Heat dissipation assembly, chip and manufacturing method thereof

Abstract

The invention discloses a heat dissipation assembly, a chip and a manufacturing method thereof, and the heat dissipation assembly comprises a heat conduction layer which is provided with a first surface and a second surface, and the first surface is attached to a target device; the heat dissipation structure is attached to the second surface of the heat conduction layer; the heat conduction layer transmits heat of the target device to the heat dissipation structure for radiation heat dissipation, the heat conduction layer comprises a plurality of first metal layers, a middle layer and a second metal layer, and the first metal layers, the middle layer and the second metal layer are sequentially arranged in the thickness direction of the target device. The first metal layer is attached to the target device, and the second metal layer is attached to the heat dissipation structure. Through the mode, heat generated during operation of the target device can be rapidly radiated into the environment, the temperature of the heat conduction layer and the target device is reduced, and the phenomenon that the electronic equipment normally operates due to thermal failure of the target device is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat dissipation component, a chip and a manufacturing method thereof. Background Art

[0002] As electronic devices gradually evolve towards high integration, miniaturization, and functionality, their internal heat continues to concentrate and the heat flux density continues to increase, which can easily lead to thermal failure of chips. In order to ensure the reliability and stability of electronic equipment, fans, water cooling, and heat pipes are usually used to dissipate heat from chips. However, since the contact interface between the radiator and the chip is not flat, only 2% of the chip area can contact the radiator, which reduces the efficiency of heat transfer from the chip to the radiator, causing thermal failure of the chip, resulting in the failure of the electronic equipment to operate normally. Summary of the invention

[0003] The present invention provides a heat dissipation component for solving the technical problem that a chip fails to operate normally due to heat failure.

[0004] The present invention is achieved through the following technical solutions:

[0005] The present invention proposes a heat dissipation component, comprising: a heat conductive layer, the heat conductive layer having a first surface and a second surface, the first surface being bonded to a target device; a heat dissipation structure, the heat dissipation structure being bonded to the second surface, the heat conductive layer transferring the heat of the target device to the heat dissipation structure for radiative heat dissipation; wherein the heat conductive layer comprises: a plurality of first metal layers, an intermediate layer and a second metal layer, the first metal layer, the intermediate layer and the second metal layer are sequentially arranged along the thickness direction of the target device, the first metal layer is bonded to the target device, and the second metal layer is bonded to the heat dissipation structure.

[0006] Furthermore, the intermediate layer includes a gallium-copper honeycomb panel and a gallium-based alloy layer coated on the gallium-copper honeycomb panel.

[0007] Furthermore, the thickness of the intermediate layer is 0.5 to 4 mm.

[0008] Furthermore, the first metal layer and the second metal layer are both copper layers.

[0009] Furthermore, the thickness of the first metal layer and the second metal layer are both 0.25 to 3.5 mm.

[0010] Furthermore, the heat dissipation structure includes: a heat dissipation plate and heat dissipation fins connected to the heat dissipation plate, and a heat dissipation channel is formed between adjacent heat dissipation fins.

[0011] Furthermore, the heat dissipation structure is made of aluminum or copper.

[0012] The present invention further provides a chip, comprising: the heat dissipation component as described above and a chip body, wherein the heat dissipation component is attached to the chip body.

[0013] The present invention also provides a method for manufacturing a heat dissipation assembly, which is used to manufacture the heat dissipation assembly as described above, comprising the following steps:

[0014] Placing a prefabricated heat-conducting layer on the base of the reaction chamber;

[0015] Drying the heat-conducting layer;

[0016] Pressing the heat dissipation structure onto the heat conductive layer;

[0017] Nitrogen was introduced to cool the reaction chamber to room temperature and the material was discharged.

[0018] Furthermore, the preparation of the heat conducting layer comprises the following steps:

[0019] placing a first metal layer on a base of a reaction chamber;

[0020] performing a drying process on the first metal layer;

[0021] welding the gallium copper honeycomb panel to the first metal layer;

[0022] Coating a gallium-based alloy on a gallium-copper honeycomb panel;

[0023] Laminating the second metal layer to the gallium copper honeycomb panel;

[0024] The periphery of the second metal layer is welded to the first metal layer to form a heat conducting layer.

[0025] Beneficial effects of the present invention:

[0026] Compared with the prior art, the heat dissipation assembly proposed in the present invention, by attaching the first surface of the thermal conductive layer to the target device and the second surface of the thermal conductive layer to the heat dissipation structure, allows the heat generated during the operation of the target device to be transferred to the heat dissipation structure through the first metal layer, the middle layer and the second metal layer. The heat dissipation structure radiates the heat to the environment, reduces the temperature of the thermal conductive layer and the target device, avoids thermal failure of the target device, and enables the normal operation of the electronic equipment.

[0027] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A schematic diagram of the overall structure of a heat dissipation structure proposed in an embodiment of the present invention;

[0029] Figure 2 A schematic cross-sectional view of a heat dissipation structure provided by an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of the structure of an intermediate layer in a heat dissipation structure proposed in an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the overall structure of a chip proposed in an embodiment of the present invention;

[0032] Figure 5 A flow chart of a method for manufacturing a heat dissipation structure provided by an embodiment of the present invention;

[0033] Figure 6 This is a flow chart of step S1 in a method for manufacturing a heat dissipation structure provided by an embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 10. Chip; 11. Heat dissipation component; 111. Thermal conductive layer; 1111. First metal layer; 1112. Intermediate layer; 11121. Gallium-copper honeycomb panel; 11122. Gallium-based alloy layer; 1113. Second metal layer; 112. Heat dissipation structure; 1121. Heat dissipation plate; 1122. Heat sink; 1123. Heat dissipation channel; 12. Chip body. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0043] See also Figures 1 to 3 The present invention proposes a heat dissipation component, including: a thermal conductive layer 111, the thermal conductive layer 111 has a first surface and a second surface, the first surface is bonded to a target device; a heat dissipation structure 112, the heat dissipation structure 112 is bonded to the second surface; the thermal conductive layer 111 transfers the heat of the target device to the heat dissipation structure 112 for radiative heat dissipation, wherein the thermal conductive layer 111 includes: a plurality of first metal layers 1111, an intermediate layer 1112 and a second metal layer 1113, the first metal layer 1111, the intermediate layer 1112 and the second metal layer 1113 are arranged in sequence along the thickness direction of the target device, the first metal layer 1111 is bonded to the target device, and the second metal layer 1113 is bonded to the heat dissipation structure 112.

[0044] Specifically, the first surface is directly attached to the target device (such as a chip) to conduct the heat generated in the chip to the inside of the thermal conductive layer 111. The heat dissipation structure 112 is attached to the second surface of the thermal conductive layer 111 to radiate the heat transferred from the thermal conductive layer 111 to the surrounding environment, so that the temperature of the target device and the thermal conductive layer 111 is gradually reduced. The first metal layers 1111, the middle layer 1112 and the second metal layer 1113 in the thermal conductive layer 111 are sequentially arranged along the thickness direction of the target device to form a composite structure. Since the metal layer has good thermal conductivity, the heat generated by the target device is efficiently and quickly transferred between the first metal layer 1111 and the second metal layer 1113. The heat generated by the operation of the target device is quickly transferred to the middle layer 1112 through the first metal layer 1111, and then to the second metal layer 1113. Since the second metal layer 1113 is in close contact with the heat dissipation structure 112, the heat is transferred to the heat dissipation structure 112. The heat dissipation structure 112 dissipates the heat to the external environment through air convection or thermal radiation, thereby reducing the temperature of the thermal conductive layer 111 and the target device, avoiding thermal failure of the target device, and allowing the electronic equipment to operate normally.

[0045] The heat dissipation assembly proposed in this embodiment adheres the first surface of the thermal conductive layer 111 to the target device and the second surface of the thermal conductive layer 111 to the heat dissipation structure 112, so that the heat generated during the operation of the target device is transferred to the heat dissipation structure 112 through the first metal layer 1111, the middle layer 1112 and the second metal layer 1113. The heat dissipation structure 112 radiates the heat to the environment, reduces the temperature of the thermal conductive layer 111 and the target device, avoids thermal failure of the target device, and enables the normal operation of the electronic device.

[0046] See also Figure 3 The middle layer 1112 includes a gallium-copper honeycomb panel 11121 and a gallium-based alloy layer 11122 coated on the gallium-copper honeycomb panel 11121 .

[0047] Specifically, gallium-copper materials and gallium-based alloys have high thermal conductivity, and the honeycomb structure of the gallium-copper honeycomb panel 11121 increases the heat dissipation area. Therefore, during the operation of the electronic device, the heat generated by the target device is first transferred to the gallium-based alloy layer 11122 through the first metal layer 1111, and then transferred to the second metal layer 1113 through the gallium-copper honeycomb panel 11121. The second metal layer 1113 fits tightly with the heat dissipation structure 112 and transfers the heat to the heat dissipation structure 112. The heat dissipation structure 112 radiates the heat into the surrounding environment to ensure stable operation of the target device.

[0048] In this embodiment, the gallium-based alloy layer 11122 is made by heating gallium, indium, and tin and then adding silver powder.

[0049] In this embodiment, the thickness of the middle layer 1112 is 0.5 to 4 mm, which reduces the thermal resistance of the middle layer 1112, makes heat transfer smooth, and improves the thermal conduction efficiency of the heat dissipation component, so that heat can be quickly transferred to the heat dissipation structure 112 and dissipated into the surrounding environment.

[0050] In this embodiment, the first metal layer 1111 and the second metal layer 1113 are both copper metal layers. Copper has good thermal conductivity, which ensures that heat is efficiently transferred inside the thermal conductive layer 111, thereby improving the heat dissipation efficiency of the heat dissipation component.

[0051] In this embodiment, the thickness of the first metal layer 1111 and the second metal layer 1113 are both 0.25 to 3.5 mm, which reduces the interface thermal resistance between the first metal layer 1111 and the second metal layer 1113 and the intermediate layer 1112 and improves the heat dissipation performance of the heat dissipation component.

[0052] In this embodiment, the heat dissipation structure 112 is made of aluminum or copper. Both aluminum and copper have high thermal conductivity, so that heat can be quickly dissipated from the heat dissipation structure 112 to the surrounding environment.

[0053] See also Figures 2 to 3The heat dissipation structure 112 includes: a heat dissipation plate 1121 and heat dissipation fins 1122 connected to the heat dissipation plate 1121 , and a heat dissipation channel 1123 is formed between adjacent heat dissipation fins 1122 .

[0054] Specifically, the heat generated by the target device during operation is first absorbed by the heat conducting layer 111 and then conducted to the heat sink 1121. The heat sink 1121 conducts the heat to the heat sink 1122. Since heat dissipation channels 1123 are formed between adjacent heat sinks 1122, when air flows through the heat dissipation channels 1123, it takes away the heat on the surface of the heat sink 1122.

[0055] See also Figure 4 The present invention further provides a chip 10 , comprising: the heat dissipation component 11 and a chip body 12 as described above, wherein the heat dissipation component 11 is attached to the chip body 12 .

[0056] Specifically, the heat dissipation assembly 11 is applied to the chip 10 , so the beneficial effects of the chip 10 are the same as the beneficial effects of the heat dissipation assembly 11 .

[0057] See also Figure 5 The present invention also provides a method for manufacturing a heat dissipation component, which is used to manufacture the heat dissipation component as described above, comprising the following steps:

[0058] Step S1, placing a prefabricated heat-conducting layer on a base of a reaction chamber;

[0059] Step S2, drying the heat conductive layer;

[0060] Step S3, pressing the heat dissipation structure onto the heat conductive layer;

[0061] Step S4, introducing nitrogen to reduce the temperature of the reaction chamber to room temperature and then discharging the material.

[0062] Compared with the prior art, the manufacturing method of the heat dissipation component proposed in the present invention removes moisture and volatile substances in the heat conduction layer by drying the heat conduction layer to improve the stability of the heat conduction layer. Nitrogen is an inert gas and is not easy to react chemically with other substances. Therefore, nitrogen is introduced for cooling to ensure that the environment in the reaction chamber is clean and dry, and to prevent the heat dissipation component from being contaminated or oxidized during the cooling process.

[0063] See also Figure 6 The preparation of the thermal conductive layer comprises the following steps:

[0064] Step S11, placing a first metal layer on a base of a reaction chamber;

[0065] Step S12, drying the first metal layer;

[0066] Step S13, welding the gallium-copper honeycomb panel to the first metal layer;

[0067] Step S14, coating the gallium-based alloy on the gallium-copper honeycomb panel;

[0068] Step S15, laminating the second metal layer to the gallium-copper honeycomb panel;

[0069] Step S16, welding the periphery of the second metal layer to the first metal layer to form a heat conducting layer.

[0070] Compared with the prior art, the heat dissipation structure proposed in the present invention, by attaching the first surface of the thermal conductive layer 111 to the target device, and the second surface of the thermal conductive layer 111 to the heat dissipation structure 112, so that the heat generated during the operation of the target device is transferred to the heat dissipation structure 112 through the first metal layer 1111, the middle layer 1112 and the second metal layer 1113. The heat dissipation structure 112 radiates the heat into the environment, reduces the temperature of the thermal conductive layer 111 and the target device, avoids thermal failure of the target device, and enables the normal operation of the electronic equipment.

[0071] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A heat dissipation component, characterized in that: include: A heat-conducting layer, the heat-conducting layer having a first surface and a second surface, the first surface being attached to the target device; A heat dissipation structure, wherein the heat dissipation structure is attached to the second surface, and the heat conductive layer transfers the heat of the target device to the heat dissipation structure for radiation heat dissipation; Wherein, the thermal conductive layer includes: a plurality of first metal layers, an intermediate layer and a second metal layer, wherein the first metal layer, the intermediate layer and the second metal layer are sequentially arranged along the thickness direction of the target device, the first metal layer is bonded to the target device, and the second metal layer is bonded to the heat dissipation structure.

2. The heat dissipation assembly according to claim 1, characterized in that: The intermediate layer includes a gallium-copper honeycomb panel and a gallium-based alloy layer coated on the gallium-copper honeycomb panel.

3. The heat dissipation assembly according to claim 1, characterized in that: The thickness of the intermediate layer is 0.5 to 4 mm.

4. The heat dissipation assembly according to claim 1, characterized in that: The first metal layer and the second metal layer are both copper layers.

5. The heat dissipation assembly according to claim 1, characterized in that: The thickness of the first metal layer and the second metal layer are both 0.25 to 3.5 mm.

6. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation structure comprises a heat dissipation plate and heat dissipation fins connected to the heat dissipation plate, and a heat dissipation channel is formed between adjacent heat dissipation fins.

7. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation structure is made of aluminum or copper.

8. A chip, characterized in that: include: The heat dissipation component and chip body according to any one of claims 1 to 7, wherein the heat dissipation component is attached to the chip body.

9. A method for manufacturing a heat dissipation component, used for manufacturing the heat dissipation component according to any one of claims 1 to 7, characterized in that: The following steps are involved: Placing a prefabricated heat-conducting layer on the base of the reaction chamber; Drying the heat-conducting layer; Pressing the heat dissipation structure onto the heat conductive layer; Nitrogen was introduced to cool the reaction chamber to room temperature and the material was discharged.

10. The method for manufacturing a heat dissipation assembly according to claim 9, characterized in that: The production of the thermal conductive layer comprises the following steps: placing a first metal layer on a base of a reaction chamber; performing a drying process on the first metal layer; welding the gallium copper honeycomb panel to the first metal layer; Coating a gallium-based alloy on a gallium-copper honeycomb panel; Laminating the second metal layer to the gallium copper honeycomb panel; The periphery of the second metal layer is welded to the first metal layer to form a heat conducting layer.

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