Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate, the first conductive pad includes at least two sub-portions, and each of the at least two sub-portions includes a first upper surface. The second conductive pad is disposed on the second substrate, and the second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially arranged in the through hole and is in contact with the at least one first upper surface and the second upper surface.

Description

Technical Field

[0001] The present invention relates to an electronic device, and in particular to an electrical connection structure of the electronic device. Background Art

[0002] Electronic devices such as tablet computers, laptops, smart phones, monitors and televisions have become indispensable necessities in modern society. With the application of electronic devices and the habits or needs of users, the requirements for the structure and quality of electronic devices are getting higher and higher, which in turn makes electronic devices face different problems.

[0003] For example, in response to requirements for higher resolution or display quality, the size of the electrical connection structure in the electronic device needs to be miniaturized accordingly, which affects the reliability or conduction capability of the electrical connection structure.

[0004] As mentioned above, existing electronic devices still fail to meet the requirements in all aspects, and further improving the performance of the electrical connection structure of electronic devices is still one of the research topics that the industry is currently committed to. Summary of the invention

[0005] According to some embodiments of the present invention, an electronic device is provided, comprising at least one electrical connection structure. The at least one electrical connection structure comprises a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate, the first conductive pad comprises at least two sub-parts, and the at least two sub-parts respectively comprise a first upper surface. The second conductive pad is disposed on the second substrate, the second conductive pad comprises a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and contacts at least one first upper surface and the second upper surface.

[0006] In order to make the features and advantages of the present invention more obvious and easy to understand, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0008] Figure 1 A schematic diagram showing a top view of an electronic device according to some embodiments of the present invention;

[0009] Figure 2 In some embodiments according to the present invention, Figure 1 A schematic cross-sectional structure diagram of the electronic device along the section line AA';

[0010] Figure 3A schematic cross-sectional view showing an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0011] Figure 4 A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0012] FIG. 5A to FIG. 5E A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0013] FIG. 6A to FIG. 6C A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0014] Figure 7 A schematic cross-sectional view showing an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0015] FIG. 8A to FIG. 8C A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present invention;

[0016] Fig. 9 A schematic cross-sectional structure diagram of an electronic device according to some embodiments of the present invention is shown.

[0017] Reference numerals:

[0018] 10, 20: Electronic devices

[0019] 10E, 10E-1, 10E-2: Electrical connection structure

[0020] 100: first substrate

[0021] 102: Middle layer

[0022] 102s: side surface

[0023] 104: Insulation layer

[0024] 110: first conductive pad

[0025] 110b: Lower surface

[0026] 110i: Inner edge

[0027] 110n: Notch

[0028] 110p: Subsection

[0029] 110s: side surface

[0030] 110t: Upper surface

[0031] 110u: outer edge

[0032] 111: Connecting part

[0033] 111e: End

[0034] 151: First pad

[0035] 152: Second pad

[0036] 191: First Test Pad

[0037] 192: Second test pad

[0038] 200: Second substrate

[0039] 202: Insulation layer

[0040] 210: second conductive pad

[0041] 210t: Upper surface

[0042] 300: The third substrate

[0043] 302: Drive components

[0044] 310: third conductive pad

[0045] 400, 400B, 400G, 400R: Electronic components

[0046] 401a, 401b: electrodes

[0047] 402: Main body

[0048] A-A', B-B', C-C': Transect

[0049] CD: Conductive material

[0050] PX1, PX2: Pixels

[0051] TH1, TH2: Perforation

[0052] THs: side surface DETAILED DESCRIPTION

[0053] The following is a detailed description of the electronic device of an embodiment of the present invention. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present invention. The specific components and arrangements described below are only for simple and clear description of some embodiments of the present invention. Of course, these are only used as examples and are not limitations of the present invention. In addition, similar and / or corresponding numbers may be used in different embodiments to indicate similar and / or corresponding components to clearly describe the present invention. However, the use of these similar and / or corresponding numbers is only for the simple and clear description of some embodiments of the present invention, and does not represent any correlation between the different embodiments and / or structures discussed.

[0054] It should be understood that relative terms, such as "lower" or "bottom" or "upper" or "top", may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "lower" side will become the component on the "upper" side. The embodiments of the present invention may be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present invention are also considered as part of the invention description. It should be understood that the drawings of the present invention are not drawn according to scale, and in fact, the size of the components may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0055] Furthermore, when a first material layer is mentioned as being located on or above a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

[0056] In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify components, do not imply or represent any previous ordinal numbers of the (or multiple) components, nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of multiple ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The claims and the specification may not use the same words, for example, the first component in the specification may be the second component in the claims.

[0057] In some embodiments of the present invention, terms such as "connection", "interconnection", etc., related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein another structure is disposed between the two structures. Such terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "coupled" include any direct and indirect electrical connection means.

[0058] In the text, the terms "about", "substantially", and "approximately" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The term "range between a first value and a second value" means that the range includes the first value, the second value, and other values ​​therebetween. Furthermore, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0059] According to embodiments of the present invention, a scanning electron microscope (SEM), an optical microscope (OM), an α-step, an ellipsometer, or other suitable methods may be used to measure the width, thickness, height, volume or area of ​​each component, and the spacing or distance between components. Specifically, according to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image of a component to be measured, and measure the width, thickness, height, volume or area of ​​each component, and the spacing or distance between components.

[0060] It should be understood that the following embodiments may replace, reorganize, or combine features in several different embodiments to complete other embodiments without departing from the spirit of the present invention. The features of each embodiment may be combined and used in any manner as long as they do not violate the spirit of the invention or conflict with each other.

[0061] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present invention belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0062] In response to requirements for higher resolution or display quality, the size of the electrical connection structure in the electronic device needs to be miniaturized accordingly, and the reliability and conduction performance of the electrical connection structure are thus greatly challenged.

[0063] According to an embodiment of the present invention, an electronic device including an electrical connection structure is provided, wherein the conductive pad of the electrical connection structure has a plurality of sub-parts, which can be used as a plurality of terminals for the conductive pad to be electrically connected laterally, thereby increasing the contact points between the conductive material and the conductive pad, reducing the difficulty of the wiring process of the electrical connection structure, and also allowing the conductive material filling and / or perforation process to have a larger allowable error value, thereby improving the process yield. In addition, by configuring the aforementioned conductive pad, the total area of ​​the conductive pad can be relatively reduced, and the volume of the perforation and / or the conductive material can be maintained or increased, so that the electrical connection structure can have an improved reliability, and is conducive to miniaturization of the electrical connection structure. In addition, according to an embodiment of the present invention, the design of the electrical connection structure can set the electronic components (for example, drive components, etc.) on the back side of the substrate, which can reduce the peripheral usage of the electronic device, thereby achieving technical requirements such as borderless, narrow border or seamless splicing.

[0064] According to an embodiment of the present invention, the electronic device may include a display device, a splicing device, a touch electronic device, a sensing device, an antenna device, a packaging device, a curved electronic device or a non-rectangular electronic device, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light-emitting diode, fluorescence, phosphorescence, other suitable display media, or a combination of the foregoing, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The electronic device may include an electronic component, and the electronic component may be a passive component or an active component, such as a capacitor, a resistor, an inductor, a diode, a driving component, a transistor, etc. The diode may include a light-emitting diode (LED) or a photodiode. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna or an antenna device of a varactor diode, but is not limited thereto. The packaging device may be used for wafer-level packaging (WLP) technology or panel-level packaging (WLP) technology, such as chip first or chip later packaging (RDLfirst). It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. In addition, the electronic device may be a bendable or flexible electronic device. In addition, the appearance of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support a display device or a splicing device.

[0065] Please refer to Figure 1 as well as Figure 2 , Figure 1 A schematic diagram of a top view of an electronic device 10 according to some embodiments of the present invention is shown. Figure 2 In some embodiments according to the present invention, Figure 1 Schematic diagram of the cross-sectional structure of the electronic device 10 along the section line A-A' in FIG. It should be understood that, for the sake of clarity, some components of the electronic device 10 may be omitted in the drawings, and only some components are schematically shown. According to some embodiments, additional features may be added to the electronic device 10 described below. According to other embodiments, some features of the electronic device 10 described below may be replaced or omitted.

[0066] The electronic device 10 includes at least one electrical connection structure 10E. The following description will be based on the electronic device 10 being a display device and the electrical connection structure 10E being applied to the display device, but the present invention is not limited thereto. It should be understood that the electrical connection structure 10E can also be applied to other suitable electronic devices to provide an electrical connection function.

[0067] like Figure 1 as well as Figure 2 As shown, according to some embodiments, the electronic device 10 may include a first substrate 100, a second substrate 200, an electronic component 400 and an electrical connection structure 10E. The second substrate 200 may be arranged opposite to the first substrate 100. The electronic component 400 may be arranged on the first substrate 100, and the electronic component 400 may be electrically connected to another electronic component (not shown, for example, a driving component, etc.) on the second substrate 200 through the electrical connection structure 10E. According to some embodiments, the electronic component 400 may include a light emitting diode, and the electronic device 10 is, for example, a light emitting diode display device. In this way, the electronic component 400 may be driven by another electronic component (not shown, for example, a driving component, etc.) arranged on the back side of the first substrate, thereby reducing the peripheral usage rate of the electronic device 10, thereby achieving the technical requirements of borderless, narrow border or seamless splicing, and having good display quality.

[0068] According to some embodiments, the first substrate 100 may be used as an active array substrate, for example, it may include a base (not shown) and a circuit component layer (not shown) disposed on the base. The base of the first substrate 100 may include a rigid substrate, a flexible substrate, or a combination thereof. According to some embodiments, the material of the base of the first substrate 100 may include glass, quartz, sapphire, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), polydimethylsiloxane (PDMS), other suitable base materials, or a combination thereof, but not limited thereto. Furthermore, the circuit component layer may include, for example, at least one or more circuit components (e.g., thin film transistors), a buffer layer, and a stack of multiple insulating layers, but not limited thereto. According to some embodiments, the circuit component layer is, for example, an active array layer composed of multiple thin film transistors, but not limited thereto.

[0069] Please continue to refer to Figure 1 as well as Figure 2According to some embodiments, one or more electronic components 400 may constitute a pixel, and a plurality of pixels (e.g., pixel PX1, pixel PX2) may be disposed on the first substrate 100. As mentioned above, the electronic component 400 may be a light emitting diode. In other words, according to some embodiments, each pixel may include a plurality of light emitting diodes (for convenience of description, Figure 1 The electronic components 400R, 400G and 400B are marked in FIG. 1 , and the number of light emitting diodes is not limited. For example, Figure 1 The two pixels PX1 and PX2 shown can be arranged in an array in the X direction and the Y direction in the figure (the X direction is perpendicular to the Y direction and the Z direction, and the Y direction is perpendicular to the X direction and the Z direction, but not limited to this). It should be understood that, Figure 1 The number of pixels and the pattern of arrangement shown are only examples. The actual number of pixels can be tens, tens of thousands, or millions or more, but is not limited thereto.

[0070] According to some embodiments, the plurality of light emitting diodes may include red light emitting diodes, green light emitting diodes, blue light emitting diodes, white light emitting diodes, yellow light emitting diodes or light emitting diodes of other colors, which may be adjusted according to design requirements. According to some embodiments, the aforementioned electronic components 400R, 400G and 400B may be used as sub-pixels, and a combination of a plurality of pixels PX1 and PX2 may be used to generate an image pattern. According to some embodiments, the number of the plurality of light emitting diodes in the pixels PX1 and PX2 may be three or more than three, and the color of the light emitting diode may include red light, blue light, green light, white light, yellow light or other suitable colors of light, but is not limited thereto.

[0071] According to some embodiments, the electronic component 400 may include an electrode 401a, an electrode 401b, and a main body 402. The main body 402 may include, for example, a first-type semiconductor layer (e.g., an N-type doped semiconductor layer), a second-type semiconductor layer (e.g., a P-type doped semiconductor layer), and a light-emitting layer located between the first-type semiconductor layer and the second-type semiconductor layer, that is, the main body 402 may be a PN light-emitting diode, but is not limited thereto. Furthermore, although the electronic component 400 in the accompanying drawings is a flip chip LED, the present invention is not limited thereto. In other embodiments, the electronic component 400 may also include a vertical LED, a front-mounted LED, or other suitable types of LED packages.

[0072] According to some embodiments, the electronic component 400 may be electrically connected to the circuit component layer of the first substrate 100. Specifically, a plurality of first pads 151 and a plurality of second pads 152 may be provided on the first substrate 100 or the circuit component layer. One of the plurality of light-emitting diodes is provided corresponding to the first pad 151 and the adjacent second pad 152. For example, the electrode 401a of the electronic component 400R may be electrically connected to the first pad 151, and the electrode 401b may be electrically connected to the second pad 152, but the present invention is not limited thereto. In this way, the first pad 151 and the second pad 152 may be used as pads connected to the positive or negative electrode of the electronic component 400, respectively. For example, the electronic component 400 may be electrically connected to the first pad 151 and the second pad 152 by wire bonding, flip chip die bonding, or eutectic die bonding. In addition, according to some other embodiments, the electronic component 400 can also be electrically connected to the circuit components (for example, thin film transistors) or the circuit layer in the circuit component layer through conductive lines by means of a transfer layer including conductive lines and an insulating layer, so that the electrode 401a and / or the electrode 402b are respectively electrically connected to the circuit components (for example, thin film transistors) or the circuit layer in the circuit component layer through conductive lines, but is not limited thereto.

[0073] According to some embodiments, the electronic device 10 may selectively include a first test pad 191 and a plurality of second test pads 192. The first test pad 191 and the plurality of second test pads 192 may be respectively disposed adjacent to one side of a pixel (e.g., pixel PX1), but not limited thereto. The first test pad 191 and the plurality of second test pads 192 may be electrically connected to the circuit component layer of the first substrate 100, but not limited thereto. The first test pad 191 may be connected in series to a plurality of first pads 151. The plurality of second test pads 192 may be respectively electrically connected to a plurality of second pads 152. According to some embodiments, the first test pad 191 and the plurality of second test pads 192 may be used as test electrodes for detecting the electrical quality of a plurality of electronic components 400 in the pixels PX1 and PX2.

[0074] The materials of the first test pad 191, the second test pad 192, the first pad 151, and the second pad 152 may include a conductive material. According to some embodiments, the materials of the first test pad 191, the second test pad 192, the first pad 151, and the second pad 152 may include a metal conductive material, such as molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), gold (Au), alloys of the aforementioned materials, other suitable conductive materials, or combinations thereof, but are not limited thereto. According to some embodiments, the materials of the first test pad 191, the second test pad 192, the first pad 151 and the second pad 152 may include a transparent conductive material. The transparent conductive material may include, for example, a transparent conductive oxide (TCO), such as indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or a combination thereof, but not limited thereto.

[0075] like Figure 2As shown, according to some embodiments, the electronic device 10 may further include a covering layer 104 disposed on the first substrate 100. Further, according to some embodiments, the covering layer 104 may be disposed on the electronic component layer of the first substrate 100, the covering layer 104 may cover the first test pad 191 and the second test pad 192, and may at least partially cover the electronic component 400. According to some embodiments, the covering layer 104 may cover a plurality of electronic components 400 and an electrical connection structure 10E. According to some embodiments, the covering layer 104 may cover the first test pad 191, the second test pad 192, a plurality of electronic components 400 and an electrical connection structure 10E, but not limited thereto. The covering layer 104 may play at least one of the functions of electrical insulation, protection of the above-mentioned related components covered, and surface flatness. The covering layer 104 may be formed by coating, jetting, dispensing, printing or other appropriate methods, but not limited thereto. According to some embodiments, the cover layer 104 may include an inorganic material, an organic material, or a combination thereof, but is not limited thereto. According to some embodiments, the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, other suitable materials, or a combination thereof, but is not limited thereto. According to some embodiments, the organic material may include, for example, perfluoroalkoxy alkane (PFA), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyethylene, silicone, acrylic, urethane or epoxy, other suitable materials, or a combination thereof, but is not limited thereto.

[0076] According to some embodiments, the second substrate 200 is disposed below the first substrate 100, and is located on two opposite surfaces of the first substrate 100 with the plurality of electronic components 400. The second substrate 200 can be used as a circuit substrate. According to some embodiments, the second substrate 200 can include a printed circuit board (PCB), a redistribution layer (RDL), or a combination thereof, but is not limited thereto. According to other embodiments, the second substrate 200 can include a chip on film (COF), but is not limited thereto.

[0077] Specifically, according to some embodiments, the second substrate 200 may include a base and a plurality of insulating layers and interconnect layers (eg, a patterned conductive layer) disposed on the base. Figure 2As shown, according to some embodiments, the electronic device 10 may further include an insulating layer 202 and a second conducting pad 210, and the insulating layer 202 and the second conducting pad 210 may also be a part of the insulating layer and the interconnect layer of the second substrate 200. The insulating layer 202 and the second conducting pad 210 may be disposed between the second substrate 200 and the first substrate 100. According to other embodiments, the second substrate 200 may be an interposer.

[0078] The base of the second substrate 100 may include a rigid substrate, a flexible substrate, or a combination thereof. According to some embodiments, the material of the base of the second substrate 100 may include glass, quartz, sapphire, polyimide (PI), polycarbonate (PC), polyethyleneterephthalate (PET), polypropylene (PP), polydimethylsiloxane (PDMS), other suitable base materials, or a combination thereof, but is not limited thereto.

[0079] According to some embodiments, the insulating layer 202 may include a polymer insulating material, such as an ABF build-up film (Ajinomoto Build-up Film, ABF), polyphenylene bis(phenylene sulfide), or poly(phenylene sulfide). Polybenzoxazole (PBO), polyimide (PI), photosensitive polyimide (PSPI), benzocyclobutene (BCB), film (PrePreg), photosensitive dielectric material (photoimageabledielectric, PID), resin coated cooper foil (RCC), flame resistant glass fiber (FR4), glass fiber resin composite material, other suitable insulating materials or combinations of the foregoing, but not limited thereto.

[0080] According to some embodiments, the electronic device 10 may further include an intermediate layer 102, and the intermediate layer 102 may be disposed between the first substrate 100 and the second substrate 200. In detail, a portion of the intermediate layer 102 may be disposed between the insulating layer 202 and the first substrate 100, and a portion of the intermediate layer 102 may be disposed between the second substrate 200 and the first substrate 100. According to some embodiments, the intermediate layer 102 may be an adhesive layer, and the first substrate 100 and the second substrate 200 may be combined, for example, it may be disposed on the second substrate 200 and then combined with the first substrate 100, or it may be disposed on the first substrate 100 and then combined with the second substrate 200. According to some embodiments, the material of the intermediate layer 102 may include an inorganic material, an organic material, or a combination thereof, but is not limited thereto. According to some embodiments, the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, other suitable materials, or a combination thereof, but is not limited thereto. According to some embodiments, the organic material may include, for example, perfluoroalkoxy alkane (PFA), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyethylene, other suitable materials, or a combination thereof, but not limited thereto. In addition, according to some embodiments, the intermediate layer 102 may include an adhesive material having a viscous property, such as optical clear adhesive (OCA), optical clear resin (OCR), pressure sensitive adhesive (PSA), acrylic adhesive, acrylic resin, other suitable materials, or a combination thereof, but not limited thereto. Furthermore, the intermediate layer 102 may have a single-layer or multi-layer structure.

[0081] In addition, the electronic device 10 includes at least one electrical connection structure 10E, and the electrical connection structure 10E can be disposed between the electronic components 400, for example, between two adjacent pixels PX1 and PX2, but is not limited thereto. In other words, according to some embodiments, the electrical connection structure 10E can be disposed in the active area and / or the peripheral area of ​​the electronic device 10. The electrical connection structure 10E can be applied to any suitable electronic device to provide an electrical connection function. The detailed structure of the electrical connection structure 10E will be described below.

[0082] Please refer to Figure 3 as well as Figure 4 , Figure 3 The cross-sectional structure diagram of the electrical connection structure 10E of the electronic device according to some embodiments of the present invention is shown. Figure 4The schematic diagram of the top view of some components of the electrical connection structure 10E of the electronic device according to some embodiments of the present invention is shown. Specifically, Figure 3 For along Figure 4 The cross-sectional structure diagram of the electrical connection structure 10E obtained by the section line BB'. Figure 4 Only the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure 10E are shown to facilitate the description of the positional relationship between them. Figure 4 The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0083] In addition, it should be understood that the components or components that are the same or similar to those described above will be represented by the same or similar numbers, and their materials and functions are the same or similar to those described above, so this part will not be repeated in the following text.

[0084] First, if Figure 3 As shown, the electrical connection structure 10E may include a first substrate 100 , a first conducting pad 110 , a second substrate 200 , a second conducting pad 210 , a through hole TH1 , and a conductive material CD.

[0085] The first conductive pad 110 may be disposed on the first substrate 100, and the first conductive pad 110 includes at least two sub-portions 110p, and the at least two sub-portions 110p respectively include a first upper surface 110t, a side surface 110s, and a lower surface 110b. According to some embodiments, the first conductive pad 110 may be disposed, for example, on the topmost insulating layer of the circuit component layer (not shown) of the first substrate 100, for example, the lower surface 110b of the sub-portion 110p of the first conductive pad 110 may contact the topmost insulating layer of the circuit component layer, but is not limited thereto.

[0086] The first conductive pad 110 may include a conductive material. According to some embodiments, the material of the first conductive pad 110 may include a metal conductive material, such as molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), gold (Au), alloys of the foregoing materials, other suitable conductive materials, or combinations thereof, but not limited thereto. According to some embodiments, the material of the first conductive pad 110 may include a transparent conductive material, and the transparent conductive material may include, for example, a transparent conductive oxide (TCO), but not limited thereto.

[0087] The second conducting pad 210 may be disposed on the second substrate 200, the second conducting pad 210 includes an upper surface 210t, and the second conducting pad 210 may be disposed on the second substrate 200. According to some embodiments, the second conducting pad 210 may be a part of the interconnect layer of the second substrate 200, but is not limited thereto. According to some embodiments, the second conducting pad 210 may be further electrically connected to an electronic component (not shown, for example, a driving component) disposed on the second substrate 200.

[0088] Furthermore, the material of the second conducting pad 210 may be the same as or similar to that of the first conducting pad 110 , and will not be repeated here.

[0089] According to some embodiments, the electrical connection structure 10E may further include an intermediate layer 102 . The intermediate layer 102 may be disposed between the first substrate 100 and the second substrate 200 and partially cover the second conducting pad 210 .

[0090] The through hole TH1 may pass through the first substrate 100. According to some embodiments, the through hole TH1 may pass through the first substrate 100 and the intermediate layer 102 and expose a portion of the upper surface 210t of the second conducting pad 210. Figure 4As shown, in the top view, the conductive material CD may be partially disposed in the through hole TH1 and contact at least one first upper surface 110t of the sub-portion 110p of the first conductive pad 110 and the upper surface 210t of the second conductive pad 210. The first conductive pad 110 may be electrically connected to the second conductive pad 210 through the through hole TH1, and the conductive material CD may pass through the through hole TH1, so that the first conductive pad 110 and the second conductive pad 210 are electrically connected. According to some embodiments, the first conductive pad 110 may be electrically connected to the second conductive pad 210 through at least one of the two sub-portions 110p. According to some embodiments, the conductive material CD may contact the upper surface 110t, the side surface 110s of the sub-portion 110p of the first conductive pad 110, and the upper surface 210t of the second conductive pad 210. According to some embodiments, the conductive material CD may contact the upper surface 110 t of the sub-portion 110 p of the first conductive pad 110 , the side surface 110 s , the first substrate 100 , the intermediate layer 102 , and the upper surface 210 t of the second conductive pad 210 .

[0091] like Figure 3 As shown, according to some embodiments, the side surface THs of the through hole TH1 may be substantially perpendicular to the upper surface 210t of the second conducting pad 210. According to other embodiments, the side surface THs of the through hole TH1 may not be perpendicular to the upper surface 210t of the second conducting pad 210, that is, the side surface THs of the through hole TH1 may be inclined, for example, it may be inclined inward (the top width of the through hole TH1 is smaller than the bottom width), or it may be inclined outward (the top width of the through hole TH1 is larger than the bottom width). According to some embodiments, the side surface THs of the through hole TH1 may have an irregular sidewall, but is not limited thereto.

[0092] Furthermore, the conductive material CD may be filled into a portion of the through hole TH1 or may fill up the through hole TH1. For example, according to some embodiments (not shown), during the process of filling the conductive material CD into the through hole TH1, a gap may be provided between the side surface of the conductive material CD in the through hole TH1 and the side surface THs of the through hole TH1. According to some embodiments (not shown), a portion of the side surface of the conductive material CD may not contact the side surface THs of the through hole TH1 and / or the side surface 102s of the intermediate layer 102. In the process of setting the conductive material CD in the through hole TH1, the generated air bubbles may be released through the gap between the side surface of the conductive material CD and the side surface THs of the through hole TH1. Thereby, the risk of bubbles generated in the conductive material CD may be reduced, thereby reducing the problem of poor contact or electrical abnormality between the conductive material CD and the first conductive pad 110 or the second conductive pad 210.

[0093] According to some embodiments, a portion of the first substrate 100 and the intermediate layer 102 may be removed by one or more photolithography processes and / or etching processes to form the through hole TH1. According to some embodiments, the photolithography process may include photoresist coating (e.g., spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning and drying, etc., but is not limited thereto. The etching process may include a dry etching process or a wet etching process, but is not limited thereto.

[0094] Furthermore, the conductive material CD may include a conductive material. According to some embodiments, the material of the conductive material CD may include silver paste, copper paste, conductive solder, other suitable conductive materials or a combination thereof, but is not limited thereto. According to some embodiments, the conductive material CD may be disposed in the through hole TH1 by solder paste printing, micro inkjet printing (MJP) process, chemical vapor deposition (CVD) process, physical vapor deposition (physical vapor deposition) process, electroplating process, electroless plating process, other suitable methods or a combination thereof.

[0095] As mentioned above, the first conductive pad 110 includes at least two sub-parts 110p. According to some embodiments, Figure 4 As shown, the aforementioned at least two sub-portions 110p are separated from each other, and the sub-portion 110p may be disposed at the periphery of the through-hole TH1. In other words, the sub-portion 110p of the first conductive pad 110 may not completely surround the through-hole TH1. According to some embodiments, the two sub-portions 110p may, for example, be disposed opposite to each other, or symmetrically disposed on both sides of the geometric center (not shown) of the through-hole TH1, but are not limited thereto. According to some embodiments, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conductive pad 110 does not overlap with the geometric center of the through-hole TH1.

[0096] It is worth noting that since the first conductive pad 110 is usually formed of a metal material with higher hardness, if the sub-portion 110p is set in the area corresponding to the center of the through hole TH1, it may be detrimental to the drilling process for forming the through hole. Therefore, setting the sub-portion 110 of the first conductive pad 110 in the peripheral area of ​​the through hole TH1 can improve the yield of the drilling process.

[0097] According to some embodiments, in a top view or in a normal direction of the first substrate 100 (e.g., the Z direction in the figure), the conductive material CD at least partially overlaps with at least one of the sub-portions 110p of the first conductive pad 110. According to some embodiments, the outer edge Tu of the through hole TH1 may be at least partially aligned with the outer edge 110u of at least one of the sub-portions 110p. It is desirable that the outer edge Tu of the through hole TH1 may be aligned with the outer edge 110u of at least one of the sub-portions 110p in design. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in a top view, the outer edge Tu of the through hole TH1 and the outer edge 110u of at least one of the sub-portions 110p at least partially overlap or are slightly misaligned (not shown). According to some embodiments, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may be substantially the same as the curvature of the inner edge 110i.

[0098] Furthermore, the sub-portions 110p may have the same or different shapes. According to some embodiments, the sub-portion 110p of the first conductive pad 110 may have an arc-shaped, curved or concave profile, but is not limited thereto. Specifically, according to some embodiments, the inner edge 110i and / or the outer edge 110u of the sub-portion 110p may have an arc-shaped, curved or concave profile. According to some embodiments, in a top view, the sub-portion 110p of the first conductive pad 110 may have rounded corners (not shown), and the rounded corners may be, for example, disposed at one, two, three or four corners of the sub-portion 110p, but is not limited thereto. Furthermore, the through hole TH1 may have a main portion similar to a circle and two fan-shaped portions connected to the main portion.

[0099] In addition, it should be understood that the number of sub-portions 110p of the first conductive pad 110 is not limited to two, and the first conductive pad 110 may have any suitable number of sub-portions 110p, for example, three, four, five, six, seven, eight, nine, ten, eleven or twelve, etc., but is not limited thereto.

[0100] It is worth noting that, in addition to providing longitudinal electrical connection by conducting with the second conductive pad 210 through the conductive material CD, the sub-portions 110p of the first conductive pad 110 can also be used as multiple terminals for providing lateral electrical connection, increasing the contact points between the conductive material CD and the first conductive pad 110, and reducing the difficulty of the wiring process of the electrical connection structure. In particular, the multiple sub-portions 110p of the first conductive pad 110 can also make the filling process of the conductive material CD and / or the process of the through hole TH1 have a larger allowable error value, thereby improving the process yield. In addition, by configuring the multiple sub-portions 110p of the first conductive pad 110, the total area of ​​the first conductive pad 110 can be relatively reduced, the volume of the through hole TH1 and / or the conductive material can be maintained or increased, and the reliability of the electrical connection structure can be improved.

[0101] Next, please refer to FIG. 5A to FIG. 5E , FIG. 5A to FIG. 5E The schematic diagram of the top view of some components of the electrical connection structure of the electronic device according to some other embodiments of the present invention is shown. FIG. 5A to FIG. 5E The figure only shows the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure to facilitate the description of the positional relationship between them. FIG. 5A to FIG. 5E The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0102] Please refer to Figure 5AIn this embodiment, the first conductive pad 110 has two sub-portions 110p, which are separated from each other. The sub-portions 110p may be disposed at the periphery of the through-hole TH1. Furthermore, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conductive pad 110 does not overlap with the geometric center of the through-hole TH1, and the conductive material CD at least partially overlaps with the sub-portion 110p of the first conductive pad 110. In this embodiment, the outer edge Tu of the through-hole TH1 may be at least partially aligned with the outer edge 110u of the sub-portion 110p. It is desirable that the outer edge Tu of the through hole TH1 can be aligned with the outer edge 110u of at least one of the sub-portions 110p in design. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in the top view, the outer edge Tu of the through hole TH1 and the outer edge 110u of at least one of the sub-portions 110p are at least partially overlapped or slightly misaligned (not shown). In addition, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may be substantially the same as the curvature of the inner edge 110i, and the inner edge 110i and / or the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may have an arc-shaped, curved or concave profile. In this embodiment, the through hole TH1 may have a main portion similar to a circle and two rectangular portions connected to the main portion.

[0103] Please refer to Figure 5BIn this embodiment, the first conductive pad 110 has two sub-portions 110p, which are separated from each other. The sub-portions 110p may be disposed at the periphery of the through-hole TH1. Furthermore, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conductive pad 110 does not overlap with the geometric center of the through-hole TH1, and the conductive material CD at least partially overlaps with the sub-portion 110p of the first conductive pad 110. In this embodiment, the outer edge Tu of the through-hole TH1 may be at least partially aligned with the inner edge 110i of the sub-portion 110p. It is desirable that the outer edge Tu of the through hole TH1 can be aligned with the inner edge 110i of at least one of the sub-portions 110p in design. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in the top view, the outer edge Tu of the through hole TH1 and the inner edge 110i of at least one of the sub-portions 110p are at least partially overlapped or slightly misaligned (not shown). In other words, compared with the outer edge 110u of the sub-portion 110p, the outer edge Tu of the through hole TH1 can be retracted. In addition, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 can be substantially the same as the curvature of the inner edge 110i, and the inner edge 110i and / or the outer edge 110u of the sub-portion 110p of the first conductive pad 110 can have an arc-shaped, curved or concave profile. In this embodiment, the through hole TH1 can have a shape similar to a circle.

[0104] Please refer to Figure 5CIn this embodiment, the first conductive pad 110 has two sub-portions 110p, which are separated from each other. The sub-portions 110p may be disposed at the periphery of the through-hole TH1. Furthermore, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conductive pad 110 does not overlap with the geometric center of the through-hole TH1, and the conductive material CD at least partially overlaps with the sub-portion 110p of the first conductive pad 110. In this embodiment, the outer edge Tu of the through-hole TH1 may be at least partially aligned with the outer edge 110u of the sub-portion 110p. It is desirable that the outer edge Tu of the through hole TH1 can be aligned with the outer edge 110u of at least one of the sub-portions 110p in design. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in the top view, the outer edge Tu of the through hole TH1 and the outer edge 110u of at least one of the sub-portions 110p are at least partially overlapped or slightly misaligned (not shown). In addition, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may be substantially the same as the curvature of the inner edge 110i, and the inner edge 110i and / or the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may have an arc-shaped, curved or concave profile. In this embodiment, the through hole TH1 may have a main portion similar to a circle and two fan-shaped portions connected to the main portion.

[0105] Please refer to Figure 5DIn this embodiment, the first conductive pad 110 has three sub-portions 110p, which are separated from each other. The sub-portions 110p may be disposed at the periphery of the through-hole TH1. Furthermore, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conductive pad 110 does not overlap with the geometric center of the through-hole TH1, and the conductive material CD at least partially overlaps with the sub-portion 110p of the first conductive pad 110. In this embodiment, the outer edge Tu of the through-hole TH1 may be at least partially aligned with the outer edge 110u of the sub-portion 110p. It is desirable that the outer edge Tu of the through hole TH1 can be aligned with the outer edge 110u of at least one of the sub-portions 110p. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in the top view, the outer edge Tu of the through hole TH1 and the outer edge 110u of at least one of the sub-portions 110p are at least partially overlapped or slightly misaligned (not shown). In addition, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may be substantially the same as the curvature of the inner edge 110i, and the inner edge 110i and / or the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may have an arc-shaped, curved or concave profile. In this embodiment, the through hole TH1 may have a main portion similar to a circle and three sector portions connected to the main portion.

[0106] Please refer to Figure 5EIn this embodiment, the first conducting pad 110 has ten sub-portions 110p, which are separated from each other. The sub-portions 110p may be disposed at the periphery of the through-hole TH1. Furthermore, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the inner edge 110i of the sub-portion 110p of the first conducting pad 110 does not overlap with the geometric center of the through-hole TH1, and the conductive material CD at least partially overlaps with the sub-portion 110p of the first conducting pad 110. In this embodiment, the outer edge Tu of the through-hole TH1 may be at least partially aligned with the outer edge 110u of the sub-portion 110p. It is desirable that the outer edge Tu of the through hole TH1 can be aligned with the outer edge 110u of at least one of the sub-portions 110p in design. However, in the process, such as the process of the through hole TH1 and / or the first conductive pad 110, there is a process tolerance between the design value and the actual value. According to some embodiments, in the top view, the outer edge Tu of the through hole TH1 and the outer edge 110u of at least one of the sub-portions 110p are at least partially overlapped or slightly misaligned (not shown). In addition, the curvature of the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may be substantially the same as the curvature of the inner edge 110i, and the inner edge 110i and / or the outer edge 110u of the sub-portion 110p of the first conductive pad 110 may have an arc-shaped, curved or concave profile. In this embodiment, the through hole TH1 may have a main portion similar to a circle and ten sector portions connected to the main portion.

[0107] Next, please refer to FIG. 6A to FIG. 6C , FIG. 6A to FIG. 6C The schematic diagram of the top view of some components of the electrical connection structure of the electronic device according to some other embodiments of the present invention is shown. FIG. 6A to FIG. 6C Only the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure are shown to facilitate the description of the positional relationship between them. FIG. 6A to FIG. 6C The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0108] like FIG. 6A to FIG. 6CAs shown, according to some embodiments, the first conductive pad 110 may further include a connecting portion 111, and the connecting portion 111 is connected to at least two sub-portions 110p. According to some embodiments, the connecting portion 111 may be electrically connected to the sub-portion 110p. According to some embodiments, the connecting portion 111 may contact with at least two sub-portions 110p and connect the at least two sub-portions 110p in series. The connecting portion 111 may be disposed at the periphery of the sub-portion 110p. In addition, according to some embodiments, the connecting portion 111 at least partially surrounds the through hole TH1, and the connecting portion 111 may only partially surround the through hole TH1 but not completely surround the through hole TH1. In other words, the first conductive pad 110 may further include a notch portion 110n, the notch portion 110n is adjacent to the connecting portion 111, and the connecting portion 111 partially surrounds the through hole, and the notch portion 110n may be located between the end portions 111e of the connecting portion 111. The notch portion 110n can discharge bubbles generated during the process.

[0109] According to some embodiments, in the top view, the shape of the connection portion 111 may be a ring with a gap. In addition, it should be understood that although the connection portion 111 in the drawings has only one gap portion 110n, according to different embodiments, the connection portion 111 may have other suitable numbers and / or other suitable sizes of gap portions 110n. Furthermore, according to some embodiments, in the normal direction of the first substrate 100 (for example, the Z direction in the drawings), the conductive material CD may overlap with the connection portion 111 in addition to overlapping with the sub-portion 110p of the first conductive pad 110.

[0110] Please refer to Fig. 6A In this embodiment, the first conducting pad 110 has two sub-portions 110p, and the two sub-portions 110p are connected to the connecting portion 111. In this embodiment, the end 111e of the connecting portion 111 is not flush with the side surface 110s of the sub-portion 110p, and the end 111e of the connecting portion 111 protrudes from the side surface 110s of the sub-portion 110p. In other words, the end 111e of the connecting portion 111 may have an overhang structure.

[0111] Please refer to Figure 6B In this embodiment, the first conducting pad 110 has three sub-portions 110p, and the three sub-portions 110p are connected to the connecting portion 111. In this embodiment, the end 111e of the connecting portion 111 is substantially flush with the side surfaces 110s of two of the sub-portions 110p.

[0112] Please refer to Figure 6CIn this embodiment, the first conducting pad 110 has ten sub-portions 110p, and the ten sub-portions 110p are connected to the connecting portion 111. In this embodiment, the end 111e of the connecting portion 111 is substantially flush with the side surfaces 110s of two of the sub-portions 110p.

[0113] It is worth noting that the impedance of the first conductive pad 110 can be further reduced by setting the connecting portion 111. When the conductive material CD contacts the sub-portion 110p and / or the connecting portion 111 of the first conductive pad 110, the contact impedance between the sub-portion 110p and / or the connecting portion 111 and the conductive material can be reduced.

[0114] Please refer to Figure 7 as well as FIG. 8A to FIG. 8C , Figure 7 The cross-sectional structure diagram of the electrical connection structure 10E of the electronic device according to some other embodiments of the present invention is shown. FIG. 8A to FIG. 8C The schematic diagram of the top view of some components of the electrical connection structure 10E of the electronic device according to some other embodiments of the present invention is shown. Specifically, Figure 7 For along FIG. 8A to FIG. 8C The cross-sectional structure diagram of the electrical connection structure 10E obtained by the section line CC'. FIG. 8A to FIG. 8C Only the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure 10E are shown to facilitate the description of the positional relationship between them. FIG. 8A to FIG. 8C The top view shown corresponds substantially to Figure 7 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0115] like FIG. 8A to FIG. 8C As shown, according to some embodiments, the first conductive pad 110 may further include a connecting portion 111, and the connecting portion 111 is connected to at least two sub-portions 110p. The connecting portion 111 may contact with at least two sub-portions 110p and connect the at least two sub-portions 110p in series. The connecting portion 111 may be disposed at the periphery of the sub-portion 110p. In addition, according to some embodiments, the connecting portion 111 may completely surround the through hole TH1, in other words, the first conductive pad 110 may not have a notch portion 110n. In the top view, the shape of the connecting portion 111 may be annular. According to some embodiments, the entirety of the first conductive pad 110 (including the sub-portion 110p and the connecting portion 111) may substantially have a symmetrical structure. Furthermore, according to some embodiments, in the normal direction of the first substrate 100 (for example, the Z direction in the figure), the conductive material CD may partially overlap with the connecting portion 111 in addition to overlapping with the sub-portion 110p of the first conductive pad 110.

[0116] Similarly, the provision of the annular connecting portion 111 can further reduce the impedance of the first conductive pad 110. When the conductive material CD contacts the sub-portion 110p and / or the connecting portion 111 of the first conductive pad 110, the contact impedance between the sub-portion 110p and / or the connecting portion 111 and the conductive material can be reduced.

[0117] Please refer to Fig. 9 , Fig. 9 A schematic cross-sectional structure diagram of an electronic device 20 is shown according to some other embodiments of the present invention. It should be understood that for the sake of clarity, some components of the electronic device 20 may be omitted in the drawings, and only some components are schematically shown. According to some embodiments, additional features may be added to the electronic device 20 described below. According to other embodiments, some features of the electronic device 20 described below may be replaced or omitted.

[0118] like Fig. 9 As shown, according to some embodiments, the electronic device 20 includes an electrical connection structure 10E-1 and an electrical connection structure 10E-2. Specifically, the electrical connection structure 10E-1 and the electrical connection structure 10E-2 Figure 2 The electrical connection structure 10E in the illustrated embodiment is substantially the same as Figure 2 Compared to the electronic device 10 shown, the electronic device 20 further includes an electrical connection structure 10E-2, which can be electrically connected to the electrical connection structure 10E-1. According to some embodiments, in the normal direction of the first substrate 100 (e.g., the Z direction in the figure), the electrical connection structure 10E-2 and the electrical connection structure 10E-1 at least partially overlap.

[0119] In detail, according to some embodiments, the electrical connection structure 10E-2 may include a third substrate 300, a third conductive pad 310, and a through hole TH2, the third conductive pad 310 may be disposed between the third substrate 300 and the second conductive pad 210, the through hole TH2 may pass through the second substrate 200, and the third conductive pad 310 may be electrically connected to the second conductive pad 210 through the through hole TH2. In detail, a conductive material is also disposed in the through hole TH2, and the third conductive pad 310 may be electrically connected to the second conductive pad 210 through the conductive material disposed in the through hole TH2.

[0120] The materials of the third substrate 300 and the third conducting pad 310 may be the same as or similar to the materials of the second substrate 200 and the second conducting pad 210 , and will not be repeated here.

[0121] Furthermore, the electronic device 20 may include an electronic component 400 and a driving component 302, the electronic component 400 may be disposed on the first substrate 100, the driving component 302 may be disposed on the third substrate 300, and the driving component 302 may be electrically connected to the electronic component 400 by means of the electrical connection structure 10E-1 and the electrical connection structure 10E-2. As mentioned above, according to some embodiments, the electronic component 400 may include a light emitting diode, but is not limited thereto. Furthermore, according to some embodiments, the driving component 302 may include an integrated circuit chip (IC), a microchip, or other suitable electronic driving components that can provide electronic signals or logic signals, but is not limited thereto. According to some embodiments, the driving component 302 may be disposed on the third substrate 300 in the form of a chip on film (COF) or a chip on glass (COG), but is not limited thereto.

[0122] The conductive material CD of the electronic device 20 can be electrically connected to the second conductive pad 210 and the third conductive pad 310 through the through hole TH1 and the through hole TH2, and then electrically connected to the driving component 302 on the third substrate 300. Through the above configuration, the driving signal of the driving component 302 can provide the driving signal to the first conductive pad 110 and the plurality of electronic components 400 through the conductive path formed by the conductive material CD, the second conductive pad 210 and the third conductive pad 310. When the electronic device 20 is applied to the field of display equipment, the driving signal of the driving component 302 can be transmitted from one side of the first substrate 100 to the plurality of electronic components 400 on the opposite side through the electrical connection structure 10E-1 and the electrical connection structure 10E-2. Therefore, the driving component 302 can be disposed on the back side of the first substrate 100, thereby reducing the peripheral usage rate of the electronic device 20, thereby achieving the technical requirements of no border, narrow border or seamless splicing, and having good display quality.

[0123] In addition, according to some other embodiments, the aforementioned electrical connection structure can also be applied to a splicing device to provide electrical connection between different parts of the splicing device. Furthermore, the electrical connection structure can be used to provide conduction between any suitable number of substrates, and the number of the electrical connection structure and the substrates is not limited to those shown in the drawings of this case.

[0124] In summary, according to an embodiment of the present invention, the conductive pad of the provided electrical connection structure has a plurality of sub-parts, which can be used as a plurality of terminals for the conductive pad to be electrically connected laterally, thereby increasing the contact points between the conductive material and the conductive pad, reducing the difficulty of the wiring process of the electrical connection structure, and making the conductive material filling and / or perforation process have a larger allowable error value, thereby improving the process yield. In addition, by configuring the aforementioned conductive pad, the total area of ​​the conductive pad can be relatively reduced, the volume of the perforation and / or the conductive material can be maintained or increased, and the electrical connection structure can have an improved reliability, and is conducive to miniaturization of the electrical connection structure.

[0125] Although the embodiments of the present invention and its advantages have been invented as above, it should be understood that any person with ordinary knowledge in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. The features between the embodiments of the present invention can be mixed and matched as needed as long as they do not violate the spirit of the invention or conflict with each other. In addition, the protection scope of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present invention. As long as the same functions can be implemented in the embodiments described here or the same results can be obtained, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. The protection scope of the present invention shall be defined by the claims attached above. Any embodiment or claim of the present invention does not need to achieve all the purposes, advantages and features disclosed in the present invention.

Claims

1. An electronic device, characterized in that: include: At least one electrical connection structure, wherein the at least one electrical connection structure comprises: a first substrate; A first conducting pad is disposed on the first substrate, wherein the first conducting pad includes at least two sub-portions, and the at least two sub-portions respectively include a first upper surface; a second substrate; a second conducting pad disposed on the second substrate, wherein the second conducting pad includes a second upper surface; a through hole passing through the first substrate and exposing a portion of the second upper surface; and A conductive material is partially disposed in the through hole and contacts at least one first upper surface and the second upper surface.

2. The electronic device according to claim 1, wherein: The at least two sub-portions are separate from each other.

3. The electronic device according to claim 1, wherein: The first conducting pad further includes a connecting portion connected to the at least two sub-portions.

4. The electronic device as claimed in claim 3, characterized in that: The connecting portion contacts the at least two sub-portions and connects the at least two sub-portions in series.

5. The electronic device according to claim 1, wherein: The first conducting pad includes a connecting portion, and the connecting portion at least partially surrounds the through hole.

6. The electronic device as claimed in claim 5, characterized in that: The first conducting pad further includes a notch portion, the notch portion is adjacent to the connecting portion, and the connecting portion partially surrounds the through hole.

7. The electronic device as claimed in claim 5, characterized in that: The connecting portion completely surrounds the through hole.

8. The electronic device as claimed in claim 1, wherein: Also includes: An intermediate layer is disposed between the first substrate and the second substrate and partially covers the second conducting pad, wherein the through hole passes through the first substrate and the intermediate layer and exposes a portion of the second upper surface.

9. The electronic device as claimed in claim 1, wherein: The first conducting pad is electrically connected to the second conducting pad via at least one of the at least two sub-portions.

10. The electronic device according to claim 1, wherein: An outer edge of the perforation is at least partially aligned with an outer edge of at least one of the at least two sub-portions.

11. The electronic device according to claim 1, wherein: An outer edge of the perforation is at least partially aligned with an inner edge of at least one of the at least two sub-portions.

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