High-temperature adhesive-resistant film and manufacturing method thereof

Abstract

According to the technical scheme, the high-temperature adhesive-resistant film is characterized by comprising a composite adhesive-resistant film body, a thermoplastic resin base layer is arranged in the middle of the interior of the composite adhesive-resistant film body, and high-temperature-resistant softening layers are arranged in the portions, above and below the thermoplastic resin base layer, of the interior of the composite adhesive-resistant film body respectively; release layers are respectively arranged in the composite glue-blocking film main body on the outer sides of the high-temperature-resistant softening layers, antistatic layers are respectively arranged in the composite glue-blocking film main body on the outer sides of the release layers, and coated paper layers are respectively arranged on the upper surface and the lower surface of the composite glue-blocking film main body. The anti-static layers are arranged in the portions, on the outer side of the release layer, of the adhesive-blocking film body respectively, and the anti-static layers are arranged on the outer side in the adhesive-blocking film body in the using process, so that the macromolecule anti-static agent is evenly arranged in the adhesive-blocking film body.

Description

Technical Field

[0001] The present invention relates to the technical field of barrier films, and more particularly to a high-temperature adhesive barrier film and a method for manufacturing the same. Background Art

[0002] As electronic products become more and more lightweight, the size of printed circuit boards (PCBs) is also becoming smaller and smaller, and the circuit design is becoming more and more dense. The power consumed by high-power electronic components during operation will generate a lot of heat. This heat causes the temperature inside the components to rise rapidly, resulting in a decrease in quality and reliability, and in severe cases even causing the electronic components to fail due to overheating. Embedding metal copper blocks in printed circuit boards (PCBs) is one of the effective ways to solve the heat dissipation problem. In the process of preparing embedded printed circuit boards, high-temperature resistant adhesive films are needed to play the role of release and adhesive resistance.

[0003] In the actual production process of printed circuit board manufacturing, in order to tightly bond the inner core board and the prepreg, it is often necessary to press them together under high temperature and high pressure. However, due to the high fluidity of the middle layer of the traditional resist film, the production efficiency is low and there are many scrapped products.

[0004] Therefore, a solution needs to be proposed to solve this problem. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a high-temperature adhesive-resistant film and a method for manufacturing the same. By providing a stirring device in the inner tank, the water bath can be heated more evenly during the heating process, and the object can be heated more evenly.

[0006] The above technical purpose of the present invention is achieved through the following technical scheme: a high-temperature adhesive film, including a composite adhesive film body, a thermoplastic resin base layer is arranged in the middle position of the composite adhesive film body, high-temperature resistant softening layers are respectively arranged in the composite adhesive film body above and below the thermoplastic resin base layer, release layers are respectively arranged in the composite adhesive film body outside the high-temperature resistant softening layer, antistatic layers are respectively arranged in the composite adhesive film body outside the release layer, and coated paper layers are respectively arranged on the upper and lower surfaces of the composite adhesive film body.

[0007] The present invention is further configured as follows: the composite adhesive resistance film body includes a first adhesive resistance layer, a corona layer, a second adhesive resistance layer and a reinforcement layer which are arranged from top to bottom.

[0008] The present invention is further configured as follows: the high temperature resistant softening layer is a cast polypropylene film.

[0009] The present invention is further configured as follows: the first adhesive barrier layer is a polyimide layer or a nylon layer, and the thickness thereof is 3-15 μm.

[0010] The present invention is further configured as follows: the second adhesive barrier layer is a polypropylene layer, and the thickness thereof is 3-25 μm.

[0011] The present invention is further configured such that: the release layer is coated with a low-silicon release agent.

[0012] The above technical purpose of the present invention is also achieved by the following technical scheme: a method for manufacturing a high temperature adhesive resistance film, in step A, firstly coating the high temperature resistant softening layer on the upper surface and the lower surface of the thermoplastic resin base respectively;

[0013] Step B, coating the antistatic layer on the upper surface and the lower surface of the thermoplastic resin base layer coated with the high temperature resistant softening layer in step A;

[0014] Step C, finally coating the surface of the antistatic layer in step B with a resist film body.

[0015] In summary, the present invention has the following beneficial effects:

[0016] 1. Antistatic layers are arranged in the main body of the adhesive film on the outside of the release layer. When in use, the antistatic layer is arranged on the outside of the main body of the adhesive film, so that the polymer antistatic agent is evenly arranged in the main body of the adhesive film. The polymer antistatic agent can make the adhesive film have antistatic properties, thereby preventing static electricity from penetrating the adhesive film and damaging the circuit board when the adhesive film is applied on the circuit board, further optimizing the performance of the adhesive film and making it more functional;

[0017] 2. The high temperature resistant softening layer will soften under high temperature and high pressure conditions so that it can automatically flow and fill according to the surface morphology of the circuit board, preventing the glue on the circuit board from flowing to the circuit line, so that the circuit board remains powered on. The use of the cast polypropylene film can allow the high temperature resistant adhesive film to withstand temperatures above 200°C and is not easy to shrink. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic structural diagram of the main body of the composite adhesive barrier film in the present invention.

[0020] In the figure: 1. Thermoplastic resin base layer; 2. High temperature resistant softening layer; 3. Release layer; 4. Antistatic layer; 5. Composite adhesive film body; 6. First adhesive layer; 7. Corona layer; 8. Second adhesive layer; 9. Reinforcement layer. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", "top / bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] The present invention is described in detail below in conjunction with the accompanying drawings.

[0025] A high temperature adhesive film, such as Figure 1-Figure 2 As shown, it includes a composite adhesive film body 5, a thermoplastic resin base layer 1 is arranged in the middle position of the composite adhesive film body 5, and high-temperature resistant softening layers 2 are respectively arranged in the composite adhesive film body 5 above and below the thermoplastic resin base layer 1, and the high-temperature resistant softening layer 2 is a cast polypropylene film.

[0026] The high temperature resistant softening layer 2 will soften under high temperature and high pressure conditions so as to automatically flow and fill according to the surface morphology of the circuit board, preventing the glue on the circuit board from flowing to the circuit line, so that the circuit board remains powered. The use of the cast polypropylene film can allow the high temperature resistant adhesive film to withstand temperatures above 200°C and is not easy to shrink.

[0027] The composite adhesive film body 5 outside the high temperature resistant softening layer 2 is provided with a release layer 3, and the release layer 3 is coated with a low silicon release agent. The low silicon release agent has excellent properties such as low toxicity, low polarity, low surface tension and immiscibility with organic silicon polymers.

[0028] The antistatic layer 4 is arranged in the composite adhesive film body 5 outside the release layer 3, and the upper surface and the lower surface of the composite adhesive film body 5 are arranged with a coated paper layer.

[0029] The composite adhesive resistance film body 5 includes a first adhesive resistance layer 6 , a corona layer 7 , a second adhesive resistance layer 8 and a reinforcement layer 9 which are arranged from top to bottom.

[0030] The first adhesive resistance layer 6 is a polyimide layer or a nylon layer, and its thickness is 3-15 μm. The second adhesive resistance layer 8 is a polypropylene layer, and its thickness is 3-25 μm.

[0031] By respectively arranging flame retardant layers on the upper and lower surfaces of the main body of the adhesive resistance film, and arranging the flame retardant layers composed of PE flame retardant on the upper and lower surfaces of the main body of the adhesive resistance film when in use, the flame retardant and high temperature resistant performance of the main body of the adhesive resistance film is made stronger, making it safer, more reliable and more feasible when installed on the circuit board.

[0032] A method for manufacturing a high-temperature adhesive-resistant film, step A, firstly coating a high-temperature-resistant softening layer 2 on the upper surface and the lower surface of a thermoplastic resin base layer 1 respectively;

[0033] Step B, coating the upper surface and lower surface of the thermoplastic resin base layer 1 coated with the high temperature resistant softening layer 2 in step A with an antistatic layer 4;

[0034] Step C, finally coating the surface of the antistatic layer 4 in step B with a resist film body.

[0035] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A high temperature adhesive film, characterized in that: The invention comprises a composite adhesive film body (5), wherein a thermoplastic resin base layer (1) is arranged in the middle position of the composite adhesive film body (5), a high temperature resistant softening layer (2) is arranged in the composite adhesive film body (5) above and below the thermoplastic resin base layer (1), a release layer (3) is arranged in the composite adhesive film body (5) outside the high temperature resistant softening layer (2), an antistatic layer (4) is arranged in the composite adhesive film body (5) outside the release layer (3), and a coated paper layer is arranged on the upper surface and the lower surface of the composite adhesive film body (5).

2. The high temperature adhesive resistance film according to claim 1, characterized in that: The composite adhesive resistance film body (5) comprises a first adhesive resistance layer (6), a corona layer (7), a second adhesive resistance layer (8) and a reinforcement layer (9) which are arranged from top to bottom.

3. The high temperature adhesive resistance film according to claim 1, characterized in that: The high temperature resistant softening layer (2) is a cast polypropylene film.

4. The high temperature adhesive resistance film according to claim 1, characterized in that: The first adhesive barrier layer (6) is a polyimide layer or a nylon layer, and its thickness is 3 to 15 μm.

5. The high temperature adhesive resistance film according to claim 1, characterized in that: The second adhesive barrier layer (8) is a polypropylene layer, and its thickness is 3-25 μm.

6. The high temperature adhesive resistance film according to claim 1, characterized in that: The release layer (3) is coated with a low-silicon release agent.

7. A method for manufacturing a high temperature adhesive resistance film according to any one of claims 1 to 6, characterized in that: In the step A, the high temperature resistant softening layer (2) is firstly coated on the upper surface and the lower surface of the thermoplastic resin base layer (1) respectively; Step B, coating the antistatic layer (4) on the upper surface and the lower surface of the thermoplastic resin base layer (1) coated with the high temperature resistant softening layer (2) in step A; Step C, finally coating the surface of the antistatic layer (4) in step B with a resist film body.

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