Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a display area and a non-display area, the non-display area comprises an ear area and a bending area, and the ear area is located between the display area and the bending area; the display panel comprises an insulating layer located in an ear area, and the insulating layer is provided with a groove; the metal layer is located on the surface of one side of the insulating layer, the first edge of the metal layer extends into the groove and covers the two opposite groove walls of the groove, and the first edge is at least part of the edge of the metal layer; wherein an included angle formed between the end face of the first end portion of the metal layer and the plane where the insulating layer is located is larger than 90 degrees, and the end face of the first end portion of the metal layer is provided with an etching opening; the packaging layer is positioned on the surface of one side, far away from the insulating layer, of the metal layer and covers the first end part of the metal layer; therefore, the packaging performance of the OLED display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are widely used in display devices such as mobile phones, tablet computers, and televisions due to their advantages of being thin, light, bright, fast, flexible, and highly efficient. However, OLED display panels are sensitive to water vapor and oxygen. In related technologies, due to poor packaging performance of OLED display panels, water and oxygen invade the OLED display panels, thereby affecting the display performance and display effect of the OLED display panels. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel and a display device that can improve the packaging performance of the OLED display panel in order to solve the above technical problems.

[0004] In a first aspect, the present application provides a display panel, the display panel comprising a display area and a non-display area, the non-display area comprising an ear area and a bending area, the ear area being located between the display area and the bending area; wherein the display panel comprises:

[0005] an insulating layer, at least partly located in the ear region, the insulating layer being provided with a groove;

[0006] A metal layer is located on one side surface of the insulating layer, wherein a first edge of the metal layer extends into the groove and covers two opposite groove walls of the groove, and the first edge is at least a partial edge of the metal layer; wherein an angle formed by a side surface of the first edge of the metal layer and a plane where the insulating layer is located is greater than 90 degrees, and an etching opening is provided on the side surface of the first edge of the metal layer;

[0007] The encapsulation layer is located on a surface of the metal layer away from the insulating layer and covers a first edge of the metal layer.

[0008] In one embodiment, the metal layer includes a first metal sublayer, a second metal sublayer and a third metal sublayer sequentially stacked on a surface of one side of the insulating layer;

[0009] At least one of the side surface of the first sub-edge of the first metal sub-layer, the side surface of the first sub-edge of the second metal sub-layer, and the side surface of the first sub-edge of the third metal sub-layer has the etching opening.

[0010] In one of the embodiments, the side surface of the first sub-edge of the second metal sub-layer has the etching opening, wherein the material of the second metal sub-layer includes aluminum.

[0011] In one of the embodiments, in the row direction, the metal layer includes a first region, a second region and a third region spaced apart from each other, and the second region is located between the first region and the third region;

[0012] In the row direction, at least one of two edges of the second region, an edge of the first region close to the second region, and an edge of the third region close to the second region includes the first edge, and the groove corresponds to the first edge one by one.

[0013] In one embodiment, the second area is used to connect to a first power line, and the first area and the third area are used to connect to two ends of the second power line respectively, wherein the second power line has a different potential from the first power line;

[0014] In one embodiment, the non-display area also includes a bonding area, the bending area is located between the ear area and the bonding area, a bonding pin is provided in the bonding area, and the first area, the second area and the third area are also used to extend from the ear area to pass through the bending area and are respectively connected to the corresponding bonding pins.

[0015] In one of the embodiments, the display panel further includes a planarization layer, and portions of the first region, the second region, and the third region except the first edge are all covered by the planarization layer.

[0016] In one of the embodiments, the orthographic projection of the side surface of the first edge in a direction perpendicular to the display panel is located within the orthographic projection of the groove wall in a direction perpendicular to the display panel.

[0017] In one of the embodiments, an upper surface of a portion of the first edge located in the groove is flush with a surface of the insulating layer close to the metal layer.

[0018] In one of the embodiments, a cross-section of the groove along a row direction of the display panel is in an inverted trapezoidal shape.

[0019] In a second aspect, the present application further provides a display device, comprising a display panel as provided in any of the above embodiments.

[0020] The above-mentioned display panel and display device, wherein the display panel includes a display area and a non-display area, and the non-display area includes a bending area and an ear area. The ear area is located between the display area and the bending area, and the ear area includes an insulating layer, a metal layer and a packaging layer stacked in sequence, and the side of the first edge of the metal layer has an etching opening. By arranging a groove in the insulating layer, the first edge of the metal layer can extend into the groove and cover the two groove walls opposite to the groove. The first edge is at least a part of the edge of the metal layer, and the angle between the side of the first edge of the metal layer and the plane where the insulating layer is located can be greater than 90 degrees, so that when the packaging layer covers the first edge of the metal layer, it is easy to completely fill the etching opening on the side, thereby inhibiting water oxygen from entering the display panel along the etching opening on the side and corroding the display panel. The embodiment of the present application improves the packaging performance of the display panel, thereby improving the display performance and effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] FIG1 is a schematic diagram of a display panel in the related art;

[0023] Figure 2 It is one of the enlarged views of the area within the dotted circle in Figure 1;

[0024] FIG3 is a second enlarged view of the area within the dotted circle in FIG1 ;

[0025] FIG4 is a cross-sectional view of FIG3 taken along line CC';

[0026] Figure 5 The second cross-sectional view along line CC' in FIG. 3 ;

[0027] Figure 6 This is one of the partial enlarged views of the non-display area of ​​the display panel in one embodiment;

[0028] Figure 7 The second partial enlarged view of the non-display area of ​​the display panel in one embodiment;

[0029] Figure 8 The third partial enlarged view of the non-display area of ​​the display panel in one embodiment;

[0030] Fig. 9 for Figure 8 One of the sections along line DD';

[0031] Fig.10 for Figure 8 Section 2 along line DD';

[0032] Fig.11 for Figure 8 Section 3 along line DD';

[0033] Fig.12 for Figure 8 Section 4 along line DD'.

[0034] Figure markings: display area-AA, non-display area-NAA, ear area-E, bending area-W, bonding area-B, bonding pin-Pad, fourth metal layer-120, insulating layer-210, groove-2101, metal layer-220, first end portion-2201, etching opening-22011, first area-221, second area-222, third area-223, first metal sublayer-224, second metal sublayer-225, third metal sublayer-226, planarization layer-230, chemical vapor deposition layer-240. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0036] 1 , generally, an OLED display device includes an OLED display panel including a display area AA and a non-display area NAA adjacent to the display area AA.

[0037] The display area AA includes an array substrate and a light emitting unit located on the array substrate. The array substrate includes a substrate and a plurality of pixel circuits arranged in an array on the substrate.

[0038] The substrate may also be located in the non-display area NAA. The substrate may be a hard substrate, and the material of the hard substrate may include glass and / or quartz, etc. The substrate may be a flexible substrate, and the material of the flexible substrate may include an organic polymer material, and the organic polymer material may include at least one of polyimide (PI), polyethylene terephthalate, polyethylene naphthalate, polyethylene, polyacrylate, polyetherimide, polycarbonate, polyarylate, and polyethersulfone.

[0039] The pixel circuit includes a plurality of thin film transistors (TFT) for controlling the light-emitting unit. The plurality of thin film transistors may be manufactured using LTPS (Low Temperature Poly Silicon) and / or IGZO (Indium Gallium Zinc Oxide) technology. The thin film transistor includes an active layer, a gate layer and a source-drain layer stacked in sequence, wherein the active layer includes a source region and a drain region, and the source region and the drain region are electrically connected to the source-drain layer, respectively. An insulating layer is generally provided between the active layer and the gate layer, between the gate layer and the source-drain layer, and between the source-drain layer and the metal wiring layer in the OLED display panel. The material of each insulating layer may be silicon oxide (SiO) and / or silicon nitride (SiN). See FIG. Figure 2 The stack of all insulating layers is indicated by reference numeral 110 .

[0040] Among them, the gate layer may be composed of part of the first metal layer, the source and drain layer may be composed of part of the third metal layer, and the metal wiring layer may be composed of part of the fourth metal layer. The insulating layer between the active layer and the gate layer may be a gate dielectric layer (GI), the insulating layer between the gate layer and the source and drain layer may be an interlayer dielectric layer (ILD), and the insulating layer between the source and drain layer and the metal wiring layer may also be an interlayer dielectric layer (ILD); the above-mentioned insulating layers between the active layer and the gate layer, between the gate layer and the source and drain layer, and between the source and drain layer and the metal wiring layer are respectively located between the active layer and the first metal layer, between the first metal layer and the third metal layer, and between the third metal layer and the fourth metal layer, and the insulating layers generally extend from the display area AA to the non-display area NAA, and are stacked in sequence on the substrate of the non-display area NAA.

[0041] The fourth metal layer is located not only in the display area AA, but also in the non-display area NAA. The fourth metal layer located in the display area AA is mainly used to form a metal wiring layer, and the metal wiring layer includes a plurality of metal wirings for transmitting signals to the pixel circuit; continue to refer to Figure 2 The fourth metal layer 120 located in the non-display area NAA has various uses, for example, it is used to connect the first power line ELVDD and the second power line ELVSS located in the non-display area NAA to the corresponding bonding pins Pad.

[0042] The array substrate may further include a planarization layer covering the pixel circuit and the substrate to improve the flatness of the array substrate. The planarization layer is located not only in the display area AA, but also in the non-display area NAA. FIG. 3 only illustrates the planarization layer 130 of the non-display area NAA. The planarization layer 130 of the non-display area NAA may cover the fourth metal layer 120 of the non-display area NAA. The material of the planarization layer 130 may be an organic glue.

[0043] The light-emitting unit includes an anode, an OLED organic light-emitting layer and a cathode which are stacked in sequence. The anode can be located on the planarization layer; the anode can be arranged corresponding to the thin film transistor in the pixel circuit, for example, an anode can be connected to a thin film transistor in the corresponding pixel circuit through a via in the planarization layer, and the switch of the corresponding thin film transistor in the pixel circuit can control whether to energize the anode, thereby controlling the light emission of the light-emitting unit to which the anode belongs. The material of the anode is generally a material with a higher work function in order to improve the hole injection efficiency, which can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO) and / or a transparent conductive polymer (such as polyaniline), etc. The anode is generally obtained by etching the entire anode layer. The anode layer can be located on the planarization layer, and at least in the production stage of the anode layer, the anode layer is located in the non-display area NAA in addition to the display area AA.

[0044] A pixel definition layer may also be disposed on the array substrate. The pixel definition layer includes pixel openings. The pixel openings may correspond to the anodes one by one. Each pixel opening exposes a corresponding anode.

[0045] The OLED organic light-emitting layer is located on the side surface of the anode away from the array substrate. The OLED organic light-emitting layer covers the pixel definition layer and can cover the anode exposed by the pixel opening to connect with the anode so that the anode can provide holes for the OLED organic light-emitting layer. The OLED organic light-emitting layer may include a stacked hole injection layer, a hole transport layer, an OLED organic material layer, an electron transport layer, and an electron injection layer.

[0046] The cathode is located on the surface of the OLED organic light-emitting layer away from the anode, and is used to provide the OLED organic light-emitting layer with electrons required for light emission. The material of the cathode layer generally uses a material with a low work function to facilitate electron injection. The material of the cathode can be one of the metal materials such as silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca) or indium (In), and can also be an alloy of these metal materials, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al).

[0047] The electrons provided by the cathode and the holes provided by the anode layer are combined in the OLED organic light-emitting layer to realize the light emission of the light-emitting unit.

[0048] The encapsulation layer is located on the cathode and is used to encapsulate the light-emitting unit. The encapsulation layer may extend from the display area AA to the non-display area NAA. The encapsulation layer generally includes a chemical vapor deposition layer and an inkjet printing layer.

[0049] As mentioned in the background technology, in the related art, water and oxygen invade the OLED display panel due to poor packaging performance of the OLED display panel. The inventors have found that the reason is:

[0050] Continuing to refer to FIG3 , the non-display area NAA includes an ear area E and a bending area W; the ear area E is located between the display area AA and the bending area W, and the ear area E is usually located in the lower frame area of ​​the display device; the display panel can be bent in the bending area W to set the driver chip and driver circuit board of the display panel on the back of the display panel. In order to ensure that the chemical vapor deposition layer does not accumulate in the ear area E when the encapsulation layer is made, continuing to refer to FIG3 , the planarization layer 130 of the edge 1201 of the fourth metal layer 120 covering the ear area E is usually dug out to leave space for the chemical vapor deposition layer, thereby avoiding the accumulation of the chemical vapor deposition layer in the ear area E when the encapsulation layer is made.

[0051] The removal of the planarization layer is generally completed before the anode layer is made. In other words, before the anode layer is made, the planarization layer 130 covering the edge 1201 of the fourth metal layer 120 in the ear area E has been removed, so that the side of the edge 1201 of the fourth metal layer 120 in the ear area E is exposed and not wrapped by the planarization layer 130. The technical problem caused by this is: during the production of the anode layer, when the anode layer is etched as a whole, referring to Figure 4, the side of the edge 1201 of the fourth metal layer 120 in the ear area E will be etched as well, resulting in one or more etching openings on the side of the edge 1201 of the fourth metal layer 120 in the ear area E, such as etching opening 12011. Furthermore, since the etching opening 12011 is on the side of the edge 1201 of the fourth metal layer 120 in the ear area E, when the chemical vapor deposition layer is made, referring to Figure 4, Figure 5 The etching opening 12011 is difficult to be filled with the chemical vapor deposition layer 140, and eventually one or more voids, such as void 14011, will be left between the etching opening 12011 and the chemical vapor deposition layer 140 and / or between the sub-film layers in the chemical vapor deposition layer 140 at the etching opening 12011. Water and oxygen will enter the ear area E along these voids (such as void 14011) and corrode the ear area E, for example, corrode any film layer structure in the ear area E, causing black spots to appear in the ear area E, thereby affecting the display performance of the display panel. Water and oxygen may even spread to the display area AA through these voids (such as void 14011), thereby affecting the display effect of the display panel.

[0052] To this end, an embodiment of the present application provides a display panel so that the chemical vapor deposition layer can completely fill the etching openings on the side edges of the fourth metal layer in the ear area to avoid leaving voids, thereby inhibiting water and oxygen from entering the display panel through the etching openings on the side and corroding the display panel, thereby improving the packaging performance of the display panel, and further improving the display performance and display effect of the display panel. The display panel provided in the embodiment of the present application is described in detail below.

[0053] In an exemplary embodiment, in combination Figure 6 and Figure 7 A display panel is provided, the display panel includes a display area AA and a non-display area NAA adjacent to the display area AA, the non-display area NAA includes an ear area E and a bending area W, the ear area E is located between the display area AA and the bending area W, and the display panel includes an insulating layer 210, a metal layer 220 and an encapsulation layer.

[0054] Among them, at least part of the insulating layer 210 is located in the ear region E; the material of the insulating layer 210 may be silicon oxide (SiO) and / or silicon nitride (SiN); the insulating layer 210 may include a plurality of sub-film layers sequentially stacked on the surface of the substrate, and the plurality of sub-film layers are, for example, a gate dielectric layer (GI) and an interlayer dielectric layer (ILD); refer to Figure 6 The insulating layer 210 is provided with a groove 2101, the length of the groove 2101 may extend along the column direction y of the display panel, the width of the groove 2101 may extend along the row direction x of the display panel, and the depth of the groove 2101 may extend along a direction perpendicular to the substrate.

[0055] Combination Figure 7 , Figure 8 and Fig. 9 , the metal layer 220 is located on one side surface of the insulating layer 210, along the row direction x, the first edge 2201 of the metal layer 220 extends into the groove 2101 and covers two opposite groove walls of the groove 2101, and the first edge 2201 is at least a partial edge of the metal layer 220; wherein the angle formed by the side surface of the first edge 2201 of the metal layer 220 and the plane where the insulating layer 210 is located is greater than 90°, and the side surface of the first edge 2201 of the metal layer 220 has an etching opening, such as an etching opening 22011, wherein, Figure 8 Reference numeral 230 in the figure refers to the planarization layer of the non-display area NAA. Fig. 9 As shown in Figure 4, it can be understood that Fig. 9In FIG. 4 , along the row direction x, the first edge 2201 of the metal layer 220 extends into the groove 2101 and covers the two opposite groove walls of the groove 2101, so that the angle between the side of the first edge 2201 of the metal layer 220 and the plane where the insulating layer 210 is located is greater than 90°; however, in FIG. 4 , the angle between the side of the edge 1201 of the fourth metal layer 120 and the plane where the insulating layer 110 is located is equal to 90°. Among them, the etching opening on the side of the first edge 2201 of the metal layer 220, such as the etching opening 22011, is formed by etching the side when the anode layer is etched as a whole. In addition, the metal layer 220 can be made in the same layer as the aforementioned fourth metal layer, or in the same layer as other metal layers in the display area AA. It should be noted that the first edge 2201 of the metal layer 220 extends into the groove 2101 and covers two opposite groove walls of the groove 2101 , wherein the metal layer 220 may cover the entire area of ​​the two opposite groove walls of the groove 2101 or may cover a partial area of ​​the two groove walls.

[0056] The encapsulation layer may be located on the surface of the planarization layer 230 away from the metal layer 220, but in the area where the first edge 2201 of the metal layer 220 is located, the encapsulation layer is located on the surface of the metal layer 220 away from the insulating layer 210 and covers the first edge 2201 of the metal layer 220, wherein the reference Fig. 9 The encapsulation layer may include a chemical vapor deposition layer 240 and an inkjet printing layer (not shown in the figure), and the chemical vapor deposition layer 240 may be composed of a plurality of sub-film layers. Exemplarily, the chemical vapor deposition layer 240 is composed of two sub-film layers.

[0057] Continue to compare Fig. 9 4, the angle formed by the side of the edge 1201 of the fourth metal layer 120 and the plane where the insulating layer 110 is located is equal to 90°, and Fig. 9 The angle formed by the side surface of the first edge 2201 of the metal layer 220 and the plane where the insulating layer 210 is located is greater than 90°, which makes Fig. 9 Compared with the etching openings on the side in FIG. 4 , such as the etching opening 12011 , the etching openings on the side in FIG. 4 , such as the etching opening 22011 , are more likely to be completely filled with the chemical vapor deposition layer 240 . Fig. 9 The setting method of the first edge 2201 of the metal layer 220 can avoid leaving voids such as the void 14011 during the packaging process through the packaging layer, thereby inhibiting water and oxygen from entering the ear area E along the side etching port 22011 and corroding the ear area E, thereby eliminating the black spots in the ear area E, improving the display performance of the display panel, and preventing water and oxygen from spreading to the display area AA through the etching port 22011, thereby improving the display effect of the display panel.

[0058] In an exemplary embodiment, referring to Fig.10 The metal layer 220 includes a first metal sublayer 224, a second metal sublayer 225 and a third metal sublayer 226 which are sequentially stacked on a surface of one side of the insulating layer 210; at least one of the side surfaces of the first sub-edge of the first metal sublayer 224, the side surfaces of the first sub-edge of the second metal sublayer 225 and the side surfaces of the first sub-edge of the third metal sublayer 226 has an etching opening 22011.

[0059] It can be understood that when the entire anode layer is etched, any position on the side of the first edge 2201 of the metal layer 220 may be etched to produce an etching opening 22011 at any position on the side. When the metal layer 220 is composed of multiple stacked metal sublayers, an etching opening 22011 may be produced at any position on the side of the first sub-edge of any metal sublayer.

[0060] In an exemplary embodiment, continue to refer to Fig.10 The side surface of the first sub-edge of the second metal sub-layer 225 has an etching opening 22011.

[0061] It can be understood that the materials of different metal sub-layers can be the same or different; when the hardness of the material of the metal sub-layer is relatively high, the side of the first sub-edge of the metal sub-layer is not easily etched together, so it is not easy to produce an etching opening; when the hardness of the material of the metal sub-layer is relatively low, the side of the first sub-edge of the metal sub-layer is easily etched together, so it is easy to produce an etching opening. Based on this, when the materials of the first metal sub-layer 224 and the third metal sub-layer 226 are both titanium (Ti) with relatively high hardness and the material of the second metal sub-layer 225 is aluminum (Al) with relatively low hardness, the side of the first sub-edge of the first metal sub-layer 224 and the side of the first sub-edge of the third metal sub-layer 226 are not easily etched together, while the side of the first sub-edge of the second metal sub-layer 225 is easily etched together, so that an etching opening 22011 is produced.

[0062] In an exemplary embodiment, continue to refer to Figure 7 In the row direction x, the metal layer 220 includes a first area 221, a second area 222 and a third area 223 that are spaced apart from each other, and the second area 222 is located between the first area 221 and the third area 223; in the row direction x, within the ear area E, at least one of the two edges of the second area 222, the edge of the first area 221 close to the second area 222, and the edge of the third area 223 close to the second area 222 includes the first edge 2201.

[0063] That is to say, there can be one or more first edges 2201 on the metal layer 220; within the ear area E, the two edges of the second area 222, the edge of the first area 221 close to the second area 222, and one of the edges of the third area 223 close to the second area 222 can be used as a first edge 2201.

[0064] In an exemplary embodiment, continue to refer to Figure 7 , within the ear region E, each of the two edges of the second region 222, the edge of the first region 221 close to the second region 222, and the edge of the third region 223 close to the second region 222 is respectively used as a first edge 2201, and combined with Figure 6 and Figure 8 , the location of the groove 2101 corresponds to the location of the first edge 2201. In this way, setting a plurality of first edges 2201 means that the planarization layer 230 at a plurality of locations is dug out, thereby leaving enough space for the production of the chemical vapor deposition layer 240, and better avoiding the accumulation of the chemical vapor deposition layer 240 in the ear area E. At the same time, the angles formed by the side surfaces of each first edge 2201 and the plane where the insulating layer 210 is located are greater than 90 degrees, so that the etching openings 22011 on the side surfaces of each first edge 2201 can also be completely filled with the chemical vapor deposition layer 240, thereby better improving the display performance and display effect of the display panel.

[0065] In an exemplary embodiment, continue to refer to Figure 7 The second region 222 is used to connect to the first power line ELVDD, and the first region 221 and the third region 223 are used to connect to two ends of the second power line ELVSS, respectively, wherein the second power line ELVSS has a different potential from the first power line ELVDD.

[0066] In an exemplary embodiment, continue to refer to Figure 7 The non-display area NAA also includes a bonding area B. The bending area W is located between the ear area E and the bonding area B. A bonding pin Pad is provided in the bonding area B. The first area 221, the second area 222 and the third area 223 are also used to extend from the ear area E to pass through the bending area W and are respectively connected to the corresponding bonding pin Pads.

[0067] In an exemplary embodiment, continue to refer to Figure 8 The first region 221, the second region 222 and the third region 223 except the first edge 2201 are all covered by the planarization layer 230 to encapsulate and protect the first region 221, the second region 222 and the third region 223 except the first edge 2201 and achieve good flatness.

[0068] In an exemplary embodiment, referring to Fig.11 , the orthographic projection of the side surface of the first edge 2201 in the direction perpendicular to the display panel (that is, perpendicular to the substrate) is located within the orthographic projection of the groove wall of the groove 2101 in the direction perpendicular to the display panel. In this way, it is further ensured that the angle formed by the side surface of the first edge 2201 of the metal layer 220 and the plane where the insulating layer 210 is located is greater than 90°, thereby ensuring that the etching opening 22011 is more easily filled with the chemical vapor deposition layer 240.

[0069] In an exemplary embodiment, referring to Fig.12 The upper surface of the portion of the first edge 2201 located in the groove 2101 is flush with the surface of the insulating layer 210 close to the metal layer 220, wherein the portion of the first edge 2201 located in the groove 2101 is, for example, the portion of the first edge 2201 covering the bottom of the groove 2101 and the first side wall, the first side wall is in contact with the side of the first edge 2201, and the upper surface refers to the surface away from the insulating layer 210; in this way, it is beneficial to avoid the side of the first edge 2201 of the metal layer 220 being etched to produce an etching port, and it is beneficial for the chemical vapor deposition layer 240 to better cover the first edge 2201, thereby better inhibiting the invasion of water and oxygen into the display panel.

[0070] The side surface of the first edge 2201 is flush with the surface of the insulating layer 210 close to the metal layer 220 , which can be understood as the side surface of the first edge 2201 and the surface of the insulating layer 210 close to the metal layer 220 are in the same horizontal plane.

[0071] In an exemplary embodiment, continue to refer to Fig.12 , the cross-section of the groove 2101 along the row direction x of the display panel is in an inverted trapezoidal shape. In this way, it is further ensured that the angle formed by the side surface of the first edge 2201 of the metal layer 220 and the plane where the insulating layer 210 is located can be greater than 90°, thereby ensuring that the etching opening 22011 is more easily filled with the chemical vapor deposition layer 240.

[0072] The inverted trapezoid refers to the direction from the substrate to the insulating layer, the width of the groove 2101 along the row direction x of the display panel gradually increases, and the orthographic projection of the bottom of the groove 2101 is within the orthographic projection of the top of the groove 2101.

[0073] In addition, in the embodiment of the present application, the specific length, width and depth of the groove 2101 must be adapted to the thickness, surface area, etc. of the first edge 2201 to ensure that the angle formed by the side surface of the first edge 2201 and the plane where the insulating layer 210 is located is greater than 90° due to the setting of the groove 2101.

[0074] In an exemplary embodiment, a display device is provided, which includes a display panel as provided in any of the above embodiments. The display device can be, but is not limited to, a display product such as a mobile phone, a tablet, or a computer.

[0075] The display device and the display panel provided in the embodiments of the present application belong to the same inventive concept, can solve the same technical problems, and thus achieve the same technical effects, and the repeated contents will not be repeated here.

[0076] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0077] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, the non-display area includes an ear area and a bending area, and the ear area is located between the display area and the bending area; wherein the display panel includes: an insulating layer, at least partly located in the ear region, the insulating layer being provided with a groove; A metal layer is located on one side surface of the insulating layer, wherein a first edge of the metal layer extends into the groove and covers two opposite groove walls of the groove, and the first edge is at least a partial edge of the metal layer; wherein an angle formed by a side surface of the first edge of the metal layer and a plane where the insulating layer is located is greater than 90 degrees, and an etching opening is provided on the side surface of the first edge of the metal layer; The encapsulation layer is located on a surface of the metal layer away from the insulating layer and covers a first edge of the metal layer.

2. The display panel according to claim 1, characterized in that: The metal layer comprises a first metal sublayer, a second metal sublayer and a third metal sublayer sequentially stacked on one side surface of the insulating layer; At least one of the side surface of the first sub-edge of the first metal sub-layer, the side surface of the first sub-edge of the second metal sub-layer, and the side surface of the first sub-edge of the third metal sub-layer has the etching opening.

3. The display panel according to claim 2, characterized in that: The side surface of the first sub-edge of the second metal sub-layer has the etching opening, wherein the material of the second metal sub-layer includes aluminum.

4. The display panel according to claim 1 or 3, characterized in that: In the row direction, the metal layer includes a first region, a second region and a third region spaced apart from each other, and the second region is located between the first region and the third region; In the row direction, at least one of two edges of the second region, an edge of the first region close to the second region, and an edge of the third region close to the second region includes the first edge, and the groove corresponds to the first edge one by one.

5. The display panel according to claim 4, characterized in that: The second area is used to connect to a first power line, and the first area and the third area are used to connect to second power lines respectively, wherein the second power line has a different potential from the first power line; Optionally, the non-display area also includes a bonding area, the bending area is located between the ear area and the bonding area, a bonding pin is provided in the bonding area, and the first area, the second area and the third area are also used to extend from the ear area to pass through the bending area and be connected to the corresponding bonding pins respectively.

6. The display panel according to claim 5, characterized in that: The display panel further includes: A planarization layer, wherein the first region, the second region, and the third region except the first edge are all covered by the planarization layer.

7. The display panel according to claim 1, characterized in that: The orthographic projection of the side surface of the first edge in the direction perpendicular to the display panel is located within the orthographic projection of the groove wall in the direction perpendicular to the display panel.

8. The display panel according to claim 1, characterized in that: An upper surface of a portion of the first edge located in the groove is flush with a surface of the insulating layer close to the metal layer.

9. The display panel according to claim 1, characterized in that: A cross-section of the groove along a row direction of the display panel is in an inverted trapezoidal shape.

10. A display device, characterized in that: Comprising a display panel as described in any one of claims 1 to 9.

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