Display panel and display module

Abstract

The invention discloses a display panel and a display module, a non-display area comprises a binding area located on one side of a display area, and the display panel further comprises a substrate, a conductive layer and a bonding pad; the substrate comprises a substrate body, a circuit wiring layer and a protection layer. The circuit wiring layer comprises an extension signal line extending from a display area to a binding area. The conductive layer is located at one side of the protection layer away from the circuit wiring layer; the bonding pad is electrically connected with the extending signal line, the bonding part and the conductive layer are arranged on the same layer, the bonding part comprises a first binding stator part and a second binding stator part, and the distance difference between the surfaces, away from one side of the substrate, of the first binding stator part and the second binding stator part is smaller than or equal to # imgabs0 #. According to the bonding pad, the shape control of the binding part of the bonding pad is relatively good, and in the subsequent thermocompression bonding step, at least part of conductive particles retained in the first binding part can be stably retained even if being extruded, so that the effective binding area of the binding part can be increased, and the binding yield of the bonding pad is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel and a display module. Background Art

[0002] Generally, a binding structure for binding a driver integrated circuit and wiring connecting the light-emitting elements of the display area to the binding structure are arranged in the non-display area of ​​a display device. Since the binding structure is made of metal material, an insulating protective layer covering the edge area of ​​the binding structure and an electrical connection layer electrically connected to the central area of ​​the binding structure need to be arranged to prevent the binding structure from being damaged or corroded in the subsequent process. However, since the process of the insulating protective layer has poor control over the morphology of the insulating protective layer after preparation, the area of ​​the electrical connection layer that can be effectively used for binding the driver integrated circuit board is small, and the binding structure and the driver integrated circuit board are not firmly bound in the subsequent hot pressing bonding step, and are easy to fall off, resulting in a low binding yield. Summary of the invention

[0003] The embodiments of the present application provide a display panel and a display module, which can increase the effective binding area of ​​the binding pads of the display panel, so as to improve the binding yield of the pads.

[0004] In the first aspect, according to an embodiment of the present application, a display panel is provided, including a display area and a non-display area arranged around the display area, the non-display area including a binding area located on one side of the display area, and the display panel also includes: a substrate, including a substrate, a circuit wiring layer and a protective layer stacked and distributed along its own thickness direction, the protective layer is located in the binding area, the circuit wiring layer includes an extended signal line, and the extended signal line extends from the display area to the binding area; a conductive layer, in the binding area and located on the side of the protective layer away from the circuit wiring layer; at least one pad, the pad and the extended signal line are electrically connected to each other, the pad includes a binding portion located in the binding area and arranged on the same layer as the conductive layer, the binding portion includes a first binding sub-portion and a second binding sub-portion arranged around the first binding sub-portion, the difference in distance between a surface of the first binding sub-portion away from the substrate side and a surface of the second binding sub-portion away from the substrate side is less than or equal to

[0005] In the second aspect, according to an embodiment of the present application, a display module is provided, comprising: a display panel of any one of the first aspect embodiments of the present application; a control circuit board, comprising a substrate and an integrated circuit, a connecting circuit and a connecting terminal that are interconnected and arranged on one side of the substrate; a conductive adhesive layer, arranged between a soldering pad and a connecting terminal, the conductive adhesive layer comprising a conductive channel running through the layer, at least one conductive channel being electrically connected to a first binding sub-portion, and the connecting terminal being bound and connected to the soldering pad via the conductive channel.

[0006] In the display panel and display module provided by the embodiments of the present application, the difference in distance between the first binding sub-portion and the second binding sub-portion in the binding portion of the pad on the surface away from the substrate can be controlled within The morphology is well controlled. In the subsequent hot pressing bonding step, at least part of the conductive particles located in the first binding sub-portion can stably remain above the first binding sub-portion even if they are subjected to the extrusion force generated by hot pressing, which can increase the effective binding area of ​​the binding portion, thereby improving the binding yield of the pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0008] Figure 1 It is a schematic diagram of a planar structure of a display panel provided in the related art;

[0009] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;

[0010] Figure 3 yes Figure 1 Schematic diagram of the cross-sectional structure along the BB direction;

[0011] Figure 4 yes Figure 1 Another schematic diagram of the cross-sectional structure along the AA direction;

[0012] Figure 5 is a schematic diagram of the planar structure of a display panel provided by an embodiment of the first aspect of the present application;

[0013] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure along the CC direction;

[0014] Figure 7 yes Figure 5 Schematic diagram of the cross-sectional structure along the DD direction;

[0015] Figure 8 yes Figure 5 Another schematic diagram of the cross-sectional structure along the CC direction;

[0016] Fig. 9 yes Figure 5 Another schematic diagram of the cross-section structure along the DD direction;

[0017] Fig.10 yes Figure 5 Another schematic diagram of the cross-sectional structure along the CC direction;

[0018] Fig.11 yes Figure 5Another schematic diagram of the cross-section structure along the DD direction;

[0019] Fig.12 yes Figure 5 Another schematic diagram of the cross-sectional structure along the CC direction;

[0020] Fig.13 yes Figure 5 Another schematic diagram of the cross-section structure along the DD direction;

[0021] Fig.14 yes Figure 5 Another schematic diagram of the cross-sectional structure along the CC direction;

[0022] Fig.15 yes Figure 5 Another schematic diagram of the cross-section structure along the DD direction;

[0023] Fig.16 It is a schematic diagram of the planar structure of a display module provided by an embodiment of the second aspect of the present application;

[0024] Fig.17 yes Fig.16 Schematic diagram of the cross-sectional structure along the EE direction.

[0025] in:

[0026] 100-display panel; AA-display area; NA-non-display area; BA-binding area;

[0027] 10-base plate; 11-substrate; 111-groove;

[0028] 12-circuit wiring layer; 121-body;

[0029] 13-protective layer; 130a-first surface; 130b-second surface; 131-first protective sublayer; 132-second protective sublayer; 133-via; 133a-first opening; 133b-second opening; 133c-sidewall;

[0030] SL-extended signal line; SL0-redundant routing;

[0031] 20-conductive layer; 21-binding portion; 211-first binding sub-portion; 212-second binding sub-portion; PAD-pad;

[0032] 30-planarization layer; 40-light-emitting functional layer; 50-encapsulation layer;

[0033] 60-touch function layer; 61-first electrode layer; 62-second electrode layer; 63-insulating layer;

[0034] 70- extension;

[0035] 200-control circuit board; 210-substrate; 220-integrated circuit; 230-connection circuit; 240-connection terminal;

[0036] 300-conductive adhesive layer; 310-conductive channel;

[0037] 1000-Display module.

[0038] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0039] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0040] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the display panel and display module of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0041] Figure 1 shows a planar structure of a display panel provided in the related art, Figure 2 Shows Figure 1 The cross-sectional structure along the AA direction, Figure 3 Shows Figure 1 The cross-sectional structure along the BB direction, Figure 4 Shows Figure 1 Another cross-sectional structure along the AA direction.

[0042] See also Figures 1 to 4In the related art, an insulating protective layer needs to be arranged on the sidewall of the edge area of ​​the binding structure to prevent the sidewall of the binding structure from being etched in the subsequent metal film layer graphic processing process, such as the metal wet etching process. At the same time, an opening needs to be provided on the insulating protective layer just above the corresponding binding structure to expose at least part of the binding structure, so as to facilitate the subsequent binding process of the display panel and the printed circuit board.

[0043] In order to further improve the binding yield of the binding structure and prevent partial etching of the surface of the binding structure in the subsequent process of patterning the film layer made of the same material as the binding structure, which makes the binding surface of the binding structure bumpy and the contact resistance increased, in the process of patterning the film layer made of the same material as the binding structure, a pattern of an electrical connection layer is simultaneously prepared directly above the binding structure to cover the opening of the insulating protective layer. The electrical connection layer can be electrically connected to the binding structure, and the electrical connection layer can extend the portion of the binding structure that can actually be effectively overlapped to the side of the insulating protective layer away from the pad. This can further improve the binding yield of the binding structure and prevent partial etching of the surface of the binding structure in the subsequent process of patterning the film layer made of the same material as the binding structure.

[0044] However, in the related art, in order to further reduce the thickness of the display panel, although part of the structure of the protective layer located around the binding structure is prepared in the same process flow as the planarization layer located in the display area, due to the use of a half-tone mask (HTM) process, the exposure amount of the area around the binding structure is slightly greater than the exposure amount of the display area. Therefore, the thickness of the protective layer in the area around the binding structure is slightly smaller than the thickness of the planarization layer in the display area.

[0045] The halftone mask in the HTM process includes not only fully light-transmitting opening areas and opaque areas, but also semi-transparent areas on the mask due to a coating pattern coated with a halftone material. By controlling the light transmittance of the semi-transparent area on the halftone mask, the thickness of the layer to be prepared by photolithography can be controlled, thereby controlling the thickness of the protective layer in the area surrounding the binding structure to be slightly smaller than the thickness of the planarization layer in the display area.

[0046] See also Figure 2 and Figure 3 However, the HTM process is currently used, which has a high process cost, and the semi-transparent area is affected by the fluctuation of the incoming halftone material coated, and the light transmittance of the semi-transparent area is also affected by the fluctuation, resulting in uneven thickness of the protective layer prepared in the semi-transparent area, and the morphology of the protective layer is affected by the fluctuation of the incoming halftone material.

[0047] See also Figure 4In the related art, after the HTM process is cancelled, the thickness of the protective layer located in the area around the binding structure is consistent with that of the planarization layer located in the display area, and the morphology control is worse, and the thickness fluctuation of the protective layer around the binding structure is larger.

[0048] At the same time, since the area of ​​the binding region and the area of ​​the binding structure are relatively fixed, the thicker the protective layer, the greater the fluctuation in the thickness control of the protective layer, and the greater the fluctuation range of the inclination angle between the side wall of the opening of the protective layer directly above the binding structure and the bottom surface of the protective layer, and the morphology control becomes further deteriorated.

[0049] The poor morphology of the protective layer results in the poor morphology of the electrical connection layer covering the protective layer and electrically connected to the binding structure. As a result, in the subsequent hot pressing bonding step with the driver integrated circuit board, the conductive particles in the dielectric adhesive layer between the electrical connection layer and the bonding end of the driver integrated circuit board may be squeezed out from the side corner area with the smallest thickness and inclination angle of the electrical connection layer before a stable connection channel is formed by hot pressing due to the extrusion force generated by hot pressing and the poor morphology of the electrical connection layer. As a result, an effective electrical connection channel cannot be formed on at least part of the electrical connection layer, and at least part of the electrical connection layer cannot be effectively used to bind the driver integrated circuit board. As a result, the binding structure is not firmly bound to the driver integrated circuit board, is easy to fall off, and has a low binding yield.

[0050] In order to solve the above-mentioned technical problems and meet technical needs, the embodiments of the present application provide a display panel and a display module.

[0051] Figure 5 The planar structure of the display panel 100 provided by the embodiment of the first aspect of the present application is shown. Figure 6 Shows Figure 5 The cross-sectional structure along the CC direction, Figure 7 Shows Figure 5 Cross-sectional structure along DD direction.

[0052] See also Figures 5 to 7 In the first aspect, an embodiment of the present application provides a display panel 100, including a display area AA and a non-display area NA arranged around the display area AA, the non-display area NA includes a binding area BA located on one side of the display area AA, and the display panel 100 also includes a substrate 10, a conductive layer 20 and at least one pad PAD.

[0053] The substrate 10 includes a substrate 11, a circuit wiring layer 12 and a protection layer 13 stacked along its thickness direction. The protection layer 13 is located in the binding area BA. The circuit wiring layer 12 includes an extended signal line SL extending from the display area AA to the non-display area NA.

[0054] The conductive layer 20 is at least partially in the binding area BA and is located on a side of the protection layer 13 away from the circuit wiring layer 12 .

[0055] At least one pad PAD, the pad PAD is electrically connected to the extended signal line SL, the pad PAD includes a binding portion 21 located in the binding area BA and arranged in the same layer as the conductive layer 20, the binding portion 21 includes a first binding sub-portion 211 and a second binding sub-portion 212 arranged around the first binding sub-portion 211, and the difference between the surface of the first binding sub-portion 211 away from the substrate 10 and the surface of the second binding sub-portion 212 away from the substrate 10 is less than or equal to

[0056] In the first aspect, the display panel 100 provided by the embodiment of the present application has a difference in distance between the first binding sub-portion 211 and the second binding sub-portion 212 in the binding portion 21 of the pad PAD on the surface away from the substrate 10, which can be controlled within The morphology is well controlled. In the subsequent hot pressing bonding step, at least part of the conductive particles located in the first binding sub-portion 211 can be stably retained directly above the first binding sub-portion 211 even if subjected to the extrusion force generated by hot pressing, thereby increasing the effective binding area of ​​the binding portion 21, thereby improving the binding yield of the pad PAD.

[0057] The substrate 10 includes a substrate 11 , a circuit wiring layer 12 and a protective layer 13 . The substrate 11 is used to support other functional structures of the display panel 100 . The substrate 11 may be a glass substrate 11 or a polyimide (PI) substrate 11 used for the flexible display panel 100 .

[0058] The circuit wiring layer 12 is used to arrange the circuit routing of the functional structure of the control display panel 100, and the protection layer 13 is used to flatten the binding area BA to make the binding area BA as flat as possible, so as to facilitate the control of the binding part 21 structure arranged in the binding area BA at the same layer as the conductive layer 20 in the pad PAD.

[0059] Optionally, in the circuit wiring layer 12, a partial structure of a pad PAD is also provided in the binding area BA, and the protective layer 13 is used to protect the pad PAD structure in the circuit wiring layer 12. The binding part 21 also needs to pass through the protective layer 13 in the binding area BA to be electrically connected to the pad PAD structure in the circuit wiring layer 12.

[0060] The non-display area NA surrounding the display area AA in the display panel 100 needs to lead out the wiring in the circuit wiring layer 12 in the display area AA on one side to bind with other control structures outside the display panel 100. Therefore, the wiring is led out to the non-display area NA to achieve binding with other control structures outside the display panel 100.

[0061] At the same time, the circuit wiring layer 12 is provided with an extended signal line SL extending from the display area AA to the non-display area NA, and the binding area BA is provided with at least one pad PAD, the pad PAD is electrically connected to the extended signal line SL, and the extended signal line SL can transmit control signals from the binding area BA to the related structures in the display area AA.

[0062] At least part of the structure of the pad PAD is arranged in the binding area BA. The difference between the pad PAD and the routing is that the pad PAD and the routing are both metal pattern structures, but the routing has a smaller plane area and a thicker thickness, which facilitates the dense arrangement of multiple routings in a narrow area, while the pad PAD has a larger plane area and a thinner thickness, which facilitates the binding and connection of other structures with it. In fact, the pad PAD and the routing are divided for different functions and have metal patterns of different shapes.

[0063] In the related art, the pad PAD may be a single metal layer or a multi-layer metal layer structure. The formation of the multi-layer metal layer structure of the pad PAD is related to the number of metal film layers of the same material as the pad PAD in the display panel 100. The metal film layer prepared later needs to reserve a conductive pattern of the same shape as the pad PAD in the binding area BA to prevent the pad PAD from being etched at the same time during the graphic process of the metal film layer prepared later, resulting in pits on the surface of the pad PAD and increased contact resistance.

[0064] Therefore, the arrangement of the conductive layer 20 in the bonding area BA is to form a bonding portion 21 in the pad PAD structure.

[0065] Optionally, the binding portion 21 covers the main structure of the pad PAD located below the binding portion 21, thereby protecting the main structure of the pad PAD, and the binding portion 21 is electrically connected to the main structure of the pad PAD to achieve binding with other control structures and transmit the signal from the binding area BA to the functional structure of the display area AA.

[0066] Optionally, the binding part 21 can also directly serve as a pad PAD, and the extended signal line SL is directly electrically connected to the binding part 21. The binding part 21 is bound to other control structures and directly transmits the signal from the binding area BA to the functional structure of the display area AA.

[0067] The specific structure of the pad PAD will be further described in conjunction with subsequent embodiments.

[0068] By controlling the morphology of the protective layer 13, the morphology of the binding portion 21 is made as flat as possible, and the difference in distance between the first binding sub-portion 211 located in the central area of ​​the binding portion 21 and the second binding sub-portion 212 surrounding the first binding sub-portion 211 and located in the edge area of ​​the binding portion 21, and the first binding sub-portion 211 and the second binding sub-portion 212 on the side away from the substrate 10 can be controlled within Therefore, in the subsequent binding process, the conductive particles in the dielectric glue layer above the first binding sub-portion 211 will not be directly lost due to the squeezing force, and a connection channel can be stably formed above the first binding sub-portion 211, thereby increasing the effective binding area of ​​the binding portion 21, thereby improving the binding yield.

[0069] Optionally, the binding part 21 is directly used as a pad PAD, and the protective layer 13 completely covers the binding area BA. The first binding sub-part 211 and the second binding sub-part 212 in the binding part 21 are always located in the same plane on the surface away from the side of the substrate 10. The morphology of the binding part 21 is relatively flat, which can increase the area of ​​the binding part 21 effectively used for binding, thereby improving the binding yield.

[0070] Optionally, in the circuit wiring layer 12, a partial structure of a pad PAD is also provided in the binding area BA, and the binding portion 21 also needs to pass through the protective layer 13 in the binding area BA to be electrically connected to the pad PAD structure in the circuit wiring layer 12, and the first binding sub-portion 211 sinks along the opening of the protective layer 13 to overlap with the partial structure of the pad PAD located in the circuit wiring layer 12, and by controlling the thickness of the protective layer 13, or the height of the protective layer 13 protruding from the circuit wiring layer 12, the difference in distance between the first binding sub-portion 211 and the second binding sub-portion 212 on the surface away from the substrate 10 can be controlled within The morphology of the binding portion 21 can also be better controlled, and the area of ​​the binding portion 21 effectively used for binding can be increased, thereby improving the binding yield.

[0071] The specific configuration of controlling the morphology of the binding portion 21 will be further described in conjunction with subsequent embodiments.

[0072] The conductive layer 20 and the protective layer 13 in the embodiment of the present application can be prepared separately and / or prepared in the same layer as part of the film layer of the display area AA. The specific relationship between the conductive layer 20 and the protective layer 13 and the film layer structure of the display area AA will be further explained in conjunction with other subsequent embodiments.

[0073] See also Figures 5 to 7 In some embodiments, the protective layer 13 completely covers the binding area BA, and the pad PAD also includes an extension portion 70, which extends from the binding portion 21 to be electrically connected to the extended signal line SL, and the surfaces of the first binding sub-portion 211 and the second binding sub-portion 212 away from the substrate 10 are located in the same plane.

[0074] In these embodiments, the extended signal line SL is directly electrically connected to the extended portion 70 extending from the binding portion 21. The binding portion 21 alone performs the binding function of the pad PAD, and there is no need to reserve an opening in the protective layer 13 for electrical connection with the underlying layer structure. Therefore, the difference in vertical distance between the first binding sub-portion 211 and the second binding sub-portion 212 can be ignored, and the morphology of the binding sub-portion is relatively flat, which can further increase the area of ​​the binding portion 21 that is effectively used for binding, thereby improving the binding yield.

[0075] Optionally, the extension portion 70 and the binding portion 21 are always arranged in the same layer, and the extended signal line SL is electrically connected to the extension portion 70 located in the conductive layer 20 through a via in the circuit wiring layer 12 .

[0076] Optionally, the extension portion 70 is provided in the same layer as a part of the binding portion 21 , and the extension portion 70 is further extended to the circuit wiring layer 12 through the replacement hole, and is electrically connected to the extension signal line SL in the circuit wiring layer 12 .

[0077] Figure 8 Shows Figure 5 Another cross-sectional structure along the CC direction, Fig. 9 Shows Figure 5 Another cross-sectional structure along the DD direction, Fig.10 Shows Figure 5 Another cross-sectional structure along the CC direction, Fig.11 Shows Figure 5 Another cross-sectional structure along the DD direction.

[0078] See also Figures 8 to 11 In some embodiments, the extended signal line SL further includes a redundant line SL0, and the redundant line SL0 continues to extend to the binding area BA in a direction close to the pad PAD at the location where the extended signal line SL and the pad PAD are electrically connected to each other.

[0079] In these embodiments, even if the structure of the pad PAD in the circuit wiring layer 12 is cancelled, the redundant trace SL0 of the extended signal line SL is still retained and extended to the binding area BA, so that unconventional process flow detection can be implemented.

[0080] The structure prepared by the pad PAD in the circuit wiring layer 12 is still retained, and is retained as a redundant routing SL0 of the extended signal line SL. In unconventional process flow detection, for example, when the display panel 100 is not fully prepared, the redundant routing SL0 of the extended signal line SL located in the binding area BA of the non-display area NA can be used to detect other routing circuits located in the circuit wiring layer 12 that are electrically connected to the extended signal lines SL. There is no need to wait until the entire circuit wiring layer 12 and the conductive layer 20 are completed. The routing circuits of the circuit wiring layer 12 can be detected through the binding portion 21 of the pad PAD, and the detection process can be flexibly adjusted to improve production efficiency.

[0081] Please continue reading Figure 8 In some embodiments, the protection layer 13 includes a first protection sublayer 131 , and the first protection sublayer 131 is made of an organic material.

[0082] In these embodiments, the protective layer 13 only retains the first protective sublayer 131 made of organic material, which is thicker, has less stress, has a better flatness effect, is not easily squeezed, stretched or deformed in subsequent process steps, and can play a better protective role.

[0083] See also Fig.10 In some embodiments, the protective layer 13 further includes a first protective sublayer 131 and a second protective sublayer 132 stacked and distributed along its thickness direction, the first protective sublayer 131 is made of an organic material, and the second protective sublayer 132 is made of an inorganic material.

[0084] In these embodiments, the first protective sublayer 131 made of organic material in the protective layer 13 is thicker, can play a better protective role, and has a better flatness effect; the second protective sublayer 132 made of inorganic material in the protective material is thinner and has a better coating effect, which can further isolate water and oxygen from entering the pads PAD of the binding area BA and other structures in the circuit wiring layer 12 located in the binding area BA, thereby further enhancing the protective effect.

[0085] See also Fig. 9 and Fig.11 In some embodiments, the display area AA also includes a planarization layer 30, a light-emitting function layer 40, a packaging layer 50 and a touch function layer 60, which are stacked and distributed in sequence along the thickness direction of the circuit wiring layer 12 and located on the side away from the substrate 11.

[0086] The first protection sub-layer 131 and the planarization layer 30 are formed by the same preparation process.

[0087] In these embodiments, the first protective sublayer 131 is prepared at the same layer as the planarization layer 30 , and the first protective sublayer 131 and the planarization layer 30 are made of the same material, thereby greatly reducing the preparation process of the display panel 100 , saving time, and improving production efficiency.

[0088] See also Fig.11 In some embodiments, the touch function layer 60 further includes a first electrode layer 61 , an insulating layer 63 , and a second electrode layer 62 which are sequentially stacked and distributed along the thickness direction thereof.

[0089] The conductive layer 20 and the second electrode layer 62 are formed by adopting the same MASK process, and the second protective sublayer 132 and the insulating layer 63 are formed by adopting the same preparation process.

[0090] In these embodiments, the second protective sublayer 132 is prepared on the same layer as the insulating layer 63, the conductive layer 20 is prepared on the same layer as the second electrode layer 62, the conductive layer 20 and the second electrode layer 62 are made of the same material, and the second protective sublayer 132 and the insulating layer 63 are made of the same material, thereby greatly reducing the preparation process of the display panel 100, saving time, and improving production efficiency.

[0091] The touch function layer 60 is a mutual capacitive touch panel having a two-layer electrode structure of a first electrode layer 61 and a second electrode layer 62 .

[0092] Optionally, the touch function layer 60 can also be set as a self-capacitive touch panel, including an insulating layer 63 and a touch electrode layer. The conductive layer 20 and the touch electrode layer are prepared by the same MASK process. The conductive layer 20 and the second electrode layer 62 are made of the same material, which can also greatly reduce the preparation process of the display panel 100, save time and improve production efficiency.

[0093] Fig.12 Shows Figure 5 Another cross-sectional structure along the CC direction, Fig.13 Shows Figure 5 Another cross-sectional structure along the DD direction, Fig.14 Shows Figure 5 Another cross-sectional structure along the CC direction, Fig.15 Shows Figure 5 Another cross-sectional structure along the DD direction.

[0094] See also Figures 12 to 15 In some embodiments, the pad PAD further includes a body portion 121 disposed on the same layer as the circuit wiring layer 12, the protective layer 13 covers at least a portion of the edge of the body portion 121, and the distance between the surface of the protective layer 13 away from the substrate 11 and the substrate 11 is less than or equal to

[0095] The protective layer 13 also includes at least one via 133 passing through itself, and the orthographic projection of the via 133 on the substrate 11 at least partially overlaps with the orthographic projection of the first binding sub-section 211 on the substrate 11. The extended signal line SL is electrically connected to the main body 121, and the first binding sub-section 211 is electrically connected to the main body 121 through the via 133.

[0096] In these embodiments, the first binding sub-portion 211 of the binding portion 21 is electrically connected to the main body portion 121 of the pad PAD on the circuit wiring layer 12 through the via hole 133 on the protection layer 13, and the extended signal line SL is directly extended to be electrically connected to the main body portion 121, and the distance between the surface of the protection layer 13 away from the substrate 11 and the substrate 11 is controlled to be less than or equal to The protective layer 13 can protect the pad PAD body 121, and the difference in distance between the first binding sub-portion 211 and the second binding sub-portion 212 in the binding portion 21 on the side away from the substrate 11 can ensure that the bonding pad 121 is not damaged. The effective area of ​​the binding portion 21 used for binding can be increased, thereby improving the binding yield.

[0097] The first binding sub-portion 211 is arranged on the surface of one side of the main body 121 of the circuit wiring layer 12 away from the substrate 11, and the thickness of the main body 121 is about the thickness of two layers of wiring, that is, The distance between the main body 121 and the surface of the substrate 11 is also At the same time, the second binding sub-portion 212 is arranged to fit the surface of the protective layer 13 away from the substrate 11. Therefore, the difference in surface distance between the first binding sub-portion 211 and the second binding sub-portion 212 away from the substrate 10 can be controlled by controlling the distance between the surface of the protective layer 13 away from the substrate 11 and the substrate 11 to be less than or equal to Control The effective area of ​​the binding portion 21 used for binding can be further increased, thereby improving the binding yield.

[0098] See also Figures 12 to 13 In some embodiments, the protective layer 13 includes a second protective sublayer 132, the second protective sublayer 132 is made of an inorganic material, and the thickness of the protective layer 13 does not exceed

[0099] In these embodiments, the protective layer 13 includes a second protective sublayer 132 made of an inorganic material. The second protective sublayer 132 is thin and has good wrapping properties. The second protective sublayer 132 can be arranged in close contact with the main body 121. The second binding sub-portion 212 is arranged in close contact with the surface of the second protective sublayer 132 away from the substrate 11. The first binding sub-portion 211 is arranged in close contact with the main body 121 away from the substrate 11. Therefore, the difference in surface distance between the first binding sub-portion 211 and the second binding sub-portion 212 on the side away from the substrate 10 is actually the thickness of the second protective sublayer 132 itself, which is approximately So as to be able to control The effective area of ​​the binding portion 21 used for binding can be increased, thereby improving the binding yield.

[0100] See also Figures 12 to 13 In some embodiments, the protective layer 13 includes a first surface 130a and a second surface 130b sequentially arranged in a direction away from the substrate 11, and the via 133 includes a first opening 133a, a side wall 133c and a second opening 133b sequentially arranged in a direction away from the substrate 11, the first opening 133a is located on the first surface 130a, the second opening 133b is located on the second surface 130b, and the inclination angle between the side wall 133c and the first surface 130a does not exceed 90°.

[0101] In these embodiments, the protective layer 13 including the second protective sublayer 132 made of inorganic material is relatively thin. When the area of ​​the binding area BA remains unchanged, the inclination angle between the side wall 133c on the protective layer 13 and the first surface 130a is smaller and better controlled, and can be no more than 90°. The morphology of the protective layer 13 is better controlled, and at the same time, the morphology of the binding portion 21 is better controlled, which can further increase the area of ​​the binding portion 21 effectively used for binding, thereby improving the binding yield.

[0102] When the area of ​​the binding region BA remains unchanged and the cross-sectional area of ​​the via 133 of the protective layer 13 cannot be adjusted, the thinner the thickness of the protective layer 13 is, the smaller the inclination angle between the side wall 133c in the via 133 and the first surface 130a can be made, and the fluctuation range of the inclination angle can be better controlled, then the morphology of the entire protective layer 13 and the via 133 can be better controlled, and when the conductive particles of the dielectric glue layer can remain in the first binding sub-portion 211 in the subsequent binding process to stably form a connection channel, and will not flow out from the worst morphology of the via 133 of the protective layer 13 due to the squeezing force, the first binding sub-portion 211 can serve as the effective area for the binding connection of the binding portion 21, thereby further improving the binding yield.

[0103] See also Figures 14 to 15In some embodiments, the substrate 11 further includes a groove 111 in the binding area BA, at least part of the protection layer 13 is located in the groove 111, and the main body 121 of the pad PAD is staggered from the groove 111 in the orthographic projection of the substrate 11.

[0104] In these embodiments, the protective layer 13 is filled in the groove 111, which can reduce the distance between the surface of the protective layer 13 away from the substrate 11 and the surface of the substrate 11 itself. When the thickness of the pad PAD body 121 remains unchanged, the difference in surface distance between the first binding sub-portion 211 and the second binding sub-portion 212 on the side away from the substrate 10 can be further reduced. The effective area of ​​the binding portion 21 used for binding can be increased, thereby improving the binding yield.

[0105] The body 121 of the pad PAD is staggered with the groove 111 so that the groove 111 does not affect the original arrangement of the body 121 of the pad PAD on the substrate 11 , and there is no need to redesign the pattern of the body 121 of the pad PAD.

[0106] See also Figures 14 to 15 In some embodiments, the depth of the groove 111 is greater than or equal to

[0107]

[0108] In these embodiments, the thickness of the protective layer 13 is approximately The protective layer 13 at least partially fills the groove 111, so that the distance between the surface of the protective layer 13 away from the substrate 11 and the surface of the substrate 11 is reduced to Since the first binding sub-portion 211 is arranged on the surface of the main body 121 of the circuit wiring layer 12 away from the substrate 11, and the thickness of the main body 121 is about the thickness of two layers of wiring, that is, The distance between the main body 121 and the surface of the substrate 11 is also At the same time, the second binding sub-portion 212 is arranged to be attached to the surface of the protective layer 13 away from the substrate 11, so the difference in surface distance between the first binding sub-portion 211 and the second binding sub-portion 212 away from the substrate 10 can be controlled within The effective area of ​​the binding portion 21 used for binding can be further increased, thereby improving the binding yield.

[0109] See also Figures 12 to 15In some embodiments, the display area AA also includes a planarization layer 30, a light-emitting function layer 40, an encapsulation layer 50, and a touch function layer 60, which are stacked in sequence along the thickness direction of the circuit wiring layer 12 and located on the side away from the substrate 11. The touch function layer 60 also includes a first electrode layer 61, an insulating layer 63, and a second electrode layer 62, which are stacked in sequence along the thickness direction of the circuit wiring layer 12.

[0110] The conductive layer 20 and the second electrode layer 62 are formed by adopting the same MASK process, and the second protective sublayer 132 and the insulating layer 63 are formed by adopting the same preparation process.

[0111] In these embodiments, the second protective sublayer 132 is prepared on the same layer as the insulating layer 63, the conductive layer 20 is prepared on the same layer as the second electrode layer 62, the conductive layer 20 and the second electrode layer 62 are made of the same material, and the second protective sublayer 132 and the insulating layer 63 are made of the same material, thereby greatly reducing the preparation process of the display panel 100, saving time, and improving production efficiency.

[0112] Fig.16 The planar structure of the display module 1000 provided by the second embodiment of the present application is shown. Fig.17 Shows Fig.16 Cross-sectional structure along EE direction.

[0113] See also Figures 16 to 17 In the second aspect, the embodiment of the present application further provides a display module 1000, comprising the display panel 100, the control circuit board 200 and the conductive adhesive layer 300 provided in any embodiment of the first aspect.

[0114] The control circuit board 200 includes a substrate 210 and an integrated circuit 220 , a connection line 230 and a connection terminal 240 which are arranged on one side of the substrate 210 and are connected to each other.

[0115] The conductive adhesive layer 300 is disposed between the pad PAD and the connecting terminal 240 . The conductive adhesive layer 300 includes a conductive channel 310 running through the conductive adhesive layer 300 . At least one conductive channel 310 is electrically connected to the first binding sub-portion 211 . The connecting terminal 240 is bound to the pad PAD through the conductive channel 310 .

[0116] Secondly, the display module 1000 provided in the embodiment of the present application can stably form at least one conductive channel 310 between the first binding sub-portion 211 and the connecting terminal 240, which can further increase the area of ​​the binding portion 21 effectively used for binding, thereby improving the binding yield.

[0117] At the same time, the display module 1000 provided in the embodiment of the present application includes the display panel 100 provided in any first aspect embodiment of the present application, and therefore also has the beneficial effects of the display panel 100 provided in any first aspect embodiment of the present application, which will not be repeated here.

[0118] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0119] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, comprising a display area and a non-display area arranged around the display area, wherein the non-display area comprises a binding area located on one side of the display area, characterized in that: The display panel further includes: A substrate, comprising a substrate, a circuit wiring layer and a protective layer stacked and distributed along the thickness direction thereof, wherein the protective layer is located in the binding area, and the circuit wiring layer comprises an extended signal line, wherein the extended signal line extends from the display area to the non-display area; A conductive layer, at least partially located in the binding area and on a side of the protective layer away from the circuit wiring layer; at least one pad, the pad being electrically connected to the extended signal line, the pad comprising a binding portion located in the binding area and disposed in the same layer as the conductive layer, the binding portion comprising a first binding sub-portion and a second binding sub-portion disposed around the first binding sub-portion, the difference in distance between a surface of the first binding sub-portion away from the substrate and a surface of the second binding sub-portion away from the substrate being less than or equal to 2. The display panel according to claim 1, characterized in that: The protective layer completely covers the binding area, and the pad also includes an extension portion, which extends from the binding portion to be electrically connected to the extended signal line, and the surfaces of the first binding sub-portion and the second binding sub-portion away from the substrate are located in the same plane.

3. The display panel according to claim 2, characterized in that: The extended signal line further includes a redundant routing line, and the redundant routing line continues to extend to the binding area in a direction close to the pad at a location where the extended signal line and the pad are electrically connected to each other.

4. The display panel according to claim 2, characterized in that: The protection layer includes a first protection sublayer made of an organic material.

5. The display panel according to claim 4, characterized in that: The protective layer further comprises the first protective sublayer and the second protective sublayer which are stacked and distributed along the thickness direction of the protective layer. The first protective sublayer is made of an organic material, and the second protective sublayer is made of an inorganic material.

6. The display panel according to claim 5, characterized in that: The display area also includes a planarization layer, a light-emitting function layer, a packaging layer, and a touch function layer, which are stacked and distributed in sequence along the thickness direction of the circuit wiring layer on the side away from the substrate; The first protection sublayer and the planarization layer are formed by adopting the same preparation process.

7. The display panel according to claim 6, characterized in that: The touch function layer further comprises a first electrode layer, an insulating layer and a second electrode layer which are sequentially stacked and distributed along the thickness direction of the touch function layer; The conductive layer and the second electrode layer are formed by adopting the same MASK process, and the second protective sublayer and the insulating layer are formed by adopting the same preparation process.

8. The display panel according to claim 1, characterized in that: The pad also includes a main body portion disposed in the same layer as the circuit wiring layer, the protective layer covers at least a portion of the edge of the main body portion, and the distance between the surface of the protective layer away from the substrate and the substrate is less than or equal to The protective layer also includes at least one via hole passing through itself, the orthographic projection of the via hole on the substrate at least partially overlaps with the orthographic projection of the first binding sub-unit on the substrate, the extended signal line is electrically connected to the main body, and the first binding sub-unit is electrically connected to the main body through the via hole.

9. The display panel according to claim 8, characterized in that: The protective layer includes a second protective sublayer, the second protective sublayer is made of an inorganic material, and the thickness of the protective layer does not exceed 10. The display panel according to claim 9, characterized in that: The protective layer includes a first surface and a second surface arranged in sequence along a direction away from the substrate, and the via includes a first opening, a side wall, and a second opening arranged in sequence along a direction away from the substrate, the first opening is located on the first surface, the second opening is located on the second surface, and the inclination angle between the side wall and the first surface does not exceed 90°.

11. The display panel according to claim 8, characterized in that: The substrate further comprises a groove in the binding area, at least a portion of the protection layer is located in the groove, and the main body of the pad is staggered with the groove in the orthographic projection of the substrate.

12. The display panel according to claim 11, characterized in that: The depth of the groove is greater than or equal to 13. The display panel according to claim 9, characterized in that: The display area also includes a planarization layer, a light-emitting function layer, a packaging layer, and a touch function layer, which are stacked and distributed in sequence along the thickness direction of the circuit wiring layer and are located on a side of the circuit wiring layer away from the substrate. The touch function layer also includes a first electrode layer, an insulating layer, and a second electrode layer, which are stacked and distributed in sequence along the thickness direction of the touch function layer; The conductive layer and the second electrode layer are formed by adopting the same MASK process, and the second protective sublayer and the insulating layer are formed by adopting the same preparation process.

14. A display module, characterized in that: include: The display panel according to any one of claims 1 to 13; A control circuit board, comprising a substrate and an integrated circuit, a connecting circuit and a connecting terminal arranged on one side of the substrate and connected to each other; A conductive adhesive layer is arranged between the pad and the connecting terminal, the conductive adhesive layer includes a conductive channel running through the conductive adhesive layer, at least one of the conductive channels is electrically connected to the first binding sub-portion, and the connecting terminal is bound and connected to the pad through the conductive channel.

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