Probe contact detection system based on multi-channel pressure-sensitive film sensor

Abstract

The invention provides a probe contact detection system based on a multi-channel pressure-sensitive film sensor, relates to the technical field of semiconductor chip packaging and testing, and is used for solving the technical problems of low sensitivity, limited area and non-uniform contact pressure in a traditional mechanical or optical contact detection method. The system comprises an objective table which is provided with a pressure-sensitive film sensor with a plurality of channels; the to-be-tested chip is adsorbed on the surfaces of the pressure-sensitive film sensors of the multiple channels in a vacuum manner; the metal probe is in contact with an electrode of the to-be-tested chip and is used for applying pressure to the to-be-tested chip under the action of external force; wherein under the condition that voltage is applied to the electrode of the chip to be tested, the metal probe is pressed down to apply pressure to the chip to be tested, at the moment, output signals of the pressure-sensitive film sensors of the multiple channels are collected, analog-to-digital conversion, signal filtering and denoising processing are carried out, and the chip to be tested is obtained. And a two-dimensional pressure mapping graph is generated to detect the pressure state and position parameters of the metal probe.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor chip packaging and testing technology, and more specifically, to a probe contact detection system based on a multi-channel pressure-sensitive film sensor. Background Art

[0002] In the field of chip packaging and testing, the contact quality between the probe tip and the chip electrode directly affects the accuracy of the test results and the stability of the chip performance. Especially in the test scenarios of tiny chips or multi-probe contact, it is crucial to ensure reliable contact between the probe and the electrode. Traditional contact detection methods mainly rely on mechanical or optical detection, but in practical applications, these methods have the following defects:

[0003] (1) Insensitive mechanical contact: Mechanical detection is difficult to sensitively reflect the pressure changes at tiny contact points, which can easily cause detection deviations and make it impossible to timely judge the stable contact between the probe and the chip.

[0004] (2) Limitations of optical detection: Optical detection methods are very sensitive to factors such as external environmental lighting and slight deviations in the probe position, which affect the accuracy of detection. In addition, optical equipment is expensive and is not suitable for large-scale automated testing.

[0005] (3) Uneven contact pressure problem: When the probe contacts the chip electrode, uneven contact pressure can lead to local poor contact or overvoltage damage, thus affecting the electrical performance and service life of the chip.

[0006] In this context, contact detection technology based on pressure-sensitive multi-channel thin film sensors has gradually attracted attention. Multi-channel pressure-sensitive thin film sensors have sensitive pressure detection capabilities and high-resolution spatial distribution measurement capabilities, and can provide pressure distribution information and position data of probe contact points. The unique advantage of this sensor is that it can monitor the pressure conditions of multiple contact points in real time while the probe is in contact, thereby improving detection accuracy and reliability. Summary of the invention

[0007] In view of this, the present disclosure provides a probe contact detection system based on a multi-channel pressure-sensitive film sensor to solve the technical problems of low sensitivity, limited area and uneven contact pressure existing in traditional mechanical or optical contact detection methods.

[0008] One aspect of the present disclosure provides a probe contact detection system based on a multi-channel pressure-sensitive film sensor, comprising: a stage, wherein the stage is configured with pressure-sensitive film sensors of multiple channels; a chip to be tested, which is vacuum-adsorbed on the surface of the pressure-sensitive film sensors of multiple channels; a metal probe, which contacts the electrodes of the chip to be tested and is used to apply pressure to the chip to be tested under the action of an external force; wherein, when a voltage is applied to the electrodes of the chip to be tested, the metal probe is pressed down to apply pressure to the chip to be tested, and at this time, the pressure state and position parameters of the metal probe are detected by collecting the output signals of the pressure-sensitive film sensors of multiple channels.

[0009] According to an embodiment of the present disclosure, the probe contact detection system based on the multi-channel pressure-sensitive film sensor further includes: a sensor signal output microstrip line for outputting output signals of the pressure-sensitive film sensors of the multiple channels.

[0010] According to an embodiment of the present disclosure, the stage is provided with a plurality of vacuum adsorption holes for adsorbing the chip to be tested under vacuum conditions.

[0011] According to an embodiment of the present disclosure, the stage is further provided with a plurality of fixing holes for fixing to the base.

[0012] According to an embodiment of the present disclosure, the stage is further provided with a plurality of fixing grooves for fixing the pressure-sensitive film sensors of the plurality of channels.

[0013] According to an embodiment of the present disclosure, the pressure-sensitive film sensor of multiple channels includes: a resistive pressure-sensitive sensor or a capacitive pressure-sensitive sensor.

[0014] According to an embodiment of the present disclosure, each of the pressure-sensitive film sensors of the multiple channels corresponds to a sensing unit, and each sensing unit corresponds to an independent resistance value or capacitance value.

[0015] According to an embodiment of the present disclosure, under the action of pressure P, the resistance change corresponding to the sensing unit in the i-th row and j-th column of the resistive pressure-sensitive sensor is:

[0016]

[0017] in, represents the resistance of the sensing unit in the i-th row and j-th column under pressure P, Indicates the resistance when there is no pressure, Represents the resistivity of a material.

[0018] According to an embodiment of the present disclosure, under the action of pressure P, the capacitance change corresponding to the sensing unit in the i-th row and j-th column of the capacitive pressure-sensitive sensor is:

[0019]

[0020] in, represents the capacitance of the sensing unit in the i-th row and j-th column under pressure P, represents the capacitance when there is no pressure, Indicates the sensitivity coefficient of material thickness change and pressure.

[0021] According to an embodiment of the present disclosure, the probe contact detection system based on a multi-channel pressure-sensitive film sensor also includes: a data processing module for performing analog-to-digital conversion, signal filtering and denoising on the output signals of the pressure-sensitive film sensors of multiple channels, and generating a two-dimensional pressure map.

[0022] The probe contact detection system based on the multi-channel pressure-sensitive film sensor provided by the embodiment of the present disclosure has at least the following beneficial effects:

[0023] (1) The probe contact detection system based on a multi-channel pressure-sensitive film sensor provided in the embodiment of the present disclosure realizes real-time detection of the pressure state and position parameters of each probe by introducing a multi-channel pressure-sensitive film sensor in a scenario where a typical chip is powered on and tested by a metal probe.

[0024] (2) The probe contact detection system based on a multi-channel pressure-sensitive film sensor provided by the embodiment of the present disclosure collects the signals transmitted by the pressure-sensitive film sensors of multiple channels, generates a two-dimensional pressure map through analog-to-digital conversion, signal filtering and denoising, and then compares the optimal pressure value and reference position measured by the experiment with the values ​​in the map to determine whether the downward pressure position and force of the probe are appropriate. Through this system, the pressure state and position parameters of each metal probe can be monitored in real time, reducing the dependence on microscopic observation, and providing data support for semiconductor chip testing and contact quality evaluation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0026] Figure 1 The application scenario diagram of the probe contact detection system based on the multi-channel pressure-sensitive film sensor in the power-on scenario according to the embodiment of the present disclosure is schematically shown.

[0027] Figure 2 A partial enlarged view of a part of the structure of a probe contact detection system based on a multi-channel pressure-sensitive film sensor in a power-on scenario according to an embodiment of the present disclosure is schematically shown.

[0028] Figure 3 The flowchart schematically shows the signal processing of the probe contact detection system based on the multi-channel pressure-sensitive film sensor in the power-on scenario according to the embodiment of the present disclosure.

[0029] [Reference Signs]

[0030] 1- stage, 2- fixing hole, 3- chip to be tested, 4- pressure-sensitive film sensor of multiple channels, 5- metal probe, 6- sensor signal output microstrip line, 7- vacuum adsorption hole, 8- fixing groove, 9- single-channel pressure-sensitive film sensor, 10- sensing unit corresponding to the single-channel pressure-sensitive film sensor. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0032] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0033] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0034] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0035] In the field of chip packaging and testing, the contact quality between the probe tip and the chip electrode directly affects the accuracy of the test results and the stability of the chip performance. Especially in the test scenarios of tiny chips or multi-probe contact, it is crucial to ensure reliable contact between the probe and the electrode. Traditional contact detection methods mainly rely on mechanical or optical detection, but in practical applications, these methods have the following defects:

[0036] (1) Insensitive mechanical contact: Mechanical detection is difficult to sensitively reflect the pressure changes at tiny contact points, which can easily cause detection deviations and make it impossible to timely judge the stable contact between the probe and the chip.

[0037] (2) Limitations of optical detection: Optical detection methods are very sensitive to factors such as external environmental lighting and slight deviations in the probe position, which affect the accuracy of detection. In addition, optical equipment is expensive and is not suitable for large-scale automated testing.

[0038] (3) Uneven contact pressure problem: When the probe contacts the chip electrode, uneven contact pressure can lead to local poor contact or overvoltage damage, thus affecting the electrical performance and service life of the chip.

[0039] In this context, contact detection technology based on pressure-sensitive multi-channel thin film sensors has gradually attracted attention. Multi-channel pressure-sensitive thin film sensors have sensitive pressure detection capabilities and high-resolution spatial distribution measurement capabilities, and can provide pressure distribution information and position data of probe contact points. The unique advantage of this sensor is that it can monitor the pressure conditions of multiple contact points in real time while the probe is in contact, thereby improving detection accuracy and reliability.

[0040] Based on this, the embodiments of the present disclosure provide a probe contact detection system based on a multi-channel pressure-sensitive film sensor to solve the technical problems of low sensitivity, limited area and uneven contact pressure existing in traditional mechanical or optical contact detection methods.

[0041] The probe contact detection system based on the multi-channel pressure-sensitive film sensor may include, for example: a stage, a chip to be tested, and a metal probe.

[0042] The stage is equipped with a plurality of channels of pressure-sensitive film sensors.

[0043] The chip to be tested is vacuum adsorbed on the surface of the pressure-sensitive film sensor of multiple channels.

[0044] The metal probe contacts the electrode of the chip to be tested and is used to apply pressure to the chip to be tested under the action of external force.

[0045] In this embodiment, when voltage is applied to the electrode of the chip to be tested, the metal probe is pressed down to apply pressure to the chip to be tested. At this time, the pressure state and position parameters of the metal probe are detected by collecting the output signals of the pressure-sensitive film sensors of multiple channels.

[0046] The probe contact detection system based on a multi-channel pressure-sensitive film sensor provided in the embodiment of the present disclosure realizes real-time detection of the pressure state and position parameters of each probe by introducing a multi-channel pressure-sensitive film sensor in a scenario where a typical chip is powered on to test a semiconductor chip via a metal probe.

[0047] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0048] Figure 1 The application scenario diagram of the probe contact detection system based on the multi-channel pressure-sensitive film sensor in the power-on scenario according to the embodiment of the present disclosure is schematically shown.

[0049] like Figure 1 As shown, the probe contact detection system based on the multi-channel pressure-sensitive film sensor of the embodiment of the present disclosure may include, for example: a stage 1 , a chip to be tested 3 and a metal probe 5 .

[0050] The stage 1 is provided with a plurality of channels of pressure-sensitive film sensors 4 .

[0051] In this embodiment, the shape and size of the stage 1 are not limited and can be freely designed according to the shape and size of the chip 3 to be tested.

[0052] The chip to be tested 3 is vacuum-adsorbed on the surfaces of the pressure-sensitive film sensors 4 of the multiple channels.

[0053] The metal probe 5 contacts the electrode of the chip 3 to be tested, and is used to apply pressure to the chip 3 to be tested under the action of an external force.

[0054] In this embodiment, the type of the metal probe 5 is not limited, and it can be a high-frequency AC probe or a DC probe.

[0055] When voltage is applied to the electrode of the chip 3 to be tested, the metal probe 5 is pressed down to apply pressure to the chip 3 to be tested. At this time, the pressure state and position parameters of the metal probe 5 are detected by collecting the output signals of the pressure-sensitive film sensors 4 of multiple channels.

[0056] The probe contact detection system based on a multi-channel pressure-sensitive film sensor provided in the embodiment of the present disclosure realizes real-time detection of the pressure state and position parameters of each probe by introducing a multi-channel pressure-sensitive film sensor in a scenario where a typical chip is powered on to test a semiconductor chip via a metal probe.

[0057] According to an embodiment of the present disclosure, the probe contact detection system based on the multi-channel pressure-sensitive film sensor further includes: a sensor signal output microstrip line 6 .

[0058] The sensor signal output microstrip line 6 is used to output the output signals of the pressure sensitive film sensors 4 of multiple channels.

[0059] According to an embodiment of the present disclosure, the stage 1 is provided with a plurality of vacuum adsorption holes 7 for adsorbing the chip to be tested 3 under vacuum conditions.

[0060] According to an embodiment of the present disclosure, the stage 1 is further provided with a plurality of fixing holes 2 for fixing to a base. The base is usually provided at the bottom of the stage for supporting the stage 1 .

[0061] According to an embodiment of the present disclosure, the stage 1 is further provided with a plurality of fixing grooves 8 for fixing the pressure-sensitive film sensors 4 of a plurality of channels.

[0062] According to an embodiment of the present disclosure, the pressure-sensitive film sensor 4 of the plurality of channels includes: a resistive pressure-sensitive sensor or a capacitive pressure-sensitive sensor.

[0063] According to the embodiment of the present disclosure, each of the pressure-sensitive film sensors 4 of the multiple channels corresponds to a sensing unit, and each sensing unit corresponds to an independent resistance value or capacitance value.

[0064] In this embodiment, the pressure-sensitive film sensors 4 of the multiple channels are mainly based on the changes in resistance or capacitance of the pressure-sensitive material under different external forces.

[0065] For a resistive pressure sensor, the resistance R of the material will change under the action of pressure P. Since each sensing unit corresponds to an independent resistance value, the resistance change corresponding to the sensing unit in the i-th row and j-th column can be characterized as:

[0066]

[0067] in, represents the resistance of the sensing unit in the i-th row and j-th column under pressure P, Indicates the resistance when there is no pressure (static resistance value), It indicates the resistance sensitivity coefficient of the material, which is related to the material's properties, thickness, and temperature.

[0068] The pressure applied to the sensor unit Usually with the pressure applied by the metal probe 5 Effective contact area with the sensing unit Relevant, namely: , the resistance change can be further characterized as:

[0069]

[0070] For a capacitive pressure-sensitive sensor, under the action of pressure P, the capacitance change corresponding to the sensing unit in the i-th row and j-th column of the capacitive pressure-sensitive sensor is:

[0071]

[0072] in, represents the capacitance of the sensing unit in the i-th row and j-th column under pressure P, Indicates the capacitance when there is no pressure (static capacitance value), Indicates the sensitivity coefficient of material thickness change and pressure.

[0073] In this embodiment, the pressure-sensitive film sensors 4 of the multiple channels are composed of The overall output is a resistance matrix or a capacitance matrix for each sensing unit:

[0074] Among them, the resistance matrix R(P) is:

[0075]

[0076] The capacitance matrix C(P) is:

[0077]

[0078] In the process of signal acquisition and processing, the resistance or capacitance of each sensing unit is changed. is the measured voltage of the sensing unit at row i and column j, then the current for:

[0079]

[0080] In particular, for capacitive pressure sensitive sensors, if AC power is used, the capacitor The resulting capacitive reactance It can be expressed as:

[0081]

[0082] According to an embodiment of the present disclosure, the probe contact detection system based on a multi-channel pressure-sensitive film sensor also includes: a data processing module for performing analog-to-digital conversion, signal filtering and denoising on the output signals of the pressure-sensitive film sensors of multiple channels, and generating a two-dimensional pressure map.

[0083] In this embodiment, the pressure value of each sensing unit is calculated by performing analog-to-digital conversion, signal filtering and noise removal on the collected current or voltage value, and then a two-dimensional pressure mapping diagram is drawn.

[0084] Figure 2 A partial enlarged view of a part of the structure of a probe contact detection system based on a multi-channel pressure-sensitive film sensor in a power-on scenario according to an embodiment of the present disclosure is schematically shown.

[0085] like Figure 2As shown, a partial enlarged view of a part of the structure of the probe contact detection system based on a multi-channel pressure-sensitive film sensor according to an embodiment of the present disclosure in a power-on scenario shows that the stage 1 is provided with a plurality of fixing grooves 8, which are used to fix the pressure-sensitive film sensors 4 of the multiple channels. The pressure-sensitive film sensors 4 of the multiple channels include a plurality of single-channel pressure-sensitive film sensors 9, and each of the pressure-sensitive film sensors 4 of the multiple channels corresponds to a sensing unit 10.

[0086] Figure 3 The flowchart schematically shows the signal processing of the probe contact detection system based on the multi-channel pressure-sensitive film sensor in the power-on scenario according to the embodiment of the present disclosure.

[0087] like Figure 3 As shown, according to the signal processing process of the probe contact detection system based on the multi-channel pressure-sensitive film sensor in the power-on scenario according to the embodiment of the present disclosure, it can be seen that when a voltage is applied to the electrode of the chip to be tested 3, the metal probe 5 is pressed down to apply pressure to the chip to be tested 3, and the pressure will be transmitted to the corresponding sensing units in the pressure-sensitive film sensors 4 of multiple channels.

[0088] At this time, the output signals of the pressure-sensitive film sensors 4 of multiple channels are collected, and then the output signals are subjected to analog-to-digital conversion, signal filtering and denoising, and a two-dimensional pressure map is generated to evaluate the downward pressure of the metal probe 5 .

[0089] The probe contact detection system based on a multi-channel pressure-sensitive film sensor provided by the embodiment of the present disclosure collects the signals transmitted by the pressure-sensitive film sensors of multiple channels, generates a two-dimensional pressure map through analog-to-digital conversion, signal filtering and denoising, and then compares the optimal pressure value and reference position determined by the experiment with the values ​​in the map to determine whether the downward pressure position and force of the probe are appropriate. Through this system, the pressure state and position parameters of each metal probe can be monitored in real time, reducing the dependence on microscopic observation, and providing data support for semiconductor chip testing and contact quality evaluation.

[0090] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram may represent a module, a program segment, or a part of a code, and the above-mentioned module, program segment, or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box may also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions. It can be understood by those skilled in the art that the features recorded in the various embodiments of the present disclosure can be combined and / or combined in a variety of ways, even if such a combination or combination is not explicitly recorded in the present disclosure. In particular, without departing from the spirit and teaching of the present disclosure, the features described in the various embodiments of the present disclosure may be combined and / or combined in a variety of ways. All of these combinations and / or combinations fall within the scope of the present disclosure.

[0091] The embodiments of the present disclosure are described above. However, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. Although the embodiments are described above, this does not mean that the measures in the various embodiments cannot be used in combination to advantage. Without departing from the scope of the present disclosure, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. A probe contact detection system based on a multi-channel pressure-sensitive film sensor, characterized in that: include: A stage, wherein the stage is configured with a plurality of channels of pressure-sensitive film sensors; The chip to be tested is vacuum-adsorbed on the surface of the pressure-sensitive film sensors of the multiple channels; A metal probe, in contact with an electrode of the chip to be tested, and used to apply pressure to the chip to be tested under the action of an external force; When voltage is applied to the electrode of the chip to be tested, the metal probe is pressed down to apply pressure to the chip to be tested. At this time, the pressure state and position parameters of the metal probe are detected by collecting the output signals of the pressure-sensitive film sensors of the multiple channels.

2. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 1, characterized in that: Also includes: The sensor signal output microstrip line is used to output the output signals of the pressure-sensitive film sensors of the multiple channels.

3. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 2, characterized in that: The stage is provided with a plurality of vacuum adsorption holes for adsorbing the chip to be tested under vacuum conditions.

4. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 2, characterized in that: The loading platform is also provided with a plurality of fixing holes for fixing to the base.

5. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 2, characterized in that: The stage is also provided with a plurality of fixing grooves for fixing the pressure-sensitive film sensors of the plurality of channels.

6. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 1, characterized in that: The pressure-sensitive film sensors of the multiple channels include: a resistive pressure-sensitive sensor or a capacitive pressure-sensitive sensor.

7. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 6, characterized in that: Each of the pressure-sensitive film sensors of the multiple channels corresponds to a sensing unit, and each sensing unit corresponds to an independent resistance value or capacitance value.

8. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 7, characterized in that: Under the action of pressure P, the resistance change corresponding to the sensing unit in the i-th row and j-th column of the resistive pressure-sensitive sensor is: in, represents the resistance of the sensing unit in the i-th row and j-th column under pressure P, Indicates the resistance when there is no pressure, Represents the resistivity of a material.

9. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 7, characterized in that: Under the action of pressure P, the capacitance change corresponding to the sensing unit in the i-th row and j-th column of the capacitive pressure-sensitive sensor is: in, represents the capacitance of the sensing unit in the i-th row and j-th column under pressure P, represents the capacitance when there is no pressure, Indicates the sensitivity coefficient of material thickness change and pressure.

10. The probe contact detection system based on a multi-channel pressure-sensitive film sensor according to claim 1, characterized in that: Also includes: The data processing module is used to perform analog-to-digital conversion, signal filtering and denoising on the output signals of the pressure-sensitive film sensors of the multiple channels, and generate a two-dimensional pressure map.

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