Semiconductor device testing device

Abstract

The invention relates to the technical field of semiconductor device testing, in particular to a semiconductor device testing device which comprises a box body, a liquid cooling assembly, a testing station assembly and a driving module. The liquid cooling assembly comprises a plurality of liquid cooling modules arranged on the inner wall of the box body in an array; the test station assembly comprises a support frame and a plurality of tested device bearing modules installed on the support frame. The positions of the tested device bearing modules and the liquid cooling modules are in one-to-one correspondence; and the driving module is fixed in the box body, the output end of the driving module is connected with the supporting frame, and the driving module is used for driving the supporting frame to reciprocate along a first direction, so that the tested device bearing module and the liquid cooling module are close to each other until the surfaces of the tested device bearing module and the liquid cooling module are attached or separated from each other. According to the invention, rapid thermal connection between a plurality of tested devices and a plurality of liquid cooling modules can be realized, uniform contact is realized, the test reliability is effectively enhanced, and the test efficiency can be greatly improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor device testing technology, and more specifically, to a semiconductor device testing apparatus. Background Technology

[0002] Dynamic bias high temperature and humidity reliability testing (DH3TRB), as an accelerated aging test method, is widely used to evaluate the insulation performance, package reliability, and long-term stability of power semiconductor devices under the combined effects of high temperature, high humidity, and reverse bias. During the test, the power semiconductor device under test is typically in a high-frequency switching state, resulting in significant power loss and high-density heat. As the test frequency increases, the heat flux density of the device increases sharply, reaching up to 75 W / cm². 2 If the heat generated by the device cannot be dissipated in a timely and effective manner, the junction temperature of the device will rise sharply, which will not only affect the accuracy of the test results, but may also cause thermal failure of the device, thus failing to truly reflect its reliability in high temperature and high humidity environments.

[0003] Currently, air cooling is the most common method used for heat dissipation in testing high-power-density devices. However, air cooling is limited by the specific heat capacity and convective heat transfer coefficient of air, and its heat dissipation capacity is usually insufficient to meet 75W / cm². 2 The aforementioned heat flux density and heat dissipation requirements have become a key bottleneck restricting the testing frequency and performance improvement of the DH3TRB. Liquid cooling technology, due to its excellent thermal conductivity and high thermal conductivity (up to 100W / cm²), offers a solution. 2 The above-mentioned heat dissipation capabilities make it the preferred solution for heat dissipation during testing of high power density devices. Liquid cooling plates can efficiently absorb and remove the heat generated by the devices, ensuring the stability of the device's operating temperature during testing. However, in practical applications, traditional mounting methods suffer from problems such as uneven pressure, cumbersome operation, and difficulty in achieving simultaneous testing of multiple devices. This is especially true in testing scenarios where frequent replacement of the device under test is required, resulting in low efficiency and poor consistency. Summary of the Invention

[0004] The purpose of this application is to provide a semiconductor device testing apparatus that enables rapid thermal connection between multiple devices under test and multiple liquid cooling modules, achieving uniform contact, which not only effectively enhances testing reliability but also significantly improves testing efficiency.

[0005] The embodiments of this application are implemented as follows: This application provides a semiconductor device testing apparatus, including a housing, a liquid cooling assembly, a test station assembly, and a drive module. The liquid cooling assembly includes multiple liquid cooling modules arranged in an array on the inner wall of the housing. The test station assembly includes a support frame and multiple device-under-test (DUT) carrier modules mounted on the support frame. The DUT carrier modules and the liquid cooling modules are positioned one-to-one. The drive module is fixed inside the housing, and its output end is connected to the support frame to drive the support frame to reciprocate along a first direction, so that the DUT carrier modules and the liquid cooling modules move closer to each other until their surfaces are in contact, or separate from each other.

[0006] As an optional implementation, the device under test (DUT) carrier module includes an adapter plate, a heat-conducting plate, and at least one DUT disposed on the adapter plate; the heat-conducting plate and the adapter plate are parallel to each other, one side surface of the heat-conducting plate is in contact with the side surface of the DUT away from the adapter plate, and the other side surface is in contact with the liquid cooling module.

[0007] As an optional implementation, the support frame includes a support plate and a plurality of bearing plates disposed on the support plate and perpendicular to the first direction; the plurality of bearing plates are arranged at intervals along the first direction, and a space is formed between two adjacent bearing plates to accommodate the liquid cooling module and the bearing module of the device under test.

[0008] As an optional implementation, the support plate is provided with two parallel and spaced grooves extending along the second direction, and the two opposite sides of the adapter plate are respectively inserted into the two grooves, wherein the first direction is perpendicular to the second direction.

[0009] As an optional implementation, each of the carrier plates is provided with at least two device under test carrier modules along a third direction, with the first direction, the second direction, and the third direction being perpendicular to each other.

[0010] As an optional implementation, a guide shaft is provided on the support plate, with one end perpendicularly connected to the slide groove. A first elastic element is sleeved on the guide shaft, with one end abutting against the support plate and the other end abutting against the slide groove. The compression of the first elastic element generates an elastic force that causes the test device support module to move closer to the liquid cooling module.

[0011] As an optional implementation, the device under test (DUT) carrier module includes a second elastic element; one end of the second elastic element is connected to the liquid cooling module and the other end is connected to the DUT carrier module, and is used to generate an elastic force that brings the liquid cooling module and the DUT carrier module closer to each other.

[0012] As an optional implementation, the drive module includes a base bracket, a linear guide rail, a slider bracket, and a lead screw assembly; the linear guide rail is fixed on the base bracket and extends along a first direction; the slider bracket is mounted on the linear guide rail and fixed to the support frame; the drive end of the lead screw assembly is connected to the slider bracket, and is driven to move the slider bracket on the linear guide rail.

[0013] As an optional implementation, the surface of the heat-conducting plate near the liquid cooling module is covered with a thermally conductive silicone pad.

[0014] As an optional implementation, the surface of the liquid cooling module near the heat-conducting plate is covered with an anti-adhesion coating; an aluminum film is provided on the thermally conductive silicone pad; the aluminum film is in contact with the anti-adhesion coating.

[0015] The beneficial effects of the embodiments of this application include: The semiconductor device testing apparatus provided in this application adopts a movable contact design between the liquid cooling module and the device under test (DUT) carrier module, achieving efficient heat dissipation performance under high heat flux density. This effectively avoids test distortion or device thermal failure caused by overheating, significantly improving the accuracy and reliability of DH3TRB testing. Simultaneously, the drive module moves the entire support frame, enabling multiple DUTs to synchronously and quickly achieve uniform pressing or separation from the liquid cooling module. This not only ensures consistent heat dissipation contact at each test point but also greatly simplifies the device clamping and replacement process, improving testing efficiency and ease of operation. The apparatus provided in this application solves the problems of insufficient traditional air cooling capacity and uneven manual fixing pressure and cumbersome operation, making it suitable for batch and long-term reliability testing of power semiconductor devices in high-frequency, high-temperature, and high-humidity environments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is one of the structural schematic diagrams of a semiconductor device testing apparatus according to an embodiment of this application; Figure 2 This is a second schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 3 This is the third schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 4 This is the fourth schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 5 This is the fifth schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 6 This is the sixth schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 7 This is the seventh schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 8 This is the eighth schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application; Figure 9 This is the ninth schematic diagram of the semiconductor device testing apparatus according to an embodiment of this application.

[0018] Icons: 100-Box; 101-Test station assembly; 102-Drive module; 103-Liquid cooling module; 104-Support frame; 105-DUT carrier module; 106-Adapter board; 107-Heat conduction plate; 108-DUT; 109-Support plate; 110-Carrier plate; 111-Slide groove; 112-Guide shaft; 113-First elastic element; 114-Second elastic element; 115-Base bracket; 116-Linear guide rail; 117-Slider bracket; 118-Screw assembly; X-First direction; Y-Second direction; Z-Third direction. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] Air cooling is limited by the specific heat capacity and convective heat transfer coefficient of air, resulting in limited heat dissipation capacity, typically making it difficult to meet the 75W / cm² requirement. 2 The aforementioned heat flux density and heat dissipation requirements have become a key bottleneck restricting the testing frequency and performance improvement of the DH3TRB. Liquid cooling technology, due to its excellent thermal conductivity and high thermal conductivity (up to 100W / cm²), offers a solution. 2 The above-mentioned heat dissipation capabilities make it the preferred solution for heat dissipation during testing of high power density devices. Liquid cooling plates can efficiently absorb and remove the heat generated by the devices, ensuring the stability of the device's operating temperature during testing. However, in practical applications, traditional mounting methods suffer from problems such as uneven pressure, cumbersome operation, and difficulty in achieving simultaneous testing of multiple devices. This is especially true in testing scenarios where frequent replacement of the device under test is required, resulting in low efficiency and poor consistency.

[0024] To address the aforementioned technical problems, embodiments of this application provide a semiconductor device testing apparatus.

[0025] Reference Figure 1 , Figure 2 as well as Figure 3 As shown, the semiconductor device testing apparatus provided in this application includes a housing 100, a liquid cooling assembly, a test station assembly 101, and a drive module 102. The liquid cooling assembly includes a plurality of liquid cooling modules 103 arranged in an array on the inner wall of the housing 100. The test station assembly 101 includes a support frame 104 and a plurality of device under test (DUT) carrier modules 105 mounted on the support frame 104. The DUT carrier modules 105 and the liquid cooling modules 103 are positioned in a one-to-one correspondence. The drive module 102 is fixed inside the housing 100, and its output end is connected to the support frame 104. It is used to drive the support frame 104 to reciprocate along the first direction X, so that the DUT carrier modules 105 and the liquid cooling modules 103 approach each other until they are in surface contact, or separate from each other.

[0026] It should be noted that the semiconductor device testing apparatus provided in this application integrates liquid cooling and mechanical drive structures to achieve efficient heat dissipation and rapid clamping of high power density power semiconductor devices during dynamic bias high temperature and high humidity reliability testing.

[0027] In this embodiment, during testing, the drive module 102 drives the support frame 104 to move along the first direction X, causing multiple device-under-test (DUT) carrier modules 105 to simultaneously approach the liquid-cooled modules 103 arrayed on the inner wall of the housing 100. This ensures that the DUTs in the carrier modules are in close contact with the surface of the liquid-cooled modules 103, thereby efficiently dissipating the high-density heat generated by the devices under high-frequency switching through liquid cooling technology, ensuring efficient heat dissipation. After the test is completed, the drive module 102 moves in the opposite direction, separating the test station assembly 101 from the liquid-cooled modules 103, facilitating quick replacement of the DUTs. This structure enables parallel testing of multiple devices, uniform and controllable heat dissipation contact pressure, and convenient and efficient assembly and disassembly operations, significantly improving the reliability, repeatability, and testing efficiency of the DH3TRB test.

[0028] In terms of effectiveness, the semiconductor device testing apparatus provided in this application embodiment achieves efficient heat dissipation performance under high heat flux density by adopting a movable contact design between the liquid cooling module 103 and the device under test (DUT) carrier module 105. This effectively avoids test distortion or device thermal failure caused by overheating, significantly improving the accuracy and reliability of DH3TRB testing. At the same time, the drive module 102 drives the support frame 104 to move as a whole, enabling multiple DUTs to be synchronously and quickly and uniformly pressed or separated from the liquid cooling module 103. This not only ensures the consistency of heat dissipation contact at each test point but also greatly simplifies the device clamping and replacement process, improving testing efficiency and ease of operation. The apparatus provided in this application embodiment solves the problems of insufficient traditional air cooling heat dissipation capacity and uneven manual fixing pressure and cumbersome operation. It is suitable for batch and long-term reliability testing of power semiconductor devices in high-frequency, high-temperature, and high-humidity environments.

[0029] Reference Figure 4 , Figure 5 As shown, as an optional implementation, the device under test (DUT) carrier module 105 includes an adapter plate 106, a heat-conducting plate 107, and at least one device under test (DUT) 108 disposed on the adapter plate 106. The heat-conducting plate 107 and the adapter plate 106 are parallel to each other. One side surface of the heat-conducting plate 107 is in contact with the side surface of the DUT 108 away from the adapter plate 106, and the other side surface is in contact with the liquid cooling module 103.

[0030] It should be noted that in this embodiment, the device under test (DUT) carrier module 105 adopts a layered structure design of adapter plate 106, heat conduction plate 107 and device under test 108. In this embodiment, the heat conduction plate 107 is used as a heat conduction medium to achieve efficient heat transfer between device under test 108 and liquid cooling module 103.

[0031] It should be noted that, in this embodiment, during operation, the device under test (DUT) 108 is mounted on the adapter board 106, with its heat-generating back side (such as the back electrode of a chip) in close contact with the heat-conducting plate 107, while the other side of the heat-conducting plate 107 faces the liquid-cooling module 103. When the drive module 102 pushes the support frame 104 forward, the heat-conducting plate 107 simultaneously brings the DUT 108 closer to and into contact with the surface of the liquid-cooling module 103. The high-density heat generated by the device during testing is rapidly conducted to the liquid-cooling module 103 via the heat-conducting plate 107 and then carried away by the coolant, thereby maintaining a stable operating temperature of the device during high-temperature and high-humidity reverse bias testing. This embodiment not only improves heat conduction efficiency and heat dissipation uniformity but also achieves consistency and repeatability of thermal contact states in multi-device testing through mechanical alignment, balancing the needs of efficient heat dissipation and rapid replacement.

[0032] Reference Figure 3 , Figure 6 As shown, as an optional implementation, the support frame 104 includes a support plate 109 and a plurality of carrier plates 110 disposed on the support plate 109 and perpendicular to the first direction X; the plurality of carrier plates 110 are arranged at intervals along the first direction X, and a space is formed between two adjacent carrier plates 110 to accommodate the liquid cooling module 103 and the device under test carrier module 105.

[0033] It should be noted that in this embodiment, the support frame 104 adopts a comb-like structure composed of a support plate 109 and multiple vertically arranged bearing plates 110. In this embodiment, the bearing plates 110 are arranged at intervals to form a accommodating space corresponding to the liquid cooling module 103, thereby realizing the precise installation and positioning of the multi-device-under-test bearing module 105.

[0034] Multiple device-under-test (DUT) carrier modules 105 are respectively installed in the space between adjacent carrier plates 110 and aligned with the liquid cooling modules 103 arranged in an array on the housing 100. When the drive module 102 pushes the support frame 104 to move along the first direction X, the carrier plate 110 drives the DUT carrier modules 105 therebet to move forward synchronously, so that each heat-conducting plate 107 is in contact with the surface of the corresponding liquid cooling module 103, thus completing the thermal connection.

[0035] The embodiments of this application not only ensure the parallelism and alignment accuracy of each test site during the advancement process, improve the uniformity and reliability of heat dissipation contact, but also facilitate modular installation and maintenance, effectively support parallel testing of multiple devices, and improve the overall integration and operational stability of the device.

[0036] Reference Figure 3 , Figure 7As shown, in one optional implementation, the support plate 110 has two parallel, spaced-apart sliding grooves 111 extending along the second direction Y. The adapter plate 106 is inserted into the two sliding grooves 111 on opposite sides. The first direction X is perpendicular to the second direction Y. The first direction X is perpendicular to the plane of the heat-conducting plate 107. The planes containing the heat-conducting plate 107, adapter plate 106, and support plate 110 are all parallel to each other.

[0037] It should be noted that, in this embodiment of the application, two parallel sliding grooves 111 extending along the second direction Y are provided on the carrier plate 110, and the two sides of the adapter plate 106 are correspondingly slidably inserted into the sliding grooves 111. The sliding fit structure is used to realize the detachable and guided installation of the device under test carrier module 105 on the carrier plate 110.

[0038] During operation, the adapter plate 106 slides into the accommodating space between the carrier plates 110 along the slide groove 111 (second direction Y), completing the rapid positioning and assembly of the device under test carrier module 105. Since the first direction X (the direction of movement of the support frame 104) is perpendicular to the second direction Y and perpendicular to the plane where the heat conduction plate 107 is located, when the drive module 102 pushes the support frame 104 forward along the first direction X, the carrier plate 110 drives the adapter plate 106 and the heat conduction plate 107 to press vertically against the liquid cooling module 103, ensuring that the heat conduction plate 107 and the surface of the liquid cooling module 103 are evenly attached, achieving efficient heat conduction.

[0039] The embodiments of this application not only facilitate the quick replacement and maintenance of the device under test carrier module 105, improving testing efficiency, but also ensure the stability and alignment accuracy of the installation through the sliding guide structure. At the same time, the planes of each board are parallel to each other, further improving the consistency and reliability of thermal contact in multi-point testing.

[0040] As an optional implementation, each carrier plate 110 is provided with at least two device under test carrier modules 105 along the third direction Z, with the first direction X, the second direction Y and the third direction Z being perpendicular to each other.

[0041] It should be noted that each carrier plate 110 is provided with at least two device under test (DUT) carrier modules 105 along the third direction Z, and the first direction X (movement direction of the support frame 104), the second direction Y (sliding direction of the adapter plate 106), and the third direction Z (lateral arrangement direction of the modules) are perpendicular to each other. This embodiment of the application achieves full utilization of space and increased test density by installing multiple DUT carrier modules 105 laterally on the carrier plate 110. During operation, multiple DUT carrier modules 105 are arranged side-by-side on the same carrier plate 110 along the third direction Z, achieving precise guidance and positioning through the sliding engagement of the slide groove 111 and the adapter plate 106; when the drive module 102 drives the support frame 104 to advance along the first direction X, all DUT carrier modules 105 move synchronously, causing their heat-conducting plates 107 to simultaneously contact the corresponding liquid-cooled modules 103, achieving parallel heat dissipation and testing of multiple devices and multiple points. This layout significantly increases the number of test devices per unit area, improves test efficiency and device integration, and is suitable for high-density, high-reliability accelerated aging test requirements of high-volume power semiconductor devices under high temperature and high humidity reverse bias conditions.

[0042] Reference Figure 7 , Figure 8 As shown, in one optional implementation, a guide shaft 112 is passed through the support plate 110, with one end perpendicularly connected to the slide groove 111. A first elastic member 113 is sleeved on the guide shaft 112, with one end abutting against the support plate 110 and the other end abutting against the slide groove 111. The compression of the first elastic member 113 generates an elastic force that causes the device under test support module 105 to move closer to the liquid cooling module 103.

[0043] It should be noted that in this embodiment of the application, a guide shaft 112 perpendicular to the slide groove 111 is provided on the support plate 110, and a first elastic element 113 is sleeved on the guide shaft 112, so as to realize the elastic contact between the device under test support module 105 and the liquid cooling module 103 by using the elastic pre-compression structure.

[0044] It should be noted that when the drive module 102 pushes the support frame 104 toward the liquid cooling module 103 along the first direction X, the first elastic element 113 on the guide shaft 112 is compressed between the bearing plate 110 and the slide groove 111, generating a continuous and uniform elastic restoring force, which pushes the device under test bearing module 105 to apply further pressure toward the liquid cooling module 103, thereby ensuring that the heat conduction plate 107 and the surface of the liquid cooling module 103 are tightly and uniformly attached, effectively eliminating uneven contact caused by processing and assembly errors or thermal deformation, and improving heat conduction efficiency; at the same time, the first elastic element 113 plays a buffering role at the moment of close contact, avoiding rigid collisions that could damage the surface of the heat conduction plate 107 or the liquid cooling module 103, and protecting the precision contact surface of the test device.

[0045] The embodiments of this application not only achieve reliable and uniform thermal contact pressure, but also improve the stability and service life of the device, and are especially suitable for test scenarios involving multi-point synchronous pressing and high-precision heat dissipation connection.

[0046] Reference Figure 7 , Figure 8 As shown, in one optional implementation, the device under test carrier module 105 includes a second elastic member 114; one end of the second elastic member 114 is connected to the liquid cooling module 103 and the other end is connected to the device under test carrier module 105, and is used to generate an elastic force that brings the liquid cooling module 103 and the device under test carrier module 105 closer to each other.

[0047] It should be noted that the embodiments of this application further introduce a second elastic element 114, one end of which is connected to the liquid cooling module 103 and the other end is connected to the device under test carrier module 105. The purpose is to provide active tension force through the second elastic element 114 that is connected between the liquid cooling module 103 and the test station component 101, thereby enhancing the reliability of the fit between the two.

[0048] It should be noted that when the drive module 102 drives the support frame 104 to approach the liquid cooling module 103, the second elastic element 114 is stretched or compressed and stores elastic potential energy. During the final bonding stage or when a small displacement occurs due to thermal expansion and contraction, the second elastic element 114 releases its elastic force and continuously applies a pre-tightening force to bring the device under test carrier module 105 and the liquid cooling module 103 closer together. This further ensures that the heat conduction plate 107 and the liquid cooling module 103 maintain a stable, uniform, and gapless thermal contact, effectively improving heat conduction efficiency and temperature control stability. At the same time, the second elastic element 114 can absorb vibration, alleviate mechanical shock, reduce stress fatigue caused by frequent assembly and disassembly or temperature cycling, and improve the reliability and service life of the system.

[0049] The embodiments of this application work in conjunction with the aforementioned first elastic element 113 to form a multi-directional elastic pre-compression mechanism, which significantly optimizes the contact consistency and dynamic adaptability of the heat dissipation interface under high-density, multi-point testing conditions.

[0050] Reference Figure 9 As shown, in one optional implementation, the drive module 102 includes a base bracket 115, a linear guide rail 116, a slider bracket 117, and a lead screw assembly 118; the linear guide rail 116 is fixed on the base bracket 115 and extends along the first direction X; the slider bracket 117 is mounted on the linear guide rail 116 and fixed to the support frame 104; the drive end of the lead screw assembly 118 is connected to the slider bracket 117, and is driven to move the slider bracket 117 on the linear guide rail 116.

[0051] It should be noted that, in this embodiment, the drive module 102 adopts a collaborative structure of a base bracket 115, a linear guide rail 116, a slider bracket 117, and a lead screw assembly 118. Through a precision guiding and transmission mechanism, it enables the support frame 104 to move smoothly and precisely along the first direction X. The lead screw assembly 118 rotates under external power, driving the slider bracket 117 connected to it to move linearly along the linear guide rail 116. Since the slider bracket 117 is fixedly connected to the support frame 104, it drives the entire test station assembly 101 to move forward or backward synchronously, achieving reliable contact or separation between the device under test (DUT) carrier module 105 and the liquid cooling module 103.

[0052] It should be noted that the external power can be manually operated by staff or driven by an electric motor.

[0053] The linear guide 116 in this embodiment provides high rigidity and low friction for guiding the motion, ensuring parallelism and alignment accuracy during multi-point contact. The lead screw assembly 118 provides controllable propulsion force and position control, making the pressing process smooth and controllable, and avoiding impact. This drive structure not only ensures the uniformity and repeatability of thermal contact, but also improves the automation level and operational stability of the testing device, making it suitable for high-precision, high-frequency assembly and disassembly reliability testing scenarios.

[0054] As an optional implementation, the surface of the heat-conducting plate 107 near the liquid cooling module 103 is covered with a thermally conductive silicone pad.

[0055] It should be noted that a thermally conductive silicone pad is covered on the surface of the heat-conducting plate 107 near the liquid cooling module 103. The flexible properties of the thermally conductive silicone pad in this embodiment can fill the microscopic uneven gap between the heat-conducting plate 107 and the liquid cooling module 103, reduce contact thermal resistance, and absorb assembly errors and thermal deformation stress to ensure uniform pressure distribution.

[0056] As an optional implementation, the surface of the liquid cooling module 103 near the heat-conducting plate 107 is covered with an anti-adhesion coating; an aluminum film is provided on the thermally conductive silicone pad; the aluminum film is in contact with the anti-adhesion coating.

[0057] This embodiment of the application covers the surface of the liquid cooling module 103 with an anti-adhesion coating and sets an aluminum film on the thermally conductive silicone pad. The technical principle is to solve the problems of easy adhesion, aging, and difficulty in disassembly of thermally conductive silicone under long-term thermal cycling through the synergistic design of interface materials. During operation, the aluminum film on the thermally conductive silicone pad is in direct contact with the anti-adhesion coating on the surface of the liquid cooling module 103, forming a stable low-adhesion interface: the anti-adhesion coating (such as a fluorinated coating or ceramic coating) effectively prevents the silicone material from chemically adhering or physically interlocking with the metal surface; the aluminum film acts as a protective layer, which not only enhances the mechanical strength and heat reflection performance of the silicone pad, but also avoids direct contact between the silicone and the surface of the liquid cooling module 103, further reducing the risk of adhesion.

[0058] The structure of this embodiment ensures good thermal conductivity and elastic fit, while allowing the device under test carrier module 105 to be easily separated from the liquid cooling module 103 after the test. This prevents interface damage and maintenance difficulties caused by silicone residue or tearing, significantly improving the reusability, maintenance convenience and long-term operational reliability of the device. It is especially suitable for high-throughput reliability testing scenarios that require frequent device replacement.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semiconductor device testing apparatus, characterized by comprising: The utility model relates to a test device for semiconductor wafer, including box (100), liquid cooling assembly, test station assembly (101) and drive module (102), the liquid cooling assembly includes a plurality of array setting liquid cooling module (103) in the box (100) inner wall, the test station assembly (101) includes support frame (104) and a plurality of installation measured device carrying module (105) on support frame (104), measured device carrying module (105) with liquid cooling module (103) position one -to-one correspondence, drive module (102) is fixed in box (100), its output end connects support frame (104), is used for driving support frame (104) reciprocating motion along first direction (X), so that measured device carrying module (105) with liquid cooling module (103) mutually close to surface bonding, or mutually separate.

2. The semiconductor device testing apparatus according to claim 1, wherein The measured device carrying module (105) includes an adapter plate (106), a heat-conducting plate (107), and at least one device under test (108) disposed on the adapter plate (106); the heat-conducting plate (107) is parallel to the adapter plate (106), one side surface of the heat-conducting plate (107) is bonded to a side surface of the device under test (108) away from the adapter plate (106), and the other side surface of the heat-conducting plate (107) is bondable to the liquid cooling module (103).

3. The semiconductor device testing apparatus according to claim 2, wherein The support frame (104) includes a support plate (109) and a plurality of carrier plates (110) disposed on the support plate (109) and perpendicular to the first direction (X); the plurality of carrier plates (110) are arranged at intervals along the first direction (X), and a space for accommodating the liquid cooling module (103) and the measured device carrying module (105) is formed between adjacent two carrier plates (110).

4. The semiconductor device testing apparatus according to claim 3, wherein The carrier plate (110) is provided with two parallel and spaced sliding grooves (111) extending along a second direction (Y), and opposite sides of the adapter plate (106) are respectively inserted into the two sliding grooves (111) correspondingly, and the first direction (X) is perpendicular to the second direction (Y).

5. The semiconductor device testing apparatus according to claim 4, wherein Each of the carrier plates (110) is provided with at least two measured device carrying modules (105) along a third direction (Z), and the first direction (X), the second direction (Y), and the third direction (Z) are perpendicular to each other.

6. The semiconductor device testing apparatus according to claim 4, wherein The carrier plate (110) is provided with a guide shaft (112) connected perpendicularly to the sliding groove (111) at one end, the guide shaft (112) is provided with a first elastic member (113) abutting against the carrier plate (110) at one end and abutting against the sliding groove (111) at the other end, and the first elastic member (113) generates an elastic force for moving the measured device carrying module (105) towards the liquid cooling module (103) when compressed.

7. The semiconductor device testing apparatus according to any one of claims 1 to 5, wherein The measured device carrying module (105) includes a second elastic member (114), one end of the second elastic member (114) is connected to the liquid cooling module (103), and the other end of the second elastic member (114) is connected to the measured device carrying module (105), and the second elastic member (114) generates an elastic force for moving the liquid cooling module (103) and the measured device carrying module (105) towards each other.

8. The semiconductor device testing apparatus according to any one of claims 1 to 5, wherein The driving module (102) comprises a base support (115), a linear guide rail (116), a slider support (117) and a screw rod assembly (118); the linear guide rail (116) is fixed on the base support (115) and extends along a first direction (X); the slider support (117) is installed on the linear guide rail (116) and fixed with the support frame (104); the driving end of the screw rod assembly (118) is connected with the slider support (117) and drives the slider support (117) to move on the linear guide rail (116).

9. The semiconductor device testing apparatus according to any one of claims 2 to 5, wherein The surface of the heat conduction plate (107) close to the liquid cooling module (103) is covered with a heat conduction silica gel pad.

10. The semiconductor device testing apparatus according to claim 9, wherein The surface of the liquid cooling module (103) close to the heat conduction plate (107) is covered with an anti-adhesion coating; the heat conduction silica gel pad is provided with an aluminum film; the aluminum film is in contact with the anti-adhesion coating.

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