Method and system for improving corrosion resistance of bonded copper wire in plastic encapsulated integrated circuit

Abstract

The application relates to the field of corrosion prevention technology and discloses a method and system for improving the corrosion prevention performance of bonded copper wires in plastic-sealed integrated circuits. The method comprises the following steps: identifying the bonding position of the bonded copper wire product in the plastic-sealed integrated circuit by using a ray detection method, and pretreating the copper wire at the bonding position; selecting an initial corrosion inhibitor for the pretreated copper wire by using an alternating current impedance analysis method, determining the corrosion inhibitor concentration of the initial corrosion inhibitor, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration; selecting the immersion time and temperature of the pretreated copper wire in the target corrosion inhibitor, immersing the pretreated copper wire in the target corrosion inhibitor, and preparing a self-assembled film copper wire of the pretreated copper wire by using the target corrosion inhibitor; constructing a first polarization curve of the pretreated copper wire and a second polarization curve of the self-assembled film copper wire, detecting the corrosion prevention improvement degree of the self-assembled film copper wire, and determining the improvement result by using the target corrosion inhibitor. The application can reduce environmental pollution caused by the use of inappropriate corrosion inhibitors.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of corrosion protection, and in particular to a method and system for improving the corrosion resistance of bonded copper wires in plastic-encapsulated integrated circuits. BACKGROUND

[0002] Bonded copper wires are wire materials that can strengthen circuit connections and provide better electrical conductivity, and are commonly used in packaging semiconductor chips and other electronic components. By improving the corrosion resistance of bonded copper wire products, the bonded copper wire products that are prone to rust in plastic-encapsulated integrated circuits can be protected to extend their service life.

[0003] Currently, corrosion inhibitors can be used to treat the surface of copper to improve the oxidation resistance of bonded copper wire products. However, in some cases, the corrosion inhibitor may remain on the surface of the bonded copper wire product during the current practice of this method, thereby affecting the quality of the bonded copper wire product, and the amount and quality of the corrosion inhibitor need to be carefully considered. Therefore, a solution is needed to carefully consider the amount and quality of the corrosion inhibitor to reduce environmental pollution caused by the use of inappropriate corrosion inhibitors. SUMMARY

[0004] To solve the above problems, the present application provides a method and system for improving the corrosion resistance of bonded copper wires in plastic-encapsulated integrated circuits, which can reduce environmental pollution caused by the use of inappropriate corrosion inhibitors.

[0005] In a first aspect, the present application provides a method for improving the corrosion resistance of bonded copper wires in plastic-encapsulated integrated circuits, comprising:

[0006] Obtaining a plastic-encapsulated integrated circuit, identifying the bonding position of the bonded copper wire product in the plastic-encapsulated integrated circuit using a radiographic detection method, pretreating the copper wire at the bonding position to obtain a pretreated copper wire;

[0007] Selecting an initial corrosion inhibitor for the pretreated copper wire by alternating current impedance analysis, determining the corrosion inhibitor concentration of the initial corrosion inhibitor using corrosion inhibitor samples at different concentrations of the initial corrosion inhibitor, and converting the initial corrosion inhibitor to a target corrosion inhibitor using the corrosion inhibitor concentration;

[0008] Selecting the immersion time and temperature of the pretreated copper wire in the target corrosion inhibitor, and preparing a self-assembled film copper wire for the pretreated copper wire using the target corrosion inhibitor based on the immersion time and temperature after immersing the pretreated copper wire in the target corrosion inhibitor;

[0009] constructing a first polarization curve of the pretreated copper wire based on preset electrochemical parameters, constructing a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and detecting the anticorrosion promotion degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve;

[0010] According to the anticorrosion promotion degree, the target corrosion inhibitor is used to determine the anticorrosion performance promotion result of the bonded copper wire product in the plastic package integrated circuit.

[0011] In a possible implementation manner of the first aspect, the using a radiographic method to identify the bonding position of the bonded copper wire product in the plastic package integrated circuit comprises:

[0012] acquiring a radiographic machine, a film, a darkroom and a film viewer in the radiographic method;

[0013] placing the plastic package integrated circuit between the radiographic machine and the film, and then radiating the plastic package integrated circuit;

[0014] after radiating the plastic package integrated circuit, collecting a radiographic negative of the plastic package integrated circuit from the film;

[0015] placing the radiographic negative into the darkroom;

[0016] in the darkroom, developing the radiographic negative to obtain a developed negative;

[0017] placing the developed negative under the film viewer;

[0018] under the film viewer, identifying pixel point coordinates with consistent gray scale in the developed negative;

[0019] calculating a coordinate distance between each of the pixel point coordinates, and aggregating the pixel point coordinates to obtain aggregated coordinates when the coordinate distance is less than a preset distance;

[0020] generating an aggregated plane of the aggregated coordinates;

[0021] determining whether the aggregated plane has a plane incoherence;

[0022] when the aggregated plane does not have the plane incoherence;

[0023] starting from a plane edge of the aggregated plane, constructing a circumscribed circle window in the aggregated plane;

[0024] until the circumscribed circle window covers the aggregated plane, generating a fitting curve between the pixel point coordinates in the aggregated plane based on a coordinate center of the pixel point coordinates in the circumscribed circle window by using a preset least square fitting method.

[0025] When the curve lengths of each of the fitting curves are consistent, taking corresponding pixel point coordinates of the fitting curves on the aggregation plane as the bonding positions.

[0026] In a possible implementation manner of the first aspect, the pre-treatment of the copper wire at the bonding position includes:

[0027] A preset heating tool, a cleaning tool, a cleaning agent, a copper material chemical polishing solution, and a chemical liquid are obtained.

[0028] The heating tool is used to heat and soften a plastic package shell of the plastic package integrated circuit to obtain a softened shell, and the cleaning tool is used to remove the softened shell to extract the copper wire at the bonding position.

[0029] The cleaning agent is used to clean dirt and grease on a surface of the copper wire to obtain a cleaned copper wire.

[0030] The copper material chemical polishing solution is used to polish the surface of the cleaned copper wire to obtain a polished copper wire.

[0031] The polished copper wire is placed in the chemical liquid, and the polished copper wire is pre-treated in the chemical liquid to obtain a pre-treated copper wire.

[0032] In a possible implementation manner of the first aspect, the initial corrosion inhibitor of the pre-treated copper wire is selected by an alternating current impedance analysis method, and the method includes:

[0033] A corrosion inhibitor sample of the pre-treated copper wire is constructed.

[0034] After a sinusoidal alternating current signal is applied to the corrosion inhibitor sample by the alternating current impedance analysis method, a signal response of the corrosion inhibitor sample to the sinusoidal alternating current signal is measured.

[0035] The initial corrosion inhibitor is selected from the corrosion inhibitor sample by using the signal response.

[0036] In a possible implementation manner of the first aspect, the corrosion inhibitor concentration of the initial corrosion inhibitor is determined by using corrosion inhibitor samples at different concentrations of the initial corrosion inhibitor, and the method includes:

[0037] A preset equivalent circuit element is obtained.

[0038] The equivalent circuit element is respectively placed in the corrosion inhibitor samples at different concentrations.

[0039] An electrochemical operation is performed on the equivalent circuit element in the corrosion inhibitor samples to obtain electrochemical reaction parameters.

[0040] performing parameter fitting on the electrochemical reaction parameters to obtain fitting parameters;

[0041] based on the fitting parameters, distinguishing electrochemical characteristic differences between inhibitor samples at different concentrations;

[0042] using the electrochemical characteristic differences to determine the inhibitor concentration of the initial inhibitor from the initial inhibitor at different concentrations.

[0043] In a possible implementation of the first aspect, the selecting of the immersion time and the immersion temperature of the pretreated copper wire in the target inhibitor includes:

[0044] constructing an experimental time and an experimental temperature of the target inhibitor;

[0045] based on the experimental time and the experimental temperature, extracting an immersed copper wire from the target inhibitor after the pretreated copper wire is immersed in the target inhibitor;

[0046] calculating a corrosion rate of the immersed copper wire using the following formula:

[0047]

[0048] wherein y represents the corrosion rate, S represents the surface area of the pretreated copper wire exposed to the target inhibitor, m 2 represents the mass of the pretreated copper wire before being immersed in the target inhibitor, m 1 represents the mass of the pretreated copper wire after being immersed in the target inhibitor, and x1 represents the experimental time;

[0049] constructing a regression model between the corrosion rate and the experimental time and the experimental temperature using the following formula:

[0050] y = β0 + β1x1 + β2x2

[0051] wherein y = β0 + β1x1 + β2x2 represents the regression model, y represents the corrosion rate, x1 represents the experimental time, x2 represents the experimental temperature, and β0, β1, and β2 represent regression coefficients;

[0052] determining the immersion time and the immersion temperature in the target inhibitor from the experimental time and the experimental temperature using the regression model.

[0053] In a possible implementation of the first aspect, the preparing of the self-assembled film copper wire of the pretreated copper wire using the target inhibitor includes:

[0054] immersing the pretreated copper wire in the target inhibitor;

[0055] In the target corrosion inhibitor, the chemical reaction between the anode and the cathode of the pretreated copper wire is retarded;

[0056] After the chemical reaction between the anode and the cathode of the pretreated copper wire is retarded, the monolayer of the pretreated copper wire is subjected to carbon chain interaction;

[0057] When the monolayer of the pretreated copper wire is stabilized by the carbon chain interaction, the self-assembled film copper wire of the pretreated copper wire is determined.

[0058] In a possible implementation manner of the first aspect, the first polarization curve of the pretreated copper wire is constructed based on the preset electrochemical parameters, and the method comprises the following steps:

[0059] A preset electrolyte solution and a constant potential instrument are obtained;

[0060] After the pretreated copper wire is inserted into the electrolyte solution, the pretreated copper wire is connected to the constant potential instrument;

[0061] The copper wire current of the pretreated copper wire under a preset electrode potential is detected on the constant potential instrument;

[0062] The first polarization curve of the pretreated copper wire is constructed with the electrode potential as the horizontal coordinate and the copper wire current as the vertical coordinate.

[0063] In a possible implementation manner of the first aspect, the corrosion resistance improvement degree of the self-assembled film copper wire is detected by using the first polarization curve and the second polarization curve, and the method comprises the following steps:

[0064] A first potential in the first polarization curve and a second potential in the second polarization curve are obtained;

[0065] The absolute value of the potential difference between the first potential and the second potential is calculated;

[0066] When the absolute value of the potential difference is greater than a preset absolute value, the corrosion inhibition efficiency of the self-assembled film copper wire is calculated;

[0067] According to the corrosion inhibition efficiency, the self-assembled film coverage of the self-assembled film copper wire is calculated;

[0068] The self-assembled film coverage is taken as the corrosion resistance improvement degree.

[0069] In a second aspect, the present application provides a system for improving the corrosion resistance of bonded copper wires in a plastic-sealed integrated circuit, and the system comprises:

[0070] A position recognition module is configured to obtain a plastic package integrated circuit, recognize a bonding position of a bonded copper wire product in the plastic package integrated circuit by using a ray detection method, and pre-process the copper wire at the bonding position to obtain a pre-processed copper wire.

[0071] A corrosion inhibitor selection module is configured to select an initial corrosion inhibitor of the pre-processed copper wire by using an alternating current impedance analysis method, determine a corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and convert the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration.

[0072] A variable control module is configured to select an immersion time and an immersion temperature of the pre-processed copper wire in the target corrosion inhibitor, and prepare a self-assembled film copper wire of the pre-processed copper wire by using the target corrosion inhibitor after the pre-processed copper wire is immersed in the target corrosion inhibitor based on the immersion time and the immersion temperature.

[0073] A curve construction module is configured to construct a first polarization curve of the pre-processed copper wire based on preset electrochemical parameters, construct a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and detect an anti-corrosion improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve.

[0074] A result analysis module is configured to determine an anti-corrosion performance improvement result of the bonded copper wire product in the plastic package integrated circuit by using the target corrosion inhibitor according to the anti-corrosion improvement degree.

[0075] Compared with the prior art, the technical principles and beneficial effects of the present scheme are as follows:

[0076] The embodiment of the present application can recognize the bonding position of the bonded copper wire product in the plastic package integrated circuit by using the ray detection method, so that the specific parameters of the required research object can be more accurately analyzed and simulated, and the subsequent operation is facilitated, further, the embodiment of the present application obtains the pretreated copper wire by pretreating the copper wire at the bonding position, so as to remove the oxide layer, stains and other impurities on the surface of the copper wire, reduce the influence on the subsequent processing or testing, the embodiment of the present application selects the initial corrosion inhibitor of the pretreated copper wire by using the alternating current impedance analysis method, so as to protect the metal material, prolong the service life of the equipment, ensure the safety of the production process, reduce the water treatment cost, improve the treatment effect, and bring economic benefits to the enterprise, further, the embodiment of the present application determines the corrosion inhibitor concentration of the initial corrosion inhibitor by using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, so as to infer the state variable in the electrode process from the number and value of the time constant contained in the impedance spectrum, and the impedance spectrum of a single time constant can also be measured, and the information about the solution resistance between the reference electrode and the working electrode, the double-layer capacitance and the charge transfer resistance can be obtained in different frequency ranges, the embodiment of the present application selects the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, so as to control all variables that can cause corrosion changes of the copper wire except the corrosion resistance of the corrosion inhibitor, reduce the influence of other factors on the experimental results, further, the embodiment of the present application prepares the self-assembled film copper wire of the pretreated copper wire by using the target corrosion inhibitor, so as to improve the corrosion resistance of the metal material, prolong the service life, and reduce the maintenance cost, by forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, so that the corrosion reaction is reduced, the embodiment of the present application constructs the first polarization curve of the pretreated copper wire and the second polarization curve of the self-assembled film copper wire based on the preset electrochemical parameters, so that the mutual relationship and change trend between the two variables can be more directly observed, and then the comparison result is obtained to achieve the experimental purpose, further, the embodiment of the present application detects the corrosion resistance improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve, so that the change trend of the experimental result after adding the corrosion inhibitor can be more directly observed, so as to judge whether the experimental result is the expected result. Therefore, the method and system for improving the corrosion resistance of the bonded copper wire in the plastic package integrated circuit can reduce the environmental pollution caused by improper use of the corrosion inhibitor. BRIEF DESCRIPTION OF DRAWINGS

[0077] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate one embodiment consistent with the present application and, together with the description, serve to explain the principles of the application.

[0078] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, for those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

[0079] Figure 1 A flowchart of a method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit is provided for an embodiment of the present application.

[0080] Figure 2 A module diagram of a system for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0081] It should be understood that the specific implementation described herein is only used to explain the present application, and is not used to limit the present application.

[0082] The embodiments of the present application provide a method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit. The execution subject of the method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit includes but is not limited to at least one of electronic devices capable of being configured to execute the method provided by the embodiments of the present application, such as a server and a terminal. In other words, the method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit can be executed by software or hardware installed in a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to a single server, a server cluster, a cloud server, or a cloud server cluster, etc. The server can be a stand-alone server, or a cloud server providing cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content distribution networks (CDN), and big data and artificial intelligence platforms, etc. basic cloud computing services.

[0083] Referring to Figure 1 The flowchart of the method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit provided by an embodiment of the present application is shown. Among them, Figure 1 The method for improving the corrosion resistance of bonded copper wires in a plastic package integrated circuit described in the embodiment includes:

[0084] S1, obtaining a plastic package integrated circuit, identifying the bonding position of the bonded copper wire product in the plastic package integrated circuit by using a ray detection method, pre-treating the copper wire at the bonding position, and obtaining a pre-treated copper wire.

[0085] The embodiment of the present application can recognize the bonding position of the bonded copper wire product in the plastic package integrated circuit by using the ray detection method, so that the specific parameters of the required research object can be more accurately analyzed and simulated, and the subsequent operation is facilitated.

[0086] The ray detection method is a non-destructive testing technology, which mainly uses the attenuation characteristics of X-rays and gamma rays when penetrating an object to detect defects and discontinuities in the material. The basic principle is that when the rays pass through the detected object, if there are defects or structural differences inside the object, the intensity of the rays will change. This change will be manifested as different degrees of gray difference on the ray film or digital image, so that the defects can be revealed.

[0087] In an embodiment of the present application, the method for recognizing the bonding position of the bonded copper wire product in the plastic package integrated circuit by using the ray detection method comprises the following steps: obtaining a ray machine, a film, a darkroom and a film viewer in the ray detection method; placing the plastic package integrated circuit between the ray machine and the film, and then irradiating the plastic package integrated circuit with rays; after irradiating the plastic package integrated circuit with rays, collecting the ray film of the plastic package integrated circuit from the film; placing the ray film in the darkroom; in the darkroom, developing the ray film to obtain a developed film; placing the developed film under the film viewer; under the film viewer, recognizing the pixel point coordinates with consistent gray scale in the developed film; calculating the coordinate distance between each pixel point coordinate in the pixel point coordinates, and when the coordinate distance is less than a preset distance, aggregating the pixel point coordinates to obtain aggregated coordinates; generating an aggregated plane of the aggregated coordinates; judging whether the aggregated plane appears to be not coherent; when the aggregated plane does not appear to be not coherent; starting from the plane edge of the aggregated plane, constructing a circumscribed circle window in the aggregated plane; until the circumscribed circle window covers the aggregated plane, generating a fitting curve between the pixel point coordinates in the aggregated plane based on the coordinate center of the pixel point coordinates in the circumscribed circle window by using a preset least squares fitting method; when the curve length between each fitting curve in the fitting curve is consistent, taking the pixel point coordinates corresponding to the fitting curve on the aggregated plane as the bonding position.

[0088] Optionally, the purpose of the aggregation of the pixel point coordinates is to aggregate the pixel point coordinates with a coordinate distance less than a preset distance into pixel point coordinates on the same aggregation plane, further, the process of judging whether the aggregation plane is not coherent in plane is a process of judging whether the edge between each two aggregation planes is continuous, further, the process of constructing a circumscribed circle window in the aggregation plane from the plane edge of the aggregation plane is a process of pre-setting a fixed size circle, and covering the fixed size circle on the aggregation plane from the plane edge of the aggregation plane, that is, the aggregation plane contains a plurality of circumscribed circle windows, and it should be noted that the bonding position is the position of the regularly distributed copper wire, and the fitting curve between each fitting curve in the fitting curve is a copper wire with consistent length.

[0089] Further, the embodiment of the present application obtains a pretreated copper wire by pretreating the copper wire at the bonding position, so as to remove the oxide layer, stains and other impurities on the surface of the copper wire, and reduce the influence on subsequent processing or testing.

[0090] In an embodiment of the present application, the pretreatment of the copper wire at the bonding position to obtain a pretreated copper wire comprises: obtaining a preset heating tool, a cleaning tool, a cleaning agent, a copper material chemical polishing liquid and a chemical liquid; using the heating tool to heat and soften the plastic package shell of the plastic package integrated circuit to obtain a softened shell; using the cleaning tool to extract the copper wire in the bonding position after the softened shell; using the cleaning agent to clean the dirt and grease on the surface of the copper wire to obtain a cleaned copper wire; using the copper material chemical polishing liquid to polish the surface of the cleaned copper wire to obtain a polished copper wire; and placing the polished copper wire in the chemical liquid to pretreat the polished copper wire in the chemical liquid to obtain a pretreated copper wire.

[0091] The copper wire at the bonding position refers to a lead wire between a chip and a frame, which can realize the important role of interaction between the chip and the external current and signal, and the least square fitting method refers to a mathematical optimization technique for finding the best function matching of data by minimizing the sum of squares of errors.

[0092] S2, selecting an initial corrosion inhibitor of the pretreated copper wire by an alternating current impedance analysis method, determining a corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration.

[0093] The embodiment of the present application selects the initial corrosion inhibitor of the pretreated copper wire by the alternating current impedance analysis method, so as to protect the metal material, prolong the service life of the equipment, ensure the safety of the production process, reduce the water treatment cost, improve the treatment effect, and bring economic benefits to the enterprise.

[0094] The alternating current impedance analysis method refers to controlling the current through the electrochemical system or the potential of the system to change in a sinusoidal manner under a small amplitude condition over time, measuring the corresponding potential or current of the system over time, or directly measuring the alternating current impedance of the system, and then analyzing the reaction mechanism of the electrochemical system and calculating the relevant parameters of the system.

[0095] In an embodiment of the present application, the initial corrosion inhibitor of the pretreated copper wire is selected by the alternating current impedance analysis method, comprising: constructing a corrosion inhibitor sample of the pretreated copper wire; after a sinusoidal alternating current signal is applied to the corrosion inhibitor sample by the alternating current impedance analysis method, measuring the signal response of the corrosion inhibitor sample to the sinusoidal alternating current signal; and selecting the initial corrosion inhibitor from the corrosion inhibitor sample by using the signal response.

[0096] Further, the embodiment of the present application determines the corrosion inhibitor concentration of the initial corrosion inhibitor by using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, so as to infer the state variables affecting the electrode process from the number and values of the time constants contained in the impedance spectrum, and the information about the solution resistance between the reference electrode and the working electrode, the double-layer capacitance and the charge transfer resistance can also be obtained in the impedance spectrum of a single time constant at different frequency ranges.

[0097] The impedance spectrum fitting parameter refers to a characteristic parameter used to describe the dynamic response of an electrochemical system in electrochemical impedance spectrum analysis.

[0098] In an embodiment of the present application, the corrosion inhibitor concentration of the initial corrosion inhibitor is determined by using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, comprising: obtaining preset equivalent circuit elements; placing the equivalent circuit elements in the corrosion inhibitor samples at different concentrations respectively; performing electrochemical operation on the equivalent circuit elements in the corrosion inhibitor samples to obtain electrochemical reaction parameters; performing parameter fitting processing on the electrochemical reaction parameters to obtain fitting parameters; distinguishing the electrochemical characteristic differences between the corrosion inhibitor samples at different concentrations based on the fitting parameters; and confirming the corrosion inhibitor concentration of the initial corrosion inhibitor from the initial corrosion inhibitors at different concentrations by using the electrochemical characteristic differences.

[0099] The equivalent circuit element refers to a simplified model in circuit analysis based on the electrical characteristics and digital model in the actual circuit, which is used to replace the complex structure in the actual circuit or the process.

[0100] S3, select the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and based on the immersion time and the immersion temperature, after the pretreated copper wire is immersed in the target corrosion inhibitor, a self-assembled film copper wire of the pretreated copper wire is prepared by using the target corrosion inhibitor.

[0101] In the embodiment of the present application, by selecting the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, all variables that can cause changes in copper wire corrosion except the corrosion inhibition performance of the corrosion inhibitor are controlled, and the influence of other factors on the experimental results is reduced.

[0102] In an embodiment of the present application, the selecting the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor comprises: constructing an experimental time and an experimental temperature of the target corrosion inhibitor; based on the experimental time and the experimental temperature, after the pretreated copper wire is immersed in the target corrosion inhibitor, an immersed copper wire is extracted from the target corrosion inhibitor; and the corrosion rate of the immersed copper wire is calculated by using the following formula:

[0103]

[0104] wherein y represents the corrosion rate, S represents the surface area of the pretreated copper wire exposed to the target corrosion inhibitor, m 2 represents the mass of the pretreated copper wire before immersion in the target corrosion inhibitor, m 1 represents the mass of the pretreated copper wire after immersion in the target corrosion inhibitor, x1 represents the experimental time;

[0105] A regression model between the corrosion rate and the experimental time and the experimental temperature is constructed by using the following formula:

[0106] y=β0+β1x1+β2x2

[0107] wherein y=β0+β1x1+β2x2 represents the regression model, y represents the corrosion rate, x1 represents the experimental time, x2 represents the experimental temperature, and β0, β1, and β2 represent regression coefficients;

[0108] The immersion time and the immersion temperature in the target corrosion inhibitor are determined from the experimental time and the experimental temperature by using the regression model.

[0109] Further, in the embodiment of the present application, the self-assembled film copper wire of the pretreated copper wire is prepared by using the target corrosion inhibitor, so as to improve the corrosion resistance of the metal material, prolong the service life thereof, and reduce the maintenance cost. By forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, so as to reduce the occurrence of corrosion reaction.

[0110] The self-assembled film refers to a monolayer formed on a solid surface through non-covalent interaction between molecules, and the film has a high degree of order and a tightly arranged structure, and the thickness is usually between zero point several nanometers and several nanometers.

[0111] In an embodiment of the present application, the self-assembled film copper wire prepared by the target corrosion inhibitor includes: immersing the pretreated copper wire in the target corrosion inhibitor; in the target corrosion inhibitor, retarding the chemical reaction between the anode and the cathode of the pretreated copper wire; after retarding the chemical reaction between the anode and the cathode of the pretreated copper wire, performing carbon chain interaction on the monolayer of the pretreated copper wire; when the carbon chain interaction of the monolayer of the pretreated copper wire is stable, determining the self-assembled film copper wire of the pretreated copper wire.

[0112] The carbon chain interaction refers to a long chain structure formed by connecting carbon atoms to each other through single bond, double bond or triple bond in an organic compound, and these carbon chains are the basic skeleton of most organic compounds. The length and structure of the carbon chain determine the physical, chemical properties of the organic compound and the function in the biological body.

[0113] S4, based on the preset electrochemical parameters, constructing a first polarization curve of the pretreated copper wire, based on the electrochemical parameters, constructing a second polarization curve of the self-assembled film copper wire, and using the first polarization curve and the second polarization curve to detect the corrosion resistance improvement degree of the self-assembled film copper wire.

[0114] The embodiment of the present application can more intuitively observe the mutual relationship and change trend between the two variables by constructing the first polarization curve of the pretreated copper wire and the second polarization curve of the self-assembled film copper wire based on the preset electrochemical parameters, and then obtaining the comparison result to achieve the experimental purpose.

[0115] The electrochemical parameter refers to an important physical quantity describing the kinetics and thermodynamics of electrochemical reactions, and plays a key role in electrochemical research and industrial applications.

[0116] The first polarization curve and the second polarization curve refer to a curve representing the relationship between electrode potential and polarization current or polarization current density, which is particularly important in the study of metal corrosion, battery reactions and electroplating processes.

[0117] In an embodiment of the present application, the first polarization curve of the pretreated copper wire is constructed based on the preset electrochemical parameters, including: obtaining a preset electrolyte solution and a constant potential instrument; connecting the pretreated copper wire to the constant potential instrument after inserting the pretreated copper wire into the electrolyte solution; detecting the copper wire current of the pretreated copper wire under a preset electrode potential on the constant potential instrument; and constructing the first polarization curve of the pretreated copper wire with the electrode potential as the horizontal coordinate and the copper wire current as the vertical coordinate.

[0118] Further, the corrosion resistance improvement degree of the self-assembled film copper wire is detected by using the first polarization curve and the second polarization curve, so that the change trend of the experimental results after adding the corrosion inhibitor can be observed more intuitively, and whether the experimental results are expected results can be determined.

[0119] In an embodiment of the present application, the corrosion resistance improvement degree of the self-assembled film copper wire is detected by using the first polarization curve and the second polarization curve, including: obtaining a first potential in the first polarization curve and a second potential in the second polarization curve; calculating the absolute value of the potential difference between the first potential and the second potential; and calculating the corrosion efficiency of the self-assembled film copper wire by using the following formula when the absolute value of the potential difference is greater than a preset absolute value:

[0120] According to the corrosion efficiency, the self-assembled film coverage of the self-assembled film copper wire is calculated by using the following formula:

[0121] The self-assembled film coverage is used as the corrosion resistance improvement degree.

[0122] Wherein, the potential electrode refers to a device for measuring electrode potential, which can be any type of electrode, such as a metal electrode, a semiconductor electrode, etc., the working principle of the potential electrode is to determine the redox properties of the solution by measuring the potential difference between the electrode and the solution (i.e. electrode potential), the polarization current refers to the current caused by the change of the polarity of the particles in the dielectric during polarization, the polarization current density refers to a physical quantity for measuring the charge separation process of the medium under the action of the electric field, which reflects the charge movement inside the medium due to the electric field, and this movement forms the current, the corrosion current density is the polarization current density.

[0123] S5, according to the corrosion resistance improvement degree, the target corrosion inhibitor is used to determine the corrosion resistance performance improvement result of the bonded copper wire product in the plastic package integrated circuit.

[0124] It can be seen that the embodiment of the present application can more accurately analyze and simulate the specific parameters of the required research object by identifying the bonding position of the bonded copper wire product in the plastic package integrated circuit by using the ray detection method, thereby providing convenience for subsequent operation. Further, the embodiment of the present application can remove the oxidation layer, stains and other impurities on the surface of the copper wire by pretreating the copper wire at the bonding position to obtain a pretreated copper wire, thereby reducing the impact on subsequent processing or testing. The embodiment of the present application can select an initial corrosion inhibitor for the pretreated copper wire by using the alternating current impedance analysis method, thereby protecting the metal material, prolonging the service life of the equipment, ensuring the safety of the production process, reducing the water treatment cost, improving the treatment effect, and bringing economic benefits to the enterprise. Further, the embodiment of the present application can determine the corrosion inhibitor concentration of the initial corrosion inhibitor by using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, thereby inferring the state variables affecting the electrode process from the number and values of the time constants contained in the impedance spectrum. The impedance spectrum of a single time constant can also be measured to obtain information about the solution resistance between the reference electrode and the working electrode, the double-layer capacitance, and the charge transfer resistance in different frequency ranges. The embodiment of the present application can select the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, thereby controlling variables that can cause corrosion changes of the copper wire other than the corrosion resistance of the corrosion inhibitor, reducing the impact of other factors on the experimental results. Further, the embodiment of the present application can prepare a self-assembled film copper wire of the pretreated copper wire by using the target corrosion inhibitor, thereby improving the corrosion resistance of the metal material, prolonging its service life, and reducing maintenance costs. By forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, thereby reducing the occurrence of corrosion reactions. The embodiment of the present application can construct a first polarization curve of the pretreated copper wire and a second polarization curve of the self-assembled film copper wire based on preset electrochemical parameters, thereby more intuitively observing the mutual relationship and change trend between the two variables, and then obtaining a comparison result to achieve the experimental purpose. Further, the embodiment of the present application can detect the corrosion resistance improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve, thereby more intuitively observing the change trend of the experimental result after adding the corrosion inhibitor, and thereby determining whether the experimental result is the expected result. Therefore, the method and system for improving the corrosion resistance of the bonded copper wire in the plastic package integrated circuit can reduce environmental pollution caused by the use of inappropriate corrosion inhibitors.

[0125] As Figure 2 shown, it is a function module diagram of the system for improving the corrosion resistance of the bonded copper wire in the plastic package integrated circuit.

[0126] The plastic package integrated circuit bonding copper wire anti-corrosion performance improvement system 200 can be installed in an electronic device. According to the functions implemented, the plastic package integrated circuit bonding copper wire anti-corrosion performance improvement system can include a position recognition module 201, an inhibitor selection module 202, a variable control module 203, a curve construction module 204, and a result analysis module 205. The modules in the present application can also be referred to as units, which refer to a series of computer program segments that can be executed by an electronic device processor and can complete a fixed function, which are stored in the memory of the electronic device.

[0127] In the embodiments of the present application, the functions of each module / unit are as follows:

[0128] The position recognition module 201 is used to obtain a plastic package integrated circuit, identify the bonding position of the bonding copper wire product in the plastic package integrated circuit by using a ray detection method, pretreat the copper wire at the bonding position, and obtain pretreated copper wire.

[0129] The inhibitor selection module 202 is used to select an initial inhibitor for the pretreated copper wire by an alternating current impedance analysis method, determine the inhibitor concentration of the initial inhibitor by using inhibitor samples at different concentrations of the initial inhibitor, and convert the initial inhibitor into a target inhibitor by using the inhibitor concentration.

[0130] The variable control module 203 is used to select the immersion time and immersion temperature of the pretreated copper wire in the target inhibitor, and prepare a self-assembled film copper wire of the pretreated copper wire by using the target inhibitor after the pretreated copper wire is immersed in the target inhibitor based on the immersion time and the immersion temperature.

[0131] The curve construction module 204 is used to construct a first polarization curve of the pretreated copper wire based on a preset electrochemical parameter, construct a second polarization curve of the self-assembled film copper wire based on the electrochemical parameter, and detect the anti-corrosion improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve.

[0132] The result analysis module 205 is used to determine the anti-corrosion performance improvement result of the bonding copper wire product in the plastic package integrated circuit by using the target inhibitor according to the anti-corrosion improvement degree.

[0133] In detail, the modules in the plastic package integrated circuit bonding copper wire anti-corrosion performance improvement system 200 in the embodiments of the present application use the same technical means as the plastic package integrated circuit bonding copper wire anti-corrosion performance improvement method described in the above Figure 1 , and can produce the same technical effects, which will not be described here again.

[0134] In addition, each of the functional modules in the various embodiments of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware, or in the form of hardware plus software function modules.

[0135] It is obvious to those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application.

[0136] Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims, not by the above description, and therefore all changes falling within the meaning and range of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims to which they relate.

[0137] It should be noted that, in this document, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0138] The above description is merely one specific implementation of the present application, and those skilled in the art can understand or implement the present application from the above description. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for improving the corrosion resistance of a bonding copper wire in a plastic encapsulated integrated circuit, characterized in that, The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises:

2. The method of claim 1, wherein, The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises:

3. The method of claim 1, wherein, The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: The method comprises: After the softening shell is removed by the cleaning tool, the copper wire is extracted in the bonding position; The surface of the copper wire is cleaned by using the cleaning agent, and a cleaned copper wire is obtained; The surface of the cleaned copper wire is polished by using the copper material chemical polishing solution, and a polished copper wire is obtained; The polished copper wire is placed in the chemical liquid, and the polished copper wire is pretreated in the chemical liquid to obtain a pretreated copper wire.

4. The method of claim 1, wherein, The initial corrosion inhibitor of the pretreated copper wire is selected by the alternating current impedance analysis method, comprising: The corrosion inhibitor sample of the pretreated copper wire is constructed; After the alternating current impedance analysis method is used to apply a sinusoidal alternating current signal to the corrosion inhibitor sample, the signal response of the corrosion inhibitor sample to the sinusoidal alternating current signal is measured; The initial corrosion inhibitor is selected from the corrosion inhibitor sample by using the signal response.

5. The method of claim 1, wherein, The corrosion inhibitor concentration of the initial corrosion inhibitor is determined by using the corrosion inhibitor sample of the initial corrosion inhibitor at different concentrations, comprising: A preset equivalent circuit element is obtained; the equivalent circuit element is placed in the corrosion inhibitor sample at different concentrations respectively; The equivalent circuit element is subjected to electrochemical operation in the corrosion inhibitor sample to obtain electrochemical reaction parameters; The electrochemical reaction parameters are subjected to parameter fitting processing to obtain fitting parameters; Based on the fitting parameters, the electrochemical characteristic differences between the corrosion inhibitor samples at different concentrations are distinguished; The corrosion inhibitor concentration of the initial corrosion inhibitor is confirmed from the initial corrosion inhibitor at different concentrations by using the electrochemical characteristic differences.

6. The method of claim 1, wherein, The immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor are selected, comprising: The experimental time and experimental temperature of the target corrosion inhibitor are constructed; Based on the experimental time and the experimental temperature, the pretreated copper wire is immersed in the target corrosion inhibitor, and then an immersed copper wire is extracted from the target corrosion inhibitor; The corrosion rate of the immersed copper wire is calculated by using the following formula: wherein y represents the corrosion rate, S represents the surface area of the pretreated copper wire exposed to the target corrosion inhibitor, m 2 x0represents the mass of the copper wire before the pretreated copper wire is immersed into the target corrosion inhibitor, m 1 x1represents the mass of the copper wire after the pretreated copper wire is immersed into the target corrosion inhibitor, x1represents the experimental time; A regression model between the corrosion rate and the experimental time and the experimental temperature is constructed by using the following formula: y = β0 + β1 + β2x2 Wherein, y = β0 + β1x1 + β2x2 represents the regression model, y represents the corrosion rate, x1 represents the experimental time, x2 represents the experimental temperature, β0, β1, β2 represent the regression coefficients; The immersion time and immersion temperature in the target corrosion inhibitor are determined from the experimental time and the experimental temperature by using the regression model.

7. The method of claim 1, wherein, The self-assembled film copper wire of the pretreated copper wire is prepared by using the target corrosion inhibitor, comprising: The pretreated copper wire is immersed in the target corrosion inhibitor; The chemical reaction between the anode and the cathode of the pretreated copper wire is blocked in the target corrosion inhibitor; After blocking the chemical reaction between the anode and the cathode of the pretreated copper wire, the single molecular layer of the pretreated copper wire is subjected to carbon chain interaction; When the single molecular layer of the pretreated copper wire is stable in carbon chain interaction, the self-assembled film copper wire of the pretreated copper wire is determined.

8. The method of claim 1, wherein, The first polarization curve of the pretreated copper wire is constructed based on the preset electrochemical parameters, comprising: A preset electrolyte solution and a constant potential instrument are obtained; After the pretreated copper wire is inserted into the electrolyte solution, the pretreated copper wire is connected to the potentiostat; The copper wire current of the pretreated copper wire is detected under a preset electrode potential on the potentiostat; The first polarization curve of the pretreated copper wire is constructed with the electrode potential as the horizontal coordinate and the copper wire current as the vertical coordinate.

9. The method of claim 1, wherein, The utilization of the first polarization curve and the second polarization curve to detect the corrosion resistance improvement degree of the self-assembled film copper wire includes: A first potential in the first polarization curve and a second potential in the second polarization curve are obtained; The absolute value of the potential difference between the first potential and the second potential is calculated; When the absolute value of the potential difference is greater than a preset absolute value, the corrosion inhibition efficiency of the self-assembled film copper wire is calculated; According to the corrosion inhibition efficiency, the self-assembled film coverage of the self-assembled film copper wire is calculated: The self-assembled film coverage is taken as the corrosion resistance improvement degree.

10. A system for improving the corrosion resistance of a bonded copper wire in a plastic encapsulated integrated circuit, comprising: a copper wire having a surface; a passivation layer formed on the surface of the copper wire; and a protective layer formed on the passivation layer. The system includes: A position recognition module is configured to obtain a plastic package integrated circuit, recognize a bonding position of a bonded copper wire product in the plastic package integrated circuit by using a ray detection method, pretreat the copper wire at the bonding position to obtain a pretreated copper wire, and select an initial corrosion inhibitor for the pretreated copper wire by using an alternating current impedance analysis method. An inhibitor selection module is configured to determine a corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and convert the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration. A variable control module is configured to select an immersion time and an immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and prepare a self-assembled film copper wire of the pretreated copper wire by using the target corrosion inhibitor after the pretreated copper wire is immersed in the target corrosion inhibitor based on the immersion time and the immersion temperature. A curve construction module is configured to construct a first polarization curve of the pretreated copper wire based on preset electrochemical parameters, construct a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and detect a corrosion resistance improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve. A result analysis module is configured to determine a corrosion resistance performance improvement result of the bonded copper wire product in the plastic package integrated circuit by using the target corrosion inhibitor according to the corrosion resistance improvement degree.

Images