes: a power source and a transmission rod disposed on the power source. The transmission rod has: a connection portion 401 and a straight rod portion 402. The connection portion 401 is used to be detachably connected to the connection. The connection assembly 200 further includes: a rotary locking member 201. A connection groove is provided on the rotary locking member 201, and the shape of the connection groove matches the shape of the connection portion 401. The connection portion 401 is embedded in the connection groove and drives the rotary locking member 201 to rotate to detachably connect the connection portion 401 to the connection assembly 200.

[0048] As can be seen from the above, the connecting portion 401 is connected to the straight rod portion 402. Since the translation device 400 needs to push the reaction vessel 1 to pass through three workstations in the system in sequence, the straight rod portion 402 provides sufficient operating length for the passage of the reaction vessel 1, ensuring that the reaction vessel 1 can receive the external force exerted by the translation device 400. The connecting portion 401 of the translation device 400 is connected to the rotation locking member 201 of the connecting assembly 200, realizing the connection between the translation device 400 and the reaction vessel 1.

[0049] Specifically, from Figure 2 and Figure 3 it can be seen that there is a locking port 211 on the connecting assembly 200, and its shape matches that of the locking portion. The locking portion can extend into the interior of the connecting assembly 200 through the locking port 211 and be inserted into the connecting groove on the rotation locking member 201. By rotating the locking portion, the rotation locking member 201 is driven to rotate together. At this time, the horizontal projection shape of the locking port 211 no longer matches that of the locking portion, thus preventing the locking portion from passing through the locking port 211 and avoiding the separation of the translation device 400 from the connecting assembly 200.

[0050] In this embodiment, the shapes of both the locking portion and the locking port 211 are rectangular, and the shape of the connecting groove can also match that of the locking portion. The locking port 211 is arranged vertically along the length direction of the rectangle. When the translation device 400 needs to be connected to the connecting assembly 200, the locking portion is arranged vertically to match and pass through the locking port 211, and then inserted into the connecting groove on the rotation locking member 201 inside the connecting assembly 200. At this time, the connection between the connecting assembly 200 and the translation device 400 is completed. When the transmission rod of the translation device 400 rotates, it will drive the rotation locking member 201 to rotate together. For example, after rotating 90 degrees, the rectangle of the connecting portion 401 is placed horizontally and does not match the vertical rectangle of the locking port 211. In this state, the locking portion cannot pass through the locking port 211, thus realizing the stable connection between the connecting assembly 200 and the translation device 400. Similarly, when disconnecting, just rotate the straight rod portion 402 to make the rectangle of the connecting portion 401 return to the vertical state to match the locking port 211, and the locking can be smoothly released.

[0051] In this embodiment, the rotation locking member 201 is provided to prevent the locking portion from sliding after extending into the interior of the connecting assembly 200. The fixed locking portion ensures the effective transmission of the force of the translation device 400. To simplify the structure of the connecting assembly 200, the rotation locking member 201 may not be provided in other embodiments. However, in comparison, after the rotation locking member 201 is provided, the pushing effect of the translation device 400 is better, and it can effectively reduce the movement deviation caused by the shaking of the locking portion.

[0052] In addition, referring to Figure 1 、 Figure 2 、 Figure 3 、Figure 4 The guiding rail 300 is the track for the rollers 301. The roller track 301 includes two guide rails 302 and a plurality of rollers 301. The two guide rails 302 are symmetrically distributed. The plurality of rollers 301 are evenly spaced between the two guide rails 302. The reaction vessel 1 is arranged on the rollers 301 and slides along the rolling direction of the rollers 301.

[0053] It can be easily concluded from the above that the reaction vessel 1 needs to move along the guiding rail 300, and the function of the guiding rail 300 is to provide position guidance for the reaction vessel 1. By setting the roller track 301, when the reaction vessel 1 moves along the track, the plurality of rollers 301 will rotate synchronously. In this way, the movement of the reaction vessel 1 on the guiding rail 300 can reduce the friction force, thereby reducing the wear of the bottom of the reaction vessel 1 and facilitating its movement. At the same time, due to the reduction of the resistance during transportation, the external force applied by the translation device 400 to the reaction vessel 1 is also correspondingly reduced, saving energy and reducing energy consumption.

[0054] Embodiment 2

[0055] In Embodiment 1, the translation device 400 is detachably connected to the reaction vessel 1 to drive the reaction vessel 1 to move through the translation device 400, which can solve the problem of switching the reaction vessel 1 between three different workstations in the system. However, during the driving process of the translation device 400, the reaction vessel 1 may deflect due to various reasons such as force and friction, and the deflection error of the reaction vessel 1 may affect the docking between the gas supply module 700 and the reaction vessel 1 at the reaction workstation.

[0056] In view of this, referring to Figure 1 、 Figure 2 Embodiment 2 of the present invention also provides a supply system for a chemical vapor deposition device. Embodiment 2 further includes a calibration device and a control module compared to Embodiment 1. The calibration device includes two pushing and positioning mechanisms 500, which are symmetrically arranged on both sides of the guiding rail 300. The two pushing and positioning mechanisms respectively act on the outer surface of the reaction vessel 1 in a direction perpendicular to the guiding rail 300 to calibrate the orientation of the reaction vessel 1. The control module is communicatively connected to the pushing and positioning mechanism 500 to control the movement of the pushing and positioning mechanism 500 according to instructions.

[0057] Based on the above supply system, the present invention also provides a supply method for the supply system of a chemical vapor deposition device. Referring to Figure 7 shown, the supply method includes:

[0058] Operate the translation device 400 to be connected to the connection component 200 to push the reaction vessel 1 to slide along the guiding rail 300.

[0059] In response to the preliminary positioning signal of the reaction vessel 1, stop pushing the reaction vessel 1.

[0060] The pushing and positioning mechanisms 500 on both sides of the reaction container 1 are controlled to fit with the outer surface of the reaction container 1 , and the orientation of the reaction container 1 is calibrated.

[0061] In response to the calibration completion signal of the orientation of the reaction container 1 , the translation device 400 is controlled to continue to push the reaction container 1 to move along the guide rail 300 so as to fine-tune the reaction container 1 to the docking position.

[0062] In response to the signal indicating that the reaction container 1 is fully in place, the pushing of the reaction container 1 is stopped, and the gas supply module 700 is controlled to dock with the reaction container 1 .

[0063] Further, the step of controlling the gas supply module 700 to dock with the reaction container 1 specifically includes:

[0064] Control and push the positioning mechanism 500 to separate from the reaction container 1;

[0065] After the positioning mechanism 500 is pushed to reset, the air supply module 700 is controlled to move so that the air pipe of the air supply module 700 is connected to the reaction container 1 .

[0066] When the air supply module 700 is docked with the reaction container 1, it needs to be connected to the docking port on the reaction container 1 in a direction perpendicular to the guide rail 300. If the reaction container 1 deviates on the guide rail 300, the air supply module 700 is difficult to dock smoothly, or the air supply module 700 needs to be rotated to achieve docking.

[0067] In this embodiment, the reaction container 1 is positioned by arranging two push positioning mechanisms 500 on both sides of the guide rail 300. The positioning mechanisms exert force on the side walls of the reaction container 1 from both sides to make the outer side walls parallel to the guide rail 300, eliminating left and right deviations. Therefore, the docking operation can be smoothly performed.

[0068] By controlling the control module to communicate with the positioning mechanism 500 and control its operation, the reaction container 1 can be positioned and reset, thereby realizing automatic control and improving work efficiency.

[0069] In the process of supplying gas for chemical vapor deposition reaction, it is first necessary to transport the reaction vessel 1 through different workstations in sequence. During the transportation process, due to the action of the translation device 400, there may be some slight changes in the attitude and orientation of the reaction vessel 1. Therefore, after moving the reaction vessel 1 to the target position, it is first necessary to calibrate the orientation of the reaction vessel 1. The positioning mechanisms located on both sides of the reaction vessel 1 apply forces to its side walls from both sides of the reaction vessel 1 respectively. Due to the opposite action of the two pushing and positioning mechanisms 500, the side wall of the reaction vessel 1 is squeezed and deflected in a direction parallel to the guide rail 300 until the outer side wall of the reaction vessel 1 is parallel to the guide rail 300, so as to ensure that there is no left-right deviation when the reaction vessel 1 moves along the guide rail 300. At this time, the reaction vessel 1 completes the adjustment in the left-right direction along the guide rail 300, and precise adjustment is still required in the direction along the guide rail 300. By further controlling the translation device 400 to push the reaction vessel 1 to move, and stop pushing the reaction vessel 1 after detecting that the reaction vessel 1 has accurately reached the target along the track direction. Since the adjustment position for adjusting the orientation of the reaction vessel 1 is very close to the docking position for docking the reaction vessel 1 with the gas supply module 700, the distance between the two is used for adjusting the orientation of the reaction vessel 1. Therefore, this moving distance for precise positioning is too short to affect the orientation of the reaction vessel 1, enabling the docking between the gas supply module 700 and the reaction vessel 1 after the reaction vessel 1 is in place. The reaction vessel 1 can pass through different workstations in the system and can complete the precise positioning of the reaction vessel 1, thus meeting the docking and gas supply between the gas supply module 700 and the reaction vessel 1.

[0070] The control module controls its operation through a communication connection with the pushing and positioning mechanism 500. When it is necessary to position the reaction vessel 1, the control module commands the pushing and positioning mechanism 500 to work; after the positioning is completed, the attitude of the reaction vessel 1 can meet the docking requirements between the gas supply module 700 and the reaction vessel 1 at this time. Therefore, in order to facilitate the smooth docking between the gas supply module 700 and the reaction vessel 1, after the pushing and positioning mechanism 500 completes the positioning work, the pushing and positioning mechanism 500 will separate from the reaction vessel 1 to provide sufficient space for the docking between the gas supply module 700 and the reaction vessel 1, avoiding unnecessary interference between some components of the pushing and positioning mechanism 500 and the gas supply module 700. This automatic control mechanism not only completes the automatic control of the chemical vapor deposition equipment supply system but also improves the work efficiency.

[0071] Furthermore, referring to Figure 5 、 Figure 6The pushing and positioning mechanism 500 includes: a fitting component 505 and a telescopic component 501. The fitting component 505 is used to fit with the outer surface of the reaction vessel 1 to drive the reaction vessel 1 for calibration. The telescopic component 501 is connected to the fitting component 505 and communicatively connected to the control module; according to the instructions of the control module, the telescopic component 501 drives the fitting component 505 to move in a direction perpendicular to the guide rail 300, so that the fitting component 505 fits with the outer surface of the reaction vessel 1 and applies an external force for calibration to the reaction vessel 1.

[0072] The telescopic component 501 can carry the fitting component 505 to move so that it closely fits with the outer surface of the reaction vessel 1. When adjusting the positioning and orientation of the reaction vessel 1, the telescopic component 501 first drives the fitting component 505 to move towards both sides of the reaction vessel 1. After the fitting component 505 contacts the outer side wall of the reaction vessel 1, the telescopic component 501 continues to work, so that the fitting component 505 applies pressure to the reaction vessel 1 from both sides to adjust its orientation for smooth docking with the gas supply module 700. In this embodiment, the telescopic component 501 can be selected to use a hydraulic rod. Given the relatively large weight of the reaction vessel 1, a relatively large external force is required during calibration. The hydraulic rod can push the relatively heavy reaction vessel 1, so it can ensure the smooth progress of calibration.

[0073] In addition, in some embodiments of the present invention, the fitting component 505 further includes: a fitting plate 503 and a friction wheel 506. The fitting plate 503 is connected to the telescopic component 501, and the fitting plate 503 is used to fit with the outer surface of the reaction vessel 1 to drive the reaction vessel 1 for calibration. The friction wheel 506 is arranged on the side of the fitting plate 503 facing the reaction vessel 1, and the friction wheel 506 fits with the outer surface of the reaction vessel 1 to reduce the contact friction between the fitting plate 503 and the reaction vessel 1.

[0074] Obviously, as the core part of the chemical vapor deposition (CVD) equipment, the accurate positioning and calibration of the reaction vessel 1 are crucial for preparing high-purity and high-performance solid films. After both sides of the pushing and positioning mechanism 500 are closely fitted with the outer side wall of the reaction vessel 1, the orientation of the reaction vessel 1 is adjusted and fixed. Next, the pipeline docking of the gas supply module 700 needs to be carried out.

[0075] Since the gas supply module 700 needs to be connected to multiple pipelines simultaneously, and each pipeline is arranged along the direction of the guide rail 300, in order to ensure that each pipeline can be smoothly inserted into the reaction vessel 1, we need to precisely adjust the reaction vessel 1 along the direction of the guide rail 300. To prevent the reaction vessel 1 from deflecting during the precise adjustment, the pushing and positioning mechanism 500 can clamp the reaction vessel 1 from both sides. At this time, the friction wheels 506 located on the fitting plate 503 will contact the outer wall of the reaction vessel 1. When using the translation device 400 to precisely adjust the reaction vessel 1, both sides of the reaction vessel 1 will be limited by the fitting plate 503 and the friction wheels 506 to prevent sliding. Since the reaction vessel 1 will move slightly along the guide rail 300 during the precise adjustment, it will generate friction with the fitting plate 503. The friction wheels 506 can rotate when the reaction vessel 1 slides, thereby converting sliding friction into rolling friction, reducing the frictional force. On the one hand, this can avoid the wear of the outer surface of the reaction vessel 1 caused by precise adjustment. On the other hand, it also saves the output power of the translation device 400 and reduces energy consumption.

[0076] When the required output power of the translation device 400 is reduced, the external force required to drive the reaction vessel 1 to move the same distance is also correspondingly reduced, which makes the driving distance easier to control and can further improve the operation accuracy.

[0077] Furthermore, in the embodiment of the present invention, the fitting assembly 505 includes: a fitting member 502. The fitting member 502 includes a plurality of fitting plates 503 that are rotatably connected to each other, and a torsion spring is provided at the connection of adjacent fitting plates 503 so that the plurality of fitting plates 503 of the fitting assembly 505 tend to form a C-shaped configuration. When the fitting plate 503 abuts against the outer surface of the reaction vessel 1 under the action of an external force, it overcomes the elastic force of the torsion spring and fits with the outer surface of the reaction vessel 1. At least two telescopic connecting rods 504 are respectively connected to both sides of the telescopic assembly 501 and are connected to the fitting member 502. By changing the telescopic amount of the telescopic connecting rods 504, the orientation of the reaction vessel 1 is adjusted.

[0078] The fitting member 502 formed by rotatably connecting a plurality of fitting plates 503 can perform adaptive fitting during the process of fitting with the reaction vessel 1. Specifically, since there is usually an angle between the side wall of the reaction vessel 1 and the length direction of the guide rail 300 when calibrating the reaction vessel 1, it is difficult for the fitting member 502 to completely fit with the outer surface of the reaction vessel 1 when the pushing and positioning mechanism 500 works.

[0079] By setting each fitting plate 503 as a fitting member 502 composed of rotatable connections to each other, with the help of the rotation between the fitting plates 503, a closer match with the side wall of the reaction vessel 1 can be achieved, enabling the fitting member 502 to completely fit with the side wall before calibration.

[0080] In addition, the torsion spring at the connection can provide a resilience force between the fitting plates 503. After the fitting plates 503 rotate to adapt to the outer wall of the reaction vessel 1, the resilience force makes them closely adhere to the outer wall, improving the adaptability of the fitting component 502 and ensuring the fitting degree.

[0081] It is worth mentioning that the side wall of the reaction vessel 1 can be set in an arc shape. Correspondingly, the multiple fitting plates 503 of the fitting assembly 505 can be set to form a C shape. Such a fitting assembly 505 can better fit the arc outer wall of the reaction vessel 1, and calibrate the attitude of the reaction vessel 1 through optimized fitting to ensure the accuracy of the adjusted orientation.

[0082] In addition, the telescopic connecting rods on both sides of the telescopic assembly 501 rotate the fitting component 502 through telescoping, thereby changing the orientation of the reaction vessel 1. Taking Figure 5 the illustrated embodiment as an example, the two telescopic connecting rods 504 are symmetrically arranged on both sides of the telescopic assembly 501 respectively. When one side of the telescopic connecting rod 504 retracts, the other side of the telescopic connecting rod 504 extends, and the fitting component 502 rotates towards the retracting side, driving the reaction vessel 1 to rotate to achieve orientation adjustment.

[0083] In some other embodiments, the number of the telescopic connecting rods 504 can be set to be multiple and even to achieve symmetrical arrangement, thereby ensuring that the rotational external force applied by the fitting component 502 is uniform and ensuring the calibration accuracy.

[0084] Finally, as shown in Figure 6 the calibration device further includes: a position sensor assembly. The position sensor assembly is communicatively connected to the control module. After detecting that the reaction vessel 1 is in place, the position sensor assembly sends an in-place signal to the control module. Preferably, the position sensing assembly includes: a first sensor and a second sensor. The first sensor is communicatively connected to the control module and is used to send a preliminary in-place signal to the control module after detecting that the reaction vessel 1 is in place, so that the control module controls the pushing and positioning mechanism 500 to calibrate the reaction vessel 1. The second sensor is communicatively connected to the control module and is used to assist in the calibration of the positioning mechanism. After detecting that the calibrated reaction vessel 1 reaches the docking position, the second sensor sends a fully in-place signal to the control module, so that the control module controls the gas supply module 700 to dock with the reaction vessel 1.

[0085] From the above content, it is not difficult to conclude that the reaction vessel 1 only needs to perform orientation calibration after reaching the designated position for docking with the gas supply module 700. After completing the orientation calibration of the reaction vessel 1, in order to ensure that the gas pipes of the gas supply module 700 can be smoothly inserted into the reaction vessel 1, it is necessary to precisely adjust the reaction vessel 1 along the direction of the guide rail 300. Therefore, during the docking process of the reaction vessel 1, orientation calibration is usually performed first, and then precise positioning. The calibration position of the reaction vessel 1 is very close to the docking position of the gas supply module 700. After completing the orientation calibration of the reaction vessel 1, only a small additional displacement needs to be continued to achieve precise positioning.

[0086] Specifically, the first sensor is responsible for detecting whether the reaction vessel 1 has reached the position of the calibrated orientation. Once the first sensor detects the reaction vessel 1, this indicates that the reaction vessel 1 has reached the position of the calibrated orientation. At this time, the control module will command the pushing and positioning mechanism 500 to adjust the orientation of the reaction vessel 1. After the orientation adjustment is completed, the translation device 400 will precisely position the reaction vessel 1.

[0087] When the second sensor detects the reaction vessel 1, this means that the reaction vessel 1 has reached the position where it can be connected to the gas pipes of the gas supply module 700. The control module then controls the gas supply module 700 to dock with the reaction vessel 1. Since the reaction vessel 1 has been precisely positioned along the direction of the guide rail 300, each pipeline of the gas supply module 700 can thus be smoothly connected to the docking port on the reaction vessel 1, ensuring that the pipeline can be smoothly inserted into the docking port.

[0088] In this embodiment, through the collaborative work of the first sensor and the second sensor, the preliminary calibration and precise positioning of the reaction vessel 1 are completed, ensuring that the reaction vessel 1 is precisely positioned in all four directions on the horizontal plane. Due to the presence of the guide rail 300, there will be no error in the vertical direction of the reaction vessel 1, thus achieving full positioning. In this way, the docking between the gas supply module 700 and the reaction vessel 1 is realized, avoiding the docking failure caused by the positioning error of the reaction vessel 1 and ensuring the working efficiency.

[0089] Embodiment 3

[0090] The present invention also provides a supply method for a supply system of a chemical vapor deposition device. Embodiment 3 is mainly used to solve how to use the supply systems in Embodiment 1 and Embodiment 2 to complete the supply of the gas for reaction in the reaction vessel 1. Refer to Figure 7 The above-mentioned supply method includes:

[0091] Control the translation device 400 to be connected to the connection component 200 to push the reaction vessel 1 to slide along the guide rail 300.

[0092] In response to the preliminary positioning signal of the reaction vessel 1, abort the propulsion of the reaction vessel 1.

[0093] Control the propulsion positioning mechanisms 500 on both sides of the reaction vessel 1 to fit against the outer surface of the reaction vessel 1 and calibrate the orientation of the reaction vessel 1.

[0094] In response to the signal indicating that the orientation of the reaction vessel 1 has been calibrated, control the translation device 400 to continue to propel the reaction vessel 1 along the guide rail 300 to finely adjust the reaction vessel 1 to the docking position.

[0095] In response to the signal indicating that the reaction vessel 1 is fully in place, stop propelling the reaction vessel 1 and control the gas supply module 700 to dock with the reaction vessel 1.

[0096] Furthermore, in the step of controlling the gas supply module 700 to dock with the reaction vessel 1, it specifically includes:

[0097] Control the propulsion positioning mechanisms 500 to separate from the reaction vessel 1;

[0098] After the propulsion positioning mechanisms 500 are reset, control the movement of the gas supply module 700 so that the gas pipes of the gas supply module 700 are connected to the reaction vessel 1.

[0099] Finally, it should be noted that those of ordinary skill in the art can understand that in order to enable readers to better understand this patent, many technical details are presented in the embodiments of this patent. However, even without these technical details and various changes and modifications based on the above embodiments, the technical solutions claimed in each claim of this patent can be basically achieved. Therefore, in practical applications, various changes can be made in form and details to the above embodiments without departing from the spirit and scope of this patent.

Claims

1. A supply system for a chemical vapor deposition device, characterized in that, Comprising: A reaction vessel for providing a reaction space for chemical vapor deposition reaction; At least one connecting component provided on the outer surface of the reaction vessel; A guiding rail arranged along a straight line, and the reaction vessel is arranged on the guiding rail; A translation device detachably connected to the connecting component for driving the reaction vessel to move along the guiding rail; The supply system of the chemical vapor deposition equipment further includes: A calibration device, including: Two pushing and positioning mechanisms symmetrically arranged on both sides of the guiding rail; The two pushing and positioning mechanisms respectively act on the outer surface of the reaction vessel in a direction perpendicular to the guiding rail for calibrating the orientation of the reaction vessel; A control module communicatively connected to the pushing and positioning mechanism to control the movement of the pushing and positioning mechanism according to instructions; The pushing and positioning mechanism includes: A fitting component for fitting with the outer surface of the reaction vessel to drive the reaction vessel for calibration; A telescopic component connected to the fitting component and communicatively connected to the control module; the telescopic component drives the fitting component to move in a direction perpendicular to the guiding rail according to the instructions of the control module, so that the fitting component fits with the outer surface of the reaction vessel and applies an external force for calibration to the reaction vessel; The fitting component includes: A fitting plate connected to the telescopic component, and the fitting plate is used for fitting with the outer surface of the reaction vessel to drive the reaction vessel for calibration; Friction wheels arranged on the side of the fitting plate facing the reaction vessel, and the friction wheels fit with the outer surface of the reaction vessel to reduce the contact friction between the fitting plate and the reaction vessel; The fitting component includes a fitting part including a plurality of fitting plates rotatably connected to each other, and a torsion spring is arranged at the connection of adjacent fitting plates, so that the plurality of fitting plates of the fitting component tend to form a C-shaped configuration. When the fitting plates abut against the outer surface of the reaction vessel under the action of an external force, they overcome the elastic force of the torsion spring and fit with the outer surface of the reaction vessel; At least two telescopic connecting rods respectively connected to both sides of the telescopic component and connected to the fitting part; By changing the telescopic amount of the telescopic connecting rod, the orientation of the reaction vessel is adjusted.

2. The supply system of the chemical vapor deposition equipment according to claim 1, characterized in that The translation device includes: A power source and a transmission rod provided on the power source, and the transmission rod has: A connection part and a straight rod part, and the connection part is used for detachably connecting with the connection; The connecting component further includes: A rotary locking part, and a connection groove is arranged on the rotary locking part, and the shape of the connection groove matches the shape of the connection part; the connection part is embedded in the connection groove and drives the rotary locking part to rotate to detachably connect the connection part with the connecting component.

3. The supply system of the chemical vapor deposition equipment according to claim 1, characterized in that, The guiding rail is a roller track; the roller track includes: Two guide rails symmetrically distributed; A plurality of rollers evenly spaced between the two guide rails, and the reaction vessel is arranged on the rollers and slides along the rolling direction of the rollers.

4. The supply system of the chemical vapor deposition equipment according to claim 1, characterized in that The calibration device further includes: A position sensor assembly, communicatively connected to the control module, which sends an in-place signal to the control module after detecting that the reaction vessel is in place.

5. The supply system of the chemical vapor deposition equipment according to claim 4, characterized in that, The position sensing assembly includes: A first sensor, communicatively connected to the control module, which sends a preliminary in-place signal to the control module after detecting that the reaction vessel is in place, so that the control module controls the pushing and positioning mechanism to calibrate the reaction vessel; A second sensor, communicatively connected to the control module, which is used to assist in the calibration of the pushing and positioning mechanism and sends a full in-place signal to the control module after detecting that the calibrated reaction vessel reaches the docking position, so that the control module controls the gas supply module to dock with the reaction vessel.

6. A supply method of a supply system of a chemical vapor deposition equipment, characterized in that, Applied to the supply system according to any one of claims 1-5, the supply method includes: Controlling the translation device to be connected to the connection component to push the reaction vessel to slide along the guide rail; Responding to the preliminary in-place signal of the reaction vessel, aborting the pushing of the reaction vessel; Controlling the pushing and positioning mechanisms on both sides of the reaction vessel to fit against the outer surface of the reaction vessel and calibrating the orientation of the reaction vessel; Responding to the calibration completion signal of the orientation of the reaction vessel, controlling the translation device to continue pushing the reaction vessel along the guide rail to finely adjust the reaction vessel to the docking position; Responding to the full in-place signal of the reaction vessel, stopping the pushing of the reaction vessel and controlling the gas supply module to dock with the reaction vessel.

7. The supply method of the supply system of the chemical vapor deposition equipment according to claim 6, characterized in that, In the step of controlling the gas supply module to dock with the reaction vessel, it specifically includes: Controlling the pushing and positioning mechanism to separate from the reaction vessel; After the pushing and positioning mechanism is reset, controlling the movement of the gas supply module so that the trachea of the gas supply module is connected to the reaction vessel.

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