Method and device for determining electrothermal characteristics of micro electro mechanical system device

Abstract

The invention provides a method and a device for determining electrothermal characteristics of a micro electro mechanical system device. The method comprises the following steps: determining an initial test current of a to-be-tested device; gradually adjusting the test current by taking the initial test current as a starting point, and determining first electrothermal characteristic parameters of the to-be-tested device under different test currents; determining a first relationship between the test current and the first electric heating characteristic parameter according to the change of the first electric heating characteristic parameter along with the test current; starting from the initial test current, gradually adjusting the environment temperature under any test current, and determining second electrothermal characteristic parameters of the to-be-tested device at different environment temperatures; and determining a second relationship between the environment temperature and the second electric heating characteristic parameter under any test current according to the change of the second electric heating characteristic parameter along with the environment temperature. And respectively determining the influence of the temperature generated by the test current on the performance of the to-be-tested device and the influence of the test current and the environment temperature on the performance of the to-be-tested device.

Description

Technical Field

[0001] The present application relates to the technical field of component reliability testing, and in particular to a method and device for determining the electrothermal characteristics of a micro-electromechanical system component. Background Art

[0002] With the development of Micro-Electro-Mechanical System (MEMS) technology, current MEMS devices mostly use electrical signals such as voltage or current as excitation and detection signals. The stability of MEMS devices with changes in voltage or current has an important impact on the performance and reliability of MEMS devices.

[0003] The factors that affect the performance of MEMS devices mainly come from external environments such as temperature and impact. Especially for mechanical MEMS devices, temperature is one of the main factors affecting device reliability. In order to improve the performance of MEMS devices and ensure their reliable use, it is necessary to determine the specific impact of temperature on the performance of MEMS devices. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a method and device for determining electrothermal characteristics of a MEMS device that overcomes the above problems or at least partially solves the above problems.

[0005] Based on the above purpose, the first aspect of the present application provides a method for determining electrothermal characteristics of a micro-electromechanical system device, comprising:

[0006] Determine the initial test current of the device under test;

[0007] Gradually adjusting the test current with the initial test current as the starting point to determine the first electrothermal characteristic parameter of the device under test under different test currents;

[0008] determining a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter along with the test current;

[0009] Starting with the initial test current, gradually adjusting the ambient temperature under any of the test currents, and determining the second electrothermal characteristic parameters of the device under test at different ambient temperatures;

[0010] According to the change of the second electrothermal characteristic parameter with the ambient temperature, a second relationship between the ambient temperature and the second electrothermal characteristic parameter under any of the test currents is determined.

[0011] Optionally, before determining the initial test current of the device under test, the method further includes:

[0012] Determining a standard ambient temperature of the device under test, and adjusting the test environment of the device under test to the standard ambient temperature;

[0013] Determining the standard ambient air pressure of the device under test, and adjusting the test environment of the device under test to the standard air pressure;

[0014] Determine the standard voltage of the device under test, and adjust the test voltage of the device under test to the standard voltage; wherein the standard voltage includes the standard AC voltage and the standard DC voltage of the device under test.

[0015] Optionally, the first electrothermal characteristic parameter includes: a first resonant frequency and a first amplitude ratio;

[0016] The step of determining the initial test current of the device under test comprises:

[0017] Starting from zero current, the current to the device under test is gradually increased until the device under test outputs any one of a first resonant frequency and a first amplitude ratio, and the current current is determined as an initial test current.

[0018] Optionally, gradually adjusting the test current with the initial test current as a starting point to determine the first electrothermal characteristic parameter of the device under test under different test currents includes:

[0019] determining a preset current increase of the test current;

[0020] Taking the initial current as the starting point and the current increase as the interval, the test current is gradually increased to determine the value of at least one of the first resonant frequency and the first amplitude ratio under any of the test currents.

[0021] Optionally, determining a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter with the test current includes:

[0022] Determining a first electrothermal characteristic parameter under different test currents;

[0023] Determining a first electrothermal characteristic parameter under the initial test current;

[0024] Determine the difference between the first electrothermal characteristic parameter under different test currents and the first electrothermal characteristic parameter under the initial test current;

[0025] The difference is taken as the dependent variable, the test current is taken as the independent variable, the dependent variable and the independent variable are linearly fitted to determine the first relationship between the test current and the first electrothermal characteristic parameter.

[0026] Optionally, there are at least two devices under test, and the first electrothermal characteristic parameters of the devices under test under different test currents are average values ​​of the first electrothermal characteristic parameters of at least two devices under test.

[0027] Optionally, taking the initial test current as a starting point, gradually adjusting the ambient temperature under any of the test currents to determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures includes:

[0028] Starting from the initial current and taking the current increment as an interval, determining different test currents;

[0029] Under any of the test currents, starting from the standard ambient temperature, the ambient temperature is gradually increased to determine the second electrothermal characteristic parameter under any of the test currents.

[0030] Optionally, according to the change of the second electrothermal characteristic parameter with the ambient temperature, a second relationship between the ambient temperature and the electrothermal characteristic parameter under any of the test currents is determined, and then the method further includes:

[0031] Under any of the test currents, the third relationship between only the ambient temperature and the third electrothermal characteristic parameter is determined by subtracting the second relationship from the first relationship.

[0032] In a second aspect of the present application, a device for determining electrothermal characteristics of a micro-electromechanical system device is provided, comprising:

[0033] An initial test current module is used to determine the initial test current of the device under test;

[0034] A first electrothermal characteristic parameter module, used to gradually adjust the test current with the initial test current as the starting point, and determine the first electrothermal characteristic parameter of the device under test under different test currents;

[0035] A first relationship module, configured to determine a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter with the test current;

[0036] A second electrothermal characteristic parameter module is used to start with the initial test current, gradually adjust the ambient temperature under any of the test currents, and determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures;

[0037] The second relationship module is used to determine the second relationship between the ambient temperature and the second electrothermal characteristic parameter under any of the test currents according to the change of the second electrothermal characteristic parameter with the ambient temperature.

[0038] Optionally, also include:

[0039] An environmental temperature adjustment module, used to determine the standard environmental temperature of the device under test and adjust the test environment of the device under test to the standard environmental temperature;

[0040] A standard air pressure determination module, used to determine the standard air pressure of the device under test and adjust the test environment of the device under test to the standard air pressure;

[0041] The standard voltage determination module is used to determine the standard voltage of the device under test and adjust the test voltage of the device under test to the standard voltage; wherein the standard voltage includes the standard AC voltage and the standard DC voltage of the device under test.

[0042] From the above, it can be seen that the method and device for determining the electrothermal characteristics of a MEMS device provided in the present application determine the change of a first electrothermal characteristic parameter at temperatures generated by different test currents to accurately reflect the influence of the temperature generated by the current on the performance of the MEMS device, and then determine the change of a second electrothermal characteristic parameter at different ambient temperatures under any test current to accurately reflect the influence of the temperature generated by the current and the ambient temperature on the performance of the MEMS device, and finally determine the influence of only the ambient temperature on the performance of the MEMS device through the difference between the two.

[0043] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 This is a flow chart of a method 100 for determining electrothermal characteristics of a MEMS device according to an embodiment of the present application;

[0046] Figure 2 A first relationship flow chart for determining a test current and a first electrothermal characteristic parameter according to an embodiment of the present application;

[0047] Figure 3 A schematic diagram of a device for determining electrothermal characteristics of a MEMS device according to an embodiment of the present application;

[0048] Figure 4 A schematic diagram of a device for determining electrothermal characteristics of a MEMS device according to another embodiment of the present application;

[0049] Figure 5 A schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0050] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0051] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0052] Temperature is one of the main factors affecting the reliability of MEMS devices. If you want to eliminate this effect, you need to determine the specific impact of temperature on MEMS devices. Here, we must first determine the source of temperature. The inventors found that the temperature factors that affect the performance of MEMS devices mainly come from changes in the external environment temperature, which leads to the mismatch of thermal expansion coefficients between device materials. The temperature stress introduced affects the performance during the period. In addition to the influence of the external environment temperature, the inventors also found that MEMS devices mostly use voltage or current as excitation and detection signals. In the process of working with current as excitation and detection signals, the internal materials of the device will generate Joule heat when energized. The thermal stress acting on the internal materials of the device will change the material properties and affect the output of the MEMS device. Therefore, to determine the impact of temperature factors on the performance of MEMS devices, it is necessary to consider the impact of ambient temperature and the temperature generated by current on the performance of the device.

[0053] In order to solve the above-mentioned influence of the ambient temperature and the temperature generated by the current on the performance of the device, the solution of the present application is proposed. An embodiment of the present application provides a method for determining the electrothermal characteristics of a MEMS device, which clarifies that both the ambient temperature and the temperature generated by the current will affect the performance of the MEMS device. However, the influence of the temperature generated by the current on the MEMS device can be determined by adjusting the test current. As for the influence of the ambient temperature on the MEMS device, if you want to test the device performance, you must power on the device for measurement, and it is impossible to determine which part is the influence of the ambient temperature on the device alone. The present application determines the influence of the temperature generated by the current on the device by first determining the relationship between the test current and the first electrothermal characteristic parameter, and then determines the influence of the ambient temperature and the test current on the device by the relationship between the ambient temperature and the second electrothermal characteristic parameter under any test current, thereby determining the influence of only the ambient temperature on the device.

[0054] Figure 1 FIG. 1 is a flowchart of a method 100 for determining electrothermal characteristics of a MEMS device according to an embodiment of the present application. Figure 1 As shown, the purpose of method 100 is to determine the change of the first electrothermal characteristic parameter under the temperature generated by different test currents to accurately reflect the influence of the temperature generated by the current on the performance of the micro-electromechanical system device, and then determine the change of the second electrothermal characteristic parameter under different ambient temperatures under any test current to accurately reflect the influence of the temperature generated by the current and the ambient temperature on the performance of the micro-electromechanical system device, and finally determine the influence of only the ambient temperature on the performance of the micro-electromechanical system device through the difference between the two. The method starts with step 101. In step 101, the initial test current of the device under test is determined. Before step 101, it is necessary to first determine the test environment of the device under test, including:

[0055] Determine the standard ambient temperature of the device under test, and adjust the test environment of the device under test to the standard ambient temperature. Exemplarily, the ambient temperature may be 25° C. at room temperature. By adjusting the test environment of the device under test to the standard ambient temperature, the influence of the change in ambient temperature can be avoided in the subsequent adjustment of the relationship between the temperature generated by different test currents and the first electrothermal characteristic parameter.

[0056] Determine the standard ambient air pressure of the device under test and adjust the test environment of the device under test to the standard air pressure.

[0057] Determine the standard voltage of the device under test and adjust the test voltage value of the device under test to the standard voltage.

[0058] Exemplarily, the standard air pressure may be 101 kPa under atmospheric pressure, and the standard voltage may be 3 V or 5 V, wherein the standard voltage includes a standard AC voltage and a standard DC voltage of the device under test.

[0059] By ensuring that the test environment of the device under test is adjusted to the standard ambient air pressure and the test voltage is adjusted to the standard voltage, the remaining test environment can be quantified to avoid the influence of the test environment (air pressure and voltage) on the first electrothermal characteristic parameter as the test current changes during the process of adjusting the test current, thereby preventing the accurate determination of the influence of the temperature generated by the current on the performance of the micro-electromechanical system device.

[0060] In some embodiments, the first electrothermal characteristic parameter includes: a first resonant frequency and a first amplitude ratio.

[0061] In step 101, starting from zero current, the current of the device under test is gradually increased until the device under test outputs either a first resonant frequency or a first amplitude ratio, and the current is determined as the initial test current.

[0062] Exemplarily, starting from zero current, when the current of the device under test is gradually increased to 0.1 mA, the device under test outputs any one of the first resonant frequency and the first amplitude ratio, then the initial test current of the device under test is determined to be 0.1 mA.

[0063] The current between zero current and the initial test current cannot excite the device under test, and accordingly no detection signal can be obtained, that is, neither the first resonant frequency nor the first amplitude ratio can be obtained. This means that even if the current between zero current and the initial test current generates temperature, it will not affect the performance of the device under test. Therefore, by determining the initial test current, it is convenient to gradually adjust the test current based on the initial test current, saving time and cost.

[0064] In step 102, the test current is gradually adjusted starting from the initial test current to determine the first electrothermal characteristic parameters of the device under test at different test currents.

[0065] Specifically, firstly, a preset current increase of the test current is determined;

[0066] Taking the initial current as the starting point and the current increase as the interval, the test current is gradually increased to determine at least one of the first resonant frequency and the first amplitude ratio under any test current.

[0067] In this embodiment, the main purpose is to determine the change of the first electrothermal characteristic parameter under different test currents, that is, the change of the performance of the device under test under the temperature or heat generated by different test currents, and the first resonant frequency and the first amplitude ratio are measured for all currents of different sizes, which is a huge workload. The current increase is set as an interval, starting from the initial current, and the corresponding interval is increased each time to obtain the test current, and at least one of the first resonant frequency and the first amplitude ratio corresponding to the test current is determined. For example, the initial current is 0.1mA, the current increase is 0.05mA, and accordingly, the test current is 0.1mA, 0.15mA, 0.2mA, 0.25mA..., until the first resonant frequency and the first amplitude ratio do not increase with the increase of the test current.

[0068] In some optional embodiments, the first amplitude ratio is positively correlated with the test current, that is, the first amplitude ratio increases with the increase of the detection current. The first resonant frequency is negatively correlated with the test current, that is, the first resonant frequency decreases with the increase of the test current.

[0069] Then in step 103, a first relationship between the test current and the first electrothermal characteristic parameter is determined according to the change of the first electrothermal characteristic parameter with the test current.

[0070] In the above embodiment, the test current is taken using the initial test current and the current gain, and the first electrothermal characteristic parameter under the corresponding test current is determined, that is, the first resonant frequency and the first amplitude are compared and taken. By fitting the test current and the first electrothermal characteristic parameter, the corresponding first relationship between the two is determined, wherein the first relationship can be a linear relationship or a nonlinear relationship.

[0071] In this embodiment, based on the correlation between the test current and the first electrothermal characteristic parameter (the first amplitude ratio of the resonator is positively correlated with the test current, while the resonant frequency is negatively correlated with the test current), a method is provided for researchers to determine a suitable detection current to improve the accuracy of the device when designing a closed-loop circuit of a micro-electromechanical system device, thereby providing a basis for subsequent research on the reliability evaluation of the electrothermal characteristics of such devices.

[0072] Specifically, refer to Figure 2 As shown:

[0073] S201, determining first electrothermal characteristic parameters under different test currents;

[0074] S202, determining a first electrothermal characteristic parameter under an initial test current;

[0075] S203, determining the difference between the first electrothermal characteristic parameter under different test currents and the first electrothermal characteristic parameter under the initial test current;

[0076] S204, taking the difference as the dependent variable and the test current as the independent variable, performing linear fitting on the dependent variable and the independent variable to determine a first relationship between the test current and the first electrothermal characteristic parameter.

[0077] In this embodiment, the initial test current is not necessarily zero, that is, when a current less than the initial test current is input to the device under test as an excitation or detection signal, although the device under test will not output the first electrothermal characteristic parameter, the current will also generate temperature, and the thermal expansion of the internal material of the device under test will also affect the performance of the device under test. The difference between the first electrothermal characteristic parameter under the test current and the first electrothermal characteristic parameter under the initial test current is used to eliminate or reduce the influence of the thermal stress generated by the different thermal expansion coefficients of the internal material of the device under test on the first electrothermal characteristic parameter of the device under test.

[0078] Exemplarily, the device under test is fixed to a device for determining the electrothermal characteristics of a micro-electromechanical system device, and the standard ambient temperature, standard ambient air pressure, and standard voltage of the device under test are determined respectively, and the test environment of the device under test is adjusted to the standard ambient temperature, standard ambient air pressure, and standard voltage and kept unchanged, and then the power supply is turned on, and current is input to the device under test, and a first electrothermal characteristic parameter is detected at the output end of the device under test until the device under test outputs any one of a first resonant frequency and a first amplitude ratio, and the current current is determined to be the initial test current.

[0079] Set n test currents, where the test currents include the initial test current. They are I1, I2, I3, ..., In, where the relationship between the test currents is I1 < I2 < ... < In, adjust the test currents in order of increasing currents, and for each test current, determine the first electrothermal characteristic parameter (at least one of the first resonant frequency and the first amplitude ratio) under the test current. After all the test currents are tested, n groups of first electrothermal characteristic parameters corresponding to the test currents are obtained. Calculate the difference between the electrothermal characteristic parameter under each test current and the electrothermal characteristic parameter corresponding to the initial test current, and determine the first relationship between the difference and the test current.

[0080] In some embodiments, there are at least two devices under test, and the first electrothermal characteristic parameters of the devices under test at different test currents are average values ​​of the first electrothermal characteristic parameters of the at least two devices under test.

[0081] In this embodiment, a micro-electromechanical system is an integration of microcircuits and micromachines on a chip according to functional requirements, and its size is usually in the millimeter or micron level. As an integrated device, on the basis of ensuring the yield, the process accuracy cannot guarantee that the error of each device under test is exactly the same. If only the accuracy of the test of one device under test is used to refer to all devices under test of the same batch or the same model, there may be a slight deviation in accuracy. In order to ensure the accuracy of the test, at least two devices under test are used for testing. For example, the two devices under test are tested under the same environment and the same experimental current, and the average value of the output first resonant frequency and the first amplitude ratio is taken, and the average value is used as the value of the first electrothermal characteristic parameter (first resonant frequency and first amplitude ratio) of the device under test.

[0082] In step 104, starting with an initial test current, the ambient temperature is gradually adjusted at any test current to determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures.

[0083] In some embodiments, the second electrothermal characteristic parameter includes a second resonant frequency and a second amplitude ratio.

[0084] Specifically, different test currents are determined with the initial current as the starting point and the current increase as the interval;

[0085] Under any test current, starting from the standard ambient temperature, gradually increase the ambient temperature to determine the value of the second electrothermal characteristic parameter under any test current.

[0086] Exemplarily, the test current starting from the initial test current is 0.1mA, 0.15mA, 0.2mA, 0.25mA..., and the ambient temperature is 25℃, 30℃, 35℃, 40℃... At 0.1mA, the second electrothermal characteristic parameter at 25℃ is first determined, and then the second electrothermal characteristic parameter at 30℃ is determined, until the second electrothermal characteristic parameter does not change or changes very little at the ambient temperature, then stop. At 0.15mA, the second electrothermal characteristic parameter at 25℃ is also first determined, and then the second electrothermal characteristic parameter at 30℃ is determined, until the second electrothermal characteristic parameter does not change or changes very little at the ambient temperature, then stop. And so on, until the second electrothermal characteristic parameters at all ambient temperatures are determined at the final test current. So far, under each test current, different ambient temperatures have different second electrothermal characteristic parameters.

[0087] It should be noted that, in view of different usage scenarios of the device under test, the above ambient temperature is only an example and is not intended to be a limitation on the embodiments of the present application. The ambient temperature can start from 0°C or be gradually adjusted from other ambient temperatures.

[0088] It can be understood that in this embodiment, without the input of the test current, the corresponding second electrothermal characteristic parameter cannot be determined from the output end. Therefore, even if the influence of the external ambient temperature on the performance of the device under test is determined, the participation of the test current is also required. Accordingly, in the case of a test current, the second electrothermal characteristic parameter not only reflects the influence of the ambient temperature on the performance of the device under test, but also reflects the influence of the temperature generated by the test current on the performance of the device under test.

[0089] In step 105, according to the change of the second electrothermal characteristic parameter with the ambient temperature, a second relationship between the ambient temperature and the second electrothermal characteristic parameter under any test current is determined.

[0090] In some exemplary embodiments, first, under a test current of 0.1 mA, there are m ambient temperatures, corresponding to m second electrothermal characteristic parameters, and correspondingly under 0.1 mA, the second relationship between the ambient temperature and the second electrothermal characteristic parameter is determined. Under a test current of 0.15 mA, there are m ambient temperatures, corresponding to m second electrothermal characteristic parameters, and correspondingly under 0.15 mA, the second relationship between the ambient temperature and the second electrothermal characteristic parameter is determined. And so on, until the second relationship between the ambient temperature and the second electrothermal characteristic parameter is determined under the middle test current.

[0091] The second relationship may be a linear relationship or a nonlinear relationship.

[0092] In this embodiment, the combined influence of the test current and the ambient temperature on the performance of the device under test is determined through the second relationship.

[0093] In some embodiments, under any test current, a third relationship between only the ambient temperature and the third electrothermal characteristic parameter is determined by subtracting the second relationship from the first relationship.

[0094] In some embodiments, the third electrothermal characteristic parameter includes a third resonant frequency and a third amplitude ratio.

[0095] It can be seen from the above embodiments that the second electrothermal characteristic parameter not only reflects the influence of the ambient temperature on the performance of the device under test, but also reflects the influence of the temperature generated by the test current on the performance of the device under test. In other words, the second electrothermal characteristic parameter reflects the combined influence of the test current and the ambient temperature on the performance of the device under test. Accordingly, the second relationship reflects the relationship between the second electrothermal characteristic parameter and the test current and different ambient temperatures under each test current.

[0096] By subtracting the second relationship from the first relationship, the first electrothermal characteristic parameter output under the test current is removed, that is, the influence of the temperature generated under the test current on the performance of the device under test is removed, and the difference obtained is the third electrothermal characteristic parameter output only by the ambient temperature under each test current, that is, only the influence of the ambient temperature on the performance of the device under test.

[0097] In addition, according to the first relationship between the test current and the first electrothermal characteristic parameter, and the third relationship between the environment and the third electrothermal characteristic, the values ​​of the two offsets can be adjusted by adjusting the test current. (The values ​​of the two offsets refer to the first relationship between the test current and the first electrothermal characteristic parameter (such as positive correlation), and the third relationship between the ambient temperature and the third electrothermal characteristic parameter (such as negative correlation). The test current is adjusted to make the impact of the thermal stress generated by the test current on the device and the impact of the thermal stress mismatch generated by the ambient temperature on the device offset accordingly), thereby effectively reducing the impact of temperature on the performance of MEMS devices. Therefore, accurately obtaining the electrothermal characteristics of MEMS devices is of great significance to improving the performance of MEMS devices.

[0098] To summarize, the method for determining the electrothermal characteristics of a MEMS device in an embodiment of the present application first controls the test environment of the device to be tested, obtains a first relationship between the test current and the first electrothermal characteristic parameter by determining a first electrothermal characteristic parameter output under different test currents, and determines the influence of the temperature generated by the test current on the performance of the device to be tested. Furthermore, under any test current, outputs a second electrothermal characteristic parameter output under different ambient temperatures, and obtains a second relationship between the ambient temperature and the second electrothermal characteristic under any test current, and determines the influence of the ambient temperature on the performance of the device to be tested under each test current. Accordingly, the second relationship is subtracted from the first relationship to obtain a third electrothermal characteristic parameter output only by the ambient temperature, and a third relationship between the ambient temperature and the third electrothermal characteristic parameter is obtained to determine the influence of the ambient temperature alone on the performance of the device to be tested.

[0099] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0100] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0101] Based on the same technical concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides a device for determining the electrothermal characteristics of a micro-electromechanical system device.

[0102] refer to Figure 3 , the device for determining electrothermal characteristics of a micro-electromechanical system device comprises:

[0103] An initial test current module 301 is used to determine the initial test current of the device under test;

[0104] The first electrothermal characteristic parameter module 302 is used to gradually adjust the test current with the initial test current as the starting point to determine the first electrothermal characteristic parameter of the device under test under different test currents;

[0105] A first relationship module 303, used to determine a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter with the test current;

[0106] The second electrothermal characteristic parameter module 304 is used to start with an initial test current, gradually adjust the ambient temperature under any test current, and determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures;

[0107] The second relationship module 305 is used to determine the second relationship between the ambient temperature and the second electrothermal characteristic parameter under any test current according to the change of the second electrothermal characteristic parameter with the ambient temperature.

[0108] In some embodiments, reference Figure 4 As shown, the device for determining electrothermal characteristics of a MEMS device further includes:

[0109] The environment temperature adjustment module 401 is used to determine the standard environment temperature of the device under test and adjust the test environment of the device under test to the standard environment temperature;

[0110] A standard air pressure determination module 402 is used to determine the standard air pressure of the device under test and adjust the test environment of the device under test to the standard air pressure;

[0111] The standard voltage determination module 403 is used to determine the standard voltage of the device under test and adjust the test voltage of the device under test to the standard voltage; wherein the standard voltage includes the standard AC voltage and the standard DC voltage of the device under test.

[0112] It should be noted that, in addition to being able to adjust the test environment of the device under test to a standard ambient temperature, the ambient temperature adjustment module 401 can also arbitrarily adjust the test environment of the device under test to a desired ambient temperature.

[0113] For the convenience of description, the above device is described in terms of functions divided into various modules. Of course, when implementing the present application, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0114] The device of the above embodiment is used to implement the corresponding method for determining the electrothermal characteristics of a MEMS device in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0115] Based on the same technical concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method for determining the electrothermal characteristics of a micro-electromechanical system device described in any of the above embodiments is implemented.

[0116] Figure 5 A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 in the device.

[0117] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0118] The memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0119] The input / output interface 1030 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.

[0120] The communication interface 1040 is used to connect a communication module (not shown) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB, network cable, etc.) or a wireless mode (such as mobile network, WIFI, Bluetooth, etc.).

[0121] The bus 1050 includes a path that transmits information between the various components of the device (eg, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).

[0122] It should be noted that, although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040 and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0123] The electronic device of the above embodiment is used to implement the corresponding method for determining the electrothermal characteristics of a MEMS device in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0124] Based on the same technical concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the method for determining the electrothermal characteristics of a micro-electromechanical system device as described in any of the above embodiments.

[0125] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0126] The computer instructions stored in the storage medium of the above embodiment are used to enable the computer to execute the method for determining the electrothermal characteristics of a MEMS device as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0127] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0128] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0129] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0130] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A method for determining electrothermal characteristics of a micro-electromechanical system device, characterized in that: include: Determine the initial test current of the device under test; Gradually adjusting the test current with the initial test current as the starting point to determine the first electrothermal characteristic parameter of the device under test under different test currents; determining a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter along with the test current; Taking the initial test current as a starting point, gradually adjusting the ambient temperature under any of the test currents, and determining the second electrothermal characteristic parameters of the device under test at different ambient temperatures; According to the change of the second electrothermal characteristic parameter with the ambient temperature, a second relationship between the ambient temperature and the second electrothermal characteristic parameter under any of the test currents is determined.

2. The method according to claim 1, characterized in that Before determining the initial test current of the device under test, the method further includes: Determining a standard ambient temperature of the device under test, and adjusting the test environment of the device under test to the standard ambient temperature; Determining the standard ambient air pressure of the device under test, and adjusting the test environment of the device under test to the standard air pressure; Determine the standard voltage of the device under test, and adjust the test voltage of the device under test to the standard voltage; wherein the standard voltage includes the standard AC voltage and the standard DC voltage of the device under test.

3. The method according to claim 1, characterized in that The first electrothermal characteristic parameter includes: a first resonant frequency and a first amplitude ratio; The step of determining the initial test current of the device under test comprises: Starting from zero current, the current to the device under test is gradually increased until the device under test outputs any one of a first resonant frequency and a first amplitude ratio, and the current current is determined as an initial test current.

4. The method according to claim 3, characterized in that Gradually adjusting the test current with the initial test current as the starting point to determine the first electrothermal characteristic parameter of the device under test at different test currents includes: determining a preset current increase of the test current; Taking the initial current as the starting point and the current increase as the interval, the test current is gradually increased to determine the value of at least one of the first resonant frequency and the first amplitude ratio under any of the test currents.

5. The method according to claim 4, characterized in that Determining a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter with the test current includes: Determining first electrothermal characteristic parameters under different test currents; Determining a first electrothermal characteristic parameter under the initial test current; Determine the difference between the first electrothermal characteristic parameter under different test currents and the first electrothermal characteristic parameter under the initial test current; The difference is taken as the dependent variable, the test current is taken as the independent variable, the dependent variable and the independent variable are linearly fitted to determine the first relationship between the test current and the first electrothermal characteristic parameter.

6. The method according to claim 1, characterized in that There are at least two devices under test, and the first electrothermal characteristic parameters of the devices under test at different test currents are average values ​​of the first electrothermal characteristic parameters of at least two devices under test.

7. The method according to claim 5, characterized in that Taking the initial test current as a starting point, gradually adjusting the ambient temperature under any of the test currents to determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures, including: Starting from the initial current and taking the current increment as an interval, determining different test currents; Under any of the test currents, starting from the standard ambient temperature, the ambient temperature is gradually increased to determine the second electrothermal characteristic parameter under any of the test currents.

8. The method according to claim 1, characterized in that Determining a second relationship between the ambient temperature and the electrothermal characteristic parameter under any test current according to a change of the second electrothermal characteristic parameter with the ambient temperature, and then further comprising: Under any of the test currents, the third relationship between only the ambient temperature and the third electrothermal characteristic parameter is determined by subtracting the second relationship from the first relationship.

9. A device for determining electrothermal characteristics of a micro-electromechanical system device, characterized in that: include: An initial test current module is used to determine the initial test current of the device under test; A first electrothermal characteristic parameter module, used to gradually adjust the test current with the initial test current as the starting point, and determine the first electrothermal characteristic parameter of the device under test under different test currents; A first relationship module, configured to determine a first relationship between the test current and the first electrothermal characteristic parameter according to a change of the first electrothermal characteristic parameter with the test current; A second electrothermal characteristic parameter module is used to start with the initial test current, gradually adjust the ambient temperature under any of the test currents, and determine the second electrothermal characteristic parameters of the device under test at different ambient temperatures; The second relationship module is used to determine the second relationship between the ambient temperature and the second electrothermal characteristic parameter under any of the test currents according to the change of the second electrothermal characteristic parameter with the ambient temperature.

10. The device according to claim 9, characterized in that Also includes: An environmental temperature adjustment module, used to determine the standard environmental temperature of the device under test and adjust the test environment of the device under test to the standard environmental temperature; A standard air pressure determination module, used to determine the standard air pressure of the device under test and adjust the test environment of the device under test to the standard air pressure; The standard voltage determination module is used to determine the standard voltage of the device under test and adjust the test voltage of the device under test to the standard voltage; wherein the standard voltage includes the standard AC voltage and the standard DC voltage of the device under test.

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