Glass substrate chamfering method

Abstract

This invention relates to the field of liquid crystal glass substrate processing technology, and particularly to a method for chamfering a glass substrate. The method includes: transporting the glass substrate to be processed to a processing platform and fixing it; acquiring the coordinates of multiple key points related to the corner to be chamfered on the glass substrate; formulating a chamfering strategy based on the coordinates of the multiple key points and pre-configured chamfering parameters; and chamfering the corner to be chamfered on the glass substrate according to the chamfering strategy. Compared with existing technologies, by setting multiple optical distance sensors on the sidewall of the glass substrate to be processed and acquiring the coordinates of multiple key points after their displacement, and then performing chamfering processing on the corner to be chamfered on the glass substrate using pre-configured chamfering parameters, data analysis can be performed on each glass substrate before processing, thereby effectively improving product uptime and yield, and achieving the goals of cost reduction, efficiency improvement, and environmental protection. Furthermore, this method improves production efficiency while reducing production costs.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal glass substrate processing technology, and in particular to a method for beveling glass substrates. Background Technology

[0002] In the processing of glass substrates, the external dimensions are a crucial quality item. The accuracy of glass dimensional precision affects downstream user applications, and dimensional fluctuations can lead to losses in yield and uptime at the user end. However, existing management methods often have some problems.

[0003] Existing corner processing methods suffer from inconsistent corner dimensions due to positional shifts during glass handling, which can lead to broken glass pieces and impact production line uptime and yield. Furthermore, dimensional inspections are often conducted offline, making it impossible to inspect and monitor all products. In addition, inspected glass is often scrapped due to surface contamination. Therefore, from the perspectives of technical management, cost reduction and efficiency improvement, and environmental protection, developing a method for online full inspection of glass substrates is an urgent problem to be solved. Summary of the Invention

[0004] To address the technical problems existing in the background art, the present invention proposes a method for beveling glass substrates.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A method for chamfering a glass substrate, characterized in that it includes:

[0007] The glass substrate to be processed is transported to the processing platform and fixed, and the coordinates of multiple key points related to the chamfered corner of the glass substrate to be processed are obtained.

[0008] A chamfering strategy is formulated based on the coordinates of multiple key points and pre-configured chamfering parameters, and the chamfering of the corner to be chamfered on the glass substrate is carried out in accordance with the chamfering strategy.

[0009] Preferably, obtaining the coordinates of multiple key points related to the chamfered corner of the glass substrate to be processed specifically involves:

[0010] Collect the first directional distance between the preset first position and the first sidewall to obtain the coordinates of the first key point on the first sidewall, and collect the second directional distance between the preset second position and the first sidewall to obtain the coordinates of the second key point on the first sidewall;

[0011] Collect the third directional distance between the preset third position and the second sidewall to obtain the coordinates of the third key point on the second sidewall; collect the fourth directional distance between the preset fourth position and the second sidewall to obtain the coordinates of the fourth key point on the second sidewall.

[0012] Among them, the coordinates of multiple key points are specifically the coordinates of the first key point, the second key point, the third key point, and the fourth key point. The intersection between the first sidewall and the second sidewall is the corner to be chamfered.

[0013] Preferably, optical ranging sensors are arranged at the first, second, third, and fourth positions, the glass substrate fixed on the processing platform is arranged horizontally, and the light emitted by the four optical ranging sensors is arranged horizontally at the same height.

[0014] Preferably, the light emitted by the four optical rangefinders all passes through the horizontally arranged midsection of the glass substrate.

[0015] Preferably, the chamfering strategy is formulated based on multiple key point coordinates and pre-configured chamfering parameters as follows: the coordinate set of the intersection area of ​​the first sidewall and the second sidewall on the glass substrate is obtained based on the coordinates of the first key point, the second key point, the third key point, and the fourth key point, as well as the thickness of the glass substrate; the coordinate set of the chamfered surface is obtained based on the pre-configured chamfering parameters and the coordinate set of the intersection area; the coordinate set of the area to be ground is obtained based on the coordinate set of the chamfered surface and the coordinate set of the intersection area; and the travel trajectory of the chamfering processing mechanism is formulated based on the coordinate set of the area to be ground. The chamfering strategy is the travel trajectory of the tool.

[0016] Preferably, the chamfering of the corner of the glass substrate according to the chamfering strategy specifically includes: adjusting the tool angle and grinding the area to be ground on the glass substrate according to the tool's travel trajectory.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] Compared with existing technologies, by setting multiple optical ranging sensors on the sidewall of the glass substrate to be processed and acquiring the coordinates of multiple key points after its displacement, and then performing chamfering processing on the corners of the glass substrate to be chamfered using pre-set chamfering parameters, data analysis can be performed on each glass substrate before processing. This effectively improves the product utilization rate and pass rate, and also achieves the goals of cost reduction, efficiency improvement, and environmental protection. Secondly, this method improves production efficiency while reducing production costs. Finally, by combining inspection and processing, all products can be inspected and monitored, further improving the finished quality of the glass substrates. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the glass substrate before processing in the glass substrate chamfering method proposed in this invention;

[0020] Figure 2 This is a schematic diagram of the structure of the glass substrate after processing in the glass substrate chamfering method proposed in this invention;

[0021] Figure 3 This is a schematic diagram of the glass substrate in the offset state and before processing in this invention;

[0022] Figure 4 This is a schematic diagram of the glass substrate in the offset state and after processing in this invention;

[0023] Figure 5 For the present invention Figure 2 A magnified structural diagram at point C.

[0024] In the figure: 1-glass substrate, 2-first position, 3-second position, 4-third position, 5-fourth position, 6-optical range sensor, 7-corner to be chamfered. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figures 1-5 As shown, this embodiment provides a method for chamfering a glass substrate, including:

[0027] The glass substrate 1 to be processed is transported to the processing platform and fixed, and the coordinates of multiple key points related to the chamfered corner 7 of the glass substrate 1 to be processed are obtained;

[0028] A chamfering strategy is formulated based on the coordinates of multiple key points and pre-configured chamfering parameters, and the chamfering corner 7 of the glass substrate 1 is chamfered in accordance with the chamfering strategy.

[0029] Overall, after the glass substrate 1 to be processed is transported by the conveying mechanism and placed on the processing table for fixation, the coordinates of multiple key points related to the corner 7 to be chamfered on the glass substrate 1 to be processed are obtained by the relevant equipment. The coordinates of the multiple key points and the pre-configured chamfering parameters are analyzed and processed to simulate a linear trajectory. Then, the chamfering processing mechanism performs chamfering processing on the corner 7 to be chamfered on the glass substrate 1 according to the linear trajectory.

[0030] like Figure 1 , Figure 2 and Figure 5 As shown, in one embodiment, obtaining the coordinates of multiple key points related to the chamfered corner 7 of the glass substrate 1 to be processed specifically involves:

[0031] Collect the first directional distance between the preset first position 2 and the first sidewall to obtain the coordinates of the first key point on the first sidewall; collect the second directional distance between the preset second position 3 and the first sidewall to obtain the coordinates of the second key point on the first sidewall.

[0032] Collect the third directional distance between the preset third position 4 and the second sidewall to obtain the coordinates of the third key point on the second sidewall; collect the fourth directional distance between the preset fourth position 5 and the second sidewall to obtain the coordinates of the fourth key point on the second sidewall.

[0033] Among them, the coordinates of multiple key points are specifically the coordinates of the first key point, the second key point, the third key point, and the fourth key point. The intersection between the first sidewall and the second sidewall is the corner to be chamfered 7.

[0034] Specifically, the first directional distance between the preset first position 2 and the first sidewall is collected using relevant equipment, and the second directional distance between the preset second position 3 and the first sidewall is collected. The coordinates of the first key point and the second key point on the first sidewall are obtained according to preset parameters. At the same time, the third directional distance between the preset third position 4 and the second sidewall and the fourth directional distance between the preset fourth position 5 and the second sidewall are collected. The coordinates of the third key point and the fourth key point on the second sidewall are obtained according to preset parameters. The first sidewall and the second sidewall are two adjacent sidewalls on the glass substrate 1, and the intersection of the first sidewall and the second sidewall is the processing position of the chamfered corner 7.

[0035] like Figures 1-4 As shown, in one embodiment, optical ranging sensors 6 are arranged at the first position 2, the second position 3, the third position 4 and the fourth position 5. The glass substrate 1 fixed on the processing platform is arranged horizontally, and the light emitted by the four optical ranging sensors 6 is arranged horizontally at the same height.

[0036] The relevant equipment specifically consists of optical ranging sensors 6 arranged at the first position 2, second position 3, third position 4, and fourth position 5 of the glass substrate 1. Multiple optical ranging sensors 6 are fixed on the processing platform and arranged at the same height on the same horizontal plane. When the glass substrate 1 does not shift, the distance between the detection end of each optical ranging sensor 6 and its corresponding sidewall is equal and can all be passed through by the chamfering processing mechanism. When chamfering the corner 7 of the glass substrate 1, it is only necessary to read the data of the corresponding first position 2, second position 3, third position 4, and fourth position 5 to be measured, and obtain the coordinates of the first key point, the second key point, the third key point, and the fourth key point in sequence. The obtained data is then compared with the preset data. After comparison, the relevant equipment sends a correction command to the chamfering processing mechanism and controls the chamfering processing mechanism to perform chamfering processing on the corner 7 according to the corrected linear trajectory.

[0037] Similarly, when performing chamfering on the other three corners 7 of the glass substrate 1, it is only necessary to read the data of the corresponding first position 2, second position 3, third position 4 and fourth position 5 to be measured again, and obtain the data of the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates in sequence. Then, the obtained data is compared with the preset data. After comparison, the relevant equipment sends a correction command to the chamfering mechanism and controls the chamfering mechanism to perform chamfering on the corners 7 according to the corrected linear trajectory.

[0038] like Figures 3-4 As shown, in one embodiment, the light emitted by the four optical ranging sensors 6 all passes through the horizontally arranged midsection of the glass substrate 1.

[0039] Specifically, the plane on which multiple optical ranging sensors 6 are located is on the same plane as the mid-section of the glass substrate 1, which enables uniformity measurement of the glass and reduces measurement errors caused by edge effects or local non-uniformity. This makes the data measured by the optical ranging sensors 6 more accurate. Furthermore, it can also avoid interference from instability at the edge of the glass substrate 1 on the measurement results, thereby improving the accuracy and reliability of the measurement.

[0040] like Figures 3-4As shown, in one embodiment, the chamfering strategy is formulated based on multiple key point coordinates and pre-configured chamfering parameters as follows: the coordinate set of the intersection area of ​​the first sidewall and the second sidewall on the glass substrate 1 is obtained based on the coordinates of the first key point, the second key point, the third key point, and the fourth key point, as well as the thickness of the glass substrate 1; the coordinate set of the chamfered surface is obtained based on the pre-configured chamfering parameters and the coordinate set of the intersection area; the coordinate set of the area to be ground is obtained based on the coordinate set of the chamfered surface and the coordinate set of the intersection area; and the travel trajectory of the chamfering processing mechanism is formulated based on the coordinate set of the area to be ground. The chamfering strategy is the travel trajectory of the tool.

[0041] The coordinate set of the intersection area of ​​the first and second adjacent sidewalls on the glass substrate 1 is obtained by using the coordinates of the first, second, third, and fourth key points and the thickness of the glass substrate 1. Then, the coordinate set of the chamfered surface is obtained by using the pre-configured chamfering parameters and the coordinate set of the intersection area. Finally, the range of the area to be processed is obtained by using the coordinate set of the intersection area of ​​the first and second sidewalls and the coordinate set of the chamfered surface. After determining the range of the area to be processed, the optical ranging sensor 6 formulates the walking trajectory of the chamfering processing mechanism based on the obtained information and feeds the information back to the chamfering processing mechanism to control the chamfering processing mechanism to perform chamfering processing on the range of the area to be processed.

[0042] Similarly, when performing chamfering on the other three corners 7 of the glass substrate 1, it is only necessary to obtain the range of the area to be processed at the corresponding chamfering position again. After determining the range of the area to be processed, the optical distance sensor 6 formulates the walking trajectory of the chamfering mechanism based on the obtained information and feeds the information back to the chamfering mechanism to control the chamfering mechanism to perform chamfering on the range of the area to be processed.

[0043] like Figures 3-5 As shown, in one embodiment, chamfering the corner 7 of the glass substrate 1 according to the chamfering strategy specifically includes: adjusting the tool angle and grinding the area to be ground on the glass substrate 1 according to the tool's travel trajectory.

[0044] The chamfering mechanism is specifically a tool structure. When the position of the glass substrate 1 is offset, the tool is adjusted according to the range of the area to be processed and the angle of the tool during the processing is adjusted so that the tool performs chamfering processing on the area to be ground on the glass substrate 1 according to the travel trajectory obtained after sending the correction command.

[0045] Of course, those skilled in the art will recognize that the present invention is not limited to the details of the exemplary embodiments described above, but also includes the same or similar structures that can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0046] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0047] The technologies, shapes, and structures not described in detail in this invention are all known technologies.

Claims

1. A method for chamfering a glass substrate, characterized in that, include: The glass substrate (1) to be processed is transported to the processing platform and fixed, and the coordinates of multiple key points related to the chamfered corner (7) of the glass substrate (1) to be processed are obtained; A chamfering strategy is formulated based on the coordinates of multiple key points and pre-configured chamfering parameters, and the chamfering corner (7) of the glass substrate (1) is chamfered in accordance with the chamfering strategy; Specifically, the coordinates of multiple key points related to the chamfered corner (7) of the glass substrate (1) to be processed are obtained as follows: Collect the first directional distance between the preset first position (2) and the first sidewall to obtain the coordinates of the first key point on the first sidewall; collect the second directional distance between the preset second position (3) and the first sidewall to obtain the coordinates of the second key point on the first sidewall. Collect the third directional distance between the preset third position (4) and the second sidewall to obtain the coordinates of the third key point on the second sidewall; collect the fourth directional distance between the preset fourth position (5) and the second sidewall to obtain the coordinates of the fourth key point on the second sidewall. Among them, the coordinates of multiple key points are specifically the coordinates of the first key point, the second key point, the third key point, and the fourth key point. The intersection between the first sidewall and the second sidewall is the corner to be chamfered (7). The chamfering strategy is formulated based on multiple key point coordinates and pre-configured chamfering parameters as follows: the coordinate set of the intersection area of ​​the first sidewall and the second sidewall on the glass substrate (1) is obtained based on the coordinates of the first key point, the second key point, the third key point, the fourth key point, and the thickness of the glass substrate (1); the coordinate set of the chamfered surface is obtained based on the pre-configured chamfering parameters and the coordinate set of the intersection area; the coordinate set of the area to be ground is obtained based on the coordinate set of the chamfered surface and the coordinate set of the intersection area; and the travel trajectory of the chamfering processing mechanism is formulated based on the coordinate set of the area to be ground. The chamfering strategy is the travel trajectory of the tool.

2. The glass substrate chamfering method according to claim 1, characterized in that, Optical ranging sensors (6) are arranged in the first position (2), the second position (3), the third position (4) and the fourth position (5). The glass substrate (1) fixed on the processing platform is arranged horizontally, and the light emitted by the four optical ranging sensors (6) is arranged horizontally at the same height.

3. The glass substrate chamfering method according to claim 2, characterized in that, The light emitted by the four optical ranging sensors (6) all passes through the horizontally arranged midsection of the glass substrate (1).

4. The glass substrate chamfering method according to claim 3, characterized in that, The chamfering strategy for the corner (7) of the glass substrate (1) to be chamfered specifically includes: adjusting the tool angle and grinding the area to be ground on the glass substrate (1) according to the tool's travel trajectory.

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