Probe card structure

Abstract

A probe card structure includes a first guide plate having a plurality of first guide plate perforations defining a first guide plate first block on the first guide plate, and a second guide plate having a plurality of second guide plate perforations defining a second guide plate first block on the second guide plate. The first number of second guide plate through holes define a second guide plate first block on the second guide plate, and at least one of the first guide plate first block and the second guide plate first block is plated with a guide plate conductive film; the signal probe penetrates through a part of the first number of first guide plate through holes and a part of the first number of second guide plate through holes, and the signal probe is plated with a probe conducting film; the grounding probe is arranged adjacent to the signal probe.

Description

Technical Field

[0001] The invention relates to a probe card for testing semiconductor elements, and in particular to a probe card structure. Background Art

[0002] Electrical testing is an important step in the process of preparing integrated circuit chips (IC chips). Probe cards are test devices used to perform electrical tests on semiconductor components to evaluate whether the operation and performance of semiconductor components meet standards. When performing electrical tests on semiconductor components, it is easy to cause problems such as uneven current configuration of the probe card and poor conductivity of the probe, especially when the signal shielding or current path design is poor. This not only affects the stability of the transmitted electrical signal, but also easily causes burnout of the probe.

[0003] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the important issues to be solved in this field. Summary of the invention

[0004] The purpose of the present invention is to provide a probe card structure, which achieves faster conduction and uniform current distribution by means of blocks divided on a guide plate, guide plate perforations and conductive film plated on probes, while allowing the signal probes of the probe card to share a grounding point and all signal probes can be grounded.

[0005] To achieve the above-mentioned object, the present invention provides a probe card structure, comprising at least one first guide plate, at least one second guide plate and a plurality of contact elements, wherein the plurality of contact elements include at least one signal probe and at least one ground probe, wherein the second guide plate is parallel to the first guide plate, wherein the first guide plate has a plurality of first guide plate through-holes, the second guide plate has a plurality of second guide plate through-holes, and the plurality of second guide plate through-holes respectively correspond to the plurality of first guide plate through-holes. The plurality of first guide plate through-holes and the plurality of second guide plate through-holes respectively have a first number of first guide plate through-holes and a first number of second guide plate through-holes, the first number of first guide plate through-holes correspond to the first number of second guide plate through-holes, the first number of first guide plate through-holes define a first guide plate first block on the first guide plate, the first number of second guide plate through-holes define a second guide plate first block on the second guide plate, and at least one of the first guide plate first block and the second guide plate first block is plated with a guide plate conductive film. The signal probe is inserted through a portion of the first number of first guide plate through holes and a portion of the first number of second guide plate through holes, and the signal probe is plated with a probe conductive film and the probe conductive film is in electrical contact with the guide plate conductive film. The probe conductive film and the signal probe are insulated from each other. The grounding probe is inserted through another portion of the first number of first guide plate through holes and another portion of the first number of second guide plate through holes, and the grounding probe is adjacent to the signal probe, and at least one grounding probe is connected to a grounding point. At least one first guide plate through hole or second guide plate through hole is plated with a guide plate conductive film, so that the guide plate conductive film of the signal probe is electrically connected to the grounding probe.

[0006] In a feasible embodiment, among the at least one ground probe disposed adjacent to the at least one signal probe, only one ground probe is connected to the ground point.

[0007] In a feasible embodiment, the plurality of first guide plate perforations and the plurality of second guide plate perforations respectively include a second number of first guide plate perforations and a second number of second guide plate perforations, the second number of first guide plate perforations corresponds to the second number of second guide plate perforations, the sum of the first number of first guide plate perforations and the second number of first guide plate perforations is less than or equal to the total number of first guide plate perforations; the sum of the first number of second guide plate perforations and the second number of second guide plate perforations is less than or equal to the total number of second guide plate perforations.

[0008] In a feasible embodiment, the second number of first guide plate through-holes define the first guide plate second block on the first guide plate, and the second number of second guide plate through-holes define the second guide plate second block on the second guide plate. At least one of the first guide plate second block and the second guide plate second block is plated with a guide plate conductive film.

[0009] In a feasible embodiment, at least one signal probe is disposed through a portion of the second number of first guide plate through holes and a portion of the second number of second guide plate through holes; at least one grounding probe is disposed through another portion of the second number of first guide plate through holes and another portion of the second number of second guide plate through holes, and is disposed adjacent to at least one signal probe.

[0010] In a feasible embodiment, an insulating layer is disposed between the probe and the probe conductive film.

[0011] In a feasible embodiment, the probe, the probe conductive film and the insulating layer form a coaxial needle.

[0012] In a feasible embodiment, the coaxial needle and the ground probe form a GSG shielding structure.

[0013] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional diagram of a first embodiment of a probe card structure of the present invention;

[0015] Figure 2 for Figure 1 A cross-sectional perspective view of the probe card structure in the IVA-IVA direction;

[0016] Figure 3 is a cross-sectional schematic diagram of a first embodiment of a probe card structure of the present invention;

[0017] Figure 4A A cross-sectional top view of a coaxial needle of a probe card structure of the present invention;

[0018] Figure 4B A cross-sectional top view of another embodiment of the coaxial needle of the probe card structure of the present invention;

[0019] Figure 5 is a cross-sectional schematic diagram of a second embodiment of the probe card structure of the present invention;

[0020] Figure 6 is a cross-sectional schematic diagram of a third embodiment of the probe card structure of the present invention;

[0021] Figure 7 FIG. 4 is a cross-sectional perspective view of a fourth embodiment of a probe card structure of the present invention.

[0022] Description of reference numerals:

[0023] 1, 2, probe card structure; 12, 22, first guide plate; 13, 23, second guide plate; 14, 24, signal probe; 15, 25, conductive film; 15a, 25a, guide plate conductive film; 15b, 25b, probe conductive film; 16, 26 insulating layer; 17, 27, grounding probe; 121, first surface; 122, second surface; 123, first guide plate through hole; 131, 231, third surface; 132, 232, fourth surface; 133, 233, second guide plate through hole; 124, 134, contact; A1, first guide plate first block; A2, second guide plate first block; A3, second guide plate second block; D, object to be tested; G, grounding point. DETAILED DESCRIPTION

[0024] The following is a specific embodiment to illustrate the implementation of the "probe card structure" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance.

[0025] The following embodiments will further explain the related technical contents of the present invention, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 FIG. 4 is a perspective view of a probe card structure according to a first embodiment of the present invention. Figure 2 It is a cross-sectional stereoscopic view of the probe card structure of the present invention along the IVA-IVA direction. Figure 3 FIG. 4 is a cross-sectional schematic diagram of a first embodiment of a probe card structure of the present invention.

[0027] In the first embodiment, if Figure 1 and Figure 2As shown, the probe card structure 1 of the present invention includes at least one first guide plate 12, at least one second guide plate 13 and a plurality of contact elements, and the plurality of contact elements include at least one signal probe 14 and at least one ground probe 17. The first guide plate 12 has a first surface 121 and a second surface 122, and the second guide plate 13 has a third surface 131 and a fourth surface 132. The second guide plate 13 is parallel to the first guide plate 12, and the second surface 122 and the third surface 131 face each other. It should be noted that the number of the first guide plate 12 and the second guide plate 13 of the present invention can be adjusted according to actual conditions, and the present invention is not limited thereto.

[0028] In the first embodiment, the first guide plate 12 has a plurality of first guide plate through holes 123, and the second guide plate 13 has a plurality of second guide plate through holes 133, and the plurality of second guide plate through holes 133 respectively correspond to the plurality of first guide plate through holes 123. The plurality of first guide plate through holes 123 and the plurality of second guide plate through holes 133 respectively have a first number of first guide plate through holes 123 and a first number of second guide plate through holes 133, and a first guide plate first block A1 defined by the first number of first guide plate through holes 123 on at least one of the first surface 121 and the second surface 122 is plated with a guide plate conductive film 15a; a second guide plate first block A2 defined by the first number of second guide plate through holes 133 on at least one of the third surface 131 and the fourth surface 132 is plated with a guide plate conductive film 15a. According to practical applications, the guide plate conductive film 15a may also be plated on at least one of the first guide plate first block A1 and the second guide plate first block A2. The signal probe 14 passes through a portion of the first number of first guide plate through holes 123 and a portion of the first number of second guide plate through holes 133 , wherein the signal probe 14 is plated with a probe conductive film 15 b and the probe conductive film 15 b is in electrical contact with the guide plate conductive film 15 a .

[0029] Preferably, among the at least one ground probe 17 adjacent to the at least one signal probe 14 , only one ground probe 17 is connected to the ground point G.

[0030] In the first embodiment, if Figure 1 and Figure 2As shown, the first block A1 of the first guide plate on the first surface 121 and the first block A2 of the second guide plate on the third surface 131 are plated with a guide plate conductive film 15a, and the surface of the probe 14 is plated with a probe conductive film 15b. In practical applications, the first guide plate 12 and the second guide plate 13 may be selectively plated, that is, the first guide plate 12 may be plated with the guide plate conductive film 15a while the second guide plate 13 is not plated with the guide plate conductive film 15a, the second guide plate 13 may be plated with the guide plate conductive film 15a while the first guide plate 12 is not plated with the guide plate conductive film 15a, or any surface of the first guide plate 12 and the second guide plate 13 may be plated with the guide plate conductive film 15a (for example: the first surface 121 is plated with the guide plate conductive film 15a while the second surface 122 is not plated with the guide plate conductive film 15a, the third surface 131 is plated with the guide plate conductive film 15a while the fourth surface 132 is not plated with the guide plate conductive film 15a), and the present invention is not limited thereto.

[0031] In the first embodiment, if Figure 3 As shown, the ground probe 17 is adjacent to and parallel to the signal probe 14, one end of the ground probe 17 contacts the substrate S, one end of the signal probe 14 contacts the substrate S, and the other end of the signal probe 14 contacts the object to be tested D. In actual application, the number of the signal probe 14, the ground probe 17, the first guide plate through-hole 123 and the second guide plate through-hole 133 can be adjusted according to the situation, and the present invention is not limited. Preferably, an insulating layer 16 is provided between the signal probe 14 and the probe conductive film 15b. Preferably, the thickness of the insulating layer 16 is less than 1 micron. In actual application, the material of the insulating layer can be, but is not limited to, polydimethylsiloxane, polyimide, or fluororesin insulating coating.

[0032] The contact surface of the first guide plate through hole 123 and the second guide plate through hole 133 and the probe conductive film 15b of the signal probe 14 has a contact point (124, 134). The probe conductive film 15b of the signal probe 14 contacts the contact point 124 of the first guide plate through hole 123 and the contact point 134 of the second guide plate through hole 133. The contact points (124, 134) are plated with the guide plate conductive film 15a, so that the probe conductive film 15b of the signal probe 14 is electrically connected to the ground probe 17.

[0033] Preferably, the guide plate conductive film 15a and the probe conductive film 15b are conductive films with a thickness of less than 1 micron. The conductive film 15 (guide plate conductive film 15a and probe conductive film 15b) can make the current distribution of the guide plate and the probe more uniform and conduct electricity faster, thereby reducing the probability of burning the needle.

[0034] To further illustrate, the signal probe 14, the probe conductive film 15b and the insulating layer 16 form a coaxial needle. Figure 4A and Figure 4B shown. Figure 4A FIG. 1 is a cross-sectional top view of a coaxial needle of the probe card structure 1 of the present invention. Figure 4BFIG. 1 is a cross-sectional top view of another embodiment of the coaxial needle of the probe card structure 1 of the present invention.

[0035] Figure 4A The cross section of the coaxial needle is circular, the first guide plate through hole 123 is circular, and the coaxial needle is a cylinder; Figure 4B The cross section of the coaxial needle is square, the first guide plate through hole 123 is square, and the coaxial needle is a square prism. In practical application, the present invention does not limit the shapes of the first guide plate through hole 123, the second guide plate through hole 133 and the coaxial needle. The first guide plate through hole 123 and the second guide plate through hole 133 can be circular, square, rectangular, triangular or polygonal, and the coaxial needle can be a cylinder, a square prism, a triangular prism or a polygon. By setting the coaxial needle, the speed of conduction can be made faster.

[0036] Further explanation, in the first embodiment, the inner surface of at least one of the first guide plate through hole 123 and the second guide plate through hole 133 is plated with a guide plate conductive film 15a. Preferably, the guide plate conductive film 15a is plated only on the through holes (first guide plate through hole 123 and / or second guide plate through hole 133) corresponding to the guide plate (first guide plate 12 and / or second guide plate 13) plated with the guide plate conductive film 15a. In other words, the through holes (first guide plate through hole 123 and / or second guide plate through hole 133) corresponding to the guide plate (first guide plate 12 and / or second guide plate 13) not plated with the guide plate conductive film 15a may not be plated with the guide plate conductive film 15a, but the present invention is not limited thereto. The effect of plating the guide plate conductive film 15a on the through holes (first guide plate through hole 123 and / or second guide plate through hole 133) is that the coaxial pin can have the function of grounding and shielding signal interference. In this embodiment, the conductive film 15 may be plated on the inner surfaces of the first guide plate 12 and the second guide plate 13, the signal probe 14, and the first guide plate through hole 123 and the second guide plate through hole 133 by electroplating or sputtering. The present invention does not limit any coating technology.

[0037] [Second embodiment]

[0038] See also Figure 5 , which is the probe card structure 1 in the second embodiment of the present invention. Figure 5 FIG. 4 is a cross-sectional schematic diagram of a second embodiment of the probe card structure of the present invention. Figure 5 The probe card structure 1 of the second embodiment is Figure 1 , Figure 2 and Figure 3The structure of the probe card structure 1 of the first embodiment is substantially the same, and the similarities are not repeated here. The difference between the probe card structure 1 of the second embodiment and the probe card structure 1 of the first embodiment is that the entire surfaces of the first guide plate 12 and the second guide plate 13 of the probe card structure 1 of the second embodiment are plated with a guide plate conductive film 15a, and the first guide plate through-hole 123 and the second guide plate through-hole 133 are plated with a guide plate conductive film 15a.

[0039] [Third embodiment]

[0040] See also Figure 6 , Figure 6 FIG. 4 is a cross-sectional schematic diagram of a third embodiment of a probe card structure of the present invention. Figure 6 The probe card structure 2 of the third embodiment is Figure 1 , Figure 2 and Figure 3 The structure of the probe card structure 1 of the first embodiment is substantially the same, and the similarities are not repeated here. There are two differences between the probe card structure 1 of the third embodiment and the probe card structure 1 of the first embodiment: First, the probe card structure 1 of the third embodiment has two first guide plates 12 and two second guide plates 13. As described above, the present invention does not limit the number of the first guide plates 12 and the second guide plates 13. The number of the first guide plates 12 and the second guide plates 13 is adjusted according to actual conditions, and can be one, two, three or more respectively; second, the signal probe 14 of the probe card structure 1 of the third embodiment is only plated with a probe conductive film 15b at the contact point (124, 134), and an insulating layer 16 is only provided between the signal probe 14 and the contact point (124, 134) plated with the probe conductive film 15b, so that the signal probe 14 can be grounded through the contact point (124, 134) of the probe conductive film 15b and the guide plate conductive film 15a.

[0041] Similarly, the thickness of the guide plate conductive film 15 a , the probe conductive film 15 b and the insulating layer 16 are respectively less than 1 micrometer.

[0042] [Fourth embodiment]

[0043] See also Figure 7 , Figure 7 FIG. 4 is a cross-sectional schematic diagram of a fourth embodiment of a probe card structure of the present invention. Figure 7 The probe card structure 2 of the fourth embodiment is Figure 1 , Figure 2 and Figure 3 The structure of the probe card structure 1 of the first embodiment is substantially the same, and the similarities are not repeated here. The probe card structure 2 includes at least one first guide plate 22, at least one second guide plate 23, and a plurality of contact elements, and the plurality of contact elements include at least one signal probe 24 and at least one ground probe 27. It should be particularly noted that in Figure 7The first guide plate perforation of the first guide plate 22 is omitted, but in fact the first guide plate perforation of the first guide plate 22 still exists in the fourth embodiment. The difference between the probe card structure 2 of the fourth embodiment and the probe card structure 1 of the first embodiment is that the plurality of second guide plate perforations 233 of the probe card structure 2 respectively have a first number of second guide plate perforations 233 and a second number of second guide plate perforations 233. The sum of the first number of second guide plate perforations 233 and the second number of second guide plate perforations 233 is less than or equal to the total number of second guide plate perforations 233. The first number of second guide plate perforations 233 define a second guide plate first block A2 on the second guide plate, and the second number of second guide plate perforations define a second guide plate second block A3 on the second guide plate.

[0044] The first guide plate 22 may include a first guide plate first block and a first guide plate second block ( Figure 7 The second guide plate 23 may have a second guide plate first block A2 and a second guide plate second block A3. Specifically, Figure 7 Taking the second guide plate first block A2 and the second guide plate second block A3 on the second guide plate 23 as an example, please note that Figure 7 It is only a schematic diagram. According to actual needs, the first surface and the second surface of the first guide plate 22, the third surface 231 and the fourth surface 232 of the second guide plate 23 can be plated with a guide plate conductive film 25a on any surface, according to the selected first number of first guide plate perforations, second number of first guide plate perforations, first number of second guide plate perforations and second number of second guide plate perforations 233, respectively defining the first guide plate first block, the first guide plate second block, the second guide plate first block A2 and the second guide plate second block A3, and contacts can be formed by the plated guide plate conductive film 25a on the first guide plate perforations and the second guide plate perforations 233 through which the signal probes 24 are penetrated.

[0045] It should be noted that the first block of the first guide plate ( Figure 7 The first guide plate second block (not shown) and the second guide plate first block A2 can be plated with a guide plate conductive film 25a; the first guide plate second block ( Figure 7 (not shown) and the second guide plate second block A3 can be selectively plated with a guide plate conductive film 25a, and the present invention is not limited thereto.

[0046] It should be noted that, according to actual application requirements, the first guide plate 22 may have a first guide plate first block ( Figure 7 Not shown) and the first guide plate second block ( Figure 7 The second guide plate 23 may also have other blocks other than the second guide plate first block A2 and the second guide plate second block A3, and the other blocks may also include any number of first guide plate through holes and second guide plate through holes 233.

[0047] Similarly, the probe conductive film 25b of the signal probe 24 is connected to the contact point of the guide plate conductive film 25a to be grounded. By plating the conductive film 25 (guide plate conductive film 25a and probe conductive film 25b), the current distribution of the guide plate and the probe can be more uniform, and the conduction can be faster, thereby reducing the probability of burning the needle.

[0048] To further illustrate, the contact elements included in the first block of the first guide plate are insulated from the contact elements included in the second block of the first guide plate; the contact elements included in the first block A2 of the second guide plate are insulated from the contact elements included in the second block A3 of the second guide plate.

[0049] To further explain, Figure 7 As shown, the second guide plate first block A2 and the second guide plate second block A3 can be respectively regarded as a 3x3 array with 9 second guide plate perforations. The second guide plate first block A2 and the second guide plate second block A3 can be respectively penetrated with a signal probe 24 and four ground probes 27. The signal probe 24 is arranged at the center of the 3x3 array, and each of the four ground probes 27 is arranged at the diagonal of the signal probe 24.

[0050] It should be particularly noted that in the fourth embodiment, the number, setting type and arrangement of the signal probes 24 and the ground probes 27 are determined according to actual needs. The number of the first guide plate first block, the first guide plate second block, the second guide plate first block A2 and the second guide plate second block A3 can all be more than two, and the present invention is not limited thereto.

[0051] The probe card structure 2 of the fourth embodiment of the present invention can achieve a better shielding effect.

[0052] [Beneficial Effects of Embodiments]

[0053] One of the beneficial effects of the present invention is that the probe card structure provided by the present invention can achieve the technical effect of evenly distributing current, faster conduction, suppressing signal attenuation and effectively reducing needle burning by coating the blocks and signal probes on the guide plate with a conductive film and arranging an insulator between the signal probe and the conductive film. Another beneficial effect of the present invention is that by arranging the coaxial needle and the grounding probe adjacently to form a GSG shielding structure, a shielding effect of reducing signal interference can be achieved, thereby achieving accurate signal transmission.

[0054] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A probe card structure, characterized in that: The probe card structure comprises: at least one first guide plate; at least one second guide plate, the second guide plate being parallel to the first guide plate; Wherein, the first guide plate has a plurality of first guide plate through-holes, the second guide plate has a plurality of second guide plate through-holes, and the plurality of second guide plate through-holes respectively correspond to the plurality of first guide plate through-holes; wherein the plurality of first guide plate through-holes and the plurality of second guide plate through-holes respectively include a first number of first guide plate through-holes and a first number of second guide plate through-holes, the first number of first guide plate through-holes corresponds to the first number of second guide plate through-holes, the first number of first guide plate through-holes define a first guide plate first block on the first guide plate, the first number of second guide plate through-holes define a second guide plate first block on the second guide plate, and at least one of the first guide plate first block and the second guide plate first block is plated with a guide plate conductive film; A plurality of contact elements, including: at least one signal probe, which is inserted through a portion of the first number of first guide plate through-holes and a portion of the first number of second guide plate through-holes, wherein the signal probe is plated with a probe conductive film and the probe conductive film is in electrical contact with the guide plate conductive film, wherein the probe conductive film and the signal probe are insulated from each other; and At least one grounding probe is disposed through another portion of the first number of first guide plate through holes and another portion of the first number of second guide plate through holes, and the at least one grounding probe is disposed adjacent to the at least one signal probe; At least one of the grounding probes is electrically connected to a grounding point; at least one of the first guide plate through-hole or the second guide plate through-hole is plated with the guide plate conductive film, so that the probe conductive film of the signal probe is electrically connected to the grounding probe.

2. The probe card structure according to claim 1, characterized in that: Among the at least one grounding probe adjacent to the at least one signal probe, only one grounding probe is electrically connected to the grounding point.

3. The probe card structure according to claim 1, characterized in that: The plurality of first guide plate through-holes and the plurality of second guide plate through-holes respectively have a second number of first guide plate through-holes and a second number of second guide plate through-holes, and the second number of first guide plate through-holes corresponds to the second number of second guide plate through-holes; Among them, the sum of the first number of first guide plate perforations and the second number of first guide plate perforations is less than or equal to the total number of the first guide plate perforations; the sum of the first number of second guide plate perforations and the second number of second guide plate perforations is less than or equal to the total number of the second guide plate perforations.

4. The probe card structure according to claim 3, characterized in that: The second number of first guide plate through-holes define a first guide plate second block on the first guide plate, and the second number of second guide plate through-holes define a second guide plate second block on the second guide plate. At least one of the first guide plate second block and the second guide plate second block is plated with the guide plate conductive film.

5. The probe card structure according to claim 4, characterized in that: The at least one signal probe is inserted through a portion of the second number of first guide plate through holes and a portion of the second number of second guide plate through holes; the at least one grounding probe is inserted through another portion of the second number of first guide plate through holes and another portion of the second number of second guide plate through holes, and the at least one grounding probe is arranged adjacent to the at least one signal probe.

6. The probe card structure according to claim 5, characterized in that: The at least one grounding probe of the first block of the first guide plate and the probe conductive film of the signal probe are electrically connected to each other; the at least one grounding probe of the second block of the first guide plate and the probe conductive film of the signal probe are electrically connected to each other; the at least one grounding probe of the first block of the second guide plate and the probe conductive film of the signal probe are electrically connected to each other; the at least one grounding probe of the second block of the second guide plate and the probe conductive film of the signal probe are electrically connected to each other; wherein the contact elements included in the first block of the first guide plate and the contact elements included in the second block of the first guide plate are insulated from each other; and The contact element included in the first block of the second guide plate and the contact element included in the second block of the second guide plate are insulated from each other.

7. The probe card structure according to any one of claims 1 to 6, characterized in that: An insulating layer is arranged between the signal probe and the probe conductive film.

8. The probe card structure according to claim 7, characterized in that: The signal probe, the probe conductive film and the insulating layer form a coaxial needle.

9. The probe card structure according to claim 5, characterized in that: The contact surfaces of the first guide plate through hole and the second guide plate through hole and the probe conductive film of the signal probe have contacts, and the guide plate conductive film is plated on the contacts.

10. The probe card structure according to claim 8, characterized in that: The thickness of the guide plate conductive film, the probe conductive film and the insulating layer are respectively less than 1 micron.

11. The probe card structure according to claim 1, characterized in that: The ground probe or the signal probe is disposed through another portion of the first number of first guide plate through holes and another portion of the first number of second guide plate through holes.

12. The probe card structure according to claim 8, characterized in that: The coaxial needle and the ground probe form a GSG shielding structure.

Images