Optical domain intelligent reconstruction high-integration modular optical fiber data chain and operation method

Abstract

The invention discloses an optical domain intelligent reconstruction high-integration modular optical fiber data chain and an operation method, and the optical fiber data chain comprises a high-integration optical fiber data chain platform based on an all-optical switching and electro-optical / photoelectric conversion dense array. The platform comprises an intelligent main control computer, an electro-optical conversion dense array card, a high-integration VPX standard case, a photoelectric conversion dense array card and a high-integration all-optical switching matrix board card. The electro-optical conversion dense array card and the photoelectric conversion dense array card are connected with the high-integration VPX standard case, and the high-integration VPX standard case is connected with the high-integration all-optical switching matrix board card; the intelligent main control computer is connected with the high-integration VPX case through an Ethernet interface; and the optical fiber data link platform realizes optical domain intelligent reconstruction of a high-integration modularized optical fiber data link based on a high-isolation all-optical switching technology under the control of the main control computer. The system has the advantages of being good in intelligent degree, high in integration degree, high in reliability, good in universality, extensible, replaceable, upgradable and easy to operate.

Description

Technical Field

[0001] The present invention belongs to the field of optical communication, and in particular relates to optical fiber data link technology, and specifically is an optical domain intelligent reconstruction highly integrated modular optical fiber data link and an operation method. Background Art

[0002] Fiber optic data links are one of the development trends of optical transmission network technology. Using fiber optic data links to replace traditional electrical signal data links can not only effectively solve the "bottleneck" problem of communication capacity, but also significantly reduce the size and cost of equipment. However, traditional fiber optic data links not only have fixed optical routes and cannot achieve intelligent dynamic reconstruction, but also the equipment form and hardware connection method cannot be dynamically changed. If the system is to be upgraded or expanded, the built data link system can only be scrapped and rebuilt. This has become a pain point and difficulty that restricts the promotion and application of fiber optic data links. Therefore, there is an urgent need for a highly integrated modular fiber optic data link system that supports intelligent reconstruction in the optical domain, which not only realizes intelligent reconstruction in the optical domain, but also achieves "scalability, replaceability, upgradeability, and iteration", and significantly reduces the system size, weight, and power consumption.

[0003] The highly integrated modular fiber-optic data link system that supports intelligent reconstruction in the optical domain involves multiple core key technologies, including high-isolation all-optical switching technology based on silicon-based microlens arrays, high-precision optical path reflection and coupling technology based on robust distribution of silicon-based microlens arrays, miniaturized integrated packaging technology of dense arrays of optoelectronic and electro-optical conversion, fully automatic data recording and processing technology, and automatic compensation technology for link loss. These core technologies make the highly integrated modular fiber-optic data link that supports intelligent reconstruction in the optical domain technically difficult and have also become a key factor restricting the user experience of the highly integrated modular fiber-optic data link that supports intelligent reconstruction in the optical domain. Summary of the invention

[0004] The purpose of the present invention is to provide a highly integrated modular optical fiber data link and an operation method for intelligent reconstruction of optical domains in view of the deficiencies of the prior art. The present invention is developed based on a modular concept and can expand the scale and capacity of optical fiber data links. Moreover, the operation method thereof is simple to operate and has good practicality. When applied to highly integrated modular optical fiber data links with intelligent reconstruction of optical domains, the difficulty of operation and maintenance can be reduced and the reliability of the system can be improved.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] An optical domain intelligent reconstruction highly integrated modular optical fiber data link, comprising a highly integrated optical fiber data link platform based on all-optical switching and electro-optical / photoelectric conversion dense array, wherein the highly integrated optical fiber data link platform comprises an intelligent main control computer, at least one electro-optical conversion dense array daughter card, a highly integrated VPX standard chassis, at least one photoelectric conversion dense array daughter card and at least one highly integrated all-optical switching matrix board card;

[0007] Among them, the intelligent main control computer is connected to the external network, the electro-optical conversion dense array sub-card and the photoelectric conversion dense array sub-card are connected to the highly integrated VPX standard chassis, and the highly integrated VPX standard chassis is connected to the highly integrated all-optical exchange matrix board card;

[0008] The intelligent main control computer and the highly integrated VPX chassis are connected via an Ethernet interface;

[0009] The optical fiber data link platform is composed of highly integrated all-optical switching matrix boards, electro-optical conversion dense array sub-cards, highly integrated VPX standard chassis, and photoelectric conversion dense array sub-cards. Under the control of the main control computer, the optical fiber data link platform realizes the optical domain intelligent reconstruction of the highly integrated modular optical fiber data link based on the high-isolation all-optical switching technology;

[0010] The highly integrated all-optical switching matrix board realizes 24×24 scale non-blocking all-optical switching, provides optical domain switching channels between the electro-optical conversion dense array sub-card and the photoelectric conversion dense array sub-card, and intelligently changes the optical domain routing state of the optical fiber data link system under the unified control of the intelligent main control computer, and feeds back the current optical routing state parameters to the intelligent main control computer;

[0011] The electro-optical conversion dense array sub-card realizes electro-optical conversion of 24 channels of 12.75G high-speed electrical signals, and puts the corresponding channel lasers in the laser array into working or low-power dormant state under the unified control of the intelligent main control computer;

[0012] The photoelectric conversion dense array sub-card realizes the photoelectric conversion of 24 channels of 13.25G high-speed optical signals, and puts the corresponding channel detectors in the detector array into working state or low-power dormant state under the unified control of the intelligent main control computer;

[0013] The highly integrated VPX standard chassis provides card slots for plugging in electro-optical conversion dense array daughter cards, highly integrated all-optical switching matrix daughter cards and photoelectric conversion dense array daughter cards. All cards inserted into the highly integrated VPX standard chassis realize interconnection and intercommunication of optical and electrical signals through a high-speed backplane.

[0014] The intelligent main control computer receives IP network remote networking management and control information, and performs unified management and control on the electro-optical conversion dense array sub-card, the highly integrated all-optical exchange matrix board card, and the optoelectronic conversion dense array sub-card.

[0015] Preferably, the highly integrated all-optical switching matrix board includes an embedded microprocessor and a DA drive control array, a power management unit, a health management unit, and a bus driver connected to the embedded microprocessor; wherein the power management unit and the health management unit are also connected to the DA drive control array and the bus driver, the DA drive control array is connected to the power management unit, the optical routing switching module, the health management unit, and the embedded microprocessor, and the optical routing switching module is connected to the DA drive control array and the optical connector of the electro-optical conversion dense array sub-card and the optical connector of the optoelectronic conversion dense array sub-card provided on the highly integrated all-optical switching matrix board. Furthermore, the optical connector of the electro-optical conversion dense array sub-card is an optical connector with a 24-core MT connector, and the optical connector of the optoelectronic conversion dense array sub-card is an optical connector with a 24-core MT connector; the control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the highly integrated all-optical switching matrix board.

[0016] Preferably, the electro-optical conversion dense array daughter card includes an embedded microprocessor and a field programmable logic device connected to the embedded microprocessor, a power management unit, and a bus driver connection; wherein the power management unit is also connected to the laser array module, the field programmable logic processor, and the bus driver, and the laser array module is connected to the electro-optical conversion dense array daughter card electrical connector, the electro-optical conversion dense array daughter card optical connector, the power management unit, and the field programmable logic processor. Furthermore, the electro-optical conversion dense array daughter card electrical connector is an electrical signal connector with a standard VPX connector, and the electro-optical conversion dense array daughter card optical connector is an optical signal connector with an MT connector; the bus driver's control signal is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the electro-optical conversion dense array daughter card.

[0017] Preferably, the photoelectric conversion dense array daughter card includes an embedded microprocessor and a field programmable logic device connected to the embedded microprocessor, a power management unit, and a bus driver connection; wherein the power management unit is also connected to the detector array module, the field programmable logic processor, the embedded microprocessor, and the bus driver, and the detector array module is connected to the photoelectric conversion dense array daughter card optical connector, the photoelectric conversion dense array daughter card electrical connector, the power management unit, and the field programmable logic processor. Furthermore, the photoelectric conversion dense array daughter card electrical connector is an electrical signal connector with a standard VPX connector, and the photoelectric conversion dense array daughter card optical connector is an optical signal connector with an MT connector; the bus driver's control signal is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the photoelectric conversion dense array daughter card.

[0018] Preferably, the highly integrated VPX chassis includes a high-speed backplane and a VPX frame structure. The high-speed backplane is installed on the VPX structure and is connected to the intelligent main control computer through an RJ45 Ethernet interface. The highly integrated VPX chassis provides 19 board slots, and the electro-optical conversion dense array daughter card can be inserted into any slot from 1 to 6; the highly integrated all-optical switching matrix board card can be inserted into any slot from 7 to 13, among which slot 7 is a required slot; the optoelectronic conversion dense array daughter card can be inserted into any slot from 14 to 19.

[0019] An operation method of an optical domain intelligent reconstruction highly integrated modular optical fiber data link, comprising the above-mentioned optical domain intelligent reconstruction highly integrated modular optical fiber data link, the operation method comprising the following steps:

[0020] 1) System self-check: Automatically check whether the working status of the intelligent main control computer, electro-optical conversion dense array sub-card, highly integrated VPX standard chassis, photoelectric conversion dense array sub-card, and highly integrated all-optical switching matrix board is normal, and control the laser array of the electro-optical conversion dense array sub-card, the detector array of the photoelectric conversion dense array sub-card, and the highly integrated all-optical switching matrix to be in the initialization working mode;

[0021] 2) Channel detection: Switch the highly integrated modular optical fiber data link system supporting intelligent reconstruction in the optical domain to the through state, so that the optical signal of the electro-optical conversion dense array card is directly transmitted to the optoelectronic conversion dense array card, and the detector of the optoelectronic conversion dense array card detects the received optical power. If the optical power received by all detectors is greater than 3dB, the channel detection is normal; the through state refers to the working state in which the 24 input and output channels of the highly integrated all-optical switching matrix are directly connected one by one;

[0022] 3) Configure the laser array: configure the laser array register of the electro-optical conversion dense array daughter card to make the 24-channel laser in working state, the register at address OX 0021 is configured to OX 3F, the register at address OX 0031 is configured to OX 42, the register at address OX 0022 is configured to OX 16, the register at address OX 0033 is configured to OX 21, the register at address OX 0014 is configured to OX 55, and the register at address OX 0053 is configured to OX 23. At this time, the electro-optical conversion dense array daughter card is in the 12.75G high-speed electrical signal electro-optical conversion mode;

[0023] 4) Optical domain routing reconstruction: According to the optical routing reconstruction table issued by the intelligent main control computer, the optical routing of the highly integrated all-optical switching matrix board is configured, so that the laser optical signal of the channel corresponding to the electro-optical conversion dense array sub-card is intelligently switched to the detector output of the channel corresponding to the photoelectric conversion dense array sub-card;

[0024] 5) Link verification: The link verification code received by the photoelectric conversion dense array sub-card detector array is reported to the intelligent main control computer, and verified with the electro-optical conversion dense array sub-card reported to the intelligent main control computer. If the verification code is correct, the link verification is successful; when performing link verification, the intelligent main control computer will also collect the verification start time, verification completion time, verification code used for verification, optical routing reconstruction table during verification, optical power received by the detector during verification, parameter value of laser array register configuration during verification, working voltage value detected during verification, and chip temperature information detected during verification;

[0025] 6) Post-processing: The intelligent main control computer performs post-processing on the configuration information and verification test data of step 5);

[0026] Preferably, the post-processing in step 6) is to generate a link verification report in the data format required by the operation and maintenance database; the content of the link verification report includes the verification start time, the verification completion time, the verification code used for verification, the optical routing reconstruction table during verification, the optical power received by the detector during verification, the parameter value of the laser array register configuration during verification, the 1.0V, 1.2V, 1.8V, 2.5V, 3.3V operating voltage values ​​detected during verification, and the chip temperature detected during verification, and the generated link verification report is uploaded to the remote operation and maintenance database.

[0027] Compared with the prior art, the present invention has the following advantages:

[0028] 1. The present invention is developed based on a modular concept. If the scale and capacity of the optical fiber data link are to be expanded, it is only necessary to insert more electro-optical conversion dense array primary daughter cards, optoelectronic conversion dense array secondary daughter cards and highly integrated all-optical switch matrix boards into the standard VPX chassis. It supports the insertion of up to 6 electro-optical conversion dense array primary daughter cards, 6 optoelectronic conversion dense array secondary daughter cards and 6 highly integrated all-optical switch matrix boards, thereby expanding the scale of the optical fiber data link from 24 optical fiber data links to 144 optical fiber data links, and supporting 144×144 scale non-blocking all-optical switching.

[0029] 2. This system has the characteristics of high intelligence, high integration, high reliability, good versatility, scalability, replaceability, upgradeability, iteration and low cost.

[0030] 3. The method of the present invention is simple to operate and has good practicality. It is applied in the optical domain intelligent reconstruction of highly integrated modular optical fiber data links, which can reduce the difficulty of operation and maintenance, save human resources, improve system reliability, and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a principle block diagram of a highly integrated modular optical fiber data link for optical domain intelligent reconstruction according to the present invention;

[0032] Figure 2 This is the principle block diagram of the highly integrated all-optical switching matrix board;

[0033] Figure 3 This is the principle block diagram of the primary daughter card of the electro-optical conversion dense array;

[0034] Figure 4 This is the principle block diagram of the secondary daughter card of the photoelectric conversion dense array;

[0035] Figure 5 This is the principle block diagram of the highly integrated VPX chassis;

[0036] Figure 6 The present invention is a flow chart of a method for operating a highly integrated modular optical fiber data link by intelligently reconstructing an optical domain. DETAILED DESCRIPTION

[0037] In order to make the purpose and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0038] like Figure 1 As shown, the present invention discloses a highly integrated modular optical fiber data link for intelligent reconstruction in the optical domain, including a highly integrated optical fiber data link platform based on all-optical switching and electro-optical / photoelectric conversion dense array, wherein the highly integrated optical fiber data link platform includes an intelligent main control computer, an electro-optical conversion dense array sub-card, a highly integrated VPX standard chassis, a photoelectric conversion dense array sub-card, and a highly integrated all-optical switching matrix board. Among them, the main control computer is externally connected to the network, the electro-optical conversion dense array sub-card and the photoelectric conversion dense array sub-card are connected to the highly integrated VPX standard chassis through MT optical connectors and VPX electrical connectors, and the highly integrated VPX standard chassis is connected to the highly integrated all-optical switching matrix board through MT optical connectors and VPX electrical connectors. The intelligent main control computer is connected to the highly integrated VPX chassis through a standard RJ45 Ethernet interface. The highly integrated all-optical switching matrix board, the electro-optical conversion dense array sub-card, the highly integrated VPX standard chassis, and the photoelectric conversion dense array sub-card constitute a fiber data link platform, and the fiber data link platform realizes the optical domain intelligent reconstruction of the highly integrated modular optical fiber data link based on the high isolation all-optical switching technology under the control of the main control computer.

[0039] like Figure 2As shown, the highly integrated all-optical switching matrix board includes an embedded microprocessor and a DA drive control array, a power management unit, a health management unit, and a bus driver connected to the embedded microprocessor. Among them, the power management unit and the health management unit are also connected to the DA drive control array and the bus driver; the DA drive control array is connected to the power management unit, the optical routing switching module, the health management unit, and the embedded microprocessor; the optical routing switching module is connected to the optical connector of the electro-optical conversion dense array sub-card, the optical connector of the photoelectric conversion dense array sub-card, and the DA drive control array provided on the highly integrated all-optical switching matrix board. Among them, the optical connector of the electro-optical conversion dense array sub-card is an optical connector with a 24-core MT connector, and the optical connector of the photoelectric conversion dense array sub-card is an optical connector with a 24-core MT connector. The control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the highly integrated all-optical switching matrix board. The functions realized by the highly integrated all-optical switching matrix board include: a single board realizes 24×24 scale non-blocking all-optical switching, provides optical domain switching channels between electro-optical conversion dense array sub-cards and optoelectronic conversion dense array sub-cards, and intelligently changes the optical domain routing state of the optical fiber data link system under the unified control of the intelligent main control computer, and feeds back the current optical routing state parameters to the intelligent main control computer.

[0040] The power management unit is provided with an interconnected RSHF4644ARH power module and a C42605RCH power chip, wherein the output ends of the RSHF4644ARH power module and the C42605RCH power chip are independent of each other, and the input ends are connected in parallel. The function of the RSHF4644ARH is to convert the 12V bus voltage into multiple groups of 2.5V and 3.3V working voltages for use by each module, and the function of the C42605RCH is to convert the 12V bus voltage into a 60V working voltage for use by each DA drive control array.

[0041] The DA drive control array is a functional array composed of 48 AD5504 chips. The control ends of the 48 AD5504 chips are connected together in a way that every 8 chips share a group of SPI buses. The output ends of the 48 AD5504 chips are independent of each other. The DA drive control array 5 can simultaneously provide 196 driving deflection voltages and drive the optical routing switching module to realize intelligent reconstruction of optical domain routing.

[0042] The health management unit is equipped with a microprocessor Loog 1J, a resistor voltage detection circuit, and a JSR706RD watchdog circuit. Its main function is to collect working temperature, working voltage amplitude, and watchdog working status health information in real time and report it to the intelligent main control computer.

[0043] The bus driver is a functional unit composed of two transceiver chips DS34C87. The two transceiver chips DS34C87 are independent of each other. The input / output interface of the driver is respectively connected to the TTL bus output / input interface of the embedded high-performance microprocessor unit Loog1J chip. The main function is to provide a bus communication channel between the highly integrated all-optical switching matrix board and the highly integrated VPX chassis.

[0044] The embedded high-performance microprocessor is a functional unit composed of Loog 1J chips, and its main function is to control the coordinated work of all functional units on the automatic debugging host unit: control the amplitude and number of paths of the DA drive array output drive deflection voltage, control the communication between the bus driver and the main control computer, control the health management unit to collect the current working status of the equipment, and control the optical routing switching module to change the optical routing status.

[0045] The optical routing switching module is a functional unit composed of MS-24-24-1315-SM modules, and its main function is to realize 24×24 scale high isolation non-blocking all-optical switching through the micro-lens array light reflection principle under the drive of the DA drive control array.

[0046] The electro-optical conversion dense array daughter card optical connector is a functional unit composed of RPB4F12Q connectors, and its main function is to provide an optical signal coupling channel between the electro-optical conversion dense array daughter card and the highly integrated all-optical exchange matrix board through the highly integrated VPX chassis.

[0047] The photoelectric conversion dense array daughter card optical connector is a functional unit composed of RPB4F12Q connectors, and its main function is to provide an optical signal coupling channel between the photoelectric conversion dense array daughter card and the highly integrated all-optical exchange matrix board through the highly integrated VPX chassis.

[0048] like Figure 3As shown, the electro-optical conversion dense array daughter card includes an embedded microprocessor and a field programmable logic device connected to the embedded microprocessor, a power management unit, and a bus driver. Among them, the power management unit is also connected to the laser array module, the field programmable logic processor, and the bus driver; the laser array module is connected to the electro-optical conversion dense array daughter card electrical connector, the electro-optical conversion dense array daughter card optical connector, the power management unit, and the field programmable logic processor. Among them, the electro-optical conversion dense array daughter card electrical connector is an electrical signal connector with a standard VPX connector, and the electro-optical conversion dense array daughter card optical connector is an optical signal connector with an MT connector. The control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the electro-optical conversion dense array daughter card. The functions realized by the electro-optical conversion dense array daughter card are: the single board card realizes 24-channel 12.75G high-speed electrical signal electro-optical conversion, and the corresponding channel lasers in the laser array are in working or low-power sleep state under the unified control of the main control computer.

[0049] The field programmable logic processor is composed of an FPGA chip XC7VX690TFFG1761. The function of XC7VX690TFFG1761 is to expand the number of IO ports of the embedded microprocessor, expand a 24-way SPI bus through protocol conversion, and provide a transmission channel between the embedded microprocessor and the laser array.

[0050] The power management unit is composed of the RSHF4644ARH power module. The function of RSHF4644ARH is to convert the 12V bus voltage into multiple groups of 1.0V, 1.2V, 1.8V, 2.5V, and 3.3V operating voltages for use by each module.

[0051] The bus driver is a functional unit composed of two transceiver chips DS34C87. The two transceiver chips DS34C87 are independent of each other. The input / output interface of the driver is respectively connected to the TTL bus output / input interface of the embedded high-performance microprocessor unit Loog1J chip. The main function is to provide a bus communication channel between the electro-optical conversion dense array daughter card and the highly integrated VPX chassis.

[0052] The embedded microprocessor is a functional unit composed of Loog 1J chips, and its main function is to control all functional units on the electro-optical conversion dense array sub-card to work together and control the laser array module to complete the electro-optical conversion of 24 12.75G high-speed electrical signals on the single board.

[0053] The laser array module is a functional unit composed of ST-24-12-15-SM modules, and its main function is to complete the electro-optical conversion of 24 12.75G high-speed electrical signals on a single board under the control of an embedded microprocessor.

[0054] like Figure 4 As shown, the photoelectric conversion dense array sub-card includes an embedded microprocessor and a field programmable logic device connected to the embedded microprocessor, a power management unit, and a bus driver. Among them, the power management unit is also connected to the detector array module, the field programmable logic processor, the embedded microprocessor, and the bus driver, and the detector array module is connected to the photoelectric conversion dense array sub-card optical connector, the photoelectric conversion dense array sub-card electrical connector, the power management unit, and the field programmable logic processor. Among them, the photoelectric conversion dense array sub-card electrical connector is an electrical signal connector with a standard VPX connector, and the photoelectric conversion dense array sub-card optical connector is an optical signal connector with an MT connector. The control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector provided on the photoelectric conversion dense array sub-card. The functions realized by the photoelectric conversion dense array sub-card are: the single-board card realizes 24-channel 13.25G high-speed optical signal photoelectric conversion, and the corresponding channel detectors in the detector array are in working state or low-power sleep state under the unified control of the main control computer.

[0055] The field programmable logic processor is composed of an FPGA chip XC7VX690TFFG1761. The function of XC7VX690TFFG1761 is to expand the number of IO ports of the embedded microprocessor, expand a 24-way SPI bus through protocol conversion, and provide a transmission channel between the embedded microprocessor and the detector array.

[0056] The power management unit is composed of the RSHF4644ARH power module. The function of RSHF4644ARH is to convert the 12V bus voltage into multiple groups of 1.0V, 1.2V, 1.8V, 2.5V, and 3.3V operating voltages for use by each module.

[0057] The bus driver is a functional unit composed of two transceiver chips DS34C87. The two transceiver chips DS34C87 are independent of each other. The input / output interface of the driver is respectively connected to the TTL bus output / input interface of the embedded high-performance microprocessor unit Loog1J chip. The main function is to provide a bus communication channel between the optoelectronic conversion dense array daughter card and the highly integrated VPX chassis.

[0058] The embedded microprocessor is a functional unit composed of Loog 1J chips, and its main function is to control all functional units on the photoelectric conversion dense array card to work together and control the detector array module to complete the photoelectric conversion of 24-channel 13.25GG high-speed optical signals on the single board.

[0059] The detector array module is a functional unit composed of RR-24-12-15-SM modules, and its main function is to complete the photoelectric conversion of 24 13.25G high-speed optical signals on a single board under the control of an embedded microprocessor.

[0060] like Figure 5 As shown, the highly integrated VPX chassis includes a high-speed backplane and a VPX frame structure. The high-speed backplane is installed on the VPX structure and connected to the main control computer through an RJ45 Ethernet interface. The highly integrated VPX chassis provides 19 board slots. The electro-optical conversion dense array daughter card can be inserted into any slot from 1 to 6, and the highly integrated all-optical exchange matrix board card can be inserted into any slot from 7 to 13. Slot 7 is a required slot, and a highly integrated all-optical exchange matrix board card must be inserted in this slot. The photoelectric conversion dense array daughter card can be inserted into any slot from 14 to 19. All boards inserted into the highly integrated VPX chassis realize the interconnection of optical and electrical signals through the high-speed backplane.

[0061] The high-speed backplane is composed of 1 FPGA chip XC7VX690TFFG1761, 1 transceiver chip DS34C87, 19 24-core MT optical connectors RPB4F12Q, and 19 VPX electrical connectors VPX20-1132-0001. The function of the FPGA chip XC7VX690TFFG1761 is to converge the control signals transmitted from each board into one control signal, which is output from the transceiver chip DS34C87 to the RJ45 connector on the high-speed backplane.

[0062] The intelligent main control computer is a multi-core computer or other PC computer with a multi-core processor, with a communication protocol conversion module RT-USB-485-3237, the role of the communication protocol conversion module RT-USB-485-3237 is to convert the USB interface signal of the main control computer into a bus signal that can be received by the transceiver chip DS34C87. The function of the intelligent main control computer is to receive IP network remote networking control information, and to uniformly control the electro-optical conversion dense array sub-card, the highly integrated all-optical switching matrix board, and the photoelectric conversion dense array sub-card. The control content includes controlling the optical fiber data link system to perform system self-check, controlling the optical fiber data link system to perform channel detection, configuring the laser array register parameters, configuring the detector array register parameters, downloading the light routing reconstruction table, and controlling the optical fiber data link system to perform link verification. The main control computer is also responsible for post-processing the collected optical fiber data link system operation data, and uploading the link verification report to the remote operation and maintenance database.

[0063] The highly integrated modularized optical fiber data link system for intelligent reconstruction of the optical domain of the present invention is developed based on a modular concept. If the scale and capacity of the optical fiber data link are to be expanded, it is only necessary to insert more electro-optical conversion dense array sub-cards, optoelectronic conversion dense array sub-cards and highly integrated all-optical exchange matrix boards into the standard VPX chassis. A maximum of 6 electro-optical conversion dense array sub-cards, 6 optoelectronic conversion dense array sub-cards and 6 highly integrated all-optical exchange matrix boards are supported, thereby expanding the scale of the optical fiber data link from 24 optical fiber data links to 144 optical fiber data links, and supporting 144×144 scale non-blocking all-optical exchange.

[0064] like Figure 6 As shown, the present invention also discloses an operation method of an optical domain intelligent reconstruction highly integrated modular optical fiber data link, including the above-mentioned optical domain intelligent reconstruction highly integrated modular optical fiber data link, and the operation method includes the following steps:

[0065] 1) System self-check: Automatically check whether the working status of the intelligent main control computer, electro-optical conversion dense array sub-card, highly integrated VPX standard chassis, optoelectronic conversion dense array sub-card, and highly integrated all-optical switching matrix board is normal, and control the laser array of the electro-optical conversion dense array sub-card, the detector array of the optoelectronic conversion dense array sub-card, and the highly integrated all-optical switching matrix to be in the initialization working mode. If the detected working voltage deviation of 1.0V, 1.2V, 1.8V, 2.5V, and 3.3V is not less than 10%, and the detected chip temperature is lower than 50°C, then the system self-check is normal.

[0066] 2) Channel detection: Switch the highly integrated modular optical fiber data link system supporting intelligent reconstruction in the optical domain to the direct-through state, so that the optical signal of the electro-optical conversion dense array sub-card is directly transmitted to the optoelectronic conversion dense array sub-card, and the detector of the optoelectronic conversion dense array sub-card detects the received optical power. If the optical power received by all detectors is greater than 3dB, the channel detection is normal. The direct-through state refers to the working state in which the 24 input and output channels of the highly integrated all-optical switching matrix are directly connected one by one.

[0067] 3) Configure the laser array: configure the laser array register of the electro-optical conversion dense array daughter card to make the 24-channel laser in working state, the register at address OX 0021 is configured to OX 3F, the register at address OX 0031 is configured to OX 42, the register at address OX 0022 is configured to OX 16, the register at address OX 0033 is configured to OX 21, the register at address OX 0014 is configured to OX 55, and the register at address OX 0053 is configured to OX 23. At this time, the electro-optical conversion dense array daughter card is in 12.75G high-speed electrical signal electro-optical conversion mode.

[0068] 4) Optical domain routing reconstruction: According to the optical routing reconstruction table issued by the intelligent main control computer, the optical routing of the highly integrated all-optical switching matrix board is configured so that the channel laser optical signal corresponding to the electro-optical conversion dense array sub-card is intelligently switched to the channel detector output corresponding to the optoelectronic conversion dense array sub-card.

[0069] 5) Link verification: The link verification code received by the photoelectric conversion dense array sub-card detector array is reported to the intelligent main control computer, and the electro-optical conversion dense array sub-card reports to the intelligent main control computer for verification and verification. If the verification code is correct, the link verification is successful. When performing link verification, the intelligent main control computer will also collect the verification start time, verification completion time, verification code used for verification, optical routing reconstruction table during verification, optical power received by the detector during verification, parameter values ​​of the laser array register configuration during verification, 1.0V, 1.2V, 1.8V, 2.5V, 3.3V working voltage values ​​detected during verification, chip temperature detected during verification, and other information.

[0070] 6) Post-processing: The intelligent main control computer performs post-processing on the configuration information and verification test data of step 5). The main content of the post-processing is to generate a link verification report in the data format required by the operation and maintenance database. The link verification report contains the verification start time, verification completion time, verification code, optical routing reconstruction table during verification, optical power received by the detector during verification, parameter values ​​of the laser array register configuration during verification, 1.0V, 1.2V, 1.8V, 2.5V, 3.3V working voltage values ​​detected during verification, chip temperature detected during verification, and the generated link verification report is uploaded to the remote operation and maintenance database.

[0071] The above embodiments are only specific examples for further describing the purpose, technical solutions and beneficial effects of the present invention, and the present invention is not limited thereto. Any modification, equivalent replacement, improvement, etc. made within the scope of the disclosure of the present invention are included in the protection scope of the present invention.

Claims

1. A highly integrated modular optical fiber data link with intelligent reconstruction in optical domain, characterized by: include A highly integrated optical fiber data link platform based on all-optical switching and electro-optical / photoelectric conversion dense array, the highly integrated optical fiber data link platform comprising an intelligent main control computer, at least one electro-optical conversion dense array daughter card, a highly integrated VPX standard chassis, at least one photoelectric conversion dense array daughter card and at least one highly integrated all-optical switching matrix board card; Among them, the intelligent main control computer is connected to the external network, the electro-optical conversion dense array sub-card and the photoelectric conversion dense array sub-card are connected to the highly integrated VPX standard chassis, and the highly integrated VPX standard chassis is connected to the highly integrated all-optical exchange matrix board card; The intelligent main control computer and the highly integrated VPX chassis are connected via an Ethernet interface; The optical fiber data link platform is composed of highly integrated all-optical switching matrix boards, electro-optical conversion dense array sub-cards, highly integrated VPX standard chassis, and photoelectric conversion dense array sub-cards. Under the control of the main control computer, the optical fiber data link platform realizes the optical domain intelligent reconstruction of the highly integrated modular optical fiber data link based on the high-isolation all-optical switching technology; The highly integrated all-optical switching matrix board realizes 24×24 scale non-blocking all-optical switching, provides optical domain switching channels between the electro-optical conversion dense array sub-card and the photoelectric conversion dense array sub-card, and intelligently changes the optical domain routing state of the optical fiber data link system under the unified control of the intelligent main control computer, and feeds back the current optical routing state parameters to the intelligent main control computer; The electro-optical conversion dense array sub-card realizes electro-optical conversion of 24 channels of 12.75G high-speed electrical signals, and puts the corresponding channel lasers in the laser array into working or low-power dormant state under the unified control of the intelligent main control computer; The photoelectric conversion dense array sub-card realizes the photoelectric conversion of 24 channels of 13.25G high-speed optical signals, and puts the corresponding channel detectors in the detector array into working state or low-power dormant state under the unified control of the intelligent main control computer; The highly integrated VPX standard chassis provides card slots for plugging in electro-optical conversion dense array daughter cards, highly integrated all-optical switching matrix daughter cards and photoelectric conversion dense array daughter cards. All cards inserted into the highly integrated VPX standard chassis realize interconnection and intercommunication of optical and electrical signals through a high-speed backplane. The intelligent main control computer receives IP network remote networking management and control information, and performs unified management and control on the electro-optical conversion dense array sub-card, the highly integrated all-optical exchange matrix board card, and the optoelectronic conversion dense array sub-card.

2. According to claim 1, the optical domain intelligent reconstruction highly integrated modular optical fiber data link is characterized by: The highly integrated all-optical switching matrix board includes an embedded microprocessor and a DA drive control array, a power management unit, a health management unit, and a bus driver connected to the embedded microprocessor; wherein the power management unit and the health management unit are also connected to the DA drive control array and the bus driver, the DA drive control array is connected to the power management unit, the optical routing switching module, the health management unit, and the embedded microprocessor, and the optical routing switching module is connected to the DA drive control array and the optical connector of the electro-optical conversion dense array daughter card and the optical connector of the photoelectric conversion dense array daughter card arranged on the highly integrated all-optical switching matrix board.

3. According to claim 2, the optical domain intelligent reconstruction highly integrated modular optical fiber data link is characterized by: The optical connector of the electro-optical conversion dense array sub-card is a 24-core MT connector optical connector, and the optical connector of the photoelectric conversion dense array sub-card is a 24-core MT connector optical connector; the control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector on the highly integrated all-optical switching matrix board.

4. The optical domain intelligent reconstruction highly integrated modular optical fiber data link according to claim 1, characterized in that: The electro-optical conversion dense array daughter card includes an embedded microprocessor and a field programmable logic device, a power management unit, and a bus driver connected to the embedded microprocessor; wherein the power management unit is also connected to the laser array module, the field programmable logic processor, and the bus driver, and the laser array module is connected to the electro-optical conversion dense array daughter card electrical connector, the electro-optical conversion dense array daughter card optical connector, the power management unit, and the field programmable logic processor.

5. The optical domain intelligent reconstruction highly integrated modular optical fiber data link according to claim 4, characterized in that: The electrical connector of the electro-optical conversion dense array daughter card is an electrical signal connector with a standard VPX connector, and the optical connector of the electro-optical conversion dense array daughter card is an optical signal connector with an MT connector; the control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector on the electro-optical conversion dense array daughter card.

6. The optical domain intelligent reconstruction highly integrated modular optical fiber data link according to claim 1, characterized in that: The photoelectric conversion dense array daughter card includes an embedded microprocessor and a field programmable logic device, a power management unit, and a bus driver connected to the embedded microprocessor; wherein the power management unit is also connected to the detector array module, the field programmable logic processor, the embedded microprocessor, and the bus driver, and the detector array module is connected to the photoelectric conversion dense array daughter card optical connector, the photoelectric conversion dense array daughter card electrical connector, the power management unit, and the field programmable logic processor.

7. The optical domain intelligent reconstruction highly integrated modular optical fiber data link according to claim 6, characterized in that: The electrical connector of the optoelectronic conversion dense array daughter card is an electrical signal connector with a standard VPX connector, and the optical connector of the optoelectronic conversion dense array daughter card is an optical signal connector with an MT connector; the control signal of the bus driver is connected to the highly integrated VPX chassis through the VPX electrical connector on the optoelectronic conversion dense array daughter card.

8. The optical domain intelligent reconstruction highly integrated modular optical fiber data link according to claim 1, characterized in that: The highly integrated VPX chassis includes a high-speed backplane and a VPX frame structure. The high-speed backplane is installed on the VPX structure and is connected to the intelligent main control computer through an RJ45 Ethernet interface. The highly integrated VPX chassis provides 19 board slots. The electro-optical conversion dense array daughter card can be inserted into any slot from 1 to 6; the highly integrated all-optical exchange matrix board card can be inserted into any slot from 7 to 13, among which slot 7 is a required slot; the optoelectronic conversion dense array daughter card can be inserted into any slot from 14 to 19.

9. A method for operating a highly integrated modular optical fiber data link with intelligent reconstruction in the optical domain, characterized in that: Including the above-mentioned optical domain intelligent reconstruction highly integrated modular optical fiber data link, the operation method includes the following steps: 1) System self-check: Automatically check whether the working status of the intelligent main control computer, electro-optical conversion dense array sub-card, highly integrated VPX standard chassis, photoelectric conversion dense array sub-card, and highly integrated all-optical switching matrix board is normal, and control the laser array of the electro-optical conversion dense array sub-card, the detector array of the photoelectric conversion dense array sub-card, and the highly integrated all-optical switching matrix to be in the initialization working mode; 2) Channel detection: Switch the highly integrated modular optical fiber data link system supporting intelligent reconstruction in the optical domain to the through state, so that the optical signal of the electro-optical conversion dense array card is directly transmitted to the optoelectronic conversion dense array card, and the detector of the optoelectronic conversion dense array card detects the received optical power. If the optical power received by all detectors is greater than 3dB, the channel detection is normal; the through state refers to the working state in which the 24 input and output channels of the highly integrated all-optical switching matrix are directly connected one by one; 3) Configure the laser array: configure the laser array register of the electro-optical conversion dense array daughter card to make the 24-channel laser in working state, the register at address OX 0021 is configured to OX 3F, the register at address OX 0031 is configured to OX 42, the register at address OX 0022 is configured to OX 16, the register at address OX 0033 is configured to OX 21, the register at address OX 0014 is configured to OX 55, and the register at address OX 0053 is configured to OX 23. At this time, the electro-optical conversion dense array daughter card is in the 12.75G high-speed electrical signal electro-optical conversion mode; 4) Optical domain routing reconstruction: According to the optical routing reconstruction table issued by the intelligent main control computer, the optical routing of the highly integrated all-optical switching matrix board is configured, so that the laser optical signal of the channel corresponding to the electro-optical conversion dense array sub-card is intelligently switched to the detector output of the channel corresponding to the photoelectric conversion dense array sub-card; 5) Link verification: The link verification code received by the photoelectric conversion dense array sub-card detector array is reported to the intelligent main control computer, and verified with the electro-optical conversion dense array sub-card reported to the intelligent main control computer. If the verification code is correct, the link verification is successful; when performing link verification, the intelligent main control computer will also collect the verification start time, verification completion time, verification code used for verification, optical routing reconstruction table during verification, optical power received by the detector during verification, parameter value of laser array register configuration during verification, working voltage value detected during verification, and chip temperature information detected during verification; 6) Post-processing: The intelligent main control computer performs post-processing on the configuration information and verification test data of step 5).

10. The method for operating a highly integrated modular optical fiber data link with intelligent reconstruction in optical domain according to claim 9, characterized in that: The post-processing in step 6) is to generate a link verification report in accordance with the data format required by the operation and maintenance database; the link verification report content includes the verification start time, verification completion time, verification code used for verification, the optical routing reconstruction table during verification, the optical power received by the detector during verification, the parameter value of the laser array register configuration during verification, the 1.0V, 1.2V, 1.8V, 2.5V, 3.3V operating voltage values ​​detected during verification, and the chip temperature detected during verification, and the generated link verification report is uploaded to the remote operation and maintenance database.

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