Electronic device

Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a shell, a circuit board assembly and a main circuit board. The shell comprises a frame. The bezel includes an antenna radiator. The antenna radiator comprises a feeding point and a grounding point. The circuit board assembly is arranged on the shell. The circuit board assembly comprises a printed circuit board, a radio frequency switch, a flexible circuit board and welding spots. The printed circuit board is arranged facing the antenna radiator. The printed circuit board comprises a feed end and a grounding end. And the feeding point is electrically connected with the feeding end. The grounding point is electrically connected with the grounding end. The radio frequency switch is arranged on the printed circuit board. And the radio frequency switch is electrically connected with the antenna radiator. The printed circuit board includes a first pad. The flexible circuit board includes a second pad. The second bonding pad is provided with a through welding hole. And the first bonding pad is arranged facing the through welding hole. The solder joint connects the first pad and the second pad. And one part of the welding spot is positioned in the through welding hole. The main circuit board is arranged in the shell. The flexible circuit board is electrically connected with the main circuit board and the printed circuit board.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 8, 2023, with application number 202310246003.2 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device. Background Art

[0003] With the explosive growth of technology in the field of electronic devices such as smart watches, smart phones or tablets, electronic devices have more and more functions. Different electronic devices can be integrated in the shell of the electronic device, such as a central processing unit (CPU), an intelligent algorithm chip or a power management chip (PMIC). The electronic device also includes an antenna radiator. The antenna radiator is a device used by the electronic device to receive or transmit electromagnetic wave signals. With the continuous development and iteration of mobile communication technology, the communication requirements for electronic devices are also getting higher and higher. As the structural design of electronic devices becomes more and more compact and thinner, the antenna signal may be unstable during the use of the electronic device, affecting the user experience of the electronic device.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electronic device that can help ensure antenna signal stability and improve antenna efficiency.

[0006] A first aspect of the present application provides an electronic device, which includes a housing, a circuit board assembly, and a main circuit board.

[0007] The housing includes a frame, the frame includes an antenna radiator, and the antenna radiator includes a feeding point and a grounding point.

[0008] The circuit board assembly is disposed in the housing. The circuit board assembly includes a printed circuit board, an RF switch, a flexible circuit board, and a solder joint. The printed circuit board is disposed facing the antenna radiator. The printed circuit board includes a feed terminal and a ground terminal. The feed terminal is electrically connected to the feed terminal. The ground terminal is electrically connected to the ground terminal. The RF switch is disposed on the printed circuit board. The RF switch is electrically connected to the antenna radiator. The printed circuit board includes a first solder pad. The flexible circuit board includes a second solder pad. The second solder pad has a through-hole. The first solder pad is disposed facing the through-hole. A solder joint connects the first solder pad and the second solder pad. A portion of the solder joint is located within the through-hole.

[0009] The main circuit board is arranged in the shell. The flexible circuit board is electrically connected to the main circuit board and the printed circuit board.

[0010] A second aspect of the present application provides an electronic device, which includes a housing, a circuit board assembly, and a main circuit board.

[0011] The housing includes a frame, the frame includes an antenna radiator, and the antenna radiator includes a feeding point and a grounding point.

[0012] The circuit board assembly is disposed within the housing. The circuit board assembly includes a printed circuit board, a radio frequency switch, and a flexible circuit board. The printed circuit board is disposed facing the antenna radiator. The printed circuit board includes a feed terminal and a ground terminal. The feed point is electrically connected to the feed terminal. The ground point is electrically connected to the ground terminal. The radio frequency switch is disposed on the printed circuit board. The radio frequency switch is electrically connected to the antenna radiator. The printed circuit board and the flexible circuit board are integrally formed.

[0013] The main circuit board is arranged in the shell. The flexible circuit board is electrically connected to the main circuit board and the printed circuit board.

[0014] In the electronic device of the embodiment of the present application, a circuit board assembly is separately provided. The printed circuit board in the circuit board assembly is arranged near the antenna radiator of the frame, effectively shortening the distance between the radio frequency switch provided on the printed circuit board and the antenna radiator, thereby shortening the signal transmission path between the radio frequency switch and the antenna radiator. This helps to reduce the possibility of external electromagnetic fields causing coupling interference to the signal transmitted between the radio frequency switch and the antenna radiator, ensuring antenna signal stability and improving antenna efficiency. The printed circuit board in the circuit board assembly is electrically connected to the main circuit board via a flexible circuit board. The printed circuit board and the flexible circuit board are connected through a first solder pad, a solder point and a second solder pad, or the printed circuit board and the flexible circuit board are integrally formed. On the one hand, this effectively reduces the thickness of the connection between the printed circuit board and the flexible circuit board, which is suitable for placing the printed circuit board in a relatively narrow space to fully utilize the internal space of the electronic device; on the other hand, if the printed circuit board and the flexible circuit board are connected using a board-to-board connector, since the board-to-board connector has a large ground impedance, the board-to-board connector becomes an impedance discontinuity point, and there is an impedance mutation, which makes it easy to couple with the external electromagnetic field and interfere with the signal transmitted between the printed circuit board and the flexible circuit board. Therefore, compared with the connection method of the board-to-board connector, the structure of the printed circuit board and the flexible circuit board of this application is conducive to eliminating impedance discontinuity, so that signal isolation can be improved, effectively reducing the possibility of coupling interference, and at the same time it is also conducive to reducing insertion loss and improving antenna efficiency.

[0015] In one possible embodiment, the weld spot is formed by a laser welding process.

[0016] Since the solder joint between the first solder pad and the second solder pad is formed by a laser welding process, during the welding process of the first solder pad and the second solder pad, high temperatures are less likely to occur in areas on the flexible circuit board that are farther away from the second solder pad. This can effectively reduce the possibility of electronic devices on the flexible circuit board being burned due to experiencing a high-temperature environment, which is beneficial to improving the yield rate of circuit board components.

[0017] In one possible embodiment, the printed circuit board has a first connection area. The first connection area is disposed outside the first solder pad. The flexible circuit board has a second connection area. The second connection area is disposed outside the second solder pad. The first connection area is connected to the second connection area.

[0018] The printed circuit board and the flexible circuit board form a connection area outside the first pad and the second pad, so that when the flexible circuit board is subjected to an axial force perpendicular to the through-hole, the force is not easily transmitted to the area of ​​the second pad, thereby reducing the possibility of the flexible circuit board being torn at the second pad.

[0019] In a possible implementation, along the height direction of the electronic device, the antenna radiator is located in the middle section of the frame.

[0020] An antenna radiator is provided in the middle section of the frame, that is, an antenna radiator is provided in the middle area of ​​the frame, so that when a user holds the electronic device in a folded state or an unfolded state, the user's hand is not likely to block the antenna radiator located in the middle section of the frame, which is beneficial to reducing the possibility of the user's holding position causing adverse effects on the antenna signal of the antenna radiator, ensuring that the antenna radiator of the electronic device in the folded state or the unfolded state can obtain higher-quality signal transmission, thereby improving the user experience satisfaction of the electronic device.

[0021] In a possible implementation, the frame includes a slit. Along the height direction, two ends of the antenna radiator are respectively provided with a slit.

[0022] In a possible embodiment, the circuit board assembly further includes a conductive elastic member, a conductive elastic member disposed between the feeding point and the feeding end, and a conductive elastic member disposed between the grounding point and the grounding end.

[0023] The conductive elastic member can ensure the reliability of the electrical connection between the feeding point and the feeding end, as well as the reliability of the electrical connection between the grounding point and the grounding end.

[0024] In a possible implementation, the electronic device further includes a board-to-board connector, and the flexible circuit board is electrically connected to the main circuit board via the board-to-board connector.

[0025] In one possible embodiment, the electronic device further includes a radio frequency transceiver module and a radio frequency chip. The radio frequency transceiver module and the radio frequency chip are both disposed on a main circuit board. The radio frequency transceiver module and the radio frequency chip are electrically connected. The flexible circuit board is electrically connected to the radio frequency transceiver module.

[0026] The RF transceiver module has a relatively small size, which helps save the area of ​​the main circuit board.

[0027] In a possible embodiment, the frame has a receiving portion, and at least a portion of the printed circuit board is disposed in the receiving portion.

[0028] On the one hand, the printed circuit board can make full use of the frame and does not occupy the space inside the frame, which is conducive to saving space inside the frame; on the other hand, the frame can provide protection for the printed circuit board and reduce the possibility of damage to the printed circuit board due to squeezing or collision.

[0029] In a possible embodiment, the printed circuit board includes a positioning portion, the frame includes a limiting portion, and the positioning portion is connected to the limiting portion.

[0030] The positioning portion of the printed circuit board is connected to the limiting portion of the frame, so that the printed circuit board can be positioned quickly and accurately, which facilitates the assembly of the printed circuit board and the frame. The frame can also limit and constrain the printed circuit board to prevent the printed circuit board from exiting the accommodating portion.

[0031] In a possible implementation, along the thickness direction of the printed circuit board, the radio frequency switch is disposed on a side of the printed circuit board facing the antenna radiator.

[0032] The radio frequency switch is relatively close to the antenna radiator, thereby facilitating electrical connection between the radio frequency switch and the antenna radiator.

[0033] In a possible implementation manner, the distance between the RF switch and the feeding end is in a range of 15 mm to 100 mm, thereby facilitating reducing the possibility of signal crosstalk between the RF switch and the feeding end.

[0034] In a possible implementation manner, the distance between the RF switch and the ground terminal ranges from 15 mm to 100 mm, thereby facilitating reducing the possibility of signal crosstalk between the RF switch and the ground terminal.

[0035] In one possible implementation, the printed circuit board includes an antenna interface pad, a control signal pad, and a ground pad. A plurality of ground pads are disposed around the antenna interface pad. A plurality of ground pads are disposed around the control signal pad.

[0036] The antenna interface pad is provided with multiple ground pads around the periphery, thereby reducing the possibility of the antenna interface pad being interfered with by external signals. The control signal pad is provided with multiple ground pads around the periphery, thereby reducing the possibility of the control signal pad being interfered with by external signals.

[0037] In a possible implementation manner, the minimum distance between the antenna interface pad and the control signal pad is greater than or equal to 3 mm.

[0038] In a possible implementation manner, a minimum distance between a ground pad on the periphery of the antenna interface pad and a ground pad on the periphery of the control signal pad is greater than or equal to 2 mm.

[0039] In one possible embodiment, the flexible circuit board includes two or more metal trace layers. The two or more metal trace layers are stacked along the thickness of the flexible circuit board. Each metal trace layer includes a ground line and an RF signal line. Along the thickness of the flexible circuit board, the orthographic projection of the RF signal line on one of two adjacent metal trace layers lies within the orthographic projection of the ground line on the other, thereby reducing the possibility of crosstalk between the RF signal lines on one of the two adjacent metal trace layers and the RF signal lines on the other.

[0040] In a possible implementation, along the width direction of the flexible circuit board, a distance between an outer edge of an orthographic projection of the radio frequency signal line and an outer edge of an orthographic projection of the ground line is greater than or equal to 0.01 mm.

[0041] In one possible embodiment, the frame is a metal frame. A portion of the frame forms the antenna radiator. Alternatively, the frame includes an insulating frame. The antenna radiator is disposed in the insulating frame.

[0042] In one possible embodiment, the housing includes a rotating shaft device, a first shell and a second shell. The first shell and the second shell are each connected to the rotating shaft device. The first shell and the second shell both include a frame.

[0043] In one possible embodiment, the electronic device further includes a first battery. The first battery is disposed in the first housing. Along the thickness of the electronic device, at least a portion of the flexible circuit board in the first housing is located on one side of the first battery. This allows the flexible circuit board to be arranged in a gap between the first battery and other structural components, thereby improving internal space utilization of the electronic device.

[0044] In one possible embodiment, the electronic device further includes a first battery and a second battery. The first battery is disposed in the first housing. The second battery is disposed in the second housing. The printed circuit board in the first housing is located on a side of the first battery facing the antenna radiator. The printed circuit board in the second housing is located on a side of the second battery facing the antenna radiator.

[0045] In one possible embodiment, the electronic device further includes a first secondary circuit board and an electrical connection line. The first secondary circuit board is disposed in the second housing. The electrical connection line connects the main circuit board and the first secondary circuit board. The flexible circuit board in the second housing is electrically connected to the first secondary circuit board.

[0046] In a possible embodiment, the electronic device further includes a board-to-board connector. The main circuit board is electrically connected to the electrical connection line via the board-to-board connector. The first auxiliary circuit board is electrically connected to the electrical connection line via the board-to-board connector. Alternatively,

[0047] The flexible circuit board in the second housing is electrically connected to the first sub-circuit board through a board-to-board connector.

[0048] In one possible embodiment, the electronic device further includes a second secondary circuit board. The second secondary circuit board is disposed in the second housing. The flexible printed circuit board in the second housing includes a main body, a first branch, and a second branch. The main body is electrically connected to the first secondary circuit board. The first branch is connected to the printed circuit board in the second housing. The second branch is electrically connected to the second secondary circuit board.

[0049] In one possible embodiment, the electronic device further includes a second battery. The second battery is disposed in the second housing. The second battery is disposed between the first and second sub-circuit boards. Along the thickness of the electronic device, at least a portion of the first branch and at least a portion of the second branch are located on one side of the second battery. This allows the flexible printed circuit board to be positioned in the gap between the second battery and other structural components, thereby improving internal space utilization of the electronic device.

[0050] In a possible embodiment, the first branch includes a first connecting section and a second connecting section intersecting each other, wherein the first connecting section is connected to the main body, and the second connecting section is electrically connected to the printed circuit board.

[0051] In one possible embodiment, the second branch includes a third connecting segment, a fourth connecting segment, a fifth connecting segment, and a sixth connecting segment, which are sequentially connected. The third connecting segment is connected to the main body. The sixth connecting segment is electrically connected to the second secondary circuit board. The angle between the fourth connecting segment and the fifth connecting segment is greater than or equal to 90°. The angle between the fifth connecting segment and the sixth connecting segment is greater than or equal to 90°.

[0052] The angle between the fourth connecting segment and the fifth connecting segment is greater than or equal to 90°, which helps reduce the possibility of the fourth connecting segment or the fifth connecting segment being torn at the intersection due to a pulling force on the fourth connecting segment or the fifth connecting segment. The angle between the fifth connecting segment and the sixth connecting segment is greater than or equal to 90°, which helps reduce the possibility of the fifth connecting segment or the sixth connecting segment being torn at the intersection due to a pulling force on the fifth connecting segment or the sixth connecting segment.

[0053] In a possible implementation manner, the angle between the first connecting segment and the third connecting segment ranges from 30° to 150°.

[0054] If the angle between the first and third connecting sections is less than 30°, the first and third connecting sections are prone to tearing at their intersection when subjected to external pulling force. If the angle between the first and third connecting sections is greater than 150°, the first and third connecting sections will occupy excessive space, making it difficult to arrange the flexible printed circuit board in a confined space.

[0055] In a possible implementation manner, the minimum distance between the first connecting segment and the fourth connecting segment is greater than or equal to 3 mm.

[0056] In a possible implementation, along the height direction of the electronic device, a distance between the main body and an edge of the second connecting section close to the second sub-circuit board is greater than or equal to 5 mm.

[0057] In one possible embodiment, the housing further includes a third housing. A rotating shaft device is provided between the first housing and the third housing. A rotating shaft device is provided between the third housing and the second housing. The first housing, the second housing, and the third housing each rotate relative to the rotating shaft device, so that the first housing, the second housing, and the third housing are stacked or unfolded relative to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] FIG1 is a schematic structural diagram of an electronic device in an unfolded state according to an embodiment of the present application;

[0059] FIG2 is a schematic structural diagram of an electronic device in a semi-folded state according to an embodiment of the present application;

[0060] FIG3 is a schematic structural diagram of an electronic device in a folded state according to an embodiment of the present application;

[0061] FIG4 is a schematic diagram of a partially exploded structure of an electronic device provided in one embodiment of the present application;

[0062] FIG5 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0063] FIG6 is an enlarged schematic diagram of point M in FIG5 ;

[0064] FIG7 is a schematic diagram of a partial structure of a circuit board assembly provided in one embodiment of the present application;

[0065] FIG8 is a schematic diagram of a partial structure of a circuit board assembly provided in one embodiment of the present application;

[0066] FIG9 is a schematic diagram of a partial structure of a circuit board assembly provided in one embodiment of the present application;

[0067] FIG10 is a schematic diagram of a partial cross-sectional structure of a circuit board assembly provided in one embodiment of the present application;

[0068] FIG11 is a schematic diagram of a partial structure of a flexible circuit board provided in one embodiment of the present application;

[0069] FIG12 is a schematic diagram of a partial cross-sectional structure of a flexible circuit board provided in one embodiment of the present application;

[0070] FIG13 is a schematic diagram of a partial cross-sectional structure of a flexible circuit board provided in one embodiment of the present application;

[0071] FIG14 is a partial structure of a flexible circuit board provided in one embodiment of the present application;

[0072] FIG15 is an enlarged schematic diagram of point W in FIG14;

[0073] FIG16 is a schematic diagram of a partially exploded structure of a circuit board assembly provided in one embodiment of the present application;

[0074] FIG17 is a schematic structural diagram of an electronic device in a folded state according to an embodiment of the present application;

[0075] FIG18 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0076] FIG19 is a schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application.

[0077] Reference numerals: 10, electronic device; 20, housing; 21, first housing; 22, second housing; 23, hinge device; 24, frame; 24a, middle section; 241, side frame; 241a, gap; 242, top frame; 243, bottom frame; 244, accommodating portion; 25, third housing; 30, flexible display; 31, first display area; 32, second display area; 33, third display area; 40, main circuit board; 50, first sub-circuit board; 60, electrical connection line; 70, electronic device; 80, first battery; 90, second battery; 100, antenna radiator; 200, circuit board assembly; 210, printed circuit board; 210a, feeding terminal; 210b, ground terminal; 211, first solder pad; 212, positioning portion; 213, antenna interface pad; 214, control signal pad; 215, ground pad; 216, first connection area; 220, RF switch; 230, flexible circuit board; 2301, metal trace layer; 2301a, ground line; 2301b, RF signal line; 2301c, copper foil; 2301d, copper plating; 2302, electromagnetic shielding layer; 2303, base film; 2304, polyimide layer; 2305, adhesive layer; 231, second pad; 232, through-hole; 233, first transition section; 234, second transition section; 235, main body; 236, first branch; 236a, first connecting section; 236b, second connecting section; 237, second branch; 237a, Third connecting section; 237b, fourth connecting section; 237c, fifth connecting section; 237d, sixth connecting section; 238, ground trace; 239, second connecting area; 240, solder joint; 250, conductive elastic member; 300, RF transceiver module; 400, RF chip; 500, board-to-board connector; 600, second sub-circuit board; 700, third sub-circuit board; 800, third battery; X, height direction. DETAILED DESCRIPTION

[0078] The electronic device in the embodiments of the present application can be referred to as user equipment (UE) or terminal, etc. For example, the electronic device can be a smart watch, a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, etc. Mobile terminals or fixed terminals. In the embodiments of the present application, the form of the terminal device is not specifically limited.

[0079] In an embodiment of the present application, FIG1 schematically shows the structure of an electronic device 10 in an unfolded state according to an embodiment. Referring to FIG1 , the electronic device 10 is described as a handheld device with wireless communication capabilities. Handheld devices with wireless communication capabilities may be, for example, but are not limited to, foldable screen devices. The embodiment of the present application is described using a foldable screen device as an example. The foldable screen device may be a foldable mobile phone including a foldable flexible display screen.

[0080] Figure 2 schematically shows the structure of the electronic device 10 in a semi-folded state. Figure 3 schematically shows the structure of the electronic device 10 in a folded state. Referring to Figures 1 to 3, the electronic device 10 includes a housing 20 and a flexible display 30. The housing 20 can provide a mounting base for other components. The housing 20 includes a first shell 21, a second shell 22, and a hinge device 23. The first shell 21 and the second shell 22 are each connected to the hinge device 23. The first shell 21 and the second shell 22 can be provided on opposite sides of the hinge device 23, respectively. The flexible display 30 is connected to the first shell 21 and the second shell 22.

[0081] The first housing 21 and the second housing 22 can each rotate or fold relative to the hinge device 23 so that the first housing 21 and the second housing 22 are stacked or unfolded. In this application, when the first housing 21 and the second housing 22 are stacked, the electronic device 10 is in a folded state. When the first housing 21 and the second housing 22 are each separated from each other from the stacked state and unfolded to the same plane, the electronic device 10 is in an unfolded state. The process of the first housing 21 and the second housing 22 each moving from the folded state to the unfolded state is called the unfolding process, and the process of moving from the unfolded state to the folded state is called the folding process.

[0082] Figure 4 schematically illustrates a partially exploded view of the electronic device 10 of the present application. As shown in Figure 4 , the housing 20 includes a frame 24. Schematically, both the first housing 21 and the second housing 22 may include a frame 24. For example, the frame 24 may include a middle frame. The flexible display 30 may be connected to the frame 24. For example, the housing 20 may also include a back cover. The back cover is connected to the frame 24.

[0083] The flexible display 30 includes a display portion for displaying image information. The flexible display 30 itself can be bent when subjected to an external force. When the electronic device 10 is in the unfolded state, the display portion of the flexible display 30 unfolds to present image information to the user. The display portion may include a first display area 31, a second display area 32, and a third display area 33. The first display area 31 and the second display area 32 are respectively provided to correspond to the first housing 21 and the second housing 22. The third display area 33 may be provided to correspond to the hinge assembly 23.

[0084] When the first shell 21 and the second shell 22 are in the folded state, the display unit is in a bent state. The first display area 31 and the second display area 32 of the display unit can overlap each other, and the third display area 33 can be bent into an arc state, for example, the third display area 33 can be bent into a teardrop shape.

[0085] When the first housing 21 and the second housing 22 are in the unfolded state, the display portion is in the unfolded state, and the first display area 31, the second display area 32, and the third display area 33 are flat. The electronic device 10 can change its overall size by folding or unfolding, and can also have a larger display area in the unfolded state.

[0086] The electronic device 10 also includes a main circuit board 40 and a first sub-circuit board 50. The main circuit board 40 is disposed in the first housing 21. The first sub-circuit board 50 is disposed in the second housing 22. The main circuit board 40 and the first sub-circuit board 50 are electrically connected to each other to enable signal exchange. For example, the electronic device 10 also includes an electrical connection line 60. The first sub-circuit board 50 is disposed in the second housing 22. The electrical connection line 60 connects the main circuit board 40 and the first sub-circuit board 50. The electrical connection line 60 may be arranged across the hinge assembly 23. The two ends of the electrical connection line 60 are disposed within the first housing 21 and the second housing 22 on either side of the hinge assembly 23. For example, the electrical connection line 60 may include a flexible printed circuit board (FPCB). The FPCB may include multiple metal traces for transmitting multiple different electrical signals. For example, the electronic device 10 may also include board-to-board connectors. The main circuit board 40 and the electrical connection line 60 are electrically connected via the board-to-board connector. The first sub-circuit board 50 and the electrical connection line 60 are electrically connected via the board-to-board connector.

[0087] The electronic device 10 further includes an electronic device 70. The main circuit board 40 and the first sub-circuit board 50 are each provided with an electronic device 70. Both the main circuit board 40 and the first sub-circuit board 50 may be printed circuit boards (PCBs). The electronic device 70 may be soldered to the main circuit board 40 or the first sub-circuit board 50 using a soldering process.

[0088] For example, the electronic components 70 on the main circuit board 40 may include, but are not limited to, a central processing unit (CPU), an intelligent algorithm chip, a power management IC (PMIC), a radio frequency transceiver integrated module (L-PAMiD), or a radio frequency integrated circuit (RFIC). Because the internal space of the electronic device 10 is relatively small, the electronic components 70 are highly integrated on the main circuit board 40 to fully reduce the volume of the main circuit board 40 and reduce the space occupancy of the main circuit board 40.

[0089] The electronic device 10 may also include a battery. The battery may be disposed within the housing 20. A battery is a structural component that converts chemical energy into electrical energy. The battery is used to provide electrical energy to the electronic device 10 to ensure its normal operation. For example, the battery may provide electrical energy to the flexible display 30 to enable it to display image information or complete corresponding operating instructions. Alternatively, the battery may provide electrical energy to the electronic device 70 to ensure its normal operation. For example, the battery may be a lithium-ion battery, such as a lithium iron phosphate battery.

[0090] Exemplarily, the electronic device 10 may include a first battery 80 and a second battery 90. The first battery 80 is disposed in the first housing 21. Along the height direction X of the electronic device 10, the main circuit board 40 is located on a side of the first battery 80 close to the top of the electronic device 10. The second battery 90 is disposed in the second housing 22. Along the height direction X of the electronic device 10, the first sub-circuit board 50 is located on a side of the second battery 90 close to the top of the electronic device 10. It should be noted that the height direction X of the electronic device 10 may refer to a direction from the bottom to the top of the electronic device 10 when the electronic device 10 is in normal use. The bottom of the electronic device 10 is close to the user, while the top of the electronic device 10 is relatively far away from the user.

[0091] The electronic device 10 also includes an antenna radiator. The antenna radiator is used to receive or transmit electromagnetic wave signals so that the electronic device 10 can achieve wireless communication functions. The antenna radiator can be arranged on the housing 20 so that the antenna radiator can obtain relatively good antenna efficiency. For example, the antenna radiator can be arranged on the frame 24 of the housing 20. The antenna radiator can be electrically connected to the main circuit board 40. The electronic device 10 also includes a radio frequency switch. The radio frequency switch is electrically connected to the antenna radiator. The function of the radio frequency switch is to connect any one or several of the multiple radio frequency signals through control logic to achieve switching between different signal paths. The radio frequency switch can be used to achieve switching between receiving and transmitting radio frequency signals. The radio frequency switch can also be used to achieve switching between different frequency bands.

[0092] In related art, the RF switch is located on the main circuit board 40. The RF switch is electrically connected to the antenna radiator via an RF cable to enable signal exchange. The diameter of a single RF cable is relatively large, for example, 0.8 mm. The large spacing between the RF switch and the antenna radiator results in a relatively long RF cable. This can cause external electromagnetic fields to couple interference with the signal transmitted in the RF cable, leading to unstable antenna signals at the antenna radiator, impacting the user experience of the electronic device 10. Multiple RF cables are typically required between the RF switch and the antenna radiator. These cables need to pass through the gap between the battery and the frame 24. As the functional requirements for electronic devices 10 diversify, the number and type of functional components are increasing, resulting in a relatively small internal space in the electronic device 10. The rationality of the layout of each component and the capacity of the battery are mutually constrained and impact each other. For example, while ensuring the rationality of the RF cable layout, installing a large number of RF cables will occupy more space. Reducing the size of the battery to free up space for RF cables will result in a decrease in battery capacity.

[0093] The electronic device 10 provided in the embodiment of the present application can position the RF switch near the antenna radiator, effectively shortening the distance between the two and the signal transmission path, thereby reducing the possibility of external electromagnetic fields causing coupling interference to the signal transmitted between the antenna radiator and the RF switch, and ensuring antenna signal stability. The structure that combines a printed circuit board and a flexible circuit board can achieve an electrical connection between the printed circuit board and the flexible circuit board without the need for a board-to-board connector, effectively reducing the size of the connection between the printed circuit board and the flexible circuit board, reducing space occupancy, and thus making it suitable for installation in smaller gaps.

[0094] FIG5 schematically shows a partial structure of the electronic device 10 of the present application. FIG6 is an enlarged view of point M in FIG5 . Referring to FIG5 and FIG6 , the electronic device 10 of an embodiment of the present application includes a housing 20 and a circuit board assembly 200. The frame 24 of the housing 20 includes an antenna radiator 100. The antenna radiator 100 includes a feeding point and a grounding point (not shown in the figure). The circuit board assembly 200 is disposed in the housing 20. The circuit board assembly 200 includes a printed circuit board 210 and a flexible circuit board 230. There is a gap between the printed circuit board 210 in the circuit board assembly 200 and the main circuit board 40. The printed circuit board 210 and the main circuit board 40 in the circuit board assembly 200 are independently arranged. The printed circuit board 210 is arranged facing the antenna radiator 100. The position of the printed circuit board 210 corresponds to the position of the antenna radiator 100, so that the gap between the printed circuit board 210 and the antenna radiator 100 is relatively small.

[0095] Figures 7 and 8 schematically illustrate partial structures of the circuit board assembly 200. As shown in Figures 5 to 8, the printed circuit board 210 includes a feed terminal 210a and a ground terminal 210b. The feed point of the antenna radiator 100 is electrically connected to the feed terminal 210a of the printed circuit board 210. The feed terminal 210a of the printed circuit board 210 can feed a wireless signal to the antenna radiator 100 through the feed point, causing the antenna radiator 100 to radiate the wireless signal. The ground point of the antenna radiator 100 is electrically connected to the ground terminal 210b of the printed circuit board 210.

[0096] The circuit board assembly 200 also includes an RF switch 220. The RF switch 220 is disposed on the printed circuit board 210 and is electrically connected to the antenna radiator 100. Because the distance between the printed circuit board 210 and the antenna radiator 100 is relatively small, the RF switch 220 is positioned relatively close to the antenna radiator 100. This reduces the distance between the RF switch 220 and the antenna radiator 100, thus shortening the signal transmission path between the RF switch 220 and the antenna radiator 100.

[0097] In some implementations, FIG9 schematically illustrates a partial structure of the circuit board assembly 200 of the present application. FIG10 schematically illustrates a partial cross-sectional structure of the circuit board assembly 200 of the present application. As shown in FIG9 and FIG10 , the printed circuit board 210 and the flexible circuit board 230 are each separately manufactured and assembled to form an integral structure. The printed circuit board 210 includes a first solder pad 211. The flexible circuit board 230 includes a second solder pad 231. The first solder pad 211 is positioned facing the second solder pad 231, such that the positions of the first solder pad 211 and the second solder pad 231 correspond to each other. For example, the material of the first solder pad 211 may be copper or a copper alloy. The material of the second solder pad 231 may be copper or a copper alloy. The second solder pad 231 has a through-hole 232. The second solder pad 231 comprises a hollow metal cylinder. The center hole of the metal cylinder forms the through-hole 232. The material of the metal cylinder may be copper or a copper alloy. Along the thickness direction of the flexible circuit board 230, the through-hole 232 of the second solder pad 231 is a through-hole that penetrates the flexible circuit board 230. The first solder pad 211 is arranged facing the through-hole 232. Exemplarily, the through-hole 232 may be a circular hole. The diameter of the through-hole 232 may be, but is not limited to, 0.045 mm, 0.15 mm, 0.2 mm, 0.4 mm, or 0.45 mm. Exemplarily, along the axial direction of the through-hole 232, the outer edge of the orthographic projection of the first solder pad 211 coincides with the outer edge of the orthographic projection of the second solder pad 231, that is, the outer edge of the orthographic projection of the first solder pad 211 and the outer edge of the orthographic projection of the second solder pad 231 have the same shape.

[0098] Circuit board assembly 200 also includes a solder joint 240. Solder joint 240 connects first pad 211 and second pad 231. A portion of solder joint 240 is located within through-hole 232, which helps increase the connection area between solder joint 240 and second pad 231, thereby improving the connection strength between solder joint 240 and second pad 231 and preventing separation of solder joint 240 and second pad 231.

[0099] Exemplarily, a portion of the solder joint 240 is located between the first solder pad 211 and the second solder pad 231 .

[0100] Exemplarily, a portion of the solder joint 240 is located on a side of the flexible circuit board 230 facing away from the first solder pad 211 to cover the through-hole 232 of the second solder pad 231 .

[0101] For example, solder paste is pre-applied onto first pads 211 of printed circuit board 210. Flexible circuit board 230 is placed in a corresponding predetermined position so that second pads 231 correspond to first pads 211. The solder paste is heated to melt. The melted solder paste rises along through-holes 232 of second pads 231. After solidification, the melted solder paste forms solder joints 240 connecting first pads 211 and second pads 231.

[0102] The printed circuit board 210 and the flexible circuit board 230 are electrically connected through the connection structure of the first solder pad 211, the solder joint 240 and the second solder pad 231, so that there is no need to use a board-to-board connector to achieve electrical connection between the printed circuit board 210 and the flexible circuit board 230, thereby effectively reducing the thickness of the connection between the printed circuit board 210 and the flexible circuit board 230 and reducing the space occupancy rate. As a result, the circuit board assembly 200 can be suitable for being set in a smaller gap to fully utilize the internal space of the electronic device 10.

[0103] In some implementations, in circuit board assembly 200, printed circuit board 210 and flexible circuit board 230 may be integrally formed. Printed circuit board 210 and flexible circuit board 230 are combined to form a single, rigid-flexible board. Flexible circuit board 230 extends directly from printed circuit board 210. No connecting structure is required to connect printed circuit board 210 and flexible circuit board 230, resulting in a relatively thin connection between printed circuit board 210 and flexible circuit board 230, thus reducing space usage.

[0104] The relatively thin connection between the printed circuit board 210 and the flexible circuit board 230 frees up space at the junction. This freed-up space can, for example, be used to increase the size of the battery, thereby improving its capacity. For example, compared to using a board-to-board connector to achieve an electrical connection between the printed circuit board 210 and the flexible circuit board 230, the battery size can be increased by 2 mm, while the battery capacity can be increased by 300 milliampere hours (mAh).

[0105] In the electronic device 10 of the embodiment of the present application, a separate circuit board assembly 200 is provided. The printed circuit board 210 in the circuit board assembly 200 is positioned near the antenna radiator 100 on the frame 24, effectively shortening the distance between the RF switch 220 disposed on the printed circuit board 210 and the antenna radiator 100. This shortens the signal transmission path between the RF switch 220 and the antenna radiator 100, thereby reducing the possibility of external electromagnetic fields causing coupling interference to the signal transmitted between the RF switch 220 and the antenna radiator 100, thereby ensuring antenna signal stability and improving antenna efficiency. The printed circuit board 210 in the circuit board assembly 200 is electrically connected to the main circuit board 40 via the flexible circuit board 230. The printed circuit board 210 and the flexible circuit board 230 are connected through the first solder pad 211, the solder joint 240 and the second solder pad 231, or the printed circuit board 210 and the flexible circuit board 230 are integrally formed. On the one hand, this effectively reduces the thickness of the connection between the printed circuit board 210 and the flexible circuit board 230, making it suitable for placing the printed circuit board 210 in a relatively small space to fully utilize the internal space of the electronic device 10; on the other hand, if the printed circuit board 210 and the flexible circuit board 230 are connected using a board-to-board connector, since the board-to-board connector has a large ground impedance, the board-to-board connector becomes an impedance discontinuity point, and there is an impedance mutation, which is easy to couple with the external electromagnetic field and interfere with the signal transmitted between the printed circuit board 210 and the flexible circuit board 230. Therefore, compared with the connection method of the board-to-board connector, the structure of the printed circuit board 210 and the flexible circuit board 230 of the present application is conducive to eliminating impedance discontinuity, so that signal isolation can be improved, effectively reducing the possibility of coupling interference, and also helping to reduce insertion loss and improve antenna efficiency. It should be noted that isolation is used to quantitatively characterize the strength of electromagnetic coupling, and its unit is dB.

[0106] The RF switch 220 of the embodiment of the present application is disposed on the printed circuit board 210, and the printed circuit board 210 and the flexible circuit board 230 are connected using the first solder pad 211, the solder joint 240, and the second solder pad 231, or the printed circuit board 210 and the flexible circuit board 230 are integrally formed, which is also conducive to improving the signal isolation between the RF switch 220 and the power supply connected to the RF switch 220.

[0107] In the embodiment of the present application, the electronic device 10 further includes a radio frequency transceiver module 300 and a radio frequency chip 400. The radio frequency transceiver module 300 and the radio frequency chip 400 are both arranged on the main circuit board 40. The radio frequency transceiver module 300 can be an integrated module including devices such as a duplexer, a filter, a power amplifier and a low noise amplifier, so that the radio frequency transceiver module 300 has a relatively small size, which is conducive to saving the area of ​​the main circuit board 40. The radio frequency transceiver module 300 and the radio frequency chip 400 are electrically connected. The flexible circuit board 230 is electrically connected to the radio frequency transceiver module 300 to realize signal interaction between the antenna radiator 100, the radio frequency switch 220, the printed circuit board 210, the flexible circuit board 230, the main circuit board 40, the radio frequency transceiver module 300 and the radio frequency chip 400.

[0108] The electronic device 10 also includes a board-to-board connector 500. The flexible circuit board 230 and the main circuit board 40 are electrically connected via the board-to-board connector 500 to enable signal exchange between the flexible circuit board 230 and the main circuit board 40. The board-to-board connector 500 includes a first connector and a second connector that can be plugged into each other. One of the first connector and the second connector can be connected to the flexible circuit board 230, and the other can be connected to the main circuit board 40. For example, the first connector is connected to an end of the flexible circuit board 230. The pins of the first connector can be soldered to corresponding metal traces in the flexible circuit board 230. The second connector is connected to the main circuit board 40. The pins of the second connector can be soldered to corresponding metal traces in the main circuit board 40. The first connector and the second connector are detachably connected, thereby facilitating separation or assembly of the flexible circuit board 230 and the main circuit board 40.

[0109] In the embodiment of the present application, the antenna radiator 100 may be disposed in the middle section 24a of the frame 24 along the height direction X of the electronic device 10. For example, along the height direction X of the electronic device 10, the middle third of the frame 24 may be the middle section 24a of the frame 24.

[0110] In this embodiment of the present application, the frame 24 may be a metal frame. The frame 24 may be made of aluminum alloy or steel. A portion of the frame 24 may form the antenna radiator 100. Alternatively, the frame 24 may include an insulating frame. The antenna radiator 100 is disposed within the insulating frame. The insulating frame may be made of plastic. The antenna radiator 100 may be a sheet of metal.

[0111] When the electronic device 10 is in a folded state or an unfolded state, the user usually holds the area near the bottom of the electronic device 10. Antenna radiators may also be provided in the top and bottom areas of the electronic device 10, so the user's hand will block the antenna radiator in the bottom area, and the user's holding position will have an adverse effect on the antenna signal of the antenna radiator in the bottom area, resulting in differences in the antenna signal. In the embodiment of the present application, an antenna radiator 100 is provided in the middle section 24a of the frame 24, that is, the antenna radiator 100 is provided in the middle area of ​​the frame 24, so that when the user holds the electronic device 10 in a folded state or an unfolded state, the user's hand is not likely to block the antenna radiator 100 located in the middle section 24a of the frame 24, which is conducive to reducing the possibility of the user's holding position causing an adverse effect on the antenna signal of the antenna radiator, ensuring that the antenna radiator of the electronic device 10 in the folded state or the unfolded state can obtain higher quality signal transmission, and improving the user experience satisfaction of the electronic device 10.

[0112] In the embodiment of the present application, as shown in Figures 5 and 6, the frame 24 may include a side frame 241. The side frame 241 extends along the height direction X of the electronic device 10. The frame 24 may also include a top frame 242 and a bottom frame 243. The top frame 242 and the bottom frame 243 are spaced apart along the height direction X of the electronic device 10. The top frame 242 and the bottom frame 243 are each connected to the side frame 241. The antenna radiator 100 is disposed in the middle section of the side frame 241 along the height direction X of the electronic device 10.

[0113] For example, the top frame 242 of the frame 24 may be provided with the antenna radiator 100 , and the bottom frame 243 of the frame 24 may also be provided with the antenna radiator 100 , which is not specifically limited in the present application.

[0114] For example, along the height direction X of the electronic device 10 , the middle one-third area on the side frame 241 may be the middle section of the side frame 241 .

[0115] The frame 24 includes a slit 241a. Along the height direction X of the electronic device 10, the antenna radiator 100 is provided with a slit 241a at each end, allowing the antenna radiator 100 to be positioned between the two slits 241a. For example, the side frame 241 may include a slit 241a. The slit 241a may be provided in the middle of the side frame 241.

[0116] Exemplarily, when the first shell 21 and the second shell 22 are in a stacked state, along the stacking direction of the first shell 21 and the second shell 22, the orthographic projection of the antenna radiator 100 on the first shell 21 and the orthographic projection of the antenna radiator 100 on the second shell 22 do not overlap, thereby helping to reduce the possibility of mutual interference between the antenna radiator 100 on the first shell 21 and the antenna radiator 100 on the second shell 22.

[0117] The frame 24 has a housing 244. At least a portion of the printed circuit board 210 is positioned within the housing 244 of the frame 24. This allows the printed circuit board 210 to fully utilize the frame 24, eliminating the space inside the frame 24 and saving space. For example, the saved space can be used to increase the size of the battery. Furthermore, the frame 24 protects the printed circuit board 210, reducing the likelihood of damage to the printed circuit board 210 from compression or collision. For example, the entire printed circuit board 210 can be positioned within the housing 244 of the frame 24, with the connection between the printed circuit board 210 and the flexible printed circuit board 230 located within the housing 244. The frame 24 protects the printed circuit board 210 and the connection between the printed circuit board 210 and the flexible printed circuit board 230, reducing the likelihood of fracture at the connection between the printed circuit board 210 and the flexible printed circuit board 230 from compression or collision. The feed point and ground point of the antenna radiator 100 can be positioned facing the housing 244. The feeding terminal 210a and the grounding terminal 210b provided on the printed circuit board 210 may be located in the receiving portion 244 of the frame 24. For example, the receiving portion 244 may be a receiving groove.

[0118] Illustratively, the printed circuit board 210 includes a positioning portion 212 (see FIG7 ). The frame 24 includes a limiting portion (not shown). The positioning portion 212 of the printed circuit board 210 is connected to the limiting portion of the frame 24, so that the printed circuit board 210 can be quickly and accurately positioned, facilitating assembly of the printed circuit board 210 and the frame 24, and the frame 24 can restrict and constrain the printed circuit board 210 to prevent the printed circuit board 210 from exiting the accommodating portion 244. For example, the printed circuit board 210 can be provided with a notch at an edge position. The provided notch forms the positioning portion 212. A boss located within the accommodating portion 244 is provided on the frame 24. The boss forms the limiting portion. The notch of the printed circuit board 210 can be engaged with the boss on the frame 24 to achieve accurate positioning of the printed circuit board 210.

[0119] The circuit board assembly 200 also includes a conductive elastic member 250. The conductive elastic member 250 is electrically conductive and can elastically deform under force. The conductive elastic member 250 is disposed between the feed point of the antenna radiator 100 and the feed terminal 210a of the printed circuit board 210. The conductive elastic member 250 is disposed between the ground point of the antenna radiator 100 and the ground terminal 210b of the printed circuit board 210. The antenna radiator 100 and the printed circuit board 210 can jointly apply force to the conductive elastic member 250. The conductive elastic member 250 ensures the reliability of the electrical connection between the feed point and the feed terminal 210a, as well as the reliability of the electrical connection between the ground point and the ground terminal 210b.

[0120] Exemplarily, the conductive elastic member 250 is located in the receiving portion 244 of the frame 24 .

[0121] Exemplarily, the feeding terminal 210 a of the printed circuit board 210 is located on the side of the printed circuit board 210 facing away from the antenna radiator 100 , and the grounding terminal 210 b of the printed circuit board 210 is located on the side of the printed circuit board 210 facing the antenna radiator 100 .

[0122] For example, the conductive elastic member 250 may be a spring. One end of the conductive elastic member 250 may be soldered to the printed circuit board 210, for example, to the feed terminal 210a or the ground terminal 210b. The other end of the conductive elastic member 250 may abut the feed point or the ground point of the antenna radiator 100. For example, the material of the conductive elastic member 250 may be, but is not limited to, copper or a copper alloy.

[0123] In some possible implementations, a conductive elastic member 250 may be provided between the RF switch 220 and the antenna radiator 100. The conductive elastic member 250 enables electrical connection between the RF switch 220 and the antenna radiator 100, thereby eliminating the need for an RF cable to achieve electrical connection between the RF switch 220 and the antenna radiator 100, thereby reducing the space occupied by the printed circuit board 210.

[0124] The RF switch 220 is disposed on the side of the PCB 210 facing the antenna radiator 100 along the thickness direction of the PCB 210. The RF switch 220 is relatively close to the antenna radiator 100, thereby facilitating electrical connection between the RF switch 220 and the antenna radiator 100.

[0125] As shown in Figures 7 and 8, in the printed circuit board 210, there is a distance between the RF switch 220 and the feed terminal 210a, which helps reduce the possibility of signal crosstalk between the RF switch 220 and the feed terminal 210a. The distance T between the RF switch 220 and the feed terminal 210a can range from 15 mm to 100 mm. For example, the distance between the RF switch 220 and the feed terminal 210a can be 20 mm, 30 mm, 50 mm, or 70 mm.

[0126] In the printed circuit board 210, a distance is provided between the RF switch 220 and the ground terminal 210b, thereby reducing the possibility of signal crosstalk between the RF switch 220 and the ground terminal 210b. The distance V between the RF switch 220 and the ground terminal 210b can range from 15 mm to 100 mm. For example, the distance between the RF switch 220 and the ground terminal 210b can be 20 mm, 30 mm, 50 mm, or 70 mm.

[0127] The printed circuit board 210 includes an antenna interface pad 213, a control signal pad 214, and a ground pad 215. The antenna interface pad 213 is electrically connected to the antenna radiator 100. Multiple ground pads 215 are arranged around the periphery of the antenna interface pad 213, thereby reducing the possibility of external signal interference on the antenna interface pad 213. Multiple ground pads 215 are also arranged around the periphery of the control signal pad 214, thereby reducing the possibility of external signal interference on the control signal pad 214.

[0128] Exemplarily, the minimum distance K between the antenna interface pad 213 and the control signal pad 214 is greater than or equal to 3 mm.

[0129] Exemplarily, a minimum spacing P between the ground pad 215 on the periphery of the antenna interface pad 213 and the ground pad 215 on the periphery of the control signal pad 214 is greater than or equal to 2 mm.

[0130] As shown in FIG9 , the flexible printed circuit board 230 is provided with a ground trace 238 connected to the ground pad 215. The minimum spacing H between the ground trace 238 on the periphery of the antenna interface pad 213 and the ground trace 238 on the periphery of the control signal pad 214 is greater than or equal to 3 mm. As an example, the first pads 211 include the antenna interface pad 213, the control signal pad 214, and the ground pad 215. The flexible printed circuit board 230 is provided with second pads 231 connected to the antenna interface pad 213, the control signal pad 214, and the ground pad 215, respectively. In the flexible printed circuit board 230, the ground trace 238 is connected to the corresponding second pad 231.

[0131] Exemplarily, among the ground traces 238 connected to the ground pads 215 on the periphery of the antenna interface pad 213 , the width of the ground trace 238 close to the control signal pad 214 is greater than or equal to 0.1 mm.

[0132] As shown in Figure 5, the electronic device 10 also includes a first battery 80. The first battery 80 is disposed in the first housing 21. The first battery 80 is disposed below the flexible display 30. Along the height direction X of the electronic device 10, the main circuit board 40 is located on the side of the first battery 80 close to the top of the electronic device 10. Along the thickness direction of the electronic device 10, at least part of the flexible circuit board 230 in the first housing 21 is located on one side of the first battery 80, so that the flexible circuit board 230 can be arranged in the gap between the first battery 80 and other structural parts, which is conducive to improving the utilization rate of the internal space of the electronic device 10. For example, at least part of the flexible circuit board 230 in the first housing 21 can be located on the side of the first battery 80 facing the flexible display 30.

[0133] Illustratively, the flexible circuit board 230 in the first housing 21 includes a first transition section 233 and a second transition section 234. The first transition section 233 and the second transition section 234 are arranged to intersect. The first transition section 233 is electrically connected to the main circuit board 40. For example, the first transition section 233 and the main circuit board 40 can be electrically connected via a board-to-board connector 500. The second transition section 234 is electrically connected to the printed circuit board 210. For example, the second transition section 234 is provided with a second solder pad 231. The solder joint 240 connects the first solder pad 211 of the printed circuit board 210 to the second solder pad 231 of the second transition section 234. Along the thickness direction of the electronic device 10, at least a portion of the first transition section 233 can be located on one side of the first battery 80. At least a portion of the second transition section 234 can be located on one side of the first battery 80.

[0134] The printed circuit board 210 in the first housing 21 is located on the side of the first battery 80 facing the antenna radiator 100, that is, the printed circuit board 210 is located between the first battery 80 and the antenna radiator 100. For example, the RF switch 220 in the first housing 21 can be set on the side of the printed circuit board 210 facing away from the first battery 80. In the embodiment of the present application, the printed circuit board 210 itself is relatively thin, and the printed circuit board 210 and the flexible circuit board 230 are connected by solder joints 240, so that the thickness of the connection between the printed circuit board 210 and the flexible circuit board 230 is relatively small, thereby freeing up space. For example, the freed-up space can be used to increase the size of the first battery 80 and improve the capacity of the first battery 80.

[0135] The electronic device 10 also includes a second battery 90. The second battery 90 is disposed in the second housing 22. The second battery 90 is disposed below the flexible display 30. Along the thickness direction of the electronic device 10, at least a portion of the flexible circuit board 230 in the second housing 22 is located on one side of the second battery 90. This allows the flexible circuit board 230 to be arranged in the gap between the second battery 90 and other structural components, which helps improve the utilization of the internal space of the electronic device 10. For example, at least a portion of the flexible circuit board 230 in the second housing 22 can be located on the side of the second battery 90 facing the flexible display 30. The printed circuit board 210 in the second housing 22 is located on the side of the second battery 90 facing the antenna radiator 100, that is, the printed circuit board 210 is located between the second battery 90 and the antenna radiator 100. For example, the radio frequency switch 220 in the second housing 22 can be disposed on the side of the printed circuit board 210 facing away from the second battery 90. In the embodiment of the present application, the printed circuit board 210 itself is relatively thin. Furthermore, the printed circuit board 210 and the flexible circuit board 230 are connected via solder joints 240, resulting in a relatively thin connection between the printed circuit board 210 and the flexible circuit board 230. This frees up space, which can be used, for example, to increase the size and capacity of the second battery 90.

[0136] The electronic device 10 also includes a first sub-circuit board 50 and an electrical connection line 60. The first sub-circuit board 50 is disposed in the second housing 22. Along the height direction X of the electronic device 10, the first sub-circuit board 50 can be disposed near the top of the electronic device 10. The electrical connection line 60 connects the main circuit board 40 with the first sub-circuit board 50. The flexible circuit board 230 in the second housing 22 is electrically connected to the first sub-circuit board 50. The printed circuit board 210 in the second housing 22 is electrically connected to the first sub-circuit board 50 via the flexible circuit board 230.

[0137] For example, the electronic device 10 further includes a board-to-board connector 500. The main circuit board 40 and the electrical connection line 60 can be electrically connected via the board-to-board connector 500. The first auxiliary circuit board 50 and the electrical connection line 60 can be electrically connected via the board-to-board connector 500. The flexible circuit board 230 in the second housing 22 and the first auxiliary circuit board 50 can also be electrically connected via the board-to-board connector 500.

[0138] The electronic device 10 also includes a second sub-circuit board 600. The second sub-circuit board 600 is disposed in the second housing 22. Along the height direction X of the electronic device 10, the first sub-circuit board 50 is disposed near the top of the electronic device 10. The second sub-circuit board 600 is disposed near the bottom of the electronic device 10. FIG11 schematically shows a partial structure of the flexible printed circuit board 230. Referring to FIG5, FIG6, and FIG11, the flexible printed circuit board 230 in the second housing 22 includes a main body 235, a first branch 236, and a second branch 237. The main body 235 is electrically connected to the first sub-circuit board 50. The first branch 236 is connected to the printed circuit board 210 in the second housing 22. The second branch 237 is electrically connected to the second sub-circuit board 600.

[0139] For example, the second sub-circuit board 600 can be positioned corresponding to the sound cavity of the electronic device 10. Along the height direction X of the electronic device 10, the sound cavity is positioned near the bottom of the electronic device 10. When a user uses the speaker, the sound cavity can be used to conduct sound outward. Along the thickness direction of the electronic device 10, the second sub-circuit board 600 can be located on one side of the sound cavity.

[0140] Exemplarily, along the height direction X of the electronic device 10 , the second battery 90 is disposed between the first sub-circuit board 50 and the second sub-circuit board 600 .

[0141] Exemplarily, along the thickness direction of the electronic device 10 , at least a portion of the first branch 236 is located on one side of the second battery 90 . At least a portion of the second branch 237 is located on one side of the second battery 90 .

[0142] First branch 236 includes a first connecting segment 236a and a second connecting segment 236b that intersect. First connecting segment 236a is connected to main body 235. Second connecting segment 236b is electrically connected to printed circuit board 210. For example, the angle between first connecting segment 236a and second connecting segment 236b can be greater than or equal to 90°, which helps reduce the possibility of tearing at the intersection of first connecting segment 236a and second connecting segment 236b due to pulling forces on either first connecting segment 236a or second connecting segment 236b.

[0143] For example, along the height direction X of the electronic device 10 , a distance L1 between the main body 235 and an edge of the second connecting section 236 b close to the second sub-circuit board 600 is greater than or equal to 5 mm.

[0144] The second branch 237 includes a third connecting segment 237a, a fourth connecting segment 237b, a fifth connecting segment 237c, and a sixth connecting segment 237d, which are sequentially connected. The third connecting segment 237a intersects with the fourth connecting segment 237b. The fourth connecting segment 237b intersects with the fifth connecting segment 237c. The fifth connecting segment 237c intersects with the sixth connecting segment 237d. The sixth connecting segment 237d is electrically connected to the second sub-circuit board 600. The angle S1 between the third connecting segment 237a and the fourth connecting segment 237b is greater than or equal to 90°, which helps reduce the possibility of the third connecting segment 237a and the fourth connecting segment 237b being torn at the intersection due to a pulling force on the third connecting segment 237a or the fourth connecting segment 237b. The included angle S2 between the fourth connecting segment 237b and the fifth connecting segment 237c is greater than or equal to 90°, which helps reduce the possibility of the fourth connecting segment 237b or the fifth connecting segment 237c being pulled, resulting in the fourth connecting segment 237b and the fifth connecting segment 237c being torn at the intersection. The included angle S3 between the fifth connecting segment 237c and the sixth connecting segment 237d is greater than or equal to 90°, which helps reduce the possibility of the fifth connecting segment 237c or the sixth connecting segment 237d being pulled, resulting in the fifth connecting segment 237c and the sixth connecting segment 237d being torn at the intersection.

[0145] Illustratively, the second branch 237 includes a third connecting segment 237a. The third connecting segment 237a is connected to the main body 235. The angle S4 between the first connecting segment 236a and the third connecting segment 237a of the first branch 236 ranges from 30° to 150°. If the angle S4 between the first connecting segment 236a and the third connecting segment 237a is less than 30°, the first connecting segment 236a and the third connecting segment 237a may easily tear at the intersection when subjected to an external pulling force. If the angle S4 between the first connecting segment 236a and the third connecting segment 237a is greater than 150°, the first connecting segment 236a and the third connecting segment 237a may occupy excessive space, making it difficult to arrange the flexible circuit board 230 in a confined space.

[0146] Exemplarily, the minimum distance L2 between the first connecting segment 236a and the fourth connecting segment 237b is greater than or equal to 3 mm.

[0147] Exemplarily, the third connecting segment 237a has a narrowed portion, which is connected to the fourth connecting segment 237b.

[0148] The flexible circuit board 230 may include more than two metal trace layers. For example, Figure 12 schematically shows a partial cross-sectional view of the flexible circuit board 230. As shown in Figure 12, the flexible circuit board 230 includes two metal trace layers 2301. The flexible circuit board 230 includes a flexible copper-clad laminate and a shielding layer. Shielding layers are provided on opposite sides of the flexible copper-clad laminate along the thickness of the flexible circuit board 230. The shielding layer may include an electromagnetic shielding layer 2302. The flexible copper-clad laminate includes a cover layer, a metal trace layer 2301, and a base film 2303. Metal trace layers 2301 are provided on opposite sides of the base film 2303. The base film 2303 may be a polyimide layer. The metal trace layers 2301 include copper foil 2301c and copper plating 2301d. An adhesive layer 2305 may be provided between the metal trace layers 2301 and the base film 2303. The cover layer includes a polyimide layer 2304 and an adhesive layer 2305. Table 2 schematically shows relevant data of the flexible circuit board 230.

[0149] Table 2

[0150] Exemplarily, the thickness of the flexible circuit board 230 ranges from the standard reference thickness*20% to the standard reference thickness*300%.

[0151] Figure 13 schematically illustrates a partial cross-sectional view of the flexible circuit board 230. As shown in Figure 13, the flexible circuit board 230 includes two metal trace layers 2301. The two metal trace layers 2301 are stacked along the thickness of the flexible circuit board 230. Each metal trace layer 2301 includes a ground line 2301a and an RF signal line 2301b. Along the thickness of the flexible circuit board 230, the orthographic projection of the RF signal line 2301b on one of two adjacent metal trace layers 2301 lies within the orthographic projection of the ground line 2301a on the other. This helps reduce the likelihood of crosstalk between the RF signal line 2301b on one of the two adjacent metal trace layers 2301 and the RF signal line 2301b on the other.

[0152] Exemplarily, the flexible circuit board 230 may include three or more metal trace layers 2301 .

[0153] For example, in metal routing layer 2301, ground trace 2301a is wider than RF signal trace 2301b. Along the width of flexible circuit board 230, the distance between the outer edge of the orthographic projection of RF signal trace 2301b and the outer edge of the orthographic projection of ground trace 2301a is greater than or equal to 0.01 mm.

[0154] Exemplarily, the width of the RF signal line 2301b is C, where 0.02 mm ≤ C ≤ 2 mm. The width of the ground line 2301a is 1C to 5C. In a metal routing layer 2301, the spacing between the ground line 2301a and the RF signal line 2301b is 0.5C to 2C.

[0155] In some implementations, FIG14 schematically illustrates a partial structure of a flexible circuit board 230 of the present application. FIG15 is an enlarged view of point W in FIG14 . Referring to FIG10 , FIG14 , and FIG15 , the printed circuit board 210 and the flexible circuit board 230 are electrically connected via a connection structure comprising a first solder pad 211, solder joints 240, and a second solder pad 231. The solder joints 240 in the circuit board assembly 200 can be formed using a laser welding process. Because the solder joints 240 between the first solder pad 211 and the second solder pad 231 are formed using a laser welding process, during the soldering process, areas of the flexible circuit board 230 that are farther from the second solder pad 231 are less likely to experience high temperatures. This effectively reduces the likelihood of electronic components on the flexible circuit board 230 being damaged by high temperatures, thereby improving the yield rate of the circuit board assembly 200.

[0156] For example, solder paste (e.g., tin paste) is pre-applied to the first pad 211 of the printed circuit board 210. The flexible circuit board 230 is placed in a corresponding predetermined position so that the second pad 231 corresponds to the first pad 211. A laser beam can be irradiated from the side of the flexible circuit board 230 facing away from the printed circuit board 210. After the laser beam passes through the through-hole 232 of the second pad 231, it heats the solder paste, causing it to melt. The melted solder paste can rise along the through-hole 232 of the second pad 231. After the melted solder paste solidifies, it forms a solder joint 240 connecting the first pad 211 and the second pad 231.

[0157] 15 , the through-hole 232 of the second solder pad 231 may be a waist-shaped hole. Table 1 schematically shows the data of the second solder pad 231 of the flexible circuit board 230 .

[0158] Table 1

[0159] FIG16 schematically illustrates a partially exploded view of the circuit board assembly 200 of the present application. As shown in FIG16 , the printed circuit board 210 has a first connection area 216. The first connection area 216 is disposed outside the first solder pad 211. The flexible circuit board 230 has a second connection area 239. The second connection area 239 is disposed outside the second solder pad 231. The first connection area 216 is connected to the second connection area 239. The printed circuit board 210 and the flexible circuit board 230 form a connection area outside the first solder pad 211 and the second solder pad 231. This ensures that when a force acting perpendicularly to the axial direction of the through-hole 232 is applied to the flexible circuit board 230, the force is less likely to be transmitted to the area around the second solder pad 231, thereby reducing the possibility of tearing of the flexible circuit board 230 at the second solder pad 231.

[0160] For example, the first connection region 216 may be ring-shaped, and the first pad 211 is located inside the first connection region 216. The second connection region 239 may be ring-shaped, and the second pad 231 is located inside the second connection region 239.

[0161] For example, the first connection region 216 and the second connection region 239 are bonded to each other. For example, adhesive or double-sided tape may be provided between the first connection region 216 and the second connection region 239 to bond the first connection region 216 and the second connection region 239 together.

[0162] In some implementations, FIG17 schematically illustrates the structure of the electronic device 10 in a folded state. FIG18 schematically illustrates a partial structure of the electronic device 10. Referring to FIG17 and FIG18 , in an embodiment of the present application, the housing 20 of the electronic device 10 may further include a third housing 25. The third housing 25 is disposed between the first housing 21 and the second housing 22. A hinge assembly 23 is disposed between the first housing 21 and the third housing 25, and a hinge assembly 23 is disposed between the third housing 25 and the second housing 22. The first housing 21, the second housing 22, and the third housing 25 each rotate relative to the hinge assembly 23 to cause the first housing 21, the second housing 22, and the third housing 25 to overlap or unfold. When the first housing 21, the second housing 22, and the third housing 25 overlap, the electronic device 10 is in a folded state. When the first housing 21, the second housing 22, and the third housing 25 each move away from the overlapped state and unfold to the same plane, the electronic device 10 is in an unfolded state. The flexible display 30 may be connected to the first housing 21, the second housing 22, and the third housing 25.

[0163] Exemplarily, both the first housing 21 and the second housing 22 include a frame 24. Along the height direction X of the electronic device 10, the antenna radiator 100 may be provided in a middle section 24a of the frame 24.

[0164] For example, when the electronic device 10 is in the unfolded state, the arrangement direction of the first housing 21, the second housing 22, and the third housing 25 is perpendicular to the height direction X of the electronic device 10. When the user uses the electronic device 10, the first housing 21, the third housing 25, and the second housing 22 are arranged from left to right.

[0165] For example, the main circuit board 40 can be disposed within the first housing 21. The electronic device 10 also includes a third sub-circuit board 700. The third sub-circuit board 700 can be disposed within the third housing 25. The third sub-circuit board 700 can be electrically connected to the main circuit board 40 via an electrical connection line 60. The electrical connection line 60 and the third sub-circuit board 700 are electrically connected via a board-to-board connector 500.

[0166] Alternatively, the main circuit board 40 may be disposed in the third housing 25 . The third sub-circuit board 700 may be disposed in the first housing 21 .

[0167] Exemplarily, the electronic device 10 further includes a third battery 800 . The third battery 800 may be disposed in the third housing 25 .

[0168] In some implementations, FIG19 schematically illustrates a partial structure of the electronic device 10. As shown in FIG19 , the arrangement direction of the first housing 21, the second housing 22, and the third housing 25 is the same as the height direction X of the electronic device 10. When a user uses the electronic device 10, the first housing 21, the third housing 25, and the second housing 22 can be arranged from top to bottom.

[0169] For example, the main circuit board 40 may be disposed in the third housing 25 . The third sub-circuit board 700 may be disposed in the first housing 21 .

[0170] Alternatively, the main circuit board 40 may be disposed in the first housing 21 . The third sub-circuit board 700 may be disposed in the third housing 25 .

[0171] Exemplarily, both the first housing 21 and the second housing 22 include a frame 24. Along the height direction X of the electronic device 10, the antenna radiator 100 may be provided in a middle section 24a of the frame 24.

[0172] For example, the electronic device 10 may further include a third battery 800 . The third battery 800 may be disposed in the third housing 25 .

[0173] For example, the electrical connection line 60 may be a flexible circuit board. The electrical connection line 60 and the flexible circuit board 230 in the circuit board assembly 200 may be an integrally formed structure.

[0174] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0175] The embodiments of the present application do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0176] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0177] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0178] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0179] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: The housing comprises a frame, wherein the frame comprises an antenna radiator, and the antenna radiator comprises a feeding point and a grounding point; A circuit board assembly is arranged on the housing, the circuit board assembly includes a printed circuit board, a radio frequency switch, a flexible circuit board and a solder joint, the printed circuit board is arranged facing the antenna radiator, the printed circuit board includes a feeding terminal and a grounding terminal, the feeding point is electrically connected to the feeding terminal, the grounding point is electrically connected to the grounding terminal, the radio frequency switch is arranged on the printed circuit board, the radio frequency switch is electrically connected to the antenna radiator, the printed circuit board includes a first solder pad, the flexible circuit board includes a second solder pad, the second solder pad has a through solder hole, the first solder pad is arranged facing the through solder hole, the solder joint connects the first solder pad and the second solder pad, and a part of the solder joint is located in the through solder hole; The main circuit board is arranged in the housing, and the flexible circuit board electrically connects the main circuit board and the printed circuit board.

2. An electronic device, characterized in that: include: The housing comprises a frame, wherein the frame comprises an antenna radiator, and the antenna radiator comprises a feeding point and a grounding point; A circuit board assembly is arranged in the housing, the circuit board assembly includes a printed circuit board, a radio frequency switch and a flexible circuit board, the printed circuit board is arranged facing the antenna radiator, the printed circuit board includes a feeding terminal and a grounding terminal, the feeding point is electrically connected to the feeding terminal, the grounding point is electrically connected to the grounding terminal, the radio frequency switch is arranged on the printed circuit board, the radio frequency switch is electrically connected to the antenna radiator, and the printed circuit board and the flexible circuit board are an integrally formed structure; The main circuit board is arranged in the housing, and the flexible circuit board electrically connects the main circuit board and the printed circuit board.

3. The electronic device according to claim 1, characterized in that: The weld points are formed by a laser welding process.

4. The electronic device according to claim 1 or 3, characterized in that: The printed circuit board has a first connection area, the first connection area is arranged outside the first pad, the flexible circuit board has a second connection area, the second connection area is arranged outside the second pad, and the first connection area is connected to the second connection area.

5. The electronic device according to any one of claims 1 to 4, characterized in that: Along the height direction of the electronic device, the antenna radiator is located in the middle section of the frame.

6. The electronic device according to claim 5, characterized in that: The frame includes a break, and the break is respectively arranged at two ends of the antenna radiator along the height direction.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The circuit board assembly further comprises a conductive elastic member, which is arranged between the feeding point and the feeding end, and between the grounding point and the grounding end.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises a board-to-board connector, and the flexible circuit board is electrically connected to the main circuit board via the board-to-board connector.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The electronic device also includes a radio frequency transceiver integrated module and a radio frequency chip, both of which are arranged on the main circuit board, the radio frequency transceiver integrated module and the radio frequency chip are electrically connected, and the flexible circuit board is electrically connected to the radio frequency transceiver integrated module.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The frame has a receiving portion, and at least a portion of the printed circuit board is arranged in the receiving portion.

11. The electronic device according to claim 10, characterized in that: The printed circuit board includes a positioning portion, the frame includes a limiting portion, and the positioning portion is connected to the limiting portion.

12. The electronic device according to any one of claims 1 to 11, characterized in that: Along the thickness direction of the printed circuit board, the radio frequency switch is arranged on a side of the printed circuit board facing the antenna radiator.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The distance between the RF switch and the feeding end ranges from 15 mm to 100 mm; or, The distance between the radio frequency switch and the ground terminal ranges from 15 mm to 100 mm.

14. The electronic device according to any one of claims 1 to 13, characterized in that: The printed circuit board comprises an antenna interface pad, a control signal pad and a ground pad. A plurality of the ground pads are arranged on the periphery of the antenna interface pad, and a plurality of the ground pads are arranged on the periphery of the control signal pad.

15. The electronic device according to claim 14, characterized in that: The minimum spacing between the antenna interface pad and the control signal pad is greater than or equal to 3 mm; or, The minimum spacing between the ground pad on the periphery of the antenna interface pad and the ground pad on the periphery of the control signal pad is greater than or equal to 2 mm.

16. The electronic device according to any one of claims 1 to 15, characterized in that: The flexible circuit board includes more than two metal routing layers, and the more than two metal routing layers are stacked along the thickness direction of the flexible circuit board. Each of the metal routing layers includes a ground line and a radio frequency signal line. Among two adjacent metal routing layers, the orthographic projection of the radio frequency signal line on one is located within the orthographic projection of the ground line on the other.

17. The electronic device according to claim 16, characterized in that: Along the width direction of the flexible circuit board, a distance between an outer edge of an orthographic projection of the radio frequency signal line and an outer edge of an orthographic projection of the ground line is greater than or equal to 0.01 mm.

18. The electronic device according to any one of claims 1 to 17, characterized in that: The frame is a metal frame, and a portion of the frame forms the antenna radiator; or, the frame includes an insulating frame, and the antenna radiator is arranged in the insulating frame.

19. The electronic device according to any one of claims 1 to 18, characterized in that: The shell includes a hinge device, a first shell and a second shell. The first shell and the second shell are respectively connected to the hinge device. The first shell and the second shell are respectively rotated relative to the hinge device so that the first shell and the second shell are stacked or unfolded with each other. The first shell and the second shell both include the frame.

20. The electronic device according to claim 19, characterized in that: The electronic device further includes a first battery, which is disposed in the first shell. Along the thickness direction of the electronic device, at least part of the flexible circuit board in the first shell is located on one side of the first battery.

21. The electronic device according to claim 19 or 20, characterized in that: The electronic device also includes a first battery and a second battery, the first battery is arranged in the first shell, and the second battery is arranged in the second shell, the printed circuit board in the first shell is located on the side of the first battery facing the antenna radiator, and the printed circuit board in the second shell is located on the side of the second battery facing the antenna radiator.

22. The electronic device according to any one of claims 19 to 21, characterized in that: The electronic device also includes a first sub-circuit board and an electrical connection line. The first sub-circuit board is arranged in the second shell. The electrical connection line connects the main circuit board and the first sub-circuit board. The flexible circuit board in the second shell is electrically connected to the first sub-circuit board.

23. The electronic device according to claim 22, characterized in that: The electronic device further comprises a board-to-board connector, the main circuit board is electrically connected to the electrical connection line via the board-to-board connector, and the first sub-circuit board is electrically connected to the electrical connection line via the board-to-board connector; or, The flexible circuit board in the second housing is electrically connected to the first sub-circuit board through the board-to-board connector.

24. The electronic device according to claim 22 or 23, characterized in that: The electronic device also includes a second sub-circuit board, which is arranged in the second shell. The flexible circuit board in the second shell includes a main body, a first branch and a second branch. The main body is electrically connected to the first sub-circuit board, the first branch is connected to the printed circuit board in the second shell, and the second branch is electrically connected to the second sub-circuit board.

25. The electronic device according to claim 24, characterized in that: The electronic device also includes a second battery, which is arranged in the second shell and between the first sub-circuit board and the second sub-circuit board. Along the thickness direction of the electronic device, at least part of the first branch and at least part of the second branch are located on one side of the second battery.

26. The electronic device according to claim 24 or 25, characterized in that: The first branch includes a first connecting section and a second connecting section intersecting each other, the first connecting section is connected to the main body, and the second connecting section is electrically connected to the printed circuit board.

27. The electronic device according to claim 26, characterized in that: The second branch includes a third connecting segment, a fourth connecting segment, a fifth connecting segment and a sixth connecting segment connected in sequence, the third connecting segment is connected to the main body, the sixth connecting segment is electrically connected to the second sub-circuit board, the angle between the fourth connecting segment and the fifth connecting segment is greater than or equal to 90°, and the angle between the fifth connecting segment and the sixth connecting segment is greater than or equal to 90°.

28. The electronic device according to claim 27, characterized in that: The angle between the first connecting section and the third connecting section ranges from 30° to 150°; or, The minimum distance between the first connecting segment and the fourth connecting segment is greater than or equal to 3 mm; or, Along the height direction of the electronic device, a distance between the main body and an edge of the second connecting section close to the second sub-circuit board is greater than or equal to 5 mm.

29. The electronic device according to any one of claims 19 to 28, characterized in that: The shell also includes a third shell, the rotating shaft device is arranged between the first shell and the third shell, and the rotating shaft device is arranged between the third shell and the second shell, and the first shell, the second shell and the third shell respectively rotate relative to the rotating shaft device so that the first shell, the second shell and the third shell are stacked or unfolded with each other.

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