Semiconductor packaging device and method

Abstract

The present invention discloses a semiconductor packaging equipment and method, which relates to the technical field of semiconductor devices, and aims to solve the technical problem that when a rib cutting machine continuously cuts a semiconductor lead frame in a semiconductor packaging process, the cutting edge of the cutting knife is easily worn and the shape may change, thereby affecting the cutting accuracy. The present invention comprises a rib cutting machine body, the rib cutting machine body comprises an operating table, and the top surface of the operating table is arranged with an alternating cutting component and a maintenance component, and the maintenance component comprises a lifting plate, the bottom surface of the lifting plate is arranged with a lifting component, and the top surface of the lifting plate is arranged with a reciprocating translation component and a grinding component. The present invention has two groups of semiconductor cutting knives that can alternately perform cutting work, so that the semiconductor cutting knives that work for a long time can enter an idle state, and the other group of semiconductor cutting knives enter a working state, which not only ensures the continuous progress of the cutting work, but also can grind and maintain the semiconductor cutting knives in an idle state through the grinding component.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more particularly to a semiconductor packaging device and method. Background Art

[0002] Semiconductor packaging equipment refers to a general term for various types of professional equipment used for chip pasting and fixing, wire bonding, plastic sealing, electroplating, testing, marking and cutting, as well as a series of operations such as advanced packaging processes, such as flip chip packaging and 3D packaging, during the semiconductor packaging process. In semiconductor packaging, multiple chips are usually connected to the same lead frame through connecting ribs and packaged at the same time. The rib cutting machine can cut off the connecting ribs to separate these interconnected packages into single, independently usable chip packages, which is convenient for subsequent installation and application.

[0003] Existing rib cutting machines are usually equipped with high-quality cutting tools to adapt to continuous cutting operations and maintain good cutting performance; however, when the cutting tool continues to perform cutting operations, the continuous friction between the cutting tool and the lead frame may still cause the cutting tool's edge to gradually wear out and become less sharp. In addition, the continuous friction between the cutting tool and the lead frame is likely to generate high temperature, causing the cutting tool's edge angle and shape to change, thereby affecting the cutting accuracy. In view of this, we propose a semiconductor packaging device and method. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor packaging device and method to solve the technical problem that in the semiconductor packaging process, when a rib cutting machine continuously cuts the semiconductor lead frame, the cutting edge of the cutting knife is easily worn and the shape may change, thereby affecting the cutting accuracy.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a semiconductor packaging equipment, including a rib cutting machine body, the rib cutting machine body includes an operating table, the top surface of the operating table is arranged with an alternating cutting component and a maintenance component; the top surface of the operating table is provided with an equipment slot; the alternating cutting component includes a ring plate, the ring plate is connected to the top surface of the operating table through a plurality of supporting columns, the top surface of the ring plate is movably connected with a rotating plate, the top surface of the rotating plate is symmetrically arranged with two hydraulic cylinders 1, two groups of semiconductor cutting knives are symmetrically arranged below the rotating plate, the output end of the hydraulic cylinder 1 passes through the bottom surface of the rotating plate and is connected to the semiconductor cutting knife; the bottom surface of the rotating plate is connected with a rotating column, the bottom of the rotating column is rotatably connected to the top surface of the operating table through a rotating bearing, A gear is arranged on the circumferential outer wall of the rotating column, a support plate is arranged on the side of the rotating column, a hydraulic cylinder 2 is arranged on the top surface of the support plate, and the output end of the hydraulic cylinder 2 is connected to a tooth plate meshing with the gear; the two groups of semiconductor cutting knives have alternating working states, when one group of semiconductor cutting knives cuts the lead frame, the other group of semiconductor cutting knives is in an idle state; the maintenance component is arranged under one group of semiconductor cutting knives in an idle state; the maintenance component includes a lifting plate arranged above the operating table, a lifting component is arranged on the bottom surface of the lifting plate, and a reciprocating translation component and a grinding component are arranged on the top surface of the lifting plate; the grinding component is used to perform grinding and maintenance on the semiconductor cutting knives in the idle state.

[0006] Preferably, the top surface of the ring plate is connected with a sliding ridge, the ring plate is a circular hollow plate-like structure, the sliding ridge is a circular strip structure, the bottom surface of the rotating plate is provided with a sliding groove that matches the sliding ridge, and the rotating plate rotatably cooperates with the ring plate through the sliding groove; the support plate is connected to the top surface of the operating table, the top surface of the support plate is provided with a sliding groove, the cross-section of the sliding groove is an inverted T-shaped structure, the tooth plate is arranged on the top surface of the support plate, the bottom surface of the tooth plate is connected with a sliding bar that matches the sliding groove, the cross-section of the sliding bar is a T-shaped structure, and the tooth plate slidably cooperates with the top surface of the support plate through the sliding bar.

[0007] Preferably, the semiconductor cutting knife consists of a plate frame and a plurality of cutting blades, the top surface of the plate frame is connected to an output end of the hydraulic cylinder, the plurality of cutting blades are arranged on the bottom surface of the plate frame, and the plurality of cutting blades correspond to the positions of the connecting ribs of the lead frame.

[0008] Preferably, circular plates of the same structure are connected to the four corners of the lifting plate, a sliding rod connected to the top surface of the operating table passes through the circular plate from top to bottom, and the circular plate is slidably matched with the sliding rod.

[0009] Preferably, the lifting assembly includes a motor 1, a first support, a second support and a third support arranged on the bottom surface of the equipment slot, the output end of the motor 1 is connected to a screw rod, the screw rod is rotatably arranged between the first support and the second support, the circumferential outer wall of the screw rod is threadedly connected to a moving block, the symmetrical two side walls of the moving block are connected to moving rods of the same structure, the end of the moving rod is rotatably connected to the first lifting rod, the top of the first lifting rod is rotatably connected to the lifting block, the side wall of the third support is rotatably connected to the second lifting rod, the side wall of the second lifting rod is rotatably matched with the side wall of the first lifting rod, the top of the second lifting rod is rotatably connected to an adjusting rod, the side wall of the lifting block is provided with an adjusting groove, the adjusting rod is arranged in the adjusting groove, and the adjusting rod is slidably matched with the adjusting groove; the top surface of the lifting block is connected to the bottom surface of the lifting plate.

[0010] Preferably, the reciprocating translation assembly includes a fixed seat 1 and a fixed seat 2 connected to the top surface of the lifting plate, a motor 2 is arranged on the top surface of the fixed seat 1, an output end of the motor 2 passes through a side wall of the fixed seat and is connected to a rotating rod, a swing rod is rotatably connected to the end of the rotating rod, a push-pull rod is rotatably connected to the end of the swing rod, a fixed cylinder is arranged on the top surface of the fixed seat 2, the push-pull rod passes through the side wall of the fixed cylinder and slidably cooperates with the fixed cylinder.

[0011] Preferably, the grinding assembly includes a main bracket connected to the top surface of the lifting plate and multiple side brackets, and the side brackets are arranged on the side of the main bracket; a fixed bottom plate connected to the end of the push-pull rod is arranged above the main bracket, and the top surface of the main bracket is provided with multiple wheel rails 1, and the bottom surface of the fixed bottom plate is connected with multiple rollers 1 that match the wheel rails 1, and the top surface of the fixed bottom plate is provided with multiple wheel rails 2, and the bottom surface of the side bracket is connected with multiple rollers 2 that match the wheel rails 2; the top surface of the fixed bottom plate is also arranged with multiple groups of grinding plate assemblies arranged in an array.

[0012] Preferably, the grinding plate assembly includes a grinding frame plate connected to the top surface of the fixed base plate, and two lubricating paste bins are formed inside the grinding frame plate through a middle partition plate; two grinding plates are arranged at the upper end of the inner cavity of the lubricating paste bin, and the two grinding plates are symmetrically distributed on the inner side wall of the lubricating paste bin, the side walls of the grinding plates are connected with rotating columns, and the side walls of the grinding frame plates are connected with fixed blocks, the rotating columns penetrate the side walls of the fixed blocks and rotate with the side walls of the fixed blocks, and the grinding plates rotate with the inner side walls of the lubricating paste bin through the rotating columns; the grinding plates are connected to the inner side walls of the lubricating paste bin by a plurality of springs, and a blade grinding area is formed between the two grinding plates, and the blade grinding area is shaped to match the blade edge of the cutting blade, and the side walls of the grinding plates are configured to have a granular structure of grinding material for grinding the blade edge of the cutting blade.

[0013] Preferably, the symmetrical two side walls of the grinding frame plate are provided with adjustment plates of the same structure, and the inner cavity of the lubricating grease bin is provided with two mutually symmetrical clamping plates, the ends of the clamping plates are arranged on the top surface of the adjustment plates, and the area between the two clamping plates is used to place the lubricating grease; wherein, the top surface of the adjustment plate is provided with a plurality of sliding convex plates, and the bottom surface of the end of the clamping plate is provided with a groove that fits with the sliding convex plate, and the end of the clamping plate slides with the sliding convex plate through the groove; a plurality of plugs are connected to the side wall at the end of one of the clamping plates, and the plugs pass through the side wall of the adjustment plate and slide with the side wall of the adjustment plate, and the circumferential outer wall of the plug is sleeved with spring 2, and the spring 2 is arranged between the side wall of the clamping plate and the side wall of the adjustment plate; the side wall at the end of another clamping plate is connected to the side wall at the end of another clamping plate in the lubricating grease bin through spring 3.

[0014] A method for using a semiconductor packaging device, characterized in that it comprises the following steps:

[0015] S1, rib cutting operation, the lead frame is transported to the bottom of the semiconductor cutting knife through the transmission device of the rib cutting machine body, and the semiconductor cutting knife is driven downward by the hydraulic cylinder, so that the cutting blade of the semiconductor cutting knife cuts off the connecting ribs on the lead frame, so that multiple packaged chips connected to each other on the lead frame are separated into single packaged chips;

[0016] S2, alternating cutting operation, when one set of semiconductor cutting knives has been working for a long time, the hydraulic cylinder 2 works to drive the tooth plate to move forward on the support plate, the tooth plate drives the gear to rotate, further drives the rotating column to rotate, and the rotating column drives the rotating plate to rotate, so that the positions of the two sets of semiconductor cutting knives are interchanged, the semiconductor cutting knives that have been working for a long time enter the idle state, and the other set of semiconductor cutting knives enter the working state, forming alternating cutting;

[0017] S3, grinding operation, through the operation of motor 1, drives the screw rod to rotate, the screw rod drives the moving block and the moving rod to move forward, the moving rod pushes the bottom end of the first lifting rod to move forward, the first lifting rod cooperates with the second lifting rod to drive the lifting block to rise, the lifting block drives the lifting plate to rise, the lifting plate drives the reciprocating translation assembly and the grinding assembly to rise, until the cutting blade of the semiconductor cutting knife enters the blade grinding area between the two grinding plates of the grinding assembly, and makes the two grinding plates close to both sides of the cutting blade, and then drives the rotating rod to rotate through the operation of motor 2, the rotating rod drives the swing rod to swing and drives the push-pull rod to reciprocate on the fixed cylinder, the push-pull rod drives the fixed bottom plate to reciprocate on the top surface of the main bracket, the fixed bottom plate drives the grinding plate to perform reciprocating friction motion relative to the blade side wall of the cutting blade, grinds the blade of the cutting blade, removes the worn part of the cutting edge, and restores the sharpness of the cutting blade;

[0018] S4, apply lubricating paste operation. After the grinding is completed, the lifting assembly continues to perform the lifting operation, driving the lifting plate to rise until the blade of the cutting blade presses the two grinding plates downward in the blade grinding area and enters the lubricating paste bin under the two grinding plates. The lubricating paste in the lubricating paste bin comes into contact with the blade of the cutting blade. Then, the reciprocating translation assembly continues to drive the fixed bottom plate to move back and forth on the top surface of the main bracket, so that the lubricating paste and the blade of the cutting blade are rubbed back and forth, and the lubricating paste is evenly applied on the blade of the cutting blade. After completion, the lifting assembly is lowered to drive the grinding assembly to descend and separate from the cutting blade, thereby completing the maintenance operation on the cutting blade.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention provides two groups of semiconductor cutting knives that can perform cutting work alternately. When one group of semiconductor cutting knives has been working for a long time, the hydraulic cylinder 2 works to drive the tooth plate to move forward on the support plate, and the tooth plate drives the gear to rotate, further drives the rotating column to rotate, and the rotating column drives the rotating plate to rotate, so that the positions of the two groups of semiconductor cutting knives are interchanged. The semiconductor cutting knives that have been working for a long time enter an idle state, and the other group of semiconductor cutting knives enter a working state. This not only ensures the continuous progress of the cutting work, but also avoids the situation where the semiconductor cutting knives are easily damaged by load due to long-term work. It solves the problem that when the semiconductor cutting knives are working for a long time, the continuous friction with the lead frame is likely to generate high temperature, which may cause the angle and shape of the blade of the semiconductor cutting knives to change, thereby affecting the cutting accuracy.

[0021] 2. The present invention also provides a maintenance component. When the positions of the two groups of semiconductor cutting knives are interchanged, the semiconductor cutting knives that have been working for a long time enter an idle state. The lifting plate is driven up by the lifting component, and the grinding component is driven to move back and forth by the reciprocating translation component, so that the grinding component can grind the cutting blade of the semiconductor cutting knife in the idle state, remove the worn part of the cutting blade edge, restore the sharpness of the cutting blade, and improve the cutting ability and efficiency of the cutting blade. The two groups of semiconductor cutting knives can work alternately while the semiconductor cutting knives in the idle state can be maintained, which does not affect the cutting operation and can effectively improve the cutting effect of the semiconductor cutting knife.

[0022] 3. In the present invention, when the cutting blade enters the blade grinding area, the grinding plate is acted upon by the elastic force of spring 1, and the grinding plate can rotate inward along the side wall of the lubricating paste bin through the rotating column, so that the two grinding plates can be tightly attached to the side wall of the blade of the cutting blade, which is beneficial for the grinding plate to effectively grind the blade of the cutting blade, so that the blade of the cutting blade is ground more evenly, further improving the grinding effect.

[0023] 4. The present invention arranges two clamping plates in the inner cavity of the lubricating paste bin, and the area between the two clamping plates is used to place the lubricating paste. When grinding is completed, the lifting operation is continued through the lifting assembly to drive the lifting plate to rise until the blade of the cutting blade presses the two grinding plates downward in the blade grinding area and enters the lubricating paste bin below the two grinding plates. The lubricating paste in the lubricating paste bin comes into contact with the blade of the cutting blade, and then the reciprocating translation assembly continues to drive the fixed bottom plate to move back and forth on the top surface of the main bracket, so that the lubricating paste and the blade of the cutting blade reciprocate and rub. The lubricating paste is evenly applied on the blade of the cutting blade. The lubricating paste will form a lubricating film on the blade of the cutting blade, which effectively reduces the friction coefficient between the cutting blade and the material during cutting, reduces the degree of damage to the cutting blade caused by friction, and extends the service life of the tool.

[0024] 5. The present invention clamps the lubricating paste by two clamping plates, and the volume of the lubricating paste gradually decreases during use. Due to the elastic force of spring 2 of one of the clamping plates, it can slide along the sliding convex plate on the top surface of the adjusting plate toward the lubricating paste. The other clamping plate and the clamping plate in another lubricating paste bin slide along the sliding convex plate toward the lubricating paste through the elastic force generated by spring 3. The two clamping plates clamp and center the lubricating paste, so that the lubricating paste always maintains a centered position in the lubricating paste bin, thereby ensuring that the blade of the cutting blade can always fully contact the lubricating paste after entering the lubricating paste bin under the two grinding plates, thereby improving the effect of applying the lubricating paste to the cutting blade and avoiding the problem of uneven application due to insufficient contact between the lubricating paste and the cutting blade. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the structure of the alternating cutting assembly of the present invention;

[0027] Figure 3 It is a schematic diagram of the structure below the rotating plate of the present invention;

[0028] Figure 4 It is a schematic diagram of the semiconductor cutting knife and lead frame structure of the present invention;

[0029] Figure 5 It is a schematic diagram of the structure of the maintenance component of the present invention;

[0030] Figure 6 It is a schematic diagram of the structure of the lifting assembly of the present invention;

[0031] Figure 7 It is a schematic diagram of the structure of the reciprocating translation assembly of the present invention;

[0032] Figure 8It is a schematic diagram of the structure of the grinding assembly of the present invention;

[0033] Fig. 9 It is a schematic diagram of the structure of the grinding plate assembly of the present invention;

[0034] Fig.10 It is a schematic diagram of the disassembly structure of the grinding plate assembly of the present invention;

[0035] Fig.11 It is a schematic diagram of the side view structure of the grinding plate assembly of the present invention;

[0036] Fig.12 It is an enlarged schematic diagram of the structure of point A of the grinding plate assembly of the present invention;

[0037] Fig.13 It is an enlarged schematic diagram of the point B structure of the grinding plate assembly split structure of the present invention;

[0038] Fig.14 The figure is a schematic diagram of a use state of the grinding plate assembly of the present invention.

[0039] 1. Main body of the cutting machine; 2. Operating table; 3. Alternating cutting assembly; 4. Maintenance assembly; 5. Lead frame;

[0040] 201, equipment slot;

[0041] 301, ring plate; 3011, sliding convex strip; 302, support column; 303, rotating plate; 3031, slide groove; 304, hydraulic cylinder 1; 305, semiconductor cutting knife; 3051, plate rack; 3052, cutting blade; 306, rotating column; 307, gear; 308, support plate; 3081, sliding groove; 309, hydraulic cylinder 2; 310, tooth plate;

[0042] 41. Lifting plate; 42. Lifting assembly; 43. Reciprocating translation assembly; 44. Grinding assembly;

[0043] 4101, round plate; 4102, slide bar;

[0044] 4201, motor 1; 4202, first support; 4203, second support; 4204, third support; 4205, screw rod; 4206, moving block; 4207, moving rod; 4208, first lifting rod; 4209, lifting block; 4210, second lifting rod; 4211, adjustment rod; 4212, adjustment slot;

[0045] 4301, fixed seat 1; 4302, fixed seat 2; 4303, motor 2; 4304, rotating rod; 4305, swing rod; 4306, push-pull rod; 4307, fixed cylinder;

[0046] 4401, main support; 4402, side support; 4403, fixed bottom plate; 4404, wheel track 1; 4405, roller 1; 4406, wheel track 2; 4407, roller 2; 4408, grinding plate assembly;

[0047] 440801, grinding frame plate; 440802, middle partition plate; 440803, lubricating grease bin; 440804, grinding plate; 440805, rotating column; 440806, fixing block; 440807, spring one; 440808, adjusting plate; 440809, sliding convex plate; 440810, clamping plate; 440811, plug column; 440812, spring two; 440813, spring three. DETAILED DESCRIPTION

[0048] Embodiment 1, as Figures 1 to 14 As shown, the present invention relates to a semiconductor packaging device, including a rib cutting machine body 1, the rib cutting machine body 1 includes an operating table 2, the top surface of the operating table 2 is arranged with an alternating cutting component 3 and a maintenance component 4, and the top surface of the operating table 2 is provided with an equipment slot 201, wherein the rib cutting machine body 1 is the existing technology in the example and will not be described in detail.

[0049] In an embodiment of the present invention, the alternating cutting assembly 3 includes a ring plate 301, which is connected to the top surface of the operating table 2 through four support columns 302. The top surface of the ring plate 301 is movably connected to a rotating plate 303. Two hydraulic cylinders 304 are symmetrically arranged on the top surface of the rotating plate 303. Two groups of semiconductor cutting knives 305 are symmetrically arranged below the rotating plate 303. The output end of the hydraulic cylinder 304 passes through the bottom surface of the rotating plate 303 and is connected to the semiconductor cutting knife 305. The semiconductor cutting knife 305 is composed of a plate frame 3051 and a plurality of cutting blades 3052. The top surface of the plate frame 3051 is connected to the hydraulic cylinder 304. The output end of the rotating plate 303 is connected to the first output end 304, and a plurality of cutting blades 3052 are arranged on the bottom surface of the plate frame 3051, and the plurality of cutting blades 3052 correspond to the connection rib positions of the lead frame 5; the bottom surface of the rotating plate 303 is connected to the rotating column 306, and the bottom of the rotating column 306 is rotatably connected to the top surface of the operating table 2 through a rotating bearing, and a gear 307 is arranged on the outer wall of the rotating column 306, and a support plate 308 is arranged on the side of the rotating column 306, and a hydraulic cylinder 2 309 is arranged on the top surface of the support plate 308, and the output end of the hydraulic cylinder 2 309 is connected to a toothed plate 310 meshing with the gear 307; two sets of semi-circular The conductor cutting blades 305 have an alternate working state. When one set of semiconductor cutting blades 305 is cutting the lead frame 5, the other set of semiconductor cutting blades 305 is in an idle state. The present invention provides two sets of semiconductor cutting blades 305 that can perform cutting work alternately. When one set of semiconductor cutting blades 305 has been working for a long time, the hydraulic cylinder 2 309 works to drive the tooth plate 310 to move forward on the support plate 308. The tooth plate 310 drives the gear 307 to rotate, further drives the rotating column 306 to rotate, and the rotating column 306 drives the rotating plate 303 to rotate, so that the two sets of semiconductor cutting blades 305 can be used for cutting. The positions of the two groups of semiconductor cutting knives 305 are interchanged. The semiconductor cutting knives 305 that have been working for a long time enter an idle state, and the other group of semiconductor cutting knives 305 enter a working state. This not only ensures the continuous progress of the cutting work, but also avoids the semiconductor cutting knives 305 from being easily overloaded due to long-term work, which may cause damage to the semiconductor cutting knives 305. This solves the problem that when the semiconductor cutting knives 305 are performing cutting work for a long time, the continuous friction with the lead frame 5 may easily generate high temperature, which may cause the blade angle and shape of the semiconductor cutting knives 305 to change, thereby affecting the cutting accuracy.

[0050] As another embodiment of the present invention, the top surface of the ring plate 301 is connected with a sliding ridge 3011, the ring plate 301 is a circular hollow plate structure, the sliding ridge 3011 is a circular strip structure, and the bottom surface of the rotating plate 303 is provided with a sliding groove 3031 that matches the sliding ridge 3011. The rotating plate 303 rotates with the ring plate 301 through the sliding groove 3031. When the rotating plate 303 rotates, it can slide along the sliding ridge 3011 on the top surface of the ring plate 301. The sliding ridge 3011 limits the rotation track of the rotating plate 303, thereby ensuring the stability and accuracy of the rotation of the rotating plate 303 and avoiding position deviation when the rotating plate 303 rotates. The difference leads to the problem of inaccurate positions of the two sets of semiconductor cutting knives 305 that interchange positions; the support plate 308 is connected to the top surface of the operating table 2, and a sliding groove 3081 is provided on the top surface of the support plate 308. The cross section of the sliding groove 3081 is an inverted T-shaped structure. The tooth plate 310 is arranged on the top surface of the support plate 308, and the bottom surface of the tooth plate 310 is connected with a sliding bar that fits the sliding groove 3081. The cross section of the sliding bar is a T-shaped structure. The tooth plate 310 slides with the top surface of the support plate 308 through the sliding bar. By setting the sliding groove 3081, the tooth plate 310 can stably remain on the top surface of the support plate 308 when moving back and forth.

[0051] In an embodiment of the present invention, a maintenance component 4 is arranged below one group of semiconductor cutting knives 305 in an idle state; the maintenance component 4 includes a lifting plate 41 arranged above the operating table 2, and circular plates 4101 of the same structure are connected to the four corners of the lifting plate 41, and a sliding rod 4102 connected to the top surface of the operating table 2 passes through the circular plate 4101 from top to bottom, and the circular plate 4101 and the sliding rod 4102 are slidably matched, and a lifting component 42 is arranged on the bottom surface of the lifting plate 41, and a reciprocating translation component 43 and a grinding component 44 are arranged on the top surface of the lifting plate 41; the grinding component 44 is used to perform grinding and maintenance on the semiconductor cutting knives 305 in an idle state; by setting the maintenance component 4, the present invention can The semiconductor cutting knife 305 that has been working for a long time enters an idle state. The lifting plate 41 is driven to rise by the lifting assembly 42, and the grinding assembly 44 is driven to move back and forth by the reciprocating translation assembly 43, so that the grinding assembly 44 can grind the cutting blade 3052 of the semiconductor cutting knife 305 in the idle state, and the worn part of the cutting blade 3052 can be removed, and the sharpness of the cutting blade 3052 can be restored, and the cutting ability and efficiency of the cutting blade 3052 can be improved. When the two groups of semiconductor cutting knives 305 work alternately, the semiconductor cutting knife 305 in the idle state can be maintained, which does not affect the cutting operation and can effectively improve the cutting effect of the semiconductor cutting knife 305.

[0052] As another embodiment of the present invention, the lifting assembly 42 includes a motor 4201, a first support 4202, a second support 4203 and a third support 4204 arranged on the inner bottom surface of the equipment slot 201, the output end of the motor 4201 is connected to a screw rod 4205, the screw rod 4205 is rotatably arranged between the first support 4202 and the second support 4203, the circumferential outer wall of the screw rod 4205 is threadedly connected to a moving block 4206, the symmetrical two side walls of the moving block 4206 are connected to moving rods 4207 of the same structure, the end of the moving rod 4207 is rotatably connected to a first lifting rod 4208, the top of the first lifting rod 4208 is rotatably connected to a lifting block 4209, there are two first lifting rods 4208, and the two first lifting rods 4208 are symmetrically arranged on both sides of the lifting block 4209, the side wall of the third support 4204 is rotatably connected to the second lifting rod 4210, and the side wall of the second lifting rod 4210 is connected to the first The side wall of the first lifting rod 4208 rotates and cooperates, and the top of the second lifting rod 4210 is rotatably connected to the adjusting rod 4211. There are two second lifting rods 4210, and the two second lifting rods 4210 are symmetrically arranged at both ends of the adjusting rod 4211. The side wall of the lifting block 4209 is provided with an adjusting groove 4212, and the adjusting rod 4211 is arranged in the adjusting groove 4212, and the adjusting rod 4211 slides and cooperates with the adjusting groove 4212; the top surface of the lifting block 4209 is connected to the bottom surface of the lifting plate 41, and the motor 4201 works to drive the screw rod 4205 to rotate, and the screw rod 4205 drives the moving block 4206 and the moving rod 4207 to move forward, and the moving rod 4207 pushes the bottom end of the first lifting rod 4208 to move forward, and the first lifting rod 4208 cooperates with the second lifting rod 4210 to drive the lifting block 4209 to rise, and the lifting block 4209 drives the lifting plate 41 to rise, so as to realize the lifting function of the lifting plate 41.

[0053] As another embodiment of the present invention, the reciprocating translation assembly 43 includes a fixed seat 1 4301 and a fixed seat 2 4302 connected to the top surface of the lifting plate 41, the top surface of the fixed seat 1 4301 is arranged with a motor 2 4303, the output end of the motor 2 4303 passes through the side wall of the fixed seat 1 4301 and is connected with a rotating rod 4304, the end of the rotating rod 4304 is rotatably connected with a swing rod 4305, the end of the swing rod 4305 is rotatably connected with a push-pull rod 4306, and the top surface of the fixed seat 2 4302 is arranged with a fixed cylinder 4307, the push-pull rod 4306 passes through the side wall of the fixed cylinder 4307 and slides with the fixed cylinder 4307, and works through the motor 2 4303 to drive the rotating rod 4304 to rotate, and the rotating rod 4304 drives the swing rod 4305 to swing and drives the push-pull rod 4306 to move back and forth on the fixed cylinder 4307, and the push-pull rod 4306 drives the grinding assembly 44 to move back and forth, so that the grinding assembly 44 can grind the cutting blade 3052 of the semiconductor cutting knife 305 in an idle state.

[0054] As another embodiment of the present invention, the grinding assembly 44 includes a main bracket 4401 connected to the top surface of the lifting plate 41 and two side brackets 4402, and the side brackets 4402 are arranged on both sides of the main bracket 4401; a fixed bottom plate 4403 connected to the end of the push-pull rod 4306 is arranged above the main bracket 4401, and two wheel rails 4404 are arranged on the top surface of the main bracket 4401, and a plurality of rollers 4405 that fit with the wheel rails 4404 are connected to the bottom surface of the fixed bottom plate 4403, and a There are two wheel-rails 4406, and the bottom surface of the side bracket 4402 is connected with multiple rollers 4407 that fit with the wheel-rails 4406. The top surface of the fixed bottom plate 4403 is also arranged with multiple groups of grinding plate assemblies 4408 arranged in an array. When the fixed bottom plate 4403 moves back and forth, the fixed bottom plate 4403 slides on the top surface of the main bracket 4401 through the rollers 4405 at its bottom, and slides on the bottom surface of the side bracket 4402 through the wheel-rails 4406 on its top surface, so that the fixed bottom plate 4403 can maintain a stable reciprocating motion state.

[0055] As another embodiment of the present invention, the grinding plate assembly 4408 includes a grinding frame plate 440801 connected to the top surface of the fixed bottom plate 4403, and two lubricating paste bins 440803 are formed inside the grinding frame plate 440801 through a middle partition plate 440802; the lubricating paste bin 440803 is provided with lubricating paste for applying lubricating paste to the blade of the cutting blade 3052; two grinding plates 440804 are arranged at the upper end of the inner cavity of the lubricating paste bin 440803 The two grinding plates 440804 are symmetrically distributed on the inner wall of the lubricating paste bin 440803. The side wall of the grinding plate 440804 is connected with a rotating column 440805. The side wall of the grinding frame plate 440801 is connected with a fixed block 440806. The rotating column 440805 penetrates the side wall of the fixed block 440806 and rotates with the side wall of the fixed block 440806. The grinding plate 440804 rotates with the inner wall of the lubricating paste bin 440803 through the rotating column 440805. The grinding plate 440804 is connected to the inner wall of the lubricating paste bin 440803 by a plurality of springs 440807, and a blade grinding area is formed between the two grinding plates 440804. The blade grinding area is matched with the shape of the blade of the cutting blade 3052. The side wall of the grinding plate 440804 is configured to have a granular structure of grinding material for grinding the blade of the cutting blade 3052. When the cutting blade 3052 enters the blade grinding area, the grinding plate 440804 is acted upon by the elastic force of the spring 440807, and the grinding plate 440804 can rotate inward along the side wall of the lubricating paste bin 440803 through the rotating column 440805, so that the two grinding plates 440804 can be closely attached to the side wall of the blade of the cutting blade 3052, which is beneficial for the grinding plate 440804 to effectively grind the blade of the cutting blade 3052, so that the blade of the cutting blade 3052 is ground more evenly, thereby further improving the grinding effect.

[0056] As another embodiment of the present invention, the symmetrical two side walls of the grinding frame plate 440801 are provided with adjustment plates 440808 of the same structure, the inner cavity of the lubricating paste bin 440803 is provided with two mutually symmetrical clamping plates 440810, the ends of the clamping plates 440810 are arranged on the top surface of the adjustment plate 440808, and the area between the two clamping plates 440810 is used to place the lubricating paste; the present invention arranges two clamping plates 440810 in the inner cavity of the lubricating paste bin 440803, and the area between the two clamping plates 440810 is used to place the lubricating paste. When the grinding is completed, the lifting operation is continued through the lifting assembly 42 to drive the lifting plate 41 to rise until the blade of the cutting blade 3052 is squeezed downward in the blade grinding area. The two grinding plates 440804 are pressed and enter the lubricating paste bin 440803 below the two grinding plates 440804. The lubricating paste in the lubricating paste bin 440803 comes into contact with the blade of the cutting blade 3052. Then, the reciprocating translation assembly 43 continues to drive the fixed base plate 4403 to move back and forth on the top surface of the main bracket 4401, so that the lubricating paste and the blade of the cutting blade 3052 are rubbed back and forth. The lubricating paste is evenly applied on the blade of the cutting blade 3052. The lubricating paste will form a lubricating film on the blade of the cutting blade 3052, which effectively reduces the friction coefficient between the cutting blade 3052 and the material during cutting, reduces the degree of damage to the cutting blade 3052 caused by friction, and extends the service life of the tool.

[0057] As another embodiment of the present invention, a plurality of sliding protrusions 440809 are arranged on the top surface of the adjusting plate 440808, and a groove which matches with the sliding protrusion 440809 is opened on the bottom surface of the end of the clamping plate 440810, and the end of the clamping plate 440810 slides with the sliding protrusion 440809 through the groove; a plurality of plug posts 440811 are connected to the side wall of one of the clamping plates 440810, and the plug posts 440811 penetrate the side wall of the adjusting plate 440808 and are connected with the adjusting plate The side wall of plate 440808 is slidably matched, and the outer wall of the circumference of the plug column 440811 is sleeved with a second spring 440812, which is arranged between the side wall of the clamping plate 440810 and the side wall of the adjusting plate 440808; the side wall at the end of another clamping plate 440810 is connected to the side wall at the end of another clamping plate 440810 in the lubricating grease bin 440803 by a third spring 440813; the present invention clamps the lubricating grease by two clamping plates 440810, The volume of the lubricating paste gradually decreases during use. The elastic force of spring 2 440812 of one clamping plate 440810 can slide along the sliding convex plate 440809 on the top surface of the adjusting plate 440808 toward the lubricating paste. The elastic force generated by spring 3 440813 of the other clamping plate 440810 and the clamping plate 440810 in the other lubricating paste bin 440803 can make the other clamping plate 440810 slide along the sliding convex plate 440809 toward the lubricating paste. The two clamping plates 440810 clamp and center the lubricating paste, so that the lubricating paste always remains in the center position in the lubricating paste bin 440803, thereby ensuring that the blade of the cutting blade 3052 can always fully contact the lubricating paste after entering the lubricating paste bin 440803 under the two grinding plates 440804, thereby improving the effect of applying the lubricating paste to the cutting blade 3052 and avoiding the problem of uneven application due to insufficient contact between the lubricating paste and the cutting blade 3052.

[0058] Embodiment 2: This embodiment provides a method for using a semiconductor packaging device, comprising the following steps:

[0059] S1, rib cutting operation, the lead frame 5 is transported to the bottom of the semiconductor cutting knife 305 by the transmission device of the rib cutting machine body 1, and the semiconductor cutting knife 305 is driven downward by the hydraulic cylinder 1 304, so that the cutting blade 3052 of the semiconductor cutting knife 305 cuts off the connecting ribs on the lead frame 5, so that the multiple packaged chips connected to each other on the lead frame 5 are separated into single packaged chips;

[0060] S2, alternating cutting operation, when one set of semiconductor cutting knives 305 has been working for a long time, the hydraulic cylinder 2 309 works to drive the tooth plate 310 to move forward on the support plate 308, the tooth plate 310 drives the gear 307 to rotate, further drives the rotating column 306 to rotate, and the rotating column 306 drives the rotating plate 303 to rotate, so that the positions of the two sets of semiconductor cutting knives 305 are interchanged, the semiconductor cutting knives 305 that have been working for a long time enter an idle state, and the other set of semiconductor cutting knives 305 enters a working state, forming alternating cutting;

[0061] S3, grinding operation, through the motor 4201 to drive the screw 4205 to rotate, the screw 4205 drives the moving block 4206 and the moving rod 4207 to move forward, the moving rod 4207 pushes the bottom end of the first lifting rod 4208 to move forward, the first lifting rod 4208 cooperates with the second lifting rod 4210 to drive the lifting block 4209 to rise, the lifting block 4209 drives the lifting plate 41 to rise, the lifting plate 41 drives the reciprocating translation assembly 43 and the grinding assembly 44 to rise, until the cutting blade 3052 of the semiconductor cutting knife 305 enters the blade grinding area between the two grinding plates 440804 of the grinding assembly 44, and the two The grinding plate 440804 is closely attached to both sides of the cutting blade 3052, and then the motor 2 4303 works to drive the rotating rod 4304 to rotate, the rotating rod 4304 drives the swing rod 4305 to swing and drives the push-pull rod 4306 to move back and forth on the fixed cylinder 4307, the push-pull rod 4306 drives the fixed bottom plate 4403 to move back and forth on the top surface of the main bracket 4401, and the fixed bottom plate 4403 drives the grinding plate 440804 to perform reciprocating friction motion relative to the side wall of the blade of the cutting blade 3052, grinds the blade of the cutting blade 3052, removes the worn part of the cutting edge, and restores the sharpness of the cutting blade 3052;

[0062] S4, lubricating paste application operation. After the grinding is completed, the lifting assembly 42 continues to perform the lifting operation, driving the lifting plate 41 to rise until the blade of the cutting blade 3052 presses the two grinding plates 440804 downward in the blade grinding area and enters the lubricating paste bin 440803 below the two grinding plates 440804. The lubricating paste in the lubricating paste bin 440803 comes into contact with the blade of the cutting blade 3052. Then, the reciprocating translation assembly 43 continues to drive the fixed bottom plate 4403 to move back and forth on the top surface of the main bracket 4401, so that the lubricating paste and the blade of the cutting blade 3052 are rubbed back and forth, and the lubricating paste is evenly applied on the blade of the cutting blade 3052. After completion, the lifting assembly 42 performs the descending operation, driving the grinding assembly 44 to descend and separate from the cutting blade 3052, thereby completing the maintenance operation on the cutting blade 3052.

[0063] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A semiconductor packaging device, characterized in that: The invention comprises a tendon cutting machine body (1), wherein the tendon cutting machine body (1) comprises an operating table (2), and an alternating cutting component (3) and a maintenance component (4) are arranged on the top surface of the operating table (2); The top surface of the operating table (2) is provided with an equipment slot (201); The alternating cutting assembly (3) comprises a ring plate (301), the ring plate (301) being connected to the top surface of the operating table (2) via a plurality of support columns (302), the top surface of the ring plate (301) being movably connected to a rotating plate (303), two hydraulic cylinders (304) being symmetrically arranged on the top surface of the rotating plate (303), two groups of semiconductor cutting knives (305) being symmetrically arranged below the rotating plate (303), and the output end of the hydraulic cylinder (304) passing through the bottom surface of the rotating plate (303) and being connected to the semiconductor cutting knives (305); The bottom surface of the rotating plate (303) is connected to a rotating column (306), the bottom of the rotating column (306) is rotatably connected to the top surface of the operating table (2) via a rotating bearing, a gear (307) is arranged on the circumferential outer wall of the rotating column (306), a support plate (308) is arranged on the side of the rotating column (306), a hydraulic cylinder 2 (309) is arranged on the top surface of the support plate (308), and the output end of the hydraulic cylinder 2 (309) is connected to a toothed plate (310) meshingly connected to the gear (307); The two groups of semiconductor cutting knives (305) have an alternating working state, wherein when one group of semiconductor cutting knives (305) is cutting the lead frame (5), the other group of semiconductor cutting knives (305) is in an idle state; The maintenance component (4) is arranged below one group of semiconductor cutting blades (305) in an idle state; The maintenance component (4) comprises a lifting plate (41) arranged above the operating table (2); a lifting component (42) is arranged on the bottom surface of the lifting plate (41); and a reciprocating translation component (43) and a grinding component (44) are arranged on the top surface of the lifting plate (41); the grinding component (44) is used to perform grinding maintenance on the semiconductor cutting knife (305) in an idle state; The grinding assembly (44) comprises a fixed bottom plate (4403), a top surface of the fixed bottom plate (4403) being provided with a plurality of groups of grinding plate assemblies (4408) arranged in an array, the grinding plate assembly (4408) comprising a grinding frame plate (440801) connected to the top surface of the fixed bottom plate (4403), and two lubricating paste bins (440803) are formed inside the grinding frame plate (440801) via a middle partition plate (440802); The symmetrical two side walls of the grinding frame plate (440801) are provided with adjustment plates (440808) of the same structure, the inner cavity of the lubricating grease bin (440803) is provided with two mutually symmetrical clamping plates (440810), the ends of the clamping plates (440810) are arranged on the top surface of the adjustment plate (440808), and the area between the two clamping plates (440810) is used for placing the lubricating grease; The top surface of the adjustment plate (440808) is provided with a plurality of sliding protrusions (440809), and the bottom surface of the end of the clamping plate (440810) is provided with a notch that matches the sliding protrusion (440809), and the end of the clamping plate (440810) is slidably matched with the sliding protrusion (440809) through the notch; A plurality of plug posts (440811) are connected to the side wall at the end of one of the clamping plates (440810), and the plug posts (440811) penetrate the side wall of the adjusting plate (440808) and slide with the side wall of the adjusting plate (440808), and a second spring (440812) is sleeved on the circumferential outer wall of the plug posts (440811), and the second spring (440812) is arranged between the side wall of the clamping plate (440810) and the side wall of the adjusting plate (440808); the side wall at the end of another clamping plate (440810) is connected to the side wall at the end of another clamping plate (440810) in the lubricating grease bin (440803) via a third spring (440813).

2. A semiconductor packaging device according to claim 1, characterized in that: The top surface of the ring plate (301) is connected with a sliding convex strip (3011), the ring plate (301) is a circular hollow plate-shaped structure, the sliding convex strip (3011) is a circular strip-shaped structure, the bottom surface of the rotating plate (303) is provided with a sliding groove (3031) that matches the sliding convex strip (3011), and the rotating plate (303) is rotatably matched with the ring plate (301) through the sliding groove (3031); The support plate (308) is connected to the top surface of the operating table (2); a sliding groove (3081) is provided on the top surface of the support plate (308); the cross section of the sliding groove (3081) is an inverted T-shaped structure; the tooth plate (310) is arranged on the top surface of the support plate (308); a sliding bar that matches the sliding groove (3081) is connected to the bottom surface of the tooth plate (310); the cross section of the sliding bar is a T-shaped structure; the tooth plate (310) is slidably matched with the top surface of the support plate (308) through the sliding bar.

3. A semiconductor packaging device according to claim 2, characterized in that: The semiconductor cutting knife (305) is composed of a plate frame (3051) and a plurality of cutting blades (3052); the top surface of the plate frame (3051) is connected to the output end of the hydraulic cylinder 1 (304); the plurality of cutting blades (3052) are arranged on the bottom surface of the plate frame (3051); the plurality of cutting blades (3052) correspond to the positions of the connecting ribs of the lead frame (5).

4. A semiconductor packaging device according to claim 3, characterized in that: Circular plates (4101) of the same structure are connected at the four corners of the lifting plate (41), and a sliding rod (4102) connected to the top surface of the operating table (2) passes through the circular plate (4101) from top to bottom, and the circular plate (4101) and the sliding rod (4102) are slidably matched.

5. A semiconductor packaging device according to claim 4, characterized in that: The lifting assembly (42) comprises a motor 1 (4201), a first support (4202), a second support (4203) and a third support (4204) arranged on the inner bottom surface of the equipment slot (201); the output end of the motor 1 (4201) is connected to a screw rod (4205); the screw rod (4205) is rotatably arranged between the first support (4202) and the second support (4203); a moving block (4206) is threadedly connected to the circumferential outer wall of the screw rod (4205); moving rods (4207) of the same structure are connected to the symmetrical two side walls of the moving block (4206); the end of the moving rod (4207) is rotatably connected to the first lifting rod (4208); The top end of the first lifting rod (4208) is rotatably connected to a lifting block (4209); the side wall of the third support (4204) is rotatably connected to a second lifting rod (4210); the side wall of the second lifting rod (4210) is rotatably matched with the side wall of the first lifting rod (4208); the top end of the second lifting rod (4210) is rotatably connected to an adjustment rod (4211); an adjustment groove (4212) is provided on the side wall of the lifting block (4209); the adjustment rod (4211) is arranged in the adjustment groove (4212); the adjustment rod (4211) is slidably matched with the adjustment groove (4212); the top surface of the lifting block (4209) is connected to the bottom surface of the lifting plate (41).

6. The semiconductor packaging device according to claim 5, characterized in that: The reciprocating translation assembly (43) comprises a fixing seat 1 (4301) and a fixing seat 2 (4302) connected to the top surface of the lifting plate (41); a motor 2 (4303) is arranged on the top surface of the fixing seat 1 (4301); an output end of the motor 2 (4303) passes through the side wall of the fixing seat 1 (4301) and is connected to a rotating rod (4304); a swing rod (4305) is rotatably connected to the end of the rotating rod (4304); a push-pull rod (4306) is rotatably connected to the end of the swing rod (4305); a fixing cylinder (4307) is arranged on the top surface of the fixing seat 2 (4302); the push-pull rod (4306) passes through the side wall of the fixing cylinder (4307) and is slidably matched with the fixing cylinder (4307).

7. The semiconductor packaging device according to claim 6, characterized in that: The grinding assembly (44) comprises a main support (4401) connected to the top surface of the lifting plate (41) and a plurality of side supports (4402), wherein the side supports (4402) are arranged on the sides of the main support (4401); The fixed bottom plate (4403) connected to the end of the push-pull rod (4306) is arranged above the main bracket (4401), a plurality of wheel rails (4404) are arranged on the top surface of the main bracket (4401), a plurality of rollers (4405) matched with the wheel rails (4404) are connected to the bottom surface of the fixed bottom plate (4403), a plurality of wheel rails (4406) are arranged on the top surface of the fixed bottom plate (4403), and a plurality of rollers (4407) matched with the wheel rails (4406) are connected to the bottom surface of the side bracket (4402).

8. The semiconductor packaging device according to claim 7, characterized in that: Two grinding plates (440804) are arranged at the upper end of the inner cavity of the lubricating paste bin (440803), and the two grinding plates (440804) are symmetrically distributed on the inner wall of the lubricating paste bin (440803). The side wall of the grinding plate (440804) is connected to a rotating column (440805), and the side wall of the grinding frame plate (440801) is connected to a fixed block (440806). The rotating column (440805) penetrates the side wall of the fixed block (440806) and is rotatably matched with the side wall of the fixed block (440806). The grinding plate (440804) is rotatably matched with the inner wall of the lubricating paste bin (440803) through the rotating column (440805); The grinding plate (440804) is connected to the inner wall of the lubricating paste bin (440803) via a plurality of springs (440807), and a blade grinding area is formed between the two grinding plates (440804). The blade grinding area is shaped to match the shape of the cutting edge of the cutting blade (3052). The side wall of the grinding plate (440804) is configured such that the grinding material is a granular structure, and is used to grind the cutting edge of the cutting blade (3052).

9. The method for using a semiconductor packaging device according to claim 8, characterized in that: The following steps are involved: S1, a rib cutting operation, wherein the lead frame (5) is transported to the bottom of the semiconductor cutting knife (305) by means of a transmission device of the rib cutting machine body (1), and the semiconductor cutting knife (305) is driven downward by means of a hydraulic cylinder 1 (304), so that the cutting blade (3052) of the semiconductor cutting knife (305) cuts off the connecting ribs on the lead frame (5), thereby separating a plurality of packaged chips connected to each other on the lead frame (5) into a single packaged chip; S2, alternating cutting operation, when one set of semiconductor cutting knives (305) has been working for a long time, the second hydraulic cylinder (309) works to drive the tooth plate (310) to move forward on the support plate (308), the tooth plate (310) drives the gear (307) to rotate, further drives the rotating column (306) to rotate, and the rotating column (306) drives the rotating plate (303) to rotate, so that the positions of the two sets of semiconductor cutting knives (305) are interchanged, the semiconductor cutting knives (305) that have been working for a long time enter an idle state, and the other set of semiconductor cutting knives (305) enters a working state, forming alternating cutting; S3, grinding operation, through the motor 1 (4201) working, driving the screw (4205) to rotate, the screw (4205) drives the moving block (4206) and the moving rod (4207) to move forward, the moving rod (4207) pushes the lower end of the first lifting rod (4208) to move forward, the first lifting rod (4208) cooperates with the second lifting rod (4210) to drive the lifting block (4209) to rise, the lifting block (4209) drives the lifting plate (41) to rise, the lifting plate (41) drives the reciprocating translation assembly (43) and the grinding assembly (44) to rise, until the cutting blade (3052) of the semiconductor cutting knife (305) enters the blade grinding area between the two grinding plates (440804) of the grinding assembly (44), and The two grinding plates (440804) are placed in close contact with the two sides of the cutting blade (3052), and then the second motor (4303) is operated to drive the rotating rod (4304) to rotate, the rotating rod (4304) drives the swing rod (4305) to swing and drives the push-pull rod (4306) to move back and forth on the fixed cylinder (4307), the push-pull rod (4306) drives the fixed bottom plate (4403) to move back and forth on the top surface of the main bracket (4401), and the fixed bottom plate (4403) drives the grinding plate (440804) to perform reciprocating friction motion relative to the side wall of the blade of the cutting blade (3052), so as to grind the blade of the cutting blade (3052), remove the worn part of the blade edge, and restore the sharpness of the cutting blade (3052); S4, applying lubricating paste. After the grinding is completed, the lifting assembly (42) continues to perform an ascending operation, driving the lifting plate (41) to ascend until the blade of the cutting blade (3052) presses the two grinding plates (440804) downward in the blade grinding area and enters the lubricating paste bin (440803) below the two grinding plates (440804). The lubricating paste in the lubricating paste bin (440803) comes into contact with the blade of the cutting blade (3052). Then, the reciprocating translation assembly (43) continues to drive the fixed bottom plate (4403) to reciprocate on the top surface of the main support (4401), so that the lubricating paste and the blade of the cutting blade (3052) rub back and forth. The lubricating paste is evenly applied to the blade of the cutting blade (3052). After completion, the lifting assembly (42) performs a descending operation, driving the grinding assembly (44) to descend and separate from the cutting blade (3052), thereby completing the maintenance operation on the cutting blade (3052).

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