Heat Dissipation Control Method, Device and Storage Medium for Triode Package

Abstract

The present invention discloses a heat dissipation control method, device and storage medium for triode packaging, relating to the field of semiconductor technology. The method includes: arranging a multi-layer heat dissipation structure of a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer outside the triode, and independently controlling each heat dissipation layer; collecting the packaging control parameters of the triode; performing heat prediction according to the packaging control parameters and outputting a first predicted heat index; judging whether the first predicted heat index is greater than or equal to a preset heat index, and if it is greater than or equal to, starting a combined channel heat dissipation instruction; according to the combined channel heat dissipation instruction, performing a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure to obtain a combined heat dissipation mode; and performing heat dissipation control on the triode according to the combined heat dissipation mode. Thus, the technical effects of improving the heat dissipation efficiency, ensuring the heat dissipation balance and providing active heat dissipation regulation are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat dissipation control method, device and storage medium for transistor packaging. Background Art

[0002] As a commonly used semiconductor device, the transistor generates a large amount of heat when it is working. If the heat dissipation is not timely or uniform, it will cause the transistor to overheat, thereby affecting its performance, lifespan, and even causing damage.

[0003] Traditional heat dissipation technologies primarily rely on simple heat sinks and heat dissipation channels. However, as transistor power increases and operating environments become more complex, these methods are gradually showing their limitations. This is especially true in high-power, high-density integrated circuits, where a single heat dissipation path often fails to meet complex thermal management requirements. This leads to technical issues such as poor heat dissipation efficiency and balance, and a lack of active control. Summary of the Invention

[0004] The present invention provides a heat dissipation control method, device and storage medium for transistor packaging to solve the technical problems of poor heat dissipation efficiency and balance and lack of active regulation in the prior art, thereby achieving the technical effects of improving heat dissipation efficiency, ensuring heat dissipation balance and providing active heat dissipation regulation.

[0005] In a first aspect, the present invention provides a heat dissipation control method for a transistor package, wherein the method comprises:

[0006] A multi-layer heat dissipation structure is arranged outside the triode, wherein the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled.

[0007] The packaging control parameters of the transistor are collected.

[0008] Heat prediction is performed according to the packaging control parameters, and a first predicted heat index is output.

[0009] It is determined whether the first predicted heat index is greater than or equal to a preset heat index, and if the first predicted heat index is greater than or equal to the preset heat index, a joint channel heat dissipation instruction is started.

[0010] According to the joint channel heat dissipation instruction, a heat dissipation mode joint analysis is performed on the first predicted heat index in the multi-layer heat dissipation structure to obtain a joint heat dissipation mode.

[0011] Heat dissipation control is performed on the transistor according to the combined heat dissipation mode.

[0012] In a second aspect, the present invention further provides a heat dissipation control device for a transistor package, wherein the device comprises:

[0013] Multi-layer heat dissipation configuration module, which is used to set up multi-layer heat dissipation structures outside the triode. Among them, the multi-layer heat dissipation structures include a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled.

[0014] Package control parameter acquisition module, which is used to acquire the package control parameters of the triode.

[0015] Heat generation prediction module, which is used to perform heat prediction according to the package control parameters and output the first predicted heat index.

[0016] Heat discrimination module, which is used to judge whether the first predicted heat index is greater than or equal to the preset heat index. If the first predicted heat index is greater than or equal to the preset heat index, a combined channel heat dissipation instruction is activated.

[0017] Heat dissipation mode analysis module, which is used to perform a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure according to the combined channel heat dissipation instruction to obtain the combined heat dissipation mode.

[0018] Heat dissipation control module, which is used to control the heat dissipation of the triode according to the combined heat dissipation mode.

[0019] In a third aspect, the present invention also provides a computer-readable storage medium storing a computer program, which when executed by a processor, implements the data security management method based on privacy computing provided by the present invention.

[0020] The present invention discloses a heat dissipation control method, device and storage medium for triode packaging, including: setting up multi-layer heat dissipation structures outside the triode, including a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer, where each heat dissipation layer can be independently controlled; acquiring the package control parameters of the triode; performing heat prediction according to the package control parameters and outputting the first predicted heat index; judging whether the first predicted heat index is greater than or equal to the preset heat index, and if it is greater than or equal to, activating the combined channel heat dissipation instruction; performing a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure according to the combined channel heat dissipation instruction to obtain the combined heat dissipation mode; controlling the heat dissipation of the triode according to the combined heat dissipation mode. The heat dissipation control method, device and storage medium for triode packaging disclosed by the present invention solve the technical problems of poor heat dissipation efficiency and balance and lack of active regulation, and achieve the technical effects of improving heat dissipation efficiency, ensuring heat dissipation balance and providing active heat dissipation regulation. Brief Description of the Drawings

[0021] Figure 1 It is a schematic flow chart of the heat dissipation control method for triode packaging of the present invention;

[0022] Figure 2 Schematic structural diagram of the heat dissipation control device for the triode package of the present invention;

[0023] Figure 3 Schematic structural diagram of a computer-readable storage medium provided by the present invention.

[0024] Explanation of reference numerals: multi-layer heat dissipation configuration module 11, package control parameter acquisition module 12, heat generation prediction module 13, heat discrimination module 14, heat dissipation mode analysis module 15, heat dissipation control module 16, computer-readable storage medium 600, computer program 611. Detailed implementation manners

[0025] In the embodiments of the present invention, the overall idea adopted for the technical solution provided to solve the technical problems of poor heat dissipation efficiency and balance and lack of active regulation existing in the prior art is as follows:

[0026] First, a multi-layer heat dissipation structure is provided outside the triode. Among them, the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled; then, the package control parameters of the triode are collected; then, heat generation prediction is performed according to the package control parameters, and a first predicted heat index is output; next, it is judged whether the first predicted heat index is greater than or equal to a preset heat index. If the first predicted heat index is greater than or equal to the preset heat index, a combined channel heat dissipation instruction is started; further, according to the combined channel heat dissipation instruction, a combined heat dissipation mode is obtained by performing a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure; finally, heat dissipation control is performed on the triode according to the combined heat dissipation mode.

[0027] The above technical solution will be described in detail below in combination with the accompanying drawings of the specification and specific implementation manners to better understand the above technical solution. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention. It should be understood that the present invention is not limited to the example embodiments for explaining the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention. In addition, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings rather than all. Embodiment 1

[0028] Figure 1 Schematic flowchart of the heat dissipation control method for the triode package of the present invention, where the method includes:

[0029] A multi-layer heat dissipation structure is provided outside the triode. Among them, the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled.

[0030] Specifically, first, a multi-layer heat dissipation structure is configured for the target triode. The multi-layer heat dissipation structure is disposed on the outer surface or package of the triode and includes a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer.

[0031] In some embodiments, the heat dissipation efficiency of the heat sink layer is less than that of the first heat dissipation channel layer, and the heat dissipation efficiency of the first heat dissipation channel layer is less than that of the second heat dissipation channel layer.

[0032] Specifically, the heat sink layer, the first heat dissipation channel layer, and the second heat dissipation channel layer have a stepped configuration of heat dissipation capabilities. Among them, the heat dissipation efficiency of the heat sink layer is the lowest, the heat dissipation efficiency of the second heat dissipation channel layer is the highest, and the heat dissipation efficiency of the first heat dissipation channel layer is between the two; through the above-mentioned multi-layer heat dissipation structure with a stepped configuration, it helps to provide sufficient control space for the flexible heat dissipation control of the target triode.

[0033] Specifically, each stage of the heat dissipation channel has different characteristic parameters corresponding to different heat dissipation efficiencies. Among them, the characteristic parameters of the heat dissipation channel include material, shape and area, channel width and height, surface roughness, convection velocity, etc. Exemplarily, each stage of the heat dissipation channel corresponds to heat dissipation parameters in different dimensions. For the heat sink layer, it mainly involves material (thermal conductivity and heat capacity), shape, area, surface roughness, etc.; while for the first heat dissipation channel layer and the second heat dissipation channel layer, they correspondingly include the thermal conductivity and heat capacity of the material, the width and height of the channel, the designed convection velocity, etc., and the first heat dissipation channel layer and the second heat dissipation channel layer have different configurations (such as different working fluid convection velocities, different channel designs, different material selections, etc.).

[0034] Collect the package control parameters of the triode.

[0035] Specifically, the package control parameters of the triode involve specific quantitative parameters of the target triode in dimensions such as package form, package material, electrical performance, etc.; by collecting the package control parameters, it provides an important basis for accurately predicting the heat generation of the triode under different working conditions.

[0036] Exemplarily, the encapsulation control parameters include: the thermal conductivity of the encapsulation material, which affects the heat conduction efficiency through the encapsulation material; the coefficient of thermal expansion, i.e., the expansion characteristics of the material when the temperature changes, which affects the thermal stress and encapsulation integrity; the encapsulation structure parameters, such as size and shape (affecting the heat dissipation area and path), number of layers and thickness (affecting the heat conduction path), etc.; the thermal conductivity (affecting the heat conduction efficiency between the chip and the radiator), thickness and uniformity (affecting the thermal resistance and heat dissipation performance) of the thermal interface material; and the electrical performance of the triode, such as power consumption, heat density, heat generation distribution, etc.

[0037] Perform heat prediction according to the encapsulation control parameters and output the first predicted heat index.

[0038] Specifically, combine the encapsulation control parameters with the existing physical property mathematical models related to heat conduction to obtain the heat generation situation and heat distribution of the target triode, and obtain the first predicted heat index, which is the basis for subsequent heat dissipation decisions.

[0039] In some embodiments, performing heat prediction according to the encapsulation control parameters and outputting the first predicted heat index, the method includes:

[0040] Construct a heat conduction model based on the triode; collect the real-time working state of the triode; input the encapsulation control parameters and the real-time working state into the heat conduction model to simulate heat conduction loss, and output a heat conduction simulation data set; perform heat loss prediction based on the heat conduction simulation data set and output the first predicted heat index.

[0041] Specifically, first, construct a heat conduction model based on the finite element analysis (FEA) method; then, obtain the real-time working state of the target triode, including working voltage, current, characteristic frequency, base parameters, etc.; then, according to the parameters such as the encapsulation material, structure parameters and thermal interface material characteristics in the encapsulation control parameters, combine with the real-time working state of the triode, set the model parameters of the above heat conduction model, and define boundary conditions such as ambient temperature and air flow conditions to ensure that the heat conduction model can accurately reflect the real-time state of the target triode; and then run the heat conduction model to simulate the loss in the heat conduction process and generate a heat conduction simulation data set.

[0042] Specifically, analyze the heat conduction simulation data set, identify the main sources of heat loss, that is, which parts (such as contact surfaces, internal structures) in the triode generate the most heat, and determine the heat loss mode, such as the load mode, frequency mode, time mode, etc. corresponding to the heat loss; define the identification result as the first predicted heat index. In other words, the heat loss of the target triode corresponds to the heat generation of the target triode. Preferably, the first predicted heat index is the average heat loss of the target triode encapsulation.

[0043] Determine whether the first predicted heat index is greater than or equal to a preset heat index. If the first predicted heat index is greater than or equal to the preset heat index, activate the combined-channel heat dissipation instruction.

[0044] Specifically, compare the first predicted heat index with the preset heat index, which is determined based on the maximum heat dissipation capacity of a single heat dissipation channel of the target transistor package. In other words, the preset heat index defines the maximum heat index of a single heat dissipation channel of the target transistor package under the condition of ensuring the safe operation of the transistor. Among them, the passive heat dissipation capacity can be determined through experiments or simulations, and the preset heat index corresponds to the most unfavorable environment.

[0045] In some embodiments, when determining whether the first predicted heat index is greater than or equal to the preset heat index, the method further includes:

[0046] If the first predicted heat index is less than the preset heat index, activate the single-channel heat dissipation instruction; according to the single-channel heat dissipation instruction, perform a heat dissipation mode matching analysis on the first predicted heat index in the multi-layer heat dissipation structure to obtain a heat sink layer, a first heat dissipation channel layer, or a second heat dissipation channel layer; perform heat dissipation control on the transistor according to the heat sink layer, the first heat dissipation channel layer, or the second heat dissipation channel layer.

[0047] Specifically, compare the first predicted heat index with the preset heat index. If the first predicted heat index is less than the preset heat index, it can be considered that single-channel heat dissipation is sufficient to meet the heat dissipation requirements and ensure the safe operation of the transistor, and then the single-channel heat dissipation instruction can be activated.

[0048] Specifically, through the single-channel heat dissipation instruction, perform a heat dissipation mode matching analysis in the multi-layer heat dissipation structure, and match according to the first predicted heat index and the heat dissipation efficiency of the multi-layer heat dissipation structure to determine the one with the lowest heat dissipation efficiency among the heat sink layer, the first heat dissipation channel layer, or the second heat dissipation channel layer that meets the first predicted heat index as the most suitable heat dissipation layer, and perform effective heat dissipation control on the transistor through the selected heat sink layer or heat dissipation channel layer.

[0049] According to the combined-channel heat dissipation instruction, perform a combined heat dissipation mode analysis on the first predicted heat index in the multi-layer heat dissipation structure to obtain a combined heat dissipation mode.

[0050] Specifically, if the first predicted heat index is greater than or equal to the preset heat index, it means that the current heat generation of the transistor is relatively high, and single-channel heat dissipation cannot meet the heat dissipation requirements to ensure the safe operation of the transistor. Then activate the combined-channel heat dissipation instruction, and perform a decision-making analysis on heat dissipation through this combined-channel heat dissipation instruction to obtain the corresponding combined heat dissipation mode.

[0051] Exemplarily, the combined heat dissipation mode is used to define the specific heat dissipation strategy for combined heat dissipation, such as selecting the heat dissipation layer for combined heat dissipation, specific heat dissipation control parameters, etc.

[0052] In some embodiments, according to the combined channel heat dissipation instruction, a combined analysis of the heat dissipation mode is performed on the first predicted heat index by the multi-layer heat dissipation structure to obtain a combined heat dissipation mode. The method includes:

[0053] Calculating the heat dissipation performance index of each heat dissipation layer in the multi-layer heat dissipation structure; obtaining the first thermal coupling coefficient and the second thermal coupling coefficient in the multi-layer heat dissipation structure, where the first thermal coupling coefficient is the degree of mutual influence between the heat sink layer and the first heat dissipation channel layer, and the second thermal coupling coefficient is the degree of mutual influence between the first heat dissipation channel layer and the second heat dissipation channel layer; constructing an optimization model for the combined heat dissipation mode according to the heat dissipation performance index of each heat dissipation layer, the first thermal coupling coefficient, and the second thermal coupling coefficient; and performing a combined analysis of the heat dissipation mode on the first predicted heat index according to the optimization model for the combined heat dissipation mode to obtain a combined heat dissipation mode.

[0054] Specifically, for the analysis and decision-making of combined heat dissipation according to the combined channel heat dissipation instruction, first, the heat dissipation performance indexes of multiple heat dissipation layers are evaluated and calculated through the characteristic parameters of each heat dissipation layer, such as the surface heat dissipation coefficient, thermal resistance, thermal conductivity, etc.

[0055] Specifically, since multiple heat dissipation layers act on the same triode package together, when multiple heat dissipation layers in different combinations are used jointly, the internal temperature field of the target triode will change differently, such as temperature distribution, temperature gradient at each interface, etc.; therefore, it is necessary to analyze the degree of mutual influence between the heat sink layer and the first heat dissipation channel layer, and the degree of mutual influence between the first heat dissipation channel layer and the second heat dissipation channel layer respectively, and determine the first thermal coupling coefficient and the second thermal coupling coefficient.

[0056] Exemplarily, when multiple heat dissipation layers are used jointly, due to the improvement of heat dissipation capacity, the temperature gradient at each heat transfer interface of the triode package will change, resulting in a change in the heat transfer gradient force, and further causing differences in heat dissipation efficiency and heat dissipation characteristics between the joint use of multiple heat dissipation layers and the use of a single heat dissipation layer under the same predicted heat index. For example, when multiple heat dissipation layers are used jointly, the heat dissipation capacity is improved, the surface temperature of the triode package decreases, resulting in a smaller temperature gradient and a smaller heat transfer gradient force, and further causing a smaller heat flux when multiple heat dissipation layers are used jointly. At this time, it can be considered that the heat dissipation capacity per unit area of the multiple heat dissipation layers used jointly has decreased compared with the single use; at the same time, the mutual influence of different combinations of multiple heat dissipation layers used jointly is different.

[0057] Optionally, the first thermal coupling coefficient and the second thermal coupling coefficient are obtained by experimental measurement or simulation calculation, such as by modeling through thermal network analysis or finite element method to evaluate the heat transfer path and thermal coupling strength between each layer.

[0058] Furthermore, based on the heat dissipation performance index and the thermal coupling coefficient, an optimization model is constructed to find the optimal heat dissipation mode, wherein, for example, the input variables are the heat dissipation performance index of each heat dissipation layer, the first thermal coupling coefficient and the second thermal coupling coefficient, and the first predicted heat index; the optimization goal is to minimize the total thermal resistance of the model system or maximize the total heat dissipation efficiency of the model system; the constraints are the physical limitations of each heat dissipation layer (such as material properties, geometric dimensions) and the heat balance equation of the model system.

[0059] Specifically, the first predicted heat index is used as input and substituted into the joint heat dissipation mode optimization model, and then the synergy between different heat dissipation layers is analyzed through the optimization algorithm to determine the optimal joint heat dissipation mode, and the output is the optimization result. The specific strategy of the joint heat dissipation mode includes the combination method of each heat dissipation layer, the corresponding working state (such as the surface treatment method of the heat sink layer, the fluid flow rate distribution of the first channel and the second channel, etc.), the heat flux distribution of the heat dissipation path, etc.

[0060] Through the above method, based on the heat dissipation performance indicators and thermal coupling coefficient of the multi-layer heat dissipation structure, a joint heat dissipation mode optimization model is constructed, and the first predicted heat index is jointly analyzed to obtain the optimal heat dissipation mode, effectively improve the heat dissipation efficiency under complex heat load conditions, and ensure the stable operation of the transistor.

[0061] In some implementations, performing a joint analysis of heat dissipation modes on the first predicted heat index according to the joint heat dissipation mode optimization model to obtain a joint heat dissipation mode includes:

[0062] According to the multi-layer heat dissipation structure, a combination is performed to output a joint heat dissipation mode solution space, wherein the joint heat dissipation mode solution space includes multiple solutions, and each solution corresponds to a joint heat dissipation mode; minimizing the first predicted heat index is used as a first optimization goal, and minimizing the sum of the energy consumption of the joint heat dissipation mode is used as a second optimization goal, and optimization is performed in the joint heat dissipation mode solution space to obtain an optimal solution that meets the first optimization goal and the second optimization goal, and the joint heat dissipation mode is output.

[0063] Specifically, first, according to all possible combinations of the multi-layer heat dissipation structure, a joint heat dissipation mode solution space is generated. Each solution in this joint heat dissipation mode solution space corresponds to a specific heat dissipation mode, including the combination information of the multi-layer heat dissipation structure, such as the working states and parameter configurations of the heat sink layer, the first heat dissipation channel layer, and the second heat dissipation channel layer. Among them, the scale of the joint heat dissipation mode solution space depends on the number of heat dissipation layers and the parameter freedom degrees of each layer.

[0064] Specifically, taking minimizing the first predicted heat index as the first optimization goal to ensure that the heat distribution of the triode package meets the heat dissipation requirements and reduces the heat load of key nodes. At the same time, taking minimizing the energy consumption as the second optimization goal, which is secondary. That is, on the premise of ensuring that the heat dissipation requirements are met, the total energy consumption of the heat dissipation system is reduced as much as possible, including the surface treatment or active cooling power consumption of the heat sink, and the pumping power consumption of the fluid in the heat dissipation channel. Through the combination of the first optimization goal and the second optimization goal, the comprehensive optimization of the heat dissipation effect is ensured.

[0065] Optionally, the combination methods of the first optimization goal and the second optimization goal include: by the weighted summation method, weights are assigned to each goal, and the two goals are combined into a comprehensive optimization goal; by the Pareto optimization method, the optimal solution set that simultaneously satisfies the two goals is found.

[0066] Specifically, based on the space size of the joint heat dissipation mode solution space, different optimization algorithms are selected. Exemplarily, exhaustive search is applicable to the case where the solution space is small, that is, all possible solutions are traversed to find the optimal solution; heuristic algorithms are applicable to the case where the solution space is large, such as genetic algorithms, particle swarm optimization, or simulated annealing algorithms.

[0067] By constructing the joint heat dissipation mode solution space and taking minimizing the first predicted heat index and minimizing the energy consumption as the optimization goals, multi-objective optimization is carried out in the solution space, and a joint heat dissipation mode that meets the heat dissipation requirements and has the lowest energy consumption can be found to achieve efficient heat dissipation control decision-making.

[0068] Perform heat dissipation control on the triode according to the joint heat dissipation mode.

[0069] Furthermore, according to the joint heat dissipation mode, activate the corresponding multiple heat dissipation layers for joint heat dissipation and execute heat dissipation control, including adjusting the fluid flow rate in the first heat dissipation channel and / or the second heat dissipation channel, increasing or decreasing the circulation rate of the coolant, and selecting a suitable coolant type (such as water or heat-conducting oil) to match the current heat demand.

[0070] Preferably, a temperature sensor and other monitoring devices are used to collect the temperature data of the triode in real time, and at the same time, the operating status of the heat dissipation system is monitored, including the fan speed, the coolant flow rate, and the power consumption. If the heat load of the triode changes, such as an increase in the working load or an increase in the ambient temperature, and the triode temperature approaches the allowable upper limit, it dynamically switches to a more efficient heat dissipation mode. In the case of low load, the triode temperature is lower than the target range, or the energy consumption is too high, it switches to a low-energy consumption mode to save resources, and then switches to a low-power heat dissipation mode to reduce unnecessary energy consumption.

[0071] By controlling the heat dissipation of the triode through the combined heat dissipation mode, it can efficiently meet the heat dissipation requirements of the triode in a complex working environment, and at the same time achieve the goals of energy conservation and reliability.

[0072] In some embodiments, a gas isolation layer is provided between the heat sink layer and the first heat dissipation channel layer, and the method further includes:

[0073] Determine whether the combined heat dissipation mode is the combined heat dissipation of the heat sink layer and the first heat dissipation channel layer; if it is the combined heat dissipation of the heat sink layer and the first heat dissipation channel layer, while controlling the heat dissipation of the triode according to the combined heat dissipation mode, start the gas isolation layer for auxiliary heat dissipation control.

[0074] Specifically, the gas isolation layer is provided between the heat sink layer and the first heat dissipation channel layer. Through the gas isolation layer, the heat transfer efficiency between the heat sink layer and the first heat dissipation channel layer can be adjusted. Furthermore, in a high-heat demand scenario, the gas isolation layer is used as an auxiliary heat dissipation control means to further improve the heat dissipation efficiency.

[0075] Specifically, when it is determined that it is the combined heat dissipation mode of the heat sink layer and the first heat dissipation channel layer, start the gas isolation layer for auxiliary heat dissipation control. Among them, the start conditions include: the triode temperature is close to the preset threshold (for example, exceeding 80% of the safe temperature range), the combined heat dissipation effect of the heat sink layer and the first heat dissipation channel layer is not sufficient to quickly reduce the temperature, and environmental factors (such as high temperature or a decrease in the fluid efficiency of the heat dissipation channel) cause a decrease in the heat dissipation capacity.

[0076] Specifically, the control methods of the gas isolation layer include adjusting the gas flow rate, adjusting the pressure of the gas isolation layer, etc.

[0077] By providing a gas isolation layer between the heat sink layer and the first heat dissipation channel layer and starting the gas isolation layer for auxiliary heat dissipation control in the combined heat dissipation mode, the heat dissipation regulation range and control flexibility of the triode can be significantly improved, so as to ensure that the triode temperature is always within the safe range and improve the reliability of heat dissipation.

[0078] In summary, the heat dissipation control method for the triode package provided by the present invention has the following technical effects:

[0079] By providing a multi-layer heat dissipation structure outside the triode, including a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer, where each heat dissipation layer can be independently controlled; collecting the package control parameters of the triode; predicting the heat based on the package control parameters and outputting a first predicted heat index; determining whether the first predicted heat index is greater than or equal to a preset heat index, and if so, initiating a combined channel heat dissipation instruction; performing a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure according to the combined channel heat dissipation instruction to obtain a combined heat dissipation mode; and controlling the heat dissipation of the triode according to the combined heat dissipation mode. Thus, the technical effects of improving the heat dissipation efficiency, ensuring balanced heat dissipation, and providing active heat dissipation regulation are achieved. Embodiment 2

[0080] Figure 2 is a schematic structural diagram of the heat dissipation control device for the triode package of the present invention. For example, Figure 1 In the present invention, the flowchart of the heat dissipation control method for the triode package can be implemented through a structure as shown in Figure 2 shown.

[0081] Based on the same concept as the heat dissipation control method for the triode package in the above embodiment, the heat dissipation control device for the triode package provided by the present invention further includes:

[0082] A multi-layer heat dissipation configuration module 11, configured to provide a multi-layer heat dissipation structure outside the triode, where the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled.

[0083] A package control parameter acquisition module 12, configured to collect the package control parameters of the triode.

[0084] A heat generation prediction module 13, configured to predict the heat based on the package control parameters and output a first predicted heat index.

[0085] A heat discrimination module 14, configured to determine whether the first predicted heat index is greater than or equal to a preset heat index, and if the first predicted heat index is greater than or equal to the preset heat index, initiate a combined channel heat dissipation instruction.

[0086] A heat dissipation mode analysis module 15, configured to perform a combined analysis of the heat dissipation mode on the first predicted heat index in the multi-layer heat dissipation structure according to the combined channel heat dissipation instruction to obtain a combined heat dissipation mode.

[0087] A heat dissipation control module 16, configured to control the heat dissipation of the triode according to the combined heat dissipation mode.

[0088] Among them, the heat generation prediction module 13 includes:

[0089] A heat conduction model construction unit for constructing a heat conduction model based on the triode.

[0090] A real-time working state acquisition unit for acquiring the real-time working state of the triode.

[0091] A heat conduction loss simulation unit for inputting the package control parameters and the real-time working state into the heat conduction model to perform heat conduction loss simulation and output a heat conduction simulation data set.

[0092] A heat loss prediction unit for predicting heat loss based on the heat conduction simulation data set and outputting a first predicted heat index.

[0093] In some embodiments, the heat discrimination module 14 includes:

[0094] A monitoring and comparison unit for starting a single-channel heat dissipation instruction if the first predicted heat index is less than the preset heat index.

[0095] A start instruction unit for performing heat dissipation mode matching analysis on the first predicted heat index in the multi-layer heat dissipation structure according to the single-channel heat dissipation instruction to obtain a heat sink layer or a first heat dissipation channel layer or a second heat dissipation channel layer.

[0096] A heat dissipation mode matching analysis unit for controlling heat dissipation of the triode according to the heat sink layer or the first heat dissipation channel layer or the second heat dissipation channel layer.

[0097] Furthermore, the heat dissipation efficiency of the heat sink layer is less than the heat dissipation efficiency of the first heat dissipation channel layer, and the heat dissipation efficiency of the first heat dissipation channel layer is less than the heat dissipation efficiency of the second heat dissipation channel layer.

[0098] In some embodiments, the heat dissipation mode analysis module 15 includes:

[0099] A heat dissipation performance index calculation unit for calculating the heat dissipation performance index of each heat dissipation layer in the multi-layer heat dissipation structure.

[0100] A thermal coupling coefficient acquisition unit for acquiring a first thermal coupling coefficient and a second thermal coupling coefficient in the multi-layer heat dissipation structure, where the first thermal coupling coefficient is the degree of mutual influence between the heat sink layer and the first heat dissipation channel layer, and the second thermal coupling coefficient is the degree of mutual influence between the first heat dissipation channel layer and the second heat dissipation channel layer.

[0101] A joint heat dissipation mode optimization model construction unit for constructing a joint heat dissipation mode optimization model according to the heat dissipation performance index of each heat dissipation layer, the first thermal coupling coefficient and the second thermal coupling coefficient.

[0102] A combined heat dissipation mode analysis unit, configured to perform a combined analysis of the heat dissipation mode on the first predicted heat index according to the combined heat dissipation mode optimization model, and obtain a combined heat dissipation mode.

[0103] In some implementation manners, the combined heat dissipation mode analysis unit in the heat dissipation mode analysis module 15 includes:

[0104] A combined heat dissipation mode solution space output unit, configured to combine according to the multi-layer heat dissipation structure, and output a combined heat dissipation mode solution space, where the combined heat dissipation mode solution space includes multiple solutions, and each solution corresponds to a combined heat dissipation mode.

[0105] An optimization target setting and execution unit, configured to take minimizing the first predicted heat index as the first optimization target, and take minimizing the sum of the energy consumptions of the combined heat dissipation mode as the second optimization target, perform optimization in the combined heat dissipation mode solution space, obtain an optimal solution that meets the first optimization target and the second optimization target, and output a combined heat dissipation mode.

[0106] In some embodiments, a gas isolation layer is provided between the heat sink layer and the first heat dissipation channel layer, and the device further includes:

[0107] A combined heat dissipation mode judgment unit, configured to judge whether the combined heat dissipation mode is the combined heat dissipation of the heat sink layer and the first heat dissipation channel layer.

[0108] An auxiliary heat dissipation control start unit, configured to, if it is the combined heat dissipation of the heat sink layer and the first heat dissipation channel layer, while performing heat dissipation control on the triode according to the combined heat dissipation mode, start the gas isolation layer to perform auxiliary heat dissipation control. Embodiment 3

[0109] Figure 3 It is a schematic diagram of an embodiment of a computer-readable storage medium provided by the present invention. As Figure 3 shown, this embodiment provides a computer-readable storage medium 600, on which a computer program 611 is stored. When the computer program 611 is executed by a processor, the following steps are implemented: a multi-layer heat dissipation structure is arranged outside the triode, where the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer, and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled; the package control parameters of the triode are collected; heat prediction is performed according to the package control parameters, and a first predicted heat index is output; it is judged whether the first predicted heat index is greater than or equal to a preset heat index. If the first predicted heat index is greater than or equal to the preset heat index, a combined channel heat dissipation instruction is started; according to the combined channel heat dissipation instruction, a combined analysis of the heat dissipation mode is performed on the first predicted heat index in the multi-layer heat dissipation structure, and a combined heat dissipation mode is obtained; heat dissipation control is performed on the triode according to the combined heat dissipation mode.

[0110] It should be understood that the key point of the embodiments mentioned in this specification lies in their differences from other embodiments. The specific embodiments in the first embodiment mentioned above are equally applicable to the heat dissipation control device for the triode package described in the second embodiment. For the sake of simplicity of the specification, no further elaboration will be made here.

[0111] It should be understood that the disclosed embodiments of the present invention and the above descriptions enable those skilled in the art to implement the present invention using the present invention. At the same time, the present invention is not limited to the part of the embodiments mentioned above. It should be understood that those of ordinary skill in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A heat dissipation control method for a transistor package, characterized in that: The method comprises: A multi-layer heat dissipation structure is provided outside the triode, wherein the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled; collecting packaging control parameters of the transistor; Performing heat prediction according to the packaging control parameters and outputting a first predicted heat index; determining whether the first predicted heat index is greater than or equal to a preset heat index, and if the first predicted heat index is greater than or equal to the preset heat index, initiating a joint channel heat dissipation instruction; performing a joint heat dissipation mode analysis on the first predicted heat index based on the multi-layer heat dissipation structure according to the joint channel heat dissipation instruction to obtain a joint heat dissipation mode; Controlling heat dissipation of the transistor according to the combined heat dissipation mode; The method of performing heat prediction according to the packaging control parameter and outputting a first predicted heat index includes: Constructing a heat conduction model based on the triode; Collecting the real-time working status of the triode; Inputting the packaging control parameters and the real-time working status into the heat conduction model to simulate heat conduction loss, and outputting a heat conduction simulation data set; Performing heat loss prediction based on the heat conduction simulation data set and outputting a first predicted heat index; The method for obtaining the combined heat dissipation mode includes: Calculating the heat dissipation performance index of each heat dissipation layer in the multi-layer heat dissipation structure; Obtaining a first thermal coupling coefficient and a second thermal coupling coefficient in the multi-layer heat dissipation structure, wherein the first thermal coupling coefficient represents a degree of mutual influence between the heat sink layer and the first heat dissipation channel layer, and the second thermal coupling coefficient represents a degree of mutual influence between the first heat dissipation channel layer and the second heat dissipation channel layer; Constructing a joint heat dissipation mode optimization model according to the heat dissipation performance index of each heat dissipation layer, the first thermal coupling coefficient, and the second thermal coupling coefficient; Performing a joint heat dissipation mode analysis on the first predicted heat index according to the joint heat dissipation mode optimization model to obtain a joint heat dissipation mode; wherein, according to the multi-layer heat dissipation structure, a combined heat dissipation mode solution space is output, wherein the combined heat dissipation mode solution space includes multiple solutions, each solution corresponding to a combined heat dissipation mode; Taking minimizing the first predicted heat index as the first optimization goal and minimizing the sum of the energy consumption of the joint heat dissipation mode as the second optimization goal, optimization is performed in the joint heat dissipation mode solution space to obtain an optimal solution that meets the first optimization goal and the second optimization goal, and output the joint heat dissipation mode.

2. The method according to claim 1, wherein Determining whether the first predicted heat index is greater than or equal to a preset heat index, the method further includes: If the first predicted heat index is less than the preset heat index, starting a single-channel heat dissipation instruction; According to the single-channel heat dissipation instruction, performing a heat dissipation pattern matching analysis on the first predicted heat index based on the multi-layer heat dissipation structure to determine a matching heat sink layer or a first heat dissipation channel layer or a second heat dissipation channel layer; The heat sink layer, the first heat dissipation channel layer, or the second heat dissipation channel layer is controlled to dissipate heat for the transistor.

3. The method according to claim 1, wherein The heat dissipation efficiency of the heat sink layer is lower than that of the first heat dissipation channel layer, and the heat dissipation efficiency of the first heat dissipation channel layer is lower than that of the second heat dissipation channel layer.

4. The method according to claim 1, wherein A gas isolation layer is provided between the heat sink layer and the first heat dissipation channel layer; Determining whether the combined heat dissipation mode is the combined heat dissipation of the heat sink layer and the first heat dissipation channel layer; If the heat sink layer and the first heat dissipation channel layer jointly dissipate heat, the heat dissipation of the transistor is controlled according to the joint heat dissipation mode, and at the same time, the gas isolation layer is activated to perform auxiliary heat dissipation control.

5. A heat dissipation control device for a transistor package, characterized in that: The device is used to execute the heat dissipation control method for a transistor package according to any one of claims 1 to 4, and the device comprises: A multi-layer heat dissipation configuration module, which is used to set up a multi-layer heat dissipation structure outside the triode, wherein the multi-layer heat dissipation structure includes a heat sink layer, a first heat dissipation channel layer and a second heat dissipation channel layer, and each heat dissipation layer is independently controlled; A packaging control parameter acquisition module, wherein the packaging control parameter acquisition module is used to acquire the packaging control parameters of the transistor; a heat generation prediction module, configured to perform heat generation prediction based on the packaging control parameters and output a first predicted heat index; a heat determination module, the heat determination module being configured to determine whether the first predicted heat index is greater than or equal to a preset heat index, and if the first predicted heat index is greater than or equal to the preset heat index, initiate a joint channel heat dissipation instruction; a heat dissipation mode analysis module, configured to perform a heat dissipation mode joint analysis on the first predicted heat index based on the joint channel heat dissipation instruction and the multi-layer heat dissipation structure to obtain a joint heat dissipation mode; A heat dissipation control module is used to control the heat dissipation of the transistor according to the combined heat dissipation mode.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the heat dissipation control method for a transistor package according to any one of claims 1 to 4 is implemented.

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