Display panel broken line repair equipment control method and device, equipment and storage medium

Abstract

The invention discloses a display panel broken line repair equipment control method and device, equipment and a storage medium, and the method comprises the steps: controlling a sensor to collect detection data in a process that a laser beam of chemical vapor deposition equipment scans a deposition repair layer on a non-metal layer at a first speed by taking a first repair hole as a starting point, whether the laser beam scans the fracture or not is judged according to the detection data, if yes, the laser beam is controlled to scan the fracture at a second speed to deposit a repair layer, the second speed is smaller than the first speed, and after the laser beam finishes scanning the fracture, the repair layer is deposited on the non-metal layer by taking the second repair hole as an end point and scanning at the first speed. The fracture is detected in real time, the scanning speed at the fracture is reduced, the staying time of a laser beam at the fracture is prolonged, a complete repairing layer can be formed at the fracture through sufficient deposition of a chemical vapor deposition process, a deposition layer formed at the fracture can be completely connected with metal layers on the two sides of the fracture, and the repairing effect is improved. And the success rate of repairing the broken line of the metal layer is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device control technology, and in particular to a display panel disconnection repair device control method, device, equipment and storage medium. Background Art

[0002] During the manufacturing process of the display panel, it is necessary to form a pixel driving circuit on a glass substrate. The pixel driving circuit includes metal lines such as data lines, scan lines and compensation lines. The metal lines are thinner metal layers in the display panel.

[0003] like Figure 1 As shown in a, from top to bottom are non-metal 1, metal layer 2 and glass substrate 3. When foreign matter 4 exists in the metal layer 2 during the deposition process, the metal layer 2 is separated by the foreign matter 4 and fractured. The metal layer 2 on both sides of the foreign matter 4 cannot be energized, as shown in FIG. Figure 1 As shown in b, in order to repair the broken metal layer 4, the foreign matter in the metal layer 2 is first removed to form a fracture 5, and then a first repair hole 6 and a second repair hole 7 are set on both sides of the fracture 5 with a depth reaching the upper surface of the glass substrate 3. Then, after the metal medium is deposited in the first repair hole 6 and the second repair hole 7 by laser CVD (Chemical Vapor Deposition) process, the laser CVD is controlled to scan and move at a uniform speed from the first repair hole 6 to the second repair hole 7 to form a repair layer 8 on the non-metallic layer 1.

[0004] like Figure 1 As shown in c, since the fracture 5 has a certain depth, when the laser CVD scans and moves at a uniform speed from the first repair hole 6 to the second repair hole 7 to form the repair layer 8, the metal medium cannot be completely filled at the fracture 5 to form a complete repair layer 8, and a gap 10 is formed in the fracture 5. There is a problem that the repair layer 8 is broken or there is a gap 10 in the repair layer 8 in the fracture 5 that cannot connect to the metal layer 2 at the fracture 5, resulting in failure to repair the metal layer 2. Summary of the invention

[0005] The present invention provides a display panel disconnection repair device control method, device, equipment and storage medium to solve the problem that the display panel disconnection repair device control is not perfect, resulting in the display panel disconnection repair failure.

[0006] In a first aspect, the present invention provides a display panel broken line repair device control method, which is used to control a chemical vapor deposition device to repair a broken metal layer, wherein the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising:

[0007] Depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer;

[0008] Control the laser beam of the chemical vapor deposition device to scan the first repair hole at a first speed to deposit a repair layer on the non-metal layer;

[0009] Controlling the sensor to collect detection data;

[0010] Determining whether the laser beam scans the fracture according to the detection data;

[0011] If not, return to the step of controlling the sensor to collect detection data;

[0012] If yes, controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;

[0013] After detecting that the laser beam has finished scanning the fracture, a repair layer is deposited on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.

[0014] In a second aspect, the present invention provides a display panel broken wire repair device control device, which is used to control a chemical vapor deposition device to repair a broken metal layer, wherein the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising:

[0015] A repair hole deposition module, used for depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer;

[0016] A first scanning control module, used for controlling the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as a starting point to deposit a repair layer on the non-metal layer;

[0017] A detection data acquisition module, used to control the sensor to collect detection data;

[0018] A fracture detection and judgment module, used for judging whether the laser beam scans the fracture according to the detection data, and if not, executing the detection data acquisition module, and if so, executing the second scanning control module;

[0019] A second scanning control module, used for controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;

[0020] A third scanning control module, after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metal layer by scanning at the first speed with the second repair hole as an end point.

[0021] In a third aspect, the present invention provides an electronic device, the electronic device comprising:

[0022] at least one processor; and

[0023] a memory communicatively connected to the at least one processor; wherein,

[0024] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the display panel disconnection repair device control method described in the first aspect of the present invention.

[0025] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a processor to implement the display panel disconnection repair device control method described in the first aspect of the present invention when executed.

[0026] After depositing the metal medium in the first repair hole and the second repair hole, the embodiment of the present invention controls the laser beam of the chemical vapor deposition equipment to scan at a first speed to deposit the repair layer on the non-metallic layer with the first repair hole as the starting point, collects detection data through the sensor, and determines whether the laser beam scans the fracture of the metal layer through the detection data. If so, the fracture is scanned from the first speed to the second speed to form a metal layer at the fracture, and after the scanning of the fracture is completed, the first speed is restored to scan to the second repair hole. Since the scanning speed is reduced at the fracture, the residence time of the laser beam at the fracture is increased, and the complete repair layer can be fully deposited at the fracture through the chemical vapor deposition process, thereby avoiding the problem that the metal layer cannot be fully deposited due to the step difference at the fracture due to the laser beam scanning too fast, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing the broken wire of the metal layer.

[0027] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of repairing a broken metal wire in the prior art;

[0030] Figure 2 This is a flow chart of a display panel disconnection repair device control method provided in Embodiment 1 of the present invention;

[0031] Figure 3 is a schematic diagram of the effect of repairing a metal wire using the control method of an embodiment of the present invention;

[0032] Figure 4 This is a flow chart of a display panel disconnection repair device control method provided in Embodiment 2 of the present invention;

[0033] Figure 5 It is a schematic diagram of detecting fracture through image;

[0034] Figure 6 is a schematic diagram of detecting a fracture through an optical signal;

[0035] Figure 7 It is a structural schematic diagram of a display panel disconnection repair device control device provided in Embodiment 3 of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0038] Embodiment 1

[0039] Figure 2This is a flow chart of a display panel disconnection repair device control method provided in the first embodiment of the present invention. This embodiment can be applied to the case where the display panel disconnection repair device is controlled to repair the disconnection. The method can be executed by a display panel disconnection repair device control device. The display panel disconnection repair device control device can be implemented in the form of hardware and / or software, and can be configured in an electronic device, such as in a host computer of the display panel disconnection repair device. Figure 2 As shown, the display panel disconnection repair device control method includes:

[0040] S201, depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer.

[0041] In this embodiment, the display panel line break may refer to a break in a metal layer in the display panel. For example, the metal layer in the display panel may be a data line (Data Line), a scan line (Scan Line), a power line (VDD Line), a compensation line (REF Line), etc.

[0042] like Figure 1 In one example, there is a metal layer 2 on a glass substrate 3, and there is a non-metal layer 1 (transparent non-metal layer) on the metal layer 2. If a foreign object 4 invades when the metal layer 2 is being deposited, after the non-metal layer 1 is formed, the foreign object 4 will cause the non-metal layer 1 to bulge and break, and also cause the metal layer 2 to break, requiring the metal layer 2 to be repaired.

[0043] Among them, it is necessary to use laser to remove foreign matter 4 to form a fracture 5, and in order to ensure the quality of repair, a first repair hole 6 and a second repair hole 7 are also formed on both sides of the fracture 5 by laser, wherein the fracture 5, the first repair hole 6 and the second repair hole 7 all penetrate the non-metallic layer 1 and the metal layer 2.

[0044] Before forming a repair layer on the non-metallic layer 1, it is necessary to deposit a metal medium in the first repair hole 6 and the second repair hole 7 so that the metal medium fills the first repair hole 6 and the second repair hole 7. In one embodiment, the metal medium can be deposited in the first repair hole 6 and the second repair hole 7 by a chemical vapor deposition device. The chemical vapor deposition device can be an existing device. For example, the chemical vapor deposition device can be a device that uses a laser beam as a heating device. Specifically, the laser beam of the chemical vapor deposition device can be controlled to move to the top of the first repair hole 6 and the second repair hole 7 respectively, and then the output metal organic chemical gas is heated by the laser beam to deposit the metal in the metal organic chemical gas in the first repair hole 6 and the second repair hole 7 until the first repair hole 6 and the second repair hole 7 are filled, so that the metal medium in the first repair hole 6 and the second repair hole 7 can realize electrical signal transmission after being connected to the metal layer 2.

[0045] S202, controlling the laser beam of the chemical vapor deposition equipment to scan at a first speed with the first repair hole as the starting point to deposit a repair layer on the non-metallic layer.

[0046] This embodiment can determine the first speed according to the required thickness of the repair layer, and control the laser beam of the chemical vapor deposition equipment to move toward the second repair hole at the first speed starting from the first repair hole to form a repair layer on the non-metallic layer and the fracture.

[0047] like Figure 1 As shown in c, the laser beam 9 moves at a uniform speed from the first repair hole 6 to the second repair hole 7 at a first speed v. During the movement, under the heating effect of the laser beam 9, the metal in the metal organic chemical gas is deposited on the surface of the non-metallic layer 1 to form a metal repair layer 8.

[0048] S203, controlling the sensor to collect detection data.

[0049] The chemical vapor deposition equipment of this embodiment is provided with a sensor. When the laser beam is scanned from the first repair hole to the second repair hole, the sensor can collect detection data of the laser beam irradiation area according to a preset period.

[0050] S204, judging whether the laser beam scans the fracture according to the detection data.

[0051] In one embodiment, the sensor may be a camera, which captures images through the camera and identifies whether the laser beam has scanned the fracture in the metal layer. In another embodiment, the sensor may be a photoelectric sensor, which emits a light signal to the irradiation area of ​​the laser beam and then receives a reflected light signal, and determines whether the laser beam has scanned the fracture through the reflected light signal.

[0052] If it is identified through the detection data that the laser beam scans the fracture, S205 is executed. If it is identified through the detection data that the laser beam does not scan the fracture, the process returns to S203 to continue collecting detection data.

[0053] S205, controlling the laser beam to scan on the fracture at a second speed to deposit a repair layer, wherein the second speed is less than the first speed.

[0054] In this embodiment, when the laser beam scans the fracture, the scanning speed is reduced, that is, the fracture is scanned at a second speed that is less than the first speed, so that when the laser beam scans the fracture, the residence time of the laser beam at the fracture is prolonged, so that the laser beam has sufficient time to deposit the metal in the metal organic chemical gas into the fracture to completely fill the fracture. Among them, those skilled in the art can pre-set the second speed according to the size and depth of the fracture, for example, the second speed can be 0.5 times the first speed, and this embodiment does not limit the second speed.

[0055] S206, after detecting that the laser beam has finished scanning the fracture, depositing a repair layer on the non-metallic layer with the second repair hole as the end point and scanning at the first speed.

[0056] After the laser beam finishes scanning the fracture, the first speed can be restored so that the laser beam scans toward the second repair hole at the first speed to deposit a repair layer on the non-metallic layer.

[0057] like Figure 1 As shown, between the first repair hole 6 and the fracture 5, the laser beam 9 scans at a first speed to form a repair layer 8 on the non-metallic layer 1. When the laser beam 9 is detected to scan the fracture 5, the speed is reduced and the fracture 5 is scanned at a second speed so that the metal medium fills the fracture 5. Then the first speed is restored and the repair layer 8 is formed on the non-metallic layer 1 by scanning from the fracture 5 to the second repair hole 7.

[0058] like Figure 3 As shown, since the speed is reduced at the fracture 5, the fracture 5 is completely filled with the metal medium to form a complete repair layer, and a complete repair layer 8 can be formed from the first repair hole 6 to the second repair hole 7, avoiding the problem of repair failure caused by the first speed scanning from the first repair hole 6 to the second repair hole 7 resulting in a gap at the fracture 5.

[0059] After depositing the metal medium in the first repair hole and the second repair hole, the embodiment of the present invention controls the laser beam of the chemical vapor deposition equipment to scan at a first speed to deposit the repair layer on the non-metallic layer with the first repair hole as the starting point, collects detection data through the sensor, and determines whether the laser beam scans the fracture of the metal layer through the detection data. If so, the fracture is scanned from the first speed to the second speed to form a metal layer at the fracture, and after the scanning of the fracture is completed, the first speed is restored to scan to the second repair hole. Since the scanning speed is reduced at the fracture, the residence time of the laser beam at the fracture is increased, and the complete repair layer can be fully deposited at the fracture through the chemical vapor deposition process, thereby avoiding the problem that the metal layer cannot be fully deposited due to the step difference at the fracture due to the laser beam scanning too fast, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing the broken wire of the metal layer.

[0060] Embodiment 2

[0061] Figure 4 This is a flow chart of a display panel disconnection repair device control method provided in Embodiment 2 of the present invention. This embodiment of the present invention is optimized based on the above Embodiment 1. Figure 4 As shown, the display panel disconnection repair device control method includes:

[0062] S401, controlling the laser beam of the chemical vapor deposition equipment to deposit metal media in the first repair hole and the second repair hole respectively.

[0063] In this embodiment, when the detection station detects that the metal layer is broken and causes the line to be broken, a fracture is formed at the fracture of the metal layer by laser, and a first repair hole and a second repair hole are formed on both sides of the fracture. Figure 1 As shown in a and b, when the metal layer 2 is broken due to foreign matter 4, the foreign matter 4 is removed by laser to form a fracture 5, and in order to facilitate repair and ensure the quality of repair, a first repair hole 6 and a second repair hole 7 are also formed on both sides of the fracture 5 by laser, wherein the fracture 5, the first repair hole 6 and the second repair hole 7 all penetrate the non-metallic layer 1 and the metal layer 2.

[0064] In one embodiment, a metal medium can be deposited in the first repair hole 6 and the second repair hole 7 by a chemical vapor deposition device. Specifically, after the laser beam of the chemical vapor deposition device is controlled to move above the first repair hole 6 and the second repair hole 7, the output metal organic chemical gas can be heated by the laser beam to deposit the metal in the metal organic chemical gas in the first repair hole 6 and the second repair hole 7 until the first repair hole 6 and the second repair hole 7 are filled.

[0065] S402, controlling the laser beam of the chemical vapor deposition equipment to scan at a first speed with the first repair hole as the starting point to deposit a repair layer on the non-metallic layer.

[0066] This embodiment can determine the first speed according to the required thickness of the repair layer, and control the laser beam of the chemical vapor deposition equipment to move toward the second repair hole at the first speed starting from the first repair hole to form a repair layer on the non-metallic layer and the fracture.

[0067] like Figure 1 As shown in c, the laser beam 9 moves at a uniform speed from the first repair hole 6 to the second repair hole 7 at a first speed v. During the movement, under the heating effect of the laser beam 9, the metal in the metal organic chemical gas is deposited on the surface of the non-metallic layer 1 to form a metal repair layer 8.

[0068] S403: Control the camera to collect images according to a preset period.

[0069] In this embodiment, the sensor can be a camera, and the camera can be used to capture images of the area of ​​the laser beam. For example, the period of image capture by the camera can be set according to the first speed, and the period is negatively correlated with the first speed. That is, the greater the first speed, the smaller the period of image capture and the higher the frequency of image capture.

[0070] S404: Binarize the image to obtain a binary image.

[0071] Since the non-metallic layer 1 and the glass substrate 3 are both transparent, and the metal layer 2 is non-transparent, the brightness of the metal layer 2 area in the acquired image is quite different from that of the non-metallic layer 1 and the glass substrate 3. The acquired image can be binarized. Specifically, each pixel in the image can be traversed, and pixels with brightness less than a preset brightness threshold are set to black, and pixels with brightness greater than or equal to the preset brightness threshold are set to white, to obtain a binary image, such as Figure 5 Shown is a schematic diagram of a binary image. Figure 5 There are two metal layers in the structure, one of which has a fracture 5 and is the metal layer that needs to be repaired.

[0072] S405: Determine the black pixel area in the binary image as the metal layer area.

[0073] Since the metal layer is opaque, and the glass substrate and the non-metal layer are translucent, the black pixel area in the binary image is the opaque area, that is, the area of ​​the metal layer 2.

[0074] S406: If there is a white area behind the metal layer area in the binary image, determine that the white area is a fracture.

[0075] like Figure 5 As shown, the laser beam is scanned along the direction of the metal layer 2, and it can be determined whether the area behind the metal layer is a white area. If so, the white area is determined to be the area of ​​the fracture 5.

[0076] S407, using preset calibration data to calculate the distance from the fracture to the laser beam, the calibration data is the position conversion data of the camera and the laser beam.

[0077] On the chemical vapor deposition equipment, the camera and the laser beam may not be in the same position, and the camera has a certain viewing angle. When the camera captures the fracture, the laser beam may not scan the fracture. For example, the laser beam may still be before the fracture. The position conversion data of the camera and the laser beam can be used to calculate the distance from the fracture to the laser beam. Specifically, the image boundary line between the white area and the black area in the image can be determined first, and the coordinates of the real boundary line between the fracture and the metal layer in the camera coordinate system can be calculated through the image coordinates of the image boundary line in the image. The distance from the real boundary line to the laser beam is calculated through the position conversion data of the camera and the laser beam, and the coordinates of the real boundary line in the camera coordinate system are used to calculate the distance from the real boundary line to the laser beam.

[0078] S408: When the distance is less than a preset distance threshold, determine that the laser beam scans the fracture.

[0079] If the calculated distance from the fracture to the laser beam is less than the distance threshold, it means that the laser beam has approached the fracture or scanned the fracture, wherein the distance threshold can be determined according to the first speed, for example, when the first speed is higher, the distance threshold can be set to be higher, and when the first speed is lower, the distance threshold can be set to be lower.

[0080] In another optional embodiment, the sensor may also be a photoelectric sensor, which may be controlled to emit a light signal to the display panel, receive a reflected light signal, and calculate the light intensity of the reflected light signal. If the light intensity is less than a preset intensity threshold, it is determined that the laser beam has scanned the fracture. Figure 6 As shown, a photoelectric sensor can be installed on the emission head of the laser. The photoelectric sensor moves synchronously with the laser beam. The photoelectric sensor emits a light signal, such as an infrared light signal, vertically to the display panel. If the infrared light signal is irradiated on the metal layer 2, it will be strongly reflected. If it is irradiated on the fracture 5, it will be weakly reflected through the glass substrate 3. Therefore, it is possible to determine whether the laser beam has scanned the fracture 5 by the light intensity of the reflected light signal.

[0081] S409, controlling the laser beam to scan on the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed.

[0082] In this embodiment, when the laser beam scans the fracture, the scanning speed is reduced, that is, the fracture is scanned at a second speed that is less than the first speed, so that when the laser beam scans the fracture, the residence time of the laser beam on the fracture is extended, so that the laser beam has sufficient time to deposit the metal in the metal organic chemical gas into the fracture to completely fill the fracture.

[0083] S410, after detecting that the laser beam has finished scanning the fracture, a repair layer is deposited on the non-metallic layer with the second repair hole as the end point and scanning at the first speed.

[0084] Specifically, the camera can be used to collect images or the photoelectric sensor can be used to receive reflected light to detect whether the laser beam has finished scanning the fracture. Figure 5 In the binary image shown, if the distance between the black area behind the white area and the laser beam is less than the threshold, it means that the laser beam has finished scanning the fracture. Figure 6 As shown, if the light intensity of the reflected light signal changes from less than the intensity threshold to greater than the intensity threshold, it is determined that the laser beam scanning the fracture is finished, and the first speed can be restored so that the laser beam scans toward the second repair hole at the first speed to deposit a repair layer on the non-metallic layer.

[0085] In this embodiment, in the process of controlling the laser beam of the chemical vapor deposition equipment to take the first repair hole as the starting point and scan at a first speed to deposit the repair layer on the non-metallic layer, the camera is controlled to collect images according to a preset period, and the collected images are binarized to obtain a binary image, and a black pixel area in the binary image is determined as a metal layer area. If there is a white area behind the metal layer area in the binary image, the white area is determined to be a fracture, and the preset calibration data is used to calculate the distance from the white area to the laser beam. When the distance is less than a preset distance threshold, it is determined that the laser beam has scanned to the fracture, and the laser beam is controlled to scan at the fracture at a second speed. Scanning is performed to deposit a repair layer. After detecting that the laser beam has finished scanning the fracture, the repair layer is deposited on the non-metallic layer with the second repair hole as the end point and scanning at the first speed, thereby realizing real-time detection of the fracture during the laser beam scanning process and reducing the scanning speed at the fracture. The residence time of the laser beam at the fracture is increased, and a complete repair layer can be fully deposited at the fracture through a chemical vapor deposition process, thereby avoiding the problem of a step difference at the fracture and the inability to fully deposit the metal layer due to the laser beam scanning too fast, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing broken wires in the metal layer.

[0086] Embodiment 3

[0087] Figure 7 This is a schematic diagram of the structure of a display panel disconnection repair device control device provided in Embodiment 3 of the present invention. Figure 7 As shown, the display panel broken wire repair device control device is used to control the chemical vapor deposition device to repair the broken metal layer, the chemical vapor deposition device is provided with a sensor, the metal layer is a non-metal layer, and the display panel broken wire repair device control device includes:

[0088] A repair hole deposition module 701 is used to deposit a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer;

[0089] A first scanning control module 702 is used to control the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as the starting point to deposit a repair layer on the non-metal layer;

[0090] A detection data acquisition module 703 is used to control the sensor to collect detection data;

[0091] A fracture detection judgment module 704 is used to judge whether the laser beam scans the fracture according to the detection data, and if not, execute the detection data acquisition module 703, and if so, execute the second scanning control module 705;

[0092] A second scanning control module 705, configured to control the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;

[0093] The third scanning control module 706, after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metal layer by scanning at the first speed with the second repair hole as an end point.

[0094] Optionally, also include:

[0095] The fracture and repair hole forming module is used to remove foreign matter in the metal layer on the display panel to form a fracture penetrating the non-metal layer and the metal layer, and to form a first repair hole and a second repair hole penetrating the non-metal layer and the metal layer on both sides of the fracture.

[0096] Optionally, the repair hole deposition module 701 includes:

[0097] The repair hole deposition control unit is used to control the laser beam of the chemical vapor deposition equipment to deposit metal medium in the first repair hole and the second repair hole respectively.

[0098] Optionally, the sensor is a camera, and the detection data acquisition module 703 includes:

[0099] An image acquisition unit, used to control the camera to acquire images according to a preset period;

[0100] Optionally, the fracture detection and judgment module 704 includes:

[0101] A binarization processing unit, used for performing binarization processing on the image to obtain a binary image;

[0102] A metal layer determination unit, used for determining a black pixel area in the binary image as a metal layer area;

[0103] A fracture region determining unit, configured to determine that the white region is a fracture if there is a white region behind the metal layer region in the binary image;

[0104] A fracture distance calculation unit, used to calculate the distance from the fracture to the laser beam using preset calibration data, wherein the calibration data is position conversion data of the camera and the laser beam;

[0105] The first fracture scanning determination unit is used to determine that the laser beam scans the fracture when the distance is less than a preset distance threshold.

[0106] Optionally, the sensor is a photoelectric sensor, and the detection data acquisition module 703 includes:

[0107] The optical signal transceiver unit is used to control the photoelectric sensor to transmit an optical signal to the display panel and receive a reflected optical signal.

[0108] Optionally, the fracture detection and judgment module 704 includes:

[0109] A light intensity calculation unit, used to calculate the light intensity of the reflected light signal;

[0110] The second fracture scanning determination unit is used to determine that the laser beam scans the fracture if the light intensity is less than a preset intensity threshold.

[0111] The display panel disconnection repair equipment control device provided in the embodiment of the present invention can execute the display panel disconnection repair equipment control method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0112] Embodiment 4

[0113] Figure 8 A schematic diagram of the structure of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0114] like Figure 8 As shown, the electronic device 40 includes at least one processor 41, and a memory connected to the at least one processor 41, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 to the random access memory (RAM) 43. In the RAM 43, various programs and data required for the operation of the electronic device 40 can also be stored. The processor 41, the ROM 42, and the RAM 43 are connected to each other through a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0115] A number of components in the electronic device 40 are connected to the I / O interface 45, including: an input unit 46, such as a keyboard, a mouse, a camera, a photoelectric sensor, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0116] The processor 41 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The processor 41 executes the various methods and processes described above, such as a display panel disconnection repair device control method.

[0117] In some embodiments, the display panel disconnection repair device control method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the display panel disconnection repair device control method described above can be performed. Alternatively, in other embodiments, the processor 41 can be configured to execute the display panel disconnection repair device control method in any other appropriate manner (for example, by means of firmware).

[0118] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0119] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0120] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0121] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0122] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0123] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0124] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0125] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel disconnection repair device control method, characterized in that: Used to control a chemical vapor deposition device to repair a broken metal layer, the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising: Depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer; Control the laser beam of the chemical vapor deposition device to scan the first repair hole at a first speed to deposit a repair layer on the non-metal layer; Controlling the sensor to collect detection data; Determining whether the laser beam scans the fracture according to the detection data; If not, return to the step of controlling the sensor to collect detection data; If yes, control the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed; After detecting that the laser beam has finished scanning the fracture, a repair layer is deposited on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.

2. The display panel disconnection repair device control method according to claim 1, characterized in that: Before depositing the metal medium in the first repair hole and the second repair hole of the metal layer, the method further comprises: Foreign matters in the metal layer are removed on the display panel to form a fracture penetrating the non-metal layer and the metal layer, and a first repair hole and a second repair hole penetrating the non-metal layer and the metal layer are formed on both sides of the fracture.

3. The display panel disconnection repair device control method according to claim 1, characterized in that: Depositing a metal medium in the first repair hole and the second repair hole of the metal layer includes: The laser beam of the chemical vapor deposition device is controlled to deposit metal media in the first repair hole and the second repair hole respectively.

4. The display panel disconnection repair device control method according to claim 1, characterized in that: The sensor is a camera, and controlling the sensor to collect detection data includes: Control the camera to collect images according to the preset period.

5. The display panel disconnection repair device control method according to claim 4, characterized in that: Judging whether the laser beam scans the fracture according to the detection data includes: Performing binarization processing on the image to obtain a binary image; Determine the black pixel area in the binary image as the metal layer area; If there is a white area behind the metal layer area in the binary image, determining that the white area is a fracture; The distance from the fracture to the laser beam is calculated using preset calibration data, wherein the calibration data is position conversion data of the camera and the laser beam; When the distance is less than a preset distance threshold, it is determined that the laser beam has scanned the fracture.

6. The display panel disconnection repair device control method according to claim 1, characterized in that: The sensor is a photoelectric sensor, and controlling the sensor to collect detection data includes: The photoelectric sensor is controlled to transmit a light signal to the display panel and receive a reflected light signal.

7. The display panel disconnection repair device control method according to claim 6, characterized in that: Judging whether the laser beam scans the fracture according to the detection data includes: Calculating the light intensity of the reflected light signal; If the light intensity is less than a preset intensity threshold, it is determined that the laser beam has scanned the fracture.

8. A display panel disconnection repair equipment control device, characterized in that: Used to control a chemical vapor deposition device to repair a broken metal layer, the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising: A repair hole deposition module, used for depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer; A first scanning control module, used for controlling the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as a starting point to deposit a repair layer on the non-metal layer; A detection data acquisition module, used to control the sensor to collect detection data; A fracture detection and judgment module, used for judging whether the laser beam scans the fracture according to the detection data, and if not, executing the detection data acquisition module, and if so, executing the second scanning control module; A second scanning control module, used for controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed; A third scanning control module, after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metal layer by scanning at the first speed with the second repair hole as an end point.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the display panel disconnection repairing device control method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the display panel disconnection repair device control method according to any one of claims 1 to 7 when executed.

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