Display panel, display device and manufacturing method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a substrate and sub-panels, at least two sub-panels are arranged on the same side of the substrate side by side, each sub-panel comprises a driving circuit layer and a light-emitting layer, the driving circuit layer is arranged on the substrate, and the light-emitting layer is arranged on the side, away from the substrate, of the driving circuit layer; the packaging layer is arranged on the side, away from the substrate, of the light-emitting layer and makes contact with at least part of the light-emitting layer, and the packaging layer covers the at least two sub-panels. In the embodiment, the at least two sub-panels are arranged on the substrate side by side, the packaging layer is arranged on the side, away from the substrate, of the light-emitting layer and is in contact with the light-emitting layer, the packaging layer covers the light-emitting layers of the at least two sub-panels, the light-emitting display device is represented as a whole in appearance, and the integrity of the display effect is good; when the sub-panels are spliced, the influence of the packaging precision of the packaging layer can be eliminated, the splicing gap between the adjacent sub-panels is reduced, and the continuity and integrity of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] The existing spliced ​​display panel is composed of multiple sub-display panels. According to different usage requirements, the sub-display panels can be used as displays alone or spliced ​​into an ultra-large screen. However, the process performance of current display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the process performance of display products.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate, a sub-panel, at least two sub-panels are arranged side by side on the same side of the substrate, the sub-panel comprises a driving circuit layer and a light-emitting layer, the driving circuit layer is arranged on the substrate, and the light-emitting layer is arranged on the side of the driving circuit layer away from the substrate; an encapsulation layer, the encapsulation layer is arranged on the side of the light-emitting layer away from the substrate and in contact with at least part of the light-emitting layer, and the encapsulation layer covers at least two sub-panels.

[0006] According to an embodiment of the present application, the display panel further includes a filling layer, a joint seam is provided between at least two adjacent sub-panels, and the filling layer is provided at the joint seam.

[0007] According to an embodiment of the present application, a surface of the filling layer that is away from the substrate is coplanar with a surface of the light-emitting layer that is away from the substrate.

[0008] According to an embodiment of the present application, the material of the filling layer includes photosensitive adhesive.

[0009] According to an embodiment of the present application, the size of the joint seam between two adjacent sub-panels is less than 80 microns.

[0010] According to an embodiment of the present application, the sub-panel also includes: a substrate, located on the side of the driving circuit layer facing the base; a driving device, arranged on the side of the substrate facing the base; and connecting lines, electrically connecting the driving circuit layer and the driving device, at least part of the connecting lines extending along the thickness direction of the sub-panel and located in the joint seam.

[0011] According to an embodiment of the present application, the display panel also includes a side encapsulation layer, the sub-panel includes a top surface facing away from the substrate and a side surface connected to the top surface and extending toward the substrate, the encapsulation layer covers the top surfaces of at least two sub-panels, and the side encapsulation layer covers the side surface.

[0012] An embodiment of a second aspect of the present application provides a display device, comprising the display panel in any one of the embodiments of the first aspect above.

[0013] An embodiment of a third aspect of the present application provides a method for manufacturing a display panel, comprising the following steps:

[0014] A substrate is provided.

[0015] At least two sub-panels are arranged side by side on the substrate. The sub-panels include a driving circuit layer and a light-emitting layer. The driving circuit layer is arranged on the substrate, and the light-emitting layer is arranged on the side of the driving circuit layer away from the substrate.

[0016] The encapsulation layer covers the side of the light-emitting layers of at least two sub-panels away from the substrate and contacts at least a portion of the light-emitting layers.

[0017] According to an embodiment of the present application, before the step of arranging at least two sub-panels side by side on the substrate, the following step is further included: attaching a protective film on the sub-panels.

[0018] The step of covering the light-emitting layers of at least two sub-panels on the side away from the substrate with the encapsulation layer and contacting at least a portion of the light-emitting layer also includes the following step: tearing off the protective film.

[0019] According to an embodiment of the present application, the sub-panel includes a top surface facing away from the substrate and a side surface connected to the top surface and extending toward the substrate. Before the step of arranging at least two sub-panels side by side on the substrate, the following step is also included: encapsulating the side surface of the sub-panel to form a side encapsulation layer. In an embodiment of the present application, at least two sub-panels are arranged side by side on the substrate to form a spliced ​​display panel. The sub-panel includes a driving circuit and a light-emitting layer. The light-emitting layer is located on the side of the driving circuit facing away from the substrate. The encapsulation layer is arranged on the side of the light-emitting layer facing away from the substrate and contacts at least part of the light-emitting layer to isolate the light-emitting layer from the external environment. The encapsulation layer covers at least two sub-panels, that is, the encapsulation layer covers the light-emitting layers of at least two sub-panels, and the encapsulation layer is on the side of the light-emitting layer facing away from the driving circuit layer. Multiple sub-panels share one encapsulation layer, and appear to be a whole in appearance, with better overall display effect. In addition, multiple sub-panels share one encapsulation layer to replace the technical solution of separately setting an encapsulation layer on each sub-panel. When splicing the sub-panels, the influence of the encapsulation accuracy of the encapsulation layer of each sub-panel can be eliminated, which is beneficial to increase the splicing accuracy of the sub-panels, reduce the splicing gaps between adjacent sub-panels, and improve the continuity and integrity of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0021] Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0022] Figure 2 is a schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0023] Figure 3 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0024] Figure 4 is a top view of a display panel provided in an embodiment of the present application;

[0025] Figure 5 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0026] Figure 6 is a schematic structural diagram of a display panel after substrate chamfering provided by an embodiment of the present application;

[0027] Figure 7 is a schematic diagram of the structure after the side wiring step in the display panel provided by the embodiment of the present application;

[0028] Figure 8 It is a schematic diagram of the structure after the steps of transferring die bonding and bonding of the display panel provided in the embodiment of the present application;

[0029] Fig. 9 It is a schematic diagram of the structure after the step of encapsulating the side surface of the sub-panel in the display panel provided in the embodiment of the present application.

[0030] Fig.10 It is a schematic diagram of the structure of the display panel after the sub-panels are spliced ​​together provided in an embodiment of the present application.

[0031] Explanation of the reference numerals: 100, base; 200, sub-panel; 210, substrate; 220, driving circuit layer; 230, light-emitting layer; 231, red light-emitting unit; 232, green light-emitting unit; 233, blue light-emitting unit; 240, encapsulation layer; 241, side encapsulation layer; 300, filling layer; 400, joint seam; 500, connecting line; 600, side surface; 700, driving device; Z, thickness direction. DETAILED DESCRIPTION

[0032] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0033] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0035] The existing spliced ​​display panel is composed of a plurality of sub-display panels. During the splicing process of the sub-display panels, due to the influence of the manufacturing process, splicing gaps will be generated at the splicing points, and the splicing gaps will have a certain impact on the display effect of the display panel.

[0036] In order to better understand this application, Figures 1 to 3 The display panel according to the embodiment of the present application is described in detail.

[0037] In order to solve the above problems, a display panel is provided in a first aspect of the present application, such as Figure 1As shown, the display panel includes a substrate 100 and a sub-panel 200, at least two sub-panels 200 are arranged side by side on the same side of the substrate 100, the sub-panel 200 includes a driving circuit layer 220, a light-emitting layer 230 and an encapsulation layer 240, the driving circuit layer 220 is arranged on the substrate 100, and the light-emitting layer 230 is arranged on the side of the driving circuit layer 220 away from the substrate 100; the encapsulation layer 240 is arranged on the side of the light-emitting layer 230 away from the substrate 100 and in contact with at least a portion of the light-emitting layer 230, and the encapsulation layer 240 covers at least two sub-panels 200.

[0038] In this embodiment, at least two sub-panels 200 are arranged side by side on the substrate 100 to form a spliced ​​display panel. The sub-panels 200 include a driving circuit layer 220 and a light-emitting layer 230. The light-emitting layer 230 is located on the side of the driving circuit layer 220 away from the substrate 100 and contacts at least part of the light-emitting layer 230. The encapsulation layer 240 is arranged in contact with the side of the light-emitting layer 230 away from the substrate 100, which can better isolate the light-emitting layer 230 from the external environment and effectively prevent water and oxygen from invading the light-emitting layer 230. The encapsulation layer 240 covers at least two sub-panels 200, that is, the encapsulation layer 240 covers the light-emitting layers 230 of at least two sub-panels 200, and the encapsulation layer 240 is on the side of the light-emitting layer 230 away from the driving circuit layer 220. Multiple sub-panels 200 share one encapsulation layer 240, and appear to be a whole in appearance, with better overall display effect. In addition, multiple sub-panels 200 share one encapsulation layer 240 to replace the technical solution of separately setting an encapsulation layer 240 on each sub-panel 200. When the sub-panels 200 are spliced, the influence of the encapsulation accuracy of the encapsulation layer 240 of each sub-panel 200 can be eliminated, which is beneficial to improving the splicing accuracy of the sub-panels 200, reducing the splicing gaps between adjacent sub-panels 200, and improving the continuity and integrity of the display panel.

[0039] Optionally, the display panel is a spliced ​​display panel formed by arranging multiple sub-panels 200 in parallel along the length and width direction of the sub-panels 200. According to different usage requirements, the display panel unit can be used as a display alone, and multiple display panels can be spliced ​​into an ultra-large screen. This application is aimed at the high process difficulty, low yield and high equipment cost of large-size display panels, and the market demand for large-size display panels is growing. It is a feasible solution to prepare large-size display panels by splicing.

[0040] Optional, such as Figure 1As shown, the light-emitting layer 230 includes a plurality of light-emitting units of different colors, and the light-emitting layer 230 may include a red light-emitting unit 231, a green light-emitting unit 232, and a blue light-emitting unit 233. The light-emitting layer 230 also includes a first electrode and a second electrode, the first electrode is arranged on the side of the light-emitting unit facing the substrate 100, the second electrode is arranged on the side of the light-emitting unit away from the substrate 100, and the encapsulation layer 240 is arranged in contact with the second electrode.

[0041] Optionally, the driving circuit layer 220 includes signal routing lines for transmitting electrical signals such as data signals, power signals, scan signals, and initialization signals, as well as electronic components required for the control circuit, such as thin film transistors and capacitors.

[0042] Optionally, each sub-panel 200 is a Micro LED (Micro Light Emitting Diode), OLED (Organic Light Emitting Display) light-emitting unit or LED (Light Emitting Diode) light-emitting unit, which has the advantages of high image quality, power saving, thin body and wide application range.

[0043] like Figure 2 and Figure 4 As shown, in some optional embodiments, the display panel further includes a filling layer 300 , a joint seam 400 is provided between at least two adjacent sub-panels 200 , and the filling layer 300 is provided at the joint seam 400 .

[0044] In these optional embodiments, due to the influence of the splicing accuracy, a splicing seam 400 will be generated between adjacent sub-panels 200. The filling layer 300 is arranged in the splicing seam 400, which is conducive to reducing the sense of separation between the multiple sub-panels 200 and ensuring the overall continuity and integrity of the display panel. At the same time, the filling layer 300 can also prevent water vapor, dust, etc. from entering the sub-panel 200. In addition, the filling layer 300 can isolate two adjacent sub-panels 200 to prevent the two adjacent sub-panels 200 from being squeezed and collided to cause damage.

[0045] like Figure 2 As shown, in some optional embodiments, the surface of the filling layer 300 away from the substrate 100 is coplanar with the surface of the light-emitting layer 230 away from the substrate 100. For example, when the light-emitting layer 230 includes a red light-emitting unit 231, a green light-emitting unit 232, and a blue light-emitting unit 233, the surface of the filling layer 300 away from the substrate 100 is coplanar with the surface of at least one of the red light-emitting unit 231, the green light-emitting unit 232, and the blue light-emitting unit 233 away from the substrate 100.

[0046] In these optional embodiments, the surface of the filling layer 300 away from the substrate 100 is coplanar with the surface of at least part of the light-emitting layer 230 away from the substrate 100, ensuring that the surfaces of the light-emitting layers 230 and the filling layer 300 of the multiple sub-panels 200 away from the substrate 100 are planes. From the perspective of the user, the light-emitting layer 230 and the filling layer 300 are close to an overall plane, which improves the visual experience. At the same time, when the encapsulation layer 240 is covered on the surface of the light-emitting layer 230 and the surface of the filling layer 300, it will also be smoother. When the side of the red light-emitting unit 231, the green light-emitting unit 232, and the blue light-emitting unit 233 away from the substrate 100 are not coplanar, that is, when the heights of the light-emitting units are different, the filling layer 300 is coplanar with the surface of the light-emitting unit away from the substrate 100 with the largest distance from the substrate 100. For example, when the distance between the surface of the red light-emitting unit 231 facing away from the substrate 100 and the substrate 100 is greater than the distance between the surface of the green light-emitting unit 232 facing away from the substrate 100 and the substrate 100, and the distance between the surface of the red light-emitting unit 231 facing away from the substrate 100 and the substrate 100 is greater than the distance between the surface of the blue light-emitting unit 233 facing away from the substrate 100 and the substrate 100, then the surface of the filling layer 300 facing away from the substrate 100 is coplanar with the surface of the red light-emitting unit 231 facing away from the substrate 100. Figure 2 As shown, in some optional embodiments, the material of the filling layer 300 includes photosensitive adhesive.

[0047] In these optional embodiments, the photosensitive adhesive is cured by ultraviolet light, and the photosensitive adhesive isolates the sub-panel 200 from external substances and heat, etc., and plays a blocking role to prevent the sub-panel 200 from being affected by the external environment. At the same time, the photosensitive adhesive is elastic, and the sub-panel 200 plays a buffering role when it is subjected to vibration, impact, etc.

[0048] like Figure 2 and Figure 4 As shown, in some optional embodiments, the size of the joint seam 400 between two adjacent sub-panels 200 is less than 80 microns.

[0049] In the related art, each sub-panel 200 is provided with an independent packaging part on the light-emitting layer 230, and the part of the independent packaging part of each sub-panel 200 extending out of the sub-panel 200 is cut with a cutting accuracy of ±10 microns. In the present embodiment, each sub-panel 200 is not provided with an independent packaging part, and the influence of the cutting accuracy of the packaging part is eliminated during the splicing process of each sub-panel 200, and the splicing accuracy can be improved by 20 microns, and the size of the splicing seam 400 can be controlled below 80 microns.

[0050] like Figure 2As shown, in some optional embodiments, the sub-panel 200 also includes a substrate 210, a driving device 700 and a connecting line 500: the substrate 210 is located on the side of the driving circuit layer 220 facing the substrate 100; the driving device 700 is arranged on the side of the substrate 210 facing the substrate 100; the connecting line 500 electrically connects the driving circuit layer 220 and the driving device 700, and at least part of the connecting line 500 extends along the thickness direction Z of the sub-panel 200 and is located in the splicing seam 400.

[0051] In these optional embodiments, the sub-panel 200 further includes a substrate 210 and a driving device 700, wherein the substrate 210 is disposed on the side of the driving circuit layer 220 facing the substrate 100; the driving device 700 is disposed on the side of the substrate 210 facing the substrate 100, and the driving circuit layer 220 and the driving device 700 are electrically connected via a connecting wire 500, and the connecting wire 500 is disposed on the side of the sub-panel 200, that is, the connecting wire 500 is disposed on the side of the sub-panel 200 in the thickness direction Z of the sub-panel 200. In addition, the connecting wire 500 is on the side of the sub-panel 200 and is located in the splicing seam 400. Due to the splicing seam 400 generated by the splicing process, arranging the connecting wire 500 in the splicing seam 400 is conducive to reducing the space occupied by the connecting wire 500 and improving the resolution of the display panel. Optionally, the substrate 100 may include a glass material.

[0052] like Figure 3 As shown, in some optional embodiments, the display panel also includes a side encapsulation layer 241, the sub-panel 200 includes a top surface facing away from the substrate 100 and a side surface 600 connected to the top surface and extending toward the substrate 100, the encapsulation layer 240 covers the top surfaces of at least two sub-panels 200, and the side encapsulation layer 241 covers the side surface 600.

[0053] In these optional embodiments, the sub-panel 200 includes a top surface and a side surface 600, wherein the side of the sub-panel 200 facing away from the substrate 100 is the top surface, the side surface 600 is connected to the top surface and extends toward the substrate 100, the encapsulation layer 240 covers the top surfaces of multiple sub-panels 200, and the side encapsulation layer 241 covers the side surface 600 of the sub-panel 200. The encapsulation layer 240 and the side encapsulation layer 241 isolate the sub-panel 200 from external substances and heat, etc., and play a blocking role to prevent the sub-panel 200 from being affected by the external environment.

[0054] Optional, such as Figure 3 As shown, the encapsulation layer 240 extends along the length and width directions of the sub-panel 200 , and the side encapsulation layer 241 extends along the thickness direction Z of the sub-panel 200 .

[0055] A second aspect of the present application provides a display device, comprising the display panel in any one of the embodiments of the first aspect.

[0056] In this embodiment, at least two sub-panels 200 are arranged side by side on the same side of the substrate 100 to form a spliced ​​display panel. The sub-panels 200 include a driving circuit layer 220 and a light-emitting layer 230. The light-emitting layer 230 is located on the side of the driving circuit layer 220 away from the substrate 100. The encapsulation layer 240 is arranged in contact with the light-emitting layer 230 on the side away from the substrate 100 to isolate the light-emitting layer 230 from the external environment. The encapsulation layer 240 covers at least two sub-panels 200, that is, the encapsulation layer 240 covers the light-emitting layers 230 of at least two sub-panels 200. Multiple sub-panels 200 share one encapsulation layer 240, which has better overall display effect. Moreover, multiple sub-panels 200 share one encapsulation layer 240 instead of separately setting an encapsulation layer 240 on each sub-panel 200. When the sub-panels 200 are spliced, the influence of the encapsulation accuracy of the encapsulation layer 240 of each sub-panel 200 can be eliminated, which is beneficial to increase the splicing accuracy of the sub-panels 200, reduce the splicing gaps between adjacent sub-panels 200, and improve the continuity and integrity of the display panel.

[0057] The display devices in the embodiments of the present application include but are not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0058] like Figure 5 As shown, the third aspect of the present application provides a method for manufacturing a display panel, comprising the following steps:

[0059] Step S1: providing a substrate 100 .

[0060] Step S2: at least two sub-panels 200 are arranged side by side on the substrate 100 , wherein the sub-panels 200 include a driving circuit layer 220 and a light-emitting layer 230 . The driving circuit layer 220 is arranged on the substrate 100 , and the light-emitting layer 230 is arranged on the side of the driving circuit layer 220 away from the substrate 100 .

[0061] Step S3 : Covering the light emitting layers 230 of at least two sub-panels 200 on the side facing away from the substrate 100 with the encapsulation layer 240 and contacting at least a portion of the light emitting layers 230 .

[0062] In this embodiment, a substrate 100 is first provided, and at least two sub-panels 200 are arranged side by side on the substrate 100 to form a spliced ​​display panel. The sub-panels 200 include a driving circuit layer 220 and a light-emitting layer 230. The light-emitting layer 230 is located on the side of the driving circuit layer 220 away from the substrate 100 and is in contact with at least part of the light-emitting layer 230. The encapsulation layer 240 is arranged in contact with the side of the light-emitting layer 230 away from the substrate 100 to isolate the light-emitting layer 230 from the external environment. The encapsulation layer 240 covers at least two sub-panels 200, that is, the encapsulation layer 240 covers the light-emitting layers 230 of at least two sub-panels 200, and the encapsulation layer 240 is on the side of the light-emitting layer 230 away from the driving circuit layer 220. Multiple sub-panels 200 share one encapsulation layer 240, and appear to be a whole in appearance, with better overall display effect. In addition, multiple sub-panels 200 share one encapsulation layer 240 to replace the technical solution of separately setting an encapsulation layer 240 on each sub-panel 200. When the sub-panels 200 are spliced, the influence of the encapsulation accuracy of the encapsulation layer 240 of each sub-panel 200 can be eliminated, which is beneficial to increase the splicing accuracy of the sub-panels 200, reduce the splicing gaps between adjacent sub-panels 200, and improve the continuity and integrity of the display panel.

[0063] In some optional embodiments, before the step of placing at least two sub-panels 200 side by side on the substrate 100 , the following step is further included: attaching a protective film on the sub-panel 200 .

[0064] The step of covering the light emitting layers 230 of at least two sub-panels 200 with the encapsulation layer 240 which are away from the substrate 100 and contacting at least a portion of the light emitting layer 230 also includes the following step: removing the protective film.

[0065] In these optional embodiments, the manufacturing process of the display panel includes the steps of arranging the connecting wires 500 on the side, transferring the die and splicing in sequence. Before the step of arranging at least two sub-panels 200 side by side on the substrate 100, a protective film is attached to the sub-panel 200, and the protective film protects the connecting wires 500 of the sub-panel 200 and the sub-panel 200 as a whole. In the step of covering the light-emitting layer 230 of at least two sub-panels 200 with the encapsulation layer 240 on the side away from the substrate 100 and contacting at least part of the light-emitting layer 230, the protective film is torn off. At this time, the encapsulation layer 240 is not arranged on the sub-panel 200. Therefore, when the sub-panels 200 are spliced, there is no effect of the encapsulation layer 240 on the splicing accuracy. Therefore, the accuracy of the spliced ​​sub-panels 200 is improved.

[0066] In some optional embodiments, the sub-panel 200 includes a top surface facing away from the substrate 100 and a side surface 600 connected to the top surface and extending toward the substrate 100. Before the step of arranging at least two sub-panels 200 side by side on the substrate 100, the following step is also included: encapsulating the side surface 600 of the sub-panel 200 to form a side encapsulation layer 241.

[0067] In these optional embodiments, the side encapsulation layer 241 isolates the side surface 600 of the sub-panel 200 from external substances and heat, etc., and plays a blocking role to prevent the sub-panel 200 from being affected by the external environment.

[0068] by Figures 6 to 9 Taking the embodiment shown as an example, the manufacturing method of the display panel of the present application is briefly described as follows:

[0069] Step 1, such as Figure 6 As shown, a substrate material is provided and the substrate material is chamfered. Optionally, the substrate 210 can be a glass substrate. The chamfering process refers to chamfering the top surface and the side surface of the substrate 210 to improve the angle between the side surface and the top surface so that the subsequent wiring is easy to break.

[0070] Step 2, such as Figure 7 As shown, side routing is performed on the substrate 210. After the edge grinding and chamfering steps are completed, the side routing step is performed. The side routing step arranges the connecting wires 500 on the side of the sub-panel 200, which means that at least part of the connecting wires 500 are arranged on the side of the sub-panel 200 in the thickness direction Z.

[0071] Step three, such as Figure 8 As shown, after the side routing step, the die transfer and bonding steps are performed.

[0072] Step 4: Fig. 9 As shown, the side surface 600 of the encapsulation sub-panel 200 forms a side encapsulation layer 241 .

[0073] Step five, attaching a protective film. After transferring the die and bonding, attach a protective film on the sub-panel 200 to protect the wiring and the product during logistics.

[0074] Step 6: Fig.10 As shown, a sub-panel 200 splicing step is performed, the protective film is torn off before the splicing step, at least two sub-panels 200 are arranged side by side on the substrate 100, the driving circuit layer 220 is arranged on the substrate 100, and the light-emitting layer 230 is arranged on the side of the driving circuit layer 220 away from the substrate 100, to form a spliced ​​display panel.

[0075] Step 7: Figure 3As shown, multiple sub-panels 200 are encapsulated, and the encapsulation layer 240 is disposed on the side of the light-emitting layer 230 away from the substrate 100 and in contact with at least part of the light-emitting layer 230. The encapsulation layer 240 covers at least two sub-panels 200, that is, the encapsulation layer 240 covers the light-emitting layers 230 of at least two sub-panels 200, and the encapsulation layer 240 is on the side of the light-emitting layer 230 away from the driving circuit layer 220. If necessary, for example, when the encapsulation layer 240 encapsulates multiple sub-panels 200, the multiple sub-panels 200 constitute a sub-panel group, and the encapsulation layer 240 protrudes from the edge of the outermost sub-panel 200 in the sub-panel group, the encapsulation layer 240 can also be cut around the circumference of the sub-panel group after step seven to remove excess encapsulation material and trim the shape and size of the display panel.

[0076] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: Base, Sub-panels, at least two of which are arranged side by side on the same side of the substrate, the sub-panels comprising a driving circuit layer and a light-emitting layer, the driving circuit layer being arranged on the substrate, and the light-emitting layer being arranged on a side of the driving circuit layer away from the substrate; The encapsulation layer is disposed on a side of the light-emitting layer away from the substrate and in contact with at least a portion of the light-emitting layer, and the encapsulation layer covers at least two of the sub-panels.

2. The display panel according to claim 1, characterized in that: The display panel further comprises a filling layer, a joint seam is provided between at least two adjacent sub-panels, and the filling layer is provided at the joint seam; Preferably, a surface of the filling layer on one side away from the substrate is coplanar with a surface of the light-emitting layer on one side away from the substrate.

3. The display panel according to claim 2, characterized in that: The material of the filling layer includes photosensitive adhesive.

4. The display panel according to claim 2, characterized in that: The size of the joint seam between two adjacent sub-panels is less than 80 microns.

5. The display panel according to claim 2, characterized in that: The sub-panel also includes: A substrate, located on a side of the driving circuit layer facing the base; A driving device, disposed on a side of the substrate facing the base; A connecting line electrically connects the driving circuit layer and the driving device, and at least a portion of the connecting line extends along the thickness direction of the sub-panel and is located in the joint seam.

6. The display panel according to claim 1, characterized in that The display panel also includes a side encapsulation layer, the sub-panel includes a top surface facing away from the substrate and a side surface connected to the top surface and extending toward the substrate, the encapsulation layer covers the top surfaces of at least two of the sub-panels, and the side encapsulation layer covers the side surfaces.

7. A display device, characterized in that: A display panel comprising any one of claims 1 to 6.

8. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; Arrange at least two sub-panels side by side on the substrate, wherein the sub-panels include a driving circuit layer and a light-emitting layer, wherein the driving circuit layer is arranged on the substrate, and the light-emitting layer is arranged on a side of the driving circuit layer away from the substrate; The encapsulation layer covers the side of the light-emitting layers of the at least two sub-panels away from the substrate and contacts with at least a portion of the light-emitting layers.

9. The manufacturing method according to claim 8, characterized in that: Before the step of placing at least two sub-panels side by side on the substrate, the method further includes the following steps: attaching a protective film on the sub-panels; The step of covering the light-emitting layers of the at least two sub-panels with the encapsulation layer on the side facing away from the substrate and contacting at least part of the light-emitting layer also includes the following steps: The protective film is removed.

10. The manufacturing method according to claim 8, characterized in that: The sub-panel comprises a top surface facing away from the substrate and a side surface connected to the top surface and extending toward the substrate, and the following steps are also included before the step of arranging at least two sub-panels side by side on the substrate; The side surface of the sub-panel is encapsulated to form a side encapsulation layer.

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