Assembled circuit board

By designing bumps and slots on the circuit board and using conductive layers and side conductive sheets to achieve electrical connections, the high cost and large space occupation problems caused by the use of inter-board connectors in the prior art are solved, and efficient connections and space savings are achieved between circuit boards.

CN119545655APending Publication Date: 2025-02-28中电长城科技有限公司
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Patent Information

Application Number
CN202411772129.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-02-28

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Abstract

The invention relates to the technical field of printed circuit boards, and provides an assembled circuit board which comprises a first circuit board and a second circuit board, at least one side edge of the first circuit board is provided with a convex block, at least one side edge of the second circuit board is provided with a clamping groove, and the convex block is matched with the plane shape of the clamping groove. A first conducting layer in the first circuit board extends to the side face of the protruding block, a first side conducting strip covering the first conducting layer is arranged on the side face of the protruding block, a second conducting layer in the second circuit board extends to the side face of the clamping groove, and a second side conducting strip covering the second conducting layer is arranged on the side face of the clamping groove. The first side conducting strip and the second side conducting strip are contacted and electrically connected; according to the technical scheme, the two circuit boards are assembled in a clamping mode through the protruding blocks and the clamping grooves, electrical connection between the two circuit boards is achieved at the same time, and therefore a connector in the prior art is omitted, cost is reduced, the internal area space of the circuit boards is saved, and the space retention rate and interconnection density of a single board are improved.
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Description

Technical Field

[0001] The present application belongs to the technical field of printed circuit boards, and more specifically, to an assembled circuit board. Background Art

[0002] The main costs of electronic products are concentrated in three parts: circuit boards, connectors and chips. Connectors can achieve electrical connection between two circuit boards. As the complexity of electronic products increases, the cost share of connector application and customization in product development gradually increases.

[0003] However, as the complexity and power consumption of electronic products increase, the demand for non-standard and customized connectors to connect circuit boards continues to increase. The development and mass production of customized connectors are slow and cannot match the demand for rapid development of self-customized products. In addition, large-sized connectors (such as power connectors) and a large number of signal connectors in circuit boards occupy a large amount of space on the board, making it impossible to miniaturize the size of the circuit board. Summary of the invention

[0004] In view of the technical problems in the above-mentioned prior art that the use of connectors to electrically connect circuit boards leads to high costs and a large amount of space occupied within the circuit boards, the purpose of the embodiments of the present application is to provide an assembled circuit board, which realizes the electrical connection between two circuit boards through splicing technology, omitting the use of connectors, reducing costs, saving space within the circuit board, and improving the space retention rate and interconnection density of a single board.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: to provide an assembled circuit board, including: a first circuit board and a second circuit board, at least one side of the first circuit board is provided with a protrusion, at least one side of the second circuit board is provided with a slot, the protrusion is adapted to the planar shape of the slot, the first conductive layer in the first circuit board extends to the side of the protrusion, and a first side conductive sheet covering the first conductive layer is provided on the side of the protrusion, the second conductive layer in the second circuit board extends to the side of the slot, and the side of the slot is provided with a second side conductive sheet covering the second conductive layer, and when the protrusion is snapped into the slot, the first side conductive sheet and the second side conductive sheet are in contact and electrically connected.

[0006] In one embodiment, the first conductive layer, the second conductive layer, the first-side conductive sheet, and the second-side conductive sheet are all conductive copper layers.

[0007] In one embodiment, the planar shapes of the protrusion and the slot are trapezoidal or circular.

[0008] In one embodiment, at least two protrusions are arranged at intervals on one side of the first circuit board, and at least two slots are arranged at intervals on one side of the second circuit board.

[0009] In one embodiment, the first side conductive sheet and the second side conductive sheet have rounded corners or inclined surfaces on the upper and lower sides.

[0010] In one embodiment, at least two through holes are provided on the first circuit board and the second circuit board. After the first circuit board and the second circuit board are snap-fitted and assembled, the first circuit board and the second circuit board are pulled away from each other when they are fixed in the housing by screws assembled through the through holes.

[0011] The beneficial effect of the assembled circuit board provided by the present application is that the two circuit boards are snap-fitted and assembled through bumps and slots, and at the same time, an electrical connection between the two circuit boards is achieved, thereby omitting the use of connectors in the prior art, reducing costs, and saving space inside the circuit board, thereby improving the space retention rate and interconnection density of the single board. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 A simplified structural schematic diagram of a first conductive layer and a second conductive layer extending to the side in an assembled circuit board provided in an embodiment of the present application;

[0014] Figure 2 A simplified structural schematic diagram of a first-side conductive sheet and a second-side conductive sheet formed on a first conductive layer and a second conductive layer in an assembled circuit board provided in an embodiment of the present application;

[0015] Figure 3 A schematic diagram of a first structure of a bump and a slot in an assembled circuit board provided in an embodiment of the present application;

[0016] Figure 4 A second structural schematic diagram of a bump and a slot in an assembled circuit board provided in an embodiment of the present application;

[0017] Figure 5 This is a schematic diagram of the forces after the first circuit board and the second circuit board in the assembled circuit board provided in an embodiment of the present application are assembled and fixed by screws.

[0018] Among them, the reference numerals in the figure are:

[0019] 1. First circuit board; 11. Bump; 12. First conductive layer; 13. First side conductive sheet; 2. Second circuit board; 21. Card slot; 22. Second conductive layer; 23. Second side conductive sheet; 3. Through hole; 4. Screw. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] like Figure 1-Figure 5As shown, an assembled circuit board provided by an embodiment of the present application is now described. The assembled circuit board comprises: a first circuit board 1 and a second circuit board 2, at least one side of the first circuit board 1 is provided with a protrusion 11, at least one side of the second circuit board 2 is provided with a slot 21, the protrusion 11 is adapted to the plane shape of the slot 21, the first conductive layer 12 in the first circuit board 1 extends to the side of the protrusion 11, and a first side conductive sheet 13 covering the first conductive layer 12 is provided on the side of the protrusion 11, so as to realize the electrical connection between the first side conductive sheet 13 and the first conductive layer 12; the second conductive layer 22 in the second circuit board 2 extends to the side of the slot 21, and a second side conductive sheet 23 covering the second conductive layer 22 is provided on the side of the slot 21, so as to realize the electrical connection between the second side conductive sheet 23 and the second conductive layer 22, when the first circuit board 1 and the second circuit board 2 are engaged in the slot 21 through the protrusion 11, the first side conductive sheet 13 and the second side conductive sheet 23 are contacted and electrically connected, so as to realize the electrical connection between the first circuit board 1 and the second circuit board 2. This assembly method reduces the cost of using connectors for communication between circuit boards, saving connector materials and processing costs; the snap-on assembly through the bump 11 and the slot 21 has the advantages of simple, fast and stable connection, reducing the development cost and cycle of the circuit board; it makes full use of the side area of ​​the circuit board, saves space on the upper surface of the circuit board, and improves the space utilization and density of the upper surface of the circuit board.

[0025] In this embodiment, the first conductive layer 12, the second conductive layer 22, the first side conductive sheet 13 and the second side conductive sheet 23 are all made of conductive materials commonly used in circuit boards, such as conductive copper layers, and the first conductive layer 12 and the second conductive layer 22 are both conventional structures of existing circuit boards.

[0026] In this embodiment, if Figure 3 and 4 As shown, the planar shape of the protrusion 11 and the slot 21 is trapezoidal or circular. Of course, other shapes can also be used, as long as the protrusion 11 cannot be pulled out horizontally after being inserted into the slot 21 from above, thereby ensuring the firmness of the connection between the first circuit board 1 and the second circuit board 2.

[0027] In this embodiment, according to design requirements, at least two protrusions 11 are provided on one side of the first circuit board 1, and at least two slots 21 are provided on one side of the second circuit board 2. According to the number of circuit boards to be assembled, corresponding protrusions 11 or slots 21 may also be provided on other sides of the first circuit board 1 and the second circuit board 2.

[0028] In this embodiment, the first side conductive sheet 13 and the second side conductive sheet 23 are formed on the side of the circuit board by a board edge electroplating process. The first side conductive sheet 13 and the second side conductive sheet 23 have rounded corners or inclined surfaces on both sides, so that the bump 11 and the slot 21 can be connected more smoothly when being clamped up and down.

[0029] In actual production, in order to facilitate assembly, the size of the protrusion 11 is slightly smaller than the size of the slot 21, so that after the protrusion 11 is inserted into the slot 21, there is a certain gap between the two. In order to ensure that the first side conductive sheet 13 and the second side conductive sheet 23 are in good contact, during assembly, the first circuit board 1 and the second circuit board 2 are pulled outward in a direction away from each other so that the first side conductive sheet 13 on the protrusion 11 and the second side conductive sheet 23 in the slot 21 are in close contact.

[0030] Specifically, in one implementation of the present embodiment, at least two through holes 3 are provided on each of the first circuit board 1 and the second circuit board 2. After the first circuit board 1 and the second circuit board 2 are assembled by the protrusion 11 and the slot 21, the first circuit board 1 and the second circuit board 2 are pulled away from each other when the screws 4 are assembled and fixed in the housing through the through holes 3. That is, when the circuit boards are installed in the housing, the first circuit board 1 and the second circuit board 2 are pulled away from each other when the screws 4 are locked, so that the first side conductive sheet 13 on the protrusion 11 and the second side conductive sheet 23 in the slot 21 are in close contact, ensuring the stability of the electrical connection. Therefore, when designing, the spacing between the two threaded holes for locking the screws 4 on the housing along the splicing length direction of the two circuit boards is slightly larger than the spacing between the two through holes 3 after the two circuit boards are assembled. For example, after the two circuit boards are assembled, a large rectangle is formed, with a total of four through holes 3 and four threaded holes, and the spacing between the two through holes 3 in the width direction is the same as the spacing between the two threaded holes in the width direction. The spacing between the two through holes 3 in the length direction is smaller than the spacing between the two threaded holes in the length direction. When there is a gap between the protrusion 11 and the slot 21 after they are engaged, the difference between the distance between the two threaded holes in the length direction and the distance between the two through holes 3 in the width direction is ≥ 2*the size of the gap + 0.25mm. This can effectively ensure that after the two circuit boards are locked on the housing, the two circuit boards are pulled outwards to make the first side conductive sheet 13 and the second side conductive sheet 23 in the slot 21 come into close contact. In other embodiments, the first circuit board 1 and the second circuit board 2 can be separated from each other by setting elastic members such as shrapnel or springs between the first circuit board 1 and the second circuit board 2, or by setting a buckle structure on the outer sides of the first circuit board 1 and the second circuit board 2. In short, as long as the first side conductive sheet 13 and the second side conductive sheet 23 can be in close contact, it will be sufficient.

[0031] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An assembled circuit board, characterized in that: include: A first circuit board (1) and a second circuit board (2), wherein at least one side of the first circuit board (1) is provided with a protrusion (11), and at least one side of the second circuit board (2) is provided with a slot (21), wherein the protrusion (11) is adapted to the planar shape of the slot (21), wherein the first conductive layer (12) in the first circuit board (1) extends to the side of the protrusion (11), and a first side conductive sheet (13) covering the first conductive layer (12) is provided on the side of the protrusion (11), and the second side conductive sheet (23) covering the second conductive layer (22) is provided on the side of the slot (21), and when the protrusion (11) is engaged in the slot (21), the first side conductive sheet (13) and the second side conductive sheet (23) are in contact and electrically connected.

2. The assembled circuit board according to claim 1, wherein: The first conductive layer (12), the second conductive layer (22), the first side conductive sheet (13) and the second side conductive sheet (23) are all conductive copper layers.

3. The assembled circuit board according to claim 1, wherein: The planar shapes of the protrusion (11) and the clamping groove (21) are trapezoidal or circular.

4. The assembled circuit board according to claim 1, wherein: At least two of the protrusions (11) are arranged at intervals on one side of the first circuit board (1), and at least two of the card slots (21) are arranged at intervals on one side of the second circuit board (2).

5. The assembled circuit board according to any one of claims 1 to 4, characterized in that: The upper and lower sides of the first side conductive sheet (13) and the second side conductive sheet (23) are rounded or inclined.

6. The assembled circuit board according to any one of claims 1 to 4, characterized in that: At least two through holes (3) are provided on each of the first circuit board (1) and the second circuit board (2); after the first circuit board (1) and the second circuit board (2) are snap-fitted and assembled, the first circuit board (1) and the second circuit board (2) are pulled away from each other when the screws (4) are assembled through the through holes (3) and fixed in the housing.