Cooking utensil door body structure, preparation process, cooking utensil and integrated cooker

By setting up an internal heat insulation plate with a low-radiation layer in the door structure of the cooking appliance, the heat in the box is reflected, and the problem of excessive temperature of the door body is solved, achieving a safe and usable door body structure and efficient food cooking.

CN119531711APending Publication Date: 2025-02-28QINGDAO HAIER WISDOM KITCHEN APPLIANCE CO LTD +1
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Patent Information

Application Number
CN202311117909.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-08-31
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

When using cooking utensils such as steam ovens with integrated stoves, the temperature of the glass panel outside the door body is high, which is easy to burn the user, and the prior art is difficult to effectively reduce the door body temperature.

Method used

An inner heat insulation plate and an outer panel are arranged in sequence at intervals. A low-radiation layer is provided on one side of the inner heat insulation plate toward the outer panel. The low-radiation layer reflects the heat in the box back to the inner cavity of the box, reducing the external surface temperature of the door body.

Benefits of technology

It effectively reduces the temperature of the outside of the door structure of the cooking utensil, prevents burning users during cooking, improves the user experience, and ensures high temperature in the inner cavity of the box and promotes food cooking.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of kitchenware, and discloses a cooking utensil door body structure, a preparation process, a cooking utensil and an integrated kitchen range, the cooking utensil door body structure is configured to be installed at an opening of a box body of the cooking utensil, and comprises a plurality of inner heat insulation plates and outer panels which are sequentially arranged at intervals; a low-radiation layer is arranged on the side, back on to the outer panel, of each inner heat insulation plate, and the low-radiation layers are used for reflecting heat in the oven body back into the inner cavity of the oven body and reducing the temperature rising speed of the inner heat insulation plates, so that the temperature rising speed of the outer panel facing a user can be reduced, and the user is prevented from being burnt in the cooking process. According to the preparation process of the inner heat insulation plate, the inner heat insulation plate base body conforming to the design raw materials and consistent with the specified shape and size is manufactured through the steps of burdening, melting and forming, and in the film coating stage, by controlling the vacuum degree and the temperature environment where the film coating procedure is located, the film coating quality can be optimized, and the heat radiation energy reflecting capacity can be improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of kitchenware, and in particular to a cooking utensil door structure, a preparation process, a cooking utensil and an integrated stove. Background Art

[0002] Integrated stove is a kitchen appliance that integrates multiple functions such as range hood, gas stove, disinfection cabinet, storage cabinet, etc. It is also called environmentally friendly stove or integrated environmentally friendly stove in the industry. It has the advantages of saving space, good fume extraction effect, energy saving, low consumption and environmental protection. The integrated stove includes a stove body, in which cooking appliances with door structures such as steam box, oven, steam-bake integrated box can be integrated to save kitchen space.

[0003] When users use cooking appliances such as the steam oven of an integrated stove to cook food, the heating tubes in the steam oven box will generate a lot of heat. During the cooking process, the heat in the box is discharged into the public kitchen flue through the integrated stove heat dissipation duct. However, since the door of the steam oven is far away from the heat dissipation duct, the temperature of the glass panel outside the door is generally high, which can easily burn users and affect their experience.

[0004] To solve the above problems, the door structure of existing cooking appliances usually has glass with a Low-E coating on the inside, so that the radiant heat of the heating tube can be reflected back into the furnace by the Low-E coated glass. However, since the emissivity of Low-E coated glass is generally high, the energy reflected back into the furnace is not ideal, which will still cause the door temperature to be too high. Alternatively, by increasing the number of door glasses, the convection heat can be blocked and the surface temperature of the door can be reduced. However, some ingredients require a higher baking temperature, such as a furnace center temperature of more than 250°C. At this time, the heat heated by the heating tube through radiation and convection will still make the surface temperature of the door high, reaching a temperature of more than 50°C, which can easily burn users and result in a poor user experience.

[0005] Therefore, there is an urgent need for a cooking utensil door structure, a preparation process, a cooking utensil and an integrated stove to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a cooking utensil door structure, a preparation process, a cooking utensil and an integrated stove, which can effectively reduce the temperature of the surface of the cooking utensil door structure, prevent users from being burned during cooking, and improve the user experience.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] In a first aspect, a cooking appliance door structure is provided, which is configured to be installed at an opening of a cooking appliance box, the cooking appliance door structure comprising a plurality of inner insulation boards and outer panels arranged in sequence and spaced apart, each of the inner insulation boards being provided with a low-emissivity layer on a side facing away from the outer panel, the low-emissivity layer being used to reflect the heat in the box back into an inner cavity of the box.

[0009] As a preferred solution of the cooking utensil door structure provided by the present invention, the plurality of inner insulation panels include a first inner glass panel and a second inner glass panel, and the first inner glass panel and / or the second inner glass panel are plated to form the low-emissivity layer.

[0010] As a preferred solution of the cooking utensil door structure provided by the present invention, the emissivity En of the inner heat insulation board is less than 0.2.

[0011] As a preferred solution of the cooking utensil door structure provided by the present invention, a first guide cavity is formed between adjacent inner heat insulation boards, and between the outer panel and the adjacent inner heat insulation board, and an air inlet is provided at the lower end of each first guide cavity;

[0012] The cooking appliance door structure also includes a top air outlet member, which is used to fix the inner insulation board and the outer panel, and a top air outlet is provided on the top air outlet member. The top air outlet is located above the first guide cavity and is connected to the first guide cavity.

[0013] As a preferred solution of the cooking utensil door structure provided by the present invention, a ventilation cavity is arranged in the top air outlet piece, and at least one partition plate is arranged in the ventilation cavity, and the partition plate divides the ventilation cavity into a plurality of second guide cavities, and the plurality of second guide cavities and the plurality of first guide cavities are arranged one by one opposite to each other.

[0014] As a preferred solution of the cooking utensil door structure provided by the present invention, the top air outlets are arranged in multiple rows on the top air outlet member, and the multiple rows of top air outlets are arranged opposite to the multiple second guide cavities one by one.

[0015] As a preferred solution of the cooking utensil door structure provided by the present invention, the cooking utensil door structure also includes two door brackets arranged at intervals, wherein the door brackets are installed between the outer panel and the outermost inner insulation board, and a lateral air inlet hole group is provided on the door bracket, and the lateral air inlet hole group is connected to at least one of the first guide chambers.

[0016] As a preferred solution of the cooking utensil door structure provided by the present invention, an elastic buckle is provided on one of the door bracket and the top air outlet piece, and a clamping cavity is provided on the other, and the elastic buckle is clamped in the clamping cavity.

[0017] As a preferred solution of the cooking utensil door structure provided by the present invention, both ends of the top air outlet member are provided with a first slot, and the top corner of the inner insulation board at the outermost end is clamped in the first slot; two bottom support members arranged at intervals are connected to the outer panel, and a second slot is provided on the bottom support member, and the bottom corner of the inner insulation board at the outermost end is clamped in the second slot.

[0018] As a preferred solution of the cooking utensil door structure provided by the present invention, a mounting block is provided between the outer panel and the outermost inner insulation board, and at least one third slot is provided on the mounting block, and the third slot is used to insert the inner insulation board located in the middle.

[0019] In a second aspect, a preparation process of a cooking utensil door structure is provided, which is applied to manufacture the cooking utensil door structure as described above, wherein the preparation process includes a preparation process of an inner heat insulation board, and the preparation process of the inner heat insulation board includes the following steps:

[0020] S1. Batching: weighing raw materials according to the designed proportion and mixing the raw materials evenly, wherein the raw materials include quartz sand, limestone, feldspar, soda ash and boric acid;

[0021] S2, melting: heating the mixed raw materials until they melt into a liquid state;

[0022] S3, molding: pouring the liquid raw material into a molding mold and solidifying it into a solid inner insulation board matrix;

[0023] S4, coating: in an environment meeting a preset vacuum degree and a preset temperature, a low-emissivity layer is formed on the inner insulation board substrate by vapor deposition to form an inner insulation board.

[0024] As a preferred solution of the preparation process of the cooking utensil door structure provided by the present invention, in step S2, the melting temperature range is 1100° C. to 1600° C.;

[0025] and / or, in step S3, the molding temperature ranges from 1100° C. to 1600° C.;

[0026] And / or, in step S4, the range of the preset vacuum degree is 10 -1 Pa~10 -6 Pa;

[0027] And / or, in step S4, the preset temperature range is greater than 800°C.

[0028] According to a third aspect, a cooking appliance is provided, comprising a housing, a hinge and the cooking appliance door structure as described above, wherein the cooking appliance door structure is rotatably mounted on the housing via the hinge.

[0029] In a fourth aspect, an integrated stove is provided, comprising a stove body, on which the cooking utensil as described above is arranged.

[0030] Beneficial effects of the present invention:

[0031] In the cooking utensil door structure provided by the present invention, a low-radiation layer is provided on the side of each inner heat insulation board facing away from the outer panel, that is, a low-radiation layer is provided on the side of the inner heat insulation board facing the inner cavity of the cooking utensil box. During the operation of the cooking utensil, the heat generated by the heating tube rushes to the side of each inner heat insulation board having the low-radiation layer, and the low-radiation layer can reflect a large amount of far-infrared radiation heat in the inner cavity of the box that escapes to the environment back into the inner cavity of the box, reducing the heating rate of several inner heat insulation boards, and further reducing the heating rate of the outer panel facing the user, controlling the temperature of the outer surface of the cooking utensil door structure within an appropriate range, and preventing the user from being burned during the cooking process. Moreover, since several inner heat insulation boards are arranged at intervals, and there is also an interval between the outer panel and the adjacent inner heat insulation board, multiple heat-insulating chambers can be formed to avoid direct contact and accelerate heat transfer, further reduce temperature rise, and control the heating rate of the door structure. At the same time, since the low-radiative layer reflects more heat back into the inner cavity of the cabinet, it can ensure that the temperature in the inner cavity of the cabinet is high enough, speed up the cooking speed of food, avoid affecting the quality of the physical product due to insufficient temperature in the cabinet, and improve the user experience.

[0032] The preparation process of the cooking utensil door structure provided by the present invention includes a production process of an inner insulation board, and an inner insulation board substrate that is consistent with the designed raw materials and has a specified shape and size is produced through the steps of mixing ingredients, melting, and forming. In the coating stage, by controlling the vacuum degree and temperature environment of the coating process, the coating quality can be optimized, the ability to reflect thermal radiation energy can be improved, and the adhesion between the coated layer and the inner insulation board substrate can be improved, thereby extending the service life of the inner insulation board.

[0033] The cooking utensils and the integrated stove including the cooking utensils provided by the present invention can effectively reduce the temperature of the surface during use, prevent users from being burned during cooking, and improve the user experience because the door structure is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a first view of a cooking appliance door structure provided by a specific embodiment of the present invention;

[0035] Figure 2 is an exploded schematic diagram of a cooking utensil door structure provided in a specific embodiment of the present invention;

[0036] Figure 3 is a cross-sectional view of a cooking utensil door structure provided by a specific embodiment of the present invention;

[0037] Figure 4 yes Figure 3 A partial enlarged view of point B in the middle;

[0038] Figure 5 is a second view of the cooking appliance door structure provided by a specific embodiment of the present invention;

[0039] Figure 6 yes Figure 2 A partial enlarged view of the middle A;

[0040] Figure 7 is a third view of the cooking appliance door structure provided by a specific embodiment of the present invention (the first inner glass plate and the second inner glass plate are hidden);

[0041] Figure 8 is a schematic diagram of a bottom support member provided in a specific embodiment of the present invention;

[0042] Fig. 9 It is a flow chart of a process for preparing an inner heat insulation board provided in a specific embodiment of the present invention.

[0043] In the figure:

[0044] 1. Outer panel; 2. First inner glass plate; 3. Second inner glass plate; 4. First guide cavity; 5. Top air outlet; 6. Door support; 7. Bottom support; 8. Mounting block;

[0045] 41. Air inlet;

[0046] 51. Top air outlet; 52. Partition plate; 53. Second flow guide cavity; 54. Elastic buckle; 55. First slot;

[0047] 61. Lateral air inlet group; 62. Card cavity;

[0048] 71. second slot; 72. plug-in portion;

[0049] 81. Third slot;

[0050] 10. Low emissivity layer;

[0051] 100. Hinge. DETAILED DESCRIPTION

[0052] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0053] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0055] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0056] like Figure 1 and Figure 2 As shown, this embodiment provides a cooking utensil door structure, which can effectively reduce the temperature of the surface of the cooking utensil door structure, prevent users from being burned during cooking, and improve the user experience.

[0057] The cooking appliance door structure is configured to be installed at the opening of the cooking appliance box, and includes a plurality of inner insulation boards and an outer panel 1 arranged in sequence and at intervals. A low-radiation layer 10 is provided on the side of each inner insulation board facing away from the outer panel 1, and the low-radiation layer 10 is used to reflect the heat in the box back to the inner cavity of the box.

[0058] In the cooking utensil door structure, each inner heat insulation board is provided with a low-radiation layer 10 on the side facing away from the outer panel 1, that is, the inner heat insulation board is provided with a low-radiation layer 10 on the side facing the inner cavity of the cooking utensil box. During the operation of the cooking utensil, the heat generated by the heating tube rushes to the side of each inner heat insulation board having the low-radiation layer 10, and the low-radiation layer 10 can reflect a large amount of far-infrared radiation heat in the inner cavity of the box that escapes to the environment back into the inner cavity of the box, reducing the heating rate of several inner heat insulation boards, thereby reducing the heating rate of the outer panel 1 facing the user, controlling the temperature of the outer surface of the cooking utensil door structure within an appropriate range, and preventing the user from being burned during the cooking process. Moreover, since several inner heat insulation boards are arranged at intervals, and there is also a gap between the outer panel 1 and the adjacent inner heat insulation board, multiple heat-insulating chambers can be formed to avoid direct contact and accelerate heat transfer, further reduce temperature rise, and control the heating rate of the door structure. At the same time, since the low-emissivity layer 10 reflects more heat back into the inner cavity of the box, it can ensure that the temperature in the inner cavity of the box is high enough, speed up the cooking speed of food, avoid affecting the quality of the food due to insufficient temperature in the box, and improve the user experience.

[0059] It should be noted that, in this embodiment, the number is at least two. Further, this embodiment does not limit the number of inner heat insulation boards.

[0060] For example, see Figure 2 and Figure 3 , several inner insulation panels include a first inner glass panel 2 and a second inner glass panel 3, and a low-emissivity layer 10 is formed on the first inner glass panel 2 and / or the second inner glass panel 3, that is, a double-layer inner insulation panel is provided, which ensures the low-emissivity capability without increasing the thickness of the door structure too much. In this embodiment, the low-emissivity layer 10 on the first inner glass panel 2 and the second inner glass panel 3 is attached thereto by evaporation, which can ensure that the adhesion is strong and will not fall off. Furthermore, the outer panel 1 is outer glass. The first inner glass panel 2, the second inner glass panel 3 and the outer panel 1 made of glass are transparent, which is convenient for users to observe the cooking status of food.

[0061] Optionally, the low-emissivity layer 10 on the inner insulation board has a low emissivity, specifically, the emissivity of the inner insulation board is En<0.2. More preferably, En<0.18, and the En of ordinary coated glass is above 0.30. The inner insulation board with an emissivity of <0.18 has a better performance of reflecting thermal radiation energy. After conducting an on-machine test, the following results were obtained: Under the same cooking temperature conditions, the use of a double-layer inner insulation board with a low-emissivity layer 10 reduces the temperature of the outer door by ≥5°C compared to a door structure with only the first layer using ordinary coated inner glass.

[0062] See also Figure 3 , Figure 4 and Figure 5 A first guide cavity 4 is formed between adjacent inner insulation boards, and between the outer panel 1 and the adjacent inner insulation board, and an air inlet 41 is provided at the lower end of each first guide cavity 4. Specifically in this embodiment, a first guide cavity 4 is formed between the first inner glass plate 2 and the second inner glass plate 3, and a first guide cavity 4 is formed between the second inner glass plate 3 and the outer panel 1. Figure 1 The cooking appliance door structure also includes a top air outlet 5, which is used to fix the inner heat insulation board and the outer panel 1, and is provided with a top air outlet 51, which is located above the first guide cavity 4 and communicates with the first guide cavity 4. The air entering the first guide cavity 4 from the air inlet 41 is heated by the heat radiation in the box, and the heated hot air flows upward and flows out through the top air outlet 51. During the entire cooking process, the low-temperature air from the outside continuously enters the first guide cavity 4 from the air inlet 41 at the lower end to reduce the temperature of the first guide cavity 4, so that convection is formed in the first guide cavity 4, and the convection airflow continuously takes away the heat of the door structure, reducing the temperature rise rate of the door structure.

[0063] See also Figure 2 and Figure 4 A ventilation cavity is arranged in the top air outlet member 5, and at least one partition plate 52 is arranged in the ventilation cavity. The partition plate 52 divides the ventilation cavity into a plurality of second guide cavities 53, and the plurality of second guide cavities 53 and the plurality of first guide cavities 4 are arranged opposite to each other. Furthermore, a plurality of rows of top air outlets 51 are arranged on the top air outlet member 5, and the plurality of rows of top air outlets 51 are arranged opposite to each other. The air inlet 41, the corresponding first guide cavity 4, the corresponding second guide cavity 53 and the corresponding row of top air outlets 51 form a straight-row air duct structure, which effectively increases the airflow velocity, takes away more heat from the door structure faster, and achieves the purpose of effectively reducing the temperature rise rate of the outer panel 1.

[0064] See also Figure 1 , Figure 2 as well as Figure 5 The cooking appliance door structure further includes two door brackets 6 arranged at intervals, the door brackets 6 are installed between the outer panel 1 and the inner heat insulation board at the outermost end, and the door brackets 6 are provided with a lateral air inlet group 61, which is connected to at least one first guide cavity 4. Specifically in this embodiment, the door bracket 6 is installed between the first inner glass plate 2 and the outer panel 1. The arrangement of the lateral air inlet group 61 enables the first guide cavity 4 to obtain low-temperature air from the side, further improving the heat dissipation effect.

[0065] See also Figure 2 and Figure 6In order to install the top air outlet 5 on the door bracket 6, an elastic buckle 54 is provided on one of the door bracket 6 and the top air outlet 5, and a clamping cavity 62 is provided on the other. The elastic buckle 54 is clamped in the clamping cavity 62 to achieve a connection between the two, which is stable and reliable and easy to install. In this embodiment, at least one elastic buckle 54 is provided at both ends of the top air outlet 5, and at least one clamping cavity 62 is provided on both door brackets 6. The elastic buckle 54 can be clamped in the corresponding clamping cavity 62. More specifically, the clamping cavity 62 can be as follows: Figure 2 The through holes shown may also be blind holes.

[0066] See also Figure 1 , Figure 2 and Figure 6 , both ends of the top air outlet 5 are provided with first slots 55. The outermost inner insulation board, i.e., the first inner glass plate 2 in this embodiment, is rectangular, and its top two corners are respectively clamped in the corresponding first slots 55. The outer panel 1 is connected with two bottom support members 7 arranged at intervals, see Figure 8 The bottom support member 7 is provided with a second slot 71, and the two corners at the bottom of the first inner glass plate 2 are respectively clamped in the second slots 71 on the two bottom support members 7. In this way, the first inner glass plate 2 and the outer panel 1 are installed.

[0067] Further, see Figure 8 The bottom support member 7 is provided with an inserting portion 72. Figure 2 The door body bracket 6 is a hollow columnar structure, and corresponding holes are set on its two side walls to form a lateral air inlet hole group 61. The two bottom support members 7 are inserted into the door body bracket 6 through the plug-in parts 72 in a one-to-one correspondence.

[0068] like Figure 7 As shown, a mounting block 8 is provided between the outer panel 1 and the outermost inner heat insulation board (i.e., the first inner glass plate 2 in this embodiment), and at least one third slot 81 is provided on the mounting block 8. The third slot 81 is used to insert the inner heat insulation board located in the middle, so as to achieve fixed installation of the inner heat insulation board. Specifically, four mounting blocks 8 are provided, and the third slots 81 on the four mounting blocks 8 are used to insert the four corners of the inner heat insulation board.

[0069] The interval t1 between the first inner glass plate 2 and the second inner glass plate 3 and the interval t2 between the second inner glass plate 3 and the outer panel 1 may be the same or different. Preferably, t1 is greater than t2, so that the first guide cavity 4 close to the inner cavity of the box body dissipates heat faster.

[0070] like Fig. 9As shown, this embodiment also provides a preparation process of a cooking utensil door structure, which is used to manufacture the above cooking utensil door structure, and the preparation process includes a preparation process of an inner heat insulation board, and the preparation process of the inner heat insulation board includes the following steps:

[0071] S1. Ingredients: weigh the raw materials according to the designed proportion and mix them evenly. The raw materials include quartz sand, limestone, feldspar, soda ash and boric acid. Since the inner insulation board is made of glass, the raw materials are the raw materials used to make glass.

[0072] S2, melting: heating the mixed raw materials until they are melted into liquid state. Specifically, the formed glass liquid is uniform and has no bubbles.

[0073] S3, molding: pouring the liquid raw material into the molding mold and solidifying it into a solid inner insulation board matrix.

[0074] Step S3 aims to transform the melted glass into a solid product with a fixed shape. Molding must be carried out within a certain temperature range. This process is a cooling process. The glass first changes from a viscous liquid state to a plastic state, and then to a brittle solid state.

[0075] S4, coating: in an environment meeting a preset vacuum degree and a preset temperature, a low-emissivity layer 10 is formed by vapor deposition on the inner insulation board substrate to form an inner insulation board.

[0076] The manufacturing process of the inner insulation board, i.e., the manufacturing process of the first inner glass plate 2 and the second inner glass plate 3, manufactures an inner insulation board substrate that is consistent with the designed raw materials and has the specified shape and size through the steps of batching, melting, and forming. In the coating stage, by controlling the vacuum degree and temperature environment of the coating process, the coating quality can be optimized, the ability to reflect thermal radiation energy can be improved, and the adhesion between the coated layer and the inner insulation board substrate can be improved, thereby extending the service life of the inner insulation board.

[0077] Specifically, in step S2, the melting temperature range is 1100°C to 1600°C; in step S3, the molding temperature range is 1100°C to 1600°C; in step S4, the preset vacuum degree range is 10 -1 Pa~10 -6 Pa; in step S4, the preset temperature range is greater than 800°C.

[0078] The advantages of using the above preset vacuum and temperature environment for coating are as follows: the film thickness can be controlled to prepare functional films with various functions; the film is prepared under vacuum conditions, the environment is clean, and the film is not easily contaminated, so a film with good density, high purity and uniform coating can be obtained; the film has good bonding strength with the glass substrate and the film is firm. In short, high vacuum and high temperature make the film denser, the thickness is better controlled, and the functional effect is better.

[0079] The following table shows a comparison of parameters between glass with a low-emissivity layer 10 prepared by the above process (low-emissivity glass in the table) and ordinary LOW-E glass prepared by the existing process.

[0080] product Ordinary LOW-E glass Low-E glass Thickness(mm) 3.2 / 4 3.2 / 4 Light transmittance (%) 82-84 75-79 Emissivity >0.25 Less than 0.18 Square resistance(Ω) >20 Less than 15

[0081] Specifically, in step S4, for CVD coating, a chemical solution with tin salt as the main component is attached to the surface of the hot glass substrate to form a single-layer tin oxide (SnO2) compound film with certain low-radiation function. The film formation process in the glass coating process is roughly as follows:

[0082] In a vacuum environment, the evaporation material moves in a straight line in any direction in the state of atoms or molecules under the action of the evaporation source. When it encounters a surface with a lower temperature, it is adsorbed. As the particles continue to increase, a film layer is gradually formed. From the beginning of evaporation to the film formation on the substrate surface, it can be divided into four stages.

[0083] (1) Initial stage

[0084] When the incident evaporation material particles are adsorbed by the substrate, a large number of crystal nuclei appear in the initial stage of forming a film layer on the substrate. The diameter of the nucleus is about 2nm, and the distance between the nuclei is about 30nm. More and more atoms are adsorbed, forming islands of different shapes. The process of atoms combining with each other in an instant is as follows: two atoms that exist separately - more and more atoms are adsorbed - the contact point gradually becomes larger - the atoms are connected into small islands.

[0085] (2) Agglomeration stage

[0086] As the vapor of the evaporated material is continuously generated, the original small islands are expanded and connected to form large islands. The atoms first adsorbed on the surface of the substrate have condensed into small islands, and the vapor atoms that arrive later continuously fill the gaps between the islands and aggregate into large islands.

[0087] (3) Intermediate process

[0088] The edges of the large islands are connected irregularly to form a mesh film, channel, passage, and hole stage. The amount of vapor of the evaporating material gradually increases, and a honeycomb structure is formed between the large islands. The gaps begin to connect, but the connected parts are not dense enough.

[0089] (4) Film formation stage

[0090] On the basis of the channel stage, as the vapor atoms of the evaporated material are continuously adsorbed and continuously filled around the channel, a film layer is gradually formed. The thickness of this film is not uniform at the microscopic level, but uneven.

[0091] like Fig. 9 As shown, the preparation process of the inner heat insulation board provided in this embodiment further includes step S5: annealing.

[0092] During the forming process, glass undergoes drastic temperature and shape changes, which leave thermal stress in the glass. This thermal stress will reduce the strength and thermal stability of glass products. If it is cooled directly, it is likely to break by itself during the cooling process or in the subsequent storage, transportation and use (commonly known as cold explosion of glass). In order to eliminate the cold explosion phenomenon, glass products must be annealed after forming. Annealing is to keep the temperature within a certain temperature range or slowly cool down for a period of time to eliminate or reduce the thermal stress in the glass to the allowable value. The annealing temperature is between room temperature and 600°C.

[0093] The finished products after annealing can be cut, packaged and transported to the workshop for installation of the door structure.

[0094] This embodiment also provides a cooking utensil, including a box, a hinge 100 and the cooking utensil door structure as described above, wherein the cooking utensil door structure is rotatably mounted on the box via the hinge 100. This embodiment also provides an integrated stove, including a stove body, on which the cooking utensil as described above is arranged.

[0095] The cooking utensils and the integrated stove including the cooking utensils provided by the present invention can effectively reduce the temperature of the surface during use, prevent users from being burned during cooking, and improve the user experience because the door structure is provided.

[0096] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A cooking appliance door structure, configured to be installed at an opening of a cooking appliance box, characterized in that: The cooking appliance door structure comprises a plurality of inner insulation panels and outer panels (1) which are arranged in sequence and at intervals, and a low-radiation layer (10) is provided on the side of each inner insulation panel facing away from the outer panel (1), and the low-radiation layer (10) is used to reflect the heat in the box body back to the inner cavity of the box body.

2. The cooking appliance door structure according to claim 1, characterized in that: The plurality of inner heat insulation panels comprise a first inner glass panel (2) and a second inner glass panel (3), and the low-emissivity layer (10) is plated on the first inner glass panel (2) and / or the second inner glass panel (3).

3. The cooking appliance door structure according to claim 1, characterized in that: The emissivity En of the inner heat insulation board is less than 0.

2.

4. The cooking appliance door structure according to claim 1, characterized in that: A first flow guide cavity (4) is formed between adjacent inner heat insulation boards, and between the outer panel (1) and the adjacent inner heat insulation board, and an air inlet (41) is provided at the lower end of each first flow guide cavity (4); The cooking appliance door structure further comprises a top air outlet member (5), wherein the top air outlet member (5) is used to fix the inner heat insulation board and the outer panel (1), and a top air outlet (51) is provided on the top air outlet member (5), and the top air outlet (51) is located above the first flow guide cavity (4) and communicated with the first flow guide cavity (4).

5. The cooking appliance door structure according to claim 4, characterized in that: A ventilation cavity is arranged in the top air outlet member (5), and at least one partition plate (52) is arranged in the ventilation cavity. The partition plate (52) divides the ventilation cavity into a plurality of second flow guide cavities (53), and the plurality of second flow guide cavities (53) and the plurality of first flow guide cavities (4) are arranged opposite to each other.

6. The cooking appliance door structure according to claim 5, characterized in that: The top air outlets (51) are arranged in multiple rows on the top air outlet member (5), and the multiple rows of top air outlets (51) are arranged opposite to the multiple second flow guide cavities (53) one by one.

7. The cooking appliance door structure according to claim 4, characterized in that: The cooking utensil door structure further comprises two door brackets (6) arranged at intervals, wherein the door bracket (6) is installed between the outer panel (1) and the outermost inner heat insulation board, and a lateral air inlet hole group (61) is provided on the door bracket (6), and the lateral air inlet hole group (61) is connected to at least one of the first guide cavities (4).

8. The cooking appliance door structure according to claim 7, characterized in that: An elastic buckle (54) is provided on one of the door body bracket (6) and the top air outlet piece (5), and a clamping cavity (62) is provided on the other, and the elastic buckle (54) is clamped in the clamping cavity (62).

9. The cooking appliance door structure according to claim 4, characterized in that: Both ends of the top air outlet member (5) are provided with a first slot (55), and the top corner of the inner heat insulation board at the outermost end is clamped in the first slot (55); two bottom support members (7) arranged at intervals are connected to the outer panel (1), and the bottom support member (7) is provided with a second slot (71), and the bottom corner of the inner heat insulation board at the outermost end is clamped in the second slot (71).

10. The cooking appliance door structure according to claim 1, characterized in that: A mounting block (8) is provided between the outer panel (1) and the inner heat insulation board at the outermost end, and at least one third slot (81) is provided on the mounting block (8), and the third slot (81) is used for inserting the inner heat insulation board located in the middle.

11. A process for preparing a cooking utensil door structure, characterized in that: Applicable to manufacturing the cooking utensil door structure according to any one of claims 1 to 10, the preparation process includes a preparation process of an inner heat insulation board, and the preparation process of the inner heat insulation board includes the following steps: S1. Batching: weighing raw materials according to the designed proportion and mixing the raw materials evenly, wherein the raw materials include quartz sand, limestone, feldspar, soda ash and boric acid; S2, melting: heating the mixed raw materials until they melt into a liquid state; S3, molding: pouring the liquid raw material into a molding mold and solidifying it into a solid inner insulation board matrix; S4, coating: in an environment meeting a preset vacuum degree and a preset temperature, a low-emissivity layer (10) is formed by vapor deposition on the inner heat insulation board substrate to form an inner heat insulation board.

12. The process for preparing a cooking utensil door structure according to claim 11, characterized in that: In step S2, the melting temperature ranges from 1100°C to 1600°C; and / or, in step S3, the molding temperature ranges from 1100° C. to 1600° C.; And / or, in step S4, the range of the preset vacuum degree is 10 -1 Pa~10 -6 Pa; And / or, in step S4, the preset temperature range is greater than 800°C.

13. A cooking appliance, characterized in that It comprises a box body, a hinge (100) and a cooking appliance door structure as claimed in any one of claims 1 to 10, wherein the cooking appliance door structure is rotatably mounted on the box body via the hinge (100).

14. An integrated stove, characterized in that: It comprises a stove body, on which the cooking utensil according to claim 13 is arranged.