Device for reducing misalignment between sputtering target and shield

Abstract

A spacer guide on a dark space shield for a sputtering chamber includes a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body configured to rest on an end of the dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against an outer surface of the dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shield.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to U.S. Patent Application No. 18 / 195,985 filed on May 11, 2023 and U.S. Provisional Application No. 63 / 390,052 filed on July 18, 2022, both of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to a device and method of use for reducing misalignment between a sputtering target and a shield. Background Art

[0004] Physical vapor deposition ("PVD") processes are used to form thin films or layers of material on a variety of substrates. PVD processes can be used, for example, in semiconductor manufacturing processes to form metallization layers in the manufacture of integrated circuit structures and devices. In one PVD process, known as sputtering, atoms are ejected from the surface of a sputtering target by bombardment with gas ions such as argon. The sputtering target is therefore the source of material that is deposited on the substrate.

[0005] In some current PVD chambers, the process kit or dark space shield is mounted to the main body of the PVD chamber. The sputtering target is mounted separately from the shield on a removable cover of the PVD chamber. In use, when the cover is closed, the sputtering target is lowered into the chamber body.

[0006] It has been found that misalignment between the dark space shield and the sputtering target can cause a variety of performance issues such as arcing, particle formation, and film non-uniformity.A device and method for improving the alignment of a dark space shield and a sputtering target is needed. Summary of the invention

[0007] These and other needs are addressed by various aspects and configurations of the present disclosure.

[0008] In embodiment 1, a spacing guide for a dark space shield of a sputtering chamber, wherein the spacing guide comprises a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the end of the dark space shield; a first leg extending laterally from the first end of the horizontal body and being configured to rest against an outer surface of the dark space shield; and a second leg extending laterally from the second end of the horizontal body and being configured to rest against an inner surface of the shield. The horizontal body, the first leg, and the second leg are formed of insulating material.

[0009] In Example 2, the spacing guide of Example 1, wherein the thickness of the horizontal body is about 1 mm to about 30 mm.

[0010] In Example 3, the spacing guide of Example 1, wherein the thickness of the second leg does not exceed about 30 mm.

[0011] In Example 4, the spacing guide of Example 1, wherein the width, length and thickness of the first leg and the second leg are different.

[0012] In Example 5, the spacing guide of Example 1, wherein the horizontal body, the first leg and the second leg are formed integrally.

[0013] In Example 6, a dark space shield assembly for use in a sputtering chamber, wherein the dark space shield assembly includes an annular dark space shield having a first end configured to be close to a substrate support base and a second end configured to be close to a sputtering target; and a plurality of spacing guides positioned on the second end of the annular dark space shield. Each spacing guide includes a horizontal body having a first end, a second end opposite to the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and being configured to rest against an outer surface of the annular dark space shield; and a second leg extending laterally from the second end of the horizontal body and being configured to rest against an inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

[0014] In Example 7, the dark space shield assembly of Example 6, wherein the plurality of spaced guides are attached to the annular dark space shield only by friction.

[0015] In Example 8, the dark space shield assembly of Example 6, wherein the plurality of spaced guides are attached to the annular dark space shield by fasteners.

[0016] In Example 9, the dark space shield assembly of Example 6, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the horizontal axis within about 5 mm.

[0017] In Example 10, the dark space shield assembly of Example 9, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the horizontal axis within about 1 mm.

[0018] In Example 11, the dark space shield assembly of Example 9, wherein the thickness of the horizontal body does not exceed about 30 mm.

[0019] In Example 12, the dark space shield assembly of Example 9, wherein the thickness of the second leg is no more than about 30 mm.

[0020] In Example 13, a sputtering chamber assembly includes a sputtering target; an annular dark space shield having a first end configured to be close to a substrate support base and a second end configured to be close to the sputtering target; and a plurality of spacing guides positioned on the second end of the annular dark space shield. Each spacing guide includes a horizontal body having a first end, a second end opposite to the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and being configured to rest against an outer surface of the annular dark space shield; and a second leg extending laterally from the second end of the horizontal body and being configured to rest against an inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

[0021] In Example 14, the sputtering chamber assembly of Example 13, wherein the plurality of spaced guides are attached to the annular dark space shield solely by friction.

[0022] In Example 15, the sputtering chamber assembly of Example 13, wherein the plurality of spacer guides are attached to the annular dark space shield by fasteners.

[0023] In Example 16, the sputtering chamber assembly of Example 13, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the horizontal axis to within about 1 mm.

[0024] In Example 17, the sputtering chamber assembly of Example 16, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the vertical axis within 1 mm.

[0025] In Example 18, the sputtering chamber assembly of Example 13, wherein the thickness of the horizontal body is from about 1 mm to about 30 mm.

[0026] In Example 19, the sputtering chamber assembly of Example 13, wherein the thickness of the second leg portion does not exceed about 30 mm.

[0027] While multiple embodiments are disclosed, other embodiments of the present invention will be apparent to those skilled in the art from the following detailed description which shows and describes illustrative embodiments of the present invention.Accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a simplified cross-sectional view of physical vapor deposition chamber 100 .

[0029] Figure 2 is a schematic cross-sectional view of a portion of a sputtering chamber.

[0030] Figure 3 is a perspective view of an embodiment.

[0031] Figure 4A and Figure 4B is a perspective view of an alternative embodiment.

[0032] Figure 5 is a perspective view of a spacing guide.

[0033] Various modifications and additions may be made to the exemplary embodiments discussed without departing from the scope of the present invention. For example, while the embodiments described above refer to particular features, the scope of the present invention also includes embodiments having different combinations of features and embodiments that do not include all of the above features. DETAILED DESCRIPTION

[0034] Disclosed herein are sputtering chamber components and methods for use thereof for improving the alignment of a sputtering target with a dark space shield in a sputtering chamber. Embodiments of the present invention can reduce or prevent arc discharge between a sputtering target and a shield by improving the alignment between the sputtering target and the shield. As used herein, alignment refers to placing the sputtering target concentrically with the dark space shield so that the gap of the first distance between the outer edge of the sputtering target and the inner surface of the dark space shield is consistent or substantially consistent along the periphery of the sputtering target. During the sputtering process, a film is deposited on the flange of the sputtering target. The alignment between the sputtering target and the dark space shield is measured by removing the sputtering target from the sputtering chamber and determining the distance from the radial outer edge of the deposited film to the target sidewall at several positions near the parameters of the sputtering target. In one embodiment, the distance is determined by measuring the distance from the O-ring groove in the flange to the sidewall of the sputtering target with a caliper, measuring the distance from the O-ring groove in the flange to the radial outer edge of the deposited film with a caliper, and calculating the difference between the two values. The maximum distance determined is the misalignment.

[0035] Embodiments of the present invention may additionally or alternatively reduce particle formation by reducing arc discharge events. Arc discharge events generate particles. Particle deposition is undesirable because particles deposited on the substrate may damage devices with very small feature sizes manufactured on the substrate. Therefore, it is desirable to avoid the formation of particles in the chamber. Embodiments of the present invention may further or additionally improve the uniformity of the deposited film. Large misalignment between the sputtering target and the dark space shield may cause uneven gaps, which may form uneven electric fields between the dark space shield and the sputtering target. Uneven electric fields may cause uneven plasma distribution and, therefore, uneven film deposition on the substrate.

[0036] Figure 11 is a cross-sectional view of a physical vapor deposition chamber 100 including a chamber lid 134 and a chamber body 136. The chamber lid 134 is removable from the chamber body 136 and is shown in a Figure 1 in the closed position.

[0037] A sputtering target assembly 138 including a backing plate 146 and a sputtering target 106 may be mounted or removably attached to the chamber lid 134, for example, by pins or screws (not shown). When the chamber lid 134 is closed, the sputtering surface of the sputtering target 106 faces the substrate support pedestal 102. The sputtering target assembly 138 may be constructed of only a single piece.

[0038] The feed structure 110 and the source distribution plate 122 can be used to distribute power to the sputtering target 106. The feed structure 110 couples RF energy and optionally DC energy to the sputtering target 106. The feed structure 110 includes a body 112 having a first end 114, a second end 116, and a central opening 115. The first end 114 is coupled to an RF power source 118 and optionally to a DC power source 120, which can be used to supply RF power and DC power to the sputtering target 106. The second end 116 is coupled to the chamber lid 134. The central opening 115 extends from the first end 114 through the body 112 to the second end 116. The feed structure 110 can be made of a suitable conductive material to conduct the RF energy and DC energy from the RF power source 118 and the DC power source 120. Those skilled in the art will recognize that other configurations of feed structures can be used.

[0039] The source distribution plate 122 can be coupled to the second end 116 of the body 112 and can be used to distribute energy applied via the feed structure 110 to the peripheral edge of the sputtering target 106 through the conductive member 125. The source distribution plate 122 can include a hole 124 aligned with the central opening 115 of the body 112. The source distribution plate 122 can be made of a suitable conductive material to conduct RF energy and DC energy from the feed structure 110.

[0040] The conductive member 125 can be a tubular member having a first end 126 coupled to the source distribution plate 122 and a second end 130 coupled to the backing plate 146 of the sputtering target assembly. The ground shield 140 can cover the outer side surface of the chamber cover 134. The ground shield 140 can be made of a suitable conductive material. An insulating gap 139 is provided between the ground shield 140 and the outer surface of the source distribution plate 122, the conductive member 125, and the sputtering target 106 (and / or the backing plate 146). The insulating gap prevents RF current and DC current from being directly routed to ground. The insulating gap 139 can be filled with air or a suitable dielectric material, such as ceramic.

[0041] The chamber lid 134 can be rotatably opened from the top of the chamber body 136. In some cases, the chamber lid 134 can be opened to install or replace a sputtering target or for maintenance of the physical vapor deposition chamber 100. In some embodiments, the chamber lid 134 can be moved from a closed position to an open position about a horizontal rotation axis. For example, the chamber lid 134 can move in an arc between the closed position and the open position about the rotation axis.

[0042] The chamber body 136 may be formed by a grounded housing wall 108 and an upper chamber wall 142 and may contain a substrate support pedestal 102, an interior volume 144, and a dark space shield or process shield 150. The substrate support pedestal 102 receives the substrate 104.

[0043] The dark space shield 150 includes an annular body having an inner surface 152 and an outer surface 154 defining a central opening 158. The dark space shield 150 extends downwardly along the walls of the upper chamber wall 142 and the grounded housing wall 108 to below the top surface of the substrate support pedestal 102 and back upwardly until it reaches the top surface of the substrate support pedestal 102. The opposite end of the dark space shield 150 is proximate to the sputtering target 106. The dark space shield 150 is spaced apart from the sputtering target 106 by a radial gap 170.

[0044] In use, electrons are emitted from the negatively charged sputtering target 106. These electrons collide with argon atoms to form ionized atoms or plasma, which in turn accelerate toward the negatively charged sputtering target 106. The argon atoms strike the sputtering target 106, resulting in a chain reaction of many collisions and displacing atoms in the sputtering target 106, thereby forming a thin film on the substrate 104. In some embodiments, suitable substrates 104 include wafers for semiconductor manufacturing. For example, the sputtering target 106 is bombarded with energy until atoms from the surface are released into the surrounding atmosphere and subsequently deposited on the substrate 104. In some embodiments, plasma sputtering is used to deposit thin metal films onto wafers for electronic devices.

[0045] Figure 2 2 is a schematic cross-sectional view of a portion of a sputtering chamber 200. In the sputtering chamber 200, a dark space shield 250 radially surrounds a sputtering target 206 of a sputtering target assembly 238. Figure 2), the inner surface 252 of the dark space shield 250 is spaced apart from the outer surface or radial surface 288 of the sputtering target 206 by distances 277a and 277b (generally referred to as distance 277). In some embodiments, distance 277 may be between about 3 millimeters (mm) and about 6 mm, or between about 2 mm and about 4 mm. The misalignment between the sputtering target 106 and the dark space shield 250 causes the distance 277 of the parameters around the sputtering target 206 to be unequal. For example, it may cause 277a and 277b to be unequal. For example, if Figure 2 As shown, the dark space shield 250 is closer to the sputtering target 206 on the left side, resulting in a distance 277b that is larger than the distance 277a. In some embodiments, the radial gap 277 does not vary by more than about 5 mm, or about 2 mm, or about 1 mm around the periphery of the sputtering target 206. That is, for example, the distances 277a and 277b do not vary by more than about 1 mm from each other. As discussed herein, the misalignment of the sputtering target 206 with the dark space shield 250 may produce performance problems. It has been found that when the distance 277 varies by about 1 mm or less around the periphery of the sputtering target 206, or when the misalignment of the sputtering target 206 with the dark space shield 250 in the radial direction is about 1 mm or less, the performance of the sputtering target is generally more acceptable or improved.

[0046] In the vertical direction, the end of the dark space shield 250 is also spaced apart from the sputtering target assembly 238, and as shown in FIG. Figure 2 As shown, the distances 279 and 279b (commonly referred to as distance 279) are spaced apart from the backing plate 146. The misalignment of the dark space shield 250 with the sputtering target 206 may cause 279a and 279b to be unequal. In some embodiments, the distance 279 varies by no more than about 1 mm around the periphery of the sputtering target 206. That is, for example, the distances 279a and 279b vary by no more than about 1 mm from each other. As discussed herein, the misalignment of the sputtering target 206 with the dark space shield 250 may produce performance issues. It has been found that when the distance 279 varies by about 1 mm or less around the periphery of the sputtering target 206, or in other words, the misalignment of the sputtering target 206 with the dark space shield 250 in the vertical direction is about 1 mm or less, the performance of the sputtering target is acceptable or improved.

[0047] The spacing guide 290 is mounted or positioned on the end of the dark space shield 250. A portion of the spacing guide 290 is positioned between the end of the dark space shield 250 and the backing plate 246. Another portion of the spacing guide 290 is positioned between the radial surface 288 of the sputtering target 206 and the dark space shield 250. The spacing guide 290 maintains a minimum spacing between the sputtering target assembly 238 and the dark space shield 250. In the radial direction (or along the Figure 2The inner surface of the dark space shield 250 is spaced apart from the outer surface or radial surface 288 of the sputtering target 206 by a distance 277. In the vertical direction, the end of the shield 250 is spaced apart from the sputtering target assembly 238, and as shown in FIG. Figure 2 As shown, it is spaced apart from the backing plate 146 by a distance 279. Figure 2 In the embodiment of the present invention, the spacing guide 290 maintains the spacing at a minimum along the horizontal axis and the vertical axis. However, the spacing guide 290 can be designed to maintain the minimum along only one of the horizontal axis and the vertical axis. In some embodiments, the spacing guide 290 is designed so that the sputtering target 206 cannot be misaligned with the shield 250 by more than about 1 mm.

[0048] An appropriate number of spacing guides 290 may be used to space, align, or isolate the dark space shield 250 from the sputtering target 206. In some embodiments, three spacing guides 290 are positioned (such as equally spaced) on the ends of and around the circumference of the dark space shield 250. In some embodiments, more than three spacing guides 290 may be used on the dark space shield 250.

[0049] Figure 3 is a perspective view of an embodiment in which the spacing guide 290 ( Figure 3 The spacing guides 290 are located or resting on the end 251 of the dark space shield 250a. As shown, the spacing guides 290 extend from the end 251 of the dark space shield 250a. In this way, the spacing guides 290 can minimize the distance between the dark space shield 250a and the sputtering target 206 along the vertical axis. In some embodiments, the spacing guides 290 are equally spaced around the dark space shield 250a. In other embodiments, the spacing guides 290 are not equally spaced.

[0050] Figure 4A and Figure 4B 2 is a perspective view of another embodiment in which portions along the end 251 of the dark space shield 250b are removed at the recess 253 to accommodate the spacing guide 290 (shown in FIG. Figure 4B ). Figure 4B FIG. 2 is an enlarged view of dark space shield 250 b, wherein spacing guide 290 is positioned in recess 253. Figure 4BAs shown, in some embodiments, the top of the spacing guide 290 protrudes or extends from the end of the dark space shield 250b. In other embodiments, the top of the spacing guide 290 is aligned or substantially aligned with the end of the dark space shield 250b. In some embodiments, the spacing guide 290 protrudes radially from the inner surface of the dark space shield 250B. In some embodiments, the spacing guides 290 are equally spaced around the dark space shield 250b. In other embodiments, the spacing guides 290 are not equally spaced.

[0051] Figure 5 2 is a perspective view of a spacing guide 290 according to one embodiment. The spacing guide 290 includes a horizontal body 291, a first leg 293, and a second leg 295. The first leg 293 extends vertically or laterally from a first end 297 of the horizontal body 291. The second leg 295 extends vertically or laterally from a second end 299 of the horizontal body 291. The horizontal body 291, the first leg 293, and the second leg 295 can be separate individual pieces that are connected together to form the spacing guide 290. Alternatively, the horizontal body 291, the first leg 293, and the second leg 295 can be formed as a single integral piece. The spacing guide 290 can be formed of any suitable insulating material such as polytetrafluoroethylene or ceramic.

[0052] The horizontal body 291 has a width of W1, a length of L1, and a thickness of T1. The length L1 is selected so that when the spacing guide 290 is positioned on the shield 250, the first leg 293 and the second leg 295 are respectively located against the inner surface 252 and the outer surface 254 of the dark space shield 250. In some embodiments, the length L1 is selected so that the spacing guide 290 is maintained on the dark space shield 250 by gravity and / or friction, and other connectors or fasteners such as screws or pins are not required. In some embodiments, the spacing guide 290 can be connected to the dark space shield 250 by fasteners. For example, fasteners such as screws or pins can be positioned to pass through the horizontal body 291 and the end of the dark space shield 250. The length L1 is selected so that the spacing guide 290 can be on the dark space shield 250. If the length L1 is too short, the spacing guide 290 will not remain on the dark space shield 250. In addition, the length L1 is selected to be accommodated within the space defined by the dark space shield 250 shield and the target sidewalls. If the length L1 is too long, the spacing guide 290 will not fit into the space between the dark space shield 250 and the sputtering target 206. In some embodiments, the length L1 is from about 10 mm to about 100 mm, such as from about 15 mm to about 30 mm. After the spacing guide 290 is installed, the space defined by the dark space shield 250 and the sidewalls of the sputtering target 206 is partially occupied by the spacing guide 290, and the remaining space remains empty.

[0053] The width W1 is selected so that the horizontal body 291 is appropriately stable and has the desired maneuverability. If the width W1 is too small, the spacing guide 290 may be weak, unstable or fragile. If the width W1 is too large, the spacing guide 290 may not conform to the curvature of the dark space shield 250 and may be difficult to install. In some embodiments, the width W1 may be about 1 mm to about 100 mm, such as about 5 mm to about 50 mm or about 10 mm to about 30 mm.

[0054] The thickness T1 is selected to form a stable horizontal body 291. If the thickness T1 is too small, the horizontal body 291 may be easily torn or broken. If the thickness T1 is too large, the horizontal body 291 may be too rigid and may be difficult to conform to the shape of the dark space shield 250. In addition, if the thickness T1 is too large, the spacing guide 290 may be difficult to accommodate in the tight space between the dark space shield 250 and the sputtering target 206. In some embodiments, the thickness T1 can be selected to minimize the distance between the dark space shield 250 and the radial surface 288 of the sputtering target 206. In some embodiments, the thickness T1 can be at least about 2 mm. Because the spacing guide thickness T1 can prevent direct contact between the dark space shield 250 and the sputtering target assembly surface 206b, this can help reduce or eliminate arc discharge caused by vertical misalignment between the dark space shield and the surface 206b of the sputtering target assembly 238. In some embodiments, thickness T1 can be about 1 mm to about 30 mm, or about 2 mm to about 20 mm, or about 3 mm to about 10 mm. In embodiments where spacing guides 290 fit within recesses 253 of dark space shield 250, thickness T1 can be greater than about 30 mm.

[0055] The first leg 293 and the second leg 295 extend laterally from the horizontal body 291 and are perpendicular to the horizontal body. The first leg 293 has an inner surface 293a and an outer surface 293b. The inner surface 293a is configured to be adjacent to or rest against the outer surface 254 of the dark space shield 250. The second leg 295 has an inner surface 295a and an outer surface 295b. The inner surface 295a is configured to be adjacent to or rest against the inner surface 252 of the dark space shield 250.

[0056] The first leg 293 has a width W2, a length L2, and a thickness T2. The thickness T2 is selected so that the first leg 293 is thick enough to keep the leg strong but thin enough to fit within the tight space between the dark space shield 150 and the upper chamber wall 142.

[0057] The second leg 295 has a thickness T3. In some embodiments, the thickness T3 is selected to maintain a minimum gap between the inner surface 252 of the dark space shield 250 and the sputtering target assembly 238. In some embodiments, the thickness T3 can be at least 1 mm. This limits the misalignment of the dark space shield 250 and the radial surface 288 of the sputtering target 206 in the radial direction. In some embodiments, the thickness T3 can be about 1 mm to about 20 mm, or about 2 mm to about 15 mm, or about 3 mm to about 10 mm.

[0058] Those skilled in the art will recognize that the second leg 295 also has a width and a length. In some embodiments, the first leg 293 and the second leg 295 have the same shape. In other embodiments, the shapes of the first leg 293 and the second leg 295 may be different. For example, the thickness of the first leg 293 and the second leg 295 may be different.

[0059] Misalignment between the dark space shield and the target assembly can cause 50% or more of all sputter target related performance problems in the sputtering chamber. Data show that small amounts of misalignment, such as less than about 1 mm, can improve the performance of the sputtering target or at least not adversely affect its performance. However, misalignment exceeding about 1 mm can have a negative impact on the performance of the sputtering target. For example, misalignment between the sputtering target and the dark space shield can cause the outer radial periphery of the sputtering target to bulge out. In addition, misalignment can also lead to arcing, particle problems and / or film uniformity problems.

[0060] The spacing guide 290 physically and electrically separates the sputtering target 206 and the dark space shield 250. The spacing guide 290 may space the sputtering target 206 from the dark space shield 250 by a distance greater than about 3 mm and less than or equal to about 10 mm around the perimeter or circumference of the sputtering target 206 as measured in the radial direction or horizontal direction. Similarly, the spacing guide 290 may space the sputtering target from the dark space shield 250 by a distance greater than about 3 mm and less than or equal to about 10 mm around the perimeter or circumference of the sputtering target 206 in the vertical direction. Since if the spacing is too small, irregular target surfaces or accumulated flakes may cause power shortages and arc discharges, or if the spacing is too large, plasma leakage may occur between the dark space shield and the sputtering target assembly surface 206b or 288, which also causes power shortages, it is important to keep the spacing within this range. Maintaining spacing in the radial direction and / or the vertical direction improves alignment of the sputtering target 206 with the dark space shield 250. In some embodiments, the spacing guides 290 reduce arcing events that occur during the sputtering process.

[0061] A method for using the spacing guide 290 is also provided. In some embodiments, the spacing guide 290 is placed on a commercially available dark space shield 250 so that one leg 295 of the spacing guide 290 rests along the inner surface 252 of the dark space shield 250 and the other leg 293 of the spacing guide 290 rests along the outer surface 254 of the dark space shield. The inner surface of the horizontal body of the spacing guide 290 rests on or adjacent to the end of the dark space shield 250. In some embodiments, three spacing guides 290 are equally spaced around the perimeter of the dark space shield 250. In other embodiments, the three spacing guides 290 are not equally spaced around the perimeter of the dark space shield 250. When the sputtering chamber is closed, such as when the sputtering chamber is in use, the spacing guide 290 maintains a minimum distance between the dark space shield 250 and the sputtering target 206 in the horizontal direction and / or vertical direction.

[0062] In some embodiments, the dark space shield 250 is modified to receive the spacing guide 290. For example, as shown in FIG. 4, portions of the dark space shield 250b may be removable to form grooves or recesses in which the spacing guide 290 is positioned. In some embodiments, three spacing guides 290 are equally spaced around the perimeter of the dark space shield 250b. In other embodiments, more than three spacing guides are used. When the sputtering chamber is closed, such as when the sputtering chamber is in use, the spacing guide 290 prevents the dark space shield 250 from being too close to the sputtering target 206, and thus maintains the distance between the dark space shield 250 and the sputtering target 206 at a minimum in the horizontal direction.

[0063] Various modifications and additions may be made to the exemplary embodiments discussed without departing from the scope of the present invention. For example, although the above embodiments refer to features, the scope of the present invention also includes embodiments with different combinations of features and embodiments that do not include all of the above features.

Claims

1. A spacing guide member for a dark space shield of a sputtering chamber, the spacing guide member comprising: a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on an end of the dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against an outer surface of the dark space shield; and A second leg extends laterally from the second end of the horizontal body and is configured to rest against an inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

2. The spacing guide according to claim 1, wherein: The horizontal body has a thickness of about 1 mm to about 30 mm.

3. The spacing guide according to claim 1, wherein: The second leg has a thickness of no more than about 30 mm.

4. The spacing guide according to claim 1, wherein: The first leg portion and the second leg portion have different widths, lengths and thicknesses.

5. The spacing guide according to claim 1, wherein: The horizontal body, the first leg, and the second leg are integrally formed.

6. A dark space shield assembly for use in a sputtering chamber, the dark space shield assembly comprising: an annular dark space shield having a first end configured to be proximate to the substrate support pedestal and a second end configured to be proximate to the sputtering target; and a plurality of spacing guides, the plurality of spacing guides being positioned on the second end portion of the annular dark space shield, each spacing guide comprising: a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against an outer surface of the annular dark space shield; and A second leg extends laterally from the second end of the horizontal body and is configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

7. The dark space shield assembly of claim 6, wherein: The plurality of spacing guides are attached to the annular dark space shield only by friction.

8. The dark space shield assembly of claim 6, wherein: The plurality of spacing guides are attached to the annular dark space shield by fasteners.

9. The dark space shield assembly of claim 6, wherein: The spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along a horizontal axis within about 5 mm.

10. The dark space shield assembly of claim 9, wherein: The spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along a horizontal axis within about 1 mm.

11. The dark space shield assembly of claim 9, wherein: The thickness of the horizontal body does not exceed about 30 mm.

12. The dark space shield assembly of claim 9, wherein: The second leg has a thickness of no more than about 30 mm.

13. A sputtering chamber assembly, comprising: Sputtering targets; an annular dark space shield having a first end configured to be proximate to the substrate support pedestal and a second end configured to be proximate to the sputtering target; and a plurality of spacing guides, the plurality of spacing guides being positioned on the second end portion of the annular dark space shield, each spacing guide comprising: a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against an outer surface of the annular dark space shield; and A second leg extends laterally from the second end of the horizontal body and is configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

14. The sputtering chamber assembly of claim 13, wherein: The spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the horizontal axis within about 1 mm.

15. The sputtering chamber assembly of claim 14, wherein: The spacing guide maintains the misalignment between the sputtering target and the annular dark space shield along the vertical axis within 1 mm.

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