Control method and device for rotating workpiece table of vacuum equipment and vacuum equipment

Abstract

The present application relates to a control method and device for a rotating workpiece table of a vacuum equipment and the vacuum equipment; the method comprises: obtaining first position parameters of various components inside a vacuum chamber, and determining a maximum range of motion of the rotating workpiece table in the vacuum chamber according to the first position parameters; determining a target position of the rotating workpiece table in the vacuum chamber according to a current application process; calculating a target angle range for the swing of the rotating workpiece table according to the target position and the maximum range of motion; calculating a motion displacement of the rotating workpiece table according to a second position parameter of the target position and a starting position of the rotating workpiece table; controlling the rotating workpiece table to move to the target position according to the motion displacement, and controlling the rotating workpiece table to swing within the target angle range; this technical solution can maximize the use of the internal space of the vacuum chamber, reduce the limitations of the application process, and improve the application process effect.

Description

Technical Field

[0001] The present application relates to the technical field of vacuum equipment, and in particular to a control method and device for a rotating workpiece table of a vacuum equipment, and a vacuum equipment. Background Art

[0002] When using vacuum equipment, the workpiece is usually mounted on a rotating workpiece table, and then the rotating workpiece table can be mounted on a motion platform and moved to a certain position for the corresponding application process, such as etching process, coating process, etc. Take the vacuum etching process as an example; when using vacuum equipment for etching process, the workpiece to be etched is placed on the rotating workpiece table, and then the ion source outputs an ion beam to bombard the workpiece to be etched to realize the etching process. The rotating workpiece table will swing at a certain angle during the etching process to achieve a uniform process effect. However, due to the limited internal space of the vacuum chamber, the rotating workpiece table will hit other components when swinging in the chamber, causing damage.

[0003] Conventional vacuum equipment usually limits the deflection angle of the rotating workpiece table to avoid hitting the components in the vacuum chamber. However, due to the different positions of the rotating workpiece table in different application processes, in most cases, the deflection angle is limited during swinging, so that the deflection angle cannot reach the optimal value, which seriously restricts the application process, seriously affects the process effect, and even causes some processes to fail to proceed normally. Summary of the invention

[0004] Based on this, it is necessary to provide a control method, device and vacuum equipment for a rotating workpiece table of a vacuum equipment to improve the application process effect in order to address one of the above-mentioned technical defects.

[0005] A method for controlling a rotating workpiece table of a vacuum device, comprising:

[0006] Acquire first position parameters of various components inside the vacuum chamber, and determine the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameters;

[0007] Determining a target position of the rotating workpiece table in the vacuum chamber according to a current application process;

[0008] Calculating a target angle range for the swing of the rotating workpiece table according to the target position and the maximum motion range;

[0009] Calculate the movement displacement of the rotating workpiece stage according to the target position and a second position parameter of the starting position of the rotating workpiece stage;

[0010] The rotating workpiece table is controlled to move to the target position according to the movement displacement, and the rotating workpiece table is controlled to swing within the target angle range.

[0011] In one embodiment, determining the maximum motion range of the rotating workpiece stage in the vacuum chamber according to the first position parameter includes:

[0012] Obtaining a first coordinate space range inside the vacuum chamber;

[0013] Acquire a second spatial coordinate range of various components currently installed inside the vacuum chamber according to the first position parameter;

[0014] Acquire a third space coordinate range that can be covered when the rotating workpiece table swings relative to the motion platform;

[0015] The maximum motion range of the rotating workpiece table in the vacuum chamber is obtained according to the intersection of the first coordinate space range, the second coordinate space range and the third coordinate space range.

[0016] In one embodiment, determining a target position of the rotating workpiece stage in the vacuum chamber according to a current application process includes:

[0017] Acquire various position points that the rotating workpiece table can reach in the vacuum chamber according to the current application process;

[0018] The maximum angle range corresponding to the swing of the rotating workpiece table at each position point is calculated according to the maximum motion range, and the position point with the largest maximum angle range is set as the target position.

[0019] In one embodiment, the calculating the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range includes:

[0020] Obtaining the position point range of the reciprocating motion of the rotating workpiece table in the vacuum chamber;

[0021] Selecting a number of position points within the position point range to form a position point set;

[0022] Calculate the maximum angular range of the swing of the rotating workpiece table at each position point according to the maximum motion range;

[0023] The target angular range of the reciprocating motion is obtained from the maximum angular range of the position points.

[0024] In one embodiment, obtaining the target angle range of the reciprocating motion from the maximum angle range of the position point includes:

[0025] Selecting a number of position points from the position point set as target points, and correspondingly recording the maximum angle range corresponding to the target points;

[0026] In the process of controlling the rotating workpiece stage to move back and forth in the vacuum chamber, when the rotating workpiece stage passes through the target point position, the rotating workpiece stage is controlled to swing within a maximum angle range corresponding to the target point.

[0027] In one embodiment, the calculating the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range includes:

[0028] Acquire the target coordinates of the swing center point of the rotating workpiece table at the target position;

[0029] Calculating the maximum coordinate range covered by the swing of the rotating workpiece table according to the target coordinates, the deflection angle threshold of the swing of the rotating workpiece table, and the radius of the rotating workpiece table;

[0030] The target angle range of the swing of the rotating workpiece table is calculated according to the maximum motion range and the maximum coordinate range.

[0031] In one embodiment, the calculating the target angle range of the swing of the rotating workpiece table according to the maximum motion range and the maximum coordinate range includes:

[0032] Obtaining the endpoint coordinates of the edge of the rotating workpiece table when the maximum motion range and the maximum coordinate range intersect;

[0033] Calculate the cutoff deflection angle of the swing of the rotating workpiece table according to the target coordinates and the endpoint coordinates;

[0034] The target angle range of the swing of the rotary workpiece table is determined according to the cut-off deflection angle.

[0035] In one embodiment, the step of calculating the cutoff deflection angle of the swing of the rotating workpiece table according to the target coordinates and the endpoint coordinates includes:

[0036]

[0037] in, represents the cut-off deflection angle, is the projection distance of the endpoint coordinates on the plane where the swing center point of the rotating workpiece table is located, and R is the radius of the rotating workpiece table.

[0038] In one embodiment, controlling the rotating workpiece stage to move to the target position according to the motion displacement, and controlling the rotating workpiece stage to swing within the target angle range includes:

[0039] Acquire a first control parameter of the X-axis motor, a second control parameter of the Y-axis motor, and a third control parameter of the Z-axis motor according to the motion displacement; acquire a fourth control parameter of the deflection motor according to the target angle range;

[0040] Control the rotating workpiece table to move to the target position according to the first control parameter, the second control parameter and the second control parameter;

[0041] During the etching process, the rotating workpiece table is controlled to swing according to the fourth control parameter.

[0042] A control device for a rotating workpiece table of a vacuum device, comprising:

[0043] A motion range determination module, used for obtaining first position parameters of various components inside the vacuum chamber, and determining the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameters;

[0044] A target position determination module, used to determine the target position of the rotating workpiece table in the vacuum chamber according to the current application process;

[0045] A target angle range calculation module, used to calculate the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range;

[0046] A motion displacement calculation module, used for calculating the motion displacement of the rotating workpiece stage according to the target position and a second position parameter of the starting position of the rotating workpiece stage;

[0047] The motion and swing control module is used to control the rotating workpiece table to move to the target position according to the motion displacement, and control the rotating workpiece table to swing within the target angle range.

[0048] A vacuum device, comprising: a vacuum chamber, an ion source, a rotating workpiece table and a motion platform; wherein the ion source, the motion platform and the rotating workpiece table are respectively connected to an industrial computer;

[0049] The ion source is used to output an ion beam;

[0050] The motion platform is used to move the rotating workpiece table;

[0051] The industrial computer is configured to execute the steps of the control method of the rotating workpiece table of the vacuum equipment.

[0052] The control method, device and vacuum equipment of the rotating workpiece table of the above-mentioned vacuum equipment determine the maximum movement range of the rotating workpiece table in the vacuum chamber by obtaining the position parameters of the components in the vacuum chamber, determine the target position of the rotating workpiece table in the vacuum chamber according to the current application process, calculate the target angle range according to the target position and the maximum movement range, and calculate the movement displacement according to the position parameters of the target position and the starting position, and thereby control the rotating workpiece table to move to the target position and swing within the target angle range; this technical solution can adapt to the optimal deflection angle of the rotating workpiece table when swinging under different application processes, thereby maximizing the use of the internal space of the vacuum chamber, reducing the limitations of the application process, and improving the application process effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is a flow chart of a control method of a rotating workpiece table of a vacuum device according to an embodiment;

[0054] Figure 2 This is a schematic diagram of the layout of an example rotating workpiece table in the internal space of a vacuum chamber;

[0055] Figure 3 is a schematic diagram of an example target angle range of the swing of the rotary workpiece table;

[0056] Figure 4 This is a schematic diagram of the target angle range under an exemplary reciprocating motion;

[0057] Figure 5 This is a schematic diagram of the structure of a control device for a rotary workpiece stage of a vacuum apparatus according to an embodiment;

[0058] Figure 6 is a block diagram of a vacuum equipment structure. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0060] The term "comprising" and any other variations of the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device comprising a series of steps is not limited to the listed steps or modules, but may optionally include steps or modules not listed, or may optionally include other steps or modules inherent to the process, method, product, or device.

[0061] The technical solution of the present application provides a control scheme for the rotating workpiece table of a vacuum equipment, aiming at the situation that when the application process requires the swinging of the rotating workpiece table during the use of the vacuum equipment, the swinging angle of the rotating workpiece table is limited, which affects the effect of the application process. In this scheme, the rotating workpiece table is swung according to different application process requirements so that it can be at a better deflection angle, thereby maximizing the use of the internal space of the vacuum chamber, reducing the restrictions on the application process, and thus improving the process effect. It can be adapted to most processes such as vacuum etching and vacuum coating. For the sake of ease of explanation, in the embodiments of the present application, vacuum etching will be mainly used as an example for explanation.

[0062] refer to Figure 1 As shown, Figure 1 The present invention is a flow chart of a control method of a rotating workpiece table of a vacuum device according to an embodiment, comprising the following steps:

[0063] Step S10, obtaining first position parameters of various components inside the vacuum chamber, and determining the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameters.

[0064] In this step, the O- XYZ Three-dimensional coordinate system, such as Figure 2 As shown, Figure 2 This is a schematic diagram of the layout of an example rotating workpiece stage in the internal space of a vacuum chamber. The figure shows a cross-sectional view of the XZ axis, with the Y axis perpendicular to the paper surface. The position parameters of various components in the chamber are obtained in advance, such as the position parameters of the ion source, three-dimensional motion platform, pipelines and other components; these position parameters can be used to calculate and determine the maximum range of motion within which the rotating workpiece stage can move and swing in the vacuum chamber.

[0065] In one embodiment, when calculating the maximum motion range of the rotating workpiece stage in the vacuum chamber, step S10 may include the following:

[0066] S101, obtaining a first coordinate space range inside the vacuum chamber.

[0067] Specifically, a first coordinate space range of the inner space of the vacuum chamber is obtained through a three-dimensional coordinate system.

[0068] S102, obtaining a second spatial coordinate range of various components currently installed inside the vacuum chamber according to the first position parameter.

[0069] like Figure 2 In the present application process, the second space coordinate range can be obtained according to various components installed inside the vacuum chamber and their positions.

[0070] S103, obtaining a third spatial coordinate range that can be covered when the rotating workpiece table swings relative to the motion platform; for example Figure 2 On the right side of the motion platform is the area that can be covered when the rotating workpiece table swings, thereby obtaining the third space coordinate range.

[0071] S104, obtaining a maximum motion range of the rotating workpiece stage in the vacuum chamber according to an intersection of the first coordinate space range, the second coordinate space range, and the third coordinate space range.

[0072] like Figure 2 As shown, the gray background portion is the maximum motion range S that the rotating workpiece table can move and swing in the vacuum chamber.

[0073] Step S20, determining the target position of the rotating workpiece table in the vacuum chamber according to the current application process.

[0074] In this step, the target position to which the rotating workpiece stage needs to move in the vacuum chamber is determined according to the current application process to be performed. Usually, the target position is represented by the deflection center coordinates of the rotating workpiece stage.

[0075] like Figure 2 As shown, taking the vacuum etching process as an example, when performing vacuum etching, the rotating workpiece table needs to be placed within a certain distance from the ion source. During the etching process, the rotating workpiece table can also perform a reciprocating motion within a certain range in the vertical direction according to the etching requirements; in addition, in some application processes, since the workpiece side of the rotating workpiece table needs to face the ion source, its deflection angle usually needs to be limited to a deflection angle threshold range to ensure that it can carry out the application process normally.

[0076] Step S30, calculating a target angular range of the swing of the rotating workpiece table according to the target position and the maximum motion range.

[0077] In this step, after determining the target position of the deflection center of the rotating workpiece table, the target angle range that the rotating workpiece table can swing at the target position is calculated based on the maximum motion range calculated before the target position. Usually, the target angle range is is the maximum safe angle range of the rotary workpiece table. If necessary, it is limited to the deflection angle threshold If it is within the target angle range At the deflection angle threshold The maximum safe angle range of inner swing.

[0078] In one embodiment, the method for calculating the target angle range of the swing of the rotating workpiece table in step S30 may include:

[0079] S301, obtaining the target coordinates of the swing center point of the rotating workpiece table at the target position.

[0080] like Figure 2 As shown, the swing center point of the rotating workpiece table is taken as the reference point. When the reference point is at the target position, its position in O- XYZ The target coordinate P0 in the three-dimensional coordinate system ( x 0 ,y 0 ,z 0 ).

[0081] S302, calculating the maximum coordinate range corresponding to the swing of the rotating workpiece stage according to the target coordinates, the deflection angle threshold of the swing of the rotating workpiece stage, and the radius of the rotating workpiece stage.

[0082] Specifically, Figure 2 As shown, the radius R of the rotating workpiece table can be obtained, and the deflection angle threshold of the rotating workpiece table swing Within the range, according to the target coordinates P0 ( x 0 ,y 0 ,z 0 ) and the radius R of the rotating workpiece table can calculate the maximum coordinate range Q covered during the swing, such as Figure 2 The shaded part is the maximum coordinate range Q.

[0083] S303: Calculate a target angular range for the swing of the rotating workpiece table according to the maximum motion range and the maximum coordinate range.

[0084] like Figure 2 As shown, since the rotating workpiece table must be able to swing within the maximum motion range S, the maximum angular range of the rotating workpiece table's swing can be calculated through the intersection of the maximum motion range S and the maximum coordinate range Q, thereby obtaining the target angular range of its swing.

[0085] In one embodiment, the method for calculating the target angular range of the swing of the rotating workpiece table in step S303 of the above embodiment may include the following steps:

[0086] (1) Obtaining the endpoint coordinates of the edge of the rotating workpiece table when the maximum motion range and the maximum coordinate range intersect.

[0087] like Figure 3 As shown, Figure 3 This is a schematic diagram of the target angle range of the swing of the rotating workpiece table. The maximum motion range S and the maximum coordinate range Q intersect at p ( x,y,z ), the rotating workpiece table is at the dotted line position, and the end point coordinates P1 of the edge of the rotating workpiece table can be obtained at this time ( x 1 ,y 1 ,z 1 ); According to the intersection point p ( x,y,z ) and radius R can calculate the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ).

[0088] For example, since the rotating workpiece table has a certain thickness d Therefore, if there is a certain deviation when calculating using the center line, if you want to perform accurate calculations, you can further consider the influence of thickness during calculations and obtain its thickness in advance. d , and then according to the intersection point p ( x,y,z ),thickness d and the center line of radius R to calculate the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ).

[0089] It should be noted that there may be multiple intersection points when obtaining the intersection point. The figure shows the first intersection point. This intersection point is actually the first intersection point in the swing range. p The endpoint coordinate P1 of the edge of the rotating workpiece table corresponding to the time.

[0090] (2) Calculating a cutoff deflection angle of the swing of the rotating workpiece table according to the target coordinates and the endpoint coordinates.

[0091] Specifically, using the target coordinates P0 ( x 0 ,y 0 ,z 0 ) and the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ) can calculate the cut-off deflection angle of the rotating workpiece table .

[0092] As an embodiment, when calculating the cut-off deflection angle of the swing of the rotating workpiece table in the above embodiment, the following may be included:

[0093]

[0094] in, represents the cut-off deflection angle, is the projection distance of the endpoint coordinates on the plane where the swing center point of the rotating workpiece table is located, and R is the radius of the rotating workpiece table.

[0095] like Figure 3 As shown, when calculating the projection distance L of the endpoint coordinate P1 on the target coordinate P0 plane, the target coordinate P0 ( x 0 ,y 0 ,z 0 ) and the projection point P2 ( x 2 ,y 2 ,z 2 ) Calculate the projection distance L. According to the radius R and the projection distance L, the cut-off deflection angle can be calculated It should be noted that if there are multiple intersection points, multiple cutoff deflection angles can be calculated. , …….

[0096] (3) Determine a target angle range for the swing of the rotary workpiece table according to the cut-off deflection angle.

[0097] like Figure 3 As shown, the deflection angle threshold value of the rotating workpiece table is combined and the cut-off deflection angle The target angle range of the rotating workpiece table can be obtained ; If there are multiple cutoff deflection angles , ..., then multiple angle ranges can be calculated separately , ... and then select the smallest one as the target angle range .

[0098] As in the technical solution of the above embodiment, the maximum safe angle range of the rotating workpiece table when swinging in the vacuum chamber can be calculated as the target angle range according to the application process requirements, the optimal deflection angle range under the application process can be obtained, and the internal space of the vacuum chamber can be fully utilized to swing the rotating workpiece table.

[0099] Step S40, calculating the movement displacement of the rotating workpiece stage according to the target position and the second position parameter of the starting position of the rotating workpiece stage.

[0100] In this step, the movement displacement of the rotating workpiece stage from the starting position to the target position in the application process can be calculated based on the target position of the rotating workpiece stage and the second position parameter of the starting position of the rotating workpiece stage.

[0101] For example, the motion displacement can be calculated using the starting position coordinates of the deflection center of the rotating workpiece stage and the target position coordinates P0. , the movement displacement It is a value with direction; then add the movement displacement based on the starting position coordinates The target position coordinates P1 can be obtained.

[0102] Step S50: controlling the rotating workpiece stage to move to the target position according to the movement displacement, and controlling the rotating workpiece stage to swing within the target angle range.

[0103] In this step, after determining the motion displacement and target angle range Afterwards, during the application process, according to the movement displacement Control the rotating workpiece stage to move to the target position P0, and move the rotating workpiece stage by controlling the motion platform. The motion platform can be a one-dimensional, two-dimensional or three-dimensional platform, and control the rotating workpiece stage to move within the target angle range. Make a swing.

[0104] In one embodiment, when the three-dimensional platform is used to control the rotating workpiece table to move and swing, the control process of step S50 can be as follows:

[0105] (1) Obtaining a first control parameter of the X-axis motor, a second control parameter of the Y-axis motor, and a third control parameter of the Z-axis motor according to the motion displacement; and obtaining a fourth control parameter of the yaw motor according to the target angle range.

[0106] (2) Controlling the rotating workpiece table to move to the target position according to the first control parameter, the second control parameter, and the second control parameter.

[0107] (3) During the etching process, the rotating workpiece table is controlled to swing according to the fourth control parameter.

[0108] By combining the control methods of the above embodiments, the rotating workpiece table can adapt to the optimal deflection angle when the rotating workpiece table swings under different application processes, fully utilize the internal space of the vacuum chamber, reduce the limitations on the application process, be suitable for various different processes, and improve the process effect.

[0109] In order to make the technical solution of the present application more clear, more embodiments are described below in conjunction with the accompanying drawings.

[0110] In one embodiment, for different application processes, in order to find an optimal target position in the etching process and match the best deflection angle, the target position of the rotating workpiece stage in the vacuum chamber is determined in step S20, which may include the following:

[0111] S201, acquiring various position points that the rotating workpiece table can reach in the vacuum chamber according to the current application process.

[0112] Specifically, the reachable position range of the rotating workpiece table in the vacuum chamber is determined according to the current etching process. When performing the etching process, the rotating workpiece table needs to be limited to a certain position range. For example, a set distance from the ion source is required, and the angle between the rotating workpiece table and the ion source is within a set angle range. Within the reachable position range, discretization processing can be performed to select multiple position points within the position range.

[0113] S202, calculating the maximum angle range corresponding to the swing of the rotating workpiece table at each position point according to the maximum motion range, and setting the position point with the largest maximum angle range as the target position.

[0114] Specifically, for each position point, the maximum angle range corresponding to the swing of the rotating workpiece table at the position point can be calculated according to the maximum motion range, and the position point with the largest maximum angle range is set as the target position, so that the best target position can be selected by calculation.

[0115] The solution of the above embodiment can find a position point with a maximum angle range as the target position for different application processes, so as to match the best deflection angle, which can not only improve the internal space utilization of the vacuum chamber, but also maximize the process effect, thereby greatly improving the process effect.

[0116] In one embodiment, considering that the rotating workpiece stage needs to perform a reciprocating motion in some etching processes, such as Figure 2 and Figure 3 As shown, the rotating workpiece table performs a reciprocating motion within a certain range in the vertical direction; accordingly, the control method of the rotating workpiece table of the vacuum equipment of the present application, when calculating the target angle range of the swing of the rotating workpiece table in step S30, may also include the following:

[0117] (a) Obtaining the position point range of the reciprocating motion of the rotating workpiece stage in the vacuum chamber.

[0118] When the rotating workpiece table swings back and forth, the rotating workpiece table will first be moved to a target position and controlled to move back and forth along a certain trajectory; the swing center point of the rotating workpiece table can be used as a reference point to obtain the position point range of its reciprocating motion in the vacuum chamber.

[0119] (b) Selecting a number of position points within the position point range to form a position point set.

[0120] In the vacuum chamber, when the rotating workpiece table performs reciprocating motion in the vertical direction, multiple position points can be selected from the position point range of the reciprocating motion of the rotating workpiece table to form a position point set; generally, several position points can be selected at certain intervals on the reciprocating motion path, and the number of selected position points can be determined according to demand.

[0121] (c) Calculating the maximum angular range of the swing of the rotating workpiece table at each position point according to the maximum motion range.

[0122] In the space limited by the maximum motion range, the maximum angular range of the corresponding swing of the rotating workpiece table at each position point is calculated, and the maximum angular range of each position point is calculated.

[0123] (d) Obtaining a target angular range for the reciprocating motion from the maximum angular range of the position point.

[0124] The minimum value can be selected from the maximum angle range of each position point as the target angle range of the entire round trip motion .

[0125] like Figure 4 As shown, Figure 4 This is a schematic diagram of the target angle range under an example of reciprocating motion. As shown in the figure, when the rotating workpiece table moves up and down in the Z-axis direction H When the target angle range is calculated, the reciprocating motion can be performed within the range. and target angle range 2, where , you can choose As the target angle range for reciprocating motion .

[0126] The solution of the above embodiment can ensure that the rotating workpiece table will not hit other components during the entire round trip, and the internal space of the vacuum chamber can be fully utilized to provide the rotating workpiece table with swinging, thereby improving the utilization rate of the internal space of the vacuum chamber and enhancing the etching process effect.

[0127] In another embodiment, for the above-mentioned step of obtaining the target angle range of the reciprocating motion from the maximum angle range of the position point, several position points can also be selected from the position point set as target points, and the maximum angle range corresponding to the target points can be recorded accordingly; accordingly, in the process of controlling the reciprocating motion of the rotating workpiece table in the vacuum chamber, when the rotating workpiece table passes through the target point position, the rotating workpiece table is controlled to swing within the maximum angle range corresponding to the target point.

[0128] Preferably, several target points within the local range where the maximum angle range changes can be selected, and combined with the maximum angle ranges corresponding to these target points, when controlling the reciprocating motion of the rotating workpiece table in the vacuum chamber, based on the real-time position of the rotating workpiece table, when passing through the positions of these target points, the rotating workpiece table is controlled to swing within the maximum angle range corresponding to the target points.

[0129] As in the above-mentioned embodiment, more refined deflection angle control can be achieved, thereby further improving the utilization rate of the internal space of the vacuum chamber and enhancing the etching process effect.

[0130] An embodiment of a control device for a rotary workpiece table of a vacuum device is described below.

[0131] refer to Figure 5 As shown, Figure 5 The present invention is a schematic diagram of the structure of a control device for a rotating workpiece table of a vacuum device according to an embodiment, mainly comprising:

[0132] A motion range determination module 10, for obtaining first position parameters of various components inside the vacuum chamber, and determining a maximum motion range of the rotating workpiece stage in the vacuum chamber according to the first position parameters;

[0133] A target position determination module 20, for determining a target position of the rotating workpiece table in the vacuum chamber according to a current application process;

[0134] A target angle range calculation module 30, used to calculate the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range;

[0135] A motion displacement calculation module 40, used to calculate the motion displacement of the rotating workpiece stage according to the target position and a second position parameter of the starting position of the rotating workpiece stage;

[0136] The motion and swing control module 50 is used to control the rotating workpiece table to move to the target position according to the motion displacement, and control the rotating workpiece table to swing within the target angle range.

[0137] The control device of the rotating workpiece table of the vacuum equipment of this embodiment can execute a control method of the rotating workpiece table of the vacuum equipment provided in the embodiment of the present application, and the implementation principle is similar. The actions performed by each module in the control device of the rotating workpiece table of the vacuum equipment in each embodiment of the present application correspond to the steps in the control method of the rotating workpiece table of the vacuum equipment in each embodiment of the present application. For the detailed functional description of each module of the control device of the rotating workpiece table of the vacuum equipment, please refer to the description in the control method of the rotating workpiece table of the vacuum equipment shown in the previous text, which will not be repeated here.

[0138] An embodiment of the vacuum device is described below.

[0139] The vacuum equipment of the present application may be a vacuum coating machine, a vacuum etching machine, etc. Figure 6 As shown, Figure 6 This is an example structural block diagram of a vacuum device, which includes: a vacuum chamber, an ion source, a rotating workpiece table and a motion platform; wherein the ion source, the motion platform and the rotating workpiece table are respectively connected to an industrial computer; the ion source is used to output an ion beam to perform coating or etching on the workpiece on the rotating workpiece table, and the rotating workpiece table can be driven to rotate by a rotating motor and can be swung by a deflection motor; the motion platform is used to move the rotating workpiece table, and exemplarily, the motion platform can be a three-dimensional motion platform, which is driven by an X-axis motor, a Y-axis motor and a Z-axis motor; the industrial computer is configured to perform the steps of the control method for the rotating workpiece table of the vacuum device of any of the previous embodiments, so that the rotating workpiece table can be moved and the target angle range of the swing can be controlled.

[0140] The above vacuum equipment can adapt to the optimal deflection angle of the rotating workpiece table when it swings under different application processes, thereby maximizing the use of the internal space of the vacuum chamber, reducing the limitations of the application process, and improving the application process effect.

[0141] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A method for controlling a rotating workpiece table of a vacuum device, characterized in that: include: Acquire first position parameters of various components inside the vacuum chamber, and determine the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameters; Determining a target position of the rotating workpiece table in the vacuum chamber according to a current application process; Calculate the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range; the target angle range is the maximum safe angle range of the swing of the rotating workpiece table; Calculate the movement displacement of the rotating workpiece stage according to the target position and a second position parameter of the starting position of the rotating workpiece stage; The rotating workpiece table is controlled to move to the target position according to the movement displacement, and the rotating workpiece table is controlled to swing within the target angle range.

2. The control method of the rotary workpiece stage of the vacuum equipment according to claim 1, characterized in that: Determining the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameter includes: Obtaining a first coordinate space range inside the vacuum chamber; Acquire a second spatial coordinate range of various components currently installed inside the vacuum chamber according to the first position parameter; Acquire a third space coordinate range that can be covered when the rotating workpiece table swings relative to the motion platform; The maximum motion range of the rotating workpiece stage in the vacuum chamber is obtained according to the intersection of the first coordinate space range minus the second coordinate space range and the third coordinate space range.

3. The control method of the rotary workpiece stage of the vacuum equipment according to claim 1, characterized in that: Determining a target position of the rotating workpiece table in the vacuum chamber according to a current application process includes: Acquire various position points that the rotating workpiece table can reach in the vacuum chamber according to the current application process; The maximum angle range corresponding to the swing of the rotating workpiece table at each position point is calculated according to the maximum motion range, and the position point with the largest maximum angle range is set as the target position.

4. The control method of the rotary workpiece stage of the vacuum equipment according to claim 1, characterized in that: The step of calculating the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range includes: Obtaining the position point range of the reciprocating motion of the rotating workpiece table in the vacuum chamber; Selecting a number of position points within the position point range to form a position point set; Calculate the maximum angular range of the swing of the rotating workpiece table at each position point according to the maximum motion range; The target angular range of the reciprocating motion is obtained from the maximum angular range of the position points.

5. The control method of the rotary workpiece stage of the vacuum equipment according to claim 4, characterized in that: Obtaining a target angle range for the reciprocating motion from the maximum angle range of the position point includes: Selecting a number of position points from the position point set as target points, and correspondingly recording the maximum angle range corresponding to the target points; In the process of controlling the rotating workpiece stage to move back and forth in the vacuum chamber, when the rotating workpiece stage passes through the target point position, the rotating workpiece stage is controlled to swing within a maximum angle range corresponding to the target point.

6. The control method of the rotary workpiece stage of the vacuum equipment according to any one of claims 1 to 5, characterized in that: The step of calculating the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range includes: Acquire the target coordinates of the swing center point of the rotating workpiece table at the target position; Calculating the maximum coordinate range covered by the rotating workpiece table when it swings according to the target coordinates, the deflection angle threshold of the rotating workpiece table, and the radius of the rotating workpiece table; The target angle range of the swing of the rotating workpiece table is calculated according to the maximum motion range and the maximum coordinate range.

7. The control method of the rotary workpiece stage of the vacuum equipment according to claim 6, characterized in that: The step of calculating the target angle range of the swing of the rotating workpiece table according to the maximum motion range and the maximum coordinate range includes: Obtaining the endpoint coordinates of the edge of the rotating workpiece table when the maximum motion range and the maximum coordinate range intersect; Calculate the cutoff deflection angle of the swing of the rotating workpiece table according to the target coordinates and the endpoint coordinates; The target angle range of the swing of the rotary workpiece table is determined according to the cut-off deflection angle.

8. The control method of the rotary workpiece stage of the vacuum equipment according to claim 7, characterized in that: The step of calculating the cutoff deflection angle of the swing of the rotating workpiece table according to the target coordinates and the endpoint coordinates includes: in, represents the cut-off deflection angle, is the projection distance of the endpoint coordinates on the plane where the swing center point of the rotating workpiece table is located, and R is the radius of the rotating workpiece table.

9. A control device for a rotating workpiece table of a vacuum equipment, characterized in that: include: A motion range determination module, used for obtaining first position parameters of various components inside the vacuum chamber, and determining the maximum motion range of the rotating workpiece table in the vacuum chamber according to the first position parameters; A target position determination module, used to determine the target position of the rotating workpiece table in the vacuum chamber according to the current application process; A target angle range calculation module is used to calculate the target angle range of the swing of the rotating workpiece table according to the target position and the maximum motion range; the target angle range is the maximum safe angle range of the swing of the rotating workpiece table; A motion displacement calculation module, used for calculating the motion displacement of the rotating workpiece table according to the target position and a second position parameter of the starting position of the rotating workpiece table; The motion and swing control module is used to control the rotating workpiece table to move to the target position according to the motion displacement, and control the rotating workpiece table to swing within the target angle range.

10. A vacuum device, characterized in that: include: A vacuum chamber, an ion source, a rotating workpiece table and a motion platform; wherein the ion source, the motion platform and the rotating workpiece table are respectively connected to an industrial computer; The ion source is used to output an ion beam; The motion platform is used to move the rotating workpiece table; The industrial computer is configured to execute the steps of the method for controlling the rotating workpiece table of the vacuum equipment according to any one of claims 1 to 8.

Images