Circuit board hole formation method and circuit board processing equipment

Abstract

A circuit board hole forming method and a circuit board processing apparatus are disclosed. The circuit board hole forming method includes a milling step of performing a milling operation on a bearing surface of a bakelite board on a carrier; a placing step of placing a circuit board to be processed on the bearing surface; a measuring step of measuring a plurality of preset measuring positions of a preset hole forming region of the circuit board to be processed to obtain a plurality of pieces of measuring information; a compensation calculating step of calculating a plurality of pieces of depth compensation values according to the pieces of measuring information and a preset depth value; and a processing step of controlling a hole forming device to form blind holes with depths conforming to a preset depth tolerance range in each of a plurality of preset segmentation regions according to the pieces of measuring information and the corresponding depth compensation values.

Description

Technical Field

[0001] This invention relates to a method and equipment for forming holes, and more particularly to a method and equipment for forming holes in a circuit board. Background Technology

[0002] In existing technologies for creating holes in circuit boards, various factors often lead to holes of varying depths in different locations. In worse cases, the depth of holes in some locations may exceed the preset allowable depth, potentially causing problems in subsequent circuit board processing. Summary of the Invention

[0003] This invention discloses a method for forming holes in a circuit board and a circuit board processing device, mainly to improve the problem that existing methods or devices for forming holes in circuit boards are prone to having holes with depths exceeding the preset depth tolerance range at different locations.

[0004] One embodiment of the present invention discloses a method for forming holes in a circuit board, which can be executed by a processing device of a circuit board processing equipment. The method includes: a milling step: milling a bearing surface of a bakelite board disposed on a platform of the circuit board processing equipment; a placement step: placing a circuit board to be processed on the bearing surface of the bakelite board; and a measurement step: having a measurement device of the circuit board processing equipment perform measurements at multiple preset measurement positions in a preset hole forming area of ​​the circuit board to be processed to obtain multiple measurement information; the preset hole forming area is divided into multiple preset segmented areas, and each preset segmented area is configured with... There is at least one preset measurement position; each measurement information includes an X-axis coordinate value, a Y-axis coordinate value, and a Z-axis coordinate value; a compensation calculation step: based on each measurement information and a preset depth value, multiple depth compensation values ​​are calculated; the difference between the sum of each depth compensation value and the corresponding Z-axis coordinate value and the preset depth value is within a preset depth allowable range; a processing step: based on each measurement information and the corresponding depth compensation value, a hole forming device is controlled to form a blind hole with a depth conforming to the preset depth allowable range in each preset segmented area; wherein, the size of each preset segmented area is larger than the size of the forming part of the hole forming device.

[0005] Optionally, during the milling process, the maximum height difference of the bakelite board surface is ±1000 micrometers; the preset depth tolerance is ±50 micrometers.

[0006] Optionally, between the compensation calculation step and the processing step, a protection step is also included: setting a protective plate on the circuit board to be processed; and in the processing step, removing the protective plate located above the preset hole forming area.

[0007] Optionally, each preset segmentation region is set with at least three preset measurement positions; in the compensation calculation step, using all the measurement information obtained from all the preset measurement positions in the same preset segmentation region, a fitting plane is first established, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation region.

[0008] One embodiment of the present invention discloses a circuit board processing apparatus, comprising: a stage on which a bakelite board is disposed, the bakelite board having a bearing surface for bearing a circuit board to be processed; a processing device for performing a circuit board hole forming method; a measuring device electrically connected to the processing device; and a hole forming device electrically connected to the processing device, the processing device being capable of controlling the hole forming device to move relative to the circuit board to be processed along the X-axis, Y-axis, and Z-axis; wherein the circuit board hole forming method performed by the processing device includes the following steps: a milling step: performing a milling operation on the bearing surface; a placement step: placing the circuit board to be processed on the bearing surface; and a measuring step: using the measuring device at multiple preset measuring positions in a preset hole forming area of ​​the circuit board to be processed. The process involves several steps: First, measurements are taken to obtain multiple measurement data. The pre-defined hole forming area is divided into multiple pre-defined segmented areas, each with at least one pre-defined measurement position. Each measurement data point includes an X-axis coordinate value, a Y-axis coordinate value, and a Z-axis coordinate value. A compensation calculation step is then performed: based on each measurement data point and a pre-defined depth value, multiple depth compensation values ​​are calculated. The difference between the sum of each depth compensation value and its corresponding Z-axis coordinate value and the pre-defined depth value is within a pre-defined depth tolerance range. A processing step is then performed: based on each measurement data point and its corresponding depth compensation value, the hole forming device is controlled to form a blind hole in each pre-defined segmented area with a depth conforming to the pre-defined depth tolerance range. The size of each pre-defined segmented area is larger than the size of the forming part of the hole forming device.

[0009] Optionally, during the milling process, the maximum height difference of the bakelite board surface is ±1000 micrometers; the preset depth tolerance is ±50 micrometers.

[0010] Optionally, between the compensation calculation step and the processing step, a protection step is also included: setting a protective plate on the circuit board to be processed; and in the processing step, removing the protective plate located above the preset hole forming area.

[0011] Optionally, each preset segmentation region is set with at least three preset measurement positions; in the compensation calculation step, using all the measurement information obtained from all the preset measurement positions in the same preset segmentation region, a fitting plane is first established, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation region.

[0012] In summary, the circuit board processing equipment and circuit board hole forming method of the present invention, through the design of milling, placement, measurement, compensation calculation and processing steps, can ensure that the depth of the holes formed on the circuit board to be processed falls within the preset depth allowable range at different positions.

[0013] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0014] Figure 1 This is a block diagram of the circuit board processing equipment of the present invention.

[0015] Figure 2 This is a schematic diagram of the process of forming holes in a circuit board according to the present invention.

[0016] Figure 3 This is a schematic diagram of the milling step in the circuit board hole formation method of the present invention.

[0017] Figure 4 This is a schematic diagram of the measurement steps in the circuit board hole formation method of the present invention.

[0018] Figure 5 This is a schematic diagram of the protective steps in the circuit board hole formation method of the present invention.

[0019] Figure 6 This is a schematic diagram of the processing steps of the circuit board hole forming method of the present invention.

[0020] Figure 7 This is a partial top view of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0021] Figure 8 This is a schematic diagram of another step in the circuit board hole formation method of the present invention.

[0022] Figure 9 This is another partial top view of the circuit board to be processed in the circuit board hole forming method of the present invention. Detailed Implementation

[0023] In the following description, if a specific drawing is indicated or shown in a specific drawing, it is only to emphasize that most of the relevant content mentioned in the following description appears in that specific drawing, but does not limit the following description to refer only to that specific drawing.

[0024] Please refer to the following: Figures 1 to 7 , Figure 1 This is a block diagram of the circuit board processing equipment of the present invention. Figure 2 This is a schematic diagram of the process of forming holes in a circuit board according to the present invention. Figures 3 to 6 These are schematic diagrams illustrating the milling, measurement, protection, and processing steps of the circuit board hole formation method of the present invention. Figure 7 This is a partial top view of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0025] The circuit board processing equipment 100 of the present invention includes: a stage 1, a processing device 2, a measuring device 3, and a hole forming device 4. The stage 1 is provided with a bakelite board 11, which has a bearing surface 111 for supporting a circuit board A to be processed. The bakelite board 11 can be fixed to the stage 1, for example, by screws.

[0026] The processing device 2 is, for example, located on or beside the stage 1. The processing device 2 is electrically connected to the measuring device 3 and the hole-forming device 4. The processing device 2 can control the measuring device 3 to measure the circuit board A to be processed, which is mounted on the bakelite board 11. The processing device 2 can control the hole-forming device 4 to form holes in the circuit board A to be processed, which is mounted on the bakelite board 11.

[0027] The measuring device 3 includes, for example, a contact probe and a multi-axis connecting arm. The processing device 2 can control the multi-axis connecting arm to move the contact probe relative to the circuit board A to be processed along the X, Y, and Z axes. The processing device 2 can also control the multi-axis connecting arm to move the contact probe above a specific position on the circuit board A to be processed, and to make the contact probe contact the circuit board A downwards, thereby obtaining a measurement information 31. The measurement information 31 includes an X-axis coordinate value, a Y-axis coordinate value, and a Z-axis coordinate value. It should be noted that in special applications, the measuring device 3 can also measure the surface of the circuit board A to be processed in a non-contact manner to generate the measurement information 31.

[0028] The hole-forming apparatus 4 includes, for example, a forming element (e.g., a drill bit, a milling cutter, etc.) and a multi-axis connecting arm. The processing device 2 can control the multi-axis connecting arm to move the forming element relative to the circuit board A to be processed along the X, Y, and Z axes. The processing device 2 can control the multi-axis connecting arm to move the forming element above a specific position on the circuit board A to be processed, and the processing device 2 can control the multi-axis connecting arm to make the forming element face downwards, thereby forming a hole in the circuit board A to be processed.

[0029] Processing apparatus 2 is used to execute the circuit board hole forming method of the present invention. The circuit board hole forming method of the present invention includes the following steps:

[0030] Milling step S1: Perform a milling operation on the bearing surface 111 (e.g.) Figure 3(as shown);

[0031] Step S2: Place the circuit board A to be processed on the bearing surface 111 of the bakelite board 11;

[0032] Measurement step S3: The measuring device 3 performs measurements at multiple preset measurement positions P1 to 10 in a preset hole forming area A1 of the circuit board A to be processed, so as to obtain multiple measurement information 31 (e.g., Figure 1 , 4 (As shown); the preset hole forming area A1 is divided into multiple preset segmented areas A11, and each preset segmented area A11 contains at least one preset measurement position P1; each measurement information 31 contains an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; wherein, the size of each preset segmented area A11 is larger than the size of the formed part;

[0033] Protection step S4: Install a protective plate 5 on the circuit board A to be processed (e.g., Figure 5 (as shown);

[0034] One compensation calculation step S5: Based on each measurement information 31 and a preset depth value, calculate multiple depth compensation values ​​21; the sum of each depth compensation value 21 and the corresponding Z-axis coordinate value, and the difference between the sum and the preset depth value, are within a preset depth allowable range.

[0035] Processing step S6: Based on the measurement information 31 and the corresponding depth compensation value 21, control the hole forming device to form a blind hole with a depth conforming to the preset depth allowable range in each preset segmented area A11. In processing step S6, the protective plate 5 located above the preset hole forming area A1 is also removed.

[0036] In one embodiment, during the milling step S1, the maximum height difference on the surface of the bakelite board 11 can be ±1000 micrometers (µm), while the preset depth allowable range can be ±50 micrometers (µm). This design effectively reduces the height difference on the surface of the bakelite board 11, thereby allowing the hole forming device 4 to more precisely form holes within the preset depth allowable range on the circuit board A to be processed, and ensuring that the depth of the holes on the circuit board A at different locations conforms to the preset depth allowable range.

[0037] In the prior art, there is no process for milling the bakelite board 11. Therefore, in the prior art, when the hole forming device forms holes in the circuit board to be processed, the height difference of the bakelite board 11 at different positions can easily lead to different depths of the holes in the circuit board to be processed at different positions.

[0038] In practical applications, the circuit board processing equipment 100 may also include a robotic arm, which is used to transfer the circuit board A to be processed, so as to place the circuit board A to be processed on the bearing surface 111; or, to move the circuit board that has been processed and is placed on the bearing surface 111 to other positions.

[0039] like Figure 7 As shown, in one example, the preset hole forming area A1 is, for example, rectangular, and the preset hole forming area A1 is, for example, divided into 10 preset segmented areas A11, each preset segmented area A11 having, for example, a preset measurement position P1. In this example, in measurement step S3, the processing device 2 will control the measuring device 3 to measure sequentially. Figure 7 The processing device 2 acquires 10 measurement information entries 31 from 10 preset measurement positions P1, P2, P3 to P10. In the compensation calculation step S5, the processing device 2 calculates 10 depth compensation values ​​21 based on the 10 measurement information entries 31. In the processing step S6, the processing device 2 controls the forming part to sequentially form holes in 10 preset segmented regions A11 according to each depth compensation value 21 and the preset depth value. Finally, the holes formed in the 10 preset segmented regions A11 will be interconnected to form blind holes with approximately the same depth.

[0040] It should be noted that the size of each preset segmented region A11 is larger than the outer diameter of the forming part (e.g., a milling cutter) of the hole forming device 4. The number of preset segmented regions A11 included in the preset hole forming region A1 can be designed according to the actual size of the forming part, the size of the preset hole forming region, etc., and is not limited here. In the example where the measuring device 3 includes a contact probe, the size of each preset segmented region A11 is larger than the needle size of the contact probe, and the contact probe can measure multiple positions in the preset segmented region A11.

[0041] By dividing the preset hole forming area A1 into multiple preset segmented areas A11 as described above, and using the measuring device 3 to measure each preset segmented area A11 one by one, the measurement information 31 corresponding to multiple preset segmented areas A11 is obtained, thereby calculating multiple depth compensation values ​​21. This design allows the holes finally formed in the preset hole forming area A1 to have approximately the same depth at different positions of the holes.

[0042] In the example where a preset measurement position P is set in each preset segmented region A11, the preset measurement position P can be set at the center of the preset segmented region A11, but is not limited thereto. In different embodiments, each preset segmented region A11 can also have two or more preset measurement positions set. In the compensation calculation step S5, the processing device 2 can, for example, average the Z-axis coordinate values ​​in two or more measurement information 31 to calculate an average Z-axis coordinate value, and then use the average Z-axis coordinate value and a preset depth value to calculate the depth compensation value.

[0043] It should be noted that in practice, before the compensation calculation step S5, the processing device 2 will obtain the coordinates and preset depth of the hole forming area of ​​the circuit board A to be processed. For example, before the compensation calculation step S5, the processing device 2 will know to control the forming part of the hole forming device 4 to move to the position of coordinates (X1, Y1), and after contacting the circuit board A to be processed (at this time, the processing device 2 will recognize the Z-axis coordinate of this position as zero), move downwards by a preset depth to form a hole with a preset depth. After the compensation calculation step S5, the processing device 2 will obtain the measurement information 31 corresponding to the preset segmented region A11 with coordinates (X1, Y1). Assuming that the Z-axis coordinate value of the measurement information 31 obtained by the processing device 2 is 15, it means that the preset segmented region A11 is 15 micrometers higher than expected. Thus, the processing device 2 will calculate the depth compensation value 21 of the preset segmented region A11 as 15 micrometers. Then, in the processing step S6, the processing device 2 will control the hole forming device 4 to form a hole with a depth of a preset depth plus 15 micrometers downward at coordinates (X1, Y1).

[0044] By designing the protection step S4, the area of ​​non-preset hole forming region A1 of the circuit board A to be processed can be prevented from being damaged when the hole forming device 4 processes the circuit board A.

[0045] Please refer to the following: Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of another step in the circuit board hole formation method of the present invention. Figure 9 This is another partial top view of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0046] The biggest difference between this embodiment and the previous embodiment is that each preset segmentation region A11 is set with three preset measurement positions P1, P2 and P3, and in the measurement step S3, three measurement information 31 will be generated in each preset segmentation region A11.

[0047] In the compensation calculation step S5A, the processing device 2 can first establish a fitting plane using all the measurement information 31 obtained from all preset measurement positions located in the same preset segmentation region A11, and then calculate at least one depth compensation value 21 corresponding to the preset segmentation region A11 using the fitting plane and the preset depth value. In practice, the processing device 2 can, for example, use three measurement information 31 in the same preset segmentation region A11 to calculate the fitting plane using the least squares method.

[0048] In processing step S6A, the processing device 2 controls the hole forming device 4 to process each preset segmented area A11 of the circuit board A to be processed according to the fitting plane corresponding to each preset segmented area A11, so as to form blind holes with a depth conforming to the preset depth range in each preset segmented area.

[0049] For example, assuming the fitting plane in each preset segmented region A11 can be represented by the equation: Z = aX + bY + c, then in the compensation calculation step S5, the processing device 2 will use three measurement information 31 to calculate the coefficients a, b, and c in the equation. After the processing device 2 calculates the coefficients a, b, and c, in the processing step S6A, the processing device 2 controls the forming part to move to the coordinate (X1, Y1), and then inputs the coordinate (X1, Y1) into the equation to calculate the corresponding Z-axis coordinate. In this way, the processing device 2, in conjunction with the preset depth, can accurately calculate the depth of the hole to be formed downwards at the coordinate position of the forming part on the circuit board A to be processed.

[0050] In summary, the circuit board processing equipment and circuit board hole forming method of the present invention, through the design of milling, placement, measurement, compensation calculation and processing steps, can ensure that the depth of the holes formed on the circuit board to be processed falls within the preset depth allowable range at different positions.

[0051] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A method of forming a hole in a circuit board, characterized by, The circuit board hole forming method can be executed by a processing device of a circuit board processing apparatus, and the circuit board hole forming method comprises: a milling step of performing a milling operation on a bearing surface of a bakelite plate arranged on a carrier table of the circuit board processing apparatus; a placing step of placing a to-be-processed circuit board on the bearing surface of the bakelite plate; a measuring step of causing a measuring device of the circuit board processing apparatus to perform measurement at a plurality of preset measuring positions of a preset hole forming region of the to-be-processed circuit board to obtain a plurality of pieces of measurement information; the preset hole forming region is divided into a plurality of preset segmentation regions, and each preset segmentation region is provided with at least one preset measuring position; each piece of measurement information comprises an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; a compensation calculation step of calculating a plurality of depth compensation values according to each piece of measurement information and a preset depth value; a difference between a sum of each depth compensation value and a corresponding Z-axis coordinate value and the preset depth value is within a preset depth tolerance range; a processing step of controlling a hole forming device to form a blind hole with a depth conforming to the preset depth tolerance range in each preset segmentation region according to each piece of measurement information and the corresponding depth compensation value; wherein the size of each preset segmentation region is greater than the size of a forming member of the hole forming device; wherein each preset segmentation region is provided with at least three preset measuring positions; in the compensation calculation step, a fitting plane is first established using all the measurement information obtained by all the preset measuring positions in the same preset segmentation region, and then at least one depth compensation value corresponding to the preset segmentation region is calculated using the fitting plane and the preset depth value.

2. The circuit board hole forming method according to claim 1, wherein In the milling step, the maximum height difference of the surface of the bakelite plate is ±1000 microns; and the preset depth tolerance range is ±50 microns.

3. The method according to claim 1, wherein Between the compensation calculation step and the processing step, there is further included a protection step of arranging a protection plate on the to-be-processed circuit board; and in the processing step, the protection plate located above the preset hole forming region is removed.

4. A circuit board processing apparatus characterized by comprising: The circuit board processing apparatus comprises: a carrier table provided with a bakelite plate having a bearing surface for bearing a to-be-processed circuit board; a processing device for executing a circuit board hole forming method; a measuring device electrically connected to the processing device; a hole forming device electrically connected to the processing device, and the processing device can control the hole forming device to move relative to the to-be-processed circuit board in X-axis, Y-axis and Z-axis directions; wherein the processing device executes the circuit board hole forming method comprising the following steps: a milling step of performing a milling operation on the bearing surface; a placing step of placing the to-be-processed circuit board on the bearing surface; A measuring step: the measuring device measures a plurality of preset measuring positions in a preset hole forming area of the circuit board to be processed to obtain a plurality of pieces of measurement information; the preset hole forming area is divided into a plurality of preset sub-areas, each of the preset sub-areas is provided with at least one preset measuring position; each piece of measurement information includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; A compensation calculating step: a plurality of depth compensation values are calculated according to each piece of measurement information and a preset depth value; the difference between the sum of each depth compensation value and the corresponding Z-axis coordinate value and the preset depth value is within a preset depth tolerance range; A processing step: the hole forming device is controlled according to each piece of measurement information and the corresponding depth compensation value to form a blind hole in each preset sub-area, the depth of the blind hole being within the preset depth tolerance range; the size of each preset sub-area is greater than the size of the forming part of the hole forming device; In the compensation calculating step, a fitting plane is established using all the measurement information obtained by all the preset measuring positions in the same preset sub-area, and then the fitting plane and the preset depth value are used to calculate at least one piece of depth compensation value corresponding to the preset sub-area.

5. The circuit board processing apparatus according to claim 4, wherein In the milling step, the maximum height difference of the surface of the bakelite board is ±1000 microns; and the preset depth tolerance range is ±50 microns.

6. The circuit board processing apparatus according to claim 4, wherein Between the compensation calculating step and the processing step, a protection step is further included: a protection plate is arranged on the circuit board to be processed; in the processing step, the protection plate above the preset hole forming area is removed.

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