Research tool, bonding head and bonding method

Abstract

The invention provides a research tool, a bonding head and a bonding method. The research tool comprises a vacuum suction nozzle which comprises a cavity; the adjusting mechanism comprises a ball head ejector pin and a driving unit; the camera module is used for acquiring a circuit image of the to-be-bonded piece adsorbed by the adsorption part; the controller is configured to drive the ball head ejector pin to extrude the skin for multiple times through the driving unit so as to bend the to-be-bonded piece, and the camera module is used for collecting circuit images of the to-be-bonded piece after bending each time; analyzing each circuit image to determine the circuit size of the to-be-bonded piece after each bending; according to the control quantity of the driving unit for bending the to-be-bonded piece each time, the corresponding spherical height is determined; and fitting an influence relation curve of the spherical surface height of the adsorption part on the circuit size of the to-be-bonded piece according to the spherical surface height of the to-be-bonded piece bent each time and the circuit size corresponding to the to-be-bonded piece. According to the invention, the circuit size of the to-be-bonded part can be accurately adjusted, and the bonding efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a research tool, a bonding head, a bonding method, and a computer-readable storage medium. Background Art

[0002] There are various circuits etched on the wafer and chip. In order to ensure that the circuits can match when the two are bonded, marks are usually engraved on the blank areas of the wafer and chip, and then the position of the circuit is fed back through the marks. Therefore, when bonding, you only need to identify the position of the marks on the two to know the position of the chip and the position of the chip on the wafer to ensure that the circuits can match completely.

[0003] In the hybrid bonding process of chips to wafer, the source of bonding force is mainly van der Waals force. In order to prevent bubbles from being generated during chip bonding, a nozzle structure with a spherical nozzle surface is required. When bonding the chip to the wafer, the spherical nozzle structure allows the chip to be bonded to contact the wafer at one point first, and then the van der Waals force diffuses the bonding wave to complete the bonding.

[0004] Due to the influence of the front-end photolithography process, the distance between the patterns on the wafer is easily affected and becomes different, that is, the circuit size on the wafer will be slightly different. This will cause the mark on the chip in the original state to not completely correspond to the mark on the wafer when the chip is bonded, thus affecting the bonding. In this regard, the prior art uses a bonding head to deform the chip to a certain extent before bonding to compensate for the error caused by photolithography so that the marks on the chip and the wafer can correspond.

[0005] However, the suction nozzle of the currently used bonding head is of a fixed height, so it is necessary to replace multiple bonding heads with different suction nozzle heights on the equipment each time to verify the deformation of the circuit size on the chip matching a certain wafer. This method is not only cumbersome, but also unable to quickly and accurately adjust the circuit size of the chip to be bonded to the target size to completely and accurately correspond to the circuit on the wafer. Moreover, the bonding head processing cycle in the prior art is long, the processing is complex, and the cost is high. At the same time, due to processing errors, it is also possible that the bonding head cannot be processed to the required specific size, and variable control is difficult.

[0006] In order to solve the above problems existing in the prior art, the art urgently needs to develop a tooling technology that can quickly and accurately adjust the circuit size of the component to be bonded to the target size, thereby reducing the adjustment time and improving the bonding efficiency. Summary of the invention

[0007] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0008] In order to overcome the above-mentioned defects of the prior art, the present invention provides a research tool, a bonding head, a bonding method, and a computer-readable storage medium, which can quickly and accurately adjust the circuit size of the to-be-bonded component to the target size, thereby reducing the adjustment time and improving the bonding efficiency.

[0009] Specifically, the above-mentioned research tooling provided according to the first aspect of the present invention is used to study the influence of the spherical height of the suction nozzle on the bonding part, including: a vacuum suction nozzle, including a cavity, wherein one end of the cavity is connected to the vacuum mechanism, and the other end thereof squeezes a skin with holes to form a deformable adsorption part; an adjustment mechanism, including a ball head ejector and a driving unit, wherein one end of the ball head ejector is connected to the driving unit, and the ball head at the other end thereof passes through the cavity to squeeze the skin and adjust the spherical height of the adsorption part; a camera module, used to collect a circuit image of the bonding part adsorbed by the adsorption part; and The controller is configured to: drive the ball head ejector pin to squeeze the skin multiple times via the driving unit to bend the part to be bonded, and collect the circuit image of the part to be bonded after each bending via the camera module; analyze each circuit image to determine the circuit size of the part to be bonded after each bending; determine the corresponding spherical height according to the control amount of the part to be bonded by the driving unit each time; and fit the influence relationship curve of the spherical height of the adsorption portion on the circuit size of the part to be bonded according to the spherical height of the part to be bonded each time and the circuit size corresponding to the part to be bonded.

[0010] Furthermore, in some embodiments of the present invention, the driving unit includes a micrometer head, wherein the controller is connected to the micrometer head to obtain the control amount of the driving unit bending the bonded part each time, and determines the spherical height corresponding to each control amount in combination with the original installation position of the micrometer head, the length of the micrometer head, the length of the ball head pin, and the length of the cavity.

[0011] Furthermore, in some embodiments of the present invention, the vacuum nozzle is composed of a base, a nozzle body and the perforated skin, wherein the nozzle body has a hollow portion extending along its axial direction, one end of which is assembled with the base to form the cavity, the base is provided with a through hole aligned with the position of the hollow portion, a sealing ring is provided in the through hole, the micrometer head extends into the cavity through the through hole with the sealing ring to connect one end of the ball head ejector pin, and the skin is fixed to the other end of the hollow portion, and it becomes a convex spherical shape under the extrusion of the ball head.

[0012] Furthermore, in some embodiments of the present invention, the research tooling comprises a plurality of the skins, wherein the plurality of adsorption holes of each skin have a distribution range of different sizes and correspond to at least one size of a part to be bonded, and each of the skins is selectively fixed to the other end of the hollow portion to adsorb parts to be bonded of corresponding sizes.

[0013] Furthermore, in some embodiments of the present invention, the controller is further configured to: bend parts to be bonded of various sizes respectively to determine the circuit size of each part to be bonded after each bending, and determine the spherical height of each part to be bonded when the adsorption portion bends each time; and fit the influence relationship curve of the spherical height of the adsorption portion on the circuit size of each part to be bonded according to the spherical height of each part to be bonded when each bending and the circuit size corresponding to each part to be bonded.

[0014] In addition, the above-mentioned bonding head provided according to the second aspect of the present invention includes: a vacuum suction nozzle, a cavity is provided inside thereof, wherein one end of the cavity is connected to the vacuum mechanism, and the other end thereof is aligned with a skin with a hole to form a deformable adsorption portion; an adjustment mechanism, including a ball head ejector and a driving unit, wherein one end of the ball head ejector is connected to the driving unit, and the ball head at the other end thereof passes through the cavity to squeeze the skin and adjust the spherical height of the adsorption portion; a camera module, used to collect a circuit image of the to-be-bonded component adsorbed by the adsorption portion; and a controller, configured to: obtain, via the camera module, The adsorption portion adsorbs a circuit image of the part to be bonded; the circuit image is analyzed to determine the actual circuit size of the part to be bonded; the theoretical circuit size of the part to be bonded is obtained, and a relationship curve of the influence of the actual circuit size and the spherical height of the adsorption portion on the circuit size of the part to be bonded is combined to determine the compensation amount for the part to be bonded; according to the compensation amount, the driving unit is controlled to drive the ball head ejector pin to squeeze the skin to bend the part to be bonded and compensate its actual circuit size to the theoretical circuit size; and the bonding head is raised and lowered to bond the compensated part to be bonded to its target position.

[0015] Furthermore, in some embodiments of the present invention, the bonding head includes a plurality of skins, wherein the plurality of adsorption holes of each skin have a distribution range of different sizes and correspond to at least one size of a part to be bonded, and each skin is selectively fixed to the other end of the hollow portion to adsorb a part to be bonded of a corresponding size.

[0016] In addition, the above-mentioned bonding method provided in accordance with the second aspect of the present invention includes the following steps: collecting a circuit image of the part to be bonded adsorbed by the adsorption portion of the bonding head; analyzing the circuit image to determine the actual circuit size of the part to be bonded; obtaining the theoretical circuit size of the part to be bonded, and combining the actual circuit size and the influence relationship curve of the spherical height of the adsorption portion on the circuit size of the part to be bonded to determine the compensation amount for the part to be bonded; according to the compensation amount, controlling a driving unit to drive a ball head ejector pin to squeeze the skin of the adsorption portion, so as to bend the part to be bonded by adjusting the spherical height of the adsorption portion, and compensate its actual circuit size to the theoretical circuit size; and raising and lowering the bonding head to bond the compensated part to be bonded to its target position.

[0017] Furthermore, in some embodiments of the present invention, the step of determining the influence relationship curve of the spherical height of the adsorption portion on the circuit size of the part to be bonded includes: driving the ball head ejector pin to squeeze the skin multiple times by the driving unit to bend the calibration sample of the part to be bonded, and collecting the circuit image of the calibration sample after each bending; analyzing each of the circuit images to determine the circuit size of the calibration sample after each bending; determining the corresponding spherical height according to the control amount of the calibration sample bent by the driving unit each time; and fitting the influence relationship curve of the spherical height of the adsorption portion on the circuit size of the part to be bonded according to the spherical height of the calibration sample each time bent and the circuit size corresponding to the calibration sample.

[0018] In addition, according to the fourth aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above bonding method provided by the third aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0020] Figure 1 A schematic structural diagram of a research tool provided according to some embodiments of the present invention is shown;

[0021] Figure 2 An exploded view of a research tool provided according to some embodiments of the present invention is shown;

[0022] Figure 3 A flow chart showing a method for studying the influence of the spherical surface height of a nozzle on a bonding part provided in accordance with other embodiments of the present invention;

[0023] Figure 4 A schematic structural diagram of a bonding head provided in some other embodiments of the present invention is shown; and

[0024] Figure 5 A flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0025] Reference numerals:

[0026] 100 Research tooling;

[0027] 110 Vacuum nozzle;

[0028] 111, 420 cavity;

[0029] 112, 440 skin;

[0030] 113, 441 adsorption department;

[0031] 114 Gas nozzle;

[0032] 120, 430 regulating mechanism;

[0033] 121 ball head thimble;

[0034] 122 drive unit;

[0035] 123, 431 ball head;

[0036] 210 base;

[0037] 211 vias;

[0038] 212 sealing ring;

[0039] 220, 410 nozzle body;

[0040] 221 hollow part;

[0041] Steps S310 to S340; and

[0042] Steps S510~S550. DETAILED DESCRIPTION

[0043] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0046] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0047] As mentioned above, the suction nozzle of the currently used bonding head is of a fixed height, so it is necessary to replace multiple bonding heads with different suction nozzle heights on the equipment each time to verify the deformation of the circuit size on the chip matching a certain wafer. This method is not only cumbersome in process, but also unable to quickly and accurately adjust the circuit size of the chip to be bonded to the target size to completely and accurately correspond to the circuit on the wafer. Moreover, the bonding head processing cycle in the prior art is long, the processing is complex, and the cost is high. At the same time, due to processing errors, it may not be possible to process the bonding head to the required specific size, and variable control is difficult.

[0048] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a research tool, a bonding head, a bonding method, and a computer-readable storage medium, which can quickly and accurately adjust the circuit size of the to-be-bonded component to the target size, thereby reducing the adjustment time and improving the bonding efficiency.

[0049] In some non-limiting embodiments, the research tooling provided in the first aspect of the present invention may be configured in the bonding head provided in the second aspect of the present invention, and used to implement the bonding method provided in the third aspect of the present invention.

[0050] Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, can be used to implement the bonding method provided in the third aspect of the present invention.

[0051] The working principle of the above-mentioned research tooling will be described below in conjunction with some examples of bonding heads and bonding methods. Those skilled in the art will understand that these examples of bonding heads and bonding methods are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the research tooling. Similarly, the research tooling is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the configuration objects in these bonding heads and the implementing subjects of each step in the bonding method.

[0052] Please see Figure 1 , Figure 1 A schematic structural diagram of a research tool provided according to some embodiments of the present invention is shown.

[0053] like Figure 1 As shown, in some embodiments of the present invention, the research tool 100 can be used to study the influence of the nozzle spherical surface height on the bonding part. The research tool 100 mainly includes a vacuum nozzle 110, an adjustment mechanism 120, a camera module and a controller.

[0054] Specifically, please combine Figure 1 and Figure 2 Common understanding, Figure 2 An exploded view of a research tool provided according to some embodiments of the present invention is shown.

[0055] like Figure 1 and Figure 2As shown, in some embodiments, the vacuum nozzle 110 may include a cavity 111, wherein one end of the cavity 111 may be connected to the vacuum mechanism, and the other end thereof may extrude a skin 112 with holes to form a deformable adsorption portion 113.

[0056] Alternatively, if Figure 1 As shown, an air nozzle 114 can be provided on the side of the cavity 111, and an external vacuum mechanism can be connected through the air nozzle 114. In combination with the adsorption holes distributed on the skin 112, a vacuum adsorption part 113 can be formed to vacuum adsorb the bonded part. Optionally, the bonded part can be a chip or other grain with at least one circuit element.

[0057] Continue as Figure 2 As shown, the adjustment mechanism 120 may include a ball head ejector pin 121 and a driving unit 122. One end of the ball head ejector pin 121 may be connected to the driving unit 122, and the ball head 123 at the other end thereof may pass through the cavity 111 to squeeze the skin 112 and adjust the spherical height of the adsorption portion 113.

[0058] In some preferred embodiments, the driving unit 122 may be a micrometer head. The micrometer head may be used to finely control the height change of the bow value of the front end skin 112. In this embodiment, the minimum feed unit of the micrometer head may be 0.5 μm, and the micrometer head may be used to achieve precise adjustment of the spherical height of the adsorption portion 113.

[0059] Furthermore, if Figure 2 As shown, in some embodiments, the vacuum nozzle 110 may be composed of a base 210, a nozzle body 220, and a perforated skin 112. The nozzle body 220 may have a hollow portion 221 extending along its axial direction, and one end of the hollow portion 221 may be assembled with the base 210 to form a cavity 111. The base 210 may be provided with a through hole 211 aligned with the hollow portion 221, and a sealing ring 212 may be provided in the through hole 211. The micrometer head may extend into the cavity 111 through the through hole 211 with the sealing ring 212 to connect one end of the ball head ejector pin 121. The skin 112 may be fixed to the other end of the hollow portion 221 by a countersunk screw for easy replacement, and is in point contact with the ball head 123. During the forward feed drive of the micrometer, the skin 112 becomes a convex spherical shape under the extrusion of the point contact with the ball head 123, thereby ensuring that the surface of the adsorption portion 113 is in a spherical shape. Since the chip is very thin, usually 40 to 50 μm, a chip of this thickness can easily be deformed during adsorption by the vacuum nozzle 110. Therefore, the spherical surface of the adsorption portion 113 can stretch the chip to be bonded during vacuum adsorption, thereby compensating for the lithography error of the wafer.

[0060] In some embodiments, the camera module in the research tool 100 may include a 3D camera for measuring the shape of the surface of the vacuum nozzle 110 and detecting the spherical morphology. The 3D camera can be used to photograph the adsorption portion 113 to obtain the surface shape parameters of the adsorption portion 113.

[0061] Furthermore, the camera module may also include a mirror profiler for measuring the surface of the bonding component adsorbed by the adsorption portion 113 after the vacuum suction nozzle 110 adsorbs the chip, so as to collect a circuit image of the bonding component adsorbed by the adsorption portion 113. The measurement principle of the mirror profiler can be specifically used to measure the appearance of an object with a mirror surface.

[0062] Optionally, in some embodiments, the relationship between different variables and the spherical surface height and morphology can be further studied by using a mirror profiler. Since there are many variables that affect the spherical surface, such as the material, structural shape, thickness, pressure of the skin, the forward distance of the drive unit 122, and the corresponding spherical head 123 lifting height, etc., before formally manufacturing the vacuum suction nozzle 110 including the deformable adsorption part 113, the relationship between each main variable and the spherical surface height can be found first, so as to reduce the number of suction nozzles, save costs, and reduce verification time.

[0063] Specifically, the harder the material of the skin 112 is and the thicker it is, the smaller the variable area is. To achieve the same spherical height, a greater force is required. Correspondingly, the drive unit 122 needs to provide a larger feed distance, that is, the greater the lifting height, the greater the lifting force required.

[0064] The controller in the research tool 100 can be connected to the adjustment mechanism 120 and the camera module to perform the steps of the method for studying the influence of the nozzle spherical height on the bonding part. Figure 3 , Figure 3 A flow chart of a method for studying the influence of the spherical height of a suction nozzle on a to-be-bonded component provided in accordance with some other embodiments of the present invention is shown.

[0065] like Figure 3 As shown, first, step S310 may be performed: the driving unit drives the ball head ejector to squeeze the skin to bend the component to be bonded, and the camera module collects circuit images of the component to be bonded after each bending.

[0066] Specifically, it can be combined Figure 1 and Figure 2It is commonly understood that in some embodiments, when the drive unit 122 is preferably a micrometer head, the controller can connect the micrometer head and drive the micrometer head to feed forward. During the forward feeding drive of the micrometer, the skin 112 can be changed into a convex spherical shape under the extrusion of the point contact with the ball head 123. The controller obtains the control amount of each bending of the chip to be bonded by the drive unit 122, and combines the original installation position of the micrometer head, the length of the micrometer head, the length of the ball head ejector pin 121, and the length of the cavity 111, thereby determining the spherical height corresponding to each control amount.

[0067] In some optional embodiments, the research tool 100 can allow the driving unit 122 to feed a chip to be bonded multiple times with different forward distances. The camera module can obtain circuit images of the chip to be bonded with multiple bending degrees after multiple bending.

[0068] Furthermore, in other preferred embodiments, the research tooling 100 may also include a plurality of skins 112, wherein the plurality of adsorption holes of each skin 112 may have a distribution range of different sizes, corresponding to the size of at least one part to be bonded. In other words, skins 112 of different sizes can be obtained by adjusting the size of the adsorption holes distributed in different skins 112, as well as their distribution range, so as to match chips to be bonded of different sizes. Each skin 112 can be selectively fixed to the other end of the hollow portion 221 of the nozzle body 220, so as to be used to adsorb parts to be bonded of corresponding sizes. Optionally, the nozzle body 220 can be a replaceable part, so that the nozzle body 220 corresponding to the size of the skin can be replaced according to the skin 112 of different sizes, so that the various components in the research tooling 100 are more matched with each other.

[0069] In this embodiment, the controller can control the drive unit 122 to bend chips to be bonded of various sizes respectively. The camera module can obtain circuit images of multiple chips to be bonded of different sizes after each bending. Optionally, the controller can control the drive unit 122 to feed each size of the chip to be bonded once or multiple times with different forward distances. This embodiment can improve the applicability of the research tool 100, can meet the tensile deformation requirements for chips to be bonded of various sizes, and adapt to parts to be bonded of different sizes.

[0070] Continue as Figure 3 As shown, step S320 may be performed next: analyzing each circuit image to determine the circuit size of the bonded component after each bending.

[0071] Specifically, in some embodiments, for a chip to be bonded, multiple circuit images of the chip to be bonded with different degrees of bending can be obtained by allowing the driving unit 122 to feed the chip with different forward distances for multiple times, and these multiple circuit images with different degrees of bending can be analyzed to obtain the circuit size of the chip to be bonded after multiple different bendings.

[0072] In other preferred embodiments, by replacing skins 112 of different sizes on the vacuum nozzle 110 of the research tooling 100, the controller can also obtain multiple circuit images of chips to be bonded of various sizes that are bent separately via the driving unit 122, and analyze the circuit images of the chips to be bonded of various sizes, thereby obtaining the circuit sizes of the chips to be bonded of various sizes after each bending.

[0073] Continue as Figure 3 As shown, step S330 and step S340 may be performed next. Step S330: Determine the corresponding spherical height according to the control amount of each bending of the bonding member by the driving unit. Step S340: Fit the relationship curve of the influence of the spherical height of the adsorption portion on the circuit size of the bonding member according to the spherical height of each bending of the bonding member and the circuit size corresponding to the bonding member.

[0074] Furthermore, in some preferred embodiments, the actual circuit sizes of different deformations corresponding to the chip stretching of multiple chips of different sizes to be bonded under different feeding distances obtained during the experiment of studying the influence of the nozzle spherical surface height on the bonded parts can be saved in the database, so that in the subsequent chip-to-wafer bonding process, according to the actual circuit size after the stretching deformation on the wafer, the actual circuit size after the adsorption deformation on the chip that matches the deformation of the chip to be bonded can be quickly found in the database, as well as the corresponding advancement distance of the driving unit 122 and the spherical height of the adsorption part 113. Then, the controller can directly control the driving unit 122 to move to the target advancement distance without multiple test adjustments, saving adjustment time and thus improving the bonding efficiency.

[0075] So far, the research tool 100 provided by the first aspect of the present invention has been introduced. The change of the spherical surface of the nozzle can be completed mechanically, and it has the function of vacuum adsorbing the chip, so that the deformation size of the chip under different bending values ​​of the skin in the adsorption part can be explored. Preferably, the optimal range of chip tensile deformation corresponding to the change of the bending value of the skin can be 10-40μm, so as to better compensate for the lithography error of the wafer.

[0076] Through the above-mentioned research tool 100 for studying the influence of the spherical height of the suction nozzle on the bonding part, a bonding head can be further obtained.

[0077] Specifically, in some optional embodiments, such as Figure 1 and 2 As shown, the bonding head can directly adopt the structure of the above-mentioned research tooling 100. The structure of the bonding head may include a vacuum suction nozzle 110, an adjustment mechanism 120, a camera module, and a controller. A cavity 111 may be provided inside the vacuum suction nozzle 110, wherein one end of the cavity 111 may be connected to the vacuum mechanism, and the other end thereof may be aligned with a perforated skin 112 to form a deformable adsorption portion 113. The adjustment mechanism 120 may include a ball head ejector pin 121 and a drive unit 122, wherein one end of the ball head ejector pin 121 may be connected to the drive unit 122, and the ball head 123 at the other end thereof may pass through the cavity 111 to squeeze the skin 112 and adjust the spherical height of the adsorption portion 113. The camera module may be used to collect a circuit image of the component to be bonded adsorbed by the adsorption portion 113. The controller in the bonding head may be used to implement the bonding method provided in another aspect of the present invention.

[0078] Optionally, see Figure 4 , Figure 4 A schematic structural diagram of a bonding head provided according to some other embodiments of the present invention is shown.

[0079] In some other optional embodiments, the structure of the bonding head 400 can also be as follows: Figure 4 As shown. Specifically, the bonding head 400 may include a nozzle body 410 and an adjustment mechanism 430. A cavity 420 may be provided inside the nozzle body 410, wherein one end (such as the lower end) of the cavity 202 may be connected to a vacuum mechanism, and the other end (such as the upper end) thereof may be aligned with a perforated skin 440 to form a deformable adsorption portion 441. The adjustment mechanism 430 may be located inside the cavity 420. As shown in the partial enlarged figure I, a spherical ball head 431 is provided at the top of the adjustment mechanism 430. When the adjustment mechanism 430 is driven, it may make point contact with the skin 440 above it, and squeeze the skin 440 through one end of the ball head 431 at the top, and adjust the spherical height of the adsorption portion 441, so that the part to be bonded may be adsorbed into a corresponding convex spherical shape. The bonding head 400 may also include a controller for implementing the bonding method provided in another aspect of the present invention.

[0080] In order to better introduce the working principle of the controller in some embodiments of the above-mentioned bonding head, the following will be further described in combination with the specific steps of the bonding method. Figure 5 , Figure 5 A flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0081] like Figure 5As shown, in some embodiments of the present invention, the bonding method may include the following steps: First, step S510 may be performed: collecting a circuit image of the to-be-bonded component adsorbed by the adsorption portion of the bonding head.

[0082] Specifically, it can be combined Figure 1 and 2 It is commonly understood that in some embodiments, the adsorption portion 113 may be in point contact with the ball head 123 of the ball head ejector pin 121 connected to the driving unit 122. After the adsorption portion 113 of the bonding head adsorbs the chip to be bonded, as the driving unit 122 is fed, the adsorption portion 113 may press the skin 112 in the form of point contact, so that the adsorption portion 113 presents a protruding spherical height. Through the camera module, the circuit image of the chip to be bonded adsorbed by the adsorption portion 113 of the vacuum nozzle 110 can be obtained.

[0083] Furthermore, in some preferred embodiments, the bonding head may include a plurality of skins 112, wherein the plurality of adsorption holes distributed on each skin 112 may have a distribution range of different sizes, corresponding to the size of at least one part to be bonded. Each skin 112 may be selectively fixed to the other end of the hollow portion 221 of the nozzle body 220, so as to be used to adsorb the chip to be bonded of the corresponding size. In other words, before the adsorption portion 113 of the bonding head adsorbs the chip to be bonded, a matching skin may be selected and installed on the nozzle body 220 according to the size, thickness and other parameters of the chip to be bonded, so as to ensure that the chip to be bonded can be stably adsorbed.

[0084] Continue as Figure 5 As shown, step S520 may be performed: parsing the circuit image to determine the actual circuit size of the component to be bonded.

[0085] Specifically, in some embodiments, the controller analyzes the circuit image of the chip to be bonded captured by the camera module, so as to determine the actual circuit size of the chip to be bonded.

[0086] Next, step S530 may be performed: obtaining the theoretical circuit size of the component to be bonded, and determining the compensation amount for the component to be bonded based on the influence relationship curve of the actual circuit size and the spherical height of the adsorption portion on the circuit size of the component to be bonded.

[0087] Specifically, in some embodiments, the controller can obtain the deformed circuit size of the wafer after photolithography in advance, and then determine the theoretical circuit size of the chip to be bonded corresponding to different bonding patch areas. The theoretical circuit size of the chip can be fully matched with the deformed circuit size on the wafer, which is conducive to accurate alignment of the chip and the mark on the wafer.

[0088] Furthermore, in some embodiments, the relationship curve of the influence of the spherical height of the adsorption portion 113 on the circuit size of the bonding component can be pre-calibrated by the above-mentioned research tool 100 provided by the first aspect of the present invention. Figure 1 and 2 As shown, in the process of using the research tooling 100 as a bonding head to implement this step, the driving unit 122 can first drive the ball head ejector pin 121 to squeeze the skin 112 multiple times to bend the calibration sample of the chip to be bonded. Then, collect the circuit images of the calibration sample after each bending. After that, by analyzing the circuit images of the calibration sample, the circuit size of the calibration sample after each bending is determined. Then, according to the control amount of each bending of the calibration sample by the driving unit 122, the corresponding spherical height is determined. Finally, according to the spherical height of the calibration sample each time it is bent, and the circuit size corresponding to the calibration sample, the relationship curve of the influence of the spherical height of the adsorption portion 113 on the circuit size of the chip to be bonded can be fitted.

[0089] Continue as Figure 5 As shown, step S540 can be executed: according to the compensation amount, a driving unit is controlled to drive a ball head ejector pin to squeeze the skin of the adsorption part, so as to bend the part to be bonded by adjusting the spherical height of the adsorption part, and compensate its actual circuit size to the theoretical circuit size. Through the above-fitted relationship curve of the influence of the spherical height of the adsorption part on the circuit size of the chip to be bonded, the compensation amount of the chip to be bonded, that is, the spherical height corresponding to the forward feed distance of the driving unit 122, can be quickly and accurately adjusted. Finally, step S550 can be executed: lifting and lowering the bonding head to bond the compensated part to be bonded to its target position, that is, a certain patch position on the wafer.

[0090] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0091] Those skilled in the art will further appreciate that the various illustrative logic modules and circuits described in conjunction with the embodiments disclosed herein may be implemented or executed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in an alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in cooperation with a DSP core, or any other such configuration.

[0092] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0093] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0094] In summary, the present invention provides a research tool, a bonding head, a bonding method, and a computer-readable storage medium, which can quickly and accurately adjust the circuit size of the bonded component to the target size, reduce the adjustment time, and thus improve the bonding efficiency.

[0095] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A research tool for studying the influence of the nozzle spherical height on the bonded parts, characterized in that: include: The vacuum nozzle comprises a cavity, wherein one end of the cavity is connected to the vacuum mechanism, and the other end of the cavity squeezes a skin with holes to form a deformable suction part; An adjustment mechanism, comprising a ball head ejector and a driving unit, wherein one end of the ball head ejector is connected to the driving unit, and the ball head at the other end thereof passes through the cavity to squeeze the skin and adjust the spherical surface height of the adsorption portion; A camera module, used for collecting a circuit image of the component to be bonded adsorbed by the adsorption portion; and The controller is configured to: drive the ball head ejector pin to squeeze the skin multiple times via the driving unit to bend the part to be bonded, and collect the circuit image of the part to be bonded after each bending via the camera module; analyze each circuit image to determine the circuit size of the part to be bonded after each bending; determine the corresponding spherical height according to the control amount of the part to be bonded by the driving unit each time; and fit the influence relationship curve of the spherical height of the adsorption portion on the circuit size of the part to be bonded according to the spherical height of the part to be bonded each time and the circuit size corresponding to the part to be bonded.

2. The research tooling as claimed in claim 1, characterized in that: The driving unit includes a micrometer head, wherein the controller is connected to the micrometer head to obtain the control amount of the driving unit bending the bonded part each time, and determines the spherical height corresponding to each control amount in combination with the original installation position of the micrometer head, the length of the micrometer head, the length of the ball head ejector pin, and the length of the cavity.

3. The research tool as claimed in claim 2, characterized in that: The vacuum nozzle is composed of a base, a nozzle body and the perforated skin, wherein: The nozzle body has a hollow portion extending along its axial direction, one end of which is assembled with the base to form the cavity. The base is provided with a through hole aligned with the hollow portion, a sealing ring is provided in the through hole, and the micrometer head extends into the cavity through the through hole with the sealing ring to connect one end of the ball head ejector pin. The skin is fixed to the other end of the hollow part, and becomes a convex spherical shape under the compression of the ball head.

4. The research tool as claimed in claim 3, characterized in that: The research tooling includes a plurality of the skins, wherein the plurality of adsorption holes of each of the skins have distribution ranges of different sizes and correspond to the size of at least one of the parts to be bonded, Each of the skins is selectively fixed to the other end of the hollow portion to absorb the to-be-bonded parts of corresponding sizes.

5. The research tool as claimed in claim 4, characterized in that: The controller is further configured to: Bend the components to be bonded of various sizes respectively, so as to respectively determine the circuit size of each component to be bonded after each bending, and respectively determine the spherical height of each component to be bonded when the adsorption portion bends each time; as well as According to the spherical height of each of the components to be bonded each time they are bent and the circuit size corresponding to each of the components to be bonded, the relationship curves of the influence of the spherical height of the adsorption portion on the circuit size of each of the components to be bonded are fitted respectively.

6. A bonding head, characterized in that: include: A vacuum suction nozzle, wherein a cavity is provided inside, wherein one end of the cavity is connected to a vacuum mechanism, and the other end thereof is aligned with a skin with a hole to form a deformable suction portion; An adjustment mechanism, comprising a ball head ejector and a driving unit, wherein one end of the ball head ejector is connected to the driving unit, and the ball head at the other end thereof passes through the cavity to squeeze the skin and adjust the spherical surface height of the adsorption portion; A camera module, used for collecting a circuit image of the component to be bonded adsorbed by the adsorption portion; and The controller is configured to: obtain, via the camera module, a circuit image of the component to be bonded adsorbed by the adsorption portion; analyze the circuit image to determine the actual circuit size of the component to be bonded; obtain the theoretical circuit size of the component to be bonded, and determine the compensation amount for the component to be bonded based on the relationship curve of the actual circuit size and the influence of the spherical height of the adsorption portion on the circuit size of the component to be bonded; control the drive unit to drive the ball head ejector pin to squeeze the skin according to the compensation amount to bend the component to be bonded and compensate its actual circuit size to the theoretical circuit size; and lift the bonding head to bond the compensated component to be bonded to its target position.

7. The bonding head according to claim 6, characterized in that The bonding head comprises a plurality of the skins, wherein the plurality of adsorption holes of each of the skins have a distribution range of different sizes and correspond to the size of at least one of the parts to be bonded, Each of the skins is selectively fixed to the other end of the hollow portion to absorb the to-be-bonded parts of corresponding sizes.

8. A bonding method, characterized in that: The following steps are involved: Collecting a circuit image of the component to be bonded adsorbed by the adsorption portion of the bonding head; Analyzing the circuit image to determine the actual circuit size of the component to be bonded; Obtaining the theoretical circuit size of the component to be bonded, and combining the actual circuit size and the influence curve of the spherical height of the adsorption portion on the circuit size of the component to be bonded, so as to determine the compensation amount for the component to be bonded; According to the compensation amount, controlling a driving unit to drive a ball head ejector pin to squeeze the skin of the adsorption portion, so as to bend the to-be-bonded component by adjusting the spherical surface height of the adsorption portion, and compensating its actual circuit size to the theoretical circuit size; as well as The bonding head is lifted and lowered to bond the compensated part to be bonded to its target position.

9. The bonding method according to claim 8, characterized in that: The step of determining the relationship curve of the influence of the spherical surface height of the adsorption portion on the circuit size of the component to be bonded comprises: The driving unit drives the ball head ejector pin to squeeze the skin multiple times to bend the calibration sample of the to-be-bonded component, and respectively collects the circuit image of the calibration sample after each bending; Analyzing each of the circuit images to determine the circuit size of the calibration sample after each bending; Determining the corresponding spherical heights according to the control amount of each bending of the calibration sample by the driving unit; and According to the spherical height of the calibration sample each time it is bent and the circuit size corresponding to the calibration sample, a relationship curve of the influence of the spherical height of the adsorption portion on the circuit size of the component to be bonded is fitted.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 8 or 9 is implemented.

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