Wafer post-processing device and post-processing method

Abstract

The present invention discloses a wafer post-processing device and a post-processing method, and relates to the field of semiconductor manufacturing technology. The wafer post-processing device comprises: a box body; a clamping assembly, which is arranged in the box body and is used to horizontally clamp and drive the wafer to rotate; a post-processing assembly, comprising a spray head, which is arranged above the clamping assembly, and the liquid outlet end of the spray head is configured to spray liquid and / or gas toward the wafer to clean the wafer surface; the spray head sprays protective gas toward the wafer to form a protective gas curtain above the sprayed liquid, thereby blocking the mist and particles in the box from contacting with the liquid; the spray head comprises: a spray seat, which has a accommodating cavity formed therein; a core part, which is arranged in the accommodating cavity; a liquid medicine pipe, which is extended downwardly through the mounting hole of the core part; a first gap is arranged between the liquid medicine pipe and the mounting hole, and the protective gas is transmitted downwardly through the first gap.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular, to a wafer post-processing device and a post-processing method. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry towards digitalization and intelligence. Chips are the carriers of integrated circuits. Chip manufacturing involves process flows such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting packaging and testing. Among them, chemical mechanical polishing (CMP) is one of the five core processes in the wafer manufacturing process.

[0003] After chemical mechanical polishing, a large amount of particles will remain on the wafer surface, so the wafer needs to be cleaned, dried and other post-processing. Post-processing generally refers to the cleaning and drying of the wafer surface after CMP. Horizontal cleaning is one of the ways to achieve wafer post-processing, which uses spin-rinse-drying to obtain wafers with surface particle counts that meet process requirements.

[0004] In some wafer post-processing processes, the chemical solution used in post-processing will come into contact with the atomized gas particles in the working space to form particulate pollutants, and these particulate pollutants will adhere to the wafer surface, which will inevitably affect the cleaning and drying effects of the wafer surface. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a wafer post-processing device and a post-processing method to at least partially solve the above-mentioned problems.

[0006] According to a first aspect of an embodiment of the present application, a wafer post-processing device is provided, comprising:

[0007] Box;

[0008] A clamping assembly, disposed in the box, for horizontally clamping and driving the wafer to rotate;

[0009] A post-processing component, comprising a shower head, which is arranged above the clamping component, and a liquid outlet end of the shower head is configured to spray liquid and / or gas toward the wafer to clean the wafer surface;

[0010] The shower head sprays protective gas toward the wafer to form a protective gas curtain above the sprayed chemical solution, thereby preventing the mist and particles in the box from contacting the chemical solution;

[0011] The spray head comprises:

[0012] A spray seat, wherein a receiving cavity is formed inside the spray seat;

[0013] A core, disposed in the accommodating cavity;

[0014] A liquid medicine tube extending downward through the mounting hole of the core;

[0015] A first gap is provided between the drug liquid pipe and the mounting hole, and the protective gas is transmitted downward through the first gap.

[0016] In some embodiments, the core is spaced apart from the accommodating cavity of the spray seat, and the two form a spacer cavity; the protective gas is transmitted downward through the spacer cavity.

[0017] In some embodiments, the core is provided with an isolation plate disposed below the core, and a second gap is provided between the isolation plate and the spray seat.

[0018] In some embodiments, the shower seat is provided with an air inlet hole which is in communication with the partition cavity. The protective gas is delivered to the partition cavity via the air inlet hole and is transmitted toward the outside of the shower head via the second gap.

[0019] In some embodiments, there is at least one gas inlet hole, which is connected to an external protective gas source through a pipeline to transport the protective gas into the compartment cavity.

[0020] In some embodiments, the core is an annular structure, and a central cavity communicating with the mounting hole is disposed inside the core, and the drug liquid tube extends into the central cavity through the mounting hole.

[0021] In some embodiments, the shower head further includes a filter plate horizontally disposed in the central cavity to separate the central cavity into an upper central cavity and a lower central cavity, and the liquid medicine outlet end of the liquid medicine tube is located in the lower central cavity.

[0022] In some embodiments, the distance between the liquid medicine outlet and the bottom of the lower central cavity is 2-8 mm.

[0023] In some embodiments, the filter plate is detachably connected to the central cavity, and is provided with through filter holes; the number of the filter holes is multiple and evenly distributed.

[0024] In some embodiments, the filter hole is a circular hole with an inner diameter of 3-8 mm.

[0025] In some embodiments, the filter hole is a conical hole, and its pore size gradually decreases from top to bottom.

[0026] In some embodiments, the isolation plate is made of homopolymer polypropylene, polyoxymethylene or polyphenylene sulfide.

[0027] In some embodiments, the outer diameter of the isolation plate is 30-100 mm.

[0028] In some embodiments, the outer peripheral wall of the liquid medicine outlet is a conical surface, and the outer diameter of the conical surface gradually decreases from top to bottom.

[0029] In some embodiments, the angle formed by the conical surface is 5-15°.

[0030] In some embodiments, the post-processing assembly further includes a fixing seat and a swing arm, wherein the fixing seat is disposed in the box body and is located on the side of the clamping assembly, the swing arm is rotatably connected to the fixing seat, and the spray head is disposed at the end of the swing arm.

[0031] In some embodiments, the swing arm moves vertically and / or rotates horizontally along the axis of the fixing base to adjust the position of the sprinkler head.

[0032] In some embodiments, the shielding gas is an inert gas.

[0033] According to a first aspect of an embodiment of the present application, a wafer post-processing method is provided, which uses the wafer post-processing device described above, including:

[0034] Placing the wafer to be processed on the clamping assembly in the box;

[0035] The clamping assembly drives the wafer to rotate, and the swing arm of the post-processing assembly drives the shower head to swing above the wafer;

[0036] The liquid pipe sprays liquid and / or gas toward the wafer to clean the wafer surface;

[0037] During wafer post-processing, the shower head sprays protective gas to form a protective gas curtain above the sprayed chemical solution, thereby preventing the mist and particles in the box from contacting the chemical solution.

[0038] In some embodiments, after the wafer post-processing is completed, a shower head is used to clean the jaws of the clamping assembly to prevent residual liquid from affecting the subsequent wafer post-processing effect.

[0039] The beneficial effects of the present invention include:

[0040] a. The wafer post-processing device is equipped with a shower head that sprays protective gas, so that the spray liquid is isolated from the mist and particles in the box, thereby preventing the liquid from contacting with the mist and particles to form new pollutants;

[0041] b. A first gap is formed between the liquid medicine pipe of the spray head and the mounting hole of the core, and the protective gas enters the central cavity of the core through the first gap, and then is sprayed out from the central area of ​​the spray head; at the same time, the spray head is equipped with an air inlet hole, which is connected to the spacing cavity, and the protective gas enters the spacing cavity through the air inlet hole, and then is sprayed out from the edge of the spray head through the second gap; the protective gas sprayed from the center and the edge forms a protective air curtain, which effectively prevents the liquid medicine from contacting with mist and particles;

[0042] c. The spray head is equipped with a filter plate to rectify the protective gas so that the protective gas can surround the outer wall of the liquid medicine pipe and above the spray liquid;

[0043] d. The inner diameter of the filter holes increases from the inside to the outside along the radius of the filter plate. Since the apertures of adjacent filter holes are different, the speed and flow rate of the protective gas when passing through the filter holes will also be different, which helps to reduce the mutual interference of the protective gas flowing through adjacent filter holes and avoid the formation of vortices or air flow turbulence;

[0044] e. The filter holes are tapered holes with larger apertures at the top and smaller apertures at the bottom. When the protective gas enters the filter holes, the larger aperture at the top can accommodate more protective gas, reducing the risk of accumulation and blockage of the protective gas at the hole mouth. The design of the tapered hole helps the protective gas jet to better adhere to the surface of the liquid sprayed by the sprinkler head, forming a stable gas film, thereby improving the stability of the protective gas flow;

[0045] f. Set the filter hole to a conical hole. Since the upper aperture of the conical hole is larger, the shielding gas can be more widely diffused after passing through the filter hole, making the distribution of the shielding gas more uniform and avoiding excessively high or low gas concentration in local areas; at the same time, the conical hole can effectively inhibit the formation of reverse vortex pairs, reduce turbulence and eddy phenomena in the flow of shielding gas, and further improve the uniformity of shielding gas distribution;

[0046] g. The lower end of the liquid medicine tube adopts a conical structure, so that the sprayed liquid forms a more concentrated jet, which can achieve higher spraying accuracy and is suitable for wafer post-processing processes with higher precision requirements;

[0047] h. The lower end of the liquid medicine pipe adopts a conical structure, which makes it difficult for the liquid medicine to spread excessively when spraying, and can be sprayed more accurately to the target area on the wafer surface, avoiding waste of liquid medicine and unnecessary coverage of non-target areas; the concentrated jet has stronger penetrating power, which can better penetrate the pollutants attached to the wafer surface, improve the permeability of the liquid medicine, and ensure the cleaning effect of the wafer;

[0048] i. After the wafer post-processing is completed, the spray head can be used to clean the jaws of the clamping assembly to prevent the residual liquid in the jaws from affecting the subsequent wafer post-processing effect, thereby meeting the process requirements with higher cleanliness requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0050] Figure 1 is a schematic diagram of a wafer post-processing device provided by an embodiment of the present invention;

[0051] Figure 2 is a schematic diagram of a post-processing component provided by an embodiment of the present invention;

[0052] Figure 3 is a schematic diagram of a shower head provided by an embodiment of the present invention;

[0053] Figure 4 is a longitudinal cross-sectional view of a core provided by an embodiment of the present invention;

[0054] Figure 5 is a transverse cross-sectional view of a shower head provided by an embodiment of the present invention;

[0055] Figure 6 is a schematic diagram of a filter plate provided by an embodiment of the present invention;

[0056] Figure 7 The protective gas is Figure 6 Schematic diagram of gas flow corresponding to the filter plate in FIG.

[0057] Figure 8 is a schematic diagram of a filter plate provided by another embodiment of the present invention;

[0058] Fig. 9 It is a schematic diagram of a shower head provided by an embodiment of the present invention spraying a chemical solution and a protective gas toward a wafer surface;

[0059] Fig.10 It is a flow chart of a wafer post-processing method provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0060] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0061] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0062] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0063] Figure 1 is a schematic diagram of a wafer post-processing device 100 provided in one embodiment of the present invention, and the wafer post-processing device 100 includes:

[0064] The box 10 provides a relatively closed space for wafer post-processing; a switch door is usually provided on the side of the box 10 so that a robot can take and place the wafer through the switch door;

[0065] The clamping assembly 20 is arranged in the box 10, and is used to horizontally clamp and drive the wafer W to rotate; specifically, the clamping assembly 20 generally includes a turntable and a plurality of claws arranged on the outer peripheral side of the turntable, and the plurality of claws swing inward around a fixed point to horizontally clamp the wafer W; a driving motor is arranged below the clamping assembly 20 to drive the turntable and the wafer W thereon to rotate;

[0066] The post-processing component 30 includes Figure 2 The spray head 31 shown is disposed above the clamping assembly 20, and the spray head 31 is provided with a liquid outlet port 31c ( Figure 3 ) spraying liquid and / or gas toward the rotating wafer W to clean the wafer surface.

[0067] In the present invention, the shower head 31 of the post-processing component 30 can spray cleaning liquid toward the surface of the wafer to clean the particles attached to the surface of the wafer, thereby achieving non-contact cleaning of the surface of the wafer. Similarly, the shower head 31 of the post-processing component 30 can spray dry gas, such as N2 and / or IPA, toward the surface of the wafer to strip off the water film on the surface of the wafer and obtain a wafer with a clean and dry surface.

[0068] In order to ensure the cleanliness of the internal flow field of the box 10, the box 10 is usually equipped with a fan filter unit (FFU), which is a self-powered air supply and filtering device. Air is sucked in through the internal fan, filtered through a high-efficiency filter (such as a HEPA or ULPA filter), and large particles of dust, bacteria, viruses and other pollutants in the air are removed. Finally, the clean air is uniformly delivered into the box 10 at a certain wind speed, thereby ensuring that the interior of the box 10 is relatively clean.

[0069] Furthermore, the post-processing assembly 30 includes a fixing seat 32 and a swing arm 33. Figure 2 As shown, the fixed seat 32 is arranged in the box body 10 and is located on the side of the clamping assembly 20, the swing arm 33 is arranged on the top of the fixed seat 32 and is rotatably connected to the fixed seat 32, and the spray head 31 is arranged at the end of the swing arm 33. The swing arm 33 can move vertically and / or rotate horizontally around the axis of the fixed seat 32 to change the position of the spray head 31 relative to the wafer W to meet the requirements of cleaning and / or drying the wafer.

[0070] Figure 1 In the illustrated embodiment, the wafer post-processing device 100 further includes a waste liquid cover 40, which is concentrically arranged on the outer peripheral side of the clamping assembly 20, and the waste liquid cover 40 can move in a vertical direction to change the direction of the waste liquid, thereby achieving classified recovery of the cleaning waste liquid. Figure 1 In the embodiment, the number of waste liquid covers 40 is two, so as to respectively recycle the acid waste liquid and the alkaline waste liquid. It is understandable that the number of waste liquid covers 40 can also be other numbers, so as to classify and recycle different types of waste liquid.

[0071] In some wafer post-processing processes, the chemical solution used in post-processing will come into contact with the atomized gas and particles in the working space to form particulate pollutants, and these particulate pollutants will adhere to the wafer surface, which will inevitably affect the cleaning and drying effects of the wafer surface.

[0072] To solve the above technical problems, the shower head 31 provided by the present invention can spray protective gas toward the wafer W to form a protective gas curtain above the sprayed liquid, thereby preventing the mist and particles in the box 10 from contacting the liquid, thereby ensuring the post-processing effect of the wafer.

[0073] Figure 3 Schematic diagram of a shower head 31 provided in one embodiment of the present invention. The shower head 31 includes:

[0074] The spray seat 31a has a receiving cavity formed therein;

[0075] The core 31b is disposed in the accommodating cavity of the spray seat 31a;

[0076] The liquid medicine tube 31c is passed through the mounting hole 31b-1 ( Figure 4 ) is extended downward;

[0077] A first gap G1 is provided between the liquid medicine pipe 31c and the mounting hole 31b-1, and the protective gas is transmitted downward through the first gap G1 and moves to the outside of the spray head 31, thereby forming a protective gas curtain above the sprayed liquid medicine. Specifically, the gas entering the inside of the spray head 31 through the first gap G1 is also called the inner layer protective gas, and the inner layer protective gas is close to the outside of the liquid medicine pipe 31c to prevent the sprayed liquid medicine from contacting the mist and particles in the box 10. Figure 3 In the figure, the flow direction of the inner shielding gas is indicated by a solid line with an arrow.

[0078] Furthermore, the core 31b is arranged in the receiving cavity of the spray seat 31a, and the two form a spacing cavity Gi; the protective gas is transmitted downward through the spacing cavity Gi. It should be noted that the protective gas transmitted downward through the spacing cavity Gi is called edge protection gas, which is transmitted through the air inlet 31d ( Figure 5 ) enters the spacing cavity Gi, and the flow direction of the edge protection gas is indicated by a dotted line with an arrow.

[0079] It should be noted that, inside the shower head 31 , the edge protection gas and the inner layer protection gas are isolated from each other and will not mix with each other.

[0080] Figure 4 In the embodiment, the core 31b is provided with an isolation plate 31b-2, which is arranged below the core 31b, and a Figure 3 The second gap G2 is shown. Specifically, the isolation plate 31b-2 is an annular thin plate structure, which extends horizontally toward the outer peripheral side to guide the protective gas in the isolation cavity Gi outward. That is, the edge protection gas is transmitted downward through the gap between the outer peripheral wall of the core 31b and the inner side wall of the spray seat 31a, and then transmitted outward through the second gap G2. The rotating wafer W can drive the airflow on its upper side to diffuse outward, thereby forming a protective air curtain above the wafer.

[0081] Figure 5 1 is a transverse cross-sectional view of a shower head 31 provided in an embodiment of the present invention. In this embodiment, the transverse cross-sectional plane passes through the air inlet 31d of the shower seat 31a, wherein the air inlet 31d is connected to the spacer cavity Gi. The protective gas is delivered to the spacer cavity Gi through the air inlet 31d, and is transmitted toward the outside of the shower head 31 through the second gap G2.

[0082] In the present invention, there is at least one gas inlet hole 31d, which is connected to an external protective gas source through a pipeline to transport the protective gas into the partition cavity Gi. Figure 5In the illustrated embodiment, the number of the air inlet holes 31d is a pair, which are symmetrically arranged on the spray seat 31a along the center line of the swing arm 33, so as to fix the pipeline between the protective gas source and the air inlet holes 31d to the spray seat 31a, thereby avoiding excessive accumulation of the pipeline at a certain place and affecting the flexibility of the swing of the swing arm 33.

[0083] Figure 4 In the illustrated embodiment, the core 31b is an annular structure, and a central cavity 31b-3 communicating with the mounting hole 31b-1 is disposed inside the core 31b, and the liquid medicine tube 31c extends into the central cavity 31b-3 through the mounting hole 31b-1.

[0084] Figure 3 In the illustrated embodiment, the shower head 31 further includes a filter plate 31e, which is horizontally disposed in the central cavity 31b-3 to separate the central cavity 31b-3 into an upper central cavity 31b-31 and a lower central cavity 31b-32 ( Figure 4 As shown in FIG. 1 , the liquid outlet end 31c-1 of the liquid tube 31c is located in the lower central cavity 31b-32 to properly control the speed of the spray liquid diffusing outward. That is, the inner layer of protective gas is located above the spray liquid, which forms the first layer of protection; and the inner side wall of the central cavity 31b-3 is the second layer of protection, which can also prevent the spray liquid from splashing back from the wafer surface to the outside of the shower head 31.

[0085] In some embodiments, the distance between the liquid medicine outlet end 31c-1 and the bottom of the lower central cavity 31b-32 is 2-8 mm, that is, the distance between the liquid medicine outlet end 31c-1 and the lower end surface of the core 31b is 2-8 mm. Preferably, the distance between the liquid medicine outlet end 31c-1 and the bottom of the lower central cavity 31b-32 is 3-5 mm, so as to control the splashing range of the spray liquid medicine, and avoid the liquid medicine directly splashing to the outside of the core 31b, so that the splashing liquid medicine breaks through the protective air curtain formed and contacts with the mist and particles in the box 10.

[0086] In the present invention, the filter plate 31e is detachably connected to the central cavity 31b-3. The filter plate 31e is a disc-shaped structure, and is provided with through filter holes 31e-1, such as Figure 6 As shown, it plays a rectifying role; there are multiple filter holes 31e-1, which are evenly distributed.

[0087] Furthermore, the filter hole 31e-1 is a circular hole with an inner diameter of 3-8 mm.

[0088] In order to control the speed at which the protective gas enters the lower central cavity 31b-32 through the upper central cavity 31b-31, the apertures of the filter holes 31e-1 arranged in the radial direction of the filter plate 31e are different. Figure 6In the embodiment shown, the aperture of the filter hole 31e-1 gradually increases from the inside to the outside along the radius direction of the filter plate 31e. In this way, the inner layer protective gas can be quickly discharged to the lower central cavity 31b-32 through the filter hole 31e-1 of the filter plate 31e, and then flow to the gap between the isolation plate 31b-2 and the wafer, and finally merge with the edge protection gas to form a protective gas curtain above the wafer.

[0089] Figure 6 In the embodiment, a through hole is provided at the center of the filter plate 31e so that the liquid medicine tube 31c can be inserted into the through hole and installed in the core 31b. The filter holes 31e-1 arranged around the through hole are circular holes with an inner diameter of 3mm, while the inner diameter of the filter holes 31e-1 arranged at the outer edge of the filter plate 31e is 6-8mm.

[0090] Figure 7 The protective gas is Figure 6 Schematic diagram of gas flow corresponding to the filter plate 31e in FIG. 1 , in this embodiment, the aperture of the filter hole 31e-1 gradually increases from the inside to the outside, so that the protective gas is concentrated on the surface of the wafer through the filter hole 31e-1. Specifically, due to the different apertures of adjacent filter holes 31e-1, the speed and flow rate of the protective gas when passing through the filter hole 31e-1 will also be different, which helps to reduce the mutual interference of the protective gas flowing through the adjacent filter holes 31e-1 and avoid the formation of eddy currents or air flow turbulence.

[0091] The pore size of the filter hole 31e-1 gradually increases from the inside to the outside, which helps the gas to converge better on the wafer surface below the filter plate 31e. The filter hole 31e-1 with a smaller pore size can control the initial protective gas flow rate, while the filter hole 31e-1 with a larger pore size helps the protective gas to be evenly distributed and converged in a larger range, thereby improving the gas coverage rate and processing effect on the wafer surface.

[0092] In summary, by optimizing the flow path and distribution of the protective gas, the contact efficiency between the gas and the wafer surface can be improved, thereby improving the efficiency of the entire processing process, shortening the processing time, and saving the use of protective gas.

[0093] Figure 8 31e is a schematic diagram of a filter plate 31e provided in another embodiment of the present invention. In this embodiment, the filter holes 31e-1 are conical holes, and there are multiple through holes 31e-1 that are roughly evenly distributed along the center of the filter plate 31e.

[0094] Figure 8 In the embodiment, the aperture of the filter hole 31e-1 gradually decreases from top to bottom to gather the protective gas instead of diffusing it, thereby avoiding mutual interference between the protective gases discharged from adjacent filter holes 31e-1.

[0095] The aperture of the filter hole 31e-1 is larger at the top and smaller at the bottom, so that when the protective gas enters the filter hole 31e-1, the larger upper aperture can accommodate more protective gas, reducing the risk of accumulation and blockage of the protective gas at the hole mouth.

[0096] At the same time, the design of the tapered hole helps the protective gas jet to better adhere to the surface of the liquid sprayed by the shower head 31, thereby forming a stable gas film above the wafer, thereby improving the stability of the protective gas flow.

[0097] Furthermore, setting the filter hole 31e-1 as a tapered hole is beneficial to improving the uniformity of the shielding gas distribution.

[0098] Specifically, since the upper aperture of the conical hole is larger, the shielding gas can diffuse more widely after passing through the filter hole 31e-1, making the distribution of the shielding gas more uniform and avoiding excessively high or low gas concentration in local areas; at the same time, the conical hole can effectively suppress the formation of reverse vortex pairs, reduce turbulence and eddy currents in the shielding gas flow, and further improve the uniformity of the shielding gas distribution.

[0099] It should be noted that when the filter hole 31e-1 is a tapered hole as described above, the aperture gradually decreases from top to bottom to ensure that the protective gas gathers rather than diffuses, thereby avoiding mutual interference of the protective gas discharged from each filter hole 31e-1. Therefore, the size parameters of each filter hole 31e-1 can be the same. For example, in some embodiments, the aperture at the upper end of the filter hole 31e-1 is 6-8 mm, and the aperture at the lower end of the filter hole 31e-1 is 3-5 mm.

[0100] In the present invention, the outer diameter of the isolation plate 31b-2 is equal to the outer diameter of the spray seat 31a, so that the inner layer protective gas and the edge protective gas can converge into one at the outer edge of the isolation plate 31b-2, so that the protective gas curtain on the outside of the spray head 31 is a mixture of the inner layer protective gas and the edge protective gas, thereby enhancing the protection effect.

[0101] Furthermore, the isolation plate 31 b - 2 is made of homopolymer polypropylene, polyoxymethylene or polyphenylene sulfide to prevent the cleaning pollutants from being attached and improve the use effect of the shower head 31 .

[0102] In some embodiments, other components of the shower head 31 are made of synthetic rubber containing fluorine elements, such as FKM material, to ensure the high temperature resistance and chemical corrosion resistance of the shower head, thereby meeting different wafer post-processing process requirements.

[0103] In the present invention, the outer diameter of the isolation plate 31b-2 is 30-100mm, that is, the isolation plate 31b-2 is smaller than the outer diameter of the wafer to be processed. During the wafer drying process, the spray head 31 is roughly arranged in the central area of ​​the wafer, and the liquid sprayed by the liquid pipe 31c is IPA vapor. Since a protective air curtain is formed above the liquid, it is completely isolated from the mist and particles in the box 10, thereby preventing the liquid from contacting the fluid to form particles.

[0104] Figure 3 In the embodiment shown, the outer peripheral wall of the liquid medicine outlet end 31c-1 is a conical surface, and the outer diameter of the conical surface gradually decreases from top to bottom. In some embodiments, the angle θ formed by the conical surface is 5-15°, preferably, the angle θ formed by the conical surface is 10-12°, so that the sprayed liquid medicine shrinks inwards to prevent the liquid medicine from overflowing excessively and breaking through the protective air curtain.

[0105] The tapered structure at the lower end of the liquid medicine tube 31c has at least the following advantages:

[0106] First, the conical structure allows the sprayed liquid to form a more concentrated jet, which can achieve higher spraying accuracy and is suitable for wafer post-processing processes with higher precision requirements; second, due to the constraints of the conical structure, the liquid is not prone to excessive diffusion when sprayed, and can be sprayed more accurately to the target area on the wafer surface, avoiding waste of liquid and unnecessary coverage of non-target areas; third, the concentrated jet has stronger penetrating power, which can better penetrate the pollutants attached to the wafer surface, improve the permeability of the liquid, and ensure the wafer cleaning effect.

[0107] In the present invention, the protective gas is an inert gas, such as nitrogen and / or rare gas, etc., to protect the liquid sprayed by the shower head 31 .

[0108] Fig. 9 It is a schematic diagram of a shower head 31 provided by an embodiment of the present invention spraying liquid medicine and protective gas toward the surface of a wafer. At the same time, protective gas is introduced into the interior of the shower head 31, and the protective gas overflows outward from the central area of ​​the shower head 31 through the first gap G1 and the central cavity 31b-3 of the core 31b. At the same time, the protective gas entering the interval cavity Gi overflows outward from the edge of the shower head 31 through the second gap G2, thereby forming a protective air curtain above the sprayed liquid medicine. The protective air curtain spreads outward to the edge of the wafer to prevent the mist and particles in the box 10 from contacting with the liquid medicine to form particulate pollutants, thereby ensuring the post-processing effect of the wafer.

[0109] At the same time, the present invention also provides a wafer post-processing method, which uses the above Figure 1 The wafer post-processing apparatus 100 is shown, and its flow chart is as follows: Fig.10 As shown, the wafer post-processing method includes:

[0110] Placing a wafer to be processed on the clamping assembly 20 in the box 10 (S1);

[0111] The robot places the wafer to be processed on the turntable of the clamping assembly 20, and the claws on the edge of the turntable open to clamp the wafer; it should be noted that when the robot places the wafer, the waste liquid cover 40 in the box 10 moves downward to avoid interference between the robot and the waste liquid cover 40.

[0112] The clamping assembly 20 drives the wafer to rotate, and the swing arm 33 of the post-processing assembly 30 drives the shower head 31 to swing to above the wafer (S2);

[0113] Specifically, the driving motor under the clamping assembly 20 drives the turntable and the wafer thereon to rotate, and the swing arm 33 swings around the axis of the fixing seat 32 toward the clamping assembly 20, so that the spray head 31 moves above the wafer to be processed.

[0114] The chemical liquid pipe 31c sprays liquid and / or gas toward the wafer to clean the wafer surface (S3).

[0115] Specifically, the liquid medicine is sprayed from the liquid medicine outlet end 31c-1 toward the wafer surface to remove pollutants and / or water film on the wafer surface, thereby obtaining a wafer with a clean surface.

[0116] During the wafer post-processing process, the spray head 31 sprays protective gas to form a protective gas curtain above the sprayed liquid, thereby blocking the mist and particles in the box 10 from contacting the liquid, thereby preventing the sprayed liquid from reacting with the liquid or particles to form contaminants attached to the wafer surface, which will affect the post-processing effect of the wafer.

[0117] After the post-processing of a single wafer is completed, the shower head 31 can be used to clean the claws of the clamping assembly 20 to prevent the residual liquid in the claws from affecting the subsequent post-processing effect of the wafer.

[0118] In some embodiments, the shower head 31 can be used to clean the claws of the clamping assembly 20 regularly, such as cleaning the claws of the clamping assembly 20 once every 5-10 wafers. It can be understood that the frequency of cleaning the claws is related to the structure of the wafer post-processing device 100 and the cleanliness requirements of the wafer surface. For post-processing processes with high cleanliness requirements, the shower head 31 needs to be used to clean the claws of the clamping assembly 20 after each wafer post-processing is completed.

[0119] When the spray head 31 is used to clean the claws, the chemical liquid is sprayed by the liquid pipe 31 c . If the chemical liquid does not react with the mist and particles in the box 10 to form new pollutants, the spray head 31 may not need to spray protective gas.

[0120] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0121] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer post-processing device, characterized in that: include: Box; A clamping assembly, disposed in the box, for horizontally clamping and driving the wafer to rotate; A post-processing component, comprising a shower head, which is arranged above the clamping component, and a liquid outlet end of the shower head is configured to spray liquid and / or gas toward the wafer to clean the wafer surface; The shower head sprays protective gas toward the wafer to form a protective gas curtain above the sprayed chemical solution, thereby preventing the mist and particles in the box from contacting the chemical solution; The spray head comprises: A spray seat, an accommodating cavity is formed inside the spray seat, and an air inlet hole is arranged therein; The core is arranged in the accommodating cavity at intervals, and the two form an interval cavity; an isolation plate is arranged below the core, and a second gap is arranged between the isolation plate and the spray seat; A liquid medicine tube extending downward through the mounting hole of the core; A first gap is provided between the liquid medicine pipe and the mounting hole, and the protective gas is transmitted downward through the first gap and the spacing cavity; The air inlet is connected to the spacer cavity, and the protective gas is delivered to the spacer cavity through the air inlet and is transmitted toward the outside of the shower head through the second gap; The core is an annular structure, and a central cavity connected to the mounting hole is arranged inside it, and the liquid medicine tube extends into the central cavity through the mounting hole; the shower head also includes a filter plate, which is horizontally arranged in the central cavity to separate the central cavity into an upper central cavity and a lower central cavity, and the liquid medicine outlet end of the liquid medicine tube is located in the lower central cavity; the filter plate is provided with through filter holes with an aperture gradually increasing from the inside to the outside, so that the gas converges on the wafer surface below the filter plate; the filter hole is a conical hole, and its aperture gradually decreases from top to bottom.

2. The wafer post-processing device according to claim 1, characterized in that: The number of the gas inlet hole is at least one, and the gas inlet hole is connected to an external protective gas source through a pipeline to transport the protective gas into the compartment cavity.

3. The wafer post-processing device according to claim 1, characterized in that: The distance between the liquid medicine outlet and the bottom of the lower central cavity is 2-8 mm.

4. The wafer post-processing device according to claim 1, characterized in that: The filter plate is detachably connected to the central cavity, and the number of the filter holes is multiple and evenly distributed.

5. The wafer post-processing device according to claim 1, characterized in that: The isolation plate is made of homopolymer polypropylene, polyoxymethylene or polyphenylene sulfide.

6. The wafer post-processing device according to claim 5, characterized in that: The outer diameter of the isolation plate is 30-100 mm.

7. The wafer post-processing device according to claim 1, characterized in that: The outer peripheral wall of the liquid medicine outlet end is a conical surface, and the outer diameter of the conical surface gradually decreases from top to bottom.

8. The wafer post-processing device according to claim 7, characterized in that: The angle formed by the conical surface is 5-15°.

9. The wafer post-processing device according to claim 1, characterized in that: The post-processing assembly also includes a fixing seat and a swing arm. The fixing seat is arranged in the box body and is located on the side of the clamping assembly. The swing arm is rotatably connected to the fixing seat. The spray head is arranged at the end of the swing arm.

10. The wafer post-processing device according to claim 9, characterized in that: The swing arm moves vertically and / or rotates horizontally along the axis of the fixing seat to adjust the position of the spray head.

11. The wafer post-processing device according to claim 1, characterized in that: The protective gas is an inert gas.

12. A wafer post-processing method, characterized in that: The wafer post-processing device according to any one of claims 1 to 11 comprises: Placing the wafer to be processed on the clamping assembly in the box; The clamping assembly drives the wafer to rotate, and the swing arm of the post-processing assembly drives the shower head to swing above the wafer; The liquid pipe sprays liquid and / or gas toward the wafer to clean the wafer surface; During wafer post-processing, the shower head sprays protective gas to form a protective gas curtain above the sprayed chemical solution, thereby preventing the mist and particles in the box from contacting the chemical solution.

13. The wafer post-processing method according to claim 12, characterized in that: After the wafer post-processing is completed, a spray head is used to clean the jaws of the clamping assembly to prevent residual liquid from affecting the subsequent wafer post-processing effect.

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