Equipment for detecting thermal conductivity of high-thermal-conductivity organic silicon interface material

Abstract

The invention provides high-thermal-conductivity organic silicon interface material thermal conductivity detection equipment, and relates to the technical field of thermal interface material detection.The high-thermal-conductivity organic silicon interface material thermal conductivity detection equipment comprises a heating table, a simulation pressing seat, a bearing base and two pressed clamping seats, clamping strips are connected to one sides of the two pressed clamping seats in a hinged mode, and supporting springs are arranged at the bottoms of the two ends of the pressed clamping seats; a hydraulic push rod A is connected to the center of the top of the simulation pressing seat in an assembled mode, and a torsional spring is arranged at the hinged point of the pressed clamping seat and the clamping strip. According to the technical key points, a hydraulic push rod A controls a simulation pressing seat to move towards the bottom, the surfaces of the two sides of the simulation pressing seat are attached to the surface of the top of a clamping strip, then the bottom of an organic silicon interface material is attached to the surface of a heating table, and the heating table is always at a target detection temperature; the organic silicon interface material is rapidly heated to the target temperature from the environment temperature, so that the thermal conductivity detection effect of the organic silicon interface material is improved.

Description

Technical Field

[0001] The invention relates to the technical field of thermal interface material detection, in particular to a device for detecting thermal conductivity of a high thermal conductivity organic silicon interface material. Background Art

[0002] Thermal interface material is a general term for materials used to coat heat dissipation devices and heating devices to reduce the contact thermal resistance between them. In detail, all surfaces have roughness, so when two surfaces come into contact, they cannot be completely in contact. There will always be some air gaps in between, and the thermal conductivity of air is very small, so it causes a relatively large contact thermal resistance. The use of thermal interface materials can fill this air gap, thereby reducing the contact thermal resistance and improving the heat dissipation performance.

[0003] There are very tiny uneven gaps between the surface of microelectronic materials and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the area of ​​the heat sink base, and the rest is air gap. Because the thermal conductivity of air is only 0.024W / (m·K), it is a poor conductor of heat, which will cause the contact thermal resistance between the electronic components and the heat sink to be very large, seriously hindering the conduction of heat, and ultimately causing the heat sink to perform poorly. Filling these gaps with thermal interface materials with high thermal conductivity, excluding the air in them, and establishing an effective heat conduction channel between the electronic components and the heat sink can greatly reduce the contact thermal resistance and fully play the role of the heat sink.

[0004] Thermal interface materials are mainly divided into six categories: silicone grease, silicone, heat sink pads, phase change materials, phase change metal sheets and thermal conductive adhesives. As a type of thermal interface material, silicone interface materials combine the properties of inorganic and organic materials, and have basic properties such as low surface tension, small viscosity-temperature coefficient, high compressibility, and high gas permeability. They also have excellent properties such as high and low temperature resistance, electrical insulation, oxidation stability, weather resistance, flame retardancy, hydrophobicity, corrosion resistance, non-toxicity, tastelessness, and physiological inertness. They are widely used in aerospace, electronics, construction, transportation, chemicals, textiles, food, light industry, and medical industries. Silicone is mainly used in sealing, bonding, lubrication, coating, surface activity, demoulding, defoaming, anti-foaming, waterproofing, moisture-proofing, and inert filling. With the continuous growth in the number and variety of silicones, the application field continues to expand, forming an important product system that is unique in the chemical new material industry. In the production process of silicone or other thermal interface materials, it is necessary to test their thermal conductivity to ensure the application performance of silicone.

[0005] Patent document with announcement number CN217717585U, a thermal interface material thermal performance detection system and detection equipment, the thermal interface material thermal performance detection system includes a heating platform, having a first contact surface; a first control unit, connected to the heating platform, for controlling the heating of the heating platform and detecting the working temperature of the heating platform; a radiator, having a second contact surface, the second contact surface is arranged opposite to the first contact surface, and there is a gap between the first contact surface and the second contact surface, and the gap is used to place the thermal interface material; a pressure unit, for applying pressure to the heating platform and the radiator in the fitting direction; during the thermal interface material testing process, pressure is applied to the heating platform and the radiator in the fitting direction through the pressure unit, so that the fitting state of the thermal interface material simulates the fitting state in the actual application process, so that the measured thermal conductivity and thermal resistance data more accurately reflect the thermal performance of the entire system.

[0006] However, in the process of implementing the above technical solution, it is found that the above technical solution has the following technical problems:

[0007] The thermal interface material thermal performance testing system applies pressure to the heating platform and the heat sink in the fitting direction through a pressure unit, so that the fitting state of the thermal interface material simulates the fitting state in the actual application process. In order to ensure the detection effect, it is necessary to start heating after the thermal interface material is fully clamped, and perform the test within a fixed time. This has the best effect on the detection of thermal conductivity. However, in actual application, it is generally difficult to raise the temperature of the heating platform to a fixed value at the initial moment of the test, and at the same time, the thermal interface material is not affected by the heating platform when simulating the fitting state, which is not conducive to efficient thermal interface material thermal conductivity performance testing within a fixed time. Summary of the invention

[0008] In order to overcome the shortcomings of the existing thermal interface material thermal performance testing system, which is generally difficult to raise the temperature of the heating platform to a fixed value at the initial moment of the test, and at the same time, the thermal interface material is not affected by the heating platform when simulating the bonding state, which is not conducive to efficient thermal interface material thermal conductivity testing within a fixed time, the embodiment of the present application provides a high thermal conductivity silicone interface material thermal conductivity testing device, which uses a torsion spring at the hinge point of the clamping strip and the pressure clamping seat to rotate the clamping strip around the hinge point with the pressure clamping seat to clamp the silicone interface material between the clamping strip and the pressure clamping seat. The hydraulic push rod A is used to control the simulated pressure seat to move toward the bottom, and the surfaces on both sides of the simulated pressure seat are first made to fit with the top surface of the clamping strip. Based on the overall thickness of the clamping strip, after the bottom of the silicone interface material fits with the surface of the heating platform, the silicone interface material is tightened with the help of two clamping strips and two pressure clamps, so that the simulated pressure seat is pressed toward the bottom on the relatively flat silicone interface material, which is beneficial for keeping the heating platform at the target detection temperature at all times, so that the silicone interface material can be quickly heated from the ambient temperature to the target temperature, thereby improving the thermal conductivity detection effect of the silicone interface material.

[0009] The technical solution adopted by the embodiment of the present application to solve the technical problem is:

[0010] A thermal conductivity testing device for a high thermal conductivity organic silicon interface material comprises a heating platform, a simulation pressure seat, a bearing base and a pressure clamp seat, wherein the simulation pressure seat is arranged directly above the heating platform;

[0011] The bearing base is arranged on the outer side of the heating platform, and the top surfaces of the two are kept flush;

[0012] There are two pressure clamping seats, which are respectively located at the top of both sides of the bearing base;

[0013] One side of the two pressure clamping seats is hingedly connected with a clamping strip, the bottoms of both ends of the pressure clamping seats are provided with supporting springs, and the center of the top of the simulation pressure seat is assembled and connected with a hydraulic push rod A;

[0014] Among them, the two sides of the bearing base are recessed toward the bottom, supporting the pressure clamp seat to move at the top of the two sides of the bearing base, the two clamping strips clamp the silicone interface material at the top of the two pressure clamp seats, and supporting the hydraulic push rod A to control the simulated pressure seat to drive the silicone interface material to the bottom to fit the surface of the top of the heating platform.

[0015] In a possible implementation, the four corners of the bottom of the bearing base are assembled and connected with vertical frames, a connecting plate seat is assembled and connected between the bottoms of the two vertical frames located at both ends of the bearing base, the tops of both ends of the connecting plate seat are assembled and connected with columns, the bottoms of both ends of the simulation pressure seat are assembled and connected with guide bases, the bottoms of both ends of the guide base are integrally formed with guide sleeves, the two guide bases are respectively slidably connected to the outside of the two columns at both ends of the bearing base, supporting the simulation pressure seat to move straight up and down on the top of the heating platform, and the two guide sleeves on one guide base are slidably connected to the outside of the two columns.

[0016] In a possible implementation, one end of the two columns located at both ends of the bearing base is jointly equipped with an assembly panel, the hydraulic push rod A is assembled and connected to the top of the assembly panel, and one end of the hydraulic push rod passes through the internal control simulation pressure seat of the assembly panel to move between the assembly panel and the bearing base.

[0017] In a possible implementation, guide rods are integrally formed at the bottom of both ends of the pressure clamp seat, and the guide rods are movably connected to the inside of the bearing base. The support spring is sleeved on the outside of the guide rods, and the two ends are respectively supported on the bottom surface of the pressure clamp seat and the top surfaces on both sides of the bearing base.

[0018] In a possible implementation, the hinge point of the pressure clamp seat and the clamping strip is arranged at both ends of the pressure clamp seat and the clamping strip, and a torsion spring is arranged at the hinge point of the pressure clamp seat and the clamping strip, and the torsion spring supports the clamping strip around its hinge point with the pressure clamp seat to cover the top surface of the pressure clamp seat.

[0019] In one possible implementation, one side of the clamping strip extends from one side of the top of the pressure clamp seat toward a direction away from the side, so that the clamping strip as a whole is wider than the pressure clamp seat, and one side of the clamping strip is supported and controlled so that the other side rotates around the hinge point between the clamping strip and the pressure clamp seat.

[0020] In a possible implementation, the bottoms of both sides of the simulated pressure seat are processed with storage slots, and the interior of the storage slots is movably connected with regulating strips, and the tops of both sides of the simulated pressure seat are assembled with hydraulic push rods B, and one end of the hydraulic push rods B passes through the interior of the simulated pressure seat and is assembled and fixed inside the storage slot and at the center of the top of the regulating strip.

[0021] In a possible implementation, the two regulating strips are respectively located directly above the two pressure clamps, and the simulated pressure seat drives the regulating strip to move from top to bottom to apply pressure to the clamping strip, so that the supporting spring at the bottom of the pressure clamp is compressed and contracted, and simultaneously drives the silicone interface material clamped between the clamping strip and the pressure clamp to contact the heating platform at the bottom.

[0022] In one possible implementation, the hydraulic push rod B controls the regulating strip to extend from the inside of the receiving slot at the top of the simulated pressure seat, so that when the simulated pressure seat presses the silicone interface material onto the surface of the heating table, the regulating strip is pressed onto the top of the clamping strip, so that the bottom end surface of the regulating strip is lower than the surface of the heating table, thereby tightening the silicone interface material.

[0023] The beneficial effects of this application are:

[0024] First, in this scheme, by using the torsion spring at the hinge point of the clamping strip and the pressure clamping seat, the clamping strip is rotated around the hinge point with the pressure clamping seat to clamp the organic silicon interface material between the clamping strip and the pressure clamping seat, and the hydraulic push rod A is used to control the simulated pressure seat to move toward the bottom, firstly, the surfaces on both sides of the simulated pressure seat are made to fit with the top surface of the clamping strip, and based on the overall thickness of the clamping strip, after the bottom of the organic silicon interface material fits with the surface of the heating platform, the organic silicon interface material is tightened with the help of two clamping strips and two pressure clamping seats, so that the simulated pressure seat is pressed toward the bottom on the relatively flat organic silicon interface material, which is conducive to keeping the heating platform at the target detection temperature at all times, so that the organic silicon interface material is quickly heated from the ambient temperature to the target temperature, thereby improving the thermal conductivity detection effect of the organic silicon interface material;

[0025] Secondly, in this scheme, by arranging regulating strips that can extend toward the bottom inside both sides of the simulation pressure seat, the regulating strips are received inside the receiving grooves under normal conditions. When the hydraulic push rods B installed on the tops of both sides of the simulation pressure seat simultaneously control the regulating strips to extend from the inside of the receiving grooves toward the bottom, the distance between the bottom of the simulation pressure seat and the top of the clamping strip can be adjusted, so as to facilitate the control of the degree to which the clamping strip and the pressure clamping seat tighten the silicone interface material toward the bottom during the process of the simulation pressure seat driving the regulating strips to move toward the bottom. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of a thermal conductivity detection device for a high thermal conductivity organic silicon interface material according to the present invention;

[0027] Figure 2 It is a schematic diagram of an explosion of a thermal conductivity detection device for a high thermal conductivity organic silicon interface material of the present invention;

[0028] Figure 3 This is a front view of a thermal conductivity detection device for a high thermal conductivity organic silicon interface material according to the present invention;

[0029] Figure 4 This invention is a thermal conductivity detection device for high thermal conductivity silicone interface material Figure 3 The enlarged schematic diagram of the middle A part;

[0030] Figure 5It is a schematic diagram of the connection structure of a clamping strip and a pressure clamping seat of a thermal conductivity detection device for a high thermal conductivity organic silicon interface material of the present invention;

[0031] Figure 6 The cross-sectional view is a simulated pressure seat of a thermal conductivity detection device for a high thermal conductivity organic silicon interface material of the present invention.

[0032] Figure numerals: 1. Hydraulic push rod A; 2. Assembly panel; 3. Simulation pressure seat; 4. Hydraulic push rod B; 5. Bearing base; 6. Clamping strip; 7. Heating table; 8. Pressure clamp seat; 9. Stand; 10. Column; 11. Connecting plate seat; 12. Guide base; 13. Guide rod; 14. Adjusting pressure strip; 15. Guide sleeve; 16. Support spring; 17. Torsion spring; 18. Storage slot. DETAILED DESCRIPTION

[0033] The technical solution in the embodiment of the present application is to solve the problems of the above-mentioned background technology, and the overall idea is as follows:

[0034] Embodiment 1:

[0035] This embodiment introduces a specific structure of a high thermal conductivity organic silicon interface material thermal conductivity detection device. Figure 1-Figure 5 As shown, it includes a heating platform 7, a simulation pressure seat 3 arranged just above the heating platform 7, a bearing base 5 arranged outside the heating platform 7 and two pressure clamping seats 8 respectively located at the top of both sides of the bearing base 5, one side of the two pressure clamping seats 8 is hingedly connected with a clamping strip 6, the bottom of both ends of the pressure clamping seats 8 is provided with a supporting spring 16, and a hydraulic push rod A1 is assembled and connected at the center of the top of the simulation pressure seat 3;

[0036] The top surfaces of the bearing base 5 and the heating platform 7 are kept flush, and the two sides of the bearing base 5 are recessed toward the bottom, providing sufficient space for the pressure clamping seat 8 to move on the top of the two sides of the bearing base 5;

[0037] Secondly, in order to facilitate the positioning of the support spring 16, the two ends of the support spring 16 are supported on the bottom surface of the pressure clamp seat 8 and the top surfaces of both sides of the bearing base 5, such as Figure 4 As shown, the bottoms of both ends of the pressure clamp seat 8 are integrally formed with guide rods 13. By movably connecting the guide rods 13 to the inside of the bearing base 5, when the support spring 16 is sleeved on the outside of the guide rods 13, the support spring 16 can be positioned, and at the same time, the pressure clamp seat 8 is ensured to move straight up and down on one side of the bearing base 5;

[0038] Furthermore, by setting the hinge point of the pressure clamp seat 8 and the clamping strip 6 at both ends of the pressure clamp seat 8 and the clamping strip 6, and providing a torsion spring 17 at the hinge point of the pressure clamp seat 8 and the clamping strip 6, when the clamping strip 6 and the pressure clamp seat 8 need to be used to clamp and fix the organic silicon interface material, the torsion spring 17 drives the clamping strip 6 around the hinge point with the pressure clamp seat 8 to cover the top surface of the pressure clamp seat 8, and the organic silicon interface material can be fixed when passing between the clamping strip 6 and the pressure clamp seat 8;

[0039] At this time, because the two clamping strips 6 clamp the organic silicon interface material on the top of the two pressure clamping seats 8, when the hydraulic push rod A1 controls the simulated pressure seat 3 to move to the bottom, after the surfaces on both sides of the simulated pressure seat 3 are fitted with the top surface of the clamping strips 6, based on the overall thickness of the clamping strips 6, in the process of the top surface of the clamping strips 6 being flush with the top surface of the bearing base 5, the organic silicon interface material is tightened with the help of the two clamping strips 6 and the two pressure clamping seats 8, and after the organic silicon interface material is fitted with the surface of the top of the heating table 7, the initial flatness of the organic silicon interface material can be guaranteed (for the relevant detection principles, please refer to the known technology in the art, and the present application aims to control the organic silicon interface material to enter the heating state only when it is under pressure, and save the preheating time of the heating table 7);

[0040] Furthermore, in order to facilitate the control of the rotation of the clamping strip 6 around the hinge point between the clamping strip 6 and the pressure clamping seat 8, as shown in FIG. Figure 4 As shown, by extending one side of the clamping strip 6 from one side of the top of the pressure clamp seat 8 to the direction away from the side, the clamping strip 6 is made wider than the pressure clamp seat 8 as a whole, so that one side of the clamping strip 6 can be supported to be controlled. When the side of the clamping strip 6 is controlled, the other side can be rotated around the hinge point between the clamping strip 6 and the pressure clamp seat 8 to flip the clamping strip 6 from the top of the pressure clamp seat 8.

[0041] In some examples, such as Figure 1 As shown, four corners of the bottom of the bearing base 5 are assembled and connected with upright frames 9, a connecting plate seat 11 is assembled and connected between the bottoms of the two upright frames 9 at both ends of the bearing base 5, and the tops of both ends of the connecting plate seat 11 are assembled and connected with upright columns 10, and the bottoms of both ends of the simulation pressure seat 3 are assembled and connected with guide bases 12, and the bottoms of both ends of the guide base 12 are integrally formed with guide sleeves 15, and the two guide sleeves 15 on one guide base 12 are slidably connected to the outside of the two upright columns 10;

[0042] One end of two upright posts 10 located at both ends of the bearing base 5 is commonly equipped with an assembly panel 2;

[0043] Among them, by making the two guide bases 12 slidably connected to the outside of the two columns 10 at both ends of the bearing base 5, a track can be provided for the simulated press seat 3 to move and fix on the top of the heating platform 7, so as to ensure that the simulated press seat 3 moves straight up and down on the top of the heating platform 7;

[0044] Secondly, after the hydraulic push rod A1 is assembled and connected to the top of the assembly panel 2, so that one end of it passes through the interior of the assembly panel 2 and is fixed to the center of the top of the simulation pressure seat 3, the hydraulic push rod A1 can control the simulation pressure seat 3 to move between the assembly panel 2 and the supporting base 5.

[0045] The above design controls one side of the clamping strip 6 so that the clamping strip 6 rotates around the hinge point between the clamping strip 6 and the pressure clamping seat 8 and flips up from the top of the pressure clamping seat 8. When the organic silicon interface material is placed on the top of the two pressure clamping seats 8, the clamping strip 6 and the pressure clamping seat 8 are connected to the torsion spring 17 at the hinge point, and the clamping strip 6 is driven to cover the top surface of the pressure clamping seat 8 around the hinge point between the clamping strip 6 and the pressure clamping seat 8, so that the organic silicon interface material can be fixed when passing between the clamping strip 6 and the pressure clamping seat 8.

[0046] Subsequently, the hydraulic push rod A1 is used to control the simulated pressing seat 3 to move toward the bottom, so that the surfaces on both sides of the simulated pressing seat 3 are first fitted with the top surface of the clamping strip 6. Based on the overall thickness of the clamping strip 6, in the process of the top surface of the clamping strip 6 being flush with the top surface of the bearing base 5 (after the bottom surface of the organic silicone interface material is fitted with the top surface of the bearing base 5, before the bottom surface of the simulated pressing seat 3 presses the organic silicone interface material on the top of the heating platform 7), the organic silicone interface material can be tightened with the help of two clamping strips 6 and two pressure clamping seats 8 after the bottom of the organic silicone interface material is fitted with the surface of the heating platform 7;

[0047] In this state, after the organic silicon interface material is fitted with the surface of the top of the heating platform 7, the initial flatness of the organic silicon interface material can be guaranteed, thereby supporting the heating platform 7 to heat the organic silicon interface material, and ultimately supporting the thermal conductivity performance detection work of the organic silicon interface material (for the relevant detection principles, please refer to the known technology in the art). During the detection process, the heating platform 7 can be directly heated to the target temperature. When the organic silicon interface material is pressed against the surface of the heating platform 7 by the simulated pressure seat 3, it can be quickly heated from the ambient temperature to the target temperature, which is simple and efficient.

[0048] Embodiment 2:

[0049] Based on Example 1, this example introduces the specific structure of the simulation pressure seat 3, such as Figure 3 and Figure 6As shown, the bottoms of both sides of the simulated pressing seat 3 are processed with receiving notches 18, and the regulating pressure strips 14 are movably connected inside the receiving notches 18, and the tops of both sides of the simulated pressing seat 3 are assembled and connected with hydraulic push rods B4;

[0050] Among them, by passing one end of the hydraulic push rod B4 through the interior of the simulated pressure seat 3 and assembling and fixing it inside the receiving slot 18 and at the center of the top of the regulating pressure strip 14, the regulating pressure strip 14 can be controlled to move up and down inside the receiving slot 18 by means of the hydraulic push rod B4;

[0051] Secondly, by making the two regulating pressure strips 14 located directly above the two pressure clamping seats 8 respectively, when the simulated pressure seat 3 drives the regulating pressure strip 14 to move from the top to the bottom to apply pressure to the clamping strip 6, so that the support spring 16 at the bottom of the pressure clamping seat 8 is compressed and contracted, the organic silicon interface material clamped between the clamping strip 6 and the pressure clamping seat 8 can be synchronously driven to contact the heating platform 7 at the bottom, so that on the basis of the thickness of the above-mentioned clamping strip 6 itself, in the process of the top surface of the clamping strip 6 being flush with the top surface of the bearing base 5, the organic silicon interface material can be further tightened with the help of the two clamping strips 6 and the two pressure clamping seats 8 to control the degree to which the organic silicon interface material is tightened;

[0052] It is worth noting that in this process, the silicone interface material can move after overcoming the fixed friction force between the clamping strip 6 and the pressure clamping seat 8 to avoid the silicone interface material being pulled and broken. When the hydraulic push rod B4 controls the regulating strip 14 to extend from the inside of the storage slot 18 at the top of the simulated pressure seat 3 (aimed at adjusting the length of the regulating strip 14 extending from the inside of the storage slot 18 to the bottom, it does not directly participate in controlling the movement of the regulating strip 14 to the bottom, but directly applies pressure to the top of the clamping strip 6, that is, after the regulating strip 14 is extended to the extended state, the hydraulic push rod B4 is in a stationary state), when the simulated pressure seat 3 presses the silicone interface material on the surface of the heating table 7, the regulating strip 14 can be pressed on the top of the clamping strip 6, pushing the clamping strip 6 to move to the bottom, so that the bottom end surface of the regulating strip 14 is lower than the surface of the heating table 7, and the silicone interface material is tightened.

[0053] The above-mentioned design is achieved by arranging regulating strips 14 that can extend toward the bottom inside both sides of the simulation pressure seat 3. Under normal conditions, the regulating strips 14 are received inside the receiving grooves 18. When the hydraulic push rods B4 assembled on the tops of both sides of the simulation pressure seat 3 simultaneously control the regulating strips 14 to extend toward the bottom from the inside of the receiving grooves 18, the distance between the bottom of the simulation pressure seat 3 and the top of the clamping strip 6 can be adjusted. In the process of the simulation pressure seat 3 pressing the silicone interface material onto the surface of the heating platform 7, the regulating strips 14 are pressed onto the top of the clamping strip 6 to push the clamping strip 6 toward the bottom. When the bottom end face of the regulating strip 14 is lower than the surface of the heating platform 7, the silicone interface material is tightened. Finally, after the surface of the simulation pressure seat 3 is bonded to the silicone interface material, the silicone interface material is pressed between the clamping strip 6 and the heating platform 7.

[0054] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A thermal conductivity detection device for high thermal conductivity silicone interface materials, characterized in that: include: Heating table (7); A simulated pressure seat (3) is arranged directly above the heating platform (7); A bearing base (5) is arranged outside the heating platform (7), and the top surfaces of the two are kept flush; Two pressure clamping seats (8) are provided and are respectively located at the top of both sides of the bearing base (5); One side of the two pressure clamping seats (8) is hingedly connected with a clamping strip (6), the bottoms of both ends of the pressure clamping seats (8) are provided with supporting springs (16), and the center of the top of the simulation pressure seat (3) is assembled and connected with a hydraulic push rod A (1); The two sides of the bearing base (5) are recessed toward the bottom, supporting the pressure clamping seat (8) to move at the top of the two sides of the bearing base (5), and the two clamping strips (6) clamp the silicone interface material at the top of the two pressure clamping seats (8), supporting the hydraulic push rod A (1) to control the simulated pressure seat (3) to drive the silicone interface material toward the bottom to fit the surface of the top of the heating platform (7).

2. A thermal conductivity testing device for high thermal conductivity silicone interface materials as claimed in claim 1, characterized in that: The four corners of the bottom of the bearing base (5) are assembled and connected with upright frames (9); a connecting plate seat (11) is assembled and connected between the bottoms of the two upright frames (9) at the two ends of the bearing base (5); the tops of the two ends of the connecting plate seat (11) are assembled and connected with upright columns (10); the bottoms of the two ends of the simulation pressure seat (3) are assembled and connected with guide bases (12); the bottoms of the two ends of the guide base (12) are integrally formed with guide sleeves (15); The two guide bases (12) are respectively slidably connected to the outside of the two columns (10) at both ends of the bearing base (5), supporting the simulation pressure seat (3) to move vertically up and down on the top of the heating platform (7), and the two guide sleeves (15) on one guide base (12) are respectively slidably connected to the outside of the two columns (10).

3. A thermal conductivity testing device for high thermal conductivity silicone interface materials as claimed in claim 1, characterized in that: One end of the two columns (10) located at both ends of the bearing base (5) is commonly equipped with an assembly panel (2), and the hydraulic push rod A (1) is assembled and connected to the top of the assembly panel (2), and one end of the hydraulic push rod passes through the internal control simulation pressure seat (3) of the assembly panel (2) to move between the assembly panel (2) and the bearing base (5).

4. A thermal conductivity testing device for high thermal conductivity silicone interface materials as claimed in claim 1, characterized in that: The bottom of both ends of the pressure clamp seat (8) are integrally formed with a guide rod (13), and the guide rod (13) is movably connected to the inside of the bearing base (5). The support spring (16) is sleeved on the outside of the guide rod (13), and the two ends are respectively supported on the bottom surface of the pressure clamp seat (8) and the top surfaces on both sides of the bearing base (5).

5. The thermal conductivity testing device for high thermal conductivity silicone interface material according to claim 1, characterized in that: The hinge point of the pressure clamp seat (8) and the clamping strip (6) is arranged at the two ends of the pressure clamp seat (8) and the clamping strip (6), and a torsion spring (17) is arranged at the hinge point of the pressure clamp seat (8) and the clamping strip (6). The torsion spring (17) supports the clamping strip (6) around its hinge point with the pressure clamp seat (8) and covers the top surface of the pressure clamp seat (8) toward the top.

6. A thermal conductivity testing device for a high thermal conductivity organic silicon interface material as claimed in claim 5, characterized in that: One side of the clamping strip (6) extends from one side of the top of the pressure clamp seat (8) in a direction away from the side, so that the clamping strip (6) is wider than the pressure clamp seat (8) as a whole, and one side of the clamping strip (6) is supported and controlled so that the other side rotates around the hinge point between the clamping strip (6) and the pressure clamp seat (8).

7. A thermal conductivity testing device for high thermal conductivity silicone interface materials as claimed in claim 1, characterized in that: The bottoms of both sides of the simulated pressure seat (3) are processed with receiving notches (18), and the inside of the receiving notches (18) is movably connected with a regulating pressure strip (14), and the tops of both sides of the simulated pressure seat (3) are assembled and connected with hydraulic push rods B (4); One end of the hydraulic push rod B (4) passes through the interior of the simulated pressure seat (3) and is assembled and fixed inside the receiving slot (18) and at the center of the top of the regulating pressure strip (14).

8. A thermal conductivity testing device for high thermal conductivity organic silicon interface materials as claimed in claim 7, characterized in that: The two regulating strips (14) are respectively located directly above the two pressure clamping seats (8). The simulated pressure seat (3) drives the regulating strip (14) to move from the top to the bottom to apply pressure to the clamping strip (6), so that the supporting spring (16) at the bottom of the pressure clamping seat (8) is compressed and contracted, and simultaneously drives the silicone interface material clamped between the clamping strip (6) and the pressure clamping seat (8) to contact the heating platform (7) at the bottom.

9. A thermal conductivity testing device for a high thermal conductivity organic silicon interface material as claimed in claim 7, characterized in that: The hydraulic push rod B (4) controls the regulating pressure strip (14) to extend from the inside of the storage slot (18) at the top of the simulated pressure seat (3), so that when the simulated pressure seat (3) presses the organic silicon interface material onto the surface of the heating platform (7), the regulating pressure strip (14) is pressed onto the top of the clamping strip (6), so that the bottom end surface of the regulating pressure strip (14) is lower than the surface of the heating platform (7), thereby tightening the organic silicon interface material.

Images