TGP product thermal dissociation process and application thereof

Abstract

The invention provides a thermal dissociation process for a TGP product and application thereof, and belongs to the technical field of circuit board preparation, and the thermal dissociation process for the TGP product comprises the steps of glue preparation, copper reduction, flexible board cutting, line imaging, developing, etching, film removal DES, OQC sampling inspection, visual inspection, appearance processing, cutting, pretreatment, packaging and warehousing. According to the thermal dissociation process for the TGP product provided by the scheme, the prepared TGP product is relatively light and thin in thickness and relatively good in winding heat dissipation efficiency; and the temperature equalization performance is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board preparation, and in particular to a TGP product thermal dissociation process and application thereof. Background Art

[0002] Vapor Chamber Vapor Chamber technology is similar to heat pipe in principle, but different in conduction mode. Heat pipe is one-dimensional linear heat conduction, while the heat in the Vapor Chamber is conducted on a two-dimensional surface, so it is more efficient.

[0003] Specifically, after absorbing the heat from the chip, the liquid at the bottom of the vacuum chamber evaporates and diffuses into the vacuum chamber, transferring the heat to the heat sink fins, and then condenses into liquid and returns to the bottom. This evaporation and condensation process, similar to that of a refrigerator air conditioner, circulates rapidly in the vacuum chamber, achieving a very high heat dissipation efficiency. Specific operation: 1. The base of the heat spreader is heated, and the heat source heats the copper mesh micro-evaporator - absorbing heat 2. The coolant (pure water or refrigerant) is heated and evaporates rapidly into hot air (<104Tor or less) in a vacuum ultra-low pressure environment - absorbing heat 3. The Vapor Chamber adopts a vacuum design, and the hot air circulates more quickly in the copper mesh micro-environment - heat conduction 4. The hot air rises when heated, dissipates heat after encountering the cold source on the upper part of the heat sink, and recondenses into liquid - heat dissipation 5. The condensed coolant flows back to the evaporation source at the bottom of the heat spreader through the copper micro-structure capillary - reflux, and the refluxed coolant is heated by the evaporator and vaporized again and absorbs heat > conducts heat > dissipates heat through the copper mesh micro-tubes, and so on repeatedly.

[0004] The industry originally used SVC materials to make heat dissipation vapor chambers. However, due to its hard material, heavy thickness, and poor heat dissipation efficiency, it is impossible to make ultra-thin mesh. The FPC material is thin and the adhesive material cannot be completely separated, so it cannot be realized. The ultra-thin mesh material, process, and parameter adjustments are made to replace the SVC heat dissipation vapor chamber.

[0005] For this purpose, we need a thermal dissociation process for TGP products. Summary of the invention

[0006] In order to overcome the problems existing in the related art, the purpose of the present invention is to provide a thermal dissociation process for a TGP product, so that the TGP product obtained is thinner and lighter, and has better heat dissipation efficiency; the temperature uniformity performance is greatly improved.

[0007] A thermal dissociation process for TGP products, including preparation of glue, copper reduction: reducing the original 12um pure copper material to 8--10um thickness, flexible board cutting: cutting the product into required length, circuit imaging, developing / etching / film removal DES: etching 25±5um through holes in 10um pure copper material to serve as the capillary structure of TGP heat dissipation module, OQC sampling inspection: appearance sampling inspection, visual inspection, appearance processing / cutting / pre-treatment: forming the product circuit into single PCS, packaging, and warehousing;

[0008] Also includes adhesive backing combination:

[0009] The pure copper material and the FPC thermal dissociation material are combined with back adhesive using a dry film pressing device, the dry film pressing speed is 0.8m / min, and the temperature is 80-100°C.

[0010] In a preferred technical solution of the present invention, in the adhesive backing combination, the LD I exposure energy is 5-9 grids;

[0011] In a preferred technical solution of the present invention, the FPC thermal dissociation material is subjected to an acid-base solution process to reduce copper, and the copper reduction rate is 2.0-2.5 m / min;

[0012] In a preferred technical solution of the present invention, no drug penetrates into DES after the etching operation: 2.0m / min+(2.5-4.0m / min)+2.0m / min;

[0013] In a preferred technical solution of the present invention, after the sample is formed, a fast press is used to completely dissociate the adhesive thermal dissociation PET material, the fast press: 145-160°, fast press time 15-25s; external shape processing 8-12pcs / time;

[0014] In a preferred technical solution of the present invention, the laminator has an operating speed of 0.8-1.2 m / min and a temperature of 80-100°C.

[0015] In a preferred technical solution of the present invention, the etching line speed is 4.0-4.5 m / min.

[0016] In a preferred technical solution of the present invention, the thickness of the FPC thermal dissociation material is 0.2-0.35 mm.

[0017] The invention also discloses an application of a TGP product thermal dissociation process in the preparation of a TGP product.

[0018] The beneficial effects of the present invention are:

[0019] The present invention provides a TGP product thermal dissociation process, and the TGP heat dissipation product prepared by the process is:

[0020] 1. Comparison of TGP products' heat dissipation performance with the same power. When used in mobile phones and notebook computers, the average temperature effect can be reduced by about 6°;

[0021] 2. For communication equipment with the same power, the average temperature performance difference of TGP products is improved by more than 22.2%;

[0022] 3. TGP products are thinner and lighter, and have better heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram comparing the heat dissipation performance of TGP mobile phone products with the same power in the thermal dissociation process of the TGP product provided by the present invention;

[0024] Figure 2 It is a schematic diagram of the comparison of heat dissipation performance of TGP notebook products with the same power and the test results in the thermal dissociation process of the TGP product provided by the present invention;

[0025] Figure 3 It is a schematic diagram of the process flow in the thermal dissociation process of the TGP product provided by the present invention. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0028] It should be understood that although the terms "first", "second", "third", etc. may be used to describe various information in the present invention, the information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.

[0029] Unless otherwise specified, the methods and equipment used in the present invention are all conventional reagents, methods and equipment in the art.

[0030] The equipment used in the following embodiments is as follows:

[0031] Fast press: Dingrui equipment model 80T fast press;

[0032] Laminator: Manual Laminator (CSL-M25E) - Zhisheng;

[0033] Dry film laminating equipment: Manual laminator (CSL-M25E) - Zhisheng;

[0034] Acidic and alkaline solution: The ratio concentration is H2O2 (30±5) g / L, Cu2+≤35 g / L. The manufacturer is "Xinglemei";

[0035] Example 1

[0036] A thermal dissociation process for TGP products, including preparation of glue, reduction of copper, cutting of flexible boards, circuit imaging, development, etching, film removal DES, OQC sampling, visual inspection, shape processing, cutting, pre-treatment, packaging, and warehousing;

[0037] Also includes adhesive backing combination:

[0038] The pure copper material and the FPC thermal dissociation material are combined with back adhesive using a dry film pressing device, the dry film pressing speed is 0.8m / min, and the temperature is 80-100°C.

[0039] In a preferred technical solution of the present invention, in the adhesive backing combination, the LD I exposure energy is 5-9 grids;

[0040] In a preferred technical solution of the present invention, the FPC thermal dissociation material is subjected to an acid-base solution process to reduce copper, and the copper reduction rate is 2.0-2.5 m / min;

[0041] In the preferred technical solution of the present invention, no drug penetrates into DES after the etching operation: 2.0m / min+2.5-4.0m / min+2.0m / min;

[0042] In a preferred technical solution of the present invention, after the sample is formed, a fast press is used to completely dissociate the adhesive thermal dissociation PET material, the fast press: 145-160°, fast press time 15-25s; external shape processing 8-12pcs / time;

[0043] In a preferred technical solution of the present invention, the laminator has an operating speed of 0.8-1.2 m / min and a temperature of 80-100°C.

[0044] In a preferred technical solution of the present invention, the etching line speed is 4.0-4.5 m / min.

[0045] In a preferred technical solution of the present invention, the thickness of the FPC thermal dissociation material is 0.2-0.35 mm.

[0046] The present invention provides a TGP product thermal dissociation process, and the TGP heat dissipation product prepared by the process is:

[0047] 1. The heat dissipation performance of TGP products with the same power is about 6° lower than the average temperature effect;

[0048] 2. For communication equipment with the same power, the average temperature performance difference of TGP products is improved by more than 22.2%;

[0049] 3. TGP products are thinner and lighter, and have better heat dissipation efficiency.

[0050] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. The embodiments of the present application have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Without departing from the scope and spirit of the described embodiments, many modifications and changes are obvious to those of ordinary skill in the art. The choice of terms used in this article is intended to best explain the principles of the embodiments, practical applications or improvements to the technology in the market, or to enable other ordinary technicians in the technical field to understand the embodiments disclosed herein.

Claims

1. A thermal dissociation process for TGP products, including preparation of glue, reduction of copper, cutting of flexible boards, circuit imaging, developing / etching / film removal DES, OQC sampling, visual inspection, shape processing / cutting / pre-treatment, packaging, and warehousing; Features ； Also includes adhesive backing combination: The pure copper material and the FPC thermal dissociation material are combined with back adhesive using a dry film pressing device, the dry film pressing speed is 0.8m / min, and the temperature is 80-100°C.

2. The TGP product thermal dissociation process according to claim 1, characterized in that: In the adhesive backing combination, the LD I exposure energy is 5-9 grids.

3. The TGP product thermal dissociation process according to claim 1, characterized in that: The FPC thermal dissociation material is subjected to an acid-base solution process to reduce copper, and the copper reduction speed is 2.0-2.5 m / min.

4. The TGP product thermal dissociation process according to claim 1, characterized in that: No drug infiltration into DES after the etching operation: 2.0 m / min + (2.5-4.0 m / min) + 2.0 m / min.

5. The TGP product thermal dissociation process according to claim 1, characterized in that: After the sample is formed, a fast press is used to completely decompose the back adhesive thermal dissociation PET material. The fast press is at 145-160° C. and the fast pressing time is 15-25s. The external shape processing is 8-12 pieces / time.

6. The TGP product thermal dissociation process according to claim 1, characterized in that: The laminator has a working speed of 0.8-1.2 m / min and a temperature of 80-100°C.

7. The TGP product thermal dissociation process according to claim 1, characterized in that: The etching line speed is 4.0-4.5 m / min.

8. The TGP product thermal dissociation process according to claim 1, characterized in that: The thickness of the FPC thermal dissociation material is 0.2-0.35 mm.

9. A thermal dissociation process for a TGP product according to any one of claims 1 to 8, characterized in that: The application of the TGP product thermal dissociation process in the preparation of TGP products.

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