Substrate processing method and substrate processing apparatus

Abstract

The invention provides a substrate processing method and a substrate processing apparatus capable of shooting a liquid column-shaped processing liquid ejected to an end portion of a substrate. The substrate processing method includes a holding step, a rotating step, a rising step, a slope processing step, an imaging step, and a monitoring step. In the raising step, the cup-shaped member surrounding the outer periphery of the substrate holding part is raised, and the upper end of the cup-shaped member is positioned at a higher upper end position than the upper surface of the substrate held by the substrate holding part. In the slope processing step, the processing liquid is discharged from the discharge port of the nozzle located at a lower position than the upper end position toward the end portion of the upper surface of the substrate held by the substrate holding portion. In the imaging step, an imaging region including the processing liquid ejected from the ejection port of the nozzle and seen from an imaging position above the substrate is imaged by a camera, and an imaged image is acquired. In the monitoring step, the discharge state of the processing liquid is determined on the basis of the captured image.

Description

[0001] The present invention is a divisional application of the invention patent application with application number 201910936715.0 filed on September 29, 2019 and invention name “Substrate processing method and substrate processing device”. Technical Field

[0002] The invention relates to a substrate processing method and a substrate processing device. Background Art

[0003] As a device for processing a substrate, a substrate processing device is used which sprays a processing liquid from a spray nozzle onto the surface of the substrate while rotating the substrate in a horizontal plane. The processing liquid landed on the approximate center of the substrate from the spray nozzle is spread over the entire surface by the centrifugal force accompanying the rotation of the substrate, and is scattered outward from the periphery of the substrate. The processing liquid is spread over the entire surface of the substrate, so that the processing liquid can act on the entire surface of the substrate. As the processing liquid, a chemical liquid or a cleaning liquid corresponding to the processing of the substrate is used.

[0004] In such a substrate processing apparatus, a technique of providing a camera in order to monitor whether the processing liquid is appropriately discharged has been proposed (Patent Documents 1 to 5).

[0005] Furthermore, in the process of manufacturing a semiconductor substrate, various films remaining on the peripheral edge of the substrate may adversely affect the device surface of the substrate.

[0006] Therefore, a bevel treatment for removing the film from the peripheral edge of the substrate has been proposed. In the bevel treatment, the film at the peripheral edge of the substrate is removed by spraying a removal treatment liquid from a spray nozzle toward the end of the substrate while rotating the substrate in a horizontal plane.

[0007] [Prior art literature]

[0008] [Patent Document]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 2015-173148

[0010] [Patent Document 2] Japanese Patent Application Publication No. 2017-29883

[0011] [Patent Document 3] Japanese Patent Application Publication No. 2015-18848

[0012] [Patent Document 4] Japanese Patent Application Publication No. 2016-122681

[0013] [Patent Document 5] Japanese Patent Application Publication No. 2008-135679 Summary of the invention

[0014] [Problems to be solved by the invention]

[0015] In the bevel treatment, the treatment liquid only needs to be supplied to the end of the substrate, so the flow rate of the treatment liquid decreases. That is, the liquid column-shaped treatment liquid ejected from the ejection nozzle becomes thinner. Therefore, the liquid column-shaped treatment liquid is easily affected by various main factors such as the airflow accompanying the rotation of the substrate and the static electricity generated in the surroundings, and the ejection state of the treatment liquid is easily changed.

[0016] However, in the bevel surface processing, the interval between the discharge nozzle and the substrate is narrow, so it takes time and effort to capture an image of the processing liquid in the form of a liquid column discharged from the discharge nozzle.

[0017] Therefore, an object of the present application is to provide a substrate processing method and a substrate processing apparatus capable of monitoring a liquid column-shaped processing liquid ejected to an end portion of a substrate.

[0018] [Technical means to solve the problem]

[0019] The first embodiment of the substrate processing method includes: a holding step of holding a substrate on a substrate holding portion; a rotating step of rotating the substrate holding portion to rotate the substrate; a lifting step of lifting a cup-shaped member surrounding the outer periphery of the substrate holding portion and positioning the upper end of the cup-shaped member at an upper end position higher than the upper surface of the substrate held on the substrate holding portion; a slope processing step of spraying a processing liquid from a nozzle outlet located at a lower position than the upper end position toward an end portion of the upper surface of the substrate held on the substrate holding portion; a photographing step of causing a camera to photograph a photographing area as a photographing area including the processing liquid sprayed from the nozzle outlet and viewed from a photographing position above the substrate held on the substrate holding portion to obtain a photographed image; and a monitoring step of determining the spraying state of the processing liquid based on the photographed image.

[0020] The second embodiment of the substrate processing method is based on the substrate processing method of the first embodiment, wherein the monitoring process includes: determining whether a first statistic of brightness values ​​of pixels in a spraying determination area located directly below the nozzle and longer in the horizontal direction than in the vertical direction in the camera image is above a first threshold value, and when the first statistic is above the first threshold value, determining that the processing liquid is sprayed from the nozzle.

[0021] The third embodiment of the substrate processing method is based on the substrate processing method of the second embodiment, wherein the monitoring process includes: determining whether the first statistic is above a second threshold value that is larger than the first threshold value, and when the first statistic is above the second threshold value, determining that liquid splashing of the processing liquid rebounding on the upper surface of the substrate is generated.

[0022] The fourth embodiment of the substrate processing method is based on the substrate processing method of the second embodiment or the third embodiment, wherein the monitoring process includes: a process of determining whether liquid splashing of the processing liquid rebounding on the upper surface of the substrate occurs based on the brightness value of pixels in a liquid splashing determination area, and the liquid splashing determination area is set on the downstream side of the rotation direction of the substrate relative to the ejection determination area in the camera image.

[0023] A fifth embodiment of a substrate processing method is the substrate processing method according to the fourth embodiment, wherein the liquid splash determination area is not set on the upstream side of the ejection determination area in the rotation direction of the substrate in the captured image.

[0024] The sixth embodiment of the substrate processing method is a substrate processing method according to any one of the second to fifth embodiments, wherein the ejection determination area is set at a position in the camera image that includes a portion of the processing liquid reflected on the upper surface of the substrate by mirror reflection.

[0025] A seventh embodiment of a substrate processing method is the substrate processing method according to the sixth embodiment, wherein the exposure time of the camera is set to be longer than the time required for the substrate to rotate once.

[0026] The 8th embodiment of the substrate processing method is based on the substrate processing method of the 6th embodiment, wherein the first statistic is calculated based on the brightness value of the pixels in the ejection judgment area in the processed image obtained by integrating or averaging a plurality of camera images obtained by the camera within a time period longer than the time required for the substrate to rotate once.

[0027] The ninth embodiment of the substrate processing method is based on the substrate processing method of the first embodiment, wherein in the monitoring process, a classifier that completes machine learning is used to classify the camera image according to a category representing the spraying state of the processing liquid sprayed from the front end of the nozzle.

[0028] The tenth embodiment of the substrate processing method is based on the ninth embodiment of the substrate processing method, wherein in the monitoring process, a spray determination area located directly below the nozzle and longer in the horizontal direction than in the vertical direction is cut out from the camera image, and the cut-out image of the spray determination area is input into the classifier.

[0029] The 11th embodiment of the substrate processing method is a substrate processing method according to any one of the first to tenth embodiments, wherein a portion of the periphery of the substrate is included in the camera image, and the bevel processing step includes: a step of calculating the substrate periphery position of a portion of the periphery of the substrate based on the camera image; and a step of moving the nozzle by a specified width from the substrate periphery position to a processing position at the center of the substrate.

[0030] An embodiment of a substrate processing device includes: a substrate holding portion, which holds a substrate and rotates the substrate; a cup-shaped member, which surrounds the outer periphery of the substrate holding portion; a lifting mechanism, which raises the cup-shaped member and positions the upper end of the cup-shaped member at an upper end position higher than the upper surface of the substrate held by the substrate holding portion; a nozzle, which has a spray port located at a lower position than the upper end position and sprays a processing liquid from the spray port toward the end of the upper surface of the substrate held by the substrate holding portion; a camera, which captures a photographing area including the processing liquid sprayed from the spray port of the nozzle and viewed from a photographing position above the substrate held by the substrate holding portion to obtain a photographic image; and an image processing portion, which determines the spraying state of the processing liquid based on the photographic image.

[0031] [Effects of the Invention]

[0032] According to the first embodiment of the substrate processing method and the embodiment of the substrate processing apparatus, the processing liquid discharged from the nozzle can be imaged, and the discharge state can be appropriately determined based on the imaged image.

[0033] According to the second embodiment of the substrate processing method, the presence or absence of discharge of the processing liquid can be determined.

[0034] According to the third embodiment of the substrate processing method, the presence or absence of liquid splashing can be determined using the first statistic used for the presence or absence of discharge. Therefore, the calculation process is simple.

[0035] According to the fourth embodiment of the substrate processing method, the pixel values ​​of pixels in the liquid splashing discharge area set in the direction where liquid splashing is likely to occur are used. Therefore, the presence or absence of discharge can be appropriately determined.

[0036] According to the fifth embodiment of the substrate processing method, the liquid splash determination area is not set in the area where liquid splash is less likely to occur, so the processing load can be reduced.

[0037] According to the sixth embodiment of the substrate processing method, the length of the liquid column-shaped processing liquid reflected on the upper surface of the substrate by the mirror reflection becomes longer, so it is easy to set the discharge determination area.

[0038] According to the seventh embodiment of the substrate processing method, in the captured image, the pattern on the upper surface of the substrate is averaged and made uniform, so that the outline of the processing liquid reflected on the upper surface of the substrate can be made conspicuous.

[0039] According to the eighth embodiment of the substrate processing method, in the processed image, the pattern on the upper surface of the substrate is averaged and made uniform, so that the outline of the processing liquid reflected on the upper surface of the substrate can be made conspicuous.

[0040] According to the ninth embodiment of the substrate processing method, abnormality can be detected with high accuracy.

[0041] According to the tenth embodiment of the substrate processing method, classification can be performed without the influence of the region having a low correlation with the discharge state, so the accuracy of the classification can be improved.

[0042] According to the eleventh embodiment of the substrate processing method, the nozzle can be moved to the processing position with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a diagram showing an example of a schematic configuration of a substrate processing apparatus.

[0044] Figure 2 This is a plan view schematically showing an example of the configuration of a processing unit.

[0045] Figure 3 This is a cross-sectional view schematically showing an example of the structure of the processing unit.

[0046] Figure 4 This is a diagram schematically showing an example of a captured image obtained by a camera.

[0047] Figure 5 This is a perspective view schematically showing an example of the configuration of a camera and a camera holding portion.

[0048] Figure 6 This is a flowchart showing an example of substrate processing.

[0049] Figure 7 This is a flowchart showing an example of monitoring processing.

[0050] Figure 8 This is a diagram in which a portion of a captured image is enlarged.

[0051] Fig. 9 This is a graph showing an example of the brightness value of pixels in the discharge determination area.

[0052] Fig.10 This is a diagram schematically showing an example of a captured image.

[0053] Fig.11This is a graph showing an example of temporal changes in statistics.

[0054] Fig.12 This is a flowchart showing an example of monitoring processing.

[0055] Fig.13 This is a plan view schematically showing an example of the configuration of a processing unit.

[0056] Fig.14 This is a diagram schematically showing an example of a captured image.

[0057] Fig.15 This is a plan view schematically showing an example of the configuration of a processing unit.

[0058] Fig.16 This is a functional block diagram schematically showing an example of the internal configuration of the control unit.

[0059] Description of Reference Numerals

[0060] 1.1A, 1B: Processing unit

[0061] 9: Control Department

[0062] 10: Chamber

[0063] 11: Sidewall

[0064] 12: Top wall

[0065] 13: Bottom wall

[0066] 14: Fan filter unit

[0067] 15: Partition

[0068] 18: Exhaust duct

[0069] 20: Substrate holding part

[0070] 21: Rotating base

[0071] 21a: Keep the face

[0072] 22: Rotary motor

[0073] 23: Cover member

[0074] 24: Rotation axis

[0075] 26: Chuck pin

[0076] 30, 60, 65: Processing liquid supply unit

[0077] 31, 61, 66: Spray nozzle

[0078] 32, 62, 67: Fixed components

[0079] 33, 63, 68: Mobile mechanism

[0080] 34: Piping

[0081] 35: On / off valve

[0082] 36: Suction valve

[0083] 37: Treatment liquid supply source

[0084] 40: Cup-shaped member (processing cup)

[0085] 41: Inner cup

[0086] 42: Medium

[0087] 43: outer cup

[0088] 44: Lifting mechanism

[0089] 70: Camera

[0090] 71: Lighting Department

[0091] 73: Camera holding part

[0092] 74: Protective components

[0093] 75: Reflector

[0094] 76: Mirror holding part

[0095] 91: Classifier

[0096] 92: Machine Learning Department

[0097] 93: Notification Department

[0098] 100: Substrate processing device

[0099] 102: Indexer

[0100] 103: Main transport robot

[0101] 321, 621, 671: Nozzle arm

[0102] 322, 622, 672: Nozzle base

[0103] 731: Connecting parts

[0104] 732: Upper surface component

[0105] 733: Side member

[0106] 734: Lower surface component

[0107] 911: Feature vector extraction unit

[0108] 912: Judgment Department

[0109] 913: Determine database

[0110] AR34, AR64, AR69: Arrow

[0111] CX: Rotation axis

[0112] G1~G3: Curve graph

[0113] IM1: Camera image

[0114] L1, L2: Straight line

[0115] Lq1: Treatment liquid

[0116] R1: Region

[0117] R2: Ejection judgment area

[0118] R3: Liquid splash judgment area

[0119] R4: Peripheral area

[0120] S1~S24: Steps

[0121] W: substrate

[0122] θ1, θ2: angle DETAILED DESCRIPTION

[0123] Below, refer to the attached Figure 1 The embodiments are described while the drawings are schematically shown. For the convenience of description, it is appropriate to omit or simplify the structure. In addition, the size and position of the structures shown in the drawings may not be accurately recorded and may be changed as appropriate.

[0124] In the following description, the same components are denoted by the same reference numerals, and the same applies to their names and functions. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

[0125] <Overview of substrate processing apparatus>

[0126] Figure 1 1 is a diagram showing the overall structure of a substrate processing apparatus 100. The substrate processing apparatus 100 is an apparatus for processing a substrate W by supplying a processing liquid to the substrate W. The substrate W is, for example, a semiconductor substrate. The substrate W has a substantially disk shape.

[0127] The substrate processing device 100 can remove useless materials attached to the peripheral end of the substrate W by supplying a processing liquid to the end of the substrate W while rotating the substrate W in a horizontal plane. The width of the peripheral end (the width along the radial direction) is, for example, about 0.5 [mm] to 3 [mm]. Examples of useless materials include films such as SiO2 films, SiN films, and polysilicon films, as well as particles. Examples of processing liquids for removing such useless materials include: hydrofluoric acid (HF), phosphoric acid (H3PO4), a mixed solution (SC-1) of ammonia (NH3) and hydrogen peroxide (H2O2), and fluoronitric acid (a mixed solution of hydrofluoric acid and nitric acid (HNO3)). The substrate processing device 100 removes useless materials by supplying a processing liquid to the end of the substrate W while rotating the substrate W. This type of processing is also called bevel processing.

[0128] The substrate processing device 100 includes: an indexer 102, a plurality of processing units 1 and a main transport robot 103. The indexer 102 has the function of moving unprocessed substrates W received from outside the device into the device, and moving processed substrates W out of the device. The indexer 102 carries a plurality of carriers and includes a transfer robot (all omitted in the figure). As a carrier, a front opening unified pod (FOUP) or a standard mechanical interface (SMIF) box that stores the substrate W in a closed space, or an open cassette (OC) that exposes the substrate W to the external air in the storage state can be used. The transfer robot transfers the substrate W between the carrier and the main transport robot 103.

[0129] The substrate processing apparatus 100 is provided with 12 processing units 1. The detailed configuration is that four towers with three processing units 1 stacked on top of each other are arranged so as to surround the main transfer robot 103. In other words, the four processing units 1 arranged to surround the main transfer robot 103 are stacked in three layers. Figure 1 It indicates one layer. In addition, the number of the processing units 1 mounted in the substrate processing apparatus 100 is not limited to 12, and may be, for example, 8 or 4.

[0130] The main transfer robot 103 is installed in the center of four stacked towers of the processing units 1. The main transfer robot 103 transfers unprocessed substrates W received from the indexer 102 to each processing unit 1, and transfers processed substrates W from each processing unit 1 to the indexer 102.

[0131] <Processing unit>

[0132] Next, the processing unit 1 will be described. Hereinafter, one of the twelve processing units 1 mounted in the substrate processing apparatus 100 will be described, but the same applies to the other processing units 1 . Figure 2 is a plan view of the processing unit 1. In addition, Figure 3 It is a longitudinal sectional view of the processing unit 1.

[0133] The processing unit 1 includes the following components as main components in the chamber 10: a substrate holding portion 20 that holds the substrate W in a horizontal position (a position in which the normal line of the substrate W is along the vertical direction); three processing liquid supply portions 30, 60, and 65 that supply processing liquid to the upper surface of the substrate W held by the substrate holding portion 20; a processing cup (cup-shaped member) 40 that surrounds the substrate holding portion 20; and a camera 70. In addition, a partition plate 15 is provided around the processing cup 40 in the chamber 10 to separate the inner space of the chamber 10 from top to bottom. In addition, the processing unit 1 is provided with a control portion 9 and a notification portion 93.

[0134] <Chamber>

[0135] The chamber 10 includes a side wall 11 extending in the vertical direction, a top wall 12 closing the upper side of the space surrounded by the side wall 11, and a bottom wall 13 closing the lower side of the space surrounded by the side wall 11. The space surrounded by the side wall 11, the top wall 12, and the bottom wall 13 serves as a processing space for the substrate W. In addition, a carry-out port / carry-in port for the main transfer robot 103 to carry the substrate W into / out of the chamber 10 and a shutter (both not shown) for opening and closing the carry-out port / carry-in port are provided at a portion of the side wall 11 of the chamber 10.

[0136] A fan filter unit (FFU) 14 is installed on the top wall 12 of the chamber 10. The fan filter unit 14 is used to further purify the air in the clean room where the substrate processing device 100 is installed, and supply it to the processing space in the chamber 10. The fan filter unit 14 includes a fan and a filter (for example, a high efficiency air filter (HEPA filter)) for taking the air in the clean room into and sending it to the chamber 10, and forms a downflow of clean air in the processing space in the chamber 10. In order to evenly disperse the clean air supplied from the fan filter unit 14, a punching plate having a plurality of blowing holes can be provided directly below the top wall 12.

[0137] <Substrate holding section>

[0138] The substrate holding portion 20 is, for example, a spin chuck. The substrate holding portion 20 includes a disk-shaped spin base 21, which is fixed in a horizontal position to the upper end of a rotation shaft 24 extending in a vertical direction. A spin motor 22 for rotating the rotation shaft 24 is provided below the spin base 21. The spin motor 22 rotates the spin base 21 in a horizontal plane via the rotation shaft 24. In addition, a cylindrical cover member 23 is provided in a manner surrounding the spin motor 22 and the rotation shaft 24.

[0139] The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the substrate holding portion 20. Therefore, the spin base 21 has a holding surface 21a facing the entire lower surface of the substrate W to be held.

[0140] A plurality of (four in the present embodiment) chuck pins 26 are erected on the peripheral edge of the holding surface 21a of the rotating base 21. The plurality of chuck pins 26 are arranged at equal intervals along a circumference corresponding to the outer circumference of the circular substrate W (as in the present embodiment, if there are four chuck pins 26, they are arranged at intervals of 90°). The plurality of chuck pins 26 are driven in a linked manner by a link mechanism (not shown) housed in the rotating base 21. The substrate holding portion 20 holds the substrate W by bringing the plurality of chuck pins 26 into contact with the outer circumferential ends of the substrate W, respectively, and can hold the substrate W in a horizontal posture close to the holding surface 21a above the rotating base 21 (see FIG. 2 ). Figure 3 ), and the plurality of chuck pins 26 can be respectively separated from the outer peripheral end of the substrate W to release the grip.

[0141] When the substrate holding part 20 holds the substrate W by gripping with the plurality of chuck pins 26, the rotary motor 22 rotates the rotary shaft 24, thereby rotating the substrate W around the rotary axis CX in the vertical direction passing through the center of the substrate W. Figure 2 The rotation is in the counter-clockwise direction.

[0142] <Processing liquid supply unit>

[0143] The treatment liquid supply unit 30 includes: a spray nozzle 31, a fixing member 32, and a moving mechanism 33. The fixing member 32 is a member for fixing the spray nozzle 31, and includes, for example, a nozzle arm 321 and a nozzle base 322. The spray nozzle 31 is mounted at the front end of the nozzle arm 321. The base end side of the nozzle arm 321 is fixedly connected to the nozzle base 322. The moving mechanism 33 moves the spray nozzle 31 by displacing the fixing member 32. For example, the moving mechanism 33 is a motor, and rotates the nozzle base 322 around an axis along the vertical direction. By rotating the nozzle base 322, as shown in FIG. Figure 2 As indicated by arrow AR34 in FIG. 1 , the discharge nozzle 31 moves in an arc shape in the horizontal direction between a processing position above the end of the substrate W and a standby position outside the processing cup 40 .

[0144] The processing liquid supply unit 30 may also include a plurality of spray nozzles 31. Figure 2 and Figure 3 In the example of FIG. 3 , three ejection nozzles 31 are shown as the ejection nozzles 31. The three ejection nozzles 31 are fixed to the nozzle base 322 via the nozzle arm 321. Therefore, the three ejection nozzles 31 move synchronously with each other. The three ejection nozzles 31 are arranged at positions along the circumferential direction of the substrate W in the processing position. The interval between the three ejection nozzles 31 in the circumferential direction is, for example, about ten [mm].

[0145] like Figure 3 As shown in the example, the ejection nozzle 31 is connected to the processing liquid supply source 37 via the piping 34. An on-off valve 35 is provided in the middle of the piping 34. A jet outlet (not shown) is formed on the lower surface of the front end of the ejection nozzle 31. When the on-off valve 35 is opened, the processing liquid from the processing liquid supply source 37 flows through the inside of the piping 34 and is ejected from the jet outlet of the ejection nozzle 31. When the ejection nozzle 31 stops at the processing position, the ejected processing liquid lands on the end of the upper surface of the substrate W held on the substrate holding portion 20. As the substrate W rotates, the processing liquid from the ejection nozzle 31 is supplied to the entire area of ​​the peripheral end of the substrate W, thereby removing the useless matter at the peripheral end (bevel processing).

[0146] A suction valve 36 may be provided in the middle of each pipe 34. The suction valve 36 draws the processing liquid in the pipe 34 when the ejection of the processing liquid stops, thereby introducing the processing liquid from the front end of the ejection nozzle 31. Thus, when the ejection stops, the processing liquid is less likely to drip from the front end of the ejection nozzle 31 as a relatively large mass (liquid droplet).

[0147] When a plurality of ejection nozzles 31 are provided, the ejection nozzles 31 may be connected to different processing liquid supply sources 37. That is, the processing liquid supply unit 30 may be configured to supply a plurality of processing liquids. Alternatively, at least two of the plurality of ejection nozzles 31 may supply the same processing liquid.

[0148] In addition, in the processing unit 1 of the present embodiment, in addition to the processing liquid supply unit 30, two processing liquid supply units 60 and 65 are further provided. The processing liquid supply unit 60 and the processing liquid supply unit 65 of the present embodiment include the same structure as the processing liquid supply unit 30. That is, the processing liquid supply unit 60 includes: a spray nozzle 61, a fixed member 62 and a moving mechanism 63. The fixed member 62 has a nozzle arm 621 and a nozzle base 622 in the same manner as the fixed member 32. The spray nozzle 61 is installed at the front end of the nozzle arm 621, and the nozzle base 622 is connected to the base end of the nozzle arm 621. The moving mechanism 63 is, for example, a motor, and by rotating the nozzle base 622, the spray nozzle 61 is moved in an arc shape between a processing position above the end of the substrate W and a standby position further outward than the processing cup 40 as indicated by the arrow AR64. This spray nozzle 61 also supplies the processing liquid to the end of the substrate W. As the substrate W rotates, the processing liquid is supplied from the discharge nozzle 61 to the entire area of ​​the peripheral edge of the substrate W, thereby removing unnecessary materials at the peripheral edge (bevel processing).

[0149] The processing liquid supply unit 65 includes: a spray nozzle 66, a fixed member 67, and a moving mechanism 68. The fixed member 67 includes a nozzle arm 671 and a nozzle base 672. The spray nozzle 66 is mounted at the front end of the nozzle arm 671, and the nozzle base 672 is connected to the base end of the nozzle arm 671. The moving mechanism 68 is, for example, a motor, which rotates the nozzle base 672 to move the spray nozzle 66 in an arc shape between a processing position above the approximate center of the substrate W and a standby position further outward than the processing cup 40 as indicated by the arrow AR69. This spray nozzle 66 supplies the processing liquid to the approximate center of the substrate W. As the substrate W rotates, the processing liquid from the spray nozzle 66 diffuses from the center of the substrate W and scatters from the periphery of the substrate to the outside. In this way, the processing liquid can act on the entire upper surface of the substrate W.

[0150] Each of the processing liquid supply parts 60 and 65 may be configured to supply a plurality of processing liquids. Alternatively, each of the processing liquid supply parts 60 and 65 may be configured to supply a single processing liquid.

[0151] The processing liquid supply part 60 and the processing liquid supply part 65 spray the processing liquid onto the upper surface of the substrate W held on the substrate holding part 20 when their respective spray nozzles 61 and spray nozzles 66 are located at the processing position. Furthermore, at least one of the spray nozzles 61 and 66 of the processing liquid supply part 60 and the processing liquid supply part 65 may be a two-fluid nozzle that mixes a cleaning liquid such as pure water with a pressurized gas to generate droplets and sprays the mixed fluid of the droplets and the gas onto the substrate W. In addition, the processing liquid supply parts provided in the processing unit 1 are not limited to three, as long as there are more than one. The respective spray nozzles 61 and spray nozzles 66 of the processing liquid supply part 60 and the processing liquid supply part 65 may also be connected to the processing liquid supply source via piping in the same manner as the processing liquid supply part 30. In addition, an opening and closing valve may be provided in the middle of the piping, and a suction valve may also be provided. Below, the slope processing using the processing liquid supply part 30 is described representatively.

[0152] <Processing cup>

[0153] The processing cup 40 is arranged in a manner surrounding the substrate holding portion 20. The processing cup 40 includes an inner cup 41, a middle cup 42, and an outer cup 43. The inner cup 41, the middle cup 42, and the outer cup 43 are arranged in a manner that can be raised and lowered. Specifically, a lifting mechanism 44 is provided in the processing unit 1, and the lifting mechanism 44 can lift and lower the inner cup 41, the middle cup 42, and the outer cup 43 individually. The lifting mechanism 44 has, for example, a ball screw mechanism.

[0154] When the inner cup 41, the middle cup 42, and the outer cup 43 are raised, the upper end of the processing cup 40 (here, the upper end of the outer cup 43) is located above the upper surface of the substrate W. Hereinafter, the height position of the upper end of the outer cup 43 when the outer cup 43 is raised is also referred to as the upper end position of the processing cup 40. The interval between the upper end position of the processing cup 40 and the substrate W in the vertical direction can be set to, for example, about 2 [mm] to more than ten [mm].

[0155] In the state where the inner cup 41, the middle cup 42 and the outer cup 43 have risen, the processing liquid scattered from the periphery of the substrate W hits the inner circumferential surface of the inner cup 41 and falls. The fallen processing liquid is suitably recovered by the first recovery mechanism (not shown). In the state where the inner cup 41 has fallen, the middle cup 42 and the outer cup 43 have risen, the processing liquid scattered from the periphery of the substrate W hits the inner circumferential surface of the middle cup 42 and falls. The fallen processing liquid is suitably recovered by the second recovery mechanism (not shown). In the state where the inner cup 41 and the middle cup 42 have fallen, and the outer cup 43 has risen, the processing liquid scattered from the periphery of the substrate W hits the inner circumferential surface of the outer cup 43 and falls. The fallen processing liquid is suitably recovered by the third recovery mechanism (not shown). Accordingly, different processing liquids can be appropriately recovered respectively.

[0156] Hereinafter, the state in which the outer cup 43 has risen will be described as the state in which the processing cup 40 has risen. That is, the state in which the processing cup 40 has risen includes: the state in which the inner cup 41, the middle cup 42 and the outer cup 43 are all risen, the state in which only the middle cup 42 and the outer cup 43 are risen, and the state in which only the outer cup 43 is risen.

[0157] <Partition>

[0158] The partition 15 is provided around the processing cup 40 so as to separate the inner space of the chamber 10 up and down. The partition 15 may be a plate-shaped member surrounding the processing cup 40, or may be a member formed by joining a plurality of plate-shaped members. In addition, the partition 15 may also be formed with a through hole or a cutout that penetrates in the thickness direction. In the present embodiment, a through hole (not shown) for passing a support shaft is formed, and the support shaft is used to support the nozzle base 322, the nozzle base 622, and the nozzle base 672 of the processing liquid supply unit 30, the processing liquid supply unit 60, and the processing liquid supply unit 65.

[0159] The outer peripheral end of the partition 15 is connected to the side wall 11 of the chamber 10. In addition, the edge of the partition 15 surrounding the processing cup 40 is formed into a circular shape with a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition 15 does not hinder the outer cup 43 from ascending or descending.

[0160] In addition, an exhaust duct 18 is provided at a part of the side wall 11 of the chamber 10 and near the bottom wall 13. The exhaust duct 18 is connected to an exhaust mechanism (not shown). The clean air supplied from the fan filter unit 14 and flowing down in the chamber 10, the air passing through the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the device.

[0161] <Camera>

[0162] The camera 70 is disposed in the chamber 10 and is located above the partition 15. The camera 70 includes, for example, an imaging element (e.g., a charge coupled device (CCD)), an electronic shutter, a lens, and other optical systems. The camera 70 can capture an imaging area described below. That is, the imaging area is an area viewed from an upper imaging position relative to the substrate W, and is an area including the front end of the ejection nozzle 31 at the processing position and a roughly liquid column-shaped processing liquid ejected from the front end of the ejection nozzle 31 to the end of the substrate W (see also Figure 3 ).

[0163] Figure 4 IM1 is a diagram schematically showing an example of image data (hereinafter referred to as a captured image) IM1 acquired by the camera 70. Figure 4In the example, the camera image IM1 includes the front ends of the three ejection nozzles 31. The camera image IM1 includes the substantially columnar processing liquid Lq1 ejected from the ejection nozzle 31 located in the center among the three ejection nozzles 31. The substantially columnar processing liquid Lq1 mentioned here refers to the processing liquid Lq1 flowing down from the front end of the ejection nozzle 31 toward the upper surface of the substrate W. The camera 70 outputs the camera image IM1 to the control unit 9.

[0164] like Figure 2 As shown in the example, the camera 70 may be arranged in a movable manner. Figure 2 In the example, the camera 70 is fixed to the fixing member 62 of the processing liquid supply part 60. As a more specific example, a camera holding part 73 for holding the camera 70 is provided, and the camera holding part 73 is connected to the nozzle arm 621 of the fixing member 62. For example, the camera holding part 73 is fixed to the front end of the nozzle arm 621 by a fastening member (for example, a screw) at its base end side, and the camera 70 is fixed and held by the fastening member at the front end side. The camera holding part 73 is formed of, for example, metal (for example, stainless steel). The moving mechanism 63 moves the camera 70 to an imaging position above the substrate W by displacing the fixing member 62. Specifically, the moving mechanism 63 can move the camera 70 back and forth between an imaging position above the substrate W and a standby position further outward than the processing cup 40 by rotating the nozzle base 622.

[0165] exist Figure 2 In the example, the standby position of the ejection nozzle 31 is located at a position that is offset by about 90 degrees in the clockwise direction relative to the standby position of the camera 70. The ejection nozzle 31 and the camera 70 move from their respective standby positions toward each other and stop at the processing position and the imaging position, respectively. The camera 70 is held on the camera holding portion 73 in a posture that allows it to capture an imaging area including the front end of the ejection nozzle 31 and the roughly liquid column-shaped processing liquid Lq1 ejected from the front end of the ejection nozzle 31 at the imaging position. Figure 2 In the example of FIG. 6 , the camera holding portion 73 protrudes obliquely in the clockwise direction relative to the nozzle arm 621 and holds the camera 70 at the front end side thereof.

[0166] Here, an example of the positional relationship between the camera 70 and the ejection nozzle 31 when the ejection nozzle 31 stops at the processing position and the camera 70 stops at the imaging position will be described. The positional relationship will be described below using the ejection nozzle 31 located in the center among the three ejection nozzles 31.

[0167] exist Figure 2In the example of FIG. 1 , the camera 70 is located on the center side of the substrate W relative to the discharge nozzle 31 in a plan view. That is, the radial position of the camera 70 relative to the substrate W is located closer to the center side of the substrate W than the radial position of the discharge nozzle 31.

[0168] In addition, Figure 2 In the example, the camera 70 captures the front ends of the three ejection nozzles 31 from a direction closer to the circumferential direction than the radial direction of the substrate W when viewed from above. That is, the circumferential position of the camera 70 relative to the substrate W is offset to one side relative to the circumferential position of the ejection nozzle 31. Furthermore, in other words, when viewed from above, the angle θ1 (0<θ1<90) formed by the virtual straight line L1 connecting the center of the substrate W and the ejection nozzle 31 and the optical axis of the camera 70 is greater than the angle θ2 (0<θ2<90) formed by the virtual straight line L2 orthogonal to the straight line L1 and the optical axis of the camera 70. Accordingly, in the camera image IM1, the radial position of the landing position of the processing liquid Lq1 relative to the substrate W can be easily seen. However, if the angle θ2 is too small, the three ejection nozzles 31 will be arranged and overlapped in the depth direction when observed from the camera position. In such a case, it is difficult to include all of the three ejection nozzles 31 in the captured image IM1 , and therefore the angle θ2 may be set so that the three ejection nozzles 31 are appropriately offset in the lateral direction when viewed from the imaging position.

[0169] In addition, the camera 70 captures the image capturing area from a direction closer to the circumferential direction, and when observing from the image capturing position, the three ejection nozzles 31 are offset from each other in the depth direction. The intervals between the three ejection nozzles 31 in the depth direction are, for example, several [mm] to more than ten [mm]. The depth of field of the camera 70 is set large to a degree that the outlines of the three ejection nozzles 31 are clear. In addition, the distance between the camera 70 and the ejection nozzle 31 is, for example, about 100 [mm].

[0170] exist Figure 2 In the example, the camera 70 is located on the upstream side of the ejection nozzle 31 in the rotation direction of the substrate holding portion 20. The amount of the processing liquid Lq1 on the peripheral edge of the substrate W is reduced on the upstream side relative to the ejection nozzle 31 compared to the downstream side in the rotation direction. The reason is that the processing liquid Lq1 will fly outward from the periphery of the substrate W as the substrate W rotates. Therefore, if the camera 70 is located on the upstream side relative to the ejection nozzle 31, the processing liquid Lq1 is not easy to adhere to the camera 70, or the vaporized components of the processing liquid Lq1 are not easy to affect the camera 70. That is, from the viewpoint of protecting the camera 70, it is appropriate that the camera 70 is located on the upstream side relative to the ejection nozzle 31.

[0171] However, when the ejection nozzle 31 ejects the processing liquid Lq1, the processing cup 40 is in an ascended state. The reason for this is that the processing cup 40 is used to receive the processing liquid Lq1 scattered from the periphery of the substrate W. In the above state, the front end (ejection port) of the ejection nozzle 31 is located at a lower position than the upper end position of the processing cup 40. For example, the vertical distance between the upper end position of the processing cup 40 and the upper surface of the substrate W is set to about 2 [mm] to more than ten [mm], and the distance between the ejection nozzle 31 and the substrate W is set to less than about 2 [mm] (for example, about 1 [mm]).

[0172] Here, for comparison, the case where the imaging position of the camera 70 is set to the outside of the processing cup 40 is described. For example, the imaging position is set to the side close to the ejection nozzle 31 in the space outside the processing cup 40 ( Figure 3 The upper right area in the chamber 10 is shown in FIG. 4 ). The upper end of the processing cup 40 is located at a higher position than the front end of the ejection nozzle 31, so the processing cup 40 will hinder the shooting. That is, even if the processing liquid Lq1 in a substantially columnar shape is to be photographed from a camera position further outward than the processing cup 40, the processing liquid Lq1 will be blocked by the processing cup 40. If the camera position is set to a higher position to avoid the processing cup 40, the ejection nozzle 31 will be photographed from obliquely above. Since the distance between the front end of the ejection nozzle 31 and the substrate W is narrow, if the processing liquid Lq1 in a substantially columnar shape is to be photographed from obliquely above, the processing liquid Lq1 will be blocked by the ejection nozzle 31 this time.

[0173] Therefore, it is also considered to set the imaging position to the space outside the processing cup 40 and on the opposite side of the ejection nozzle 31 with respect to the center of the substrate W ( Figure 3 Thus, it is possible to photograph the substantially columnar processing liquid Lq1 ejected from the ejection nozzle 31. However, the distance between the tip of the ejection nozzle 31 and the imaging position of the camera 70 becomes longer, so a high-resolution camera 70 or a telephoto camera 70 is required.

[0174] In contrast, in the present embodiment, the imaging position is located above the substrate W, so it is easy to bring the imaging position close to the upper surface of the substrate W in the height direction, and it is easy to make the optical axis of the camera 70 along the horizontal direction. Therefore, the camera 70 is not blocked by the processing cup 40 and the ejection nozzle 31, and can capture the substantially columnar processing liquid Lq1 ejected from the ejection nozzle 31. The angle formed by the optical axis of the camera 70 and the horizontal plane can be set to, for example, less than about ten degrees.

[0175] In addition, when looking down, the camera 70 can be brought closer to the ejection nozzle 31. Therefore, a camera with lower resolution or a camera that does not require telephoto and is cheaper can be used. Such a camera is small and suitable. Figure 4 In the example of FIG. 5 , the distance between the camera 70 and the discharge nozzle 31 is short, and therefore, only a portion of the periphery of the substrate W is included in the captured image IM1 .

[0176] Here, an example of the imaging position of the camera 70 in the height direction is described. The imaging position of the camera 70 can be set so that the lower end of the light receiving surface of the imaging element of the camera 70 is the same as or lower than the upper end position of the processing cup 40. For example, the distance between the camera 70 and the upper surface of the substrate W can be set to about 1 [mm] to 5 [mm]. In this way, the camera 70 can be brought closer to the upper surface of the substrate W, and the optical axis of the camera 70 can be further along the horizontal direction.

[0177] Alternatively, the imaging position of the camera 70 may be set so that the lower end of the housing of the camera 70 is at the same position as the upper end of the processing cup 40 or at a position lower than the upper end.

[0178] In addition, the camera holding portion 73 may support the lower surface of the camera 70 . Figure 5 70 and a camera holding portion 73. Figure 5 In FIG, a substrate W and a discharge nozzle 31 are also shown. Figure 5 In the example of , the camera holding portion 73 has: an L-shaped connecting member 731; an upper surface member 732, located on the upper surface side of the camera 70; a side member 733, located on the side surface side of the camera 70; and a lower surface member 734, located on the lower surface side of the camera 70. The connecting member 731 has a first rod-shaped member extending horizontally from the nozzle arm 621, and a second rod-shaped member extending vertically downward from the front end of the first rod-shaped member. The front end of the second rod-shaped member is connected to the upper surface member 732. Figure 5 In the example of FIG. 7 , the upper surface member 732, the side member 733, and the lower surface member 734 have a plate-like shape. The upper surface member 732 and the lower surface member 734 are arranged with their thickness directions along the vertical direction, and the side member 733 is arranged with its thickness direction along the horizontal direction. The side member 733 connects the upper surface member 732 and the lower surface member 734. The lower surface member 734 also functions as a supporting member for supporting the camera 70.

[0179] In this structure, the imaging position of the camera 70 can be set so that the lower end of the lower surface member 734 is at the same position as or lower than the upper end of the processing cup 40. In this way, the camera 70 can be brought closer to the upper surface of the substrate W, and the optical axis of the camera 70 can be further aligned in the horizontal direction.

[0180] <Lighting Department>

[0181] like Figure 3 As shown, an illumination unit 71 is provided in the chamber 10 and above the partition 15. The illumination unit 71 includes a light source such as a light emitting diode (LED). The wavelength of the light irradiated by the illumination unit 71 is not particularly limited, and for example, visible light or near infrared light may be used. Figure 3 In the example of FIG. 7 , the lighting unit 71 is arranged above the camera 70. For example, the lighting unit 71 is arranged at a position overlapping with the camera 70 when viewed from above (see FIG. 7 ). Figure 2 ). The lighting unit 71 may be held by the camera holding unit 73. For example, the lighting unit 71 may be fixed to the upper surface of the upper surface member 732 of the camera holding unit 73. Usually, the chamber 10 is a dark room, so the lighting unit 71 irradiates light to the imaging area when the camera 70 is shooting.

[0182] <Control Department>

[0183] The control unit 9 controls various components of the substrate processing apparatus 100 and performs processing on the substrate W. In addition, the control unit 9 performs image processing on the camera image IM1 obtained by the camera 70. Therefore, the control unit 9 functions as an image processing unit. The camera 70 captures the front end of the ejection nozzle 31 from the camera position above the substrate W, so the camera image IM1 obtained by the camera 70 appropriately includes the roughly liquid column-shaped processing liquid Lq1 ejected from the ejection nozzle 31. The control unit 9 monitors the ejection state of the processing liquid Lq1 ejected from the ejection nozzle 31 by performing image processing on the camera image IM1 (slope monitoring). An example of the monitoring process will be described in detail later.

[0184] The hardware structure of the control unit 9 is the same as that of a general computer. That is, the control unit 9 is composed of the following components, etc.: a central processing unit (CPU) for performing various calculations; a read-only memory (ROM) for storing basic programs; a random access memory (RAM) for storing various information that can be read and written; and a disk for storing control software or data, etc. The CPU of the control unit 9 executes a prescribed processing program, and each operating mechanism of the substrate processing device 100 is controlled by the control unit 9, thereby performing processing of the substrate processing device 100. In addition, the central processing unit of the control unit 9 executes a prescribed processing program to perform image processing. Furthermore, part or all of the functions of the control unit 9 can also be implemented by dedicated hardware.

[0185] <Notification Department>

[0186] The notification unit 93 is, for example, a sound output unit (e.g., a speaker or a buzzer) or a display. The notification unit 93 can make various notifications to the operator. For example, the sound output unit outputs a notification sound (sound), or the display displays notification information, thereby making various notifications to the operator. The notification of the notification unit 93 is controlled by the control unit 9.

[0187] <Operation of the control unit>

[0188] Figure 6 1 is a flowchart showing an example of substrate processing. First, in step S1, the main transfer robot 103 transfers the substrate W onto the substrate holding unit 20. The substrate holding unit 20 holds the transferred substrate W.

[0189] Next, in step S2, the control unit 9 controls the moving mechanism 33 to move the discharge nozzle 31 to the processing position, and controls the moving mechanism 63 to move the camera 70 to the imaging position. Next, in step S3, the control unit 9 controls the lifting mechanism 44 to raise the processing cup 40, and controls the rotating motor 22 to rotate the rotating base 21. The rotating speed of the rotating base 21 is set to, for example, about 1000 [rpm] or more.

[0190] Next, in step S4, the control unit 9 controls the camera 70 to start imaging. The camera 70 images the imaging area at a predetermined frame rate (e.g., 60 frames / second), and sequentially outputs the acquired imaging images IM1 to the control unit 9. As described in detail later, the control unit 9 monitors the ejection state of the processing liquid Lq1 based on image processing of the imaging images IM1.

[0191] Next, in step S5, the control unit 9 starts the ejection of the processing liquid Lq1 from the ejection nozzle 31. Specifically, the control unit 9 outputs an opening signal to the on-off valve 35. The on-off valve 35 opens the pipe 34 based on the opening signal. As a result, the processing liquid Lq1 from the processing liquid supply source 37 is ejected from the ejection nozzle 31 and lands on the end of the upper surface of the substrate W. The flow rate of the processing liquid Lq1 is set to, for example, several [ml / minute] to several tens of [ml / minute]. The flow rate is less than the flow rate of the processing liquid when the entire surface of the substrate W is processed (for example, the flow rate of the processing liquid ejected from the ejection nozzle 66 of the processing liquid supply unit 65).

[0192] By rotating the substrate W while spraying the processing liquid Lq1 to the end of the substrate W, the processing liquid Lq1 acts on the entire area of ​​the peripheral end of the substrate W. The processing liquid Lq1 can be used to remove useless objects attached to the peripheral end of the substrate W (bevel processing). The processing liquid Lq1 corresponding to the type of useless objects (for example, films) can be sprayed out from the spray outlets of the three spray nozzles 31 in sequence. Furthermore, the processing liquid can be sprayed out synchronously from at least two spray outlets of the three spray nozzles 31.

[0193] In the above-mentioned slope treatment, the flow rate of the processing liquid Lq1 is small, so the processing liquid Lq1 is easily affected by the airflow accompanying the rotation of the substrate W, and further, liquid splashing caused by the processing liquid Lq1 rebounding on the upper surface of the substrate W is easily generated.

[0194] Therefore, the control unit 9 monitors the discharge state of the processing liquid Lq1 in the monitoring process. The specific operation of the monitoring process will be described in detail later.

[0195] When the end condition of the inclined surface treatment is satisfied, the control unit 9 stops the discharge of the treatment liquid Lq1 from the discharge nozzle 31 in step S6. The end condition of the inclined surface treatment does not need to be particularly limited, and for example, a condition that the time elapsed since step S5 reaches a predetermined time may be adopted. In response to the satisfaction of the end condition, the control unit 9 outputs a closing signal to the on-off valve 35. The on-off valve 35 performs a closing action based on the closing signal to close the pipe 34. Thus, the discharge of the treatment liquid Lq1 is terminated. Furthermore, when a suction valve 36 is provided, the control unit 9 outputs a suction signal to the suction valve 36.

[0196] After the ejection of the processing liquid Lq1 stops, a process of drying the substrate W may be appropriately performed. Next, in step S7, the control unit 9 causes the camera 70 to stop photographing. That is, the monitoring process is terminated. Next, in step S8, the control unit 9 controls the rotation motor 22 to stop the rotation of the rotation base 21, and controls the lifting mechanism 44 to lower the processing cup 40. Next, in step S9, the control unit 9 controls the moving mechanism 33 and the moving mechanism 63 respectively, so that the ejection nozzle 31 and the camera 70 move to their respective standby positions.

[0197] Figure 7 This is a flowchart showing an example of the execution of the monitoring process. Figure 7 The processing flow shown is executed, for example, every time the captured image IM1 is input to the control unit 9. First, in step S11, the control unit 9 specifies a discharge determination region R2 described below in the captured image IM1.

[0198] Figure 8 IM1 is a diagram schematically showing an example of an enlarged view of the captured image IM1. Figure 8 In the example of , there is shown an enlarged view of an area R1 near the front end of a discharge nozzle 31. The discharge determination area R2 is an area directly below the discharge nozzle 31 in the camera image IM1, and is an area containing a portion of the roughly liquid column-shaped processing liquid Lq1 discharged from the discharge nozzle 31. The discharge determination area R2 is set at a position away from the discharge nozzle 31 in the camera image IM1. In addition, the discharge determination area R2 has a long strip shape that is long in the horizontal direction. That is, the longitudinal width of the discharge determination area R2 is narrower than its lateral width. More specifically, the lateral width of the discharge determination area R2 is wider than the liquid column width of the processing liquid Lq1 discharged from the discharge nozzle 31, for example, it is set to more than 3 times the normal liquid column width. The lateral position of the discharge determination area R2 is set in such a way that both ends of the processing liquid Lq1 in the width direction are included in the discharge determination area R2. The longitudinal width of the discharge determination area R2 is appropriately set, for example, the width may also be a width equivalent to several pixels.

[0199] The ejection determination region R2 in the captured image IM1 may be preset relative to the ejection nozzle 31. That is, the relative positional relationship between the ejection nozzle 31 and the ejection determination region R2 may be preset. Information indicating the positional relationship may be stored in a storage medium of the control unit 9.

[0200] In addition, the relative position of the camera 70 with respect to the ejection nozzle 31 can be changed according to the accuracy of the moving mechanism 33 and the moving mechanism 63, so the position of the ejection nozzle 31 in the camera image IM1 can also be changed. Therefore, the control unit 9 can determine the position of the ejection nozzle 31 in the camera image IM1, and determine the ejection determination area R2 in a predetermined positional relationship with respect to the determined ejection nozzle 31. In order to determine the position of the ejection nozzle 31 in the camera image IM1, a reference image including the appearance of the front end of the ejection nozzle 31 is also stored in advance in the storage medium of the control unit 9. The control unit 9 determines the position of the ejection nozzle 31 in the camera image IM1 by pattern matching based on the reference image, and determines the ejection determination area R2 based on a predetermined relative positional relationship with respect to the determined ejection nozzle 31. Therefore, even if the position of the ejection nozzle 31 changes in the camera image IM1, the ejection determination area R2 can be appropriately determined corresponding to the position of the ejection nozzle 31.

[0201] When the treatment liquid Lq1 is discharged from the discharge nozzle 31, a portion of the treatment liquid Lq1 in the substantially columnar shape is included in the discharge determination area R2. The light irradiated by the illumination unit 71 is reflected by the treatment liquid Lq1 and received by the camera 70, so the brightness value of the pixel reflecting the treatment liquid Lq1 is higher than the brightness values ​​of other pixels. Furthermore, in the case where the camera 70 is a grayscale monochrome camera, it can be said that the pixel value of the pixel represents the brightness value. Here, as an example, it is assumed that the camera 70 is a monochrome camera.

[0202] Fig. 9 : is a graph showing an example of the brightness values ​​(here, pixel values) of the pixels in the ejection determination area R2. The horizontal axis shows the pixel numbers of the pixels arranged in a row in the horizontal direction in the ejection determination area R2, and the vertical axis shows the pixel values ​​of the pixels arranged in a row in the horizontal direction in the ejection determination area R2. Fig. 9 As shown in the example, the brightness of the portion corresponding to the liquid column of the processing liquid Lq1 is higher than that of the surrounding portion. That is, the brightness distribution has a characteristic caused by the shape of the liquid column of the processing liquid Lq1.

[0203] Back to Figure 7 Then, in step S12, the control unit 9 calculates the statistic A1 of the pixel values ​​of the pixels in the determined ejection determination area R2. The statistic A1 is a quantity that reflects the ejection state of the processing liquid Lq1. As the statistic A1, for example, the variance (for example, standard deviation) of the pixel values ​​in the ejection determination area R2 may also be used. The reason for this is that due to the ejection of the processing liquid Lq1, the pixel values ​​of a part of the pixels in the ejection determination area R2 (the pixels corresponding to the processing liquid Lq1) increase (refer to Fig. 9), the variance increases compared to the case where the processing liquid Lq1 is not ejected. That is, the variance can be said to be a value reflecting the presence or absence of ejection of the processing liquid Lq1.

[0204] The above-mentioned variance is also a value reflecting the presence or absence of liquid splash caused by the processing liquid Lq1 ejected from the ejection nozzle 31 bouncing off the upper surface of the substrate W. The reason for this will be described below. Fig.10 IM1 is a diagram schematically showing an example of a captured image IM1 when liquid splash occurs. Fig.10 As shown in the example, if liquid splash occurs, the area occupied by the processing liquid Lq1 in the ejection determination area R2 is expanded. That is, in the ejection determination area R2, the liquid splash portion is included next to the liquid column portion of the processing liquid Lq1, and the area occupied by the processing liquid Lq1 is expanded as a whole. In the liquid splash portion of the processing liquid Lq1, the distribution deviation of the brightness value becomes larger than that of the liquid column portion, and therefore, as a result, the variance of the pixel value in the ejection determination area R2 is further increased.

[0205] Fig.11 : is a graph showing an example of the time variation of the statistic A1. The horizontal axis represents time. As a parameter representing the time, for example, the frame number in the camera image IM1 can be used. The vertical axis represents the statistic A1. Here, the standard deviation is used as the statistic A1. Fig.11 In FIG. 1 , three graphs G1 to G3 are shown, each of which has a different ejection time of the processing liquid Lq1. Fig.11 In the example, the discharge time of the graph G1 is the longest, and the discharge time of the graph G3 is the shortest. In addition, the graphs G1 to G3 respectively represent the graphs when the flow rate of the processing liquid Lq1 is 18 [ml / min], 12 [ml / min], and 8 [ml / min].

[0206] Graphs G1 and G2 represent the time variation of the statistic A1 when the treatment liquid Lq1 is properly ejected. Graph G3 represents the time variation of the statistic A1 when liquid splashing occurs immediately after the ejection of the treatment liquid Lq1 begins. When the ejection nozzle 31 does not eject the treatment liquid Lq1, the statistic A1 is less than the threshold value Aref1. If the ejection nozzle 31 ejects the treatment liquid Lq1, the statistic A1 increases in accordance with the ejection and exceeds the threshold value Aref1. When the ejection nozzle 31 ejects the treatment liquid Lq1 normally, the statistic A1 is less than the threshold value Aref2. The threshold value Aref2 is greater than the threshold value Aref1. The threshold values ​​Aref1 and Aref2 can be pre-set by simulation or experiment, and can be stored in the storage medium of the control unit 9, for example.

[0207] On the other hand, if liquid splash occurs, the statistic A1 exceeds the threshold value Aref2. Fig.11In the example of FIG. 1 , liquid splashing occurs immediately after the treatment liquid Lq1 with the lowest flow rate is ejected (see graph G3 ). This can be considered as follows. That is, the reason can be considered to be that the treatment liquid Lq1 with a low flow rate is easily affected by the airflow accompanying the rotation of the substrate W, and the flow of the treatment liquid Lq1 is unstable immediately after the treatment liquid Lq1 is ejected.

[0208] exist Fig.11 In the example of , the statistic A1 increases significantly in response to the splash of the liquid. This is considered to be due to the following reasons.

[0209] That is, in the inclined surface processing, the flow rate of the processing liquid Lq1 is small, and the liquid column of the processing liquid Lq1 is thin, so the ratio of the area occupied by the liquid splashing part to the area occupied by the liquid column part in the ejection determination area R2 is relatively large. That is, in the inclined surface processing, the liquid splashing part with a large deviation in brightness distribution occupies a relatively large part of the ejection determination area R2.

[0210] For comparison, the processing liquid supply unit 65 will be described. In the processing liquid supply unit 65, the flow rate of the processing liquid ejected from the ejection nozzle 66 is large, so the liquid column of the processing liquid is thick. Therefore, even if liquid splashes, the proportion of the liquid splash portion relative to the liquid column portion in the ejection determination area will not increase as in the inclined surface treatment.

[0211] Moreover, in the processing liquid supply section 65, the interval between the ejection nozzle 66 and the substrate W is set to be wide. The reason for this is that the flow rate is large. In the above case, in order to capture the ejection state of the processing liquid Lq1 in a wider range, the ejection determination area is set in a manner that is longer in the vertical direction than in the horizontal direction. Moreover, in the case where the camera shoots the front end of the ejection nozzle 66 from a direction close to the horizontal, the width of the liquid splashing part of the processing liquid Lq1 in the vertical direction in the camera image IM1 appears to be relatively narrow. Therefore, the liquid splashing part of the processing liquid Lq1 only exists in the lower part of the ejection determination area. In the above case, in the ejection determination area, the proportion of the liquid splashing part is not that large relative to the liquid column part.

[0212] In contrast, in the inclined surface processing, the distance between the tip of the ejection nozzle 31 and the upper end of the substrate W is narrow, and the ejection determination area R2 is set to be long in the horizontal direction. Therefore, the liquid splashing portion of the processing liquid Lq1 may exist from one end to the other end of the ejection determination area R2 in the vertical direction of the captured image IM1 (see also FIG. Fig.10 ).

[0213] As described above, by setting the ejection determination area R2 that is long in the horizontal direction in the bevel processing, when liquid splashing occurs, the proportion of the liquid splashing portion in the ejection determination area R2 is greatly increased. Therefore, by generating liquid splashing, the variance in the ejection determination area R2 is greatly increased. That is, it is precisely because the ejection determination area R2 that is long in the horizontal direction is set in the bevel processing that the variance easily reflects whether there is liquid splashing.

[0214] Reference Figure 7 Then, in step S13, the control unit 9 determines whether the statistic A1 is greater than the threshold value Aref1. When the statistic A1 is less than the threshold value Aref1, in step S14, the control unit 9 determines that the ejection state is the ejection stop state and ends the process. That is, the control unit 9 determines that the processing liquid Lq1 is not ejected and ends the process.

[0215] When the statistic A1 is greater than or equal to the threshold value Aref1, the control unit 9 determines in step S15 whether the statistic A1 is less than the threshold value Aref2. When the statistic A1 is less than the threshold value Aref2, the control unit 9 determines in step S16 that the discharge state is a normal discharge state and ends the process. That is, the control unit 9 determines that the treatment liquid Lq1 is discharged normally and ends the process.

[0216] When the statistic A1 is greater than the threshold value Aref2, in step S17, the control unit 9 determines that the ejection state is a liquid splashing state and terminates the process. That is, the control unit 9 determines that liquid splashing occurs and terminates the process. When it is determined that liquid splashing occurs, the control unit 9 can cause the notification unit 93 to notify that liquid splashing occurs. Accordingly, the operator can be aware that liquid splashing occurs.

[0217] As described above, the processing unit 1 can appropriately determine the discharge state (discharge and splash) of the processing liquid Lq1 during the slope processing. Furthermore, the statistic A1 used for discharge can be used to determine splash, so the calculation process is simple.

[0218] Furthermore, in the above example, although variance is used as the statistic A1, it is not necessarily limited to this. As the statistic A1, the sum (or average value, the same below) of the pixel values ​​of the pixels in the ejection determination area R2 may be used. The reason for this is that in the ejection determination area R2, the pixel value of the pixel corresponding to the processing liquid Lq1 is higher than the pixel value of other pixels (see also Fig. 9 ). That is, the sum increases due to the ejection of the processing liquid Lq1. In other words, the sum is a value reflecting the presence or absence of the ejection of the processing liquid Lq1.

[0219] The above sum is also a value reflecting whether there is liquid splashing. The reason is explained below. Fig.10As shown in the example, when liquid splash occurs, the area occupied by the processing liquid Lq1 in the discharge determination area R2 increases. That is, the number of pixels with high brightness values ​​in the discharge determination area R2 increases further, and the total pixel value in the discharge determination area R2 increases further.

[0220] The change tendency of the sum corresponding to the presence or absence of the ejection and the presence or absence of the liquid splashing and Fig.11 Therefore, the sum can be used as the statistic A1.

[0221] Furthermore, it can be considered that the reason why the sum is greatly increased by the presence or absence of liquid splashing is that, similar to the variance, a laterally long ejection determination area R2 is set in the bevel processing. That is, in the laterally long ejection determination area R2 in the bevel processing, the proportion of the liquid splashing part is large relative to the liquid column part. Therefore, the sum of the pixel values ​​in the ejection determination area R2 is greatly increased compared to the case where the processing liquid Lq1 is normally ejected. That is, in the bevel processing, the sum easily reflects the presence or absence of liquid splashing of the processing liquid Lq1.

[0222] <Liquid splash judgment area>

[0223] In the example, the presence or absence of liquid splash is determined based on the pixel values ​​of the pixels within the ejection determination area R2. However, a liquid splash determination area R3 different from the ejection determination area R2 may also be set. Similar to the ejection determination area R2, the liquid splash determination area R3 is pre-set corresponding to the position of the ejection nozzle 31 in the camera image IM1. That is, the relative position of the ejection nozzle 31 in the camera image IM1 and the liquid splash determination area R3 is pre-set. The information representing the relative position is stored in a storage medium of, for example, the control unit 9.

[0224] exist Figure 8 and Fig.10 In the example, the liquid splash determination area R3 is set away from the ejection determination area R2 in the camera image IM1. More specifically, the liquid splash determination area R3 is set on the downstream side of the rotation direction relative to the ejection determination area R2. In other words, the liquid splash determination area R3 is not set on the upstream side of the rotation direction relative to the ejection determination area R2. The above situation is based on the following reasons. That is, in the inclined surface processing, the processing liquid Lq1 is easily affected by the airflow accompanying the rotation of the substrate W, so the liquid splash is mainly generated on the downstream side of the rotation direction relative to the landing position of the processing liquid Lq1. Therefore, the liquid splash determination area R3 is set in an area where liquid splash is likely to occur, and the liquid splash determination area R3 is not set in an area where liquid splash is not likely to occur.

[0225] exist Figure 8 and Fig.10 In the example of FIG. 1 , the liquid splash determination region R3 has a rectangular shape, and its width in the lateral direction is narrower than that in the ejection determination region R2, and its width in the longitudinal direction is wider than that in the ejection determination region R2. Thus, the liquid splash can be more effectively contained in the liquid splash determination region R3.

[0226] When liquid splashing does not occur, the liquid splashing determination area R3 includes only the upper surface of the substrate W, so the pixel values ​​of the pixels in the liquid splashing determination area R3 are small, and the distribution deviation of the pixel values ​​is also small. In contrast, when liquid splashing occurs, the liquid splashing portion of the processing liquid Lq1 is included in the liquid splashing determination area R3, so the pixel values ​​of the pixels corresponding to the liquid splashing portion increase.

[0227] Therefore, the control unit 9 calculates the statistic B1 based on the pixel values ​​of the pixels in the liquid splash determination area R3. The statistic B1 is a quantity reflecting the presence or absence of liquid splash, for example, the sum or dispersion of the pixel values ​​in the liquid splash determination area R3. Similar to the statistic A1, the statistic B1 increases due to the occurrence of liquid splash.

[0228] Fig.12 This is a flowchart showing an example of monitoring processing. Fig.12 The processing flow shown is executed, for example, each time the camera image IM1 is input to the control unit 9. First, in step S21, the control unit 9 determines the liquid splash determination area R3 in the camera image IM1. Specifically, the control unit 9 determines the position of the ejection nozzle 31 in the camera image IM1 by pattern matching based on the reference image, and determines the liquid splash determination area R3 based on a predetermined relative position relationship relative to the determined ejection nozzle 31. Thus, even if the position of the ejection nozzle 31 changes in the camera image IM1, the liquid splash determination area R3 can be appropriately determined corresponding to the position of the ejection nozzle 31.

[0229] Next, in step S22, the control unit 9 calculates the statistic B1 of the pixel values ​​of the pixels in the liquid splash determination area R3. Next, in step S23, the control unit 9 determines whether the statistic B1 is greater than a threshold value Bref1. The threshold value Bref1 can be pre-set by, for example, simulation or experiment, and stored in the storage medium of the control unit 9.

[0230] When the statistic B1 is equal to or greater than the threshold value Bref1, the control unit 9 determines in step S24 that the discharge state is the liquid splashing state and terminates the process. That is, the control unit 9 determines that the liquid splashing occurs and terminates the process.

[0231] On the other hand, when the statistic B1 is smaller than the threshold value Bref1, the control unit 9 does not execute step S24 and ends the process.

[0232] As described above, the control unit 9 can appropriately determine the presence or absence of liquid splash based on the pixel values ​​in the liquid splash determination area R3.

[0233] In the above example, the splash determination region R3 is not set upstream of the ejection determination region R2 in the rotation direction. Therefore, the calculation process related to the splash determination region R3 is not performed, so the processing load can be reduced.

[0234] Furthermore, in the above example, the variance of the pixel values ​​of all pixels in the ejection determination area R2 is used as the variance of the statistic A1. However, the pixel values ​​of the pixels arranged vertically may be integrated by column, and the variance of the multiple integrated values ​​of the multiple columns may be used. The same is true for the statistic B1.

[0235] <Securing the camera>

[0236] In the above example, the camera 70 is fixed to the fixing member 62 similarly to the discharge nozzle 61. That is, the fixing member 62 serves as both a mechanism for moving the camera 70 and a mechanism for moving the discharge nozzle 61. Therefore, the manufacturing cost and size can be reduced compared to the case where dedicated mechanisms are provided separately.

[0237] Fig.13 1 is a plan view schematically showing an example of the structure of the processing unit 1A. The processing unit 1A includes the same structure as the processing unit 1 except for the fixing object of the camera 70. In the processing unit 1A, the camera 70 is fixed to the fixing member 32 in the same manner as the ejection nozzle 31 that is the object of imaging. More specifically, the camera holding portion 73 is connected to the nozzle arm 321 on the side of the nozzle arm 321. The camera holding portion 73 holds the camera 70. The camera 70 is fixed to the fixing member 32 via the camera holding portion 73. The camera 70 and the camera holding portion 73 are arranged on the counterclockwise side relative to the nozzle arm 321 (that is, from the standby position of the ejection nozzle 31 to the side of the processing position). In addition, the camera 70 is held by the camera holding portion 73 in a posture that allows the front end of the ejection nozzle 31 and the processing liquid Lq1 ejected from the ejection nozzle 31 to be photographed.

[0238] The moving mechanism 33 can move the ejection nozzle 31 and the camera 70 to the processing position and the imaging position respectively while maintaining the positional relationship between the ejection nozzle 31 and the camera 70 by rotating the nozzle base 322. The positional relationship between the imaging position of the camera 70 and the processing position of the ejection nozzle 31 is the same as that of the processing unit 1.

[0239] With the processing unit 1A, as with the processing unit 1 , the camera 70 can appropriately capture an image of the substantially columnar processing liquid Lq1 ejected from the ejection nozzle 31 .

[0240] In addition, the camera 70 is fixed to the same fixing member 32 as the ejection nozzle 31, so the camera 70 can be positioned with high precision relative to the ejection nozzle 31. That is, in the processing unit 1, the ejection nozzle 31 and the camera 70 are fixed to the nozzle arms 321 and 621 which are different from each other. Therefore, in view of the accuracy of the moving mechanism 33 and the moving mechanism 63, it is necessary to set a relatively wide margin between the camera 70 and the nozzle arm 321. In contrast, in the processing unit 1A, the ejection nozzle 31 and the camera 70 are fixed to the same nozzle arm 321, so the margin between the camera 70 and the nozzle arm 321 can be set to be narrower. That is, the camera 70 can be brought closer to the nozzle arm 321. According to this, the camera 70 can shoot the ejection nozzle 31 from a direction closer to the circumferential direction. Therefore, it is easy to determine the radial ejection position of the processing liquid Lq1 in the captured image IM1.

[0241] <Camera protection>

[0242] When the processing liquid Lq1 contains hydrofluoric acid, the lower surface of the frame of the camera 70 or the lower end surface of the lower surface member 734 of the camera holding portion 73 may be formed of a chemically resistant material. In short, a protective member 74 for protecting the camera 70 may be provided on the lower surface side of the camera 70. As the protective member 74, a fluororesin such as polytetrafluoroethylene or a chemically resistant resin such as vinyl chloride resin or a metal such as stainless steel which has high chemical resistance to hydrofluoric acid may be used.

[0243] According to this, it is possible to reduce the possibility that the camera 70 located above the substrate W is corroded by the vaporized components of the processing liquid Lq1. Therefore, the reliability of the camera 70 can be improved.

[0244] <Discharge determination area R2>

[0245] Fig.14 IM1 is a diagram schematically showing another example of the region R1 of the captured image IM1. Fig.14 In the camera image IM1 illustrated in FIG. 1 , the ejection nozzle 31 is included in the upper surface of the substrate W. This is because the light from the illumination unit 71 is reflected by the ejection nozzle 31, and then specularly reflected on the upper surface of the substrate W, and received by the light receiving surface of the camera 70. That is, the upper surface of the substrate W functions as a mirror, and the appearance of the ejection nozzle 31 is reflected on the upper surface.

[0246] In such a captured image IM1, the ejection determination area R2 can be set so as to include a portion of the substantially liquid column-shaped processing liquid Lq1 (liquid column portion) projected on the upper surface of the substrate W. That is, in the captured image IM1, the ejection determination area R2 can be set so as to cross the substantially liquid column-shaped processing liquid Lq1 projected on the upper surface of the substrate W.

[0247] The control section 9 can determine the liquid column width and the discharge position of the processing liquid Lq1 in the discharge determination area R2 by performing the same image processing as the above-mentioned image processing.

[0248] Furthermore, in the present embodiment, the optical axis of the camera 70 is further along the horizontal direction, so that in the captured image IM1, the length of the processing liquid Lq1 reflected on the upper surface of the substrate W in the longitudinal direction is longer than the length of the processing liquid Lq1 between the discharge nozzle 31 and the substrate W. Accordingly, it is easy to set the discharge determination area R2 so as to cross the processing liquid Lq1. In addition, the width of the discharge determination area R2 in the longitudinal direction can be set wider.

[0249] In addition, various patterns such as metal patterns, semiconductor patterns, insulating layer patterns, and resist patterns may be formed on the upper surface of the substrate W. Therefore, the processing liquid Lq1 reflected on the upper surface of the substrate W is affected by these patterns. As a result, the outline of the processing liquid Lq1 is blurred.

[0250] Therefore, the exposure time of the camera 70 can be set to be longer than the rotation time required for one rotation of the substrate W. As a result, the pattern of the substrate W in the camera image IM1 is averaged and made uniform, so that the outline of the processing liquid Lq1 in the camera image IM1 can be made conspicuous. As a result, the accuracy of determining the positions of both ends of the processing liquid Lq1 can be improved, and further, the liquid column width and the ejection position can be obtained with higher accuracy.

[0251] Alternatively, the exposure time may be shorter than the rotation time. The control unit 9 may integrate or average a plurality of camera images IM1 captured within a predetermined time longer than the rotation time, and generate a processed image according to the predetermined time. In the processed image according to the predetermined time, the pattern on the upper surface of the substrate W is averaged and unified, so that the outline of the processing liquid Lq1 can be made conspicuous.

[0252] In the above example, the ejection determination region R2 is described, but the same is true for the liquid splash determination region R3.

[0253] <Position of the ejection nozzle 31>

[0254] The processing position of the discharge nozzle 31 may be controlled based on the captured image IM1. This will be described in detail below.

[0255] The processing position of the discharge nozzle 31 is a position away from the periphery of the substrate W by a predetermined width. Therefore, the control unit 9 determines the position of the periphery of the substrate W in the captured image IM1 (hereinafter referred to as the substrate periphery position). First, the control unit 9 determines the peripheral region R4 described below in the captured image IM1.

[0256] The peripheral region R4 is a region including a portion of the peripheral edge of the substrate W in the captured image IM1. Figure 8 In the example of , the peripheral region R4 has a rectangular shape. The position of the peripheral region R4 is pre-set corresponding to the position of the ejection nozzle 31, similarly to the ejection determination region R2. That is, the relative positional relationship between the ejection nozzle 31 and the peripheral region R4 is pre-set. Information indicating the positional relationship may be stored in a storage medium of the control unit 9.

[0257] The control unit 9 determines the position of the ejection nozzle 31 in the captured image IM1 by pattern matching, and determines the peripheral region R4 based on the determined position of the ejection nozzle 31. Furthermore, the control unit 9 determines the substrate peripheral position of the substrate W in the peripheral region R4. For example, the control unit 9 determines the periphery of the substrate W based on image processing such as edge detection processing. Thus, the substrate peripheral position of the substrate W based on the position of the ejection nozzle 31 can be determined.

[0258] The control unit 9 may also determine the processing position of the ejection nozzle 31 based on the substrate peripheral position. For example, a camera image IM1 is acquired in advance when the ejection nozzle 31 stops at the correct processing position, the substrate peripheral position in the peripheral region R4 is obtained in advance from the camera image IM1, and the substrate peripheral position is stored in advance in the storage medium of the control unit 9 as a reference position.

[0259] The control unit 9 compares the determined substrate peripheral position with the reference position, and adjusts the position of the ejection nozzle 31 to reduce the difference between the substrate peripheral position and the reference position. For example, when the substrate peripheral position deviates further to the left than the reference position in the camera image IM1, the control unit 9 controls the moving mechanism 33 to move the ejection nozzle 31 toward the center of the substrate W. When the substrate peripheral position deviates further to the right than the reference position, the control unit 9 controls the moving mechanism 33 to move the ejection nozzle 31 toward the peripheral side of the substrate W. Thus, the ejection nozzle 31 can be moved to a position closer to the center of the substrate W by a predetermined width than the substrate peripheral position.

[0260] <Image pickup optical system>

[0261] Fig.151 is a diagram schematically showing an example of the structure of the processing unit 1B. The processing unit 1B has the same structure as the processing unit 1 except for the imaging optical system. In the processing unit 1B, a reflection mirror 75 is provided. The reflection mirror 75 is arranged at the imaging position above the substrate W, and the camera 70 is arranged in the area other than above the substrate W. Fig.15 As shown in FIG. 1 , the camera 70 can be located above the processing cup 40 in a plan view. The reflector 75 reflects light from the imaging region toward the light receiving surface of the camera 70. Therefore, the camera 70 can capture the imaging region viewed from the imaging position above the substrate W.

[0262] like Fig.15 As shown in the example, the reflector 75 can be arranged in a movable manner. Fig.15 In the example, the reflector 75 is fixed to the fixed member 62 of the processing liquid supply part 60. As a more specific example, a reflector holding part 76 for holding the reflector 75 is provided, and the reflector holding part 76 is connected to the nozzle arm 621 of the fixed member 62. For example, the reflector holding part 76 is fixed to the front end of the nozzle arm 621 by a fastening member (for example, a screw) at its base end side, and the reflector 75 is fixed and held by a fastening member at the front end side of the reflector holding part 76. The reflector holding part 76 is formed of, for example, metal (for example, stainless steel). The moving mechanism 63 can move the reflector 75 back and forth between the imaging position above the substrate W and the standby position further outside than the processing cup 40 by rotating the nozzle base 622. The reflector 75 is moved to the imaging position by the moving mechanism 63, so that the light from the imaging area is reflected from the reflector 75 to the camera 70.

[0263] The positional relationship between the position of the reflector 75 (imaging position) and the ejection nozzle 31 when viewed from above is the same as the positional relationship between the position of the camera 70 in the processing unit 1 (imaging position) and the ejection nozzle 31. It is ideal that the imaging position is close to the substrate W. For example, the imaging position can be set in such a way that the lower end of the reflecting surface of the reflector 75 is the same as the upper end of the processing cup 40, or a position lower than the upper end. Alternatively, when the reflector holding portion 76 has a lower surface member disposed on the lower side of the reflector 75, the imaging position can be set in such a way that the lower end of the lower surface member is the same as the upper end of the processing cup 40, or a position lower than the upper end. As a result, the camera 70 can capture the imaging area viewed from the imaging position in a direction closer to the horizontal direction. That is, it is easy to make the imaging direction from the imaging position further along the horizontal direction.

[0264] According to the processing unit 1B, the camera 70 can be arranged in a region other than above the substrate W, so that the influence of the processing liquid Lq1 on the camera 70 can be reduced. For example, the possibility of the processing liquid Lq1 adhering to the camera 70 or the vaporized component of the processing liquid Lq1 adhering to the camera 70 can be reduced. Therefore, even if the processing liquid Lq1 contains hydrofluoric acid, the camera 70 is less likely to be corroded.

[0265] Furthermore, the camera 70 may be fixed in the processing unit 1B in a substantially immovable manner, or may be fixed in a movable manner.

[0266] In addition, the reflection mirror 75 does not necessarily need to be fixed to the fixing member 62 of the processing liquid supply unit 60, and can be fixed to the fixing member 32 of the processing liquid supply unit 30 in the same manner as the camera 70 of the processing unit 1A. According to this, the reflection mirror 75 can be brought closer to the nozzle arm 321, so that the imaging direction from the imaging position can be easily made further along the circumferential direction.

[0267] Machine Learning

[0268] In the above example, the control unit 9 performs image processing on the captured image IM1 to determine whether the processing liquid Lq1 is ejected or splashed. However, the control unit 9 may perform the determination using machine learning.

[0269] Fig.16 9 is a diagram schematically showing an example of the internal structure of the control unit 9. The control unit 9 includes a classifier 91 and a machine learning unit 92. The classifier 91 sequentially inputs the camera images IM1 from the camera 70. The classifier 91 classifies each input camera image IM1 according to a category related to the ejection state of the ejection nozzle 31. The category may also be called a class. As the category, a first category indicating ejection stop, a second category indicating normal ejection, and a third category indicating liquid splashing may be used.

[0270] The classifier 91 is generated by a machine learning unit 92 using a plurality of teacher data. That is, the classifier 91 can be said to be a classifier that has completed machine learning. The machine learning unit 92 uses, for example, a neighbor method, a support vector machine, a random forest, or a neural network (including deep learning) as a machine learning algorithm. The neural network automatically generates feature quantities, so the designer does not need to determine the feature vector.

[0271] The teacher data includes image data and a label indicating which category the image data is classified into. The image data is a video image taken by the camera 70 and can be generated in advance. The correct category is assigned to each image data as a label. The assignment can be performed by the operator. The machine learning unit 92 performs machine learning based on these teacher data to generate a classifier 91.

[0272] As an example, a classifier 91 for classifying frames using a proximity method is described. The classifier 91 includes a feature vector extraction unit 911, a determination unit 912, and a storage medium storing a determination database 913. Each frame of a camera image from the camera 70 is sequentially input to the feature vector extraction unit 911. The feature vector extraction unit 911 extracts a feature vector of the camera image IM1 according to a prescribed algorithm. The feature vector is a vector representing a feature quantity corresponding to the ejection state of the ejection nozzle 31. As the algorithm, a well-known algorithm can be used. The feature vector extraction unit 911 outputs the feature vector to the determination unit 912.

[0273] The judgment database 913 stores a plurality of feature vectors (hereinafter referred to as reference vectors) generated by the machine learning unit 92 based on a plurality of teacher data, and the reference vectors are classified into various categories. Specifically, the machine learning unit 92 generates a plurality of reference vectors by applying the same algorithm as the feature vector extraction unit 911 to the plurality of teacher data. Furthermore, the machine learning unit 92 assigns the label (correct category) of the teacher data to the reference vector.

[0274] The determination unit 912 classifies the camera image IM1 based on the feature vector input from the feature vector extraction unit 911 and the plurality of reference vectors stored in the determination database 913. For example, the determination unit 912 may determine the reference vector closest to the feature vector and classify the camera image IM1 into the category of the determined reference vector (nearest neighbor method). Thus, the determination unit 912 may classify the camera image input to the classifier 91 (feature vector extraction unit 911) into categories.

[0275] The control unit 9 classifies each captured image IM1 into any one of the first to third categories by the classifier 91. The classification is to determine whether the discharge state quantity of the processing liquid Lq1 is within an appropriate range. Since the classification is performed by machine learning, abnormality can be detected with high accuracy.

[0276] <For classifier input>

[0277] In the above example, the entire region of the captured image IM1 is used as input data for the classifier 91, but the present invention is not necessarily limited to this. For example, the control unit 9 may cut out an image of the ejection determination region R2 in the captured image IM1 and input the image to the classifier 91. In this case, the image representing the ejection determination region R2 is also used as learning data input to the machine learning unit 92.

[0278] According to this, the classifier 91 can perform classification without the influence of the region with low correlation with the discharge state, so the classification accuracy of the classifier 91 can be improved.

[0279] In addition, when the ejection determination area R2 has a width equivalent to two or more pixels as its width in the vertical direction, an integral value group containing the sum of the pixel values ​​arranged in a column in the vertical direction of the ejection determination area R2, i.e., the integral value, may be used as input data for the classifier 91.

[0280] <Server>

[0281] In the example, the control unit 9 provided in the substrate processing apparatus 100 generates the classifier 91 through machine learning and classifies the frame using the classifier 91. However, at least a part of the machine learning function (the classifier 91 and the machine learning unit 92) of the control unit 9 may also be provided in the server.

[0282] Although the embodiments of the substrate processing apparatus have been described above, various modifications other than the embodiments described above are possible without departing from the gist of the invention. The various embodiments and modifications described above may be combined as appropriate for implementation.

[0283] In addition, although a semiconductor substrate is used as the substrate W, the invention is not limited thereto. For example, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a magnetic disk, or a magneto-optical disk may also be used.

Claims

1. A substrate processing method, characterized in that: include: A holding step of holding the substrate on the substrate holding portion; a rotating step of rotating the substrate holding portion to rotate the substrate; A raising step of raising a cup-shaped member surrounding the outer periphery of the substrate holding portion and positioning an upper end of the cup-shaped member at an upper end position higher than an upper surface of the substrate held by the substrate holding portion; a slope processing step of spraying a processing liquid from any one of a plurality of nozzles located at a lower position than the upper end position toward an end portion of the upper surface of the substrate held by the substrate holding portion; an imaging step of causing a camera to capture an imaging area including the processing liquid ejected from the ejection outlet, thereby obtaining an imaging image including the plurality of nozzles in one image; as well as a monitoring step of determining a discharge state of the processing liquid based on the camera image, In the imaging step, the camera is arranged above the substrate held by the substrate holding portion and at an imaging position located on the center side of the substrate relative to the plurality of nozzles and on the upstream side in the rotation direction of the substrate holding portion when viewed from above. The plurality of nozzles located above the end of the upper surface of the substrate are not overlapped with each other when viewed from the imaging position, and an image is acquired in a state where the plurality of nozzles are offset from each other in a depth direction when viewed from the imaging position.

2. The substrate processing method according to claim 1, characterized in that: The imaging position is such that the height position of the lower end of the light receiving surface of the camera is the same as the upper end position of the cup-shaped member or is lower than the upper end position.

3. The substrate processing method according to claim 1 or 2, characterized in that: The monitoring process includes: Determine whether a first statistic of pixel values ​​of pixels in a spray determination area in the captured image that is located directly below the nozzle and is longer in the horizontal direction than in the vertical direction is above a first threshold value, and when the first statistic is above the first threshold value, determine that the process is that the treatment liquid is sprayed from the nozzle.

4. The substrate processing method according to claim 3, characterized in that: The monitoring process includes: A step of determining whether the first statistic is equal to or greater than a second threshold value greater than the first threshold value, and determining that liquid splashing caused by the processing liquid rebounding on the upper surface of the substrate occurs when the first statistic is equal to or greater than the second threshold value.

5. The substrate processing method according to claim 3, characterized in that: The monitoring process includes: A process for determining whether liquid splashing of the processing liquid rebounding on the upper surface of the substrate occurs based on pixel values ​​of pixels within a liquid splashing determination area, wherein the liquid splashing determination area is set on the downstream side of the rotation direction of the substrate relative to the ejection determination area in the camera image.

6. The substrate processing method according to claim 5, characterized in that: In the captured image, the liquid splash determination region is not set on the upstream side of the discharge determination region in the rotation direction of the substrate.

7. The substrate processing method according to claim 3, characterized in that: The discharge determination region is set at a position including a portion of the processing liquid reflected on the upper surface of the substrate by specular reflection in the captured image.

8. The substrate processing method according to claim 7, characterized in that: The exposure time of the camera is set to be longer than the time required for the substrate to rotate once.

9. The substrate processing method according to claim 7, wherein The first statistic is obtained based on pixel values ​​of pixels in the discharge determination area in a processed image obtained by integrating or averaging a plurality of captured images acquired by the camera over a period of time longer than a period required for the substrate to make one rotation.

10. The substrate processing method according to claim 1, characterized in that: In the monitoring process, The captured image is classified into a category representing a discharge state of the processing liquid discharged from the tip of the nozzle using a classifier that has completed machine learning.

11. The substrate processing method according to claim 10, characterized in that: In the monitoring process, A discharge determination region that is located directly below the nozzle and is longer in the horizontal direction than in the vertical direction is cut out from the captured image, and an image of the cut-out discharge determination region is input to the classifier.

12. The substrate processing method according to claim 1 or 2, characterized in that: The captured image includes a portion of the periphery of the substrate, The bevel processing step comprises: a step of obtaining a substrate peripheral edge position of a portion of the peripheral edge of the substrate based on the captured image; and The step of moving the nozzle by a predetermined width from a peripheral position of the substrate to a processing position at a center portion of the substrate.

13. A substrate processing device, characterized in that: include: a substrate holding portion that holds the substrate and rotates the substrate; a plurality of nozzles for ejecting a processing liquid from an ejection port at a processing position above an end portion of the upper surface of the substrate; a camera that captures an image of an imaging area including the processing liquid ejected from the plurality of nozzles and the ejection port located at the processing position from an imaging position located closer to the center of the substrate than the processing position in a plan view and located upstream in the rotation direction of the substrate holding portion to obtain an image; as well as an image processing unit that determines a discharge state of the processing liquid based on the captured image, When the camera captures the imaging area from the imaging position, all images of the multiple nozzles are included in the imaging image without overlapping each other, and the multiple nozzles are arranged in a manner that deviates from each other in the depth direction along the optical axis direction of the camera.

14. The substrate processing apparatus according to claim 13, wherein: Also includes: a cup-shaped member surrounding the outer periphery of the substrate holding portion; as well as The lifting mechanism lifts the cup-shaped member so that the upper end of the cup-shaped member is located at an upper end position higher than the upper surface of the substrate held by the substrate holding portion.

15. The substrate processing apparatus according to claim 14, wherein: The imaging position is such that the height position of the lower end of the light receiving surface of the camera is the same as or lower than the upper end position of the cup-shaped member raised by the lifting mechanism.

16. The substrate processing apparatus according to claim 14, wherein: Also includes: The camera moving mechanism moves the camera between a camera standby position located outside the cup-shaped member and the imaging position.

17. The substrate processing apparatus according to claim 14, wherein: Also includes: The nozzle moving mechanism moves the plurality of nozzles between a nozzle standby position located outside the cup-shaped member and the processing position.

18. The substrate processing apparatus according to claim 14, wherein: Also includes a nozzle arm, The camera and the plurality of nozzles are fixed to the nozzle arm.

Images