Liquid cooling radiator with spraying and two-phase flow circulation functions

Abstract

A liquid cooling radiator with both spraying and two-phase flow circulation comprises a three-dimensional steam cavity element and a semi-open shell, the three-dimensional steam cavity element comprises an upper cover, a lower cover, a porous capillary structure and working fluid, the upper cover is provided with a through opening and an annular shell cavity, and the lower cover is provided with a lower inner surface. When the upper cover is connected to the lower cover, a cavity of the annular shell forms an annular closed air cavity, working fluid is arranged in the annular closed air cavity, the working fluid and the annular closed air cavity conduct two-phase flow circulation through the porous capillary structure, the semi-open shell is coupled to the lower cover to form a heat exchange cavity and comprises a spraying head, an input port and an output port, the spraying head is connected to the input port, and the output port is connected to the output port. Cooling liquid flows in from the input port and flows to the through opening along the spraying head, further the cooling liquid is sprayed to the lower inner surface of the lower cover in the corresponding through opening, and finally the cooling liquid flows through the heat exchange cavity and flows out from the output port. The heat dissipation device achieves the dual heat dissipation effect, can effectively improve the heat dissipation efficiency, and can also be suitable for a heat source with higher power in the future.

Description

Technical Field

[0001] The present invention relates to a liquid cooling radiator, and more particularly to a liquid cooling radiator which integrates a spray nozzle and has two-phase flow circulation. Background Art

[0002] The demand for electronic products is increasing day by day. In order to meet the needs of consumers and respond to the trend of big data, the performance requirements of chips used in electronic devices are also getting higher and higher. For the main heat source, such as the heat energy on the AI ​​chip, CPU or GPU, the power of a single chip has reached 500W or 700W, and there will even be a design demand for high-computing power chip products with a power of more than 2,000W in the future. Generally speaking, the faster the computing speed of the chip, the more powerful its performance, but at the same time, the thermal design power and heat generation of the chip also increase greatly. If the heat of the chip cannot be effectively dissipated, it may cause the chip to overheat and cause the chip to work at a reduced frequency or even burn out. In addition, with the high power and multi-functional computing of high-computing power chips, the temperature of the secondary heat sources configured around the high-computing power chips gradually increases to match the overall high computing power function. Therefore, today's heat dissipation technology is no longer just to dissipate the heat of the high-computing power chips of the main heat source, but the secondary heat sources also need to be dissipated.

[0003] It is known that the common heat dissipation technologies are divided into air cooling technology and liquid cooling technology. The air cooling technology currently used in the industry is mostly heat pipes (Heat pipe) and vapor chamber temperature plate (Vapor Chamber, VC) plus heat dissipation fins. However, as the power of a single chip increases, the heat pipe has almost reached its heat dissipation limit. Vapor chamber temperature plate (Vapor Chamber, VC) is generally a flat plate shape, which can be used to solve the problem of two-dimensional heat diffusion. However, as the power of the chip becomes larger and larger, the flat-plate vapor chamber temperature plate element can no longer meet the heat dissipation requirements, and a three-dimensional vapor chamber temperature plate element structure is generated. The heat absorption zone and the condensation zone of the two-phase flow circulation are located on different planes to increase the function of three-dimensional heat dissipation.

[0004] In addition, conventional liquid cooling technologies mainly include cold plate liquid cooling technology and immersion liquid cooling technology. Cold plate liquid cooling is to install a cold plate cooling module on the high computing power chip on the circuit motherboard, and then connect the circulating coolant to the water inlet and outlet of the cold plate cooling module. The microchannels in the water-cooling plate in the cold plate liquid cooling are used to exchange heat with the chip, and then the heated hot water is taken away from the water-cooling plate to achieve the purpose of lowering the chip temperature. However, when the power of a single chip exceeds 700W, it can no longer meet the heat dissipation requirements of the increasing trend of high computing power chips. The immersion liquid cooling technology directly immerses the entire circuit motherboard and electronic heating elements in a non-conductive liquid, and directly conducts the heat energy generated when the electronic device is in operation to the cooling liquid.

[0005] Therefore, in order to solve the hot spot problem caused by the increasing chip power and power density and the uneven power distribution of the chip itself in the conventional technology, it is necessary to provide a more efficient heat dissipation and heat distribution solution to improve the overall heat dissipation efficiency of the chip. Summary of the invention

[0006] In view of this, the purpose of the present invention is to provide a liquid-cooled radiator with both spraying and two-phase flow circulation, which can overcome the defects of the prior art, effectively achieve dual heat dissipation effects, effectively provide heat dissipation efficiency, and can also be suitable for future higher-power heat sources, which is more innovative.

[0007] To achieve the above object, the present invention discloses a liquid cooling radiator with both spraying and two-phase flow circulation, which is characterized by comprising:

[0008] A three-dimensional vapor chamber element, comprising:

[0009] An upper cover includes an upper shell having a through opening, an inner shell surface and an annular shell cavity;

[0010] A lower cover, relative to the upper cover, having a lower inner surface and a lower outer surface, when the upper cover is coupled to the lower cover, the annular shell cavity forms an annular closed air cavity, and the lower outer surface of the lower cover is used to contact a heat source;

[0011] A multi-porous capillary structure is continuously disposed on the inner surface of the shell and the lower inner surface located in the annular closed air cavity; and

[0012] A working fluid is disposed in the annular closed air cavity, and the pressure of the annular closed air cavity is less than one atmospheric pressure; and

[0013] A semi-open shell is coupled to the lower cover of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port and an output port. The input port is used to input a cooling liquid. The spray head is connected to the input port relative to the through opening to spray the cooling liquid on the lower inner surface of the lower cover in the through opening first, and then flows through the heat exchange chamber and outputs the cooling liquid through the output port.

[0014] The semi-open shell further has a top plate and a side plate, the input port is arranged on the top plate, and the output port is arranged on the side plate.

[0015] The lower cover has at least one first groove relative to the spray head and a plurality of second grooves, the first groove has a first bottom surface, the spray head first sprays the coolant on the first bottom surface of the first groove located in the through opening, and a groove rib wall is formed between the second grooves, the groove rib wall has a rib wall surface, and each second groove has a groove inner surface.

[0016] The porous capillary structure is continuously arranged on the inner surface of the shell, the lower inner surface in the annular closed air cavity, the rib wall surface of the groove rib wall and the groove inner surfaces of the second grooves.

[0017] The lower cover has a third groove, in which at least one fourth groove relative to the spray head and a plurality of fifth grooves are provided, the fourth groove has a fourth bottom surface, the spray head is used to first spray the coolant on the fourth bottom surface of the fourth groove located in the through opening, and a groove rib wall is formed between the fifth grooves, the groove rib wall has a rib wall surface, and each fifth groove has a groove inner surface.

[0018] The porous capillary structure is continuously arranged on the inner surface of the shell, the lower inner surface in the annular closed air cavity, the rib wall surface of the groove rib wall and the inner surfaces of the grooves of the fifth grooves.

[0019] The semi-open shell further has a top plate and a side plate, the top plate is provided with a flow channel and has a top plate side end, the input port is provided at the top plate side end, the flow channel is used to connect the input port and the sprinkler head, and the output port is provided at the side plate.

[0020] The upper shell further has a nozzle sealing structure, which is formed by pre-setting a liquid nozzle on the upper shell, injecting the working fluid into the closed air cavity through the liquid nozzle, and then sealing the liquid nozzle.

[0021] The invention also comprises a plurality of supporting columns with porous capillary structures, which are respectively arranged between the upper shell and the lower cover.

[0022] The heat source is a high computing power chip having a hot spot, and the through opening is formed on the upper shell relative to the hot spot.

[0023] In summary, the present invention provides a liquid cooling radiator with both spraying and two-phase flow circulation. First, by arranging the spray head in a semi-open shell, the cooling liquid can be sprayed on the lower inner surface of the lower cover along the spray head, and the cooling liquid directly impacts the lower inner surface of the lower cover close to the hot spot of the chip to perform effective heat exchange. Further, in order to more effectively match the cooling liquid for better liquid cooling circulation, the three-dimensional steam chamber element of the liquid cooling radiator with both spraying and two-phase flow circulation provided by the present invention is further designed as a middle concave hole (i.e., the through opening described in the present invention). This through opening actually corresponds to the hot spot position with the highest temperature in the heat source (i.e., the high-computing power chip). In detail, the positions of the spray head and the through opening both correspond to the hot spot of the heat source. Therefore, when the cooling liquid is sprayed from the spray head at the through opening, the cooling liquid can be directly sprayed and impacted on the lower inner surface of the lower cover at a vertical distance, further and more effectively performing the liquid cooling circulation, and at the same time, the two-phase flow circulation in the annular three-dimensional steam chamber surrounding the hot spot plays a role in heat equalization, reducing the temperature difference on the chip. Compared with the prior art, the liquid cooling radiator with both spraying and two-phase flow circulation of the present invention has several advantages. First, when the cooling liquid is sprayed at the through opening, the cooling liquid can directly impact the position of the corresponding hot spot to directly exchange heat, and the heat energy can be taken away efficiently. At the same time, the two-phase flow circulation is carried out through the phase change of the working fluid inside the three-dimensional vapor chamber element to make the chip reach the purpose of uniform temperature, thereby reducing the temperature difference of the chip. Further, the cooling liquid will flow along the semi-open shell. At this time, the upper cover of the three-dimensional vapor chamber element also serves as the condensation end, and the heat energy absorbed by the three-dimensional vapor chamber element is taken away through the cooling liquid. Finally, the cooling liquid outputs all the heat energy exchanged in the heat exchange cavity from the output port. Therefore, the liquid cooling radiator with both spraying and two-phase flow circulation provided by the present invention has achieved a double heat dissipation effect through the two-phase flow circulation inside the three-dimensional vapor chamber element and the liquid cooling circulation in the heat exchange cavity at the same time. It can also effectively provide heat dissipation efficiency and can be applied to future higher power heat sources. Even when there is more than one set of hot spots in the heat source, the present invention can also provide a design corresponding to each type of heat source. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to a specific embodiment of the present invention is shown.

[0025] Figure 2A Shows the Figure 1 Schematic top view of a three-dimensional vapor chamber element.

[0026] Figure 2B A schematic top view of a three-dimensional vapor chamber element according to another embodiment is shown.

[0027] Figure 2C A schematic top view of a three-dimensional vapor chamber element according to another embodiment is shown.

[0028] Figure 2D A schematic top view of a three-dimensional vapor chamber element according to another embodiment is shown.

[0029] Figure 2E A schematic top view of a three-dimensional vapor chamber element according to another embodiment is shown.

[0030] Figure 3 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0031] Figure 4 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0032] Figure 5A A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0033] Figure 5B Shows the Figure 5A A partial top view of the lower cover.

[0034] Figure 6 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0035] Fig. 7A A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0036] Figure 7B Shows the Fig. 7A A partial top view of the lower cover.

[0037] Figure 8 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0038] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the accompanying drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0039] Please also read Figure 1 as well as Figure 2A , Figure 1 A schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation according to a specific embodiment of the present invention is shown. Figure 2A Shows the Figure 1 A top view of a three-dimensional vapor chamber element. Figure 1 As shown, the present invention provides a liquid cooling radiator 1 with both spraying and two-phase flow circulation, comprising a three-dimensional vapor chamber element 10 and a semi-open shell 20. The three-dimensional vapor chamber element 10 comprises an upper cover 101, a lower cover 102, a porous capillary structure 106 and a working fluid 107. Please refer to Figure 1 as well as Figure 2A The upper cover 101 includes an upper shell 1011, and the upper shell 1011 has a through opening 1012, a shell inner surface 1013 and an annular shell cavity (not shown). Figure 1 The angle of the upper cover 101 is 2 sets of upper shells 1011, but please refer to Figure 2A ,like Figure 2A As shown, the upper shell 1011 of the upper cover 101 is in the shape of a rectangular parallelepiped, and the circular portion in the middle is the position of the through opening 1012. In practice, there may be only one set of upper shells 1011. During the material preparation process, a metal sheet is first made into a circular hole through a punch or a mold, and then the shape of the upper shell 1011 is processed by a stamping process. Therefore, the non-protruding portion in the middle of the upper shell 1011 is the through opening 1012. Please continue to refer to Figure 1 , the lower cover 102 has a lower inner surface 1021 and a lower outer surface 1022. When the upper cover 101 is joined to the lower cover 102, the annular shell cavity forms an annular closed air cavity 1023. Among them, the porous capillary structure 106 is continuously arranged on the shell inner surface 1013 and the lower inner surface 1021 located in the annular closed air cavity 1023; the working fluid 107 is arranged in the annular closed air cavity 1023, and the pressure of the annular closed air cavity 1023 is less than one atmosphere. The lower outer surface 1022 of the lower cover 102 contacts the heat source 108. Further, the semi-open shell 20 is coupled to the lower cover 102 of the three-dimensional steam chamber element 10 to form a heat exchange chamber 201, and the semi-open shell 20 includes a shower head 202 and has an input port 203 and an output port 204. The input port 203 is used to input the cooling liquid. The spray head 202 is connected to the input port 203 relative to the through opening 1012 to spray the coolant into the through opening 1012 to impact the lower inner surface 1021 of the lower cover 102 for efficient heat exchange of hot spots, and then flows through the heat exchange cavity 201 and outputs the coolant through the output port 204.

[0040] The porous capillary structure 106 can be made of metal powder or metal mesh and first laid on the inner surface 1013 of the shell and the lower inner surface 1021 of the lower cover 102 corresponding to the upper shell 1011, and then sintered to form the porous capillary structure 106. Further, a plurality of support columns 109 with porous capillary structures are placed in the upper cover 101 and the lower cover 102. The upper cover 101 and the lower cover 102 are welded and airtightly joined, and the working fluid 107 is injected into the annular closed air cavity 1023 from the liquid injection port 1015 in the injection port sealing structure 1014, and finally the liquid injection port 1015 is sealed and evacuated to form the three-dimensional vapor chamber element 10. In practice, the lower outer surface 1022 of the lower cover 102 in the three-dimensional vapor chamber element 10 as a heat absorbing end preferentially receives the heat energy emitted from the heat source 108, and the working fluid 107 of the three-dimensional vapor chamber element 10 undergoes a phase change to a gaseous working fluid 107 due to heat absorption. Then, the working fluid 107 changes from gas phase to liquid phase at the condensation end, and finally flows back to the lower inner surface 1021 in the annular closed air cavity 1023 by capillary phenomenon along the porous capillary structure 106 located on the inner surface 1013 of the shell to complete a two-phase flow cycle. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol.

[0041] Please continue reading Figure 1 ,like Figure 1 As shown, Figure 1 The dashed arrow in the figure indicates the coolant flow direction F. After the coolant flows from the input port 203 through the through opening 1012, the coolant directly sprays and impacts the lower inner surface 1021 of the lower cover 102, and then flows through the heat exchange chamber 201 and finally flows out from the output port 204, completing a liquid cooling cycle. In summary, when the liquid cooling radiator 1 with both spraying and two-phase flow circulation of the present invention is actually applied to a heat source 108, the two-phase flow circulation inside the three-dimensional steam chamber element 10 can not only achieve temperature uniformity and heat dissipation, but also spray the coolant at the through opening 1012, so that the coolant directly impacts the place with the highest temperature to dissipate heat, thereby greatly increasing the overall heat dissipation efficiency. In practice, the coolant can be water or an aqueous solution of water and alcohol, but is not limited thereto.

[0042] Next, in practical applications, the heat source 108 can be an AI chip, CPU or GPU, or a high-computing power chip with a single power of more than 1,000W, and these high-computing power chips all have core heating hotspots 1081 when actually operating. The high-computing power chip may also contain two or more hotspots. Therefore, the liquid cooling radiator with both spraying and two-phase flow circulation of the present invention can also perform spraying and cooling for each hotspot of future high-power high-computing power chips and various high-computing power chips.

[0043] See also FIG. 2A to FIG. 2E , Figure 2BA schematic top view of a three-dimensional vapor chamber element of another specific embodiment is shown, Figure 2C A schematic top view of a three-dimensional vapor chamber element of another specific embodiment is shown, Figure 2D A schematic top view of a three-dimensional vapor chamber element of another specific embodiment is shown, Figure 2E FIG. 1 is a top view of a three-dimensional vapor chamber element of another specific embodiment. When the hot spot of some high-computing power chips is not located in the middle but near one side, the through opening 1012 can be set at the corresponding position according to the hot spot position, such as FIG. 2A to FIG. 2B As shown, Figure 2A The through opening 1012 is located in the middle of the three-dimensional vapor chamber element 10 . Figure 2B The through opening 1012 in the three-dimensional vapor chamber element 11 can be set at the position of the hot spot.

[0044] Furthermore, if the high computing power chip includes multiple hot spots, a three-dimensional vapor chamber element can also be designed according to the number of hot spots, such as Figure 2C as well as Figure 2D As shown, Figure 2C The three-dimensional vapor chamber element 12 has two sets of through openings 1012 , and the two sets of through openings 1012 may correspond to two hot spots. Figure 2D The three-dimensional vapor chamber element 13 has three groups of through openings 1012 , and the three groups of through openings 1012 may correspond to three hot spots.

[0045] Next, if the high-computing chip contains multiple hot spots and also has a temporary memory that generates heat, since the overall hot spot covers a larger area, the three-dimensional vapor chamber element can also be designed according to the actual heating area of ​​the heat source, such as Figure 2E As shown, Figure 2E The through opening 1012' in the three-dimensional vapor chamber element 14 is in the shape of an oblong. When the coolant is sprayed from the spray head 202, the coolant can cover a larger area of ​​heat generation, thereby improving the heat dissipation efficiency. FIG. 2A to FIG. 2E The nozzle sealing structure and the liquid nozzle are shown in the upper left relative to the through opening, but the position is not limited thereto. The nozzle sealing structure, the liquid nozzle, the number and coverage area of ​​the through opening can be designed and adjusted according to the number and distribution position of the heat source in the high computing power chip. The two-phase flow circulation inside the three-dimensional vapor chamber elements 11, 12, 13, 14 is the same as described above, and will not be repeated here.

[0046] Please continue reading Figure 1 ,like Figure 1As shown, the semi-open shell 20 further has a top plate 205 and a side plate 206, the input port 203 is disposed in the top plate 205, and the output port 204 is disposed in the side plate 206, but the location of the arrangement is not limited thereto, and the output port 204 can also be disposed in the top plate 205. In practice, the shower head has an external thread, and the semi-open shell has a corresponding internal thread, so that the shower head can be coupled to the semi-open shell. The semi-open shell 20 can be coupled to the lower cover 102 using screws and sealing rings or by using stir friction welding, but the coupling method is not limited thereto.

[0047] The liquid cooling radiator with both spraying and two-phase flow circulation proposed by the present invention can perform liquid cooling circulation by two-phase flow circulation in the three-dimensional vapor chamber element and the heat exchange chamber in the semi-open shell. In addition to reducing the hot spot temperature in the chip, it can also reduce the temperature difference of the chip and improve the uniformity of the chip temperature. The above has provided several through-opening patterns for different hot spot locations and numbers. Furthermore, the present invention also provides different patterns of semi-open shells, which will be described in detail below. Please refer to Figure 3 , Figure 3 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention. Figure 3 As shown, the present invention provides a liquid-cooled radiator 2 with both spraying and two-phase flow circulation, further comprising an outer frame structure 209. The outer frame structure 209 can match the shape and size of the lower cover 102 of the three-dimensional vapor chamber element 10 (i.e., the length and width of the lower cover 102). Furthermore, the outer frame structure 209 can simultaneously increase the structural strength of the lower cover 102 of the three-dimensional vapor chamber element 10, and can also simultaneously couple the three-dimensional vapor chamber element 10 and the semi-open shell 21 together. Among them, the liquid-cooled radiator 2 with both spraying and two-phase flow circulation of this specific embodiment also dissipates heat simultaneously through the two-phase flow circulation inside the three-dimensional vapor chamber element 10 and the liquid cooling circulation inside the semi-open shell 21, and its operation method is the same as Figure 1 The liquid cooling radiator 1 with both spraying and two-phase flow circulation is the same and will not be described in detail here.

[0048] Furthermore, when the liquid cooling radiator is installed in an electronic device with limited space (such as height restrictions), the shower head cannot be directly arranged above the top plate of the semi-open shell. The present invention further provides a state that can be matched with the installation space. Figure 4 , Figure 4 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention. Figure 4As shown, the present invention provides a liquid cooling radiator 3 with both spraying and two-phase flow circulation, comprising a three-dimensional vapor chamber element 10 and a semi-open shell 22. The semi-open shell 22 further has a top plate 205' and a side plate 206', the top plate 205' is provided with a flow channel 207 and has a top plate side end 208, the input port 203 is provided at the top plate side end 208, and the flow channel 207 connects the input port 203 and the spray head 202. After the coolant flows into the input port 203, it flows along the flow channel 207 to the spray head 202, and further sprays the coolant at the corresponding through opening 1012. The coolant sprayed at the through opening 1012 can directly absorb the heat energy in the lower inner surface 1021 corresponding to the through opening 1012, and can directly absorb the heat energy of the hot spot 1081 with the highest temperature in the heat source 108 and take away its heat energy, and finally flows out from the output port 204 to complete a liquid cooling cycle. In practice, the side end of the top plate is disposed on the right side of the top plate, but the location is not limited thereto, and the output port may also be disposed in the top plate.

[0049] Next, the present invention further provides other aspects of three-dimensional vapor chamber elements integrated into a semi-open housing. Other embodiments provided by the present invention will be described below. Figure 5A , Figure 5A FIG. 1 is a schematic diagram showing a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention. Figure 5A As shown, the present invention provides a liquid cooling radiator 4 with both spraying and two-phase flow circulation, including a three-dimensional vapor chamber element 15 and a semi-open shell 20. Among them, the lower cover 104 of the three-dimensional vapor chamber element 15 has at least one first groove 1024 and a plurality of second grooves 1026 relative to the spray head 202. The first groove 1024 has a first bottom surface 1025, and the spray head 202 is used to spray the cooling liquid on the first bottom surface 2025 of the first groove 1024 in the through opening 1012.

[0050] Please also read Figure 5A as well as Figure 5B , Figure 5B Shows the Figure 5A A partial top view of the lower cover. Figure 5A as well as Figure 5BAs shown, groove rib walls 1030 are formed between the second grooves 1026, and the groove rib walls 1030 have rib wall surfaces 1031, and each second groove 1026 has a groove inner surface 1032. After the upper cover 101 is joined to the lower cover 104, the porous capillary structure 106 is continuously disposed on the inner surface 1013 of the shell, the lower inner surface 1021 in the annular closed air cavity 1023, the rib wall surface 1031 of the groove rib wall 1030, and the groove inner surface 1032 in the second groove 1026. In practice, the position of the first groove 1024 corresponds to the hot spot 1081 with the highest temperature in the heat source 108, so when the coolant is sprayed from the shower head 202, the heat dissipation of the chip hot spot can be effectively carried out. Please note that Figure 5B Only one set of first grooves and eight sets of second grooves are shown, but the number and shape are not limited thereto. The first grooves and the second grooves can be designed according to the number and distribution range of hot spots. The liquid cooling radiator 4 with both spraying and two-phase flow circulation in this specific embodiment also dissipates heat through the two-phase flow circulation inside the three-dimensional vapor chamber element 15 and the heat exchange circulation inside the semi-open shell 20 at the same time. The heat dissipation method is the same as Figure 1 The liquid cooling radiator 1 with both spraying and two-phase flow circulation is the same and will not be described in detail here.

[0051] See also Figure 6 , Figure 6 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention. Figure 6 As shown, the present invention provides a liquid cooling radiator 5 with both spraying and two-phase flow circulation, comprising a three-dimensional vapor chamber element 15 and a semi-open shell 22. The liquid cooling radiator 5 with both spraying and two-phase flow circulation of the present embodiment also dissipates heat simultaneously through the two-phase flow circulation inside the three-dimensional vapor chamber element 15 and the heat exchange circulation inside the semi-open shell 22. The heat dissipation method is the same as Figure 4 The liquid cooling radiator 3 with both spraying and two-phase flow circulation is the same and will not be described in detail here.

[0052] See also Fig. 7A , Fig. 7A FIG. 1 is a schematic diagram showing a liquid cooling radiator with both spraying and two-phase flow circulation according to another specific embodiment of the present invention. Fig. 7A As shown, the present invention provides a liquid cooling radiator 6 with both spraying and two-phase flow circulation, comprising a three-dimensional vapor chamber element 16 and a semi-open shell 20. The lower cover 105 of the three-dimensional vapor chamber element 16 has a third groove 1033, and the third groove 1033 is provided with at least one fourth groove 1034 and a plurality of fifth grooves 1036 relative to the spray head 202. The fourth groove 1034 has a fourth bottom surface 1035, and the spray head 202 is used to spray the cooling liquid on the fourth bottom surface 1035 of the fourth groove 1034 located in the through opening 1012.

[0053] Please also read Fig. 7A as well as Figure 7B , Figure 7B Shows the Figure 5A A partial top view of the lower cover. Fig. 7A as well as Figure 7B As shown, a groove rib wall 1030' is formed between the fifth grooves 1036, and the groove rib wall 1030' has a rib wall surface 1031', and each fifth groove 1036 has a groove inner surface 1032'. When the upper cover 101 is joined to the lower cover 105, the porous capillary structure 106 is continuously arranged on the inner surface 1013 of the shell, the lower inner surface 1021 of the annular closed air cavity 1023, the rib wall surface 1031' of the groove rib wall 1030' and the groove inner surface 1032' of the fifth groove 1036. In practice, the position of the fourth groove 1034 corresponds to the hot spot 1081 with the highest temperature in the heat source 108, so when the coolant is sprayed from the shower head 202, the heat dissipation of the chip hot spot can be effectively carried out. Please note that Figure 7B Only one set of fourth grooves and eight sets of fifth grooves are shown, but the number and shape are not limited thereto. The third groove, the fourth groove and the fifth groove can be designed according to the number and distribution range of hot spots. The liquid cooling radiator 6 with both spraying and two-phase flow circulation in this specific embodiment also dissipates heat through the two-phase flow circulation inside the three-dimensional vapor chamber element 16 and the liquid cooling circulation inside the semi-open shell 20 at the same time. Its operation mode is the same as Figure 1 The liquid cooling radiator 1 with both spraying and two-phase flow circulation is the same and will not be described in detail here.

[0054] See also Figure 8 , Figure 8 The schematic diagram of a liquid cooling radiator with both spraying and two-phase flow circulation of another specific embodiment of the present invention is shown. The present invention provides a liquid cooling radiator with both spraying and two-phase flow circulation 7, which includes a three-dimensional vapor chamber element 16 and a semi-open shell 22. The liquid cooling radiator with both spraying and two-phase flow circulation of this specific embodiment also dissipates heat simultaneously through the two-phase flow circulation inside the three-dimensional vapor chamber element 16 and the heat exchange circulation inside the semi-open shell 22, and its operation mode is the same as that of the liquid cooling radiator 7 of the present invention. Figure 4 The liquid cooling radiator 3 with both spraying and two-phase flow circulation is the same and will not be described in detail here.

[0055] In summary, the present invention provides a liquid-cooled radiator with both spraying and two-phase flow circulation. First, by arranging the spray head in a semi-open shell, the coolant can be sprayed on the lower inner surface of the lower cover along the spray head. Furthermore, in order to more effectively match the coolant for better liquid cooling circulation, the three-dimensional steam chamber element of the liquid-cooled radiator with both spraying and two-phase flow circulation provided by the present invention is further designed to be in the shape of a middle concave hole (i.e., the through opening described in the present invention). This through opening actually corresponds to the hot spot with the highest temperature in the heat source (i.e., the high-computing power chip). In detail, the positions of the spray head and the through opening both correspond to the hot spot of the heat source. Therefore, when the coolant sprays from the spray head and impacts the through opening, the coolant can be directly sprayed and impacted on the lower inner surface of the lower cover at a vertical distance, further performing the liquid cooling circulation more effectively. Compared with the conventional technology, the liquid cooling radiator with both spraying and two-phase flow circulation of the present invention has several advantages. First, when the cooling liquid is sprayed at the through opening, the cooling liquid can directly impact the position of the corresponding hot spot to directly exchange heat, and the heat energy can be taken away efficiently. At the same time, the two-phase flow circulation is carried out through the phase change of the working fluid inside the three-dimensional steam chamber element to make the chip reach the purpose of uniform temperature, thereby reducing the temperature difference of the chip. Furthermore, the cooling liquid will flow along the semi-open shell. At this time, the upper cover of the three-dimensional steam chamber element also serves as the condensation end, and the heat energy absorbed by the three-dimensional steam chamber element is taken away through the cooling liquid. Finally, the cooling liquid outputs all the heat energy that is heat exchanged in the heat exchange ring cavity from the output port. Therefore, the liquid cooling radiator with both spraying and two-phase flow circulation provided by the present invention has achieved a double heat dissipation effect through the two-phase flow circulation inside the three-dimensional steam chamber element and the liquid cooling circulation in the heat exchange cavity at the same time, and the temperature of the chip hot spot is effectively reduced by spraying the cooling liquid on the chip hot spot to directly impact the hot spot area. The present invention can be applied to future higher power heat sources. Even when there is more than one set of hot spots in the heat source, the present invention can also provide a heat source design corresponding to each aspect.

[0056] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. A liquid cooling radiator with both spraying and two-phase flow circulation, characterized in that Contains: A three-dimensional vapor chamber element, comprising: An upper cover includes an upper shell having a through opening, an inner shell surface and an annular shell cavity; A lower cover, relative to the upper cover, having a lower inner surface and a lower outer surface, when the upper cover is coupled to the lower cover, the annular shell cavity forms an annular closed air cavity, and the lower outer surface of the lower cover is used to contact a heat source; A multi-porous capillary structure is continuously disposed on the inner surface of the shell and the lower inner surface located in the annular closed air cavity; as well as A working fluid is disposed in the annular closed air cavity, and the pressure of the annular closed air cavity is less than one atmospheric pressure; and A semi-open shell is coupled to the lower cover of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port and an output port. The input port is used to input a cooling liquid. The spray head is connected to the input port relative to the through opening to spray the cooling liquid on the lower inner surface of the lower cover in the through opening first, and then flows through the heat exchange chamber and outputs the cooling liquid through the output port.

2. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The semi-open shell further has a top plate and a side plate. The input port is arranged on the top plate, and the output port is arranged on the side plate.

3. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The lower cover has at least one first groove relative to the spray head and a plurality of second grooves, the first groove has a first bottom surface, the spray head first sprays the coolant on the first bottom surface of the first groove located in the through opening, and a groove rib wall is formed between the second grooves, the groove rib wall has a rib wall surface, and each second groove has a groove inner surface.

4. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 3, characterized in that: The porous capillary structure is continuously arranged on the inner surface of the shell, the lower inner surface in the annular closed air cavity, the rib wall surface of the groove rib wall and the groove inner surfaces of the second grooves.

5. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The lower cover has a third groove, in which at least one fourth groove relative to the spray head and a plurality of fifth grooves are provided, the fourth groove has a fourth bottom surface, the spray head is used to first spray the coolant on the fourth bottom surface of the fourth groove located in the through opening, and a groove rib wall is formed between the fifth grooves, the groove rib wall has a rib wall surface, and each fifth groove has a groove inner surface.

6. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 5, characterized in that: The porous capillary structure is continuously arranged on the inner surface of the shell, the lower inner surface in the annular closed air cavity, the rib wall surface of the groove rib wall and the groove inner surfaces of the fifth grooves.

7. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The semi-open shell further has a top plate and a side plate, the top plate is provided with a flow channel and has a top plate side end, the input port is provided at the top plate side end, the flow channel is used to connect the input port and the sprinkler head, and the output port is provided at the side plate.

8. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The upper shell further has a nozzle sealing structure, which is formed by pre-setting a liquid nozzle on the upper shell, injecting the working fluid into the closed air cavity through the liquid nozzle, and then sealing the liquid nozzle.

9. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The invention also comprises a plurality of supporting columns with porous capillary structures, which are respectively arranged between the upper shell and the lower cover.

10. The liquid cooling radiator with both spraying and two-phase flow circulation as claimed in claim 1, characterized in that: The heat source is a high computing power chip having a hot spot. The through opening is formed on the upper shell relative to the hot spot.

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