Plating apparatus and substrate processing method

Abstract

This invention improves the accuracy of detecting the cleanliness of a substrate support. The plating apparatus includes: a plating tank configured to contain a plating solution; a substrate support (440) having a contact member (494-4) for supplying power to the substrate, and an electrode member (494-6) disposed near the contact member (494-4); a cleaning member having a cleaning nozzle (472a) configured to discharge cleaning solution into the internal region of the substrate support (440) where the contact member (494-4) is disposed; and a power supply (495) configured to connect the contact member (494-4) to the power supply. A voltage is applied between the electrode components (494-6); a galvanometer (496) is configured to measure the current flowing between the contact component (494-4) and the electrode component (494-6); and a control unit (499) activates a detector (497) configured to detect the cleanliness of the internal area of ​​the substrate support (440) based on the current measured by the galvanometer (496) when the internal area of ​​the substrate support (440) is cleaned using a cleaning component.

Description

Technical Field

[0001] This application relates to plating apparatus and substrate processing method. Background Technology

[0002] As an example of a plating apparatus, a cup-type electrolytic plating apparatus is known. In the cup-type electrolytic plating apparatus, a substrate (e.g., a semiconductor wafer) with the plating surface facing downwards and held by a substrate support is immersed in a plating solution. By applying a voltage between the substrate and the anode, a conductive film is deposited on the surface of the substrate.

[0003] For example, Patent Document 1 discloses a plating apparatus configured to clean a substrate support after plating. This plating apparatus includes a cleaning member configured to discharge cleaning fluid to the substrate support after plating, and a tray member disposed below the cleaning member. The plating apparatus is configured to receive the cleaning fluid after cleaning the substrate support using the tray member, and to measure the conductivity of the cleaning fluid flowing in the tray member, thereby detecting the degree of cleanliness of the substrate support.

[0004] Patent Document 1: Japanese Patent No. 7114002

[0005] There is still room for improvement in the detection accuracy of existing plating equipment for enhancing the cleanliness of substrate supports.

[0006] That is, there is a possibility that the cleaning fluid used during substrate cleaning before cleaning the substrate holder may also mix with the cleaning fluid flowing in the tray component. Therefore, if the cleanliness of the substrate holder is detected based on the conductivity of the cleaning fluid flowing in the tray component, as in the prior art, there is a concern that the accuracy will be compromised. In addition, since a specified time has elapsed after the cleaning fluid flowing in the tray component has cleaned the substrate holder, there is a concern that the current cleanliness of the substrate holder cannot be accurately detected in the prior art. Summary of the Invention

[0007] Therefore, one of the objectives of this application is to improve the detection accuracy of the cleanliness of the substrate support.

[0008] According to one embodiment, a plating apparatus is disclosed, comprising: a plating tank configured to contain a plating liquid; a substrate support configured to hold a substrate with the plating surface facing downwards, the substrate support having a contact member for supplying power to the substrate and an electrode member disposed near the contact member; a cleaning member having a cleaning nozzle configured to discharge cleaning liquid into an internal region of the substrate support where the contact member is disposed; a power source configured to apply a voltage between the contact member and the electrode member; a galvanometer configured to measure the current flowing between the contact member and the electrode member; and a control unit configured to activate a detector configured to detect the cleanliness of the internal region of the substrate support based on the current measured by the galvanometer when the internal region of the substrate support is cleaned using the cleaning member. Attached Figure Description

[0009] Figure 1 This is a perspective view showing the overall structure of the plating apparatus of this embodiment.

[0010] Figure 2 This is a top view showing the overall structure of the plating apparatus of this embodiment.

[0011] Figure 3 This is a longitudinal sectional view schematically illustrating the structure of the plating module in this embodiment.

[0012] Figure 4A This is a longitudinal sectional view that is an enlarged and schematic representation of a portion of the structure of the plating module in this embodiment.

[0013] Figure 4B This is a longitudinal sectional view that is an enlarged and schematic representation of a portion of the structure of the plating module in this embodiment.

[0014] Figure 5 This is a diagram showing the current of the electrode components after the internal area of ​​the substrate support has been cleaned.

[0015] Figure 6 This diagram shows the voltage and current of the electrode components after the substrate is mounted on the substrate holder before plating.

[0016] Figure 7 This is a schematic diagram illustrating the substrate processing flow of this embodiment.

[0017] Figure 8 This is a flowchart that details the substrate processing procedure of this embodiment. Detailed Implementation

[0018] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or equivalent constituent elements are labeled with the same reference numerals and repeated descriptions are omitted.

[0019] <Overall Structure of the Plating Equipment>

[0020] Figure 1 This is a perspective view showing the overall structure of the plating apparatus of this embodiment. Figure 2 This is a top view showing the overall structure of the plating apparatus of this embodiment. (e.g.) Figure 1 , 2 As shown, the plating apparatus 1000 includes: a loading port 100, a handling robot 110, an alignment device 120, a pre-dip module 300, a plating module 400, a rotary rinsing and drying device 600, a handling device 700, and a control module 800.

[0021] The loading port 100 is a module used to load substrates stored in a FOUP (not shown) box into the plating apparatus 1000, or to remove substrates from the plating apparatus 1000 into the box. In this embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The handling robot 110 is a robot for handling substrates, configured to transfer substrates between the loading ports 100, the alignment device 120, and the rotary washing and drying device 600. When the handling robot 110 and the handling device 700 transfer substrates, the transfer of substrates can be performed via a temporary stage (not shown).

[0022] Aligner 120 is a module used to align the orientation plane, notch, and other positions of the substrate with a specified direction. In this embodiment, two alignment devices 120 are arranged side by side in the horizontal direction, but the number and arrangement of alignment devices 120 are arbitrary.

[0023] The pre-impregnation module 300 is configured to perform a pre-impregnation process, which involves, for example, etching away high-resistivity oxide films such as those formed on the seed layer surface of the substrate to be plated before plating with a treatment solution such as sulfuric acid or hydrochloric acid, and cleaning or activating the surface of the substrate to be plated. In this embodiment, two pre-impregnation modules 300 are arranged side-by-side in the vertical direction, but the number and arrangement of the pre-impregnation modules 300 are arbitrary. The plating module 400 performs the plating process on the substrate. In this embodiment, there are two sets of twelve plating modules 400, three arranged side-by-side in the vertical direction and four arranged side-by-side in the horizontal direction, for a total of twenty-four plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0024] The rotary rinsing and drying apparatus 600 is a module used to rotate and dry the cleaned substrate at high speed. In this embodiment, two rotary rinsing and drying apparatuses are arranged side by side in the vertical direction, but the number and arrangement of the rotary rinsing and drying apparatuses are arbitrary. The conveying device 700 is a device used to convey the substrate between multiple modules within the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000, and can be configured, for example, by a general-purpose computer or a dedicated computer equipped with an input / output interface for the operator.

[0025] An example of a series of plating processes based on the plating apparatus 1000 will be described. First, a substrate stored in a box is moved into the loading port 100. Next, a handling robot 110 removes the substrate from the box in the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notches, and other positions of the substrate with a predetermined direction. The handling robot 110 then transfers the substrate, which has been aligned by the aligner 120, to the handling device 700.

[0026] The transport device 700 transports the substrate received from the transport robot 110 to the plating module 400. The plating module 400 performs a pre-wetting treatment on the substrate. The transport device 700 then transports the pre-wetted substrate to the pre-impregnation module 300. The pre-impregnation module 300 performs a pre-impregnation treatment on the substrate. The transport device 700 then transports the pre-impregnation treated substrate to the plating module 400. The plating module 400 performs the plating treatment on the substrate. Additionally, the plating module 400 cleans the plating-treated substrate.

[0027] The transport device 700 transports the cleaned substrate to the rotary rinse-dry apparatus 600. The rotary rinse-dry apparatus 600 dries the substrate. The transport robot 110 receives the substrate from the rotary rinse-dry apparatus 600 and transports the dried substrate to a cassette in the loading port 100. Finally, the cassette containing the substrate is removed from the loading port 100.

[0028] <Structure of the plating module>

[0029] Next, the structure of the plating module 400 will be described. Since the twenty-four plating modules 400 in this embodiment have the same structure, only one plating module 400 will be described. Figure 3 This is a longitudinal sectional view schematically illustrating the structure of the plating module 400 in this embodiment. (See attached image.) Figure 3As shown, the plating module 400 includes a plating tank 410 for containing plating solution. The plating tank 410 is a container with cylindrical sidewalls and a circular bottom wall, and a circular opening is formed at the top. Additionally, the plating module 400 includes an overflow channel 405 disposed outside the upper opening of the plating tank 410. The overflow channel 405 is a container for receiving plating solution overflowing from the upper opening of the plating tank 410.

[0030] The plating module 400 includes a diaphragm 420 that separates the interior of the plating tank 410 vertically. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. Plating solution is filled in the cathode region 422 and the anode region 424 respectively. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. A resistor 450 is disposed opposite to the diaphragm 420 in the cathode region 422. The resistor 450 is a component used to achieve uniform plating treatment on the plating surface Wf-a of the circular substrate Wf, and is composed of a plate-shaped component with many holes.

[0031] Additionally, the plating module 400 includes a substrate support 440 for holding the substrate Wf with the plating surface Wf-a facing downwards. The plating module 400 includes a lifting mechanism 442 for raising and lowering the substrate support 440. The lifting mechanism 442 can be implemented, for example, by a known mechanism such as a motor. Furthermore, the plating module 400 includes a rotation mechanism 446 for rotating the substrate support 440, so that the substrate Wf rotates about an imaginary rotation axis extending vertically from the center of the plating surface Wf-a. The rotation mechanism 446 can be implemented, for example, by a known mechanism such as a motor.

[0032] The plating module 400 is configured to apply a voltage between the anode 430 and the substrate Wf while using a lifting mechanism 442 to immerse the substrate Wf in the plating solution of the cathode region 422 and using a rotating mechanism 446 to rotate the substrate Wf, thereby performing a plating process on the plating surface Wf-a of the substrate Wf.

[0033] In addition, the plating module 400 includes a tilting mechanism 447 configured to tilt the substrate support 440. The tilting mechanism 447 can be implemented, for example, by a known mechanism such as a pitching mechanism.

[0034] The plating module 400 includes a cleaning apparatus 470 for cleaning the substrate Wf held on the substrate holder 440 and the substrate holder 440. The cleaning apparatus 470 will be described below.

[0035] <Cleaning Device>

[0036] like Figure 3As shown, the cleaning apparatus 470 includes a cleaning member 472 for cleaning the plated surface Wf-a of the substrate Wf held on the substrate support 440 and the internal region of the substrate support 440. The cleaning member 472 includes a plurality of (two in this embodiment) cleaning nozzles 472a. A cleaning liquid (e.g., pure water) is supplied to the cleaning member 472 from a liquid source not shown, and the cleaning liquid is discharged from the cleaning nozzles 472a.

[0037] The cleaning apparatus 470 includes a drive mechanism 476 configured to rotate an arm 474. The drive mechanism 476 can be implemented using a known mechanism such as a motor. The arm 474 is a plate-shaped member extending horizontally from the drive mechanism 476. A cleaning member 472 is held on the arm 474. The drive mechanism 476 is configured to rotate the arm 474, thereby moving the cleaning member 472 between a cleaning position between the plating tank 410 and the substrate support 440, and a retracted position retracting from the plating tank 410 and the substrate support 440.

[0038] like Figure 3 As shown, the cleaning apparatus 470 includes a tray member 478 disposed below the cleaning member 472. The tray member 478 is configured to receive cleaning fluid discharged from the cleaning member 472 and falling onto the plated surface Wf-a of the cleaning substrate Wf and the internal region of the substrate support 440. In this embodiment, the cleaning member 472 and the arm 474 are entirely housed within the tray member 478. The drive mechanism 476 is configured to rotate the cleaning member 472, the arm 474, and the tray member 478 together between a cleaning position and a retracted position.

[0039] Figure 4A and Figure 4B This is a longitudinal sectional view that is enlarged and schematically shown as a portion of the structure of the plating module in this embodiment. For example... Figure 4A and Figure 4B As shown, the substrate support 440 includes a support mechanism 494 for supporting the outer periphery of the plated surface of the substrate, and a backplate assembly 492 for clamping the substrate together with the support mechanism 494.

[0040] The support mechanism 494 includes an annular support member 494-1 for supporting the outer periphery of the plated surface of the substrate. The support member 494-1 has a flange 494-1a protruding to the lower surface of the backplate assembly 492. An annular sealing member 494-2 is disposed on the flange 494-1a. The sealing member 494-2 is an elastic member. The support member 494-1 supports the outer periphery of the plated surface of the substrate via the sealing member 494-2. The substrate is clamped between the support member 494-1 (substrate support 440) and the substrate by the sealing member 494-2 and the backplate assembly 492, thereby sealing the support member 494-1 (substrate support 440) and the substrate.

[0041] The support mechanism 494 includes an annular base 494-3 mounted on the inner peripheral surface of the support member 494-1. The base 494-3 is, for example, a conductive material such as stainless steel. The support mechanism 494 includes a contact member 494-4 for supplying power to the substrate. The contact member 494-4 is annularly mounted to the inner peripheral surface of the base 494-3 by screws or the like. The support member 494-1 holds the contact member 494-4 via the base 494-3. The contact member 494-4 is a conductive material for supplying power to the substrate held in the substrate support 440.

[0042] The substrate support 440 includes an electrode component 494-6 disposed near the contact component 494-4. The electrode component 494-6 is a conductive annular component. The substrate support 440 includes an annular spacer 494-5 disposed between the contact component 494-4 and the electrode component 494-6. The spacer 494-5 is an insulator. By disposing of the spacer 494-5, the contact component 494-4 and the electrode component 494-6 are insulated.

[0043] The cleaning nozzle 472a is configured to discharge cleaning fluid into the internal region of the substrate support 440, where contact members 494-4 are arranged. For example... Figure 4A and Figure 4B As shown, as an example, the cleaning nozzle 472a can also be configured to discharge cleaning fluid to the inner region of the lower end of the substrate support 440, which is rotated by the rotating mechanism 446 and tilted by the tilting mechanism 447. Alternatively, as an example, the cleaning nozzle 472a can also be configured to discharge cleaning fluid toward the lower surface of the backplate assembly 492, and to direct the cleaning fluid that bounces off the lower surface of the backplate assembly 492 toward the inner region of the substrate support 440.

[0044] The plating module 400 includes a power supply 495 configured to apply voltage between contact member 494-4 and electrode member 494-6, and a galvanometer 496 configured to measure the current flowing between contact member 494-4 and electrode member 494-6. Additionally, the plating module 400 includes a control unit 499 that operates a detector 497 configured to detect the cleanliness of the internal area of ​​the substrate support 440 based on the current measured by the galvanometer 496 when the cleaning member 472 cleans the internal area (contact member 494-4 and sealing member 494-2) of the substrate support 440. The control unit 499 can be configured, for example, as a general-purpose computer or a dedicated computer with an input / output interface for an operator. The detection of the cleanliness of the internal area of ​​the substrate support 440 performed by the detector 497 and the control unit 499 will be described below.

[0045] Figure 5This is a graph showing the current of the electrode components after cleaning the internal area of ​​the substrate support. Figure 5 In the diagram, the horizontal axis represents the passage of time, and the vertical axis represents the current measured by ammeter 496. Additionally, Figure 5 The currents for each of the four cleaning operations performed on the internal region of the substrate support 440 are shown.

[0046] When the substrate Wf is held on the substrate holder 440 and a plating process is performed, there is a possibility that the plating solution leaks from the gap in the sealing member 494-2 into the internal area of ​​the substrate holder 440. In this case, due to the influence of the plating solution, such as... Figure 5 As shown in the current value during the first cleaning, the current value measured by ammeter 496 increases, and as cleaning progresses, the current value measured by ammeter 496 decreases. By activating detector 497, control unit 499 can detect the extent of plating solution present in the cleaning solution within the internal region of substrate support 440, i.e., the progress of the cleaning process, based on the current measured by ammeter 496.

[0047] If the current measured by ammeter 496 is less than a predetermined threshold, the control unit 499 considers that the internal area of ​​the substrate support 440 has been sufficiently cleaned and can end the cleaning process. On the other hand, if the current measured by ammeter 496 is not less than the predetermined threshold after a predetermined number of cleaning processes, the control unit 499 considers that some adverse condition has occurred and can issue an alarm. According to this embodiment, the degree of cleanliness inside the substrate support 440 can be monitored during cleaning, thereby reducing the accumulation of contaminants caused by cleaning residue and its impact on plating quality.

[0048] According to this embodiment, the accuracy of detecting the cleanliness of the substrate holder 440 can be improved. Specifically, in the prior art, the cleanliness of the substrate holder is detected by measuring the conductivity of the cleaning fluid flowing in the tray member 478. However, since the cleaning fluid used during substrate cleaning before cleaning the substrate holder may also mix with the cleaning fluid flowing in the tray member 478, there is a concern that the accuracy of detecting the cleanliness of the substrate holder may be compromised. Furthermore, since a predetermined time has elapsed after the cleaning fluid flowing in the tray member 478 has cleaned the substrate holder, there is a concern that the current cleanliness of the substrate holder cannot be accurately detected in the prior art.

[0049] In contrast, according to this embodiment, the cleanliness of the substrate support 440 is detected using electrode components 494-6 disposed in the internal region of the substrate support 440. Therefore, no cleaning solution used during substrate cleaning is introduced, resulting in improved accuracy in detecting the cleanliness of the substrate support 440. Furthermore, according to this embodiment, since the cleanliness of the substrate support 440 is detected using electrode components 494-6 disposed in the internal region of the substrate support 440, the cleanliness of the substrate support 440 can be detected without time lag, further improving the accuracy in detecting the cleanliness of the substrate support 440.

[0050] like Figure 4A and Figure 4B As shown, the plating module 400 includes a relay member 498 configured to reverse the positive and negative voltage supplied from the power supply 495 to the contact member 494-4 and the electrode member 494-6. The relay member 498 reverses the positive and negative voltages of the contact member 494-4 and the electrode member 494-6 by switching the wires connected to the contact member 494-4 and the electrode member 494-6 to the positive and negative terminals of the power supply 495, respectively. Figure 4A The diagram shows a state where a positive voltage is applied to the electrode component 494-6 and a negative voltage is applied to the contact component 494-4. Figure 4B The diagram shows a state where a negative voltage is applied to the electrode component 494-6 and a positive voltage is applied to the contact component 494-4.

[0051] By reversing the polarity of the voltage supplied from the power supply 495 using the relay member 498, the plating film formed on the contact member 494-4 can be removed, thus preventing the plating film from oxidizing and becoming unusable over time. Specifically, there is concern about plating precipitation on the contact member 494-4 if contamination occurs inside the substrate support 440 due to leakage from the sealing member 494-2 during the plating process. Regarding this, by reversing the polarity of the power supply using the relay member 498 during cleaning of the internal area of ​​the substrate support 440 as in this embodiment, the plating on the surface of the contact member 494-4 can be peeled off. Furthermore, by alternately switching the positive and negative voltage supplied to the contact member 494-4 and the electrode member 494-6 while performing the cleaning process, cleaning of both the contact member 494-4 and the electrode member 494-6 is possible.

[0052] Furthermore, the above description illustrates an example where the control unit 499 detects the cleanliness of the internal region of the substrate holder 440 based on the current measured by the ammeter 496 by activating the detector 497, but this is not a limitation. The control unit 499 may also be configured to detect whether foreign matter has entered the internal region of the substrate holder 440 based on the current measured by the ammeter 496 after the substrate before plating is mounted on the substrate holder 440. This point will be explained below.

[0053] Figure 6 This diagram shows the voltage and current of the electrode components after the substrate, before plating, is mounted on the substrate holder. Figure 6 In (a), the horizontal axis represents the passage of time, and the vertical axis represents the voltage and current of the electrode components. Figure 6 (b) will Figure 6 The portion enclosed by the dashed line in (a) is magnified.

[0054] like Figure 6 As shown in (a) and (b), when foreign matter (e.g., plating solution) is mixed into the internal region of the substrate support 440, the current measured by the ammeter 496 rises sharply after the substrate is mounted on the substrate support 440. If the control unit 499 activates the detector 497 and the current measured by the ammeter 496 is greater than a predetermined threshold, it can issue an alarm indicating that foreign matter has been mixed into the internal region of the substrate support 440. In addition, if the control unit 499 activates the detector 497 and the current measured by the ammeter 496 is greater than a predetermined threshold, it can also reduce the voltage applied to the electrode component 494-6 to prevent plating adhesion to the contact component 494-4.

[0055] Next, the substrate processing method of this embodiment will be described. Figure 7 This is a schematic diagram illustrating the substrate processing flow of this embodiment. (See diagram for example.) Figure 7 As shown, in the substrate processing method, the substrate Wf is mounted on the substrate support 440. Figure 7 (a) Next, the substrate is plated. Figure 7 (b) Next, the plated surface of the substrate Wf after plating is cleaned. Figure 7 (c)). Next, in the substrate processing method, the substrate Wf is removed from the substrate holder 440. Figure 7 (d)), Cleaning substrate support 440 ( Figure 7 (e)).

[0056] Figure 8 This is a flowchart detailing the substrate processing procedure of this embodiment. For example... Figure 8As shown, in the substrate processing method, a voltage is applied between the electrode component 494-6 and the contact component 494-4 (application step S101). Next, in the substrate processing method, the current flowing between the contact component 494-4 and the electrode component 494-6 due to the application step S101 is measured (measurement step S102). Next, in the substrate processing method, the substrate Wf is mounted on the substrate support 440 (S103).

[0057] Next, in the substrate processing method, the detector 497 is activated to detect whether foreign matter has entered the internal area of ​​the substrate support 440 based on the current measured in step S102 during step S103 (foreign matter detection step S104). The foreign matter detection step S104 can be executed using the control unit 499. In the substrate processing method, if the current measured in step S102 is greater than a predetermined threshold, an alarm can be issued as if foreign matter has entered the internal area of ​​the substrate support 440.

[0058] Next, in the substrate processing method, the substrate support 440 is lowered so that the substrate Wf is immersed in the plating solution, and the substrate Wf is plated (plating step S105). If the plating process is completed, in the substrate processing method, the substrate support 440 is raised and the plated surface of the substrate Wf is cleaned using the cleaning unit 472 (substrate cleaning step S106).

[0059] Next, in the substrate processing method, the substrate Wf is removed from the substrate holder 440 (step S107). Next, in the substrate processing method, the substrate holder 440 is tilted using the tilting mechanism 447 (tilting step S108). Next, in the substrate processing method, the substrate holder 440 is rotated using the rotation mechanism 446 (rotation step S109). Furthermore, the tilting step S108 and the rotation step S109 can also be performed during the substrate cleaning step S106.

[0060] Next, in the substrate processing method, a voltage is applied between the electrode member 494-6 and the contact member 494-4 (application step S110). Next, in the substrate processing method, the current flowing between the contact member 494-4 and the electrode member 494-6 by applying step S110 is measured (measurement step S111).

[0061] Next, in the substrate processing method, cleaning fluid is discharged from the inner region of the lower end of the substrate support 440, which is rotated by the rotation step S109 and tilted by the tilting step S108 (cleaning step S112).

[0062] Next, in the substrate processing method, the detector 497 is activated to detect the cleanliness of the internal region of the substrate support 440 based on the current measured in measurement step S111 during cleaning step S112 (cleanliness detection step S113). Cleanliness detection step S113 can be executed using the control unit 499. According to the substrate processing method of this embodiment, the cleanliness of the substrate support 440 is detected using electrode members 494-6 disposed in the internal region of the substrate support 440, thus improving the detection accuracy of the cleanliness of the substrate support 440. In the substrate processing method, if the current measured in measurement step S111 is not lower than a predetermined threshold after a predetermined number of cleaning processes, it is considered that some defect has occurred, and therefore an alarm can be issued.

[0063] Next, in the substrate processing method, the voltage supplied to the contact member 494-4 and the electrode member 494-6 during the cleaning step S112 is reversed (switching step S114). As in this embodiment, the relay member 498 is used to reverse the power supply during cleaning, thereby enabling the plating on the surface of the contact member 494-4 to be peeled off. In addition, by alternately switching the positive and negative voltage supplied to the contact member 494-4 and the electrode member 494-6 while performing the cleaning process, the contact member 494-4 and the electrode member 494-6 can be cleaned.

[0064] Furthermore, the cleaning nozzle 472a can also be configured to supply various cleaning liquids. For example, it can supply a liquid (such as pure water) intended to remove contaminants within the substrate support 440 and reduce conductivity, and it can supply a stripping solution (stripping liquid) that promotes the peeling of the plating film on the surface of the contact member 494-4. During the switching step S114, if pure water is supplied to the substrate support 440, and the conductivity of the liquid remaining inside the substrate support 440 (internal liquid) becomes too low, the current cannot flow sufficiently between the contact member 494-4 and the electrode member 494-6, and the solubility of metal ions also decreases. Therefore, if a large amount of plating precipitates on the surface of the contact member 494-4, there is a concern that the plating film cannot be sufficiently peeled off. During the switching step S114, a stripping liquid that improves the conductivity of the internal liquid and the solubility of metal ions is supplied, thereby enabling efficient peeling of the plating film on the surface of the contact member 494-4. As the stripping liquid used at this time, a dilute solution of an acid or complexing agent capable of dissolving the oxides of the plating metal can be used. From the viewpoint of reducing the risk of contamination caused by the cleaning solution mixing into the plating solution, the type of acid and complexing agent used is preferably selected from the main components constituting the plating solution. For example, in the case of copper sulfate plating solution, dilute sulfuric acid is preferably used as the stripping solution. After the plating film has been sufficiently stripped, the switching step S114 is stopped, the cleaning solution is switched to pure water, and the series of steps from application step S110 to detection step S113 are performed again, thereby driving away the stripping solution supplied into the substrate support 440.

[0065] Several embodiments of the present invention have been described above. However, these embodiments are provided for ease of understanding and are not intended to limit the invention. The present invention can certainly be modified and improved without departing from its spirit, and equivalents are also included. Furthermore, within the scope of solving at least a portion of the above-mentioned problems, or within the scope of achieving at least a portion of the effects, any combination or omission of the constituent elements described in the claims and specification is possible.

[0066] As one embodiment, this application discloses a plating apparatus, comprising: a plating tank configured to contain a plating liquid; a substrate support configured to hold a substrate with the plating surface facing downwards, the substrate support having a contact member for supplying power to the substrate and an electrode member disposed near the contact member; a cleaning member having a cleaning nozzle configured to discharge cleaning liquid into the internal region of the substrate support where the contact member is disposed; a power source configured to apply a voltage between the contact member and the electrode member; a galvanometer configured to measure the current flowing between the contact member and the electrode member; and a control unit configured to activate a detector configured to detect the cleanliness of the internal region of the substrate support based on the current measured by the galvanometer when the internal region of the substrate support is cleaned using the cleaning member.

[0067] In addition, as an embodiment, this application discloses a plating apparatus, which further includes a relay component configured to reverse the positive and negative voltage supplied from the power source to the contact component and the electrode component.

[0068] In addition, as an embodiment, this application discloses a plating apparatus in which the control unit further activates the detector to detect whether foreign matter has entered the internal area of ​​the substrate support based on the current measured by the ammeter after the substrate before plating is mounted on the substrate support.

[0069] In addition, as an embodiment, this application discloses a plating apparatus, which further includes a tilting mechanism configured to tilt the substrate support and a rotating mechanism configured to rotate the substrate support. The cleaning member is configured to discharge cleaning fluid into the inner region of the lower end of the substrate support, which is rotated by the rotating mechanism and tilted by the tilting mechanism.

[0070] In addition, as one embodiment, this application discloses a substrate processing method, which includes: a step of mounting a substrate on a substrate holder having contact members; a plating step of plating the substrate mounted on the substrate holder; a step of removing the substrate from the substrate holder after the plating step; a cleaning step of draining cleaning fluid from the internal region of the substrate holder where the contact members are disposed; an application step of applying a voltage between an electrode member disposed near the contact member and the contact member; a measurement step of measuring the current flowing between the contact member and the electrode member through the application step; and a cleaning degree detection step of activating a detector, wherein the detector is configured to detect the cleaning degree of the internal region of the substrate holder based on the current measured by the measurement step during the cleaning step.

[0071] In addition, as an embodiment, this application discloses a substrate processing method, which further includes a switching step in which the positive and negative voltages supplied to the contact member and the electrode member through the application step are reversed during the cleaning step.

[0072] In addition, as an embodiment, this application discloses a substrate processing method in which the above-mentioned application step and measurement step are also performed in the step of mounting the substrate on the substrate support. The substrate processing method further includes a foreign matter detection step, in which the detector is activated to detect whether foreign matter has entered the internal area of ​​the substrate support based on the current measured by the above-mentioned measurement step when the step of mounting the substrate on the substrate support is performed.

[0073] In addition, as an embodiment, this application discloses a substrate processing method, which further includes a tilting step of tilting the substrate support and a rotating step of rotating the substrate support. The cleaning step is configured to discharge cleaning fluid into the inner region of the lower end of the substrate support, which has been rotated by the rotating step and tilted by the tilting step.

[0074] Explanation of reference numerals in the attached figures

[0075] 400…plating module; 410…plating tank; 430…anode; 440…substrate support; 446…rotating mechanism; 447…tilting mechanism; 450…resistor; 470…cleaning device; 472…cleaning component; 472a…cleaning nozzle; 494-4…contact component; 494-5…spacer; 494-6…electrode component; 495…power supply; 496…ammeter; 497…detector; 498…relay component; 499…control unit; 1000…plating device; Wf…substrate; Wf-a…plated surface.

Claims

1. A plating apparatus characterized by comprising: comprises: a plating bath configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a plating surface facing downward, the substrate holder having a contact member for supplying power to the substrate and an electrode member disposed in the vicinity of the contact member; a cleaning member having a cleaning nozzle configured to discharge a cleaning solution to an inner region of the substrate holder in which the contact member is disposed; a power source configured to apply a voltage between the contact member and the electrode member; a current meter configured to measure a current flowing between the contact member and the electrode member; a control unit that causes a detector to operate, the detector being configured to detect a degree of cleaning of the inner region of the substrate holder based on the current measured by the current meter when the inner region of the substrate holder is cleaned using the cleaning member; and a relay member configured to reverse the polarity of the voltage supplied from the power source to the contact member and the electrode member.

2. The plating apparatus according to claim 1, wherein the control unit causes the detector to further operate to detect whether or not a foreign object is mixed into the inner region of the substrate holder based on the current measured by the current meter after a substrate before plating processing is mounted on the substrate holder. further comprising:

3. The plating apparatus according to claim 2, wherein a tilting mechanism configured to tilt the substrate holder; and a rotating mechanism configured to rotate the substrate holder, the cleaning member being configured to discharge the cleaning solution to an inner region of a lower end of the substrate holder that is rotated by the rotating mechanism and tilted by the tilting mechanism. comprises: a step of mounting a substrate on a substrate holder having a contact member; 4. A substrate processing method characterized by, a plating step of performing plating processing on the substrate mounted on the substrate holder; a step of detaching the substrate from the substrate holder after the plating step; a cleaning step of discharging a cleaning solution to an inner region of the substrate holder in which the contact member is disposed; an application step of applying a voltage between an electrode member disposed in the vicinity of the contact member and the contact member; a measurement step of measuring a current flowing between the contact member and the electrode member by the application step; a degree-of-cleaning detection step of causing a detector to operate, the detector being configured to detect a degree of cleaning of the inner region of the substrate holder based on the current measured by the measurement step when the cleaning step is performed; and a switching step of reversing the polarity of the voltage supplied to the contact member and the electrode member by the application step when the cleaning step is performed.

5. The substrate processing method according to claim 4, wherein the application step and the measurement step are also performed in the step of mounting the substrate on the substrate holder, ​ ​ The substrate processing method further includes a foreign matter detection step in which the detector is operated to detect whether or not foreign matter has intruded into the inner region of the substrate holder based on the current measured by the measurement step when the step of mounting the substrate on the substrate holder is performed.

6. The substrate processing method according to claim 5, wherein Further comprising: a tilting step of tilting the substrate holder, and a rotating step of rotating the substrate holder, the cleaning step is configured to discharge the cleaning liquid to the inner region of the lower end of the substrate holder that is rotated by the rotating step and tilted by the tilting step.

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