An error measurement method, device and equipment of a circuit patch board and a storage medium

Abstract

This invention discloses a method, apparatus, device, and storage medium for measuring the error of a circuit splicing board. The method includes acquiring a theoretical image and an actual image of the circuit splicing board. The circuit splicing board includes at least two splicing sub-boards, with the sub-board located in the theoretical image being the theoretical splicing sub-board and the sub-board located in the actual image being the actual splicing sub-board. Based on the theoretical and actual images, at least two points located within the theoretical splicing sub-board in the theoretical image are selected as theoretical marker points, and at least two points located within the actual splicing sub-board in the actual image corresponding to the theoretical marker points are selected as actual marker points. The theoretical and actual images are placed in the same measurement coordinate system. The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical and actual marker point in the measurement coordinate system. The technical solution of this invention can improve the accuracy of measuring the splicing error of a circuit splicing board.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method, apparatus, device, and storage medium for measuring the error of a circuit splicing board. Background Technology

[0002] In the field of printed circuit board (PCB) manufacturing, PCBs are susceptible to expansion and deformation due to environmental factors. When expansion and deformation occur in certain areas of the PCB, it can affect the overall operation of the PCB. To avoid this problem, existing technology divides the original complete PCB into multiple sub-boards. After each sub-board is inspected separately, a board assembly machine is used to splice the sub-boards together to form a complete PCB.

[0003] In actual operation, due to accuracy errors in the motion control system in the X and Y directions, as well as calibration errors in the positional relationships of various components, the position of the spliced ​​sub-boards differs from their theoretical positions. This error leads to placement errors when mounting components onto the sub-boards based on their theoretical positions, affecting the overall quality of the circuit board. Therefore, how to detect the splicing errors of the sub-boards produced by the PCB splicing machine and thus improve the quality of the circuit board manufacturing is a pressing technical problem that needs to be solved. Summary of the Invention

[0004] This invention provides a method, apparatus, device, and storage medium for measuring the error of a circuit splicing board, which can improve the accuracy of measuring the splicing error of the circuit splicing board.

[0005] In a first aspect, the present invention provides a method for measuring the error of a circuit splicing board, comprising:

[0006] Obtain the theoretical image and the actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board;

[0007] Based on the theoretical image and the actual image, at least two points in the theoretical image located within the theoretical splicing sub-board are selected as theoretical marker points, and at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points are selected as actual marker points;

[0008] The theoretical image and the actual image are placed in the same measurement coordinate system;

[0009] The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system; the error parameters include at least distance error and angle error.

[0010] Optionally, based on the theoretical image and the actual image, at least two points located within the theoretical splicing sub-panel in the theoretical image are selected as theoretical marker points, and at least two points located within the actual splicing sub-panel in the actual image corresponding to the theoretical marker points are selected as actual marker points, including:

[0011] Based on the theoretical image, at least two points located within the theoretical splicing sub-board are selected as theoretical marker points;

[0012] Based on the position parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located, at least two points in the actual image that correspond to the theoretical marker points within the actual splicing sub-board are selected as actual marker points; the position parameters include at least distance parameters and orientation parameters.

[0013] Optionally, based on the position parameters of the theoretical marker points in the region where the theoretical stitching sub-board is located, at least two points in the actual image located within the actual stitching sub-board and corresponding to the theoretical marker points are selected as actual marker points, including:

[0014] Based on the orientation parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located, the area to be marked on the actual splicing sub-board is determined;

[0015] Based on the distance parameter of the theoretical marker point in the area where the theoretical splicing sub-board is located, the actual marker point in the area to be marked is determined.

[0016] Optionally, the error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system, including:

[0017] Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, the theoretical center point of the theoretical image and the actual center point of the actual image are determined; the theoretical center point is the geometric center of the theoretical image; the actual center point is the geometric center of the actual image.

[0018] Based on the position coordinates of the theoretical center point and the position coordinates of the actual center point, a first adjustment parameter for the actual image is determined; the first adjustment parameter includes an adjustment distance.

[0019] According to the first adjustment parameter, the position of the actual image in the measurement coordinate system is adjusted so that the geometric centers of the actual image and the theoretical image overlap and align.

[0020] The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjustment position coordinates of each actual marker point in the measurement coordinate system.

[0021] Optionally, the theoretical center point of the theoretical image and the actual center point of the actual image are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, including:

[0022] Based on the position coordinates of each theoretical marker point in the measurement coordinate system, the theoretical center point of the theoretical image is calculated and determined using the segmentation method.

[0023] The actual center point of the actual image is determined by calculating the original position coordinates of each actual marker point in the measurement coordinate system based on the segmentation method.

[0024] Optionally, the error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, including:

[0025] Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, a second adjustment parameter of the actual image is calculated and determined using the least squares method; the second adjustment parameter includes at least a rotation angle.

[0026] According to the second adjustment parameter, the position of the actual image in the measurement coordinate system is adjusted so that the actual image and the theoretical image are aligned.

[0027] The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment position coordinates of each actual marker point in the measurement coordinate system.

[0028] Optionally, the error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjusted position coordinates of each actual marker point in the measurement coordinate system, including:

[0029] The actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated.

[0030] Based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system in the theoretical sub-board to be calibrated, and the second adjusted lateral position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the lateral distance error between each actual marker point and each theoretical marker point is determined.

[0031] Based on the longitudinal position coordinates of each theoretical marker point in the measurement coordinate system in the theoretical sub-board to be calibrated, and the second adjusted longitudinal position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the longitudinal distance error between each actual marker point and each theoretical marker point is determined.

[0032] The theoretical angle of the theoretical sub-board to be calibrated is determined based on the position coordinates of each theoretical marker point in the measurement coordinate system.

[0033] The actual angle of the actual sub-board to be measured is determined based on the position coordinates of each actual mark point in the actual sub-board to be measured in the measurement coordinate system.

[0034] The angle error is determined based on the theoretical angle and the actual angle.

[0035] The next actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated. The process returns to the execution of each step from determining the longitudinal distance error between each actual mark and each theoretical mark based on the lateral position coordinates of each theoretical mark point in the measurement coordinate system in the theoretical sub-board to be calibrated, until the error parameters of each actual splicing sub-board are measured; the distance error includes lateral distance error and longitudinal distance error.

[0036] Secondly, the present invention provides an error measurement device for a circuit splicing board, comprising:

[0037] An image acquisition module is used to acquire theoretical and actual images of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board;

[0038] The marker point selection module is used to select at least two points located within the theoretical splicing sub-board in the theoretical image as theoretical marker points, and select at least two points located within the actual splicing sub-board in the actual image that correspond to the theoretical marker points as actual marker points, based on the theoretical image and the actual image.

[0039] An image processing and measurement module is used to place the theoretical image and the actual image in the same measurement coordinate system;

[0040] An error determination module is used to determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system; the error parameters include at least distance error and angle error.

[0041] Thirdly, the present invention provides an electronic device, the electronic device comprising:

[0042] At least one processor; and

[0043] A memory communicatively connected to the at least one processor; wherein,

[0044] The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the error measurement method for the circuit board described in the first aspect.

[0045] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions that, when executed by a processor, implement the error measurement method for the circuit panel described in the first aspect.

[0046] The technical solution provided by this invention selects at least two points located within the theoretical sub-board of the circuit splicing board as theoretical marker points in the theoretical image of the circuit splicing board, and selects at least two points located within the actual sub-board of the circuit splicing board that correspond to the theoretical marker points as actual marker points in the actual image of the circuit splicing board. By placing the theoretical image and the actual image in the same measurement coordinate system, the error parameters of each splicing sub-board in the circuit splicing board can be determined based on the position coordinates of at least two theoretical marker points located in the theoretical sub-board and at least two actual marker points located in the actual splicing sub-board, thereby improving the accuracy of error measurement. When mounting electrical components on each splicing sub-board of the circuit splicing board, the mounting accuracy and reliability of the electrical components can be improved based on these error parameters. Attached Figure Description

[0047] Figure 1 A flowchart illustrating an error measurement method for a circuit splicing board provided in an embodiment of the present invention;

[0048] Figure 2 A theoretical schematic diagram of a circuit splicing board provided in an embodiment of the present invention;

[0049] Figure 3 This is a schematic diagram of an actual circuit splicing board provided in an embodiment of the present invention;

[0050] Figure 4 A flowchart of another error measurement method for a circuit splicing board provided in an embodiment of the present invention;

[0051] Figure 5 A flowchart illustrating another error measurement method for a circuit splicing board provided in an embodiment of the present invention;

[0052] Figure 6 A schematic diagram of the placement structure of an actual image and a theoretical image provided in an embodiment of the present invention;

[0053] Figure 7 A flowchart illustrating another error measurement method for a circuit splicing board provided in an embodiment of the present invention;

[0054] Figure 8 A schematic diagram of another placement structure of actual and theoretical images provided in an embodiment of the present invention;

[0055] Figure 9 A schematic diagram of another placement structure of actual and theoretical images provided in an embodiment of the present invention;

[0056] Figure 10 This is a schematic diagram of the structure of an error measurement device for a circuit splicing board provided in an embodiment of the present invention;

[0057] Figure 11 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0058] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0059] Figure 1 This is a flowchart illustrating an error measurement method for a circuit panel according to an embodiment of the present invention. It is applicable to measuring the splicing error of a circuit panel. This method can be executed by an error measurement device for the circuit panel provided in this embodiment, which can be implemented in hardware and / or software. Figure 1 As shown, the error measurement method for this circuit board splicing board includes:

[0060] S101. Obtain the theoretical and actual images of the circuit splicing board.

[0061] The circuit splicing board includes at least two splicing sub-boards. The splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board. The circuit splicing board is composed of at least two splicing sub-boards. Figure 2 This is a theoretical schematic diagram of a circuit splicing board provided in an embodiment of the present invention, such as... Figure 2 As shown, the circuit splicing board in the theoretical image includes multiple theoretical splicing sub-boards 10, and each theoretical splicing sub-board 10 is arranged in an array. Figure 3 This is a schematic diagram of an actual circuit splicing board provided in an embodiment of the present invention, such as... Figure 3 As shown, the circuit splicing board in the actual image includes multiple actual splicing sub-boards 20, and each theoretical splicing sub-board is arranged in an array.

[0062] Specifically, a theoretical image of the circuit panel can be obtained through a layout device. For example, users can use computer-aided design (CAD) equipment to design the placement of each sub-board in the circuit panel to form a theoretical image. The actual sub-boards can then be assembled using a panel mounting machine or similar equipment to form the circuit panel. Afterward, a charge-coupled device (CCD) is used to acquire an actual image of the assembled circuit panel. This image is then used to measure the error parameters of the circuit panel based on both the actual and theoretical images.

[0063] Understandable, Figure 2 and Figure 3 The example only shows a circuit panel comprising 16 sub-panels, each a square structure of uniform size. The shapes of the sub-panels can be the same or different, depending on actual needs. For instance, the circuit panel may include two sub-panels, one circular and the other rectangular. Provided the circuit panel includes at least two sub-panels, the number of sub-panels and their shapes can be customized as needed; no specific limitations are imposed here.

[0064] S102. Based on the theoretical image and the actual image, select at least two points in the theoretical image located within the theoretical splicing sub-board as theoretical marker points, and select at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points as actual marker points.

[0065] Among them, reference Figure 2Each theoretical splicing sub-board 10 contains two theoretical markers: one located at the upper right corner and the other at the lower left corner. The position and number of theoretical markers can be set according to actual needs and are not specifically limited here.

[0066] Specifically, if only one theoretical marker is set in the theoretical splicing sub-board, and only one actual marker corresponding to the theoretical marker is set in the actual splicing sub-board, when the theoretical marker and the actual marker are detected to coincide, it can only indicate that the positions of the theoretical marker and the actual marker coincide. However, the actual splicing sub-board where the actual marker is located may partially or completely coincide with the theoretical splicing sub-board where the theoretical marker is located. In this case, it is impossible to further determine the relative positional relationship between the actual splicing sub-board and the theoretical splicing sub-board based on the theoretical marker and the actual marker, resulting in the inability to accurately measure the error parameters of each actual splicing sub-board in the circuit splicing board. Therefore, based on the shape and other parameters of each theoretical sub-board in the theoretical image, at least two points located within the theoretical sub-board can be selected as theoretical marker points. Based on the shape and other parameters of each actual sub-board in the actual image, at least two points located within the actual sub-board in the actual image that correspond to the theoretical marker points can be selected as actual marker points. This allows for the determination of the splicing error of each actual sub-board in the circuit splicing board based on the relative positions of the actual marker points and the theoretical marker points, thereby improving the accuracy of error measurement.

[0067] S103. Place the theoretical image and the actual image in the same measurement coordinate system.

[0068] The measurement coordinate system can be a two-dimensional or three-dimensional coordinate system, which can be set according to actual needs. For ease of description, the following embodiments will use a two-dimensional coordinate system as an example.

[0069] Specifically, in order to facilitate the measurement of the stitching error between the actual image and the theoretical image, the actual image and the theoretical image can be placed in the same plane of the measurement coordinate system, so as to determine the error parameter based on the coordinates of the actual marker points and the theoretical marker points in the measurement coordinate system.

[0070] S104. Determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical and actual marker point in the measurement coordinate system.

[0071] The error parameters include at least distance error and angle error.

[0072] Specifically, after placing the theoretical and actual images in the same measurement coordinate system, each actual and theoretical marker point has corresponding position coordinates in this system. Based on these coordinates, translation and / or rotation operations can be performed on either the actual or theoretical image to align them. The distance between the current actual and theoretical marker points is then used as the distance error. For example, for the same sub-board in a circuit splicing board, if the distance between each theoretical and actual marker point is zero, the distance error of the sub-board is zero, and no splicing error occurred during the board installation process. The angle between the line connecting two theoretical marker points in the theoretical splicing sub-board and the horizontal or vertical axis of the measurement coordinate system is used as the theoretical angle. Similarly, the angle between the line connecting two actual marker points in the actual splicing sub-board and the horizontal or vertical axis of the measurement coordinate system is used as the actual angle. The difference between the actual angle and the theoretical angle is taken as the angle error. If the difference between the actual angle and the theoretical angle is zero, it means that there is no angle error in the actual splicing sub-board.

[0073] The technical solution of this invention selects at least two points located within the theoretical sub-board of the circuit splicing board as theoretical marker points in the theoretical image of the circuit splicing board, and selects at least two points located within the actual sub-board of the circuit splicing board that correspond to the theoretical marker points as actual marker points in the actual image of the circuit splicing board. By placing the theoretical image and the actual image in the same measurement coordinate system, the error parameters of each splicing sub-board in the circuit splicing board can be determined based on the position coordinates of at least two theoretical marker points located in the theoretical sub-board and at least two actual marker points located in the actual splicing sub-board, thereby improving the accuracy of error measurement. When mounting electrical components on each splicing sub-board of the circuit splicing board, the mounting accuracy and reliability of the electrical components can be improved based on these error parameters.

[0074] Based on the above embodiments, this embodiment of the invention describes the case where, according to the theoretical image and the actual image, at least two points located within the theoretical splicing sub-board in the theoretical image are selected as theoretical marker points, and at least two points located within the actual splicing sub-board in the actual image that correspond to the theoretical marker points are selected as actual marker points. Figure 4 A flowchart of another error measurement method for a circuit splicing board provided in an embodiment of the present invention is shown below. Figure 4 As shown, the error measurement method includes:

[0075] S201. Obtain the theoretical and actual images of the circuit splicing board.

[0076] The circuit splicing board includes at least two splicing sub-boards. The splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board.

[0077] S202. Based on the theoretical image, select at least two points located within the theoretical splicing sub-board as theoretical marker points.

[0078] Specifically, based on parameters such as the shape of each theoretical sub-panel in the theoretical image, at least two points located within the theoretical sub-panel can be selected as theoretical marker points. (Reference) Figure 2 Each theoretical splicing sub-board is square in shape. Two points can be selected as theoretical marker points on the diagonal of the theoretical splicing board, or two points can be selected on the central axis of the theoretical splicing board. The selection positions of the theoretical marker points can also be other, and can be set according to actual needs. No specific limitation is made here.

[0079] S203. Based on the position parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located, select at least two points in the actual image that correspond to the theoretical marker points within the actual splicing sub-board as actual marker points.

[0080] The location parameters include at least distance and orientation parameters.

[0081] Specifically, after the theoretical marker points are determined, the position parameters of the theoretical marker points in the area where the theoretical stitching sub-board sits can be obtained. Based on the position parameters, marker points that are consistent with the position parameters are selected in the actual stitching sub-board of the actual image as actual marker points, so as to improve the correspondence between the actual marker points and the theoretical marker points, and thus improve the accuracy of determining the error parameters based on the position coordinates of the theoretical marker points and the actual marker points.

[0082] Optionally, based on the position parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located, at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points are selected as actual marker points. This includes determining the area to be marked in the actual splicing sub-board based on the orientation parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located; and determining the actual marker points within the area to be marked based on the distance parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located.

[0083] The orientation parameter represents the direction of the theoretical marker point relative to the center of the theoretical splicing sub-board. The distance parameter represents the distance between the theoretical marker point and a fixed point or line within the theoretical splicing sub-board.

[0084] For details, please refer to Figure 2 and Figure 3The following explanation uses theoretical splicing sub-board 11 and actual splicing sub-board 21 as examples. Two theoretical marker points are selected in theoretical splicing sub-board 11, including a first theoretical marker point 31 and a second theoretical marker point 32 located on the diagonal of theoretical splicing sub-board 11. The first theoretical marker point 31 is located at the upper right corner of theoretical splicing sub-board 11, and the second theoretical marker point 32 is located at the lower left corner of theoretical splicing sub-board 11. The upper right and lower left corners are azimuth parameters. There is a first distance between the first theoretical marker point 31 and the first theoretical edge 111, a second distance between the first theoretical marker point 31 and the second theoretical edge 112, a third distance between the second theoretical marker point 32 and the third theoretical edge 113, and a fourth distance between the second theoretical marker point 32 and the fourth theoretical edge 114. The first, second, third, and fourth distances are all distance parameters. Based on the azimuth parameters, the first area to be marked in the actual splicing sub-board 21 is determined to be the upper right area of ​​the actual splicing sub-board 21. The second area to be marked is the lower left area of ​​the actual splicing sub-board 21. Then, based on the first and second spacing parameters, the point in the first area to be marked where the distance to the first actual edge 211 is the first spacing, and the distance to the second actual edge 212 is the second spacing, is designated as the first actual marking point. Based on the third and fourth spacing parameters, the point in the second area to be marked where the distance to the third actual edge 213 is the third spacing, and the distance to the fourth actual edge 214 is the fourth spacing, is designated as the second actual marking point 42. This improves the accuracy of the positional correspondence between the actual marking points and the theoretical marking points, thereby improving the accuracy and reliability of subsequent error measurements.

[0085] Understandable, Figure 2 and Figure 3 The diagram only shows that the first theoretical marker point and the first actual marker point are both located in the upper right corner of the splicing sub-panel, while the second theoretical marker point and the second actual marker point are both located in the lower left corner of the splicing sub-panel, and the number and position of marker points are the same in each splicing sub-panel. In other optional embodiments, the number and position of marker points in each splicing sub-panel may be different; for example, refer to... Figure 2 and Figure 3 The theoretical splicing sub-board 11 and the actual splicing sub-board 21 each have two marker points, located at the upper right and lower left corners respectively. The theoretical splicing sub-board 12 and the actual splicing sub-board 22 can also have two marker points, located at the upper left and lower right corners respectively. The theoretical splicing sub-board 13 and the actual splicing sub-board 23 can have three marker points, located at the geometric center, upper right corner, and lower left corner of the splicing sub-board respectively. That is, provided that the positions and numbers of marker points in the actual and theoretical splicing sub-boards are consistent and correspond one-to-one in the actual and theoretical images, the marker points in each splicing sub-board can be set according to actual needs; no specific limitations are imposed here.

[0086] S204. Place the theoretical image and the actual image in the same measurement coordinate system.

[0087] S205. Determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical and actual marker point in the measurement coordinate system.

[0088] The error parameters include at least distance error and angle error.

[0089] The technical solution of this invention selects at least two points located within the theoretical splicing sub-board as theoretical marker points, and then selects at least two points in the actual image located within the actual splicing sub-board corresponding to the theoretical marker points as actual marker points based on the position parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located. This improves the correspondence accuracy between the actual marker points and the theoretical marker points, and enhances the accuracy and reliability of subsequent measurement error parameters based on the position coordinates of the actual marker points and the theoretical marker points.

[0090] Based on the above embodiments, this embodiment of the invention describes how to determine the error parameters of the circuit splicing board according to the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system. Figure 5 A flowchart illustrating another error measurement method for a circuit splicing board provided in an embodiment of the present invention is shown below. Figure 5 As shown, the error measurement method includes:

[0091] S301. Obtain the theoretical and actual images of the circuit splicing board.

[0092] The circuit splicing board includes at least two splicing sub-boards. The splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board.

[0093] S302. Based on the theoretical image and the actual image, select at least two points in the theoretical image located within the theoretical splicing sub-board as theoretical marker points, and select at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points as actual marker points.

[0094] S303. Place the theoretical image and the actual image in the same measurement coordinate system.

[0095] S304. Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, determine the theoretical center point of the theoretical image and the actual center point of the actual image.

[0096] In this context, the theoretical center point is the geometric center of the theoretical image, while the actual center point is the geometric center of the actual image. The geometric center of the image is the location at the very center of the image.

[0097] Specifically, based on the position coordinates of each theoretical marker point in the measurement coordinate system, the theoretical center point of the theoretical image is determined using the geometric center calculation principle. Based on the original position coordinates of each actual marker point in the measurement coordinate system, the actual center point of the actual image is determined using the geometric center calculation principle. This allows the actual center point to be adjusted to a position consistent with the theoretical center point based on the positional difference between the theoretical and actual center points, facilitating subsequent measurement of error parameters. Figure 6 This is a schematic diagram of the placement structure of an actual image and a theoretical image provided in an embodiment of the present invention, with reference to... Figure 6 The theoretical center point of the theoretical image is determined as O1 based on the position coordinates of each theoretical marker point in the measurement coordinate system, and the actual center point of the actual image is determined as O2 based on the position coordinates of each actual marker point in the measurement coordinate system.

[0098] Optionally, the theoretical center point of the theoretical image and the actual center point of the actual image are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system. This includes calculating and determining the theoretical center point of the theoretical image based on the segmentation method based on the position coordinates of each theoretical marker point in the measurement coordinate system, and calculating and determining the actual center point of the actual image based on the segmentation method based on the original position coordinates of each actual marker point in the measurement coordinate system.

[0099] Specifically, the theoretical marker points can be connected to segment the theoretical image into multiple first geometric figures. The geometric center of each first geometric figure is determined based on the coordinates of the theoretical marker points that constitute it. Then, these geometric centers are connected to segment the theoretical image into multiple second geometric figures. The geometric center of each second geometric figure is determined based on the coordinates of the theoretical marker points that constitute it. This process is continued until only one geometric figure is formed after connecting the geometric centers. The geometric center of this single geometric figure is then taken as the theoretical center point of the theoretical image.

[0100] It should be noted that the above explanation only uses the determination of the theoretical center point of the theoretical image as an example. The principle of determining the actual center point in the actual image is similar to the calculation principle of the theoretical center point. Please refer to the above description, and it will not be repeated here.

[0101] S305. Determine the first adjustment parameter of the actual image based on the position coordinates of the theoretical center point and the position coordinates of the actual center point.

[0102] The first adjustment parameter includes the adjustment distance. The adjustment distance can be a vector, meaning it includes both direction and value. The measurement coordinate system includes the X-axis and Y-axis, and the adjustment distance includes the adjustment distance along the X-axis and / or the adjustment distance along the Y-axis.

[0103] Specifically, the difference between the ordinate of the actual center point and the ordinate of the theoretical center point can be calculated, and this difference can be used as the adjustment distance in the Y-axis direction. The difference between the abscissa of the actual center point and the abscissa of the theoretical center point can also be calculated, and this difference can be used as the adjustment distance in the X-axis direction.

[0104] S306. According to the first adjustment parameter, adjust the position of the actual image in the measurement coordinate system so that the geometric centers of the actual image and the theoretical image overlap and align.

[0105] Specifically, based on the adjustment distance in the X-axis direction of the first adjustment parameter, the actual image is moved along the X-axis by that adjustment distance. Based on the adjustment distance in the Y-axis direction of the second adjustment parameter, the actual image is moved along the Y-axis by that adjustment distance. Thus, after the above adjustments to the actual image, the actual center point coincides with the theoretical center point, that is, the geometric center of the actual image overlaps and aligns with the geometric center of the theoretical image. Before adjusting the actual image, the position coordinates of the theoretical center point are (x1, y1), and the position coordinates of the actual center point are (x2, y2). In the X-axis direction, the adjustment distance between the actual center point and the theoretical center point is x2 - x1. If the adjustment distance in the X-axis direction is positive, the actual image is subsequently moved along the negative direction of the X-axis by that adjustment distance; if the adjustment distance in the X-axis direction is negative, the actual image is subsequently moved along the positive direction of the X-axis by that adjustment distance. Correspondingly, in the Y-axis direction, the adjustment distance between the actual center point and the theoretical center point is y2-y1. If the adjustment distance y2-y1 in the Y-axis direction is positive, the subsequent control moves the actual image along the negative direction of the Y-axis by this adjustment distance. If the adjustment distance in the Y-axis direction is negative, the subsequent control moves the actual image along the positive direction of the Y-axis by this adjustment distance.

[0106] For example, x1, y1, and y2 are all 4, and x2 is 5. That is, the position coordinates of the theoretical center point are (4, 4), and the position coordinates of the actual center point are (5, 4). Then the difference between x2 and x1 is 1, and the difference between y2 and y1 is 0. Therefore, by simply controlling the adjustment distance of the theoretical image moving (x2-x1) in the negative direction of the X-axis, the geometric center of the theoretical image can be made to coincide with the theoretical center of the actual image.

[0107] S307. Determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjustment position coordinates of each actual marker point in the measurement coordinate system.

[0108] The position of the theoretical image in the coordinate system will affect the position coordinates of the actual marker point. For easy distinction, the first adjusted position coordinates represent the current position coordinates of the actual marker point after the position of the geometric center of the theoretical image is adjusted.

[0109] Specifically, after the geometric center of the actual image overlaps with the geometric center of the theoretical image, the position of the actual image can be adjusted according to the positional relationship between each actual and theoretical marker point relative to the actual center point, so that the actual image is aligned with the theoretical image. Based on this, the distance between each actual and theoretical marker point, as well as the coordinate differences between each actual and theoretical marker point along the X-axis and Y-axis, are used as error parameters for the circuit splicing board. In this way, by adjusting the position of the theoretical image, the accuracy of the error parameters is improved.

[0110] The technical solution of this invention determines the theoretical center point of the theoretical image and the actual center point of the actual image based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system. Then, based on the position coordinates of the theoretical and actual center points, a first adjustment parameter is determined for the actual image to overlap with the geometric center of the theoretical image. This first adjustment parameter is used to adjust the position of the actual image in the measurement coordinate system, thereby achieving geometric center overlap between the actual and theoretical images. Based on this geometric center overlap, the error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, thus improving the accuracy and reliability of error parameter determination.

[0111] Based on the above embodiments, this embodiment of the invention describes how to determine the error parameters of the circuit splicing board according to the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system. Figure 7 A flowchart illustrating another error measurement method for a circuit splicing board provided in an embodiment of the present invention is shown below. Figure 7 As shown, the error measurement method includes:

[0112] S401. Obtain the theoretical and actual images of the circuit splicing board.

[0113] The circuit splicing board includes at least two splicing sub-boards. The splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board.

[0114] S402. Based on the theoretical image and the actual image, select at least two points in the theoretical image located within the theoretical splicing sub-board as theoretical marker points, and select at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points as actual marker points.

[0115] S403. Place the theoretical image and the actual image in the same measurement coordinate system.

[0116] S404. Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, determine the theoretical center point of the theoretical image and the actual center point of the actual image.

[0117] The theoretical center point is the geometric center of the theoretical image, while the actual center point is the geometric center of the actual image.

[0118] S405. Determine the first adjustment parameter of the actual image based on the position coordinates of the theoretical center point and the actual center point.

[0119] The first adjustment parameter includes the adjustment distance.

[0120] S406. According to the first adjustment parameter, adjust the position of the actual image in the measurement coordinate system so that the geometric centers of the actual image and the theoretical image overlap.

[0121] S407. Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjustment position coordinates of each actual marker point in the measurement coordinate system, the second adjustment parameters of the actual image are calculated and determined using the least squares method.

[0122] The second adjustment parameter includes at least the rotation angle.

[0123] Specifically, Figure 8 This is a schematic diagram of another placement structure of actual and theoretical images provided in an embodiment of the present invention, such as... Figure 8 As shown, the actual center point O2 of the actual image overlaps with the theoretical center point O1 of the theoretical image, meaning their geometric centers overlap. Based on this, the first adjustment position coordinates of each actual marker point at its current position can be obtained. For actual and theoretical marker points located in the same area within the same stitching sub-board, the theoretical marker point, the corresponding actual marker point, and the theoretical center point can be connected to form a triangle. Then, based on the position coordinates of the theoretical marker point within this triangle, the first adjustment position coordinates of the corresponding actual marker point, and the position coordinates of the theoretical center point, the angle between the actual and theoretical marker points is determined; this angle is the first rotation angle. The first rotation angle of each actual marker point can be determined using the above principle. Then, the first rotation angle corresponding to each actual marker point is calculated using the least squares method to determine the rotation angle of the actual image. Thus, by determining the rotation angle required for the actual image to align with the theoretical image using the least squares method, the overlap between the actual and theoretical images is improved, thereby increasing the accuracy of subsequent error parameter measurements.

[0124] S408. According to the second adjustment parameter, adjust the position of the actual image in the measurement coordinate system so that the actual image and the theoretical image are aligned.

[0125] Specifically, the rotation angle can be a vector, meaning it includes the rotation direction, which can be counter-clockwise or clockwise. A positive rotation angle indicates that the actual image needs to be rotated clockwise, while a negative rotation angle indicates that the actual image needs to be rotated counter-clockwise. The correspondence between positive and negative values ​​and the rotation direction can be set according to actual needs and is not specifically limited here. For example, if the second adjustment parameter is -10°, then the actual image will be rotated 10° counter-clockwise around the theoretical center point to make the actual image aligned with the theoretical image. Figure 9 This is a schematic diagram of another placement structure of an actual image and a theoretical image provided in an embodiment of the present invention, with reference to... Figure 8 and Figure 9 After adjusting the actual image according to the second adjustment parameter, the actual image and the theoretical image are aligned as a whole.

[0126] S409. Determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment position coordinates of each actual marker point in the measurement coordinate system.

[0127] The position of the theoretical image in the coordinate system affects the position coordinates of the actual marker point. To facilitate differentiation, the second adjusted position coordinates represent the current position coordinates of the actual marker point after the angle of the theoretical image is adjusted.

[0128] Specifically, the difference between the second adjusted position coordinates of the actual marker point and the position coordinates of the theoretical marker point in the coordinate system can be used as the error parameter for each splicing sub-board. By setting at least two marker points on each splicing sub-board, the accuracy of determining the overall error parameter of the splicing sub-board can be improved, thereby increasing the precision of determining the error parameter of the circuit splicing board.

[0129] Optionally, the error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment position coordinates of each actual marker point in the measurement coordinate system. This includes: taking the current actual splicing sub-board to be measured as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured as the theoretical sub-board to be calibrated; determining the lateral distance error between each actual marker and each theoretical marker point based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment lateral position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system; and determining the error parameters of each actual marker and each theoretical marker point based on the longitudinal position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment longitudinal position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system. The longitudinal distance error between the actual marker points and each theoretical marker point is determined; the theoretical angle of the theoretical sub-board to be calibrated is determined based on the position coordinates of each theoretical marker point in the measurement coordinate system; the actual angle of the actual sub-board to be measured is determined based on the position coordinates of each actual marker point in the measurement coordinate system; the angle error is determined based on the theoretical angle and the actual angle; the next actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated, and the process is repeated from determining the longitudinal distance error between each actual marker point and each theoretical marker point based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system to obtaining the error parameters of each actual splicing sub-board; the distance error includes lateral distance error and longitudinal distance error.

[0130] Specifically, since the circuit splicing board includes multiple splicing sub-boards, the splicing error parameters of each sub-board can be determined sequentially. The actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated. Then, based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system on the theoretical sub-board to be calibrated, and the second adjusted lateral position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the lateral distance error between each actual marker point and each theoretical marker point is determined. The lateral distance error can be the difference in lateral coordinates between the actual marker point and the theoretical marker point. For example, if the lateral coordinate of the actual marker point is 5 and the lateral coordinate of the theoretical marker point corresponding to the actual marker point is 4.4, then the lateral distance error is 0.6. Then, based on the longitudinal position coordinates of each theoretical marker point in the measurement coordinate system on the theoretical sub-board to be calibrated, and the second adjusted longitudinal position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the longitudinal distance error between each actual marker point and each theoretical marker point is determined. The longitudinal distance error can be the difference between the longitudinal coordinates of the actual marker point and the theoretical marker point. For example, if the longitudinal coordinate of the actual marker point is 4 and the longitudinal coordinate of the corresponding theoretical marker point is 3.4, then the longitudinal distance error is 0.6.

[0131] Accordingly, refer to Figure 2 , Figure 3 and Figure 9 The following explanation uses theoretical splicing sub-board 11 and actual splicing sub-board 21 as examples. The theoretical marker points in theoretical splicing sub-board 11 include a first theoretical marker point 31 and a second theoretical marker point 32 located diagonally. The actual marker points in actual splicing sub-board 21 include a first actual marker point 41 and a second actual marker point 42 located at the upper right corner of actual splicing sub-board 21. The first theoretical marker point 31, the second theoretical marker point 32, the first actual marker point 41, and the second actual marker point 42 have corresponding position coordinates. For example, the coordinates of the first theoretical marker point 31 are (x11, y11), the coordinates of the second theoretical marker point 32 are (x12, y12), the coordinates of the first actual marker point 41 are (x21, y21), and the coordinates of the second actual marker point 42 are (x22, y22). The angle θ1 between the line connecting the first theoretical marker point 31 and the second theoretical marker point 32 and the horizontal axis X can be determined according to the angle calculation formula. Similarly, the angle θ2 between the line connecting the first actual marker point 41 and the second actual marker point 42 and the horizontal axis X can be determined. The difference between θ2 and θ1 is taken as the angle error. Specifically, arctanθ1 = (y12 - y11) / (x12 - x11), and arctanθ2 = (y22 - y21) / (x22 - x21).

[0132] In an optional embodiment, the error parameters further include expansion / contraction error. The error parameters of the circuit panel are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment position coordinates of each actual marker point in the measurement coordinate system. This includes: connecting any two theoretical marker points in the theoretical sub-board to be calibrated; determining a first distance between the two theoretical marker points based on their position coordinates in the measurement coordinate system; connecting the actual sub-board to be measured with two corresponding actual marker points in the theoretical sub-board to be calibrated; determining a second distance between the two actual marker points based on their second adjustment position coordinates in the measurement coordinate system; and using the difference between the second distance and the first distance as the expansion / contraction error.

[0133] For details, please refer to Figure 2 , Figure 3 and Figure 9 Taking the theoretical splicing sub-board 11 and the actual splicing sub-board 21 as examples, the following explanation is provided. In the measurement coordinate system, the first theoretical marker point 31 and the second theoretical marker point 32 in the theoretical splicing sub-board 11 are connected, and the first actual marker point 41 and the second actual marker point 42 in the actual splicing sub-board 21 are connected. The coordinates of the first theoretical marker point 31 are (x11, y11), the coordinates of the second theoretical marker point 32 are (x12, y12), the coordinates of the first actual marker point 41 are (x21, y21), and the coordinates of the second actual marker point 42 are (x22, y22). The first distance L1 between the first theoretical marker point 31 and the second theoretical marker point 32, and the second distance L2 between the first actual marker point 41 and the second actual marker point 42 can be determined according to the distance calculation formula. If the difference between the second distance and the first distance is greater than zero, it indicates that the actual size of the sub-board being measured has increased. If the difference between the second distance and the first distance is less than zero, it indicates that the actual size of the sub-board being measured has decreased.

[0134] After calculating and determining the distance and angle errors of each marker point in the actual sub-board to be measured according to the aforementioned method of determining distance errors, the next actual spliced ​​sub-board to be measured can be used as the actual sub-board to be measured, and the corresponding theoretical spliced ​​sub-board can be used as the theoretical sub-board to be calibrated. The process then returns to determining the longitudinal distance error between each actual marker and each theoretical marker based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system. This process is repeated sequentially, using the next actual spliced ​​sub-board to be measured as the actual sub-board, and determining the error parameters of the measured actual sub-board according to the above steps. This process is repeated until the error parameters of each actual spliced ​​sub-board are obtained. By setting at least two marker points on each spliced ​​sub-board and using both the lateral and longitudinal distance errors of each marker point as error parameters, the overall splicing error determination accuracy of the spliced ​​sub-board is improved.

[0135] The technical solution of this invention adjusts the position of the actual image based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system to make the geometric centers of the actual image and the theoretical image overlap. Then, based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, a second adjustment parameter of the actual image is calculated and determined using the least squares method. The actual image is then rotated according to the second adjustment parameter to make the actual image and the theoretical image aligned. By ensuring that the geometric centers of the actual image and the theoretical image overlap and are aligned overall, the measurement accuracy of the error parameters between the actual and theoretical marker points can be improved. This, in turn, improves the measurement accuracy and reliability of determining the error parameters of the circuit splicing board based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjusted position coordinates of each actual marker point in the measurement coordinate system.

[0136] This invention also provides an error measurement device for circuit splicing boards. Figure 10 This is a schematic diagram of the structure of an error measurement device for a circuit splicing board provided in an embodiment of the present invention, as shown below. Figure 10 As shown, the error measurement device for the circuit board includes:

[0137] The image acquisition module 10 is used to acquire the theoretical image and the actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board;

[0138] The marker selection module 20 is used to select at least two points located within the theoretical splicing sub-board in the theoretical image as theoretical marker points, and to select at least two points located within the actual splicing sub-board in the actual image that correspond to the theoretical marker points as actual marker points, based on the theoretical image and the actual image.

[0139] Image processing and measurement module 30 is used to place theoretical images and actual images in the same measurement coordinate system;

[0140] The error determination module 40 is used to determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical mark point and each actual mark point in the measurement coordinate system; the error parameters include distance error.

[0141] The error measurement device for circuit splicing boards provided in this embodiment of the invention can execute the error measurement method for circuit splicing boards provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the execution method. The similarities can be referred to the above description.

[0142] Figure 11This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention, such as... Figure 11 As shown, electronic devices are intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0143] like Figure 11 As shown, the electronic device 50 includes at least one processor 51 and a memory, such as a read-only memory (ROM) 52 and a random access memory (RAM) 53, communicatively connected to the at least one processor 51. The memory stores computer programs executable by the at least one processor. The processor 51 can perform various appropriate actions and processes based on the computer program stored in the ROM 52 or loaded from storage unit 58 into the RAM 53. The RAM 53 can also store various programs and data required for the operation of the electronic device 50. The processor 51, ROM 52, and RAM 53 are interconnected via a bus 54. An input / output (I / O) interface 55 is also connected to the bus 54.

[0144] Multiple components in the electronic device are connected to the I / O interface 55, including: an input unit 56, such as a keyboard, mouse, etc.; an output unit 57, such as various types of displays, speakers, etc.; a storage unit 58, such as a disk, optical disk, etc.; and a communication unit 59, such as a network card, modem, wireless transceiver, etc. The communication unit 59 allows the electronic device to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0145] Processor 51 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 51 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 51 performs the various methods and processes described above, such as error measurement methods for circuit boards.

[0146] In some embodiments, the error measurement method for the circuit panel can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 58. In some embodiments, part or all of the computer program can be loaded and / or installed on an electronic device via ROM 52 and / or communication unit 59. When the computer program is loaded into RAM 53 and executed by processor 51, one or more steps of the error measurement method for the circuit panel described above can be performed. Alternatively, in other embodiments, processor 51 can be configured to perform the error measurement method for the circuit panel by any other suitable means (e.g., by means of firmware).

[0147] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0148] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0149] This invention also provides a computer-readable storage medium storing computer instructions. The computer instructions are used to cause a processor to execute the error measurement method for the circuit splicing board provided in this invention, and have the corresponding functional modules and beneficial effects of the execution method, which will not be described in detail here.

[0150] Computer-readable storage media can be tangible media that may contain or store computer programs for use by or in conjunction with an instruction execution system, apparatus, or device. Computer-readable storage media can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0151] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for measuring the error of a circuit panel, characterized in that, include: Obtain the theoretical image and the actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board; Based on the theoretical image and the actual image, at least two points in the theoretical image located within the theoretical splicing sub-board are selected as theoretical marker points, and at least two points in the actual image located within the actual splicing sub-board corresponding to the theoretical marker points are selected as actual marker points, including: Based on the theoretical image, at least two points located within the theoretical splicing sub-board are selected as theoretical marker points; Based on the position parameters of the theoretical marker points in the region where the theoretical splicing sub-board is located, at least two points in the actual image located within the actual splicing sub-board that correspond to the theoretical marker points are selected as actual marker points, including: Based on the orientation parameters of the theoretical marker points in the area where the theoretical splicing sub-board is located, the area to be marked on the actual splicing sub-board is determined; Based on the distance parameter between the theoretical marker point and the area where the theoretical splicing sub-board is located, the actual marker point within the area to be marked is determined; The location parameters include at least distance parameters and orientation parameters; The theoretical image and the actual image are placed in the same measurement coordinate system; Based on the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system, the error parameters of the circuit splicing board are determined, including: Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, the theoretical center point of the theoretical image and the actual center point of the actual image are determined; the theoretical center point is the geometric center of the theoretical image; the actual center point is the geometric center of the actual image. Based on the position coordinates of the theoretical center point and the position coordinates of the actual center point, a first adjustment parameter for the actual image is determined; the first adjustment parameter includes an adjustment distance. Based on the first adjustment parameter, the position of the actual image in the measurement coordinate system is adjusted so that the geometric centers of the actual image and the theoretical image overlap and align. The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjustment position coordinates of each actual marker point in the measurement coordinate system. The error parameters include at least distance error and angle error.

2. The error measurement method according to claim 1, characterized in that, Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the original position coordinates of each actual marker point in the measurement coordinate system, the theoretical center point of the theoretical image and the actual center point of the actual image are determined, including: Based on the position coordinates of each theoretical marker point in the measurement coordinate system, the theoretical center point of the theoretical image is calculated and determined using the segmentation method. The actual center point of the actual image is determined by calculating the original position coordinates of each actual marker point in the measurement coordinate system based on the segmentation method.

3. The error measurement method according to claim 1, characterized in that, Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, the error parameters of the circuit splicing board are determined, including: Based on the position coordinates of each theoretical marker point in the measurement coordinate system and the first adjusted position coordinates of each actual marker point in the measurement coordinate system, a second adjustment parameter of the actual image is calculated and determined using the least squares method; the second adjustment parameter includes at least a rotation angle. According to the second adjustment parameter, the position of the actual image in the measurement coordinate system is adjusted so that the actual image and the theoretical image are aligned. The error parameters of the circuit splicing board are determined based on the position coordinates of each theoretical marker point in the measurement coordinate system and the second adjustment position coordinates of each actual marker point in the measurement coordinate system.

4. The error measurement method according to claim 3, wherein the error parameters of the circuit splicing board are determined based on the position coordinates of each of the theoretical marker points in the measurement coordinate system and the second adjusted position coordinates of each of the actual marker points in the measurement coordinate system, comprising: The actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated. Based on the lateral position coordinates of each theoretical marker point in the measurement coordinate system in the theoretical sub-board to be calibrated, and the second adjusted lateral position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the lateral distance error between each actual marker point and each theoretical marker point is determined. Based on the longitudinal position coordinates of each theoretical marker point in the measurement coordinate system in the theoretical sub-board to be calibrated, and the second adjusted longitudinal position coordinates of each actual marker point corresponding to each theoretical marker point in the measurement coordinate system, the longitudinal distance error between each actual marker point and each theoretical marker point is determined. The theoretical angle of the theoretical sub-board to be calibrated is determined based on the position coordinates of each theoretical marker point in the measurement coordinate system. The actual angle of the actual sub-board to be measured is determined based on the position coordinates of each actual marker point in the actual sub-board to be measured in the measurement coordinate system. The angle error is determined based on the theoretical angle and the actual angle. The next actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated. The process returns to the execution of each step from determining the longitudinal distance error between each actual mark and each theoretical mark based on the lateral position coordinates of each theoretical mark point in the measurement coordinate system in the theoretical sub-board to be calibrated, until the error parameters of each actual splicing sub-board are measured; the distance error includes lateral distance error and longitudinal distance error.

5. An error measurement device for a circuit panel, characterized in that, The error measurement method according to any one of claims 1-4 includes: An image acquisition module is used to acquire theoretical and actual images of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board located in the actual image is the actual splicing sub-board; The marker point selection module is used to select at least two points located within the theoretical splicing sub-board in the theoretical image as theoretical marker points, and select at least two points located within the actual splicing sub-board in the actual image that correspond to the theoretical marker points as actual marker points, based on the theoretical image and the actual image. An image processing and measurement module is used to place the theoretical image and the actual image in the same measurement coordinate system; An error determination module is used to determine the error parameters of the circuit splicing board based on the position coordinates of each theoretical marker point and each actual marker point in the measurement coordinate system; the error parameters include at least distance error and angle error.

6. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the error measurement method for the circuit board according to any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that are used to cause a processor to execute the error measurement method for the circuit board according to any one of claims 1-4.

Images