Wire welding equipment

Abstract

The invention discloses wire welding equipment, and the equipment comprises a track which comprises a first track part and a second track part, and the first track part and the second track part are arranged at an interval in a second direction and are flush with each other; the two ends, in the second direction, of the carrier are placed on the first rail piece and the second rail piece respectively, the sides, facing the rails, of the two ends, in the second direction, of the carrier are flush with each other, the side, facing the rails, of the carrier is provided with at least one fixing part, and the fixing parts are used for fixing semiconductor devices to be subjected to wire bonding on the carrier; the fixing parts and the two ends of the carrier in the second direction are arranged at intervals in the second direction. Therefore, the fixing part can support the semiconductor device to be subjected to wire bonding on the carrier, so that the arrangement stability of the semiconductor device on the track can be ensured, the wire bonding equipment can be suitable for wire bonding of the semiconductor device, and the application range of the wire bonding equipment can be widened.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wire bonding device. Background Art

[0002] In the process of semiconductor wire bonding, products need to be placed on a track and then transported through the track in sequence for wire bonding. Usually, the track structure used to transport products is fixed.

[0003] In the prior art, different products have different structures. If the same transmission track is used to transport welding wires for different semiconductor products, the track needs to be replaced to make the track compatible with the semiconductor products to be produced. This method has low production efficiency and limited application range of the track. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a wire bonding device, which has a wider application range.

[0005] A wire bonding device according to an embodiment of the present invention includes: a track, which extends in a first direction and includes a first track member and a second track member, the first track member and the second track member are spaced apart and flush with each other in the second direction; a wire bonder, which is spaced apart on one side of the track in a third direction to perform wire bonding operations on semiconductor devices to be bonded on the track; and a carrier, wherein two ends of the carrier in a second direction are respectively placed on the first track member and the second track member, the two ends of the carrier in the second direction are flush with each other toward one side of the track, and at least one fixing portion is provided on the side of the carrier facing the track, the fixing portion is used to fix the semiconductor devices to be bonded on the carrier, and the fixing portion is spaced apart from the two ends of the carrier in the second direction in the second direction.

[0006] Therefore, by arranging a fixing portion on the side of the carrier facing the track, the fixing portion and the carrier are spaced apart in the second direction, so that the fixing portion can support the semiconductor device to be wire-bonded on the carrier. Such an arrangement can ensure the stability of the semiconductor device on the track, and then make the wire bonding equipment suitable for wire bonding of semiconductor devices, which is beneficial to improving the scope of application of the wire bonding equipment.

[0007] According to some embodiments of the present invention, the carrier includes a main body and a fixing portion, and both ends of the main body in the second direction are respectively placed on the first rail member and the second rail member, and the fixing portion is arranged on the side of the main body facing the rail and is located between the first rail member and the second rail member, and a fixing groove is defined between the fixing portion and the main body, and the fixing groove is suitable for fixing at least a portion of the semiconductor device to be welded.

[0008] According to some embodiments of the present invention, the fixing portion is a fixing bracket, the fixing bracket extends toward a third direction away from a side of the main body, and the fixing bracket is at least partially bent to define the fixing groove together with the main body.

[0009] According to some embodiments of the present invention, the fixed bracket includes a first bracket segment and a second bracket segment, one end of the first bracket segment is connected to the main body, and the other end is extended toward a third direction away from the main body, and the second bracket segment is connected to the other end of the first bracket segment and is bent and extended relative to the first bracket segment.

[0010] According to some embodiments of the present invention, the second bracket segment is rotatable relative to the first bracket segment to adjust the volume of the fixing groove so that the fixing groove is compatible with semiconductor devices of different models to be wire-bonded.

[0011] According to some embodiments of the present invention, a cross-sectional area of ​​the second stent segment is smaller than a cross-sectional area of ​​the first stent segment.

[0012] According to some embodiments of the present invention, in a third direction away from the main body, a cross-sectional area of ​​the first bracket segment gradually decreases.

[0013] According to some embodiments of the present invention, a receiving groove is provided in the main body, the receiving groove extends in the second direction, the receiving groove is suitable for receiving at least part of the semiconductor device to be wired, and the fixing groove is correspondingly connected to at least part of the receiving groove.

[0014] According to some embodiments of the present invention, the fixing portion is adjacent to one end of the main body portion in the second direction, and the carrier also includes a limiting portion, which is arranged on a side of the main body portion facing the track and located at the other end of the main body portion in the second direction to limit at least a portion of the semiconductor device to be welded in the accommodating groove.

[0015] According to some embodiments of the present invention, a side of the limiting portion facing the accommodating groove is a limiting surface, one side of the accommodating groove in the third direction is at least partially open, and the limiting surface is flush with the open side.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 is a schematic diagram of a wire bonding apparatus and a semiconductor device according to an embodiment of the present invention; Figure 2 is a schematic diagram of a wire bonding device and a semiconductor device according to another perspective of an embodiment of the present invention; Figure 3 is a schematic diagram of a carrier according to an embodiment of the present invention.

[0018] Reference numerals: 10. track; 11. first track member; 12. second track member; 20. carrier; 21. fixing portion; 211. first bracket section; 212. second bracket section; 22. main body; 23. fixing groove; 24. receiving groove; 25. limiting portion; 251. limiting surface; 30. Semiconductor devices. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0021] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0022] In the description of the present invention, "plurality" means two or more than two, and "several" means one or more.

[0023] Please refer to the following Figure 1-Figure 3 A wire bonding device according to an embodiment of the present invention is described. In an embodiment of the present invention, the wire bonding device includes but is not limited to a wire bonding device suitable for producing an intelligent power module.

[0024] like Figure 1-Figure 3 As shown, the wire bonding equipment according to the embodiment of the present invention includes a track 10 , a wire bonding machine and a carrier 20 .

[0025] The track 10 extends in a first direction and includes a first track component 11 and a second track component 12 . The first track component 11 and the second track component 12 are spaced apart and flush with each other in the second direction.

[0026] Specifically, the first track member 11 extends in the first direction, and the second track member 12 extends in the first direction, so that the track 10 of the wire welding equipment can be extended along the first direction, and then the product to be welded can be moved along the first direction on the wire welding equipment, so that the moving path of the product to be welded on the wire welding equipment can be limited, and the movement reliability of the product to be welded on the production line can be ensured.

[0027] Furthermore, the first rail member 11 and the second rail member 12 are arranged at intervals in the second direction, so that an operating space can be provided for the product to be welded on the rail 10, so as to facilitate the welding operation on the product to be welded. The first rail member 11 and the second rail member 12 are arranged flush with each other in the second direction, so that the product to be welded on the rail 10 can be kept stable along the second direction, so that the operation of the welding operation can be facilitated.

[0028] In an embodiment of the present invention, the wire welder is located on one side of the third direction of the track 10 and is spaced apart from the track 10. In this way, the wire welder can be arranged toward the track 10 in the third direction, which makes it easier for the wire welder to perform wire welding operations on the products to be welded on the track 10, thereby improving the operational convenience of the wire welding equipment.

[0029] In the embodiment of the present invention, a carrier 20 is arranged on the track 10. The two ends of the carrier 20 in the second direction are respectively placed on the first track member 11 and the second track member 12, so that the first track member 11 and the second track member 12 can both provide support for the carrier 20 and ensure that the carrier 20 is stably arranged in the second direction.

[0030] Furthermore, the two ends of the carrier 20 in the second direction are flush with each other on one side of the track 10. This arrangement can maintain structural flatness between the two ends of the carrier 20 in the second direction and the track 10, thereby ensuring that the carrier 20 can slide smoothly while being set on the track 10.

[0031] Furthermore, at least one fixing portion 21 is provided on the side of the carrier 20 facing the track 10. The fixing portion 21 can be used to fix the semiconductor device 30 to be wire-bonded on the carrier 20. The fixing portions 21 are respectively spaced apart in the second direction at both ends of the carrier 20. This not only enables the fixing portion 21 to provide stable support for the semiconductor device 30 to be wire-bonded, but also facilitates the picking up and placing of the semiconductor device 30 on the carrier 20, thereby facilitating the operational convenience of the wire bonding operation.

[0032] Therefore, by setting a fixing portion 21 on the side of the carrier 20 facing the track 10, the fixing portion 21 and the carrier 20 are spaced apart in the second direction, so that the fixing portion 21 can support the semiconductor device 30 to be wire-bonded on the carrier 20. Such a setting can ensure the stability of the setting of the semiconductor device 30 on the track 10, and then make the wire bonding equipment suitable for wire bonding of the semiconductor device 30, which is beneficial to improve the scope of application of the wire bonding equipment.

[0033] In the embodiment of the present invention, the semiconductor device 30 to be wire-bonded includes but is not limited to a discrete device such as TO-247.

[0034] By designing a carrier 20 to carry discrete devices, the discrete devices can be suitable for transportation on the track 10 designed based on the frame of the intelligent power module. In this way, when switching between the intelligent power module and the discrete devices when switching the welding wire, it is only necessary to add the carrier 20 to achieve the adaptation of the track 10 in the welding wire equipment to the different semiconductor devices 30 to be welded. Such a setting can save production time and improve production efficiency.

[0035] Combination Figure 2 As shown, the carrier 20 includes a main body 22 and a fixing portion 21, and the two ends of the main body 22 in the second direction are respectively placed on the first rail member 11 and the second rail member 12, and the fixing portion 21 is arranged on the side of the main body 22 facing the rail 10 and is located between the first rail member 11 and the second rail member 12. A fixing groove 23 is defined between the fixing portion 21 and the main body 22, and the fixing groove 23 is suitable for fixing at least a portion of the semiconductor device 30 to be wired.

[0036] Specifically, the main body 22 is the main part of the carrier 20 , and the main body 22 is the basic frame of the carrier 20 , which can ensure the structural strength of the carrier 20 .

[0037] The two ends of the main body 22 in the second direction are respectively placed on the first rail member 11 and the second rail member 12 , so that the first rail member 11 and the second rail member 12 can provide support to the carrier 20 at the same time to ensure the stability of the carrier 20 in the second direction.

[0038] Furthermore, the fixing portion 21 is disposed on the main body 22 , so that the main body 22 can provide stable and reliable support for the fixing portion 21 .

[0039] The fixing portion 21 is located on the side of the main body 22 facing the track 10, and is located between the first track member 11 and the second track member 12, so that the fixing portion 21 can support at least part of the semiconductor device 30 to be welded between the first track member 11 and the second track member 12 in the second direction, so as to enhance the support reliability of the carrier 20 for the partial structure of the semiconductor device 30 located between the first track member 11 and the second track member 12.

[0040] With such arrangement, when the wire bonder is operating, the stability of the partial structure of the semiconductor device 30 between the first track member 11 and the second track member 12 can be improved, which is beneficial to the accuracy of the wire bonding operation and further beneficial to improving the product yield.

[0041] Furthermore, a fixing groove 23 is defined between the fixing portion 21 and the main body portion 22, and the fixing groove 23 is suitable for fixing at least a portion of the semiconductor device 30 to be wired. This allows the fixing portion 21 to support a portion of the structure of the semiconductor device 30 located between the first rail member 11 and the second rail member 12, and on the other hand, it can ensure the stability of the arrangement of the semiconductor device 30 to be wired on the rail 10, which can facilitate the wire bonding operation of the wire bonder.

[0042] Combination Figure 2 As shown, the fixing portion 21 is a fixing bracket, which extends toward a third direction away from a side of the main body 22 , and is at least partially bent to define a fixing groove 23 together with the main body 22 .

[0043] Specifically, in the embodiment of the present invention, a fixing bracket is used as the fixing portion 21 of the carrier 20. The fixing bracket extends in the third direction relative to the main body 22 toward a side away from the main body 22, so that the fixing bracket and the main body 22 can jointly define a fixing groove 23, so that at least a portion of the semiconductor device 30 located between the first track member 11 and the second track member 12 can match the fixing groove 23. With such an arrangement, the wire bonding device can be adapted to the semiconductor device 30 to be wire bonded, so that the wire bonding device can perform wire bonding operations on semiconductor devices 30 of different models, thereby improving the scope of application of the wire bonding device.

[0044] Furthermore, the fixing bracket is at least partially bent to define a fixing groove 23 together with the main body 22, so that the fixing bracket can at least partially support the semiconductor device 30 to be welded in the third direction. Such a setting can ensure the reliability of the fixing bracket in supporting the semiconductor device 30 to be welded.

[0045] Combination Figure 2As shown, the fixed bracket includes a first bracket segment 211 and a second bracket segment 212. One end of the first bracket segment 211 is connected to the main body 22, and the other end is extended toward a third direction away from the main body 22. The second bracket segment 212 is connected to the other end of the first bracket segment 211 and is bent and extended relative to the first bracket segment 211.

[0046] Specifically, in the structure of the fixing bracket, the first bracket segment 211 extends in the third direction to define the dimension of the fixing slot 23 in the third direction. One end of the first bracket segment 211 is connected to the main body 22 to ensure the structural reliability of the first bracket segment 211 on the carrier 20.

[0047] In the third direction, the other end of the first bracket segment 211 is extended toward a side away from the main body 22 , so that the fixing bracket and the main body 22 together define a fixing groove 23 .

[0048] The second bracket segment 212 is connected to one end of the first bracket segment 211 away from the main body 22 , so that the structural integrity of the fixed bracket can be ensured, and the first bracket segment 211 can provide support for the second bracket segment 212 to ensure the reliability of the second bracket segment 212 on the carrier 20 .

[0049] The second bracket segment 212 is bent and extended relative to the first bracket segment 211, so that the second bracket segment 212 can be extended in a plane formed by the first direction and the second direction. In this way, the second bracket segment 212 can support the semiconductor device 30 to be wired on the carrier 20 in the third direction, thereby ensuring that the semiconductor device 30 to be wired is on the carrier 20 and is flush with the track 10, which makes it easier for the wire bonder to perform wire bonding operations on the semiconductor device 30 to be wired on the track 10.

[0050] According to an embodiment of the present invention, the second bracket segment 212 is rotatable relative to the first bracket segment 211 to adjust the volume of the fixing groove 23 so that the fixing groove 23 is compatible with semiconductor devices 30 of different models to be wire-bonded.

[0051] Specifically, by setting the second bracket segment 212 to be rotatable relative to the first bracket segment 211, the volume of the fixed groove 23 defined by the fixed bracket and the main body 22 can be changed. With this arrangement, the second bracket segment 212 can be rotated to make the fixed groove 23 suitable for placing semiconductor devices 30 of different types to be welded. With this arrangement, the application scope of the carrier 20 can be improved, and the application scope of the wire bonding equipment can be further expanded. Therefore, when producing different semiconductor devices 30, the volume of the fixed groove 23 in the carrier 20 can be adjusted to enable the wire bonding equipment to perform wire bonding on semiconductor devices 30 of different types to be welded. The compatibility of the wire bonding equipment in the embodiment of the present invention with semiconductor devices 30 of different types to be welded can be improved, thereby effectively saving production time and improving production efficiency.

[0052] Combination Figure 2 As shown, the cross-sectional area of ​​the second bracket segment 212 is smaller than the cross-sectional area of ​​the first bracket segment 211. Such a configuration can make the structural strength of the first bracket segment 211 stronger. In the embodiment of the present invention, the two ends of the first bracket segment 211 are suitable for connecting the main body 22 and the second bracket segment 212. The cross-sectional area of ​​the first bracket segment 211 is set to be larger than the cross-sectional area of ​​the second bracket segment 212. This can not only ensure that the first bracket segment 211 provides stable and reliable support for the second bracket segment 212, but also prevent the end of the first bracket segment 211 away from the main body from bearing too much weight, and reduce the stress concentration at the position where the second bracket segment 212 is connected to the first bracket segment 211. Such a configuration can improve the structural reliability of the fixed skeleton, and further improve the structural reliability of the carrier 20.

[0053] Combination Figure 2 As shown, in the third direction away from the main body 22, the cross-sectional area of ​​the first bracket segment 211 gradually decreases. Such a configuration can, on the one hand, reduce the stress on the end of the first bracket segment 211 away from the main body 22, and on the other hand, can make the structure between the first bracket segment 211 and the second bracket segment 212 smoother, thereby reducing the stress concentration at the position between the second bracket segment 212 and the first bracket segment 211, and improving the structural reliability of the fixing portion 21.

[0054] Combination Figure 1-Figure 3 As shown, a receiving groove 24 is provided in the main body 22 . The receiving groove 24 extends in the second direction. The receiving groove 24 is suitable for receiving at least a portion of the semiconductor device 30 to be wire-bonded.

[0055] Specifically, the receiving groove 24 is a main space on the carrier 20 for receiving the semiconductor device 30 to be wired, and is suitable for receiving at least part of the semiconductor device 30 to be wired between the first rail member 11 and the second rail member 12. The receiving groove 24 extends in the second direction, so that the receiving groove 24 can provide a suitable setting space for the semiconductor device 30 to be wired, which is conducive to ensuring the stability of the setting of the semiconductor device 30 to be wired on the rail 10.

[0056] Furthermore, the fixing groove 23 is correspondingly connected to at least a portion of the receiving groove 24, so that a portion of the semiconductor device 30 to be welded can be set in the receiving groove 24, and the other portion can be set in the fixing groove 23. In this way, the structural integrity of the semiconductor device 30 to be welded in the carrier 20 can be guaranteed, and the reliability of the setting of the semiconductor device 30 to be welded on the carrier 20 can be guaranteed.

[0057] Combination Figure 1-Figure 3 As shown, the fixing portion 21 is adjacent to one end of the main body portion 22 in the second direction, and the carrier 20 also includes a limiting portion 25, which is arranged on the side of the main body portion 22 facing the track 10 and is located at the other end of the main body portion 22 in the second direction to limit at least a portion of the semiconductor device 30 to be wired in the accommodating groove 24.

[0058] Specifically, the carrier 20 in the embodiment of the present invention is further provided with a limiting portion 25. The limiting portion 25 is provided on the side of the main body 22 facing the track 10, and is located at one end of the main body 22 away from the fixing portion 21 in the second direction, so that the limiting portion 25 and the fixing portion 21 can jointly limit the semiconductor device 30 to be wired and arranged on the carrier 20 in the second direction, so as to ensure the stability of the semiconductor device 30 to be wired on the carrier 20 along the second direction. Such a setting is conducive to ensuring the operating accuracy of the wire bonder when performing wire bonding operations on the semiconductor device 30 to be wired, thereby facilitating improving the product yield of the semiconductor device 30.

[0059] Combination Figure 2 and Figure 3 As shown, one side of the limiting portion 25 facing the receiving groove 24 is a limiting surface 251 , and one side of the receiving groove 24 in the third direction is at least partially open, and the limiting surface 251 is flush with the open side.

[0060] Specifically, a limiting surface 251 is provided on the limiting portion 25 , and the limiting surface 251 is located on one side of the limiting portion 25 facing the receiving groove 24 in the third direction, so that the limiting surface 251 corresponds to the semiconductor device 30 to be wired in the receiving groove 24 .

[0061] Furthermore, the receiving groove 24 is at least partially open in the third direction, and the limiting surface 251 is flush with the open side of the receiving groove 24, so that the semiconductor device 30 to be wired in the receiving groove 24 can be in contact with the limiting surface 251 on the limiting portion 25. In addition, the limiting portion 25 can limit the semiconductor device 30 to be wired in the receiving groove 24 in the third direction, so as to ensure the reliability of the semiconductor device 30 to be wired in the third direction.

[0062] Such an arrangement can ensure the stability of the semiconductor device 30 to be wire-bonded on the track 10, thereby ensuring the reliability of the wire bonder when performing wire bonding operations on the semiconductor device 30 to be wire-bonded.

[0063] The present invention designs a carrier 20 to carry semiconductor devices 30 to be wired in different frames, and uses the carrier 20 to perform transmission operations on the wire bonding equipment. When replacing different semiconductor devices 30 to be wired, there is no need to replace the track 10, which can save the time for replacing the track 10 and calibrating the wire bonding equipment caused by switching between semiconductor devices 30 to be wired in different frames, thereby greatly reducing the time for switching the product wire bonding track 10. This not only improves production efficiency, but also prevents frequent replacement of the track 10 and accessories of the wire bonding equipment from affecting the accuracy of the wire bonding equipment.

[0064] In the description of this specification, the description with reference to the terms "specific embodiment", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0065] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wire bonding device, characterized in that: include: A track extending in a first direction and comprising a first track member and a second track member, wherein the first track member and the second track member are spaced apart and flush with each other in the second direction; A wire bonder, which is arranged at intervals on one side of the track in the third direction to perform wire bonding operations on semiconductor devices to be wire bonded on the track; A carrier, wherein both ends of the carrier in the second direction are respectively placed on the first rail member and the second rail member, and both ends of the carrier in the second direction are flush with each other on the side facing the rail. At least one fixing portion is provided on the side of the carrier facing the rail, and the fixing portion is used to fix the semiconductor device to be wire-bonded on the carrier, and the fixing portion is respectively spaced apart from the two ends of the carrier in the second direction.

2. The wire bonding device according to claim 1, characterized in that: The carrier includes a main body and a fixing part, wherein two ends of the main body in the second direction are respectively placed on the first rail member and the second rail member, and the fixing part is arranged on the side of the main body facing the rail and is located between the first rail member and the second rail member, and a fixing groove is defined between the fixing part and the main body, and the fixing groove is suitable for fixing at least a part of the semiconductor device to be wired.

3. The wire bonding device according to claim 2, characterized in that: The fixing portion is a fixing bracket, which extends toward a third direction and away from a side of the main body. The fixing bracket is at least partially bent to define the fixing groove together with the main body.

4. The wire bonding device according to claim 2, characterized in that: The fixed bracket includes a first bracket segment and a second bracket segment, one end of the first bracket segment is connected to the main body, and the other end is extended toward a third direction away from the main body, and the second bracket segment is connected to the other end of the first bracket segment and is bent and extended relative to the first bracket segment.

5. The wire bonding device according to claim 4, characterized in that: The second bracket section is rotatable relative to the first bracket section to adjust the volume of the fixing groove so that the fixing groove is compatible with semiconductor devices of different models to be wire-bonded.

6. The wire bonding device according to claim 4, characterized in that: The cross-sectional area of ​​the second stent segment is smaller than the cross-sectional area of ​​the first stent segment.

7. The wire bonding device according to claim 6, characterized in that: In a third direction away from the main body, a cross-sectional area of ​​the first bracket segment gradually decreases.

8. The wire bonding device according to claim 2, characterized in that: The main body is provided with a receiving groove extending in the second direction, the receiving groove is suitable for receiving at least part of the semiconductor device to be wired, and the fixing groove is correspondingly communicated with at least part of the receiving groove.

9. The wire bonding device according to claim 8, characterized in that: The fixing portion is adjacent to one end of the main body in the second direction, and the carrier also includes a limiting portion, which is arranged on one side of the main body facing the track and located at the other end of the main body in the second direction to limit at least part of the semiconductor device to be welded in the accommodating groove.

10. The wire bonding device according to claim 9, characterized in that: A side of the limiting portion facing the accommodating groove is a limiting surface, one side of the accommodating groove in the third direction is at least partially open, and the limiting surface is flush with the open side.

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